Abstract: A process by which an ion energy analyzer is manufactured includes processing a first substrate to form an entrance grid having a first channel and a first plurality of openings extending therethrough. A second substrate is processed to form a selection grid having a second channel therein and a second plurality of openings extending therethrough. A third substrate is processed to form an ion collector having a third channel therein. The entrance grid is operably coupled to, and electrically isolated from, the selection grid, which is, in turn, operably coupled to, and electrically isolated from, the ion collector.

Abstract: A semiconductor device includes: a solder bump including a barrier metal layer formed on an electrode pad portion of a substrate, and a solder layer formed at a central portion of an upper surface of the barrier metal layer so as to have a smaller outer diameter than that of the barrier metal layer.

Abstract: An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.

Abstract: A portable electrostatic chuck carrier includes a holder having a dielectric top surface, and bipolar electrodes under the dielectric top surface. The bipolar electrodes includes positive electrodes and negative electrodes electrically insulated from the positive electrodes. The positive electrodes and the negative electrodes are allocated in an alternating pattern in a plane substantially parallel to the dielectric top surface.

Abstract: Components and methods of forming a protective coating system on the components are provided. In an embodiment, and by way of example only, the component includes a ceramic substrate and a braze layer disposed over the ceramic substrate. The braze layer includes a silicon matrix having a first constituent and a second constituent that is different than the first constituent. The first constituent forms a first intermetallic with a portion of the silicon matrix and the second constituent forms a second intermetallic with another portion of the silicon matrix, wherein the braze layer is formulated to provide a barrier to oxygen diffusion therethrough.

Abstract: An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.

Abstract: A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 percent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0% by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders.

Abstract: A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.

Abstract: A system and a method, the method includes determining or receiving a multiple iteration printing scheme indicative of multiple printing iterations of a coating material to be applied on an electrical circuit that comprises at least one three dimensional structure to be coated by the coating material; wherein the multiple iteration printing scheme is responsive to a shape and size of the at least one three dimensional structure; and performing multiple printing iterations of the coating material, according to the multiple iteration printing scheme; wherein at least one printing iteration is followed by at least partially curing the coating material printed during the at least one printing iteration.

Abstract: A system and method for supporting an electronic component attached to a circuit board. Solder paste is applied to a solder pad underneath and aligned with a non-wetting region of an electronic component to form a support formed of solder to prevent electronic component lead flexing. The amount of solder for forming the support and the size of the solder pad are selected to bring the support into contact with, or in close proximity to, the non-wetting region.

Abstract: A rechargeable battery comprises an electrode assembly comprising a plurality of electrodes, wherein each of the plurality of electrodes comprises a coated region and an uncoated region; a case housing the electrode assembly; a cap plate coupled to the case for enclosing the electrode assembly in the case; a current collection plate coupled to the cap plate; and a connecting member electrically connected to the uncoated regions of at least two electrodes.

Abstract: A wiring board including a conductor post corresponding to high-density packaging is provided. The wiring board may comprise a conductor layer, a solder resist layer laminated on the conductor layer, and a conductor post that is electrically connected to a conductor layer which is disposed in a lower portion of a through-hole provided in the solder resist layer, wherein the solder resist layer comprises a thermosetting resin; the conductor post comprises tin, copper, or a solder; the conductor post includes a lower conductor post, which is located within the through-hole and includes an external side surface and a lower end surface, and an upper conductor post, which is located above the lower conductor post and is projected outside the solder resist layer; and at least a part of a lower end surface of the upper conductor post is brought into intimate contact with an outer surface of the solder resist layer.

Abstract: Disclosed is a method for manufacturing a wiring board including a conductor layer, a solder resist layer laminated on the conductor layer, and a conductor post to be electrically connected to a conductor layer which is disposed in a lower portion of a through-hole provided in the solder resist layer, the method including a through-hole boring process of boring the through-hole in the solder resist layer containing a thermosetting resin to expose the conductor layer within the through-hole; a first conductor part forming process of forming a first conductor part composed mainly of copper within the through-hole; and a second conductor part forming process of forming a second conductor part composed mainly of tin, copper, or a solder on the first conductor part, in this order.

