Abstract: The present invention relates to the development of variants of multilayer structural materials with enhanced corrosion resistance, including successively connected outer main layers which directly contact corrosive operating environments on one or both sides of the multilayer material and, disposed therebetween, alternating internal main and internal sacrificial layers. The main layers are made of metallic materials which are characterized by a state of passivity over a prolonged period with subsequent development therein of pitting-type corrosion, while the internal sacrificial layers, which contact the corrosive operating environment as deep foci of pitting corrosion develop in the preceding outer and internal main layers, are characterized by the development of general corrosion and have a protective action in relation to the outer and internal main layers. Methods for preparing such materials are proposed.

Abstract: A weld joins a thin overlay of low carbon steel to a base that contains high carbon steel, at least at its surface along which the weld is formed. The weld may be effected by fusion (melting) or by solid-state diffusion. With either it creates a heat affected zone (HAZ) in the base around the weld. The HAZ contains enough austenite, and perhaps bainite as well, to render the HAZ relatively ductile and also crack resistant. Adjacent to the weld the HAZ has a hardness that does not exceed 58 HRC. The weld may be produced with a high energy beam or with resistance welding equipment.

Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and may be partially integrated or fully integrated into a processing chamber which also includes diffusion bonded layers.

Abstract: According to a metal joining method of the present invention, first and second dissimilar metals are joined together by interposing between the first and second metal materials a third metal material dissimilar to the first and second metal materials and causing eutectic melting at least either at an interface between the first and third metal materials or at an interface between the second and third metal materials.

Abstract: A method of forming packages containing SiC or other semiconductor devices bonded to other components or conductive surfaces utilizing transient liquid phase (TLP) bonding to create high temperature melting point bonds using in situ formed ternary or quaternary mixtures of conductive metals and the devices created using TLP bonds of ternary or quaternary materials. The compositions meet the conflicting requirements of an interconnect or joint that can be exposed to high temperature, and is thermally and electrically conductive, void and creep resistant, corrosion resistant, and reliable upon temperature and power cycling.

Abstract: The invention relates to a method for forming a highly electroconductive surface on an aluminum piece. A highly conductive layer of silver is formed on the piece by means of a eutectic join. The temperature of the aluminum piece is raised gradually and the oxide layer formed on the surface of the piece is removed. After the first heating stage, the silver piece that is to be attached is transferred to the cleaned surface. The contact point is heated to a temperature where a eutectic bond is generated between the aluminum and silver. During the second heating stage a slight momentary loading is applied to the contact point.

Abstract: The invention relates to open-pore biocompatible surface layers for implants, which layers are arranged over virgin surfaces of the implants, wherein pores of the open-pore surface layers are connected to form coherent pore networks and the surface layers have a specific internal surface area of ?0.06 ?m/?m2, preferably ?0.035 ?m/?m2 and especially ?0.025 ?m/?m2, measured by image analysis as a 2D-boundary line per unit of surface area in a metallographic microsection at 100× magnification. The invention further relates to methods of producing such surface layers, to implants coated therewith and to possible uses of the surface layers.

Abstract: A cast metal part has a veneer made of cosmetic metal applied thereto so that the cast metal part has a cosmetic surface. A method for producing a cast metal part with a cosmetic surface comprises applying a veneer of cosmetic metal to a surface of the cast metal part. The cast metal part can be a die cast part, such as die cast aluminum or zinc. The veneer can be thin gauge highly cosmetic aluminum. The veneer of cosmetic metal can be applied to the surface of the cast metal part by placing the veneer into a casting mold used for forming the cast metal part, and casting molten metal onto the veneer in the casting mold. The veneer of cosmetic metal can also be applied to the surface of the cast metal part by solid-state welding, e.g., diffusion bonding, the veneer and the cast metal part together.

Abstract: According to a metal joining method of the present invention, first and second dissimilar metals are joined together by interposing between the first and second metal materials a third metal material dissimilar to the first and second metal materials and causing eutectic melting at least either at an interface between the first and third metal materials or at an interface between the second and third metal materials.

