Abstract: A method of mounting an electronic power component to a cooling element includes finishing at least a bonding area of the cooling element with a finish for use during soldering, forming an indentation in the bonding area of the cooling element, placing adhesive in the indentation, attaching the power component to the cooling element using the adhesive, and thereafter soldering the power component to the cooling element. The finishing melts during soldering and the adhesive prevents shifting of the power component on the cooling element during soldering. Alternatively, the power component is attached to a printed circuit board by adhesive bonding prior to soldering.

Abstract: A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap.A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device.

Abstract: The cladding material 10 comprises an Fe-based metal substrate 1 consisting of Fe or an Fe-alloy, a Ni-based metal layer 2 placed on the Fe-based metal substrate 1 and a metal mesh 3 placed on the Ni-based metal layer 2 in opposition to the Fe-based metal substrate 1 with the Ni-based metal layer 2 inbetween. Furthermore, a corrosion resistant metal lining 4 is placed in contact with the metal mesh 3 in opposition to the Ni-based metal layer 2 with the metal mesh 3 inbetween. The Fe-based metal substrate 1, the Ni-based metal layer 2, the metal mesh 3 and the metal lining 4 are bonded together by seam welded portion 8, which is provided in a planer or a linear form by using roller electrodes 6. The metal lining 4 consists of a metal whose main component is the one selected from Ti, Zr, Nb, Ta and Ni, or consisting of a stainless steel.

Abstract: The invention comprises a method and apparatus for maintaining seam alignment in seam welded tubes comprising the tube being formed to be advanced through a shaping station after seam welding and prior to the cooling of tube wherein the tube is preformed to commence to assume at least two continuously extending flat shaped surfaces parallel with the continuous seam and contacting the preformed tube subsequent to the cooling to maintain alignment of the weld seam.

Abstract: A double shear lap joint is formed between metal and composite structure by welding Z-pins in the composite in the joint area to the metal tangs on the metal structure. The joint has modest strength but is less susceptible to shock damage than an adhesive bond or to notch effect crack propagation damage associated with fastened metal/composite joints.

Abstract: A method for manufacturing a sweeped tubular bumper reinforcement member having a rear wall formed with an inwardly indented portion in cross-section and a front wall formed in parallel with the rear wall and welded to the inwardly indented portion of the rear wall.

Abstract: An integrated circuit package that has no internal routing or vias within the substrate of the package. The package includes a substrate that has a plurality of bond pads and connecting contact pads located on an outer first surface of the substrate. An integrated circuit is mounted to the first surface and coupled to the bond pads. Mounted to the substrate is a solder rack which contains a plurality of contacts that couple the contact pads to an external printed circuit board.

Abstract: An apparatus for producing a contact/connection member for electronic parts has a base material supply unit for continuously supplying a flexible belt-shaped base material, a wire material supply unit for continuously supplying a precious metal wire material, a welding unit for diffusion bonding the wire material to a surface of the base material by applying electricity to a mother rotation electrode and a variable rotation roller electrode while the wire material is pressed against the surface of the base material between the electrodes at a welding location, and a take-up unit for the bonded contact/connection member. A cooling unit may be provided for the welding unit. The apparatus produces a contact/connection member having a base material thickness of between 0.03 to 3.0 mm and a width of 3.

Abstract: A device for the inside scarfing of tubes or profiles longitudinally welded in a tube welding line consists of a tool carrier guided on guide rollers inside the tube to which a cutting ring is attached. The cutting ring is clamped in a cutting ring holder and can be rotated about its central axis which is inclined at an acute angle to the longitudinal axis of the tube. The cutting ring can be retracted from the cut, whereby at the same time as the retraction of the cutting ring, the clamp can be released and the cutting ring can be turned further by a defined angle. The device is controlled by at least one hydraulic or electric line leading out from the welding point of the tube or profile in the tube welding line.

