Diffusion Type Patents (Class 228/193)
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Publication number: 20090159647Abstract: A method for bonding two glassy metal pieces, includes: (a) disposing the glassy metal pieces in an environment such that the surrounding of the glassy metal pieces is heated to a working temperature within a common supercooled liquid region of the glassy metal pieces; and (b) pressing one of the glassy metal pieces against the other of the glassy metal pieces under an elevated pressure while maintaining the working temperature for a suitable period of time so as to subject the glassy metal pieces to undergo solid state diffusion at an interface therebetween.Type: ApplicationFiled: May 8, 2008Publication date: June 25, 2009Inventors: Shing-Hoa Wang, Pei-Hung Kuo, Peter K. Liaw, Guo-Jiang Fan, Hsiao-Tsung Tsang, Dongchun Qiao, Feng Jiang
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Publication number: 20090137082Abstract: A manufacturing method for manufacturing an electronic device includes a first electronic component and a second electronic component; and a bond part for the first electronic component joined to another bond part for the second electronic component. In a first process of this manufacturing method, the metallic bond part for the first electronic component is placed directly against the metallic bond part for the second electronic component, pressure is applied to the first electronic component and the second electronic component and, after metallically joining the above two bond parts, the pressure applied to the first electronic component and the second electronic component is released. In a second process in the manufacturing method, a clamping member affixes the relative positions of the joined first electronic component and second electronic component, and heats the first electronic component and the second electronic component to maintain a specified temperature.Type: ApplicationFiled: November 18, 2008Publication date: May 28, 2009Applicant: NEC Electronics CorporationInventor: Yoichiro Kurita
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Patent number: 7537151Abstract: A method of heat sink manufacture in which the crests of a conductive fin are nested down into close fitting grooves in a flat, conductive base plate, with small interface gaps G. A compressive material is set inside the fin crests and the grooves, viscous enough to not intrude into the gaps G, to a level sufficient to substantially fill the grooves. The work piece thus created is subjected to a cold hydrostatic oil bath, crushing the outer surfaces of the fin crests into the internal surfaces of the grooves where the compressed seal covers, while the rest of the fin is supported against net deformation by the surrounding oil.Type: GrantFiled: January 11, 2005Date of Patent: May 26, 2009Assignee: Delphi Technologies, Inc.Inventors: Mohinder Singh Bhatti, Patrick Mitchell Griffin
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Patent number: 7533794Abstract: A method for superplastically forming and/or diffusion bonding a structural member and an associated structural member are provided. The structural member is formed at least partially of titanium, e.g., Ti-6A1-4V, and has a fine grain structure. For example, the grain size of the material of the structural member can be less than 2 micron. The member can be superplastically formed and/or diffusion bonded at a reduced temperature, thereby potentially reducing the thermal energy required for forming and bonding, and also reducing the effects of heating on the structural member and the forming apparatus. In addition, the structural member can be formed at an increased strain rate.Type: GrantFiled: March 31, 2004Date of Patent: May 19, 2009Assignee: The Boring CompanyInventors: Peter N. Comley, Larry D. Hefti
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Publication number: 20090105843Abstract: A method for metallurigically bonding a metal wire mesh to a metal substrate which allows the use of a fragile open weave mesh and/or a thin wall substrate. A thin nickel based layer is placed between a titanium based substrate and a titanium based wire mesh. The mesh and substrate are lightly clamped in intimate contact against the nickel interlayer therebetween, e.g., by wire wrapping. The sandwich, or assembly, (i.e., substrate, interlayer, mesh) is then heated to a temperature, below the melting point of titanium and nickel but sufficient to form a eutectic titanium-nickel alloy (e.g. , Ti2Ni).Type: ApplicationFiled: August 11, 2006Publication date: April 23, 2009Inventor: Kate E. Purnell
