Abstract: A flip-chip block structure with block bumps comprises a die, a substrate, a first block bump, and a second block bump. The die comprises an active side and a backside, a first die pad and a second die pad are disposed on the active surface, and an electrode layer is disposed on the backside. The first die pad and the second die pad are connected to the pattern side of the substrate via the first block bump and the second block bump respectively. Besides, the first block bump and the second block bump are formed by a wedge bonding method, therefore, the block bumps are more easily formed into larger sizes, which enhance electrical performance and thermal dissipation performance of the flip-chip structure due to a lower contact resistance and a larger contact area between the die and the substrate.

Abstract: A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal nano paste on each electrode, a primary bonding mechanism (50) that carries out primary bonding to the electrodes in a non-conductive state by pressing the bump of the semiconductor die (12) against the bump of the circuit board (19), and a secondary bonding mechanism (80) that includes a pressurizing unit that pressurizes the primary bonded bump in bonding direction, and that carries out secondary bonding so that the electrodes become conductive by heating the bump up to a temperature higher than a binder removal temperature of the metal nano paste and a dispersant removal temperature of the metal nano paste, removing the binder and the dispersant, and pressurizing and sintering the metal nanoparticles in the bump.

Abstract: The objective of this invention is to prevent the generation of defects pertaining to placement of solder balls on the terminal placement parts of the electronic part main body. The solder ball 1 has spherical core 2 and coating layer 3 that covers core 2. The coating layer 3 contains a resin. The diameter of core 2 is in the range of 30-500 ?m. The thickness of coating layer 3 is in the range of 5-100 ?m. The coating layer 3 is melted at temperature in a range of 20° C. between 150 to 300° C., and the viscosity of coating layer 3 is in the range of 0.01-50 Pa-s. After solder balls 1 are set on terminal placement parts 13a in the main body of the electronic part, reflow is performed for solder balls 1. As a result, coating layer 3 is melted first, and core 2 descends under its own weight to come into contact with the terminal placement part. Core 2 is then melted, and core 2 and terminal placement part 13a are soldered and joined to each other.

Abstract: A filter is formed by a sintered non-woven metal fiber cloth adapted to be installed in a liquid passage, and, in the filter, a substance sticking to the surface of metal fibers which is present in the outermost part of the filter and in the vicinity thereof is removed together with the surface layer of the metal fibers.

Abstract: The invention relates to a method of producing and joining superalloy balls by means of brazing and to objects produced with such joints. According to the invention, an alloy powder covered with a brazing solder is bonded to a spherical core and subsequently transformed into a continuous alloy layer by means of brazing.

Abstract: Alloys of silver and an alloying element that diffuses to the surface of the high conductivity metal and is oxidizable to form an alloying element oxide such as beryllium are provided along with electronic structures employing the alloys and methods of fabrication.

Abstract: In a case of soldering for mounting a device on a printed circuit board, a printed circuit board to which a device is soldered is heated in a high oxygen concentration atmosphere to form oxide films on surfaces of joints, by which detachment of a device soldered onto the surface of the printed circuit board, positional deviation, and rise from the printed circuit board at the time of reflow of the printed circuit board are prevented.

Abstract: Certain examples disclosed herein are directed to devices that include a substrate and conductor disposed on the substrate. In some examples, each of the conductor and the substrate may include materials that are mutually insoluble in each other. In other examples, the conductor may further comprise a substantially pure metal. In certain examples, the disposed conductor may be configured to pass adhesion tape test ASTM D3359-02. Methods of forming the conductors are also provided.

Abstract: A system may include a solar cell comprising a first electrical contact, an optical element comprising a second electrical contact, and a solder bump in contact with the first electrical contact and the second electrical contact. The solar cell is to generate charge carriers in response to received photons. Some aspects provide fabrication of a solder bump on an electrical contact of a solar cell, placement of the solder bump in contact with an electrical contact of an optical element, and melting of the solder bump to couple the electrical contact of the solar cell to the electrical contact of the optical element.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: The present invention is directed to a process for joining tantalum clad steel structures. The process broadly comprises: a) providing a first tantalum clad section, said first tantalum clad section comprising a tantalum layer over a steel layer, with a bonding layer optionally therebetween, with a portion of said steel layer in an edge region not being covered by said tantalum layer or said bonding layer, b) providing a second tantalum clad section, said second tantalum clad section comprising a tantalum layer over a steel layer, with a bonding layer optionally therebetween, with a portion of said steel layer in an edge region not being covered by said tantalum layer or said bonding layer, c) locating said steel edge regions adjacent each other, d) welding the steel edge regions together, e) cold spraying a tantalum powder onto the welded edge regions and over the tantalum layers adjacent said edge regions thereby joining the tantalum clad steel sections.

