Abstract: A welding process in which fixture pipes 3 are resistance welded to opposite ends of a hollow stabilizer's suspension arm 1 for a vehicle and thereafter, these two parts are subjected to arc welding, but with a first step of the ends of the hollow stabilizer's suspension arm upset to form thick wall portions before resistance welding and arc welding are performed. The initial resistance welding retains the two parts in place for the arc welding step.

Abstract: Substrate warpage is eliminated without adversely affecting connection reliability when an IC chip or other packaging component is mounted on a substrate by thermocompression bonding with an interposed thermosetting adhesive. In a packaging method for the thermocompression bonding of a substrate and an IC chip or other packaging component between a stage and a head by means of an interposed thermosetting adhesive, the temperature of the stage during thermocompression bonding is set above the temperature corresponding to the inflection point of the elastic modulus in the relationship between the elastic modulus and the temperature of the cured adhesive.

Abstract: To provide such a boss welding structure for the arm of a working implement as is light in weight and easy in manufacture.

Abstract: The invention relates to a method for forming a welded joint between abutting pieces of steel. The welded joint is produced by first forming a strength weld and then depositing additional weld metal on the toe of the strength weld to form a toughness weld. The fusion interface of the toughness weld forms a minimum angle with the direction of the maximum tensile load across the welded joint. The toughness weld toe is separated from the heat-affected zone of the strength weld to effectively prevent propagation of a crack initiated at the toughness weld toe into the heat-affected zone of the strength weld. The welded joint so produced is substantially resistant to failure by brittle fracture.

Abstract: In a method of manufacturing multiple kinds of products in an arbitrarily selected order in one manufacturing apparatus, the rate of operation of the welding robots to be disposed in each of assembly lines for each of parts is improved, the cost for equipment investment is reduced, and the time required to introduce a new kind of motor vehicle into the manufacturing apparatus is shortened, whereby the productivity is improved. The manufacturing apparatus is made up of: a plurality of part assembly lines for assembling a plurality of parts; a combining station for tack-welding these parts to thereby assemble a product; and a reinforce-welding line for reinforce-welding the product. The number of welding points for welding each of the parts in the respective assembly lines is made equal to one another for all kinds of vehicles. Those welding points of each of the parts which fall short of a required number of welding points are welded in the reinforce-welding line.

Abstract: A method for manufacturing a connecting structure for covered wires is provided at first, a shield wire (1) and a ground wire (2) are prepared. After overlapping the ground wire (2) on the shield wire 1 across each other, respective overlapping portions of the wires (1, 2) are interposed between an upper resin tip (13) and a lower resin tip (14). Next, the upper and lower resin tips (13, 14) are oscillated with ultrasonic waves while compressing the upper and lower resin tips (13, 14) from the outside. Consequently, respective outside rinds (1d, 2b) of the wires (1, 2) are molten for removal, so that a braided wire (1c) comes into electrical contact with a core line (2a) the upper resin tip (13) is provided, on its butt face, with a stopper (13b) for defining the position of a leading end of the ground wire (2), while the lower resin tip (14) is provided, on its butt face, with a recess (14b) for receiving the stopper (13b).

Abstract: A vacuum chamber-forming method for forming a vacuum chamber in a power element of a control valve for a variable capacity compressor through a reduced number of steps. A power element is assembled in the atmospheric air by arranging a disk, a diaphragm, a disk, a spring and an upper housing on a lower housing, caulking the periphery of the lower housing to the periphery of the upper housing, and then soldering the junction of the upper and lower housings. The assembled power element is placed in a vacuum container, and a small hole formed in the upper housing is subjected to spot welding in the vacuum atmosphere, whereby the small hole is sealed by a weld metal.

Abstract: A multilayer wiring substrate which can be produced by a simple method and has a high connection reliability is disclosed.

