Abstract: The wave barrier device of the invention comprises a flap which is rigidly joined to the soldering machine. This flap plunges lightly into the molten tin bath and pushes it before the board which is precedes.

Abstract: An apparatus for soldering printed circuit boards moving along a predetermined path of travel, comprises an upwardly extending nozzle member having an opening at its top end from which molten solder is caused to overflow to form an overflowing molten solder with which the underside surface of the printed circuit board is contacted, and an adjustable outlet member rotatably disposed in the opening to define an outlet extending in the direction transverse to the path of travel, so that by adjusting the angular position of the outlet member the orientation of the outlet may be varied for adjustment of the direction and height of the overflowing solder.

Abstract: Fluxing station (34) has a flux dispenser (52) where liquid flux cascades down steps (88, 90). Circulating pump (46) draws liquid flux from a reservoir (54) below the steps and recirculates it to cascade down the steps. There is provision to add makeup flux from reservoir (38) or supply a cleaning liquid such as alcohol from reservoir (37) to clean the circulating system. A drain (62) is provided. Electrical components can be positioned with their leads on the steps so that liquid flux cascades thereover for accurately fluxing only the ends of the leads. Two or more pairs of steps, with different spacing, may be provided to accommodate components of different lengths.

Abstract: An apparatus for the application of a conductive adhesive medium in a fluid state to a side of a printed circuit board bearing electronic components is disclosed. The apparatus generally comprises a hollow shaft standing in a supply tank for the adhesive medium in an obliquely rising conveyor belt for at least one circuit board at a time. The upper end of the hollow shaft has two overflow edges arranged perpendicularly to the direction of transport for the formation of a wave, through the crest of which the side of the card previously moistened with a flux, is passed.

Abstract: At least one chip type component is soldered to a printed circuit board by independent first and second nozzles which spout molten solder so as to form respective first and second solder waves, with the printed circuit board sequentially passed through the first and second nozzles. The first and second solder waves define therebetween a space and flow at least in a direction of movement of the printed circuit board and in a direction counter to the direction of movement of the printed circuit board, respectively. The second nozzle is disposed at a level higher than the first nozzle such that the printed circuit board is moved obliquely upwardly.

Abstract: This invention relates to an improved process for application of a metal-comprising coating to a metal-comprising surface without using a flux. The metal-comprising surface must be wettable by or become wettable upon contact with a bath of the metal-comprising coating. Application of the coating is carried out in an environment which is inert at least with respect to the coating material during the time period of its application to the metal-comprising surface, and preferably inert with respect to both the coating material and the metal-comprising surface. The inert environment temperature is sufficiently low that no damage is done to the metal-comprising surface and no damage is done to other materials adjacent to the metal-comprising surface.

Abstract: To match the soldering of an assembled printed-circuit board (13) to its assembly configuration, the circuit board (13) is brought in contact with a soldering wave (21) for a first time along a predetermined path (57, 58), and thereupon the circuit board is rotated about a vertical axis and is brought into contact, preferably with the same soldering save (21), a second time, along predetermined paths from the same direction during its motion along the paths (57, 58). The printed circuit board (13) may be rotated by an angle (.alpha.) depending on the assembly configuration relative to the direction of flow (56) of the soldering wave (21).

Abstract: A fountain-type soldering apparatus is disclosed, which comprises:an outer tank which contains molten solder;a nozzle which is immersed in said molten solder in said outer tank, said nozzle having a longitudinally-extending discharge port which extends above the surface of said molten solder and having two end panels at the opposite ends of said nozzle which form the end walls thereof, each of said end panels having a through opening formed therein;a moving body which is disposed in said discharge port and which extends for the length thereof, the opposite ends of said moving body passing loosely through said through openings in said end plates; andsupport means for supporting each end of said moving body such that said moving body can oscillate vertically therein.

Abstract: An improved method and apparatus restricts or limits dross formation in a soldering apparatus where liquid solder overflows such as wave soldering and the like. The improvement comprises a solder receiving tray positioned beneath at least a portion of liquid solder falling from an overflow or solder wave to a reservoir and a level control means limits the maximum solder level in the tray above a dynamic solder level in the reservoir, the solder level in the tray being a predetermined distance below the overflow to limit dross formation thus restricting dross recirculation.

