Abstract: A method for manufacturing a cooling passage in a component of a machine is described. The method may include: forming a channel in a surface of the component, the channel having a predetermined configuration; forming a cover wire, the cover wire having a predetermined configuration based on the predetermined configuration of the channel; nesting the cover wire in the channel; and welding the nested cover wire to the component such that the channel is enclosed.

Abstract: Remote melt joining methods include melting a filler material to produce a molten filler material, wherein melting the filler material occurs at a remote distance away from a target site of a substrate material such that melting the filler material maintains the target site of the substrate material below its solidus temperature, and, delivering the molten filler material to the target site of the substrate material in a continuous stream.

Abstract: A tube assembly for an endoscope includes a steering device and a flexible tube device on a proximal side. The tube assembly includes an inner sleeve. An outer sleeve receives one end portion of the inner sleeve in an axial direction, for connection of the flexible tube device to the steering device. A flow opening is formed in a portion of the outer sleeve disposed around the inner sleeve. A distribution groove is formed between an outer wall surface of the inner sleeve and an inner wall surface of the outer sleeve, to extend from the flow opening. A seal cavity is formed in the inner and outer sleeves to extend from the distribution groove in a direction away from the flow opening. Flowing solder material is supplied in the flow opening, charged in the distribution groove and the seal cavity, for attaching the outer sleeve to the inner sleeve.

Abstract: This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.

Abstract: A feed-through element of an ignition device for igniters of airbags or seatbelt tighteners is provided. The feed-through element has a metal support body, at least one first access opening in which a metal rod is arranged in an electrically insulating fixing material, and at least one second access opening in which a further metal rod is electrically conductively fixed to the support body by a soldered connection in this access opening. The support body and the access openings are configured as a shaped part. The feed-through element further includes a solder gap between the metal rod and the wall of the second access opening, where the solder gap has a small width.

Abstract: An implantable medical device that includes electrical circuitry for providing a therapy to a patient. The device also includes a housing forming an inner chamber that is adapted for receiving, at least a portion of the electrical circuitry. The device further includes a thermally conductive material that is configured to disperse heat from a first portion of the implantable medical device that is located in proximity to a heat generating component of the electrical circuitry, to a second portion of the implantable medical device that is not located in proximity to said heat generating component. The thermally conductive material is a discrete component separate from the electrical circuitry and the housing.

Abstract: A method of joining tubes that are regularly arranged in a shell & tube heat exchanger to tube sheets placed at opposite ends of the tubes and a shell & tube heat exchanger produced by the method. The method of joining the tubes to the tube sheets includes: forming a tube sheet groove in a surface of the tube sheet at a location spaced apart from a tube insert hole of the tube sheet by a predetermined distance, and forming a tube holding groove in an inner surface of the tube insert hole; inserting the tube into the tube insert hole of the tube sheet and expanding the tube; and performing both tube side welding and shell side welding so as to join the tube to the tube sheet, wherein the shell side welding is performed by inserting a welding torch into the tube.

Abstract: Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate that includes at least one inner contact area, ii) contact the entire substrate area including the at least one inner contact area with a solution suitable to provide a conductive layer on the substrate surface, iii) form a patterned resist layer, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the inner contact area, v) remove the patterned resist layer, vi) form a solder resist layer having solder resist openings on the substrate surface.

Abstract: There is provided a probe card, including: a substrate having a plurality of grooves formed in one surface thereof; and at least one probe pin having a plurality of substrate combining protrusions formed on one surface thereof and corresponding to the plurality of grooves, the plurality of substrate combining protrusions having heights corresponding to the plurality of grooves.

Abstract: There are provided a probe card and a method of manufacturing the same, in which an electrode pad having a probe pin bonded thereto may be prevented from being delaminated from a substrate. The probe card according to embodiments of the present invention may include a ceramic substrate including at least one pad groove formed in one surface thereof and an electrode pad embedded in the pad groove; and a probe pin bonded to the electrode pad.

Abstract: Disclosed herein are a stiffener and a method for manufacturing the same. The method includes: forming a metal film on an upper surface or a lower surface of a base layer; forming a plurality of via holes penetrating the base layer and the metal film; and forming a first plating film covering an external surface including an inner surface of each of the via holes. The double-sided conductive stiffener according to the present invention can support the device by being disposed on the lower surface of the FPCB, and provide a ground structure of the device through the metal film without using the conductive bond or the conductive tape.