Abstract: A manufacturing method for an electronic device joining a first metallic bond part formed on a first electronic component and a second metallic bond part formed on a second electronic component includes a first process for placing the first metallic bond part directly against the second metallic bond part, applying pressure to the first electronic component and the second electronic component, joining the first metallic bond part to the second metallic bond part with solid-phase diffusion, and releasing the applied pressure, and a second process for heating the first electronic component and the second electronic component at a predetermined temperature such that the first metallic bond part and the second metallic bond part are joined together by melting the first metallic bond part and the second metallic bond part.

Abstract: The invention is directed to effective means for joining materials having dissimilar coefficients of thermal expansion, such as advanced ceramics with metallic compounds. Moreover, the present invention relates to furnace tubes and methods of fabricating a joint between two different materials, which is compositionally graded to provide a substantially graded coefficient of thermal expansion between the joint materials.

Abstract: Methods and apparatuses for passive jet blast deflection or the like. Use of the passive jet blast deflector permits the efficient dispersal of a fast moving local heat source into the environment through passive means while providing a high strength structure. The jet blast deflector system may include a first plate, a second plate, and a cellular core disposed between them adapted to allow cooling ambient air to flow through the cellular core, wherein the first plate, second plate, and core are all seamlessly coupled heat pipes that form a single vapor core to facilitate the spreading and even storing of thermal energy. An ejector plate may be attached to the top of the second plate to create a low pressure zone as the heat source passes over it, thereby pulling the ambient air through the cellular core, facilitating the removal the thermal energy from the system.

Abstract: A titanium alloy composite material including dispersed carbon fibers coated with a layer containing an element which forms a carbide in reaction with carbon, and the carbide formed thereby, in crystal grains of the titanium alloy. The element which forms a carbide in reaction with carbon is preferably at least one of silicon (Si), chromium (Cr), titanium (Ti), vanadium (V), tantalum (Ta), molybdenum (Mo), zirconium (Zr), boron (B), and calcium (Ca). The carbon fibers are preferably carbon nanotubes, vapor-grown carbon fibers, or a mixture thereof. The titanium alloy composite material has excellent mechanical strength, such as tensile strength, Young's modulus, toughness, and hardness.

Abstract: A method for the planar joining of components of semiconductor devices involves coating the components with diffusion materials on their upper sides and rear sides, respectively. Subsequently, the components to be joined one on the other are introduced into a reducing atmosphere. The components are aligned and a compressive pressure is exerted on the aligned components. While heating up the components to be joined in the reducing atmosphere to a diffusion joining temperature, isothermal solidification takes place, the diffusion joining temperature lying below the melting temperature of the forming diffusion joint of the joined material.

Abstract: A wafer article includes a substrate, two or more hydrophilic areas disposed on the substrate, hydrophobic areas surrounding the hydrophilic areas, and a eutectic bonding material disposed on the substrate. A wafer apparatus including two wafers having complimentary hydrophilic regions and eutectic bonding material is disclosed and a method of forming a bonded wafer articles is disclosed.

Abstract: A preform for forming a structural assembly that defines a complex contour is provided. The preform and, hence, the structural assembly includes first and second skin members and a cellular core member between the first and second skin members. The skin members and/or the core member can be formed to a shape that corresponds to the desired contour of the structural member before the preform is assembled, e.g., by superplastic forming. That is, the first skin member can be disposed against a contour surface of a die to restrain the preform to the contour defined by the surface. A pressurized fluid is provided against the second skin member to urge the preform against the contour surface. A pressurized fluid is also injected in the first chamber to support the cellular core member. The preform is heated to a bonding temperature before or after being disposed against the contour surface so that the core and skin members are bonded to form the structural assembly.

Abstract: The present invention is a cooling block that forms an electrode for generating a plasma for use in a plasma process, and includes a channel for a cooling liquid, the cooling block comprising: a first base material and a second base material respectively made of aluminum, at least one of the first and second base materials having a recess for forming a channel for a cooling liquid; and a diffusion bonding layer, in which zinc is diffused in aluminum, and an anti-corrosion layer of a zinc oxide film, the layers being formed by interposing zinc between the first and second base materials, and by bonding the first and second base materials with zinc interposed therebetween in a heating atmosphere containing oxygen.