Abstract: A pallet for conveying a plurality of ceramic leadless chip carriers (LCC) through an automated wave soldering machine. The pallet includes recesses formed to receive and contain the LDD's with the lid of the LCC facing into the recess. This results in protecting the lids from the molten solder. Additionally, the recesses are formed in a diamond orientation with a solderable pin placed at the trailing apex of each recess. Both the pin and the diamond orientation prevents solder build up on the trailing conductive pads, resulting in enhancing the coplanarity of the solder on the pads.

Abstract: A foam fluxer for fluxing surface mounted devices on printed wiring boards is suitable for low solids content fluxes. The foam fluxer is for installation in an open tank containing liquid flux positioned under a conveyor path conveying the components. The fluxer comprises an aerator chimney housing with side walls and end walls for placement in and protruding above the open tank, the housing having a top foam outlet for positioning below the conveyor path, at least one vertical internal divider located in the housing below the foam outlet, the divider forming at least two chambers, and a porous aerator tube located in each chamber with connection means for a compressed gas supply to produce foam in each chamber, the foam from each chamber joining above the divider to exit upwards from the foam outlet.

Abstract: A soldering apparatus comprising a soldering station (10) with a system for producing at least one soldering wave (P2, P3) and a transport device extending above the soldering station (10). Several resilient supporting elements (18) are arranged in one or more rows at right angles to the direction of transport (P1) for resiliently supporting a printed circuit board (24) to be subjected to a soldering treatment. Due to the supporting elements (18), sagging of the board (24) and flushing of the board with solder are avoided (FIG. 3).

Abstract: A soldering machine with two parallel guide profiles for revolving chains provided for with soldering fingers, include a succession of a fluxer, a preheater and a solder bath along with the guide profiles extend. One profile is mounted fixed laterally above the succession and the other is adjustable directly above the succession. Thereby the adjustable guide profile is heated up more, especially under the action of the preheater, whereby, due to elongations of the guide profile, problems arise in the conduction of printed circuit boards held at the revolving chains by means of soldering fingers. To eliminate this problem, the invention provides that each guide profile is provided with at least one longitudinally extending coolant duct and that each coolant duct is connected to a pump for a coolant. Thereby the temperature actions on the adjustable guide profile 5 are compensated.

Abstract: The present invention is directed to a method for soldering each of a plurality of members (40), arranged in one or more parallel rows, to a separate one of a plurality of metallized pads (42) on a substrate (10), each pad being contiguous with a corresponding member. The method is initiated by tilting the substrate so that one end of each row of members and the metallized pads contiguous therewith are at a higher elevation than the other end. A stream (80) of molten solder and a dripping stream (88) of flux droplets are directed onto the substrate into the regions where the members are contiguous with the metallized pads. Simultaneously, the substrate is displaced relative to the streams along a path (96) inclined with respect to the horizontal and parallel to the rows of members so that the members and the metallized pads are successively coated with solder and then flux.

Abstract: A soldering device wherein the article to be soldered is moved into contact with molten solder which flows in the direction counter to the direction of movement of said article is characterized by including a nozzle for flowing said molten solder and a flow path of a channel shape provided contiguous thereto for circulating said molten solder flowed out of said nozzle, said flow path having side-wall plates which are vertically adjustable.

Abstract: A method for removing excess solder from a printed circuit board is practiced by mixing a quantity of ceramic beads with an oil to form a fluidized bed mixture. The fluidized bed mixture is heated to a temperature above the melting point of a solder on the printed circuit board. A surface of the printed circuit board to be cleaned is placed in contact with the heated fluidized bed and agitated against the bed to remove excess solder.

Abstract: A processing vessel has two adjacent tanks each holding different electronic liquids. When heated the first will generate saturated vapor having a temperature below the liquidus temperature of eutectic solder and the second, when heated, will generate saturated vapor having a temperature above the liquidus temperature of eutectic solder. Work product is sequentially passed through these vapors and is first preheated and then reflowed.