Abstract: A composite structure comprising a body having a surface. Cladding covers at least a part of the surface. The body and the cladding are formed of different materials, at least one of which is a shape memory alloy having a recoverable strain in excess of 1.0%.

Abstract: Methods of brazing and coating and preparing articles for brazing and coating are disclosed. Prior to assembly and brazing, the articles are coated with a coating composition including a hot melt adhesive medium and brazing materials. To coat the articles, the hot melt adhesive medium and brazing materials are first mixed at elevated temperatures to form a liquid coating material, the material is allowed to harden, and the hardened material is then melted onto the articles to form a hard coating. The coated articles are then assembled for brazing. During the brazing process, the articles are first preheated to a sufficient temperature to substantially gasify and remove the hot melt adhesive medium from the articles. This leaves only the brazing materials on the articles for clean and efficient brazing of the articles in a conventional brazing oven. In one embodiment, the hot melt adhesive medium takes the form of a hot melt glue from the chemical family of ethylene-vinyl acetate bases.

Abstract: A method of producing an elongated member having a main body portion and terminal portions extending form ends thereof includes bending an elongated strip between circumferential faces of first forming rolls and second forming rolls having parallel central rotational axes. The circumferential faces of the first forming rolls include annular main body portion bending sections that form the main body portion in the strip and adjacent transition portion bending sections that form adjacent transition portions in the strip, thereby forming an intermediate stage elongated member. The transition portions have a cross-section that changes continuously from the annular cross-section of the main body portion to a different cross-section of the terminal portions.

Abstract: The present invention is a superconducting radiofrequency window assembly for use in an electron beam accelerator. The srf window assembly (20) has a superconducting metal-ceramic design. The srf window assembly (20) comprises a superconducting frame (30), a ceramic plate (40) having a superconducting metallized area, and a superconducting eyelet (50) for sealing plate (40) into frame (30). The plate (40) is brazed to eyelet (50) which is then electron beam welded to frame (30). A method for providing a ceramic object mounted in a metal member to withstand cryogenic temperatures is also provided. The method involves a new metallization process for coating a selected area of a ceramic object with a thin film of a superconducting material. Finally, a method for assembling an electron beam accelerator cavity utilizing the srf window assembly is provided.

Abstract: An method and apparatus for forming adhesive and solder pads on a printed circuit board to surface mount electrical components to the board. In accordance with an embodiment of the invention, a solder paste is deposited onto the printed circuit board through a first stencil that has a plurality of first openings. The solder paste forms a plurality of solder pads on the board. A second stencil is then positioned on the printed circuit board. The second stencil has a plurality of second openings, and a recess in its bottom face configured to receive the plurality of solder pads. After the second stencil is positioned on the printed circuit board so that the solder pads are received in the recess on the bottom face of the second stencil, an adhesive material is deposited onto the board through the second openings of the second stencil to form a plurality of adhesive pads on the board.

Abstract: A system is disclosed for forming metal tubing and, more particularly, brake tubing. The system includes a mill for rolling a metal strip into a tube so that at least a portion of the strip overlaps itself. The strip is then brazed so that the overlapping portions of the strip fuse together and form the tube. Thereafter, the tube passes through a cooling tunnel which cools the tube to a temperature such that the tube can be coated with a corrosion resistant material, such as a zinc based material. An inert gas, such as argon, and/or a reducing gas, such as hydrogen, is introduced into the cooling tunnel to prevent or remove oxidation of the tubing as it passes through the cooling tunnel.

Abstract: The invention features a method for flowing solder in a gap between two surfaces. A supply of solder is heated to cause it to reflow and flow in the gap. The solder is directed to flow as a main stream in the gap and to flow as peripheral streams from the main stream toward edges of the gap to reduce formation of voids.

