Abstract: In a conventional wave soldering bath, the bottom surface of a bath body in a position which is below the inlet of a duct underwent erosion by molten solder and had a hole formed therein, causing molten solder to be spilled out from the hole. The cause of erosion of the bottom surface of the bath body is a vortex (T) of molten solder formed below the duct inlet accompanying rotation of an impeller pump (10), and the vortex rubs the bottom surface of the bath body. In the present invention, a shielding member (14) is installed between the duct inlet (12) and the bottom surface (13) of the bath body such that the vortex is prevented from affecting the bottom surface.

Abstract: Methods and apparatus for improving wave soldering processes by measuring and controlling the amount of residual oxygen present in the soldering tank and thereby avoiding excess dross formation. The methods and apparatus utilize a glass plate with ports to support sensors, e.g. oxygen sensors to both protect the solder bath from contact with air and to measure the oxygen levels associated with the solder bath.

Abstract: In a wave soldering tank using a conventional screw pump, pulsation sometimes occurred in which molten solder spouting from the discharge nozzle moved up and down. The cause of the occurrence of the pulsation in a screw pump was that the gap between the screw pump and the casing was wide, so there was reverse flow through the gap. It is conceivable to narrow the gap, but if the gap is made narrow, the screw pump ends up contacting the casing if the screw pump becomes eccentric. A wave soldering tank according to the present invention makes the diameter of the inlet in the bottom of the casing smaller than the diameter of the screw pump so that reverse flow does not take place even if the gap between the screw pump and the casing is wide. Flow is made more stable by providing outwardly flaring guide walls on the outlet of the casing.

Abstract: Methods and devices for placing a semiconductor wafer or other substrate in contact with solder are described. A wave soldering apparatus includes a solder bath, a nozzle for producing a solder wave, and a jig for orienting a substrate in a substantially vertical orientation and placing the substrate in contact with a cascading solder wave. In another wave soldering apparatus, a jig orients a semiconductor wafer in a substantially horizontal orientation in contact with the solder wave. Another soldering apparatus includes a tank comprising molten solder and a fixture configured to orient one or more semiconductor wafers in a substantially vertical orientation. Methods of placing semiconductor wafers or other substrates in contact with solder using the devices of the present invention are also disclosed.

Abstract: A wave soldering tank is provided on which it is easy to perform maintenance, which does not have fluctuation of the height of spouted solder, which does not damage the rotating shaft of a discharge pump, and which can be stably used for long periods. The wave soldering tank 1 has a tank body 1a which houses molten solder S, a discharge pump 5 which pumps molten solder S, a discharge nozzle 4 which spouts molten solder S which was sent to it by the discharge pump 5 upwards, a duct 2 having the discharge pump 5 installed at one of its ends and the discharge nozzle 4 installed at its other end, an oxidation preventing member 22 which has a prescribed size and which floats on the surface of the molten solder S, and an engaging means 13 which controls rotation of the oxidation preventing member 22 in a horizontal plane.

Abstract: A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.

Abstract: A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.

Abstract: The invention relates to a supply device for feeding a gas to a wave brazing or tinning machine, wherein said machine is capable of generating at least one soldering wave, comprising: a gas inlet channel, a set of N secondary channels immersed in the solder bath of the brazing or tinning machine, and an injection channel supplying at least one injection means for injecting the gas in the vicinity of said at least one wave, each secondary channel having its inlet end connected to the injection channel, characterized in that the number N of secondary channels is equal to or higher than 1, and in that the inner diameter d of the secondary channels and the gas flow rate Q0 in the inlet channel are selected so that the gas flow in the secondary channels is in a turbulent mode.

Abstract: Soldering with lead-free alloys is enhanced by use of two additives to a molten solder bath. One additive is an oxygen barrier fluid that floats on or envelops a bath. Another additive is an oxygen or metal oxide scavenger in the bath. Exemplary scavengers include metals with a higher free energy of oxide formation than oxide of tin, reducing gas, or an electrode immersed in the bath. The oxygen barrier may be an organic liquid, preferably polar in nature, which forms at least a monomolecular film over static surfaces of the bath. An exemplary soldering process is wave soldering of printed circuit boards.