Abstract: Apparatus for promoting heat transfer between a first volume (chamber volume) and a second volume (expandable, substrate support platform volume). Specifically, the apparatus comprises: a chamber defining a chamber volume that contains a chamber atmosphere, e.g., a partial vacuum; a substrate support platform that defines an expandable volume that contains a heat transfer medium, e.g., air; and a seal that isolates the chamber volume from the heat transfer medium. The substrate support platform further comprises: a substrate support platen that has a first surface located within the chamber volume and a second surface located within the expandable volume; a housing sealed to the second surface of the substrate support platen; and a expandable member such as a bellows, attached to the housing, to provide for expansion of the expandable volume that is defined by the housing and the bellows. The housing is typically fabricated of metal and the substrate support is typically fabricated of ceramic.

Abstract: A method for joining ductile iron with steel includes the steps of depositing a metallic material between a first ductile iron component, and a second steel component. The joint formed by the method has an interface disposed between the two components and the first and second components are welded thereto. The interface includes the metallic material. The metallic material preferably includes nickel sprayed to the joint area. The resulting interface material is a weld bead zone that preferably includes nickel at a concentration ranging from about twenty-two percent to about thirty-two percent, most preferably between about thirty percent and about thirty-two percent. The welding step of the present invention preferably includes the use of laser energy to localize fusion of the components and the metallic material.

Abstract: A method for welding electronic components (13) to a circuit board (10) having two conductive layers (12) includes the steps of inserting an electronic component (13) into a first surface of circuit board (10), welding the electronic component (13) to a first conductive face of the circuit board (10) using a first welding material (20), and subsequently welding the electronic component (13) to a second conductive face of the circuit board (10) using a second welding material (22) having a melting point lower than that of the first welding material (20).

Abstract: A method of welding a hollow member and an insert member to form a composite member including a hollow member and insertion member requiring a high dimensional accuracy in the end-to-end distance in the axial direction and requiring a reliable concentricity in the center axes of the hollow member and insertion member, including preparing a hollow member and insertion member, inserting the insertion member in the hollow member, providing spot welds at an overlap portion where the hollow member and insertion member overlap to correct the axial end-to-end distance of the hollow member and the insertion member, and providing a partial weld at an overlap portion where the hollow member and insertion member overlap to correct the concentricity of the hollow member and the insertion member.

Abstract: An improved method for mounting tape carrier package type integrated circuits on printed circuit boards. In the method, some of leads of the integrated circuit are preliminarily soldered with corresponding lead pattern on the printed circuit board after the integrated circuit is aligned on the printed circuit board so that the integrated circuit is prevented from being disordered while the printed circuit board including the integrated circuit aligned thereon is transferred to a soldering apparatus.

Abstract: In a plate-like component holding bracket (1) having a certain thickness, a welding portion (5) to be welded to a base member includes an end surface along one of the sides. The end surface is adapted to come into contact with the surface of the base member. Along the end surface of the side of the elding portion (5), non-welding portions (6) are provided adjacent to the welding portion (5), and discharge arc anti-transferring grooves (7) are formed between the welding portion (5) and the non-welding portions (6) to prevent discharge arc from transferring to the non-welding portions (6). The end surface of each non-welding portion (6) is formed at such a height (H) that is measured from the end surface of the welding portion (5) apart from the surface of the base member. The height (H) is effective to predetermine the height of the welded bracket.

Abstract: Method for the safety and extension of the operating life of pressure equipment having an internal chamber suitable for containing a process fluid, surrounded by a pressure-resistant body (1) equipped with weep-holes (2), made of a material subject to corrosion by contact with said process fluid operation, coated inside with an anticorrosive lining (4) made up of several elements welded to each other, wherein said lining weldings (3) are completely isolated from contact with the process fluid of the normal operating run, by a coating with adjoining strips (or plates) (10, 10′, 10″, 10′″), of the same material as said lining (4) or other corrosion-resistant material weldable thereto, which are subsequently seal-welded on the edges to said lining (4) and to each other, characterized in that the arrangement and welding of the edges of these strips (10, 10′, 10″, 10′″) are such to create a network of underlying interstices (or meati) (9,11), communicating with each

Abstract: Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed. For achieving the forming of the solder bumps, the adhesive film is formed instead of the Au plating, the adhesive film being used as an oxidation-preventing film and as film for temporarily fixing each of the solder balls, the solder balls being supplied by stencil mask or the vacuum adsorbing mask.

