Abstract: A cream solder printing apparatus is disclosed which includes a positioning unit for positioning a workpiece 1, a mask 9 having a plurality of opening portions 31, a filling unit for filling cream solder 11 in the opening positions, a pressurizing unit composed of a pressure head 12 having a pressure container 13 and a gas charge/discharge pipe 14, a position registration unit for aligning the workpiece, the mask and the pressure head, and a moving means for peeling the mask away from the workpiece. A lower surface 27 of said pressure head has holes at positions corresponding to the opening portions.

Abstract: By using an application unit having: a storage chamber for a viscous material; a discharge hole, for the viscous material, provided so as to communicate with the storage chamber, where a viscous-material feeding device for feeding the viscous material to the storage chamber is coupled to the application unit; and a discharge-pressure adjusting device for imparting a discharge pressure to the viscous material stored in the storage chamber, a screen mask having openings corresponding to the application object or the application object itself and the discharge hole of the application unit are brought into contact with each other, either the application unit and the screen mask or the application unit and the application object are moved relative to each other while the discharge pressure is imparted to the viscous material in the storage chamber, and the viscous material is applied onto the application object while the storage chamber is replenished at all times with the viscous material by the viscous-material

Abstract: An apparatus and method for manufacturing solder balls used for an electrical and/or mechanical connection between a semiconductor chip and a substrate are provided. The apparatus includes a melting furnace having a nozzle through which a molten solder paste flows and drops, for producing solder balls; a vibrating mechanism attached to the nozzle of the melting furnace, for applying vibration to the nozzle; and a vibration controlling mechanism for controlling the vibration frequency of the vibrating mechanism to adjust the size of the solder balls dropped from the nozzle. The method includes the steps of setting a vibration frequency according to a desired solder ball size, applying vibration to a nozzle with the set vibration frequency, making the molten solder paste flow through the nozzle to manufacture solder balls of a predetermined size according to the vibration frequency, and measuring the size of the manufactured solder balls.

Abstract: A capillary tube for a solder ball connection device connects a first connection surface of a pad to a second connection surface of a pad with a solder ball. The first connection surface is formed at a slider held by a slider holder in a disk unit. The second connection surface is formed at an end of a lead wired to the slider holder. The capillary tube has a ball regulator with a substantially conic, hollow portion. The solder ball regulator has an opening at its top that opens to the tip of the hollow portion. The center axes of the hollow portion and the opening are common. The solder ball regulator also has a pair of projections along the center axis around the opening, where the projections face each other with the center axis therebetween. The projections regulate the movement of the solder ball. The tip of the hollow portion is tapered when viewed from a line connecting the pair of projections and the extreme tips of the tapered tip portions.

Abstract: The invention relates to a method and apparatus to use nitrogen, or any other inert gas, or a reducing gas as a process gas to reflow and planarize solder paste in a single heating step. The inert gas may also be used to cool the solder paste after reflowing. According to one method soldered paste is printed onto the printed circuit board with conventional methods employing a mask or stencil. A mesh, die, or mold element having a plurality of openings therein is lowered onto the soldered paste and the printed circuit board is reflowed and planarized in a single heating step. Once the paste is applied, the parts are reflowed and planarized in a single, brief, thermal excursion. The heated mesh is lowered into the solder paste causing the paste to wick through the mesh forming a meniscus. A hot gas knife is arranged to plane the meniscus of the solder paste off of the mesh. An inert, nitrogen, or reducing gas is diffused through the knife to prevent oxidation.

Abstract: A solder jet apparatus is disclosed The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.

Abstract: A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.

Abstract: A capillary for electrical bonding between a semiconductor chip and corresponding pins of a semiconductor device in which the chip is accommodated, comprising a body whose terminal portion is substantially frustum-shaped, the body having a diametrical through hole which allows the passage of a copper wire for electrical bonding between the chip and the semiconductor device; the portion of the body that is adjacent to a lower end of the through hole is flared, with a flaring diameter and a flaring angle which allow to form a substantially flat annular peripheral region on a copper ball when the copper ball placed at a lower end of the copper wire is deformed by the action of the capillary, the formation of the substantially flat annular peripheral region being independent of the position of the copper wire within the through hole of the body of the capillary.

Abstract: The soldering method comprising the steps of forming a solder melting pot by assembling plural trowel members, supplying a solder tip to the solder melting pot, and sequentially repeating the operation for supplying the molten solder to the respective soldering point. In the improvement, an additional heating portion which comes close to the solder melting pot is formed to the trowel members, and the soldering point to which molten solder has been supplied by the prior molten solder supplying operation is additionally heated during the supplying operation. The trowel members are used to simultaneously perform the operation for supplying the molten solder and another operation for additionally heating the soldering point to which the molten solder has been supplied. A plurality of points to be soldered aligned at predetermined intervals are efficiently soldered.