Abstract: A nickel-based braze composition is described, containing nickel, palladium, and restricted amounts of boron and silicon. The composition can also contain tantalum, titanium, and zirconium, as well as aluminum, chromium, and cobalt. A method for joining two metal components, using the braze composition, is also described. The braze composition can also be used to fill cracks or other cavities in a component, e.g., a gas turbine part formed from a nickel-based superalloy. Articles of manufacture which contain the braze composition are also described.

Abstract: A bonding device for manufacturing a liquid crystal display device includes a bonding chamber for bonding first and second substrates and an ionizing device for introducing ionized gas or air into the bonding chamber.

Abstract: The present invention provides seam-welded, air hardenable steel tubes, methods of manufacturing seam-welded air hardenable steel tubes, tube mills for practicing such methods and applications for using seam-welded, air hardenable steel tubing of the present invention.

Abstract: A method is provided for forming a metallic overlay having enhanced toughness. The metallic overlay may be a weld, a metallic coating, or similar application. The method includes applying a glass forming metallic alloy to a substrate while the alloy is in a molten or semi-molten state. At the interface of the metallic alloy overlay and the substrate the substrate metal becomes at least partially molten and combines with the alloy to form metallurgical bonds. When the metallic alloy cools it experiences a high relative degree of thermal contraction. The metallurgical bonds between the substrate and the alloy constrain the contraction of the alloy at the interface with the substrate. This results in the inducement of compressive stresses in the metallic alloy overlay. The induced compressive stresses inhibit the formation of cracks in the overlay and/or mitigation of the effects of any cracks in the overlay.

Abstract: A stainless steel slab containing B, wherein a protecting material is joined onto at least two faces across the bloom from each other in a stainless steel bloom containing B of 0.3–2.5 mass %, being integrated into one-piece by forming a weld metal comprising a stainless steel with chemical composition that satisfies the relationship expressed by following formulas (1)–(4), and a method to produce a steel product by rolling said slab. Further, it is preferable to interpose an insert material between above stainless steel bloom and above protecting material in bonding process. 15?Cr eq?30,??(1) 4?Cr eq?Ni eq?17,??(2) Cr eq=Cr+1.5 Si+Mo?5 B,??(3) Ni eq=Ni+30 (C+N)+0.5 Mn??(4) Herein, each symbol of a chemical element designates the content (mass %) of relevant chemical element contained in steel.

Abstract: A method for coating and an associated assembly including such a coating are provided. The assembly includes a workpiece defining a weld portion, such as a friction weld joint and a heat affected zone. A coating is disposed on the weld portion to at least partially cover the weld portion, thereby providing enhanced corrosion resistance to the workpiece.

Abstract: A sealant for a weld joint and an associated weld joint and method are provided. The sealant includes aluminum and germanium and is characterized by a melting temperature that is lower than the melting temperature of the structural member that is joined. The sealant, which is disposed between faying surfaces of the structural members, can fill the spaces between the structural members to prevent the entry of chemicals, moisture, debris, and other substances, thereby reducing the likelihood of corrosion of the joint or structural members at the interface. Further, the sealant can be diffusion bonded to the faying surfaces, for example, by the heat generated during the joining process.

Abstract: The invention includes deposition apparatuses having reaction chambers and particle-trapping features formed along one or more surfaces within the chambers. In particular aspects, the particle-trapping features can comprise a pattern of bent projections forming receptacles, and can comprise microstructures on the bent projections. The invention also includes methods of forming particle-trapping features by initially forming a pattern of projections, bending the projections, and then exposing the projections to particles to form microstructures on the bent projections.

Abstract: To prevent decreases in fatigue strength of a base material by relieving the residual stress of a weld. A method for welding a deposit metal to a base material with reduced residual stress, comprising a step of welding a deposit metal to a base material; and a step of plastically deforming into a recess, an area on the surface of the base material around a peripheral portion of the deposit metal. The invention is also directed to a welded block joint between a wire and a base material, characterized by comprising a deposit metal receiving an end portion of the wire and welded to the base material, wherein an area which is plastically deformed into a recess is formed on the base material surface at a peripheral portion of the deposit metal.