Abstract: [Object] The object is to provide a functional composite material which is adaptable to environmental changes. [Means for Achieving the Object] The present invention provides a method for producing a functional composite material comprising a step wherein an insert layer is formed on a first metal substrate having a groove; a step wherein a piezoelectric fiber having a metal core is placed on the first metal substrate; and a step wherein a second metal substrate and the first metal substrate are hot-pressed. The present invention can provide a functional composite material which is adaptable to environmental changes.

Abstract: According to one aspect of the invention, a method for manufacturing a hot gas path component of a turbine is provided, the method including forming cooling channels in a surface of a member. The method also includes disposing a layer on the surface of the member to enclose the cooling channels, the layer being disposed on a portion of the member to be cooled and bonding the layer to the surface, wherein bonding comprises heating the member and the layer.

Abstract: Fabricating a turbine component (50) by casting a core structure (30), forming an array of pits (24) in an outer surface (32) of the core structure, depositing a transient liquid phase (TLP) material (40) on the outer surface of the core structure, the TLP containing a melting-point depressant, depositing a skin (42) on the outer surface of the core structure over the TLP material, and heating the assembly, thus forming both a diffusion bond and a mechanical interlock between the skin and the core structure. The heating diffuses the melting-point depressant away from the interface. Subsurface cooling channels (35) may be formed by forming grooves (34) in the outer surface of the core structure, filling the grooves with a fugitive filler (36), depositing and bonding the skin (42), then removing the fugitive material.

Abstract: In various embodiments, protective layers are bonded to a steel layer and connected by a layer of unmelted metal powder produced by cold spray.

Abstract: A welded assembly characterized by improved structural integrity includes a first component disposed along a first plane. The first component includes first and second substantially parallel surfaces, and also includes a channel arranged on the first surface. The welded assembly also includes a second component disposed along a second plane, wherein the second component includes a leading edge. The leading edge of the second component is inserted into the channel of the first component such that an interface is formed between the first and second components. A weld generated on the second surface joins the first component with the second component at the interface such that the assembly is formed. The subject weld may be a friction-stir type of a weld. The subject welded assembly may be a vehicle bumper support. A method of forming such a welded assembly is also disclosed.

Abstract: A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions together.

Abstract: A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A post-passivation interconnect (PPI) is electrically coupled to the metal pad, wherein the PPI includes a portion over the metal pad and the passivation layer. A polymer layer is over the PPI. A solder ball is over the PPI. A compound includes a portion adjoining the solder ball and the polymer layer, wherein the compound includes flux and a polymer.

Abstract: Disclosed is a multilayer wiring board having via-hole conductors for connecting a first copper wiring and a second copper wiring, the via-hole conductor including a metal portion and a resin portion. The metal portion includes a first metal region including a link of copper particles as a path for electrically connecting the first and second copper wirings; a second metal region mainly composed of at least one selected from tin, a tin-copper alloy, and a tin-copper intermetallic compound; and a third region mainly composed of bismuth. The copper particles forming the link are in plane-to-plane contact with one another. At least one of the first copper wiring and the second copper wiring is in plane-to-plane contact with the copper particles, and the portion where there is such a plane-to-plane contact is covered with at least a part of the second metal region.

Abstract: Method for providing a printed circuit board (16) with an electronic device (1), wherein the electronic device (1) having at least one external soldering pad (11) having a predetermined size for heat dissipation is soldered with the soldering pad (11) onto a printed circuit board substrate of the printed circuit board (16) such that the electronic device (1) is electrically connected to an electrical circuit provided on the printed circuit board substrate, wherein prior to soldering, one or more through holes (12) are provided in the printed circuit board in the area where the soldering pad (12) is to be soldered to the printed circuit board (16) such that the through hole is provided for allowing flux gasses resulting during soldering of the electronic device (1) to the printed circuit board to escape.

Abstract: The invention relates to a ground peg (10) which is made from a steel tube (11) and comprises an upper cylindrical section (12), a lower section (16) that tapers towards the bottom to form a tip (14), and an external thread (26) that extends along at least part of the lower section (16) and is formed from a continuous sheet metal strip (28) welded onto an external surface (32) of the ground peg (10) by means of a continuous or regularly interrupted fillet weld (34). The external thread (26) has a nearly constant pitch (S) and slope (a) relative to a longitudinal axis (40) of the ground peg (10) along the entire length of the external thread (26). The invention further relates to a method or producing such a ground peg (10).

Abstract: A circuit board, associated assembly, and method of manufacture. The circuit board comprises an elongated groove, extending into the circuit board, for accommodating a footing of a large component such as an RF shield. The groove allows solder paste to be deposited therein via a stencil, to a depth greater than the stencil thickness. Thus the same stencil can be used for depositing solder paste for both small and large components.