Abstract: A metallurgical bond which may be substituted for a soldering process forms an alloy of a metal with a metal coating applied to at least one of the surfaces to be so bonded by a transient liquid phase (TLP) reaction at a low temperature. Mechanically robust bonding of noble metals for electrical connections which are resistively stable through repeated thermal cycling can be performed at particularly low temperatures using coating materials of indium, tin or lead. Isotropically or anisotropically conductive connections can be formed by applying a polymer adhesive containing conductive particles to at least one of the surfaces to be bonded and a compressional force developed between surface by curing of the polymer adhesive at temperatures lower than the melting point of a eutectic alloy of the chosen metal system before the TLP process is allowed to proceed.

Abstract: The present invention relates to a mounting assembly for a pressure sensor in a pressure transmitter. The mounting assembly includes a header having a cavity opening to a first surface. The cavity is defined by an inner endwall and an inner sidewall. A support is joined to the inner endwall within the cavity on a first support end. A pedestal has a first pedestal end supporting the pressure sensor and a second pedestal joined to the second support end. Aligning means align the second pedestal end to the second support end in order that a volume of the mounting assembly is increased to thereby reduce a quantity of fill fluid needed in the sensor cavity.

Abstract: A device and method for mounting a surface mount package onto a printed circuit board includes inserting a pin through a printed circuit board feedthrough for providing movement of the pin within the feedthrough. One end of the pin is soldered to conductive surfaces on the bottom side of the printed circuit board while the other end of the pin id soldered to a surface mount package pad. The package is mounted in a spaced relation with a printed circuit board top surface. The pin is soldered to the board conductive surface using a high temperature solder for forming a solder joint which remains solid during subsequent soldering using a low temperature solder such as a lead tin solder type. The pin is then soldered to the pad of the surface mount package using the low temperature lead tin solder for forming a solder joint between the pad and pin.

Abstract: An apparatus for manufacturing an optical fiber cable covered with a metal pipe forms a metal pipe by abutting two sides of a metal strip to be pulled, introduces an optical fiber or an optical fiber bundle into the metal pipe, and seals the opening of the metal pipe by laser welding. A squeeze shoe is arranged immediately before a welding position. The inner circumferential surface of the squeeze shoe is brought into contact with the metal pipe, and the section of this inner circumferential surface conforms to the outer circumferential surface of the metal pipe. The squeeze shoe is vertically divided into halves. Since the squeeze shoe is provided immediately before the welding position, the opening of the metal pipe can have a predetermined width and be welded. The opening width is adjusted in accordance with at least one of a diameter, thickness and composition of the metal strip and in accordance with at least one of a welding rate, laser beam power and laser beam focus shift amount of the laser welder.

Abstract: A method of connecting two strips (1, 3) each provided with a conductor pattern, an insulating coating (9, 11) and a set of free conductor portions (5a, 7a) of the conductor pattern, which free conductor portions are disposed outside the coating. The strips are positioned in such a manner relative to one another that the one set of free conductor portions faces the other set of free conductor portions and the coatings overlap one another at least partly. After this, the two strips are pressed against one another and the one set of free conductor portions is soldered to the other set of free conductor portions. However, before the strips are pressed against one another an adhesive is applied to at least one of the coatings at such a location that after positioning of the strips the adhesive is situated in an overlapping area between the coatings.

Abstract: A method for attaching a surface mount device to a circuit board includes applying a heat curable adhesive to the circuit board, applying solder paste with a predetermined melting temperature to the circuit board, placing the surface mount device on the adhesive, placing the circuit board into an oven where the circuit board is continuously heated to a first temperature until the adhesive is sufficiently cured so that it withstands reflow of the solder paste then to a second temperature to melt the solder paste.