Abstract: A flux-application fixture for applying flux to die pads in a ball-grid-array assembly process is provided. The fixture comprises a solid plate having a lower surface and an upper surface and a plurality of flux pins formed in the upper surface of the solid plate. The flux pins are contiguous with the solid plate and are formed by removing material from the upper surface of the plate such that the remaining material not removed forms the plurality of flux pins. In a preferred application the material is removed by grinding and the flux plate is ground flat to tight tolerance before removing the material to form the flux pins.

Abstract: The present invention relates to a method for making an array of metal balls. The method includes the step of generating a first pattern on a metal foil which includes a plurality of foil projections. The method also includes the step of generating a second pattern on a carrier substrate. The second pattern includes a plurality of carrier recesses that are arranged and configured to correspond with the foil projections of the first pattern. The method further includes the steps of placing the metal foil and the carrier substrate together such that the foil projections of the metal foil fit within the carrier recesses of the carrier substrate, and melting the metal foil such that the foil projections form metal balls positioned within the carrier recesses of the carrier substrate. The invention also relates to metal ball arrays constructed via the above method.

Abstract: A portable feeder for welding wire used to charge a welding wire guide system with a new coil of wire upon depletion of the previous welding wire coil. A casing includes a drive roller driven by a portable drill or the like, and a backup roller movably mounted upon the casing squeezes the welding wire passing through the casing between the rollers rapidly feeding the welding wire into guides formed on the casing in alignment with the wire guide system.

Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.

Abstract: An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and an orifice defining structure. The substrate support has structure for bearing a substrate on which one or more electronic components are to be mounted. The solder ejector has a housing that defines a cavity for containing molten solder. The orifice defining structure includes a flat disk having an orifice defined therethrough for producing a stream of molten solder and a disk support structure that supports the disk around the orifice and is replaceably coupled to the cavity-defining structure. Also disclosed is an apparatus that deposits a selected pattern of solder onto a substrate and includes a substrate support, a solder ejector that directs solder droplets to desired positions on the support, and an ejector aligner that adjusts the orientation of the solder ejector in two angular dimensions to enable adjustment of the trajectory of the stream of molten solder droplets.

Abstract: In a soldering method for soldering a thermit case 26 and a pair of bus bars 11a, 19a to be electrically connected to the thermit case 26, a portion to be heated P of the thermit case 26 which is spaced from the respective bus bars 11a, 19a by an approximately equal distance is heated by a gas burner 71, and solders are simultaneously supplied from solder wire supply portions 75a, 75b to a pair of solder joining faces 22 for joining the thermit case 26 and the pair of bus bars 11a, 19a, after the portion to be heated P has been heated. The temperatures of the pair of solder joining faces 22 are made substantially equal to each other by heating the portion to be heated P so that solders are simultaneously supplied to the pair of solder joining faces 22.

Abstract: In a flow soldering apparatus, a substrate is clamped by a pair of nails of a chuck mechanism and transferred over a molten solder barrel while being held in contact with a molten solder. The nails are held resiliently to each other, so that the substrate is allowed to expand thermally between the nails without bowing. The chuck mechanism has a scraper nail which extends transversely over the entire lateral length of the substrate at the front side of the substrate in a substrate transfer direction to push away an oxide film formed on the molten solder. The chuck mechanism is constructed to allow the molten solder to enter underneath the substrate in the lateral direction with respect to the substrate transfer direction. After completing one soldering operation, the nails change the set of the opposing two sides to another set of two opposing sides of the substrate, so that the substrate is subjected to the soldering operation from a direction different from the preceding soldering operation.

Abstract: In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.

Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.

Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

Abstract: A bump forming apparatus comprises a container for retaining therein a solder melt, a solder forming member having a side wall portion and a ceiling portion which form, above a substrate's flat surface, a chamber for receiving therein the solder melt. The solder forming member also includes a height regulator portion provided on an exterior of the side wall portion and having a flat surface for restricting the height of the solder melt during formation. Heating means for heating the solder melt may also be provided. A hole in the solder forming portion allows solder melt to flow from the container to the chamber. Pressurizing means for pressurizing the solder melt in the container to thus expedite passage of solder melt into the chamber of the forming member may be used. Depressurization means for reducing the inside pressure of the container to cause the unused metal to return from the chamber into the container may also be used.