Abstract: An apparatus for reflowing solder terminals that join an electronic element to a support substrate, which apparatus includes (1) a stage for supporting the substrate, (2) a quantity of liquid capable of being heated to a temperature in excess of the melting point of the solder of the solder terminals, (3) a means to contact a surface of the substrate with the liquid, including a reservoir for maintaining the liquid, and a pumping means to move the liquid from the reservoir into contact with the surface of the substrate, and (4) a means to control the temperature of the liquid when in contact with the substrate to initially increase the temperature of the liquid, and subsequently reduce the temperature of the liquid.

Abstract: A soldering apparatus is disclosed having a first vessel through which printed circuit boards are transferred for soldering by a combination of a solder wave and hot vapors of a heat transfer liquid, a second vessel in which heat transfer liquid is heated and vaporized, a gas feed conduit extending between the first and second vessels and having a pump for feeding the vapors produced in the second vessel to the first vessel, and a liquid recycling conduit extending between the first and second vessels and having a pump for recycling heat transfer liquid formed by the condensation of the vapors and collected in the first vessel to the second vessel.

Abstract: The invention concerns a wave soldering device with a heated tub that accommodates molten solder, which is suctioned out of the tub by at least one pump and forced back into the tub through at least one nozzle to create at least one wave that falls back into the tub, with a layer of oil hat covers the surface of the solder in the tub, with an oil reservoir and oil cleaner, with a tub lip associated with the oil reservoir, and with an oil pump that communicates at the vacuum end with the oil reservoir and at the pressure end with the tub through an oil supply and associated heat exchanger.

Abstract: Desired control of the thickness and composition of a solder coat on the J-leads of an integrated circuit Quad package is obtained by orienting the packages while being solder coated in a "leads-up" orientation as a series of strips mounting the packages are passed through a solder wave of a wave soldering apparatus on a pallet. The Quad or other shaped integrated circuit or other electronic packages which have leads extending exteriorly thereof, thus have the critical lead crest portions coated with substantially the same solder layer thickness and composition. This permits reliable electrical connections between the crest portions of the leads and printed circuit board metal traces (metallization), particularly in surface mounting of the package to a printed circuit board. An additional feature of the invention is a pallet for holding a series of package-holding elongate frames which pallet is used for conveying the packages through the wave soldering apparatus.

Abstract: A set of titanium guide bars are shaped with inner angular finger shields to isolate designated underside edge areas of a printed circuit board being conveyed across a molten solder bath in a wave solder machine.

Abstract: A soldering system for applying molten solder to a work product. The system includes a solder applicator having a cylindrical barrel having an elongated orifice wall extending parallel to the axis of the barrel and a nozzle secured to the barrel. The nozzle which has an elongated orifice surface can be from a first position whereat the orifice surface and the orifice wall define an elongated orifice having a selected opening to a second position whereat the opening is substantially enlarged.

Abstract: Apparatus for the continuous hot tinning of printed circuit boards includes conveying rollers for passing the circuit boards through the apparatus, and a trough for accommodating the molten tin, together with nozzles for applying tin from the trough to appropriate locations on the circuit boards. A hollow column is disposed at at least one side and preferably at both sides of the path of conveying movement of the circuit boards through the apparatus, with the open lower end of the or each column dipping into the trough so as to be below the level of the molten tin therein. Tin is pumped from the trough through the columns by pumps at the lower ends thereof, and then to the nozzles arranged above and below the path of conveying movement and directed so as to spray molten tin on to the printed circuit boards. In a process using the apparatus for soldering the connecting pins of components to a circuit board, molten tin from a trough is sprayed against the underside of the board at the appropriate locations.

Abstract: In a wave soldering apparatus including a station for forming a standing wave of foamed flux, a preheater station, and a standing wave of hot molten solder station, a flux removing apparatus for reducing the thickness of flux on a coated printed circuit board includes an apertured pipe for gently blowing a plurality of streams of air against the foam coated board, the streams acting effectively as a continuous linear stream of air. The airstreams also blow the foamed flux into apertures in the printed circuit board.