Abstract: A method of manufacturing a multilayer circuit board includes forming a prepreg on a surface of a first circuit board including a first region in which a plated-through hole is formed and a second region in which a solid pattern is formed, the prepreg having a first hole reaching the plated-through hole and a second hole reaching the solid pattern, filling the first hole with a conductive paste, and pressing a second circuit board on the prepreg to laminate the first circuit board and the second circuit board to each other after filling the first hole with the conductive paste.

Abstract: Herein described is a hammock stand of improved strength comprising weight bearing structural members welded together in a manner that improves the strength of certain weight bearing joints within the stand to help avoid collapse and possible injury. Further described herein is a stronger, more durable weld between weight bearing structural members in a hammock stand and the process of producing the weld.

Abstract: A method for manufacturing a rotor by welding a plurality of elements together is described. The elements have a body with cavities and surfaces to be welded to surfaces of adjacent elements. According to the method, the elements are vertically stacked one above the other to form a pile with facing surfaces to be welded together defining slots. The cavities of adjacent elements define bores that extend within the pile. Then, adjacent elements are welded together within the slots. The bore is purged with an inert gas or mixture during welding. The slots are welded at an upper part of the bore before the slots at a lower part of the bore, and a slot at the upper part of the bore is welded last.

Abstract: A wheel resurfacing method and system for resurfacing a worn track wheel to its original profile are disclosed. The system comprises a support for maintaining the worn railway wheel, a welding device, a controller, and a surface processing device. The worn railway wheel's circumferential surface defining a flange and a tread surface is reconstituted using a welding material. The welding device and the worn railway wheel rotate one relative to the other at a predetermined rate to adaptively aggregate annular welding beads along the circumferential surface to form a curvilinear profile slanted away from the flange. A surface processing device is then applied to the welded layer to form a substantially uniform surface to reconstitute the worn railway wheel to its original profile.

Abstract: Methods and apparatus are provided for solder bonding entities to solid materials. One or more through apertures are formed in a solid material. Solder paste is introduced into each through aperture. Respective entities having solderable surface features are disposed in overlying alignment with the through apertures. The arrangement is heated causing molten solder paste to wet the solderable surface features and the solid material. Cooling results in the electrical and mechanical bonding of the entities to the solid material. Devices having substantially planar form factors and without lead wires can be electrically and mechanically secured to a supporting conductive stratum.

Abstract: An interconnect assembly including a substrate with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete contact member are located in the plurality of through holes. The contact members include proximal ends that are accessible from the second surface, distal ends extending above the first surface, and intermediate portions engaged with an engagement region of the substrate located between the first surface and the recesses. Retention members are coupled with at least a portion of the proximal ends to retain the contact members in the through holes. The retention members can be made from a variety of materials with different levels of conductivity, ranging from highly conductive to non-conductive.

Abstract: A draft sill with special rear draft lug for a railcar is disclosed. In some embodiments, a rear draft lug comprises a metallic body. The rear draft lug further comprises a boss extending along a transverse portion of the metallic body. The boss is configured to be coupled to a first vertical reinforcement plate. The rear draft lug also comprises an overhang portion extending from the boss along the transverse portion. The overhang portion configured to be coupled to the first vertical reinforcement plate. In some embodiments, the boss and the overhang portion are configured to be coupled to the first vertical reinforcement plate with a weld.

Abstract: In various embodiments, a metallic structure includes first and second clad structures each comprising a protective layer disposed over a steel layer, a joint joining the steel layers of first and second clad structures, and, directly connecting the protective layers of the first and second clad structures, a layer of metal powder disposed in contact with (i) the joint, (ii) the protective layers of the first and second clad structures, and (iii) a portion of at least one of the steel layers proximate the joint.

Abstract: A method for manufacturing a high temperature electrolyzer <<HTE>> or a high temperature fuel cell <<SOFC>>, comprising a vertical stack of n elementary planar cells alternating with n+1 interconnection plates, each of the elementary cells consisting of an openworked planar porous anode and an openworked planar porous cathode respectively positioned on each of the faces of a planar dense electrolyte, and brazed joints being made by infiltration of a defined amount of brazing in the electrodes at contact points between the elementary cells and the interconnection plates.