Abstract: A method is provided for forming a plurality of solder joints for electrically and mechanically coupling a printed circuit board (100) and a flexible circuit (101). Solder is applied to the connection surfaces of the printed circuit board (100), and the connection surfaces of the flexible circuit (101) are tinned. The circuit board (100) and flexible circuit (101) are then positioned so that the connections surfaces of each are in alignment and a gap exists between circuit board (100) and flexible circuit (101). The gap between circuit board (100) and flexible circuit (101) is precisely controlled and permits the solder of the printed circuit to be in contact with the connection surfaces of the flexible circuit (101). The solder is reflowed by applying heat by vapor phase condensation.

Abstract: A golf club head is formed from two separate pieces. One of such pieces constitutes the face plate while the other piece constitutes the sole plate and the top crown of the club head. The pieces are welded together to form a hollow shell. The sole plate and the top crown are connected together with a hinge. These hinged pieces are joined in a closed position in a nest die and spot welded together. The face plate is then seam welded to the sole plate and the top crown in an argon chamber to form an integral unit.

Abstract: A process and a device for bonding two millimeter elements. The process makes, at determined locations of each of the two millimeter elements, bonding zones set to the potential of a second plane. Then, the process makes the bond by determined connections between the bonding zones and between conducting lines of the two millimeter elements. The device includes a coplanar line. Such a process and device may find particular application to millimeter circuits implementing conducting lines of the microstrip type.

Abstract: A method of installing tiles via interposed tile carriers on a scroll of a centrifuge comprises mounting each tile carrier (11) prior to a welding step in the required position on a centrifuge flight by means of an individual tile clamp (32), with mechanical inter-engagement between each carrier (11) and its clamp (32), thus positioning each carrier (11) in the same position relative to its clamp (32) on each application, the tile clamps (32) being of a set width, so that when mounted side by side they pitch the carriers (11) so that when the tiles (10) are inserted there are no gaps between the tiles, thus giving a smooth surface without having to dress the tiles. Mounting is followed by welding the carriers (11), whilst held in position by the tile clamps to the centrifuge flight. The tile clamps; are then removed and once the tile carriers have cooled down to ambient temperature the tiles (10) are inserted and secured to their respective carriers (11).

Abstract: An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a conductive structure that couples a first substrate to a second substrate. The first substrate may include a chip or a module. The second substrate may include a chip carrier or a circuit card. Thus, the present invention encompasses such coupling as chip to chip carrier, chip to circuit card, and module to circuit card. The conductive structure includes a first conductive body and a second conductive body. The first conductive body is attached to the first substrate and the second conductive body is attached to the second substrate. The first conductive body may include a solder bump, while the second conductive body may include a eutectic alloy, such as a eutectic alloy lead and tin. Alternatively, the second conductive body may include a non-eutectic alloy whose melting point is below the melting point of the first conductive body.

Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.

Abstract: A Ni—Ti alloy part (6) constituting a frame for a pair of spectacles is inserted in and then caulked to a bore (3) formed in a joint piece (2) that is made of a resistance-weldable or resistance-brazeable titanium material. The joint piece (2) has a weldable or brazeable portion (5) that is located remote from the bore (3). This piece (2) will subsequently be resistance welded or brazed to a skeleton member (7) also constituting the frame and made of the same or a different titanium material also weldable or brazeable, so that the Ni—Ti alloy part can firmly and reliably be secured to the skeleton member.

Abstract: In a flyback transformer device wherein the leads of diodes or like electronic components are connected between pairs of terminal pieces provided upright at opposite ends of a coil bobbin, the lead ends, of the components are fixedly connected to the respective terminal pieces by electric welding. A coil conductor wound around the bobbin has an end twined around the terminal piece, and the twined portion is soldered by dipping.

Abstract: The top peaks of the outer fin are coated with slime-like flux. A sandwich unit is assembled from the outer fin and the tube plates by attaching the tube plates to the respective sides of the outer fin such that the surfaces of the tube plates having the butt bead faces formed thereon face inward. The butt bead faces on the respective tube plates on either side of the sandwich unit are coated with the slime-like flux. A plurality of sandwich units whose tube plates are coated with the flux are laminated and brazed, and the thus-formed assembly is heated in a heating furnace, to thereby braze together the tube plate pairs and the tube plates connected to the outer fin.