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Publication number: 20090098310Abstract: A method for bonding a porous tantalum structure to a substrate is provided. The method comprises providing a substrate comprising cobalt or a cobalt-chromium alloy; an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and a porous tantalum structure. Heat and pressure are applied to the substrate, the interlayer, and the porous tantalum structure to achieve solid-state diffusion between the substrate and the interlayer and between the interlayer and the porous tantalum structure.Type: ApplicationFiled: October 10, 2007Publication date: April 16, 2009Applicant: ZIMMER, INC.Inventors: Gregory M. Hippensteel, Lawrence F. Peek, Jeffrey P. Anderson, Devendra Gorhe, Steve M. Allen
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Publication number: 20090087681Abstract: An impact resistant composite member is for at least one of armor plate and an impact resistant structure. The member comprises a body in plate form and a reinforcement structure located within the body. The body includes a metal alloy having a fine grain size of about 5 microns or less.Type: ApplicationFiled: June 13, 2008Publication date: April 2, 2009Inventors: Raymond F. Decker, Sanjay Kulkarni, Joseph R. Pickens
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Patent number: 7506793Abstract: A process for repairing a turbine component of a turbomachine, as well as a sintered preform used in the process and a high gamma-prime nickel-base superalloy component repaired thereby. The sintered preform contains a sintered mixture of powders of a cobalt-base braze alloy and a cobalt-base wear-resistant alloy. The braze alloy constitutes at least about 10 up to about 35 weight percent of the sintered preform and contains a melting point depressant such as boron. The preform is formed by mixing powders of the braze and wear-resistant alloys to form a powder mixture, and then sintering the powder mixture. To use the preform, a surface portion of the turbine component is removed to expose a subsurface portion, followed by diffusion bonding of the preform to the subsurface portion to form a wear-resistant repair material containing the braze alloy dispersed in a matrix of the wear-resistant alloy.Type: GrantFiled: October 4, 2007Date of Patent: March 24, 2009Assignee: General Electric CompanyInventor: Sujith Sathian
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Publication number: 20090072010Abstract: A method of manufacturing an article by diffusion bonding, the method comprising the steps of assembling first and second component parts having a joint therebetween; sealing the joint against infiltration by solid particulate material, without causing phase change of the component parts; and applying heat and isostatic pressure via a solid particulate material to form a consolidated joint by diffusion bonding.Type: ApplicationFiled: August 25, 2008Publication date: March 19, 2009Applicant: ROLLS-ROYCE PLCInventors: Wayne Eric Voice, Junfa Mei
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Patent number: 7487900Abstract: Apparatus for diffusion bonding, brazing, or joining between respective surfaces of two parts, e.g., the exterior wall of a first annular cylinder and the interior wall of a concentric second annular cylinder, includes a cylindrical body having a circumferential cavity positioned between upper and lower ends thereof. A flexible annular membrane is disposed concentrically over the cavity, and respective upper and lower ends of the membrane are each sealingly hinged to the body. The body is assembled coaxially within the first cylinder, and the assembly then inserted coaxially into the second cylinder to the desired axial bonding position. The cavity is pressurized, causing the membrane, and responsively, the first cylinder, to expand radially within the second cylinder. The temperature of the parts is then raised and maintained for a selected period of time to bond the respective walls of the two cylinders to each other.Type: GrantFiled: August 22, 2005Date of Patent: February 10, 2009Assignee: The Boeing CompanyInventors: Gregory F. Kayser, Daniel L. Wisner, John G. Somerville, Jonathan H. Ferrin
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Patent number: 7484651Abstract: Accordingly, the present invention provides a method for joining metallic members, which can be used to join component sub-assemblies. Further, the present invention provides a method for repairing a component by replacing a damaged portion and re-inserting a replacement section. In general, the present invention provides in one embodiment a method for joining metallic members comprising: preparing a surface of a first metallic member, thereby providing an oxide-free surface; preparing a surface of a second metallic member, thereby providing an oxide-free surface; applying pressure to the first and second metallic members, thereby forcing the surface of the first metallic member and the surface of the second metallic member together and forming a joint area; sealing an outer edge of the joint area; and subjecting the members to a hot isostatic process operation.Type: GrantFiled: October 22, 2004Date of Patent: February 3, 2009Assignee: Electric Power Research Institute, Inc.Inventors: David Wayne Gandy, Gregory J. Frederick, Andrew McGehee, Artie Gene Peterson, Jr.