Abstract: A soldering apparatus including a vessel containing a molten solder, a casing defining therewithin a soldering chamber in which a flat overflowing wave of the molten solder is formed, a conveyor physically integrated with the casing for movement therewith and operable for transferring a printed circuit board through the soldering chamber, actuators and for vertically moving the casing, inert gas feeders for feeding an inert gas to the soldering chamber, and a controller for controlling the operation of the actuators and, so that the printed circuit board is contacted with the surface of the flat overflowing wave in an atmosphere of the inert gas during its passage through the soldering chamber.

Abstract: It has been observed that turbulent solder flow, particularly at the opening of a conventional flow well, correlates to a greater degree of Cu dissolution of the PTH barrels of a PCB, especially those that are aligned with the opening. A more laminar solder flow is created to more evenly distribute the solder flow and thus reduce the rate of Cu dissolution near the flow well opening, particularly during a PTH rework process. In one aspect, a flow well for a soldering machine is provided comprising a flow distribution element, wherein solder flowing into the flow well is distributed by the flow distribution element to provide a more laminar flow.

Abstract: Solder is pumped through a nozzle to produce a jet 12 of solder and leads on a printed circuit board are passed through the jet to solder them to the board tracks. The nozzle 2 is mounted on a flange 16 held between slip rings 18, 20 so that the nozzle can be rotated to change the direction of the jet. A nitrogen conduit 68, 70 may be provided in-line with the jet to provide a nitrogen atmosphere. A thin plate 92 downstream of the nozzle outlet to contact the jet and inhibit sideways fluctuations when leads are passed sideways through the jet. The apparatus may also include a tube 204, 212, 224 for delivering heated nitrogen gas to pre-heat a region to be soldered.

Abstract: A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered.

Abstract: In a conventional wave soldering bath, molten solder spouted from a second discharge nozzle did not have a uniform height, oxides were spouted from the nozzle opening and adhered to printed circuit boards, and constituent parts of the wave soldering bath were eroded. In a wave soldering bath according to the present invention, a cylinder is disposed at one end of a duct, a spiral pump is installed in the cylinder, and the width of a nozzle opening is made narrower than the width of the duct.

Abstract: A solder bath contains a solder bath main body that contains solder, and a heating member that heats the solder. The heating member is mounted on outer surfaces of a bottom and sides of the solder bath main body. The heating member contains a thermal diffusion member that is made of stainless steel, which is mounted on the outer surfaces of a bottom and sides of the solder bath main body, a porous heat insulator that is mounted on and attached to the thermal diffusion member, and a heating element that is buried in the porous heat insulator. The heating element is also away from the thermal diffusion member.

Abstract: This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.

Abstract: Especially for but not limited to lead-free solder, the apparatus disclosed herein will provide better quality of wave soldered joints at a lower cost, without the addition of more equipment. The invention will form complete TH solder joints over the first wave soldering nozzle, not the second wave soldering nozzle which is current art. It specifically addresses the size and the shape of the holes in the first wave-forming nozzle. The first solder wave forming plate has hexagon shaped holes that reduce the incidence of holes being clogged and non-functional. There is a size gradient across the multiple rows of holes in the extended contact wave former that has the effect of creating a uniform solder pressure across the entire face of the nozzle. The result is higher solder pressure against the electronic substrate being soldered for a longer period of time than current art, allowing for faster formation of solder joints. This affects quality and thru-put.

Abstract: The invention relates to a device and method for selective soldering, including at least one nozzle and a soldering channel surrounded by a vertically moveable hood, which immerses in a soldering bath or which is sealed against a surface of the soldering bath. The hood includes a passage for each nozzle, at least one gas feeding device for providing protective and/or active gas underneath the hood, and flow plates which are attached to the hood to extend substantially downward in the direction of the soldering bath from the hood.

Abstract: A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder balls to the first plate.