Abstract: A p-type contact (30) is disclosed for flip chip bonding and electrically contacting a p-type group III-nitride layer (28) of a group III-nitride flip chip light emitting diode die (10) with a bonding pad (60). A first palladium layer (42) is disposed on the p-type group III-nitride layer (28). The first palladium layer (42) is diffused through a native oxide of the p-type group III-nitride layer (28) to make electrical contact with the p-type group III-nitride layer (28). A reflective silver layer (44) is disposed on the first palladium layer (42). A second palladium layer (46) is disposed on the silver layer (44). A bonding stack (48) including at least two layers (50, 52, 54) is disposed on the second palladium layer (46). The bonding stack (48) is adapted for flip chip bonding the p-type layer (28) to the bonding pad (60).

Abstract: A tailor welded blank for use in a fluid-forming operation includes a first sheet element having a physical characteristic with a first value and a second sheet element having the physical characteristic with a second value different from the first value. The first and second sheet elements are welded together at at least one weld region to form at least a portion of a tailor welded blank. When the tailor welded blank is processed in a fluid forming process, the first and second values of the physical characteristic result in said first and second sheet elements having approximately equal effective strength values such that said first and second sheet elements deform at an approximately equal rate during the fluid forming process and local thinning and failure initiation is reduced at the at least one weld region and throughout the first and second sheet elements.

Abstract: Methods for the manufacture of assemblies which included brazed components and in which nickel/chromium-based filler metals are used wherein the manufactured assemblies are characterized by low leaching rates of nickel in water and water-based fluids, are disclosed. More specifically, there are disclosed methods for the manufacture of a heat exchanger or other assembly which method includes a brazing step, as well as a post-brazing conditioning step for treating the heat exchanger or other assembly. The manufactured heat exchangers and other assemblies are particularly useful in the handling of materials intended for human consumption such as water, beverages or food as the manufactured heat exchangers or other assemblies are characterized by reduced leaching rates of nickel into fluids passed through the heat exchanger. Brazing compositions useful in such manufactured assemblies are also described.

Abstract: The apparatus for operating on a workpiece includes a die defining first and second apertures and an interior therebetween. The first aperture and the interior of the die are structured to receive the workpiece. The interior of the die can be structured to shape the workpiece into a predetermined configuration. The apparatus includes at least one rotatable pin extending at least partially into the interior of the die. The pin is structured to at least partially stir the workpiece as the workpiece moves through the interior of the die to thereby refine the grain structure of the workpiece.

Abstract: A method of welding age-hardenable aluminum alloys to improve strength properties in the heat affected zone and the weld zone, the method comprising the steps of providing precipitation hardenable aluminum alloy members to be welded and subjecting said members to a first aging step for times and temperatures to generated strengthening precipitates. Thereafter, the aged members are welded to provide a welded assembly having a weld zone. The welded members are subjected to a second aging step to reprecipitate strengthening precipitates dissolved in the weld zone.

Abstract: A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

Abstract: A lower shell for a sealed compressor includes a shape with a plurality of intricate bends. In particular, u-shaped sections are stamped into a plainer sheet of material to form the lower shell. This stamping process can cause brittleness in the lower shell. Thus, after the stamping process, the lower shell is subjected to a heat-treating process to reduce the brittleness. After the heat-treating process a center shell is welded to the lower shell.

Abstract: There is provided a semiconductor device manufacturing method which comprising the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosphere containing a formic acid to heat the solder bumps. Accordingly, the solder bumps can be formed without the use of flux not to generate voids in the solder layer, and also the cleaning required after the solder bumps are formed can be omitted.

Abstract: An improved rework method and rework wiring structure for repairing and reworking multilayer printed circuit boards utilizing ball grid array (BGA) solder pads are described. The repair method includes the steps of locating a solder pad to be rewired, removing the identified pad, installing a repair wire through a via hole in a multilayer printed circuit board, and forming a replacement solder pad on the end of the repair wire and positioning it in place of the removed pad. Once thus installed, the method includes the step of connecting the other end of the repair wire to a corrected circuit interconnection point.