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Patent number: 7467741Abstract: A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method includes bonding a sputtering target to a backing plate at a low temperature. Also described is a method of forming a sputtering target assembly such that a gap is formed between the sputtering target and the backing plate. Also described is a method of forming a sputtering target assembly providing a mechanism to prevent unintended sputtering into the backing plate.Type: GrantFiled: October 21, 2003Date of Patent: December 23, 2008Assignee: Cabot CorporationInventors: Charles E. Wickersham, Jr., David P. Workman
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Publication number: 20080305013Abstract: A method of making a test device comprised of a container divided into two chambers, each holding a volume of a clear test liquid, the chambers separated by a porous barrier. The liquid is introduced into the lower chamber by adding a liquid to the upper chamber through the open top of the container and then applying a vacuum to completely evacuate air from the lower chamber by drawing the air through the barrier and liquid in the upper chamber. Restoring air pressure forces liquid in the upper chamber into the lower chamber, to completely fill the same while leaving a volume of liquid in the upper chamber. The application of a vacuum is preferably carried out by placing the container with liquid in a receptacle containing a liquid to be boiled, heating the liquid to boil the same and thereafter condensing the vapor with the receptacle sealed to develop a very high vacuum which draws the air out from the lower chamber of the container.Type: ApplicationFiled: June 5, 2007Publication date: December 11, 2008Inventor: Gideon Eden
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Publication number: 20080296354Abstract: The present invention relates to stainless steel sheets which would be useful in semiconductor processing and in other applications which require high purity fluid handling. The invention also relates to a method of selecting and processing such sheets.Type: ApplicationFiled: May 31, 2007Publication date: December 4, 2008Inventors: MARK CROCKETT, John W. Lane, Vincent Kirchhoff, Marcel E. Josephson, Hong P. Gao, Bhaswan Manjunath
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Publication number: 20080290968Abstract: A boundary acoustic wave device includes a first medium, a second medium, and an IDT electrode disposed at an interface between the first medium and the second medium, the IDT electrode having an Au layer defining a main electrode layer, wherein a Ni layer is laminated so as to contact at least one surface of the Au layer, and a portion of Ni defining the Ni layer is diffused from the Ni layer side surface of the Au layer toward the inside of the Au layer.Type: ApplicationFiled: August 13, 2008Publication date: November 27, 2008Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Daisuke YAMAMOTO, Hajime KANDO, Akihiro TERAMOTO, Toshiyuki FUYUTSUME, Masahiko SAEKI
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Publication number: 20080292899Abstract: A titanium alloy composite material including dispersed carbon fibers coated with a layer containing an element which forms a carbide in reaction with carbon, and the carbide formed thereby, in crystal grains of the titanium alloy. The element which forms a carbide in reaction with carbon is preferably at least one of silicon (Si), chromium (Cr), titanium (Ti), vanadium (V), tantalum (Ta), molybdenum (Mo), zirconium (Zr), boron (B), and calcium (Ca). The carbon fibers are preferably carbon nanotubes, vapor-grown carbon fibers, or a mixture thereof. The titanium alloy composite material has excellent mechanical strength, such as tensile strength, Young's modulus, toughness, and hardness.Type: ApplicationFiled: August 22, 2006Publication date: November 27, 2008Applicants: E&F CORPORATION, NAGANO PREFECTUREInventors: Toshio Tanimoto, Hidekazu Takizawa
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Patent number: 7441691Abstract: A method for producing parts including at least one internal cavity. In the method at least two metal sheets are diffusion bonded; then the bonded metal sheets are bent; and then each of internal cavities is inflated by superplastic forming. The method is carried out by a mold allowing at least one first part to be diffusion bonded and then bent while inflating at least one second part by superplastic forming during a single operation, whereby the mold is heated. The method can be applied, e.g., to the field of aeronautics.Type: GrantFiled: January 10, 2003Date of Patent: October 28, 2008Assignees: SNECMA, Hurel HispanoInventors: Jean-Michel Patrick Maurice Franchet, Gilles Charles Casimir Klein, Olivier Daniel Lamy, Edmond Paul Szkolnik
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Patent number: 7438523Abstract: A blade for a turbine engine is described, having a base body, made from a titanium alloy, with a first and a second component piece, which are connected in the connection region by means of a bonding process. A groove with a groove wall runs through the connection region, to prevent local concentration of tension, such that the above borders directly on the second component piece and forms therewith a connection angle greater than 70 degrees.Type: GrantFiled: July 24, 2002Date of Patent: October 21, 2008Assignee: Siemens AktiengesellschaftInventors: Ursula Pickert, Iris Oltmanns, legal representative, Peter Tiemann, incapacitated