Abstract: In a wave soldering tank using a conventional screw pump, pulsation sometimes occurred in which molten solder spouting from the discharge nozzle moved up and down. The cause of the occurrence of the pulsation in a screw pump was that the gap between the screw pump and the casing was wide, so there was reverse flow through the gap. It is conceivable to narrow the gap, but if the gap is made narrow, the screw pump ends up contacting the casing if the screw pump becomes eccentric. A wave soldering tank according to the present invention makes the diameter of the inlet in the bottom of the casing smaller than the diameter of the screw pump so that reverse flow does not take place even if the gap between the screw pump and the casing is wide. Flow is made more stable by providing outwardly flaring guide walls on the outlet of the casing.

Abstract: A wave soldering tank is provided on which it is easy to perform maintenance, which does not have fluctuation of the height of spouted solder, which does not damage the rotating shaft of a discharge pump, and which can be stably used for long periods. The wave soldering tank 1 has a tank body 1a which houses molten solder S, a discharge pump 5 which pumps molten solder S, a discharge nozzle 4 which spouts molten solder S which was sent to it by the discharge pump 5 upwards, a duct 2 having the discharge pump 5 installed at one of its ends and the discharge nozzle 4 installed at its other end, an oxidation preventing member 22 which has a prescribed size and which floats on the surface of the molten solder S, and an engaging means 13 which controls rotation of the oxidation preventing member 22 in a horizontal plane.

Abstract: A method for manufacturing a printed circuit board includes providing a board including a plurality of electrical traces, a first surface, and a second surface opposite the first surface. The method further includes providing at least one surface mount component having a plurality of electrical terminals. The method also includes applying an adhesive on the first surface of the board, and adhering the surface mounting component to the first surface. The method also includes wave soldering the surface mount component on the first surface to the board to encapsulate at least a portion of the electrical terminals of the surface mount component with a lead-free solder.

Abstract: Problem: In a conventional wave soldering bath, oxides which intermixed with molten solder were sucked into a duct from a suction port of the duct and were discharged from a discharge nozzle and adhered to printed circuit boards. Means for Solving the Problem: In a wave soldering bath according to the present invention, an oxide reservoir is provided at one end of the bath body which is opposite from the end thereof where a pump is installed, and a gutter which is closed off on the pump side is mounted on the side surface of the discharge nozzle. A perforated plate having a large number of holes formed therein is pivotably installed at a middle height of the oxide reservoir.

Abstract: It has been observed that turbulent solder flow, particularly at the opening of a conventional flow well, correlates to a greater degree of Cu dissolution of the PTH barrels of a PCB, especially those that are aligned with the opening. A more laminar solder flow is created to more evenly distribute the solder flow and thus reduce the rate of Cu dissolution near the flow well opening, particularly during a PTH rework process. In one aspect, a flow well for a soldering machine is provided comprising a flow distribution element, wherein solder flowing into the flow well is distributed by the flow distribution element to provide a more laminar flow.

Abstract: A wave soldering apparatus includes: two parallel tracks; a soldering bath defining a wave soldering region between the tracks for soldering circuit boards passing therethrough; a conveying unit including two belts that are movably and respectively mounted on the tracks, and a plurality of clamping members mounted on the belts; and two adjusting mechanisms, each of which is mounted on a respective one of the tracks and each of which includes a pressing plate that is disposed at a top side of the wave soldering region and that is adjustable in height relative to the tracks so as to press downwardly against the clamping members that are under the pressing plate.

Abstract: In a conventional wave soldering bath, the bottom surface of a bath body in a position which is below the inlet of a duct underwent erosion by molten solder and had a hole formed therein, causing molten solder to be spilled out from the hole. The cause of erosion of the bottom surface of the bath body is a vortex (T) of molten solder formed below the duct inlet accompanying rotation of an impeller pump (10), and the vortex rubs the bottom surface of the bath body. In the present invention, a shielding member (14) is installed between the duct inlet (12) and the bottom surface (13) of the bath body such that the vortex is prevented from affecting the bottom surface.