Abstract: In a soldering apparatus a pump pumps molten solder up into a tube to form a head of molten solder. Solder is fed from the tube through a conduit to a nozzle for a soldering operation. The pump comprises a rotatable shaft extending within the tube and an air tight seal is formed between the shaft and tube, above the level of the solder, to reduce the formation of dust of oxidized solder at the region of shear between the shaft and the solder surface.

Abstract: A system for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct one or more controlled and defined streams of solder onto the product. A vessel is provided for containing a heated saturated inert vapor into which the product is introduced prior to solder application. One or more nozzles are disposed within the vessel for directing one or more streams of molten solder to the heated product. The heating and soldering operations are separately controllable and are each substantially independent of the control of the other.

Abstract: A system for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct one or more controlled and defined streams of solder onto the product. A vessel is provided for containing a heated saturated inert vapor into which the product is introduced prior to solder application. One or more nozzles are disposed within the vessel for directing one or more streams of molten solder to the heated product. The heating and soldering operations are separately controllable and are each substantially independent of the control of the other.

Abstract: An automatic soldering apparatus and method thereof is described, wherein a flux is heated up to a predetermined temperature, and is then contacted to a face of a printed base board to thereby coat the base board and to simultaneously heat the latter with the heated flux and then the heated base board is contacted to a melted solder, and wherein provided in combination are apparatus for transporting the base board, apparatus for coating the base board with the heated flux, the flux coating apparatus including a tank in which the flux is stored, heating elements for heating the flux up to a predetermined temperature such that the heated flux is coated on the face of the base board, the heated flux simultaneously heating the base board when the latter is transported to the flux storing tank, and apparatus for soldering the flux coated and heated base board, the soldering apparatus including a tank in which a melted solder is stored which is contacted to the base board when the latter is transported to the tank,

Abstract: Solder flux is applied to the face of a printed circuit board (24) or the like by flowing a foam (30) of liquid flux bubbles upwardly through the top of a chimney flue (10) and into contact with the board face which is top passed over the top of the flue. The size of bubbles adjacent the face of the board is controlled by placing a grid screen (26) within and immediately beneath the top of the flue. The openings (26a) in the grid screen allow passage therethrough of smaller bubbles (34) but prevent passage of larger bubbles (32). The force of the board face on the foam urges the larger bubbles downwardly into contact with the grid screen where the grid wires of the screen pierce and thereby break the larger bubbles into smaller bubbles which then rise to the face of the board.

Abstract: Wave soldering process and apparatus for the soldering of elements such as, for example, printed circuit assemblies with surface mounted components and the like which yield improved soldering results by promoting the penetration of solder into narrow spaces between components, the filling of small holes in a board, filling crevices, filling corners adjacent to solder masks and all other areas where solder wetting is difficult to achieve with conventional machines. The process provides the steps of moving an element in a predetermined path, forming a solder wave beneath the path so that at least a portion of the element passes through the solder wave, and producing an oscillation in the solder wave during the passage of the element therethrough.

Abstract: A soldering mask for use with a wave soldering machine. The soldering mask is formed into a trough-like shape which is positioned in the machine to displace molten solder away from the part of the work which is not to be soldered. The mask is made of titanium and includes positioning members to accurately position the mask between the part to be free of solder and the wave of molten solder.

Abstract: A machine for soldering a work product. Work product is conveyed through the machine and an applicator directs an extended liquid stream against the conveyed work product. The applicator is rotatable about a horizontal axis and a rotatable manifold assembly delivers liquid to the applicator and the manifold assembly is rotatable about an axis parallel to the axis of the applicator means and is rotated by a bell crank which is supported for rotation about the axis of the manifold assembly and a link member which is pivotally connected between the bell crank and the applicator with the points of interconnection defining with the axes of rotation of the applicator and the manifold assembly a parallelogram so that rotation of the bell crank will rotate the applicator means.