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Publication number: 20080245846Abstract: A method of creating an electrical connection involves providing a pair of contacts each on one of two different chips, the pair of contacts defining a volume therebetween, the volume containing at least two compositions each having melting points, the compositions having been selected such that heating to a first temperature will cause a change in at least one of the at least two compositions such that the change will result in a new composition having a new composition melting point of a second temperature, greater than the first temperature and the melting point of at least a first of the at least two compositions, and heating the pair of contacts and the at least two compositions to the first temperature.Type: ApplicationFiled: April 5, 2007Publication date: October 9, 2008Inventor: John Trezza
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Patent number: 7431197Abstract: A method of fabricating a hollow mechanical part includes a step of depositing an anti-diffusion substance in a predefined pattern on at least one face of primary parts to be assembled together. The depositing step is performed by applying a layer of anti-diffusion substance including a powder over a surface of the face of the primary parts; and by localized sintering of the anti-diffusion substance in the predefined pattern by the heating that results from localized application of a laser beam along a track.Type: GrantFiled: March 31, 2004Date of Patent: October 7, 2008Assignee: SNECMAInventors: Jean-Michel Franchet, Gilles Klein, Patrick Gesmier
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Publication number: 20080230590Abstract: A method for producing a bonded body of different materials of the present invention is a method for producing a bonded body of different materials (1), where two plate members (2 and 3) are bonded to each other, the method including: laminating two plate members (2 and 3) consisting of different materials to obtain a plate-member-laminated-body (4), and heating the plate-member-laminated-body (4). The method includes a step of heating the plate-member-laminated-body (4) while it is sandwiched between a pair of pressing dies (5). The pressing die (5) is made of a material having a heat transfer coefficient 1.5 times or more higher than that of at least one of the plate members (2 and 3) constituting the plate-member-laminated-body (4) and has a tapered part (6) between holding surface (15) which hold the plate-member-laminated-body (4) and a fixing end (16) for securing the pressing die (5). The outer diameter of the tapered part is reduced from the holding surface (15) toward the fixing end (16).Type: ApplicationFiled: April 17, 2008Publication date: September 25, 2008Applicant: NGK INSULATORS, LTD.Inventors: Hironori Takahashi, Masayuki Hironaga
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Publication number: 20080230589Abstract: An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber is disclosed. The component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between the current position of the component and the current position of the substrate, for placing and pressing the component on the substrate. The combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of the lower side of the component to be connected and the pressing direction of the component, the angle corresponding to the angle between the normal of the substrate surface area to be connected and the pressing direction of the component.Type: ApplicationFiled: March 19, 2007Publication date: September 25, 2008Inventors: Karsten Guth, Alfred Kemper, Roland Speckels
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Patent number: 7424967Abstract: An embodiment provides a method of constructing a cellular structure having nodes therein comprising: providing at least one truss layer comprised of at least one truss unit, at least one of the truss units being comprised of truss members; providing at least one panel in mechanical communication with the at least one truss unit of the at least one truss layer, the mechanical communication defines contact regions wherein the at least one truss unit is coupled to the at least one panel; the nodes being defined as intersections existing among any of the truss members and the nodes also being defined by the contact regions; providing at least one node pin, the at least one node pin spanning between two desired the nodes; and diffusion bonding at least one of the truss layer to the at least one panel.Type: GrantFiled: September 3, 2003Date of Patent: September 16, 2008Assignee: University of Virginia Patent FoundationInventors: Kenneth D. Ervin, Haydn N. G. Wadley
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Publication number: 20080217385Abstract: A method of manufacturing a structural part through diffusion bonding in solid state without secondary materials after stacking multi-sheet metal and a tool thereof are disclosed. The tool for diffusion boding of multi-sheet metal includes a top tool having a top gas inlet, a central tool coupled to the top tool for installing the multi-sheet metal inside the central tool, a bottom tool coupled to the central tool for supporting the multi-sheet metal and having a bottom gas inlet and a vacuum path for making a vacuum state or an inert gas environment, and a sealing plate interposed between the top tool and the central tool.Type: ApplicationFiled: July 21, 2006Publication date: September 11, 2008Applicant: KOREA AEROSPACE RESEARCH INSTITUTEInventor: Ho Sung Lee