Abstract: A seal device for a rotary shaft includes a sleeve, a gland, a ring, a guide block, and a fixing member. The guide block has an outer block surface extending circumferentially and abutting against a portion of an inner gland surface of the gland, and an inner block surface extending circumferentially and opposite to the outer block surface. The outer block surface has two circumferentially opposite outer ends. The inner block surface has two circumferentially opposite inner ends. The guide block further has two opposite end faces each of which connects one of the outer ends to one of the inner ends. The inner ends subtend an angle of not larger than 90° at a center line of the gland. At least one of the end faces lies in a plane line that is substantially tangent to an outer peripheral face of the ring.

Abstract: A method and apparatus are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract: A vehicle door frame includes first and second door frame members which are positioned end-to-end to be butt-welded to each other, wherein each of the first and second door frame members includes a design part, an enclosed section provided on a vehicle interior side, a connecting part which connects an inner surface of the design part with the enclosed section; and first and second dam protrusions which project from the inner surface of the design part and are positioned on opposite sides of the connecting part, respectively. Molten metal is present in the first and second spaces after the molten metal has melted and passed through the inner surface of the design part from the outer surface thereof upon butted ends of the first and second door frame members being butt-welded to each other from the outer surface of the design part.

Abstract: A write head includes a cavity configured to couple a laser diode to the write head. A bottom of the cavity includes a heat conductive element configured to contact the laser diode, a plurality of thermal studs disposed below the heat conductive element, and a substrate disposed below the thermal studs. The heat conductive element, thermal studs, and substrate are thermally coupled to draw heat from the laser diode.

Abstract: Provided are an oven controlled crystal oscillator in which in a case where a metal lead is soldered to a substrate, even if cracks occur in the solder, its reliability is not reduced, and a production method. That is, an oven controlled crystal oscillator in which pre-tinning solders are formed around openings on a front surface and a rear surface of a substrate in which of a through hole for passing a metal lead therethrough is formed; and in a state where a metal lead including a solder layer (a pre-tinning solder) formed on its surface is inserted into the through hole of the substrate, the metal lead extending from the openings is soldered to the openings on the front surface and the rear surface of the substrate, so as to form a main solder, and a production method of the oven controlled crystal oscillator are provided.

Abstract: The present disclosure relates to methods of making solder balls having a uniform size. More particularly, the disclosure relates to improved solder ball formation processes that prevent or reduce bridging/merging of two or more solder balls during reflow. The processes of the instant disclosure are desirable because they do not require a sifting step to obtain uniformly-sized solder balls.

Abstract: A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

Abstract: An electronic component is mounted on a substrate so as to be in contact with a non-reciprocal circuit element. Therefore, there is no risk of the electronic component, which is arranged so as to be in contact with the non-reciprocal circuit element, being displaced as a result of being shifted by the magnetic force of permanent magnets included in the non-reciprocal circuit element and displacement of the electronic component as a result of being shifted by the magnetic force of the permanent magnets can be prevented. Therefore, since there is no risk of the electronic component being displaced by being shifted by the magnetic force of the permanent magnets, a space in which to mount a member that would function as an electromagnetic shield, such as a yoke, need not be provided on the substrate and the composite electronic module can be reduced in size and profile.

Abstract: A process and product made from the process is disclosed to minimize solder collapse during solder reflow. Predetermined bond pads on a layer or component have a solder paste such as Sn63 solder paste with a first lower reflow temperature applied and a spacer element such as an SAC solder ball or stud bump having a predetermined geometry with a second higher reflow temperature applied. The SAC solder balls or stud bumps act as spacing elements but do not interact with the solder paste such that the solder paste may be reflowed while precisely maintaining the space between the layers.