Abstract: A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase.

Abstract: An improved method of manufacturing thick film circuit wherein an IC is attached to a central conductor pad with adhesive, and wherein spreading of the adhesive is constrained by a ring of porous dielectric material formed between the central conductor pad and the peripheral conductor pads to which the IC terminals are bonded. When the adhesive material is printed and begins to spread, it contacts the porous dielectric ring, which absorbs the adhesive material and stops the spreading. In this way, the porous dielectric ring controls the dimensions of the cured adhesive, thereby preventing the adhesive from contaminating the peripheral conductor pads. Even with the addition of the intervening dielectric ring, the length of the wire-bond connections and the overall dimension of the IC and its conductor pads are both significantly decreased, contributing to improved circuit area utilization and wire-bond durability.

Abstract: An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.

Abstract: The present invention is a weld bonding method providing adhesion by both an adhesive and resistance spot welding, and includes application of an adhesive including a thermosetting epoxy resin, a latent curing agent and 1 to 15 vol % of one or more additives selected from the group consisting of conductive metals, metal oxides, metal carbides, metal nitrides, metal borides, and metal silicides, which are in the from of powder having a particle size of 10 .mu.m or less, or in the form of fragments or flakes having a thickness of 0.5 .mu.m or more and a size of 30 .mu.m or less.

Abstract: A method, and associated structure, for adhesively coupling a chip to an organic chip carrier. The chip is attached to a top surface of the organic chip carrier by interfacing a solder bump between a C4 solder structure on the chip and a pad on a top surface of the chip carrier. The melting temperature of the solder bump is less than the melting temperature of the C4 solder structure. A block of ferrous material is placed on a top surface of the chip. A temporary or permanent stiffener of ferrous material is placed on the top surface of the chip carrier. A permanent magnet is coupled to a bottom surface of the chip carrier. Alternatively, an electromagnetic could be utilized instead of the electromagnet. Due to the permanent magnet or the electromagnet, a magnetic force on the stiffener is directed toward the magnet and substantially flattens the first surface of the chip carrier.

Abstract: Solderable structures, and related methods for making them, can provide thermal conductivity and/or electrical isolation for electronic devices soldered to the structures. Each of the structures includes a solderable material bonded to a heat sink by a thermally-activated bonding material which provides thermal conductivity between the solderable material and the heat sink and which can be configured as a three-layer bonding film to also provide electrical isolation. The structures can be produced in a highly-automated, rapid way without the need for standard mounting hardware and mechanical preparation of the heat sinks.

Abstract: A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap.A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device.

Abstract: A method of enhancing a joint in a metal assembly. At least two metal members are joined together. Each member has a joining surface that mates with the other joining surface. The metal members are contacted against one another such that the joining surfaces mate. The mated joining surfaces are welded together at multiple locations. The welding process leaves a small gap between the metal members between these welding locations. Heat is applied to the joining surfaces adjacent to the gap. A solder is applied to the heated joining surfaces. The joining surfaces cause the solder to melt and to be wicked into the gap by the capillary force. The solder fills the length, width and thickness of the gap and joins the metal members together with a metallurgical bond. The entire joint including areas between the welding locations becomes joined.

Abstract: To weld a workpiece rounded from plane metal sheet on a seam welding machine, the workpiece is introduced into a preform (7) whose internal shape is approximately the same as the workpiece. Stops (11, 12, 14) are used to fix the workpiece in place in the preform, and the workpiece is then moved together with the preform (7) towards the welding rollers and welded. To this end the preform (7) is arranged on a platform (6) which in its turn is arranged on a movable carriage (3) in the welding machine (1). Welding with the preform makes it possible to weld together any desired sheet metal workpieces, including those which are not uniformly rounded because, for example, they are formed from blanks incorporating recesses.

Abstract: A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase.