Abstract: A method for making a component including fluid flow channels formed by making a plurality of grooves (12), in at least one face (21) of a base plate (10); having opposite ends so that the grooves have open top sides; scalably blocking the open top side of each groove and diffusion-welding a lid by hot isostatic compression onto the face (21) of the base plate (10) to cover each of the strips leaving open the fluid flow channels at one or both opposite ends of the base plate for allowing pressurized gas to penetrate into the flow channels.

Abstract: According to a metal joining method of the present invention, first and second dissimilar metals are joined together by interposing between the first and second metal materials a third metal material dissimilar to the first and second metal materials and causing eutectic melting at least either at an interface between the first and third metal materials or at an interface between the second and third metal materials.

Abstract: A method of superplastic forming of titanium packs and an associated assembly is provided. The titanium packs can include sheets having different granular structures so that the different sheets are adapted to superplastically form at different temperatures. One or more of the sheets can be formed at a temperature that is below the superplastic forming temperature of another sheet in the pack. In some cases, the occurrence of markoff can be reduced or eliminated.

Abstract: A method of making a large Mo billet or bar for a sputtering target wherein two or more bodies comprising Mo are placed adjacent one another (e.g. stacked one on the other) with Mo powder metal present at gaps or joints between the adjacent bodies. The adjacent bodies are hot isostatically pressed to form a diffusion bond at each of the metal-to-Mo powder layer-to-metal joint between adjacent bodies to form a billet or bar that can be machined or otherwise formed to provide a large sputtering target. The number and dimensions of the Mo bodies placed adjacent one another are selected to yield a desired large size the billet or bar suitable for the sputtering target. The billet or bar for the sputtering target exhibits a microstructure comprising equiaxed grains of less than 30 microns grain size and exhibits a low oxygen content of less than about 100 ppm by weight.

Abstract: A method of forming a part that includes a first component and a second component and which two components are diffusion bonded together. The first component is configured as a pressure component and includes a first bond land surface. The second component is configured as a suction component and includes a second bond land surface. A mandrel is provided that includes a first surface having a contour that mates with at least a portion of the first component and a second surface having a contour that mates with at least a portion of the second component. The first and second components are positioned on the mandrel so that the first bond land surface and the second bond land surface are in mating abutment. The first and second components together with the mandrel are positioned in a die assembly. The die assembly including a first die, a second die and a plurality of fastening members for releasably securing the first die to the second die.

Abstract: A liquid phase diffusion bonding method for a metal machine part superior in the quality of the joint and the productivity enabling the bonding time to be shortened, achieving homogenization of the bonding structure and improving the tensile strength, fatigue strength, and joint quality and reliability. This liquid phase diffusion bonding method of a metal machine part is characterized interposing an amorphous alloy foil for liquid phase diffusion bonding at bevel faces of metal materials, performing primary bonding by melt bonding said amorphous alloy foil and said metal material by resistance welding to form a joint, then performing secondary bonding by liquid phase diffusion bonding by reheating said joint to at least the melting point of said amorphous alloy foil, then holding it there to complete the solidification process of said joint.

Abstract: The present invention relates to a method of diffusion bonding of steel and steel alloys, to fabricate a fluid delivery system of the kind which would be useful in semiconductor processing and in other applications which require high purity fluid handling.

Abstract: An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber is disclosed. The component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between the current position of the component and the current position of the substrate, for placing and pressing the component on the substrate. The combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of the lower side of the component to be connected and the pressing direction of the component, the angle corresponding to the angle between the normal of the substrate surface area to be connected and the pressing direction of the component.

Abstract: A composite steel plate includes at least two steel sheets rolled to form a plate. One of the sheets has a composition that varies in a depthwise direction, between nanocrystalline and micron grained. The plate is made by treating a steel sheet to produce a composition in the sheet that varies in a depthwise direction of the sheet between nanocrystalline and micron grained, stacking the treated sheet with at least one other steel sheets and rolling the stacked sheets to form the plate.