Abstract: A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.

Abstract: Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.

Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used, to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections.

Abstract: A welding wire holder includes a container body having an annular space defined therein for receiving therein a coil of welding wire, and a coil keeper for keeping the coil of welding wire stably in position against floating when the welding wire is pulled out from the container body in an upward direction. The coil keeper is comprised of a layer of spheroidal members spread over the entire area of an upper surface of the coil of welding wire received in the annular space. The spheroidal members thus spread produce a distributed load acting on the upper surface of the coil of welding wire with uniform distribution of load.

Abstract: A bump forming apparatus includes a first tank storing fused solder, a cavity having an inlet for the fused solder, a nozzle arranged on a lower portion of the cavity, a pressure element formed by a diaphragm and a piezoelectric element, and a first heater heating the first tank, a pipe and the cavity. The bump forming apparatus further comprises a static pressure control part having a second tank storing solid solder, a second heater provided around a second opening, a level detector detecting the surface level of the fused solder in the first tank and a level control part controlling driving of the second heater on the basis of a detection signal from the level detector. Thus obtained are a bump forming apparatus and a bump forming method capable of properly avoiding defective discharge, increasing the speed of discharge, avoiding dispersion of an amount of discharge and stabilizing discharge.

Abstract: A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than all of the component bottom surface, so as to provide a void-free interface when the adhesive bonds the component to the top surface of a chip. The adhesive desirably is brought to a flowable condition by heat transferred from the chip itself. The connection component may include leads having base metal strips in a trace area underlying the top surface and noble metal portions protruding beyond an edge of the top layer. A flowable, curable material encapsulates the base metal sections. Because the base metal sections desirably are free of undercuts, the same can be encapsulated in a void-free manner during formation of the component.

Abstract: An improved soldering system which reduces the numbers of steps for paste supply and soldering in soldering lead provided parts and surface mounting parts onto a printed circuit board. A printed circuit board has through holes through which a lead of each lead provided part is to be inserted and lands for surface mounting parts. A printing mask is matched with the through holes and lands and a paste receiving plate having holes to which solder paste is to be supplied corresponding to each of the through holes is disposed. A printing roller is swept by forcibly rotating it so as to fill with solder paste, then a printing squeegee is swept following that printing roller so as to further fill with solder paste.

Abstract: An apparatus and a process for mounting solder balls or other conductor balls on terminal pads of semiconductor devices or other electronic devices collectively formed on a semiconductor wafer or other substrate by using a single adsorbing plate. The apparatus includes an adsorbing unit which comprises an adsorbing head; an adsorbing plate attached to the head and having adsorbing holes for adsorbing the conductor balls, the adsorbing holes being arranged corresponding in number and position to the terminal pads present in one of the divisions that includes a largest number of the devices; and a mask plate attached to one side of the adsorbing plate and having an opening conformed in shape and size to an area of the substrate occupied by a group of the devices included in a selected one of the divisions so that the conductor balls are only adsorbed by the adsorbing holes corresponding in position to the terminal pads of the devices of the group in the selected one division.

Abstract: An apparatus for removing a casting comprising an electronic package substrate and an array of cast solder columns having a column pitch of less than 2 mm extending therefrom from the corresponding openings of a mold. The apparatus includes a removable mold containing a plurality of openings for casting a corresponding array of solder columns and bonding the columns to the underside of an electronic package substrate. A stripper plate for receiving the mold contains openings through a thickness thereof corresponding to at least some of the openings in the mold. An ejector assembly including ejector pins having a length at least as long as the sum of the thickness of the stripper plate at the stripper plate openings and the thickness of the mold at the column casting openings, and corresponding to openings in the mold and the stripper plate.

Abstract: A method of bonding wire between at least one pair of bond locations in a semiconductor device and the bonder. A conveyor is provided having a conveying surface for conveying in a predetermined direction a partially fabricated semiconductor device having first and second bonding locations. A first capillary is provided for forming a stitch bond to the first bonding location, the first capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal thereto and substantially parallel to the plane of the conveying surface. A stitch bond is formed on the first bonding location with the first capillary. The first capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface.

Abstract: The precise solder paste application process makes use of mask registration apertures that are formed in the printed circuit board and that are adapted to receive a component solder paste mask that conforms to the conductor pattern of the component to be replaced. The component solder paste mask comprises a mask that has formed therein apertures that correspond to the pattern of solder paste that is to be applied to the printed circuit board surface mount pads to correspond to the conductors of the component. The component solder paste mask includes registration features that mate with the registration apertures formed in the printed circuit board to thereby ensure precise placement of the component solder paste mask over the area of the printed circuit board that receives the replacement component.