Abstract: A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

Abstract: A superconducting article includes first and second stacked conductor segments. The first stacked conductor segment includes first and second superconductive segments and has a nominal thickness tn1. The second stacked conductor segment includes third and forth superconductive segments and has a nominal thickness tn2. The superconducting article further includes a joint region comprising a first splice connecting the first and third superconductive segments together and a second splice connecting the second and forth superconductive segments together. The first splice is adjacent to and bridged portions of the first and third superconductive segments along at least a portion of the joint region, and the second splice is adjacent to and bridged portions of the second and forth superconductive segments along at least a portion of the joint region. The joint region has a thickness tjr, wherein tjr is not greater than at least one of 1.8 tn1 and 1.8 tn2.

Abstract: The present invention relates to variable melting point solder formulations. The solder is comprised of at least one base metal or base metal alloy, preferably alloyed with at least one melting point depressant metal, such that the solidus point of the solder composition is reduced to an initial solidus temperature. Said base metal or base metal alloy, alloyed with at least one melting point depressant metal is mixed with at least one additive metal or additive metal alloy. When heated to a process temperature above said initial solidus temperature, a reaction occurs between the melting point depressant metal, and the additive metal, such that solidification occurs at the process temperature via the formation of intermetallic phases, effectively increasing the solidus of the base metal, and of the overall solder.

Abstract: Embodiments of a method for forming an MCrAlY coating on a gas turbine engine component are provided, as are embodiments of a method for repairing a structurally-damaged region of a gas turbine engine component utilizing an MCrAlY material. In one embodiment, the method includes the step of preparing an MCrAlY slurry containing an MCrAlY powder, a low melting point powder, a binder, and a dilutant. After application over the gas turbine engine component, the MCrAlY slurry is heated to a predetermined temperature that exceeds the melting point of the low melting point powder to form an MCrAlY coating on the gas turbine engine component. The MCrAlY powder may have any one of a number of different compositions.

Abstract: A method of forming a bump structure includes providing a first work piece including a dielectric layer having a top surface; placing a second work piece facing the first work piece; placing a heating tool contacting the second work piece; and heating the second work piece using the heating tool to perform a reflow process. A first solder bump between the first and the second work pieces is melted to form a second solder bump. Before the second solder bump solidifies, pulling the second work piece away from the first work piece, until an angle formed between a tangent line of the second solder bump and the top surface of the dielectric layer is greater than about 50 degrees, wherein the tangent line is drawn at a point where the second solder bump joins the dielectric layer.

Abstract: A pre-solder method for a multi-row quad flat no-lead (QFN) packaged chip is provided. Solder paste is applied on at least one pad of the multi-row QFN packaged chip. The multi-row QFN packaged chip is heated, such that the solder paste on the at least one pad of the multi-row QFN packaged chip becomes solid solder before the multi-row QFN packaged chip is mounted on a substrate.

Abstract: A method of forming a conductive bump is provided. The method includes the steps of: (1) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball; (2) raising the bonding tool to a desired height, with a wire clamp open, while paying out wire continuous with the bonded ball; (3) closing the wire clamp; (4) lowering the bonding tool to a smoothing height with the wire clamp still closed; (5) smoothing an upper surface of the bonded ball, with the wire clamp still closed, using the bonding tool; and (6) raising the bonding tool, with the wire clamp still closed, to separate the bonded ball from wire engaged with the bonding tool.

Abstract: An apparatus for applying a helical cladding bead to the interior surface of a pipe elbow has a rotor mounted to an elbow carriage so as to be rotatable about a primary axis. The elbow carriage is longitudinally movable parallel to the rotor's rotational axis. A radially-movable elbow collar is mounted to the rotor, and has means for mounting a first end of a pipe elbow. The second end of the elbow passes through a stationary frame with centering means for keeping the elbow's curved centerline tangential to the primary axis. A weld arm, extending from a weld arm carriage into the second end of the elbow, is sinuously configured so that it will not interfere with the elbow. The weld arm is rotatable about the primary axis in coordination with the rotor. A weld head is mounted at the extending end of the weld arm so as to remain spatially fixed regardless of rotation of the weld arm.

Abstract: A layered structure comprising a base structure having a major surface, and a brazing layer secured to the major surface of the base structure, where the brazing layer is applied to the major surface prior to positioning the layered structure in contact with a turbine engine component.