Abstract: A wave soldering apparatus includes a solder supply and a first wave soldering nozzle in fluid communication with the solder supply. The first wave soldering nozzle includes a flat plate having a plurality of square-shaped openings formed therein to generate a first solder wave. An inert system is configured to deliver an inert gas around the first solder wave. Other embodiments and methods of wave soldering are further disclosed.

Abstract: The instant invention relates to a device for wave soldering workpieces, encompassing means for moving the workpiece, which is to be soldered, along a specific path across at least one solder wave generated above a solder reservoir, with a protective and/or active gas atmosphere of a first composition being located above the solder reservoir so as to exclude oxygen and with means for introducing the protective and/or active gas as well as an enclosure being provided, with the enclosure being configured in such a manner that it encloses at least the essential parts of a solder zone.

Abstract: A compact soldering apparatus capable of increasing reliability of products by reducing occurrence of dross and using lead-free solder, wherein a primary jet nozzle 1, a secondary jet nozzle 2, and a pump (not shown) forming jet waves 24, 25 are installed in a solder tank 6 reservoiring molten solder S. Guide plates 4, 5 are installed between the jet nozzles 1, 2 above a solder face F of the molten solder S on a position where the molten solder is dropped. The guide plates 4, 5 formed into a V-shape are provided with solder guide portions crossing each other so as to drop the molten solder S at different positions on the solder face F of the solder tank 6. Molten solder dropped onto upper portions of the guide plates 4, 5 passes through the solder guide portions and is made to fall on a nozzle side different to a nozzle side where the solder is flowed.

Abstract: A method of making a printed circuit board having zero resistance connections. Pairs of shunt pads are formed on the board, spaced sufficiently far apart to avoid short circuiting but sufficiently close to permit a solder bridge to occur between them during a solder wave process.

Abstract: A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.

Abstract: The present invention relates to a selective wave solder machine. In particular, it relates to a system for calibrating and adjusting process points to account for variations in machines and circuit boards. Vision systems are used to locate fiducials on the processing modules and the circuit boards. Differences between stored locations for fiducials relating to the circuit board and the processing modules are used to adjust the positions of stored process points to achieve improved performance.

Abstract: An apparatus for mounting an electric component onto a board by means of a lead-free solder material. The apparatus of the present invention has a solder material supplying chamber in which a melt of the solder material is supplied to the board by a solder material supplying unit such that the solder material adheres to a predetermined portion of the board. The apparatus further includes a cooling chamber in which the board is cooled by a cooling unit such that the solder material adhering to the board is rapidly cooled to solidify. A conditioning chamber can also be positioned between the solder material supplying chamber and the cooling chamber. The conditioning chamber conditions the board such that the solder material adhering to the board is ensured to be a completely molten condition at least before the rapid cooling of the solder material.

Abstract: Temperature-sensitive electrical and electronic components which are connected to a board by soldering during the installation process are protected from the heat during the soldering process in order to prevent permanent damage to the components. The solder connections of the component are thermally coupled to a protection apparatus during the soldering process, so that some of the heat which is introduced into the solder connections during the soldering process is passed to the protection apparatus. The protection apparatus also has a protection sleeve, which surrounds the component in places. The protection sleeve is advantageously composed of a thermally insulated material, and is provided with a coating with a high thermal reflection capability in places on its outer wall which faces away from the component.

Abstract: This invention relates to a packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a lead-free solder paste; an inserting step in which the lead or terminal of a insertion mount device is inserted into the circuit board; a step in which a warp preventing jig is attached to the circuit board; a flux applying step in which flux is applied to the foregoing circuit board; a preheating step in which, after applying flux, the lower surface of the circuit board is preheated; a flow-soldering step in which the upper surface of the circuit board the lower surface of which was preheated in the preheating step is heated, and by applying lead-free solder paste to the lower surface of the circuit board, the lead or terminal of the insertion mount device is flow-soldered to the circuit board; and a temperature controlling step where temperatures of both surfaces of a circuit board are adjusted, the upper surface of the

Abstract: The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate from the upper side is wave soldered by contact with a molten lead-free solder blowout at a wave soldering portion provided in a chamber, and a cooling step in which an inert gas in the chamber is recirculated and cooled and is blown to the lower side of the substrate wave soldered with the lead-free solder in the wave soldering step and being conveyed, to cool the lower side of the substrate, at a blowing portion provided adjacently to the wave soldering portion in the chamber, and an apparatus therefor.