Abstract: A process is provided for simultaneously attaching surface-mount (SM) integrated circuit (IC) devices (12) and chip-on-board (COB) IC devices (22) to a circuit board (10) using a combined solder reflow and adhesive cure thermal cycle. The process generally entails placing SM and COB devices (12, 22) on the circuit board (10), such that a suitable solder composition (14) and adhesive (24) are present between the circuit board (10) and the SM and COB devices (12, 22), respectively. The circuit board (10) and devices (12, 22) are then heated so as to simultaneously cure the adhesive (24) and reflow the solder composition (14). A preferred heating step entails at least one thermal cycle that attains a peak temperature well above the cure temperature of the adhesive (24), as well as above the melting or liquidus temperature of the solder composition (14). Accordingly, the thermal cycle is employed to cure the adhesive (24) well outside its conventional cure limits.

Abstract: A heat exchanger is disclosed which is designed to be fabricated from sheet material. The heat exchanger core assembly comprises a plurality of stacked substantially identical strips of formed sheet members each having a plurality of troughs formed therein. The troughs are positioned in nested relationship so as to define fluid flowpaths through the core assembly and between headers secured to opposite ends of the core assembly. Each of the troughs includes a bottom portion having a plurality of openings therein through which fluid may flow. In one embodiment the openings are in the form of louvers. In another embodiment, the openings are rectangularly shaped and offset between successive strips in the stack so as to impart a mixing action to the fluid flowing through the core. Heat radiating fin portions separate the respective fluid flowpath defining troughs and may include louvered-like openings therein. A method of fabricating the heat exchanger is also disclosed.

Abstract: Disclosed is a friction element designed for frictional contact with a body and for use, in particular, in brakes or clutches. The friction element has at least one freely accessible surface formed by a carbon-fiber-reinforced porous carbon block, at least some pores of which are filled with silicon and silicon carbide. In order to provide a friction element of this kind, as well as a method of manufacturing the friction element, which gives the advantages associated with C/C--SiC materials and which can be manufactured inexpensively, thus making it suitable, from the cost point of view, for general use particularly in the automobile-construction industry, the friction element is made up of at least one core element and at least one friction block securely bonded to it, the friction block being bonded to the core element on the side remote from its friction surface and the two elements being joined to each other by a high-temperature-resistant bonding layer.

Abstract: The present invention relates to a method for making metal frameworks for dental protheses:of the type comprising metallic cops, optionally coated with resin or ceramic material, designed to be anchored in the mouth directly onto the stump of the tooth or teeth to be restored, contiguous or independent,optionally coupled by also metal intermediate members;using for the embodiment of said cops directly on the master mould, generally of plaster, obtained from the patient maxilla or mandibular cast, i.e. without having to pass through a duplicate in refractory material, first a thin metal sheet forming operation on the stump model of the tooth to be restored and then wintering and/or melting operation of precious, semiprecious and non-precious metal powder, coating said metal sheet, through the effect of a suitable heat supply.

Abstract: During the production of long metal tubes with small diameters, where a metal tape is drawn from an annular coil, is gradually formed into a tube with a longitudinal slot and the longitudinal slot is welded, the internally and externally located metal tape ends of a number of annular coils are interconnected by welding, and the annular coils are horizontally positioned on tension rings which are attached to a rotatable take-up drum. The metal tape with the welded ends is drawn off without interruption.

Abstract: A wear surface for helicopter shoes is constructed by forming a railed enclosure on a curved base plate, placing a mosaic of smooth-surfaced tungsten carbide blocks on the base plate within the enclosure, brazing the blocks to the plate and rails, and grinding the rails to form a smooth, edgeless transition between the wear surface and the plate surface.

Abstract: A first component is soldered to a second component by placing the first component on the second component with solder therebetween, then ultrasonically vibrating at least one of the first and second components to thereby tack the solder to at least one of the first and second components, and by reflowing the solder. Ultrasonic vibration of at least one of the first and second components to thereby tack the solder is preferably performed for less than one second. A component placer places the first component on the second component with solder therebetween. An ultrasonic vibrator ultrasonically vibrates at least one of the placed first and second components, to thereby tack the solder to at least one of the placed first and second components. A solder reflower reflows the tacked solder to thereby solder the first component to the second component.