Abstract: Glue dots are deposited on a substrate side of a partially completed printed circuit board, between pairs of component mounting pads disposed on the substrate and having quantities of solder paste thereon, using a resilient stencil plate having a spaced series of glue discharge openings extending transversely therethrough, and a spaced series of side recesses. The recess side of stencil plate is positioned in a spaced, parallel and opposing relationship with the mounting pad side of the substrate with the plate recesses being aligned with the substrate mounting pads, and the glue discharge openings being aligned with glue leveling pads disposed on the substrate side between adjacent mounting pad pairs. Glue is deposited on the outer stencil plate side and a squeegee blade is moved along the outer stencil plate side to deflect it toward the substrate and force glue through the discharge openings to deposit glue dots thereon when the stencil plate is permitted to return to its undeflected position.

Abstract: In a method for producing a lengthwise welded metal tube with an outside diameter of 1 to 6 mm, whereby a metal band is shaped into a lengthwise slotted tube by a forming tool, and the lengthwise slot of the tube is welded by a laser welding installation, the tube to be welded passes immediately before and immediately after the welding point area through a guide that guides the surface of the tube to keep the edges of the band in contact with each other and keeps the welded seam stress-free. The jaws of a clamping tool grip the welded tube immediately downstream of the guide to keep it from twisting.

Abstract: A tubular shape finishing apparatus in a steel pipe manufacturing system which molds band steel in a tubular shape while passing through a plurality of sets of forming roll stands and welds the butt portion by a seam welding unit, the tubular shape finishing apparatus welding the pipe by a seam welding unit, cutting off padding by a bead cutter, finishing and shaping the same into a shape of a desired diameter, and to be about an complete round, and comprising one or two of 3-roll forcible drive type stand or 3 or more roll forcible drive type stands disposed in series.

Abstract: A lower vacuum housing (34) of a sensor dewar (26) is fabricated in a single brazing operation from ceramic and metallic components. The components are assembled with ceramic-to-metal interfaces and metal-to-metal interfaces. Brazing is accomplished by active brazing of the ceramic-to-metal interfaces and non-active brazing of the metal-to-metal interfaces. Specific combinations of active braze alloys and non-active braze alloys are provided for various combinations of dewar materials.

Abstract: A pin-type fastener capable of dual-function includes a pin which can be used in fastening workpieces together. The pin has a pintail capable of being removed from the remainder of the pin after the pin has been installed as a fastener in a workpiece, and the pintail can then be used as a weldstud and welded to the same workpiece as the pin-type fastener, or to another workpiece. The pin-type fastener can be a two-part fastener, for example a lockbolt including a nut or swageable collar engageable with the pin. The pin may have a breakneck to facilitate removal of the pintail. The pin itself may be a weldstud. In use, the pin-type fastener is installed in a workpiece and the pintail is removed, and then the pintail is used as a weldstud, being welded to a workpiece. Electric welding is employed. The advantage of the fastener is in economy through second use of the pintail as a stud.

Abstract: A hidden lead package device is configured to be placed between a leadless component such as a surface mount package (SMP) used to house a SAW device and a standard printed circuit board configured for solder joints in a leadless contact with the printed circuit board. The hidden lead device is made using materials having similar characteristic thermal expansion properties as that of the SMP and printed circuit board pads to which the hidden lead is affixed. The hidden lead extends across the underside of the SMP along the PCB surface. One end of the lead is brazed to an SMP pad and the opposite end is soldered to a communicating PCB pad. The brazing temperature is higher than the reflow temperature for the solder. The hidden lead device causes the relative movement between the leadless carrier and the printed circuit board to occur along a length of the hidden lead and thus minimizes tensional or compressive forces to the solder joints.

Abstract: A package for use in implanted devices, particularly where power and/or data are supplied by an inductive link, is disclosed. A ceramic envelope is bonded to a platinum or similar flange, so that the package may be sealed by simply welding the flange to a metal closure. No braze is required in the bonding of the flange to the envelope.