Abstract: There is provided a method for fabricating a dual alloy structure that may in turn be machined to fabricate a rotary component for use in a gas turbine engine. The method provides a powder metal (PM) nickel based superalloy and a nickel aluminide intermetallic based alloy. The powder metal (PM) nickel based superalloy displays characteristics, such as improved strength, low cycle fatigue resistance, fracture toughness, and crack growth resistance. The nickel aluminide intermetallic based alloy displays characteristics, such as high temperature creep and oxidation resistance, suitable for use in the outer radial area of an impeller. A bore sub-element is fabricated from the powder metal (PM) nickel based superalloy. A body sub-element is fabricated from the nickel aluminide intermetallic based alloy. The bore sub-element and body sub-element are joined by inertia welding or diffusion bonding at a common mating surface.

Abstract: A method of forming a structure by a material additive process, the method comprising the steps: providing a substrate having a surface, providing an interlayer on the surface which conforms to the surface of the substrate, forming a melt pool in the interlayer, the depth of the melt pool being less than the depth of the interlayer, selectively depositing a material within the melt pool, allowing the material to solidify, and applying heat and pressure to diffusion bond the material to the substrate.

Abstract: A manufacturing method for manufacturing an electronic device includes a first electronic component and a second electronic component; and a bond part for the first electronic component joined to another bond part for the second electronic component. In a first process of this manufacturing method, the metallic bond part for the first electronic component is placed directly against the metallic bond part for the second electronic component, pressure is applied to the first electronic component and the second electronic component and, after metallically joining the above two bond parts, the pressure applied to the first electronic component and the second electronic component is released. In a second process in the manufacturing method, a clamping member affixes the relative positions of the joined first electronic component and second electronic component, and heats the first electronic component and the second electronic component to maintain a specified temperature.

Abstract: A method and apparatus for producing a metal core sandwich structure that is lightweight and many times stiffer than regular sheet metal, and which is easily formable into curved structures as well as structures having compound curves. In one embodiment, a formed metal core includes a plurality of cells comprising alternating front and rear projections extending outwardly in front of and behind a median plane, with each projection having a bonding surface area or land configured to be brazed or bonded with corresponding external metal sheets on both sides of the formed metal core. A plurality of micro-abrasions or indentations are formed on the bonding lands, allowing stronger brazing or bonding joints to be formed between the metal core and the external metal sheets by facilitating improved capillary action by the metal core during the brazing or bonding process.

Abstract: A method and apparatus for producing a sandwich structure that is lightweight and many times stiffer than regular sheet metal, and which is easily formable into curved structures as well as structures having compound curves. In one embodiment, a formed core includes a plurality of cells comprising alternating front and rear projections extending outwardly in front of and behind a median plane, with each projection having a bonding surface area or land configured to be bonded with corresponding external sheets on both sides of the formed core. A plurality of micro-abrasions or indentations are formed on the bonding lands, allowing stronger bonding joints to be formed between the core and the external sheets by facilitating improved capillary action by the core during the bonding process.

Abstract: The invention relates to a gas distributor (1, 2) for a CVD reactor comprising two or more chambers (8, 9, 14), with supply lines ending therein, wherein at least one of the chambers (8, 9) forms a gas volume and is connected to gas outlet openings (23) associated with the bottom (2) of the gas distributor (1, 2) by means of a plurality of small tubes (11, 12, 13) crossing at least one other chamber (9, 14). For simplified production and technical enhancement, the gas distributor (1, 2), at least in the region of the small tubes (11, 12, 13), is made of a plurality of structured disks resting on top of each other, which are diffusion-welded to each other by pressure and temperature.

Abstract: A method of creating an electrical contact involves locating a barrier material at a location for an electrical connection, providing an electrically conductive bonding metal on the barrier material, the electrically conductive bonding metal having a diffusive mobile component, the volume of barrier material and volume of diffusive mobile component being selected such that the barrier material volume is at least 20% of the volume of the combination of the barrier material volume and diffusive mobile component volume. An electrical connection has an electrically conductive bonding metal between two contacts, a barrier material to at least one side of the electrically conductive bonding metal, and an alloy, located at an interface between the barrier material and the electrically conductive bonding metal. The alloy includes at least some of the barrier material, at least some of the bonding metal, and a mobile material.

Abstract: In order to create titanium components with a titanium composite insert, a method is provided whereby an initial pre form 1 has a groove 2 formed in it. An encapsulating member 4 is then provided about the groove 2 in order to create a cavity 5 which is filled with titanium alloy powder 6. This titanium alloy powder 6 is densified and then accurately machined in order to create a groove insert form 7 which can accommodate a titanium composite material pre form insert 8 and further titanium alloy powder 9 such that through a high temperature isostatic pressing (HIP) process, the insert 8 is embedded. The original component form 1 can then be machined in order to create the final component elements such as aerofoils 13.