Abstract: A jet nozzle structure for a soldering apparatus for soldering a local area of a substrate on which electric components are placed improves the soldering performance. The soldering apparatus includes a tubular body formed on a soldering bath filled with molten solder, an opening rim at a top of the tubular body forming a top opening to expose the molten solder for soldering electronic components placed on a specified local area of the substrate, and one or more flow openings which are established on a side wall of the tubular body at a position lower than the opening rim by a predetermined distance.

Abstract: A supporting tray for moving a PCB (10) in a wave solder machine includes a frame (30) and a circular plate (20). The frame includes a circular opening (33) defined thereof and a graduated scale (31) marked thereon around the circular opening. The circular plate includes a recessed portion (23). Two aligned pointers (21) are marked at two opposite outer sides of the recessed portion. In assembly, the PCB is fixedly received in the recessed portion of the circular plate. The combined PCB and circular plate is then rotatably received in the circular opening of the frame. Then the assembled PCB and the supporting tray are transported to a wave solder machine. The angle of the PCB with respect to a direction of flow of solder waves can be adjusted with an indication of the pointers and the scale. Consequently the optimal angle can be efficiently and accurately ascertained.

Abstract: An apparatus and method for eliminating dross in a solder pot of a soldering machine by converting the dross into usable solder. The conversion apparatus is comprised of an impeller, a shroud, an electric motor for driving the impeller, a vacuum source operatively connected to the shroud, an arrangement of guides immersed in the solder pot for recirculating liquid solder and a chemical de-oxidizing agent. The impeller and shroud are adjacent to a free surface of the dross which forms at the top portion of the liquid solder. The method includes the steps of adding a measured amount of de-oxidizing agent to the solder pot, agitating and recirculating the liquid solder/de-oxidizer mixture with the impeller to break-up the dross into smaller particles and separate the solder from the dross, and removing a residue of the dross by suction as the recirculating mixture passes beneath the shroud.

Abstract: Selective gas knives for wave soldering provide for targeted gas flow at a particular location on a substrate, such as a printed circuit board. Both the temperature and flow rate of gas through a segment of a gas knife can be independently controlled.

Abstract: A wave soldering apparatus includes a solder reservoir within which a pool of molten solder is held at a suitable temperature by heaters. Each heater has an electric heating element and a cover mounted to the solder reservoir to protect the heating element from the molten solder. A solder wave nozzle is submerged in the pool of molten solder and includes a nozzle housing within which a baffle is mounted, and a nozzle head mounted to the nozzle housing and having nozzle openings. An impeller pump includes an impeller housing communicated with the nozzle housing and an impeller connected to a motor. The impeller is driven to draw the molten solder into the impeller, pump the molten solder up through the nozzle housing and force the molten solder through the nozzle opening to form a solder wave through which a printed circuit board to be solder passes.

Abstract: A soldering machine includes a solder vessel, an electromagnetic pump, and a nozzle. The solder vessel stores molten solder, and the electromagnetic pump moves the solder by generating electromagnetic force. The electromagnetic pump is submerged below the liquid surface of the solder. The nozzle ejects the solder in the solder vessel onto an object, such as a printed circuit board. Accordingly, the generated heat from the electromagnetic pump is conducted to the solder in the solder vessel, and the solder can be heated to a higher temperature than in the conventional soldering machine.

Abstract: The present invention discloses an apparatus applied to the wave former of the wave soldering system to increase the wave height of molten solder. The apparatus comprises a block board and a gland, wherein the block board is mounted on the enclosing walls of the wave former to increase the total height of enclosing walls thereof for increasing the wave height, and the gland is disposed on the partial opening of the wave former to press the molten solder for have higher solder wave on other partial opening of the wave former uncovered by the gland.