Abstract: An apparatus for making cable including an elongate core and a surrounding longitudinally welded tube includes one or more pairs of opposing tube forming rolls which form a tape into a generally tubular shape surrounding the advancing core. A pair of tube forming rolls define exit tube forming rolls mounted to have an adjustable spacing therebetween. A first sensor generates an exit roll spacing signal which is one parameter that may be displayed to the operator or used to directly to control the spacing. Downstream from an induction welding coil, a pair of opposing weld rolls are mounted to have an adjustable spacing therebetween for permitting setting of a desired pressure between the heated opposing longitudinal edges of the advancing tape. A second sensor generates a weld roll spacing signal which may also be displayed or used to directly control the spacing within a desired range. An associated method is also disclosed.

Abstract: Solder interconnection for forming connections between an integrated semiconductor device and a carrier substrate is provided. Located on the carrier substrate are electrodes and located between the electrodes and integrated semiconductor device are solder connections that have a relatively low melting point such that when the device is in operation, the solder connection will liquify thereby permitting expansion compensation between the substrate and semiconductor device.

Abstract: A metallurgical bond which may be substituted for a soldering process forms an alloy of a metal with a metal coating applied to at least one of the surfaces to be so bonded by a transient liquid phase (TLP) reaction at a low temperature. Mechanically robust bonding of noble metals for electrical connections which are resistively stable through repeated thermal cycling can be performed at particularly low temperatures using coating materials of indium, tin or lead. Isotropically or anisotropically conductive connections can be formed by applying a polymer adhesive containing conductive particles to at least one of the surfaces to be bonded and a compressional force developed between surface by curing of the polymer adhesive at temperatures lower than the melting point of a eutectic alloy of the chosen metal system before the TLP process is allowed to proceed.

Abstract: A method, and product created thereby, by which low melting point solder suitable for reflow connection of components is formed on select fine pitch contacts of a printed circuit board. The method is particularly suited to the attachment of flip-chip die to printed circuit boards which also include coarse pitch surface mount components. Controlled volumes of solder are formed onto fine pitch contacts of the printed circuit board through selective holes in a mask formed onto the board. The deposit is accomplished by molten solder immersion preferably using conventional hot air solder level manufacturing equipment. The volume of solder is related to the thickness of the mask. The mask is then removed, the deposited low temperature solder is flattened, and the coarse pitch contacts are covered with solder paste in a conventional screening process. Flux is applied to the fine pitch contacts.

Abstract: A process of preparing clad contact material comprises forming a contact belt-like member by bonding an Au or Au alloy tape to the surface of an Ag or Ag alloy tape, thermally treating that contact member for forming an Au diffusion layer, and cladding that contact member having the Au diffusion layer to a base belt-like member made of Cu or a Cu alloy. Since, according to the process, the thermal diffusion treatment is carried out before the contact belt-like member is set in the base belt-like member, the thermal diffusion treatment of the contact belt-like member can be performed in the most suitable conditions for obtaining an Au diffusion layer with excellent characteristics, and no dissolution may occur at the interface between the two belt-like members.

Abstract: A process for consolidating a composite material comprising the steps of forming a workpiece including a matrix interspersed with fibers, supporting the workpiece by an electrically conductive support, inductively heating the support and thereby conductively heating the workpiece, and applying pressure to the heated workpiece.

Abstract: A method and apparatus are used to mount a machine component, e.g., an electric motor, in alignment with another component such as a gear shaft of a gear transmission. The apparatus includes a bolt-attached U-shaped clamp device straddling a "foot-like" transmission mounting base. The legs are spaced greater than the horizontal thickness of the base to permit slight base movement during mounting. The clamp device has an interior height somewhat less than the vertical height of the base. The base is shimmed so that the motor shaft is vertically aligned with the gear shaft, horizontal and angular alignment is performed and then the clamp legs are shimmed. Leg shimming is to a height such that when the clamp bolts are tightened, the base shims are under substantial compressive force and the leg shims are under only somewhat less compressive force. One or more chock blocks are welded to the machine deck to help maintain base position.