Abstract: A vapor phase soldering apparatus for soldering printed circuit boards, including a vessel for containing a heat transfer liquid, partition plates provided within the vessel for dividing the inside space of the vessel into inner and outer chambers which are in fluid communication with each other at upper and lower portions of the partition plates, a heater provided in the inner chamber to heat and to vaporize the heat transfer liquid in the inner chamber, a cooler provided within the outer chamber to cool and to condense vapors of the heat transfer liquid in the outer chamber, and a conveyor for conveying printed circuit boards through the vessel, whereby the printed circuit boards are soldered in the inner chamber by contact with the vapors of said heat transfer liquid, and the vapors escaped from the inner chamber to the outer chamber are condensed in the outer chamber and recycled to the inner chamber.

Abstract: A soldering system is described in which a fluid stream is directed onto a solder board substantially immediately following the deposition of molten solder onto the boards. The apparatus includes a pair of concentric slotted tubular shells wherein one shell rapidly rotates relative to about the other to create a plurality of different angles of impingement of the air on each area of the bottom surface of the circuit board.

Abstract: A machine for soldering a work product. A solder applicator is located within a zone of saturated vapor to direct an extended stream of molten solder against a work product conveyed through the machine. Molten solder can be drained from the applicator by pivoting the applicator about a horizontal axis to a drain orientation. The applicator includes an end plate having an axially extending hole communicating with the lowermost portion of the solder within the applicator when the applicator has the drain orientation and the applicator includes an end plate having a hole extending axially therethrough at a location in alignment with the applicator end plate hole when the applicator end plate has the drain orientation. The applicator end plate hole is sealed when the holes are not in alignment.

Abstract: Automatic wave solder apparatus in which printed circuit boards are passed over a wave soldering section to apply solder to exposed metallic surfaces on the undersides of the surface of the board. A weir is attached to the exit side of a discharge nozzle for the solder wave which is spring loaded upwards for engagement with a stop member. The solder pot assembly may be lowered and swung out of a circuit board conveyor path for cleaning and both front plate and rear plate members on each side of the discharge nozzle are hinged so they can be raised for cleaning when the solder pot assembly is lowered. The stop member permits the discharge nozzle to be raised to different heights, but retains the spring loaded weir at the same height.

Abstract: A soldering system is described in which a fluid stream is directed onto a solder board substantially immediately following the deposition of molten solder onto the boards. The impinging fluid stream is rapidly oscillated to create a plurality of different angles of impingement of the air on each area of the bottom surface of the circuit board.

Abstract: The present invention relates to a device for generating a wave of solder in a wave soldering machine used for soldering components on printed circuit boards passing through the machine, said device being equipped with a nozzle comprising an elongated chamber with convergent walls and a discharge opening at its upper part, which opening extends below the displacement path of the printed circuit boards and through the entire width of said path, said nozzle, which is connected with a reservoir supplying liquid solder and equipped with heating elements, being designed to send an upwardly directed stream of solder which forms a wave, the said wave licking the lower face of the printed circuit boards and the components leads protruding therefrom. Said device is equipped, close to the opening of the nozzle, with at least one auxiliary heater capable of heating up the solder in the vicinity of the wave and to keep its temperature there to a value higher than a given value.

Abstract: A soldering apparatus comprises a solder bath, an applicator for applying solder to a joint or the like to be soldered and a pump for pumping solder substantially continuously through the applicator. The applicator is movable vertically relative to the solder bath to solder a joint positioned above the bath.

Abstract: Failure of an electronic component (18) during soldering of leads (16--16) thereof to a substrate (12) can be reduced by directing a gas such as air across the top surface (13) of the substrate against the leads. The gas directed against the leads serves to drive off corrosive flux vapors which would otherwise migrate upwardly along the leads causing corrosion thereto and failure of the component.

Abstract: Automatic wave solder apparatus having a fluxer section, preheater section and wave soldering section through which circuit boards are passed by a conveyor. All of the major process parameters are monitored by a microprocessor. One specific parameter controlled is the temperature of the boards exiting from the preheater system. Preheating is carried out by two axially spaced banks of heaters, the upstream one supplying the major quantity of heat and the downstream one supplying sufficient heat to boost the temperature to the desired value. A pyrometer located in the zone between the two banks of heaters measures the heat radiated from the boards and this information is converted by the microprocessor to an appropriate instruction to the second bank of heaters. The soldering section has a solder pot assembly particularly adapted to the automatic nature of the apparatus. The pot can be jacked to the correct height according to the length of leads projecting from the boards under control of the microprocessor.