Abstract: An automatic soldering apparatus includes a conveyor for conveying a printed circuit board along a predetermined path, a heater located below the conveyor and adapted to heat the lower surface of the printed circuit board on which leads of chips and other electronic parts are to be electrically connected to circuits as printed, a flux applicator located downstream of the heater and arranged to apply a molten flux to the surface of the printed circuit board, and a supply of solder located downstream of the flux applicator and arranged to solder the leads to the circuits. The flux applicator includes a supply of flux for feeding flux in solid form at room temperature, a heater for heating the flux to a temperature above its melting point to provide a molten flux, and a spray nozzle for spraying the molten flux to the surface of the substrate.

Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

Abstract: Device for the singled-out application of joining material deposits (30), particularly solder beads, from a joining material reservoir (11) with an application device (13) and a singling-out device (12) for singling-out joining material deposits from the joining material reservoir, wherein the singling-out device (12) is designed as a conveying device (20) for the singled-out transfer of joining material deposits (30) to the application device (13).

Abstract: An apparatus for use in manufacturing a semiconductor device includes an input-output (IO) face having a plurality of IO lands, and is situated in an operating position in abutting relation with a depositor. The apparatus includes a first holding member holding the depositor in a first position; a second holding member holding the semiconductor device in the operating position. The depositor and the semiconductor device cooperate in the operating position to deposit solder ball connection structures to the IO lands. The apparatus further includes a separating member for moving at least one of the depositor and the semiconductor device from the operating position to an interim orientation. The interim orientation establishes a separation distance intermediate the depositor and the semiconductor device appropriate to disengage the solder ball connecting structures from the depositor.

Abstract: An apparatus for simultaneously wetting a plurality of electrical contact areas with a liquid includes a punch with nubs or studs made of an elastomer. The number, configuration and dimensions of the nubs are adapted to the contact areas to be wetted. A process for simultaneously wetting a plurality of electrical contact areas with a liquid includes wetting the nubs with the liquid, leading the punch over the contact areas in such a way that the nubs are each disposed over one of the contact areas, and subsequently transferring the liquid from the nubs onto the contact areas.

Abstract: Disclosed are methods and apparatuses for forming solder bumps on integrated circuit chips (and other similar circuitized units) and apparatuses. A screening stencil is laid over the surface of the substrate and solder paste material is deposited into the stencil's apertures with a screening blade. The stencil is placed in such a manner that each of its apertures is positioned over a substrate pad, upon which a solder bump is to be formed. Next, a flat pressure plate is laid over the exposed top surface of the stencil, which creates a fully enclosed, or "captured", cell of solder paste within each stencil aperture. Then, with the stencil and plate remaining in place on top of the substrate, the substrate is heated to a temperature sufficient to reflow the solder paste material. After reflow, the substrate is cooled, and the pressure plate and stencil are thereafter removed, leaving solder bumps on the substrate.

Abstract: Solder deposit carrier for the selective soldering of terminal areas of a substrate, comprising on an electrically conductive, non-wettable or wetting-inhibiting coating (12) a transfer mask (13) of an electrically isolating, non-solderable material which exposes the coating in the area of mask openings (14), in which the mask openings (14) serve to accommodate solder deposits (16) electroplated to the coating (12), and the coating (12) comprises two superimposed metal layers (15, 17) of different materials, such that the layer (17) facing towards the mask openings (14) is non-wettable or has a wetting-inhibiting effect, and the layer (15) arranged facing away from the mask openings (14) acts as a current-carrying layer during the electroplating.

Abstract: A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.

Abstract: A metal jet, metal deposition system has metal jets disposed in an oxygen-free chamber. The metal jets eject droplets of a wetting metal onto conductors on an electrical substrate followed by solder metal. Banks of metal jets can be used to print conductors onto the electrical substrate.

Abstract: The present invention discloses a method and apparatus for forming solder bumps by a molten solder screening technique in which a flexible die head constructed of a metal sheet is utilized for maintaining an intimate contact between the die head and a solder receiving mold surface. The flexible die head, when used in combination with a pressure means, is capable of conforming to any curved mold surface as long as the curvature is not more than 2.5 .mu.m per inch of die length. The present invention further provides a method and apparatus for filling a multiplicity of cavities in a mold surface by providing a stream of molten solder and then intimately contacting the surface of the molten solder with a multiplicity of cavities such that the molten solder readily fills the cavities. The apparatus further provides means for removing excess molten solder from the surface of the mold without disturbing the molten solder already filled in the cavities.