Abstract: The invention relates to a strip or sheet of aluminium alloy, comprising at least 80% by weight of aluminium and 0.01 to 0.5% yttrium and/or 0.05 to 0.5% bismuth, coated on at least one face with a brazing alloy. Said sheets and strips are used for the production of pieces by non-flux brazing.

Abstract: A hard composite composition comprises a binder; and a polymodal blend of matrix powder. In an embodiment, the polymodal blend of matrix powder has at least one local maxima at a particle size of 30 ?m or less, at least one local maxima at a particle size of 200 ?m or more, and at least one local minima between a particle size of about 30 ?m to about 200 ?m that has a value that is less than the local maxima at a particle size of 30 ?m or less.

Abstract: In the soldering method, metal-powder-contained flux is disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprising a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.

Abstract: The creation of a circuit board which contains electrical interconnections between the circuit board traces and electronic devices mounted on the circuit board where the circuit board assembly can be operated at temperatures of 600° C. or greater. This invention allows for solder connections to be formed using solder paste or high-temperature.

Abstract: Copper metal or metal alloy workpieces and/or aluminum metal or metal alloy workpieces are joined in a solid state weld by use of a reactive material placed, in a suitable form, at the joining surfaces. Joining surfaces of the workpieces are pressed against the interposed reactive material and heated. The reactive material alloys or reacts with the workpiece surfaces consuming some of the surface material in forming a liquid-containing reaction product comprising a low melting liquid that removes oxide films and other surface impediments to a welded bond across the interface. Further pressure is applied to expel the reaction product and to join the workpiece surfaces in a solid state weld bond.

Abstract: The invention relates to a method for producing a blade tip plating (20) on a blade (10) Tor a lurhomachine, in particular on a high-pressure rotating compressor blade lor a gas turbine, comprising the following steps:—producing a particle composite material (24) having embedded hard material particles (18);—placing the panicle composite material (24) on a solder (30) applied (o the blade tip (16): and—healing the solder (30).

Abstract: A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 ?m or more but 20 ?m or less is provided between the joining surfaces and the three-dimensional web structure.

Abstract: Electronic assemblies and solders used in electronic assemblies are described. One embodiment includes a die and a substrate, with a solder material positioned between the die and the substrate, the solder comprising at least 91 weight percent Sn, 0.4 to 1.0 weight percent Cu and at least one dopant selected from the group consisting of Ag, Bi, P, and Co. Other embodiments are described and claimed.

Abstract: A method and a device for introducing solder onto a solar cell is provided. The method and device employ a solder wire introduced in the molten state onto the solar cell under the action of ultrasonic vibrations applied by a sonotrode. Solder is introduced very precisely onto the solar cell, without subjecting the solar cell to undesirably high temperatures, by introducing the solder wire into a gap running between a heating device and the sonotrode, which applies ultrasonic vibrations and melts and flows through the gap onto the solar cell.

Abstract: Provided is a wire solder with high tensile strength and pull cut resistance. An apparatus for feeding the wire solder is also provided. The wire solder has an extended wire solder and a core wire having a higher tensile strength than the wire solder. The core wire is made of thermosetting resin or Joulean heat generating material. The wire solder has a single or multiple strands bound together. The wire solder is supplied from upstream of a location of soldering while the core wire is rewound under tension at a location downstream of the location of soldering. The apparatus for feeding the wire solder comprises a wire solder storage section where the wire solder with a core wire is stored and a core wire rewinding member that takes up an end of the core wire to rewind the core wire. While the core rewinding member is rotated to rewind the core wire, the single or multiple strands of solder are heated to perform soldering at the location of soldering upstream of the core wire rewinding member.

Abstract: A fuel cell including an anode, a cathode and an electrolyte interposed between the anode and the cathode is disclosed. The fuel cell also includes an anode interconnect disposed adjacent to the anode, and a brazing material disposed between the anode interconnect and the anode to bond the anode interconnect to the anode. A method of assembling a fuel cell including forming a package of an anode and an electrolyte is also disclosed. It includes heating the package with a brazing material disposed adjacent to the anode, to bond the anode to an interconnect.