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Publication number: 20080190994Abstract: The invention relates to a method for forming a highly electroconductive surface on an aluminum piece. A highly conductive layer of silver is formed on the piece by means of a eutectic join. The temperature of the aluminum piece is raised gradually and the oxide layer formed on the surface of the piece is removed. After the first heating stage, the silver piece that is to be attached is transferred to the cleaned surface. The contact point is heated to a temperature where a eutectic bond is generated between the aluminum and silver. During the second heating stage a slight momentary loading is applied to the contact point.Type: ApplicationFiled: April 25, 2006Publication date: August 14, 2008Applicant: OUTOTEC OYJInventors: Veikko Polvi, Karri Osara
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Patent number: 7392927Abstract: A combinatorial process for production of material libraries from a single sample, comprising forming a diffusion multiple in the single sample, wherein the diffusion multiple comprises a plurality of interdiffusion regions at interfacial locations of dissimilar metals, metal oxides, or alloys, and wherein the diffusion multiple comprises at least three layers of the metals, non-metals, metal oxides, or alloys; and evaluating properties of the diffusion multiple as a function of composition at about the interdiffusion regions.Type: GrantFiled: April 17, 2003Date of Patent: July 1, 2008Assignee: General Electric CompanyInventors: Ji-Cheng Zhao, Melvin Robert Jackson
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Publication number: 20080148566Abstract: A method and apparatus for the fabrication and/or repair of an integrally bladed rotor, specifically of an integrally bladed gas turbine rotor, is disclosed. At least one rotor blade is joined to a main rotor body for fabrication and/or repair. The joining is carried out by diffusion welding.Type: ApplicationFiled: February 4, 2006Publication date: June 26, 2008Applicant: MTU Aero Engines GmbHInventors: Erwin Bayer, Ulrich Knott, Karl-Hermann Richter
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Patent number: 7390735Abstract: A method of forming packages containing SiC or other semiconductor devices bonded to other components or conductive surfaces utilizing transient liquid phase (TLP) bonding to create high temperature melting point bonds using in situ formed ternary or quaternary mixtures of conductive metals and the devices created using TLP bonds of ternary or quaternary materials. The compositions meet the conflicting requirements of an interconnect or joint that can be exposed to high temperature, and is thermally and electrically conductive, void and creep resistant, corrosion resistant, and reliable upon temperature and power cycling.Type: GrantFiled: January 7, 2005Date of Patent: June 24, 2008Assignee: Teledyne Licensing, LLCInventor: Vivek Mehrotra
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Publication number: 20080121263Abstract: There are described thermoelectric elements that are manufactured by using a porous matrix or a porous substrate. The matrix consists of an electrically insulating material having sufficient thermal and chemical resistance as well as the lowest possible thermal conductivity, and is provided in predetermined regions with different thermoelectric materials, so that continuous conductors are formed in the matrix. These are electrically connected to one another to form thermocouples, which in turn are electrically interconnected with one another to form the thermoelectric element.Type: ApplicationFiled: November 21, 2007Publication date: May 29, 2008Applicant: EVONIK DEGUSSA GmbHInventors: Rudiger Schutte, Thorsten Schultz, Georg Markowz
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Publication number: 20080116246Abstract: A method for making a component including fluid flow channels. Grooves (12) are made in at least one face (21) of a base plate (10); the grooves (12) are sealably blocked by means of thin strips (16); a lid (22) is diffusion-welded with hot isostatic compression on the face (21) of the base plate (10) with the grooves above the thin strips (16). The grooves include fittings (14) with which the strips (16) may be received. The strips are for example welded by laser welding.Type: ApplicationFiled: December 16, 2005Publication date: May 22, 2008Inventors: Emmanuel Rigal, Guillaume De Dinechin, Philippe Bucci, Philippe Aubert
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Patent number: 7353982Abstract: This invention relates to a method of bonding a metallic membrane with metallic part involving pressing a smooth surface of the metallic membrane against the smooth surface of the metallic part, and heating the metallic membrane and metallic part to a temperature above the half melting point of the metallic membrane while subjecting the metallic membrane and metallic part to a controlled environment of a proper gas atmosphere. The metallic membrane can comprise palladium and the pressurized gas can comprise one of hydrogen, an inert gas or their mixture.Type: GrantFiled: November 25, 2003Date of Patent: April 8, 2008Assignee: Membrane Reactor Technologies Ltd.Inventor: Anwu Li