Abstract: A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

Abstract: A method for establishing an electrical connection between a first contact surface and a second contact surface, with a wire-bonding tool being used to provide a contact wire between the contact surfaces by bonding the contact wire to the first contact surface and subsequently leading it to the second contact surface, bonding it to the latter, and subsequently separating it using the wire-bonding tool. After the contact wire has been separated from the second contact surface, the wire-bonding tool is used to provide the contact point with an additional contact securing element via the contact wire.

Abstract: An efficient and effective process for manufacturing of hardened aluminum components is achieved by coordinating the material preparation steps with the forming steps. The resulting product is a hardened aluminum component with desirable strength characteristics. The process includes initial heating of sheet material in order to prepare it for further processing. The sheet material is then quenched to promote appropriate material conditioning. A product forming sub-process is then undertaken in a relatively short period of time following the quenching. The product forming is done while the material is in a relatively ductile condition, thus easing forming operations, and avoiding product spring-back problems. Lastly, the component is naturally aged, to provide the final hardening operations. The resulting product has very desirable strength characteristics, due to the combined forming and hardening process.

Abstract: Interconnection elements for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart a desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element.

Abstract: A semiconductor device comprising a semiconductor substrate on which metal bumps having narrowed base portions are bonded and coated on its top surface with a resin covering the base portions of the metal bumps, improving reliability of the bump bonds. Also, a method of production of a semiconductor device including steps of forming metal bumps in a wafer state, coating a resin for protecting a wiring surface of a semiconductor chip in the wafer state and cutting the semiconductor chip from the wafer, wherein the metal bumps have narrowed base portions and are bonded to the wiring surface of the semiconductor chip and the resin is coated covering the base portions of the metal bumps.

Abstract: A method of interconnecting components (10, 16) of aluminium having a purity of at least 95%, the method comprising brazing the components (10, 16) together and then surface treating the assembled componetns (10, 16) by subjecting them to a Bohmitting procedure.

Abstract: A welding bead 50 is formed along to a jointing potion 40 using friction stir welding on a first frame member 20 and a second frame member 30, each of which is a hollow extruded molded base member made of an aluminum alloy A6N01 material. When a defect exists in this welding bead 50, the welding bead including this defect is moved by a grinding processing and then a mending zone is formed. In this mending zone, a mending bead is formed using TIG welding. The welding rod used in this TIG welding is made of the same material as the base member of the frame member, and so the composition of the welding bead is formed homogeneously. In the friction stir welding portion, a hairline processing is performed, so that a surface having a beautiful appearance, in which a boundary between the frame members and traces of the defect are inconspicuous, can be obtained.

Abstract: Method of forming a two-piece hollow cathode sputter target assembly and the assembly formed thereby. The sputter target assembly includes an outer shell having a substantially cylindrical side wall and is composed of a relatively low purity metallic material. A sputtering insert includes a substantially cylindrical side wall and is concentrically received within, and bonded to, the outer shell. The sputtering insert is composed of a relatively high purity metallic material as used for depositing a thin layer or film onto a desired substrate.

Abstract: A connection component for use in making microelectronic element assemblies, has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.

Abstract: Contact structures formed on an electronic component are useful for connecting the component to other electronic components. A contact tip structure can be formed on a sacrificial substrate, then combined with an interconnection element. A preferred contact structure includes some topography, generally in the form of certain raised features. These are formed by embossing depressed features into the sacrificial substrate upon which the contact tip structure is constructed. The contact tip structure can be optimized for making contact with another electrical component.

Abstract: A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

Abstract: A method of interconnecting components (10, 16) of aluminum having a purity of at least 95%, the method comprising brazing the components (10, 16) together and then surface treating the assembled components (10, 16) by subjecting them to a Bohmitting procedure.

Abstract: The present invention provides a welding method for materials to be welded which are subjected to fluoride passivation treatment, and a fluoride passivation retreatment method, wherein, when fluoride passivation retreatment was conducted after welding, there is no generation of particles or dust, and superior resistance is provided to fluorine system gases.

Abstract: The method for coating the seam of a welded tube of this invention includes applying a mixture of the desired protective metal coating in powdered form and a liquid flux over the internal surface of the welded seam with the welded seam located in a lower portion of the tube, then heating the welded seam to the melting temperature of the protective metal coating, melting the metal coating which flows over the seam forming an adherent metallurgical bond. The preferred apparatus includes a wand which extends between the opposed edges of the open seam tube in the welding apparatus and extends axially through the tube to overlie the welded seam spaced from the welding apparatus. The wand includes three conduits transmitting the powdered protective metal coating, liquid flux and nonoxidizing gas to the applicator which includes a nozzle which atomizes and sprays the liquid flux over the internal surface of the seam and which combines with the powdered protective metal coating to form a paste.