Abstract: A method of manufacturing clad tubular product from a hollow carbon steel billet having an inner diameter and a hollow corrosion resistant alloy billet having an outer diameter, comprising the steps of: machining the inner diameter of the hollow carbon billet and the outer diameter of the hollow corrosion resistant alloy billet to result in an interference fit between the two billets at room temperature when the corrosion resistant billow is placed inside the carbon billet; heating the hollow carbon billet in a furnace until the carbon billet reaches a temperature in the range of approximately 400.degree. F. to about 850.degree. F.; inserting the corrosion resistant billet inside of the hollow carbon billet while the carbon billet is at a temperature in the range of approximately 400.degree. F. to about 850.degree. F.

Abstract: A method for the temporary fixing of an electronic component (10) having elevated contact metallizations (11) to a substrate (17) provided with terminal surfaces (16) for a subsequent thermal connection of the contact metallizations to the terminal surfaces, wherein a bonding agent is applied to the component and/or the substrate and wherein the bonding agent used is an alcoholic liquid medium containing an alcohol (13) whose surface tension is used to form bonding forces between the contact metallizations and the terminal surfaces and whose boiling point is below the melting temperature of the contact metallizations (11).

Abstract: In a method and apparatus for manufacturing an optical fiber cable, a metal band is gradually shaped into a lengthwise slotted tube, the optical fibers are introduced into the still open slotted tube, the lengthwise slot of the tube is welded and the outside diameter of the welded tube is reduced. The welded tube with the reduced outside diameter is wound at least once around a take-up reel. A force provided on the reduced outside diameter welded tube as it is wound on the take-up reel causes an elastic strain of 0.1 to 0.6% on the tube. The strain is released on the take-up reel to produce an overlength of the optical fibers relative to the reduced outside diameter welded tube.

Abstract: Process for bonding a metal brush structure to a planar surface of a metal substrate in which an array of metal rods are retained and immobilized at their tips by a common retention layer formed of metal, and the brush structure is then joined to a planar surface of a metal substrate via the retention layer.

Abstract: A thin-walled steel first part is joined to a steel second part by first juxtaposing a metal plate with the first part, then securing the plate to the first part by soldering or laser welding, juxtaposing the second part with the plate, and fusion welding the second part to the plate.

Abstract: A method of reversibly brazing surfaces together. An interface is affixed to each surface. The interfaces can be affixed by processes such as mechanical joining, welding, or brazing. The two interfaces are then brazed together using a brazing process that does not defeat the surface to interface joint. Interfaces of materials such as Ni-200 can be affixed to metallic surfaces by welding or by brazing with a first braze alloy. The Ni-200 interfaces can then be brazed together using a second braze alloy. The second braze alloy can be chosen so that it minimally alters the properties of the interfaces to allow multiple braze, heat and disassemble, rebraze cycles.

Abstract: Disclosed is an apparatus and method for making an automotive bumper beam by a single roll forming. The apparatus of the present invention comprises an uncoiler; a straightener; a brake press; a first group of roll formers; a second group of roll formers; a final sweep roll former; adjuster; welding member; and cutting member. The method of the present invention is comprising of a step of preparing the steel sheet; a step for forming the tubular cross-sectional shape on the steel sheet; a step for forming a sweep on the steel sheet; a step for adjusting the tubular cross-sectional shape of the steel sheet; a step for welding two flanges to each other at their terminal ends; and a step for cutting the steel sheet to the predetermined length.

Abstract: A method for joining a component to a substrate applies a base solder portion to the substrate and provides a standoff solder portion in the base solder portion. The standoff solder portion has a higher melting temperature than the base solder portion and a height which substantially corresponds to a desired standoff height between the component and the substrate. The component is positioned on the standoff solder portion and the base solder portion is melted under reflow conditions to form a solder joint between the component and the substrate. This joint substantially encapsulates the standoff solder portion, wherein the reflow conditions create a dendritic structure between the base solder portion and the standoff solder portion.