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Publication number: 20070271784Abstract: Fabricating an IBR, in particular a two-part IBR. A metal container is defined, made up of a plurality of parts that define between them at least one annular cavity, an insert made of composite material is positioned in the or each cavity, the assembly is subjected to hot isostatic compacting, and a rotor disk is machined.Type: ApplicationFiled: May 18, 2007Publication date: November 29, 2007Applicant: SNECMAInventor: Adrien Fabre
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Patent number: 7299967Abstract: The invention relates to an innovative method for manufacturing plate stacks, particularly for manufacturing coolers or cooler elements or heat sinks at least one plate stack, with at least two plate-shaped elements made of metal, for example copper, and provided with passages or openings, wherein the stacked elements are joined with each other using bonding on joining surfaces formed by surface sides of said elements by heating to a process temperature to form the stack.Type: GrantFiled: January 4, 2005Date of Patent: November 27, 2007Assignee: Electrovac AGInventor: Jurgen Schulz-Harder
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Publication number: 20070205253Abstract: A method for connecting at least two metal layers by means of a diffusion soldering process, wherein each of the metal layers that is to be connected is plated with a respective solder layer prior to the diffusion soldering process.Type: ApplicationFiled: March 6, 2006Publication date: September 6, 2007Applicant: Infineon Technologies AGInventor: Holger Hubner
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Patent number: 7255260Abstract: A method for manufacturing an assembly including a stack of at least two primary parts, the primary parts being joined together around their periphery with the exception of a place forming a passage so as to define between the two of them a cavity, and the primary parts having, facing the cavity, at least one face that is covered, in a pattern, with a stop-off product containing a binder that can be thermally degraded, and a sealed reservoir having an open end, the end being joined in a sealed manner to the passage in the stack so as to allow communication between the internal space of the reservoir and the cavity, the reservoir being placed under a partial vacuum, this being produced so as to be non-deformable at the temperature and at the pressure at which the diffusion bonding of the said stack takes place.Type: GrantFiled: March 19, 2004Date of Patent: August 14, 2007Assignee: Snecma MoteursInventors: Jean-Michel Franchet, Patrick Gesmier
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Patent number: 7237709Abstract: Two metal blocks (50, 52) are welded to respective metal sheets (30, 32) to form sealed assemblies. The sealed assemblies are then diffusion bonded together to form two metal preforms (54, 56). The thick ends (36) and (40) of the metal sheets (30, 32) and the metal blocks (50, 52) are hot formed so that a continuation of the plane X of the first surfaces (42, 46) of the metal sheets (30, 32) extends through and across the metal blocks (50, 52). The metal preforms (54, 56) are machined to remove the portion of the metal blocks (50, 52) extending above the first surfaces (42, 46) of the metal sheets (30, 32) respectively. The metal preforms (54, 56) and a metal sheet (58) are assembled into a stack (64). The metal preforms (54, 56) and the metal sheet (58) are diffusion bonded together and then superplastically formed to produce a hollow fan blade (10). The method enables thinner metal workpieces with better microstructure to be used and increases the yield of metal workpieces.Type: GrantFiled: August 9, 2004Date of Patent: July 3, 2007Assignee: Rolls-Royce plcInventor: Peter R Beckford
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Patent number: 7168605Abstract: A medical implant that delivers therapeutic via microtubes and a method of making the same is provided. In one embodiment a biologically implantable structure adapted to fit within the body of a patient is provided. This structure may have a plurality of individual microtubes in physical communication with its outer surface, the microtubes containing or carrying a therapeutic. In an alternative embodiment a method of manufacturing an implantable medical appliance is provided. This method includes placing a pliant stratum of microtubes onto a biologically implantable medical structure and then applying a therapeutic to the pliant stratum to cover or fill the microtubes.Type: GrantFiled: September 18, 2001Date of Patent: January 30, 2007Assignee: Boston Scientific Scimed, Inc.Inventor: Steven Walak
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Patent number: 7165712Abstract: A joint having bond line grains that nucleate in the joint region and grow into the adjoined solid substrates. The resulting bond line grains have a size that is greater than a thickness of a molten region. The surfaces of the substrates are cold worked to a desired degree of residual stress prior to the bonding process so that the recrystallization of the substrate surface necessary for the grains to grow into the substrates results in a reduction in the local free energy.Type: GrantFiled: October 23, 2003Date of Patent: January 23, 2007Assignee: Siemens Power Generation, Inc.Inventors: Zafir Abdo, Patricia Bezerra, Paul J. Zombo