Abstract: A sleeve-shaped printing sleeve for a form cylinder of a printing machine is fabricated from a blank of metallic material by cutting the blank to a width corresponding to the form cylinder and to an intermediate length which exceeds the circumference of the intended printing form cylinder. Additionally, the blank is provided with aligning indicia in the regions between each edge of the intermediate-length blank and the corresponding edge to be defined by cutting. Thus, these regions lie outside of the printing area. The blank is bent circularly, held in exact register in a bending/welding device, and cut to the length required for the intended form cylinder by laser beam cutters. As a result of this cutting operation, two waste pieces are produced. The waste pieces are removed and the now defined plate edges forming the beginning and end of the printing form are positioned opposite one another without overlap and welded together, preferably by a laser.

Abstract: A method of applying a tacking agent to a printed circuit board. The printed circuit board (10) has a number of solder pads (12), and each solder pad is preclad with a layer of solder (14) between 0.02 and 0.3 mm thick. A plastic film (16) is temporarily adhered to the printed circuit board by a pressure sensitive adhesive. The plastic film has a number of apertures (22) that correspond to the solder pads, and is positioned so that the apertures in the film expose the solder coated pads. There is a breakaway tab (20) on the plastic film that is used to peel the film from the printed circuit board in a later operation. The film is roller coated with a high viscosity tacking agent (30) so that a layer of the tacking agent is applied to the exposed interconnect pads. The plastic film is then peeled cleanly away from the printed circuit board using the breakaway tab, leaving the tacking agent only on the solder pads.

Abstract: The invention is in the field of metallurgy and relates to an automatic machine for the continuous production of cylindrical shells from a pile of flat metal sheets. Said machine is characterized in that it is comprised of, from the output of the shell to the input of the metal sheet, a welding station provided with means for transferring and holding a rolled blank with jointed edges and means for the continuous formation of a welding bead along said edges, a station for the continuous transfer of the rolled blanks and for progressively tightening them, a station for the discontinuous transfer of the blanks to deliver them axially against each other, a rolling station consisting of a rolling machine, and a supply station comprising means for unpiling and transferring the metal sheets, and a servomechanism for adjusting the bending means as a function of the thickness of each sheet.

Abstract: A novel bonding tool is designed for use in conventional ultrasonic transducers. The bonding tool body is mounted in the ultrasonic transducer at an angle or in an offset holder so that the working face of the bonding tool is offset and out from under the end of the ultrasonic transducer. The axis of a wedge bonding tool body is mounted at an inclined angle of up to forty-five degrees and the tapered wedge of the bonding tool is inclined in the opposite direction so that the working face of the offset tapered wedge is in a horizontal working plane.

Abstract: A metallic strip having at least one surface enhanced with a texture pattern is formed into a welded tube. A fin insert shapes the edges of the metallic strip prior to welding and minimizes the formation of a protruding weld bead. The longitudinally running edges of the metallic strip adjacent to the enhancement are angled so that the unenhanced portions of the strip edges contact during welding. By having the unenhanced portions contact, fluctuations in metal volume during welding are reduced. This reduces weld instability.

Abstract: A substrate includes a non-conductive support layer and a plurality "n" of conductive leads disposed on the support layer. The leads are arranged in a generally radial pattern about a central point on the support layer, each of the leads having a width "w" and spaced a distance "d" from one another at their innermost ends, thereby forming a generally square opening of side dimension "s". The substrate accommodates semiconductor dies ranging in size from smaller than the opening, to approximately equal to that of the opening, to substantially larger than the opening, such as four times the size (linear dimension) of the opening. The die is bonded to the substrate. Other elements of a semiconductor device assembly are added to the resulting structure. Method and apparatus are disclosed.

Abstract: According to the invention, a method and structure for flip chip interconnection of an integrated circuit chip to a substrate is provided. The method and structure of the invention overcome the problems associated with interconnecting the chip to the substrate by wirebonding and are less expensive than prior art flip chip interconnection methods and structures. Conventional integrated circuit chips that have been made using wafer fabrication processes for wirebonding chip-level interconnection are electrically connected to a substrate using a flip chip interconnection. Conventional wirebonding equipment can be used to bump chips for use in the invention.