Abstract: A process for filling openings, including blind holes, through-holes, and cavities, in high temperature components. The process entails forming a powder mixture by mixing particles of at least a base alloy and a second alloy that contains a sufficient amount of a melting point depressant to have a lower melting temperature than the base alloy. The powder mixture is combined with a binder and compacted to form a compacted preform, which is then heated to remove the binder and form a rigid sintered preform. The sintered preform is produced, or optionally is further shaped, to have a cross-sectional shape and dimensions to achieve a clearance of up to 200 micrometers with the opening, after which the preform is placed in the opening and diffusion bonded within the opening to form a brazement comprising the particles of the base alloy dispersed in a matrix formed by the second alloy.

Abstract: In a method of manufacturing an article (28) by diffusion bonding and superplastic forming stop off material (122) is applied to prevent diffusion bonding in a predetermined pattern on a first surface (106) of a first metal workpiece (100) and the predetermined pattern is spaced from the edges of the first surface (106) of the first metal workpiece (100). Stop off material (124) to prevent diffusion bonding is applied in a predetermined position on the first surface (106) of the first metal workpiece (100) and the predetermined position extends from the predetermined pattern of stop of material (122) on the first surface (106) of the first metal workpiece (100) towards one edge of the first surface (106) of the first metal workpiece (100).

Abstract: A method of fabricating a turbomachine rotor disk is disclosed. In the method, a metal container is defined, made up of a plurality of parts that define between them at least one annular cavity, an insert made of composite material is positioned in the at least one cavity, the assembly is subjected to hot isostatic compacting, and a rotor disk is machined.

Abstract: Provided is a method of repair which method is capable of holding a molten brazing material at the bonding portion when a component is bonded with a brazing material to an inclined or to a curved surface. The method of repair repairs by brazing a repair portion in which a crack has developed and which needs repair, wherein a brazing material support (4) holding in the interior thereof a molten brazing material (5) is brought into contact with the repair portion, and under the condition that the brazing material support (4) is in contact with the repair portion, the molten brazing material (5) is solidified. Under the condition that the brazing material (5) in a powder form is brought into contact with the brazing material support (4), the brazing material (5) can be melted by heating to a temperature at or above the melting point of the brazing material (5).

Abstract: In various embodiments, a method of joining clad structures includes providing first and second clad structures each comprising a protective layer disposed only partially over a steel layer such that an edge region of the steel layer is exposed, joining the first and second clad structures at their respective edge regions, thereby forming a joint, and cold spraying a metal powder over and in contact with (i) the joint, (ii) the edge regions, and (iii) the protective layers of the first and second clad structures, thereby directly connecting the protective layers of the first and second clad structures with a layer of unmelted metal powder.

Abstract: A method is provided for producing an engine wall structure that includes an inner wall, to which hot gas is admitted during engine operation, an outer wall, which is colder than the inner wall during engine operation, and at least two webs that connect the inner wall with the outer wall and delimit a cooling duct between the walls. The engine wall structure is produced by wire-electro discharge machining the duct out of a solid sheet forming the entire engine wall structure including the inner wall, the outer wall and the webs.

Abstract: Fabrication techniques for and examples of metallic composite materials with high toughness, high strength, and lightweight for various structural, armor, and structural-armor applications. For example, various advanced materials based on metallic-intermetallic laminate (MIL) composite materials are described, including materials with passive damping features and built-in sensors.

Abstract: An accelerometer or a seismometer using an in-plane suspension geometry having a suspension plate and at least one fixed capacitive plate. The suspension plate is formed from a single piece and includes an external frame, a pair of flexural elements, and an integrated proof mass between the flexures. The flexural elements allow the proof mass to move in the sensitive direction in the plane of suspension while restricting movement in all off-axis directions. Off-axis motion of the proof mass is minimized by the use of intermediate frames disbursed within and between the flexural elements. Intermediate frames can include motion stops to prevent further relative motion during overload conditions. The device can also include a dampening structure, such as a spring or gas structure that includes a trapezoidal piston and corresponding cylinder, to provide damping during non-powered states. The capacitive plate is made of insulating material.

Abstract: The present disclosure provides for scoring a line on metal to form a solder dam to define a solderable area on a metal surface. The solderable area can define solderable pads on a solid copper plane or at the end point of a trace on a circuit board. The present disclosure provides for soldering metallic surfaces together and for aligning solderable objects to one another. The surface tension of solder enables the parts to be aligned through the manipulations of the skived patterns and their placement. The skiving can be done either by laser skiving or by mechanical scoring on the metallic surfaces.

Abstract: An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.