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Patent number: 7163121Abstract: A bond joint and process of bonding metal parts to one another to form seamless, hollow metal articles, particularly made from beryllium. Tooling is assembled to the parts, prior to hot pressing, to cause pressure to be applied to flanges that extend peripherally from the parts. The parts, assembled together with the tooling, are then subjected to hot isostatic pressing of the flanges at a temperature of about 1700° F. to 1750° F., and at a pressure of about 2000 psi to 2500 psi, for around 3 hours. The tooling surrounding the metal parts functions to limit the amount of compression of the flanges. Articles formed by this process are particularly useful in space flight applications because they are formed of a homogeneous material. This means that the articles can operate under high pressure despite being subjected to temperature cycling. Strength of the bond joint is enhanced because no filler metal is used.Type: GrantFiled: November 5, 1999Date of Patent: January 16, 2007Assignee: Swales & Associates, Inc.Inventors: Charles J. Stouffer, David C. Bugby
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Patent number: 7152321Abstract: A gas generator housing part is produced of a thin-walled tube having a wall thickness which amounts to a maximum of 10% of a tube external diameter and a minimum tensile strength which amounts to at least approximately 800 N/mm2, and a connecting piece having an external diameter which amounts to between 15% and 40% of the tube external diameter. After aligning the connecting piece radially to the tube such that an end face of the connecting piece faces an outer face of the tube, the tube and the connecting piece are joined by friction welding. A maximum welding time amounts to less than 1 second, preferably less than 0.3 second and a friction depth amounts to less than 80% of the wall thickness of the tube.Type: GrantFiled: August 27, 2003Date of Patent: December 26, 2006Assignee: TRW Airbag Systems GmbHInventors: Sebastian Bierwirth, Karsten Schwuchow, Achim Hofmann, Thomas Kapfelsperger
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Patent number: 7114232Abstract: A collimator obtained by the alternate stacking of metal sheets 1 (40 ?m thick) having holes 4 with a width of 2200 ?m in the center thereof, and metal sheets 2 (10 ?m thick) devoid of holes (the metal sheets 1 with the holes 4 are shown in the state in which they exist before being cut in the manner described below, the metal sheets 1 in the upper portion of the figure and the metal sheets in the bottom portion are not connected with each other in the finished product). The opposite sides are held by metal pressing sheets 3 that are 2 mm thick. These metal sheets and pressing sheets are bonded by means of diffusion bonding based on thermocompression bonding. The portions with the vertical through-holes 4 (40 ?m×2000 ?m) thus become light-transmitting portions, the metal sheets 2 serve as partitions between adjacent holes 4, and light collimated to a width of 40 ?m can ultimately pass through. A compact collimator having high wavelength resolution without wavelength dependence can thus be achieved.Type: GrantFiled: April 26, 2005Date of Patent: October 3, 2006Assignee: Nireco CorporationInventors: Takeo Yamada, Tomoyuki Kobayashi
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Patent number: 7077306Abstract: A ceramic armor is disclosed in several embodiments. In a first embodiment, a metal base plate has a metal frame assembled on it having a central opening into which the ceramic material is placed. A cover plate is placed over the frame to enclose the ceramic material on all sides. In a second embodiment, the frame has an open central area that has two crossing walls that define four sub-chambers. Four pieces of ceramic material are placed in the respective sub-chambers and a covering plate is placed over it. In a further embodiment, the frame has a plurality of cavities mechanically formed in it. A ceramic tile or plate is placed in each cavity and a cover plate is placed over the frame. The metal used to encapsulate the ceramic material may, if desired, comprise a Titanium alloy such as Ti-6Al-4V, and the ceramic material may comprise Silicon Carbide, Boron Carbide, Tungsten Carbide, Titanium Diboride or Aluminum Nitride.Type: GrantFiled: November 26, 2003Date of Patent: July 18, 2006Assignee: Cercom, Inc.Inventors: Richard John Palicka, Daniel Ashkin
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Patent number: 7043819Abstract: A method of forming a metal product. A metal alloy workpiece substrate is provided have pre-process dimensions. The dimensional differences are determined between the pre-process dimensions of the workpiece substrate and desired post-process dimensions of a post-process metal product formed from the workpiece substrate. A build-up thickness is determined of coating material required to obtain the desired post-process dimensions of the post-process metal product. A high-density coating process is performed to coat the workpiece substrate with a coating material to build-up a thickness of coating material effective to obtain desired finished dimensions after performing a sintering heat treatment process and/or a hot isostatic pressing treatment. The sintering heat treatment is performed on the coated workpiece substrate to densify the coating material.Type: GrantFiled: February 17, 2000Date of Patent: May 16, 2006Assignee: Recast Airfoil GroupInventor: James E. Arnold