Abstract: Wave soldering machine of the type comprising a frame, at least one solder pot mounted on the frame and equipped with a nozzle designed to produce a wave of solder, a conveyor mounted on the frame and designed to carry the printed circuit boards along a substantially linear path, and a device for adjusting the height of the solder pot, thus permitting the adjustment of the height of the wave with respect to the path, machine wherein the frame comprises a moving track of general direction similar to that of the conveyor and on which is mounted the solder pot, the path and track forming together a predetermined angle of small value, and the track having an inclination as small as possible with respect to the horizontal, and a device for adjusting the position of the solder pot along the moving track.

Abstract: An apparatus for holding an IC device for tinning the leads in a wave soldering machine is disclosed. The apparatus utilizes a pair of beveled surfaces, one on each side of the lead to be tinned, to limit the extent of penetration of the lead into the molten solder. The beveled surfaces are made of a material which cannot be wet by the molten solder, therefore, surface tension of the solder will tend to limit penetration of the molten solder into the area defined by the beveled surfaces.

Abstract: In a process for wave soldering a work-piece in an atmosphere consisting essentially of air wherein (i) there is a first portion of the solder wave in which fluid motion can be observed, said first portion including an active dross forming area and (ii) there is a second portion of the solder wave, which is the last portion of the solder wave with which the work-piece comes into contact, the improvement comprising (a) subject to step (b), replacing the atmosphere in contact with at least about 50 percent of the surface of the active dross forming area with an inert gas; and (b) preventing the atmosphere in contact with the surface of the second portion from becoming inert regardless of whether the first and second portions overlap.

Abstract: The invention concerns preventing oxidation of printed circuit board metal surfaces as a result of heat produced in a solder bath arrangement and reducing thermal stress defects from occurring in the circuit carrier being soldered. An enclosed reaction chamber is provided with the solder bath and supplied with a pressurized atmosphere of inert gas which gas seals the reaction chamber from ambient air. The inert gas is discharged from jets against the solder side (the connector post side) of the printed circuit boards at a point upstream of the solder bath and the inert gas is at a temperature substantially higher than the solder bath temperature.

Abstract: This is a process relating to improvements in the soldering of headers to conventional radiators. Tubular members of the radiator extend through holes in the header. The tubes are initially sealed to the header with a solder having a high temperature melting point T.sub.1. Infrared heat heats the header to a temperature T.sub.2 which is less than T.sub.1 but above a lower temperature T.sub.3 which is the melting temperature of a second solder. Upon the header reaching a selected temperature T.sub.2, a selected amount of the second solder in a molten state is poured in the header to puddle the entire pan area of the header, and allowed to cool to form a very strong soldered connection.

Abstract: Device for soldering a printed board, equipped with a printed substrate conveyor, which effects soldering of chip parts on a printed substrate by moving the printed substrate through a molten solder wave formed by providing a nozzle in a solder tank accommodating molten solder, and a vibration imparter for giving vibration to the printed substrate when it is passing through the molten solder wave.

Abstract: For protecting the surface of a soldering bath a covering means is used which comprises two phases (3,4), which are placed one on top of the other, are not soluble in each other and are liquid at the soldering temperature. The bottom phase (3) is produced by spreading over the top phase (4), which consists of a liquid synthetic polyalphaolefin, a powder of a chemically active component of sebacic acid and/or suberic acid which is solid at room temperature and liquid at the soldering temperature.

Abstract: Apparatus for treating electronic components comprises a frame, a lower track mounted on the frame for supporting the components, and an upper track mounted on the frame in a normal operating position above and in spaced-apart parallel relationship to the lower track. The lower and upper tracks define therebetween a path along which the components can pass for treatment. Pusher fingers are provided each having a portion which extends substantially horizontally in such a manner as to be insertable between the tracks and engageable with individual ones of the components. A drive is mounted on the frame for propelling the fingers. The components are held captive between the lower and upper tracks, and the fingers engage individual ones of the components and propel them along the path.