Abstract: Reflow soldering apparatus comprising a vapour chamber in communication with a reservoir of heat transfer fluid such that a volume of vaporised heat transfer fluid is created and held in the vapour chamber by heating of the heat transfer fluid. A heating chamber is provided for receiving a board and a transportation mechanism is provided to transport vapour, and condensate formed from the vapour, from the volume of vaporised heat transfer fluid to the heating chamber. The transported vapour and condensate applies heat to the heating chamber for the reflow soldering process.

Abstract: A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

Abstract: A solder alloy having a composition comprising at least two eutectic alloy compositions is provided. A method of joining two workpieces with the use of the solder alloy is also provided.

Abstract: The use of pre-sintered soldering plates, referred to as PSPs, frequently proceeds without a continuous, cohesive soldering connection between individual grains in the sinter material and between the sinter and base material. A process soldering of prefabricated, perforated, porous or drilled plates or porous, spongy, laminar material that, can be laid full-surfaced on a base element as a plurality of tiles or as individual porous, drilled or perforated inlay elements designed contour-close on a recess in the base material is provided. To this end, the selected plate materials can be mechanically equal to the base material or otherwise set off for the particular requirements of the component insert. The solder can be offset by specific diffusible, melting-point-lowering components. A mould that has an open, continuous porosity so that melted or fluid solder can flow through from the one surface to the other surface is also provided.

Abstract: An antenna resonating element may be mounted in an antenna cavity. The antenna resonating element may have a printed circuit board substrate with a patterned metal layer. Components may be soldered to the antenna resonating element using solder with a given melting point before soldering the antenna resonating element the antenna cavity using solder with a lower melting point. Solder widow openings may be formed in the antenna resonating element and antenna cavity to allow for application of solder paste. Engagement features and alignment structures may be used to align the antenna resonating element relative to the antenna cavity. The antenna cavity may have a curved opening. The printed circuit board substrate may be bent to the shape of the curved opening before soldering components to the printed circuit board. An elastomeric fixture may be used to hold the antenna resonating element to the cavity during soldering.

Abstract: The present invention provides technology for mounting components with simple processing and with comparatively high dimensional precision. Welding sections (21) and non-welding sections (31) are formed on a surface of a substrate (1) by transferring a mask pattern. Next, fusing material (4) is arranged on the welding sections (21), and the fusing material (4) is fused to the welding sections (21). The fusing material (4) is positioned with comparatively high dimensional precision using the non-welding sections (31). Next, a component (5) is mounted on the substrate (1) with the fusing material (4) that has been fused to the welding sections (21) as positioning guides. In this way, it is possible to mount the component (5) on the substrate (1) with high dimensional precision.

Abstract: A frame member for use in a two-wheeled vehicle and an all-terrain vehicle that includes a plurality of Al members each made of a 7000 series Al alloy having a high strength is provided in which weld crack sensitivity is reduced and a weld joint having an excellent strength is provided. The alloy composition of the 7000 series Al alloy, which provides the Al member, contains Cu: 0.01 to 0.50%, Mg: 0.5 to 2.1%, and Zn: 4.0 to 8.5%, the balance consisting of Al and inevitable impurities. Further, in the production of the frame member, the plurality of Al members is integrated by welding using a filler metal containing Mg: 5.5 to 8.0%, Cr: 0.05 to 0.25%, Ti: 0.25% or less, Si: 0.4% or less, Fe: 0.4% or less, Cu: 0.1% or less, Zr: 0.05% or less and Zn: 0.25% or less, and the balance consisting of Al and inevitable impurities.

Abstract: Nitrogen-containing fluorochemical ketones are provided that can be useful in apparatuses that includes a device and a mechanism for transferring heat. The provided fluorochemical ketones are stable at temperatures above 170° C., are environmentally friendly, and are economical to produce. The provided apparatuses can be useful for vapor phase soldering of electronic devices.