Abstract: A printed-circuit substrate is provided with: a film-shaped support base having an electrical insulating property and elasticity, which includes a resin mold section for supporting an IC; a plurality of foil-shaped electrodes which are connected to the IC and supported by the support base in such a manner as to extend toward the periphery of the support base; and an exposed portion which is provided by removing the support base in the direction orthogonal to the foil-shaped electrodes over an entire area of the support base between the IC chip and the periphery thereof so as to expose one portion of each foil-shaped electrode. In the case of connecting the foil-shaped electrodes to electrodes of a printed-circuit substrate by means of soldering, the tips of the foil-shaped electrodes are soldered to the respective electrodes by applying heat and pressure to a part of the support base located on the tip-side of the exposed portions of the foil-shaped electrodes.

Abstract: The method of forming a coated seamed metal tube of this invention is particularly, but not exclusively adapted to existing continuous tube forming mills, wherein the tube is formed from a metal strip and welded with the seam located in an upper portion of the tube. In the process of this invention, at least one surface of the strip is coated with a metal coating prior to forming and welding. The tube is then turned to relocate the welded seam in a lower portion of the tube and the lower portion of the tube is then reheated to melt the metal coating and the metal coating then flows downwardly over and coating the welded seam. In the most preferred continuous or in line process of this invention, the tube is continuously spirally twisted following welding to locate the seam in a lower portion of the tube adjacent a heater and the tube is then heated by the heater to the melting temperature of the metal coating, causing the coating to coat the seam.

Abstract: A bonding method joins together a plurality of conductively coated polymers in a single operation. The method employs heat generation via a high energy source, whose output is focused by an energy director which causes fusing of the polymer surfaces along with fusing of the metal surfaces at their respective interfaces to form a robust electrical and mechanical bond.

Abstract: An end bumper for vehicles constructed from a single sheet of high-tensile strength steel roll-formed to provide two side-by-side tubular sections. Each section has a front wall, an outer side wall, a rear wall, and an inner side wall, the inner side walls being spaced one from the other and connected together by a web roll-formed integrally with the inner side walls. The front walls each have extended ends overlapping and abutting the web. The extreme ends of the front walls also form an abutting juncture which is welded together and also welded to the web. The bumper has a sweep formed by a sweep-forming mechanism having curvilinear external and internal mandrels conforming to the inner configuration and outer configuration of the bumper so as to provide a passageway therebetween for receiving the bumper. The bumper is passed through the passageway while the roll-forming of the bumper takes place upstream of the mandrels.

Abstract: An electronic part is tacked to a circuit board, leads of the electronic part being made into contact with cream solder built up on the circuit board, and thereafter, the circuit board is heated up so as to melt the cream solder in order to solder the electronic part to the circuit board. In this procedure, the melting temperature of a hardener in the tacking bond, that is, the hardening temperature of the tacking bond, is higher than that of the cream solder, thereby making it possible to prevent hindrance to sinking of the lead terminal of the electronic part into the melted cream solder.

Abstract: A method of providing a thermally conductive connection between spaced surfaces includes (a) mixing a thermally conductive filler containing a liquid metal into an unhardened matrix material, and (b) contacting the unhardened matrix material and randomly dispersed, separate spaced non-solidified regions of filler within the unhardened matrix material to the surfaces. A solid mechanical bond may be provided by hardening the matrix material or by providing a separate adhesive between the surfaces. Preferably, the regions of filler form separate spaced continuous thermally and electrically conductive paths between the surfaces.

Abstract: A method of making a heat exchanger of the type used in vehicle radiators and having a core of spaced welded, as contrasted to lock-seam, tubes and interconnecting fins connected to spaced liquid tanks.