Abstract: An electrically conductive body includes: a first electrically conductive material; a second electrically conductive material; and a bonding material bonding the first electrically conductive material to the second electrically conductive material at least for electric conduction. The bonding material is made of a metallic structure containing copper-tin based intermetallic compound phases and tin-bismuth phases, the copper-tin based intermetallic compound phases being continuous between the first electrically conductive material and the second electrically conductive material, the tin-bismuth phases being surrounded by the copper-tin based intermetallic compound phases.

Abstract: The invention provides a printed circuit board and method for fabricating the same. The printed circuit board includes a substrate having an internal circuit structure. An additional circuit structure is disposed on the substrate, electrically connected to the internal circuit structure. A solder mask insulating layer having an opening is disposed on the additional circuit structure. A conductive bump pattern is disposed in the solder mask insulating layer, wherein the conductive bump pattern extends into the opening horizontally, wherein a side, a portion of an upper surface and a portion of a lower surface of the conductive bump pattern are exposed from the opening from the opening. A solder ball is formed in the opening, wherein the solder ball is electrically connected to the additional circuit structure.

Abstract: A lead wool electrode for an electro-chemical cell can be fused to a metallic collector to provide an electrical connection therebetween. Various methods of fusion such as thermal, electrical or chemical can be used.

Abstract: A cutting tool insert includes: a body defining a rake face, a flank face, and a cutting edge at an intersection of the rake and flank faces; and a cooling microduct within the body. The microduct has a cross-sectional area of not more than 1.0 square millimeter. The microduct is adapted to permit the flow of a coolant therethrough to transfer heat away from the cutting edge and extend the useful life of the insert. The microduct may have a portion with a cross-sectional area no larger than 0.004 square millimeter, and may communicate through at least one of the rake fact and the flank face to exhaust coolant near the cutting edge and further enhance cooling.

Abstract: Method for producing a securing object, particularly in the form of a heat-resistant adhesive closure, comprising: —designing and providing metal securing elements (9) having a hooked head (13) and a foot part in the form of a tang (11); —providing a support structure (1) having a securing surface (3); —introducing a perforation (7) into the securing surface (3) for forming seats for receiving the tangs (11) of the securing elements (9), and —inserting the tangs (11) of the securing elements (9) into the perforation (7) of the securing surface (3).

Abstract: There are provided the steps of preparing a contact (10, 20), which is formed from a metallic sheet including a base portion (11, 21), an elastic deformation portion (12, 22), and a contact portion (13, 23), and in which a recess (15, 25) is formed on a bottom surface of the base portion and a plurality of through-holes (16, 26, 27) are formed to be arranged above the recess and in parallel to the bottom surface of the base portion to extend through the base portion, and holding solder on the through-holes formed on the contact. A desired, solder-attached contact (10a, 20a) is fabricated by the manufacturing method. Further, the solder is a solder ball (90) and the step of holding solder includes the step of preparing the solder ball and the step of press fitting the solder ball into the through-hole.

Abstract: The invention concerns a process for joining a first member (1) comprising an aluminum alloy to a second member (2) comprising a titanium alloy and having at least one edge with a thickness e, comprising the steps of (i) chamfering said edge of said second member into a tapered truncated shape having on a first side a first tapering angle ?1, on a second side a second tapering angle ?2 and a minimum thickness t, wherein ?1 and ?2 are greater than or equal to zero, the sum of ?1 and ?2 is between 10° and 50° and t is between 0.05 e and 0.3 e, (ii) placing said first member and said chamfered edge of said second member (21) in an abutting relationship defining a geometry to be weld-brazed (3), (iii) heating the surface areas of said members adjacent the abutment to a temperature above the melting temperature of said aluminum alloy and below the melting temperature of said titanium alloy, in the presence of an inert gas (5) and of a filler metal (4) to obtain a weld-brazed joint.

Abstract: Compression molding of metals is used to make microchannel heat exchangers. Heat transfer can be improved by employing controlled microchannel surface roughness. Flux-free bonding is achieved using a eutectic thin-film intermediate layer. Seals are leak-tight, mechanically strong, and uniform across multiple contact areas. The metal heat exchangers may be mass-produced inexpensively, and are useful for applications including the cooling of computer chips and other high-power electronic devices, air conditioning, refrigeration, condenser plates, radiators, fuel cell heat management, and instant water heating.

Abstract: The system contains a substrate having at least one electrical trace formed thereon. An opening is formed in the substrate. The opening comprising at least one wall. An electrically conductive fill is formed in the opening. The electrically conductive fill is chemically bonded to the wall and electrically contacted with the electrical trace.