Abstract: A flip-chip block structure with block bumps comprises a die, a substrate, a first block bump, and a second block bump. The die comprises an active side and a backside, a first die pad and a second die pad are disposed on the active surface, and an electrode layer is disposed on the backside. The first die pad and the second die pad are connected to the pattern side of the substrate via the first block bump and the second block bump respectively. Besides, the first block bump and the second block bump are formed by a wedge bonding method, therefore, the block bumps are more easily formed into larger sizes, which enhance electrical performance and thermal dissipation performance of the flip-chip structure due to a lower contact resistance and a larger contact area between the die and the substrate.

Abstract: Fabrication techniques for and examples of metallic composite materials with high toughness, high strength, and lightweight for various structural, armor, and structural-armor applications. For example, various advanced materials based on metallic-intermetallic laminate (MIL) composite materials are described, including materials with passive damping features and built-in sensors.

Abstract: A target and backing plate assembly and method of making the same. The target and backing plate assembly provides a mechanical interlock between the target and backing plate in addition to diffusion bonding between dissimilar materials comprising the target and backing plate. An interlayer may also be used between the target and backing plate. A plurality of ridges, or other salient surface features on one of the target and backing plate are joined to corresponding members or channels on the other of the target and backing plate. The dissimilar materials of the target and backing plate fill negative angled cavities formed by the plurality of ridges and corresponding channels or members of the target and backing plate to accommodate the diffusion bonded dissimilar materials. A target and backing plate assembly with increased strength results.

Abstract: A method for producing permanent integral connections of oxide-dispersed metallic materials by welding. The materials or components to be connected are overlapped to form an overlapping region in a joining region of the overlapping region. The materials or components are heated below the melting temperatures of the materials and are welded to at least partially form a diffusion bond by a welding method. A noble metal foil may be between the components to be connected. The diffusion bond is heated subsequently to a temperature below the melting temperature of the materials or components and the bond is mechanically recompacted by hammering.

Abstract: A method and apparatus for producing a metal core sandwich structure that is lightweight and many times stiffer than regular sheet metal, and which is easily formable into curved structures as well as structures having compound curves. In one embodiment, a formed metal core includes a plurality of cells comprising alternating front and rear projections extending outwardly in front of and behind a median plane, with each projection having a bonding surface area or land configured to be bonded with corresponding external metal sheets on both sides of the formed metal core. A plurality of micro-abrasions or indentations are formed on the bonding lands, allowing stronger bonding joints to be formed between the metal core and the external metal sheets by facilitating improved capillary action by the metal core during the bonding process.

Abstract: A process for manufacturing reinforcing parts (14) for leading edges (10) and/or trailing edges (12) of fan blades (1) is described. In particular, this invention relates to the use of the SPF/DB (<<Super Plastic Forming/Diffusion Bonding >>) process for this type of non-hollow part.

Abstract: This invention relates to a method of brazing while the thickness of the opening between materials being brazed can not be maintained constant or can not be adjusted in the appropriate range. In order to solve this issue the porous material of metals or metal alloys consisting of Ni, Cu, Ti, Al, Ag or W should be utilized. The metallic porous material is inserted into the brazing opening mentioned above by using the softness of it, and is made to hold the brazing solder and to reinforce the bonding part after brazing.

Abstract: A method for bonding two components together including the steps of providing a first component, providing a second component, and locating a first eutectic bonding material between the first and second component. The first eutectic bonding material includes at least one of germanium, tin, or silicon. The method further includes the step of locating a second eutectic bonding material between the first and second component and adjacent to the first eutectic bonding material. The second eutectic bonding material includes gold. The method further includes the step of heating the first and second eutectic bonding materials to a temperature above a eutectic temperature of an alloy of the first and second eutectic bonding materials to allow a hypoeutectic alloy to form out of the first and second eutectic bonding materials. The method includes the further step of cooling the hypoeutectic alloy to form a solid solution alloy bonding the first and second components together.