Abstract: A supporting tray for moving a PCB (10) in a wave solder machine includes a frame (30) and a circular plate (20). The frame includes a circular opening (33) defined thereof and a graduated scale (31) marked thereon around the circular opening. The circular plate includes a recessed portion (23). Two aligned pointers (21) are marked at two opposite outer sides of the recessed portion. In assembly, the PCB is fixedly received in the recessed portion of the circular plate. The combined PCB and circular plate is then rotatably received in the circular opening of the frame. Then the assembled PCB and the supporting tray are transported to a wave solder machine. The angle of the PCB with respect to a direction of flow of solder waves can be adjusted with an indication of the pointers and the scale. Consequently the optimal angle can be efficiently and accurately ascertained.

Abstract: A wave soldering apparatus includes a solder reservoir within which a pool of molten solder is held at a suitable temperature by heaters. Each heater has an electric heating element and a cover mounted to the solder reservoir to protect the heating element from the molten solder. A solder wave nozzle is submerged in the pool of molten solder and includes a nozzle housing within which a baffle is mounted, and a nozzle head mounted to the nozzle housing and having nozzle openings. An impeller pump includes an impeller housing communicated with the nozzle housing and an impeller connected to a motor. The impeller is driven to draw the molten solder into the impeller, pump the molten solder up through the nozzle housing and force the molten solder through the nozzle opening to form a solder wave through which a printed circuit board to be solder passes.

Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material. In the flow soldering process, thermal efficiency of flow soldering is improved in preheating step and/or solder material supplying step thereof. In one aspect of the present invention, a heating cover is located above a preheater, and the flow soldering is conducted while the board passes between the heating cover and the preheater. In another aspect of the present invention, a gap between a preheater and a solder bath is 20 to 60 mm. In yet another aspect of the present invention, a distance between a primary wave and a secondary wave is not larger than 60 mm.

Abstract: A method for fabricating a printed circuit board assembly comprising a via, wherein the method inhibits the flow of molten solder into the via during a wave soldering step, thereby preventing heat transfer that might otherwise degrade a solder joint at a top pad that is thermally coupled to the via. The method comprises the steps of: (1) fastening a bottom component to the bottom surface of the circuit board by a screening and reflow of solder paste that also generates a solder plug in the via; (2) fastening top components to the top surface of the circuit board by a screening and reflow of solder paste, wherein the top components comprise ball grid arrays and other surface mount devices that are to be affixed to pads which are connected to vias; and (3) wave soldering the bottom surface to affix additional components onto the circuit board, such as pin-in-hole components placed on the top surface.

Abstract: A new solder bath apparatus applied to the soldering furnace is disclosed herein. The solder bath is used for containing molten solder. And a nozzle base is located in the solder bath to flow molten solder upwards. An enclosing frame with axial horizontal pillars mounted on the two terminal sidewalls thereof is put around the nozzle base. Besides, a nozzle manufactured with two bearing pedestals on two terminal sidewalls responsive to the pillars is put around the enclosing frame. Thus, the nozzle can rotate about the axial pillars for adjusting the outlet direction thereof.

Abstract: An adjustable nozzle of a stannic furnace comprises a nozzle tank which is mounted at the upper portion of a stannic tank of the stannic furnace, a front backflow stopper and a rear backflow stopper which are respectively mounted at the forward area and the backward area inside the nozzle tank to form an opening of the nozzle such that a liquid tin within the stannic tank passes through the nozzle tank and produces a tin wave at the opening of the nozzle. The feature of the adjustable nozzle lies in that the rear backflow stopper is mounted at the backward area inside the nozzle tank by means of a rear combining means which adjusts the altitude of the rear backflow stopper with an altitudinal opening and fixes the rear backflow stopper by a fixing means so as to control the waveform of the tin wave produced by the nozzle of the stannic furnace.

Abstract: A soldering method including: bonding a first electronic component having electrodes plated with a material containing lead to one surface of an interconnect substrate through solder containing no lead; and flow-soldering to bond a second electronic component to the other surface of the interconnect substrate. In the soldering method, a joint section between the first electronic component and the interconnect substrate is heated at the same time as or after the step of flow soldering to melt the joint section.