Abstract: The apparatus, in preparation of soft soldering semiconductor chips to a substrate (6), is for the shaping of spherically domed liquid portions of solder (8) into flat solder applications (8"), as evenly distributed as possible and correctly positioned on the substrate. On a shaft (10) which can be lifted and lowered, a punch (20) with a punch surface (22) is guided vertically, spring mounted and slewable all around the axis of motion (16) and also frictionally engaged. The punch (20) is provided with distance keeping means--e.g. in the form of a circumferential rim (24)--which extends beyond the punch surface (22) and is intended for touching down on the substrate (6). In each operation cycle the punch (20) is automatically aligned to the substrate (6). Since the punch (20) is self-adjusting with respect to the shaft (10), it is unnecessary to maintain an exactly defined height position above the substrate.

Abstract: A method of mounting an integrated circuit having a plurality of leads on a printed circuit board (PCB), by: removing foreign substances on the PCB; spreading a flux on lead patterns formed on the PCB; aligning the leads of the integrated circuit on the lead patterns on the PCB on which the flux is spread; soldering the leads and lead patterns by covering the part of a semiconductor chip of the aligned integrated circuit using a holding block and radiating an optical beam onto the whole surface thereof; and cooling the holding block and PCB which has been soldered, which prevents shorts and a poor contact generated by an earlier method. As the quality of soldering is enhanced and the lead is not pressured when soldering, the confidence of the integrated circuit after mounting is also enhanced. Moreover, by soldering all of the leads at one time, the operational time can be reduced.

Abstract: Screen printing and chip mounting are executed in a dry air atmosphere to prevent generation of solder balls due to absorption of moisture by a flux ingredient of paste solder. Screen printing of the solder on a board takes place in a space which has the board, a printing screen and a squeegee arranged therein and is formed therein with a dry air atmosphere having a pressure slightly higher than that of an atmosphere outside the space. Likewise, mounting of a chip on the board is carried out in a like space. Also, a reflow step is executed in a reflow oven kept at a dry air atmosphere.

Abstract: A method [and apparatus] for refurbishing eroded portions in coke oven doorjambs including refurbishing apparatus having a framework attached to the coke oven structure adjacent the doorjamb. The framework supports a carriage that is simultaneously moveable in an "X" axis direction and a "Y" axis direction within the boundary so that a machine[-cutting] tool, attached to the carriage, can be moved from one position directly to another position within the framework boundary. [The machine-cutting tool is positioned to make cutting] The machine tool is moved directly to selected positions within the boundary to make machining passes along new metal that is fused into the eroded portions of the coke oven doorjamb.

Abstract: A method and apparatus is disclosed for applying solder to a substrate which has a predetermined pattern of receiving pads thereon and forming solder balls from the applied solder. A conveyor is provided having a support member and a continuous metering member. The metering member has openings thereon arranged in the same preselected pattern as the solder receiving pads on the substrate. The substrate is moved into contact with the support member and the metering member, the openings in the metering member being in alignment with the solder receiving pads of the substrate. A container of solder is provided which supplies solder to the openings. The solder may be in liquid form, or in paste form, or in the form of solid solder balls. The applied solder, if in the form of paste or solid balls is melted. Thereafter, the solder is solidified on the pads to form solder balls, and the substrate is discharged from the conveyor with the solidified solder balls thereon.

Abstract: In a ball grid array (BGA) station (50) having a robotic arm (60) with a vacuum head (70) containing a predetermined quantity of vacuum apertures (90), a method and apparatus of loading an array of solder balls (14) for solder bumping a carrier (20). Solder balls (14) are supplied into a tub (500) having a head opening (510) for accommodating a vacuum head (70). After the vacuum head (70) is positioned by the robotic arm (60) towards the head opening (510) of the tub (500), suitable fluid pressure (570) is applied to the solder balls (14) within the tub (500) to force the solder balls (14) to float on the gas pressure towards the vacuum apertures (90). The vacuum apertures (90), which are appropriately sized and annularly shaped has at least a partial vacuum (34) applied through the apertures (90) to suck-up a desired quantity of solder balls for eventual placement on the BGA carrier (20).

Abstract: An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.

Abstract: A solder jet apparatus is disclosed The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.

Abstract: This invention is substantially an all purpose workstation suitable for use by electricians, jewelers, etc. The workstation is portable, and attachable to a work bench, or the like. The workstation includes specific tools commonly used in these trades, such as a solder pad container, a ring mandrel, and gripping members.