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Patent number: 7038160Abstract: A method for producing permanent integral connections of oxide-dispersed metallic materials by welding. The materials or components to be connected are overlapped to form an overlapping region in a joining region of the overlapping region. The materials or components are heated below the melting temperatures of the materials and are welded to at least partially form a diffusion bond by a welding method. A noble metal foil may be between the components to be connected. The diffusion bond is heated subsequently to a temperature below the melting temperature of the materials or components and the bond is mechanically recompacted by hammering.Type: GrantFiled: August 18, 2003Date of Patent: May 2, 2006Assignee: Schott GlasInventors: Jorq Witte, Manfred Borens, Franz-Peter Eckes, Stefan Bauer, Helmut Schoppe, Andreas Stolzenberg, Stefan Freidrich Melchior, Robert Ruehl
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Patent number: 7021522Abstract: Mating faces of a microchannel plate (MCP) (50) and a multi-layer ceramic body (80) unit are deposited with a thin film having protuberances (84) using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The metallized MCP (50) and multi-layer ceramic body (80) unit are then aligned and placed in a bonding fixture (F) that provides the necessary force applied to the components to initiate a diffusion bond at a desired elevated temperature. The bonding fixture (F) is then placed in a vacuum heat chamber (V) to accelerate the diffusion bonding process between the MCP (50) and the multi-layer ceramic body unit (80).Type: GrantFiled: January 24, 2005Date of Patent: April 4, 2006Assignee: Litton Systems, Inc.Inventors: Niels F. Jacksen, Michael J. Iosue, Miguel M. Saldana, Jay Scott Tucker
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Patent number: 7018721Abstract: A first conductor having an Au layer formed on the surface is connected with a second conductor at least the surface of which has conductivity through a solder containing Zn. The first conductor is, for example, a terminal pad (11a, 11b, 11c) constituting a part of a wiring pattern on a circuit board (1), and the second conductor is, for example, a terminal (20a, 21a) or a terminal board (22) of an electronic component (20 21). The first conductor is connected with the second conductor through an Au—Zn alloy layer formed through diffusion of Zn from the solder containing Zn into the Au layer of the first conductor.Type: GrantFiled: July 11, 2001Date of Patent: March 28, 2006Assignee: Rohm Co., Ltd.Inventor: Satoshi Nakamura
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Patent number: 6991151Abstract: To reduce the capacitance of an electronic module having an active component (1) bonded to a base (2), thereby enabling its cutoff frequency to be raised, the method provides a plurality of contact pads (P1, P?1, P2, P3, P?3) and a plurality of contact zones (Z1, Z?1, Z2, Z3, Z?3) on the component and on the base respectively. First structures (P1, P?1, Z1, Z?1) are adapted to be bonded together by melting solder. Second structures (P2, Z2) of small surface area are designed to be bonded together by thermal compression delivered by the mutual force of attraction that results between the component and the base due to the solder melting. The invention is particularly applicable to making optoelectronic components used in high data rate optical transmission systems.Type: GrantFiled: November 14, 2003Date of Patent: January 31, 2006Assignee: AlcatelInventor: Louis Giraudet
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Patent number: 6967307Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.Type: GrantFiled: August 29, 2003Date of Patent: November 22, 2005Assignee: Micron Technology, Inc.Inventors: David R. Hembree, Warren M. Farnworth
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Patent number: 6955288Abstract: A layered article having a curved surface made of a supporting metal metallurgically bonded to a supported metal.Type: GrantFiled: September 11, 2003Date of Patent: October 18, 2005Assignees: E. I. du Pont de Nemours and Company, Engelhard-CLALInventors: John James Barnes, Joseph Gerard Biondo, Peter Gideon Gelblum, Richard Delbert Lanam, Charles Joseph Noelke, David Archer Wells
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Patent number: 6938816Abstract: A method is provided for diffusion bonding a first member (20) and a second member (3) to each other. According to this method, a first joint portion (24) of the first member and a second joint portion (34) of the second member are fitted to each other with a predetermined interference. Thereafter, the first and second members are heated under a condition substantially without oxygen, so that the first and second joint portions are diffusion bonded to each other.Type: GrantFiled: June 18, 2003Date of Patent: September 6, 2005Assignee: Asian Kogyo Kabushiki KaishaInventors: Tadayoshi Tominaga, Takio Suzuki