Abstract: A process, termed Trailing Edge Stress Relief (TESR) is described which can be used to produce a weld joint with reduced residual stress level with least defects. In this process, cyclic stresses are applied to the trailing edge of the weld (TEW) during welding. Welding operation is always in quasi-stationary state; but in the TEW microstructure is in formative stages. Therefore TEW is in the Second order Quasi Stationary (SQS) state. During the time solidification of the cup of molten metal takes place, in TESR process cyclic stress is applied that modifies the structure of microstructure. The modification of the structure of microstructure reduces the grain size and the potential energy that is otherwise retained after solidification in it, as residual stress. In the process described pneumatic vibrators are used; but such cyclic stresses can be generated by other devices using electrical, electronic, magnetic or ultrasonic energy; and systems can be designed using combinations thereof.

Abstract: A welding method for materials to be welded which are subjected to fluoride passivation treatment, and a fluoride passivation retreatment method, wherein, when fluoride passivation retreatment is conducted after welding, there is no generation of particles or dust. The method provides superior resistance to fluorine system gases. During fluoride passivation treatment, hydrogen is added to the gas (the back shield gas) flowing through the materials to be welded. In one embodiment of the welding method, the thickness of the fluoride passivated film in a predetermined range from the butt end surfaces of the materials to be welded is set to 10 nm or less, followed by subsequent welding. Furthermore, the fluoride passivation retreatment method, includes the steps of heating at least the welded parts following welding and flowing a gas containing fluorine gas in the interior portion of the parts.

Abstract: A method of joining the ends of metal strip material together by positioning a consumable insert of weld filler material between the full thickness of the strip ends and below the lower surface of the strip ends a predetermined depth to establish a predetermined gap between the strip ends thus allowing for full arc penetration of the strip ends and providing a supply of the filler material to the root of the weld to be formed between the strip ends.

Abstract: A weld bead chopper is provided, for use in combination with a scarfing tool which is intended to scarf a longitudinal weld bead from a tube. The chopper has a) a chopper blade which is rotatable about an axis which is substantially perpendicular to a longitudinal axis of the tube, and b) a stationary blade which is cooperable with the rotatable blade. The cooperating chopping surfaces of the rotatable and stationary blades are at a short distance from the weld bead, e.g. less than 100 mm, and preferably from 20 to 50 mm. The scarfed weld bead enters an enclosed throat which has walls to guide a scarfed weld bead towards the cooperating chopping surfaces. The throat has a first guide adjacent to the scarfing tool which directs the scarfed weld bead towards a second guide. The second guide faces the scarfing tool, and is adapted to guide the scarfed weld bead towards the cooperating chopping surfaces.

Abstract: In an electrowinning anode in which a lead anode sheet is tightly fitted to a copper busbar, the anode sheet is additionally joined to the busbar by pinning to prevent damage to the joint. A lead coating is electrodeposited onto the busbar, pin and the soldered joint to provide a complete metallurgical seal and good resistance to acid corrosion.

Abstract: An improved method of coating the welded seam of a metal tube comprising heating the weld area only of the metal tube to a first temperature which is less than the melting temperature of the protective metal coating, applying the protective metal coating over the seam and heating the entire tube preferably with a full body induction coil to a second temperature which is at least equal to the difference between the first temperature and the melting temperature of the metal coating, such that the temperature of the seam area is heated to a temperature equal to or greater than the melting temperature of the metal coating, whereby the metal coating firmly adheres to the welded seam.

Abstract: Aluminum-lithium alloy sheets which are welded together are examined to identify regions requiring repair. A grid is applied to the sheet about the region requiring repair, and the region to be repaired is ground out and rewelded. Residual stresses are relieved by planishing yes to cause localized plastic deformation in the repaired region. The grid is used as a guide to restoring the original dimensions of the sheet in a manner which tends to reduce in-plane shrinkage. The reduced in-plane shrinkage in turn tends to reduce undesired tensile residual stresses. The planishing also tends to work-harden the weld filler.