Abstract: A method for manufacturing a plumbing fixture by thixotropic welding.

Abstract: Recent semiconductor device becomes high powered, and on the material of heat sinks on which these devices are mounted, lower thermal expansion coefficient and higher thermal conductivity are needed. For this requirement, material with thermal conductivity as high as Cu alone and also with low thermal expansion coefficient, is needed. An aspect in accordance with the present invention provides, a cladding material in which 1st material layer and 2nd material layer are laminated alternately, wherein thermal expansion coefficient of said 2nd material is lower than the thermal expansion coefficient of said 1st material, and thermal conductivity of said 2nd material is lower than the thermal conductivity of said 1st material, and a total number of laminated layers composed of said 1st material and said 2nd material is 5 or more.

Abstract: A filter is formed by a sintered non-woven metal fiber cloth adapted to be installed in a liquid passage, and, in the filter, a substance sticking to the surface of metal fibers which is present in the outermost part of the filter and in the vicinity thereof is removed together with the surface layer of the metal fibers.

Abstract: A method of manufacturing a structural part through diffusion bonding in solid state without secondary materials after stacking multi-sheet metal and a tool thereof are disclosed. The tool for diffusion boding of multi-sheet metal includes a top tool having a top gas inlet, a central tool coupled to the top tool for installing the multi-sheet metal inside the central tool, a bottom tool coupled to the central tool for supporting the multi-sheet metal and having a bottom gas inlet and a vacuum path for making a vacuum state or an inert gas environment, and a sealing plate interposed between the top tool and the central tool.

Abstract: The invention relates to a method of producing electrical connections for an electrical energy storage unit (10), said unit employing at least one electrical energy storage element (70) placed inside a casing (20?), said casing having at least one cover (30, 40) containing the electrical energy storage element (70) in a main body (20) of the casing, said element (70) and said cover (30, 40) each having a current collector means, which method is characterized in that it includes at least one step of depositing gallium on one or other of the current collector means and a step of assembling two current collector means separated by the gallium coating followed by a diffusion brazing step carried out by the disposition and the pressing of a mass heated to a given temperature on the unit formed by two current collector means, the unit being brazed for a given time in order to produce the electrical connection for the electrical energy storage unit.

Abstract: A method of manufacturing a stave cooler for a metallurgical furnace including supplying a metal plate having an inward side for facing the inside of the furnace and an opposite outward side; supplying at least one coolant pipe; establishing a thermo-conductive contact between the coolant pipe and the metal plate; providing the coolant pipe with a flattened face and externally fixing the flattened face to the metal plate on the outward side for establishing the thermo-conductive contact.

Abstract: Hydrogen-producing fuel processing systems, hydrogen purification membranes, hydrogen purification devices, and fuel processing and fuel cell systems that include hydrogen purification devices. In some embodiments, the fuel processing systems and the hydrogen purification membranes include a metal membrane, which is at least substantially comprised of palladium or a palladium alloy. In some embodiments, the membrane contains trace amounts of carbon, silicon, and/or oxygen. In some embodiments, the membranes form part of a hydrogen purification device that includes an enclosure containing a separation assembly, which is adapted to receive a mixed gas stream containing hydrogen gas and to produce a stream that contains pure or at least substantially pure hydrogen gas therefrom. In some embodiments, the membrane(s) and/or purification device forms a portion of a fuel processor, and in some embodiments, the membrane(s) and/or purification device forms a portion of a fuel processing or fuel cell system.

Abstract: An object is to provide an electronic components mounting adhesive capable of lowering the probability of occurrence of short-circuiting and increasing the reliability of the joining of electrodes in an electronic components mounted structure obtained by bonding electronic components to each other, as well as a manufacturing method of such an electronic components mounting adhesive, a resulting electronic component mounted structure, and a manufacturing method of such an electronic component mounted structure. In an electronic components mounted structure 10, a first circuit board 11 and a second circuit board 13 are bonded to each other with an electronic components mounting adhesive 20. The electronic components mounting adhesive 20 is such that solder particles 22 are dispersed in a thermosetting resin 21. The solder particles 22 are subjected to heating treatment in an oxygen-containing atmosphere before being dispersed in the thermosetting resin 21.