Abstract: A flow of waste fused solder, which has been ejected from ejection nozzles 2, 3 but has not been effectively used during a soldering process, is received in troughs 10 provided on either sides of each of the ejection nozzles 2, 3. The flow of waste fused solder, containing therein oxides, is directed through the troughs 10 into a filtration chamber 13 defined in a vessel body 1. The flow of fused solder is filtrated by means of a partition plate 12 as it flows from the filtration chamber 13 into a solder reservoir 14, so that the oxides in the fused solder are removed. The troughs 10 do not become clogged with the oxides in the fused solder, since the top each of the troughs is opened. Due to an appropriate configuration of the partition plate 12, depending upon difference in specific gravity between the fused solder and the oxides, it is possible to effectively remove oxides from the solder ejection vessel.

Abstract: A cover or shroud extends over a solder reservoir and has a slot for a solder wave to protrude therethrough. Gas is provided to blanket the solder wave and the shroud is positioned to reduce solder from contacting elements that are conveyed through the solder wave. The devise comprises a solder reservoir having at least one solder nozzle projected therefrom, a pump for forming a solder wave from the nozzle, a cover for covering at least a portion of the reservoir containing the solder wave, the cover having a longitudinal slot for the solder wave to pass therethrough and contain solder splatter caused by the solder wave falling into the solder reservoir. A gas supply provides gas under the cover and also provides a gas blanket over the solder wave, and a conveyor moves the element in a predetermined path over the cover ensuring at least a portion of the element passes through the solder wave.

Abstract: A method and apparatus for soldering a workpiece in a non-oxidizing gas are achieved by comprising conveyors running in a substantially horizontal direction, for holding and moving a workpiece in the horizontal direction, a flux supplying unit for supplying flux to the workpiece, a solder bath including solder and disposed under the conveyors such that the workpiece with a parting portion parting from the top of solder flow is dipped in the top of solder flow, and jetting unit provided at an exit side of the solder bath with respect to the conveyors and connected to a non-oxidizing gas source, for jetting non-oxidizing gas from the non-oxidizing gas source into a region defined by the parting portion of the workpiece and a vicinity thereof.

Abstract: The invention relates to a soldering device comprising: a vessel opened at the top for filling with solder; at least two solder towers placed in the vessel, each adapted for delivering a flow of solder on their upper side; and a transporting member for carrying along the objects for soldering above the solder towers. In order to prevent, both in the case of soldering machines which operate in a normal atmosphere and those operating in an inert atmosphere, the solder flows falling back into the vessel from splashing solder up onto the underside of the printed circuit boards, the solder towers are adapted for generating jets directed toward each other, wherein the jets intersect before they make contact with the solder level prevalent in the vessel. According to a preferred embodiment the rear tower in the direction of movement forms a jet of solder comprising a movement component counter to the movement of the objects for soldering and enclosing an acute angle with the object for soldering.

Abstract: A hot air circulation apparatus and method for wave soldering machines which heats air from a high-pressure air source and directs it at the flux applied to a printed circuit board. The heated and pressurized air also circulates air within the wave soldering machine to force the moisture out. A plurality of hot air knives are mounted adjacent heaters within the wave soldering machine and are coupled to the pressurized air source. The hot air knives include a hollow metal cylindrical member which conducts heat from the heater, and contain a plurality of orifices which increase the pressure of the air and direct the air at the flux.

Abstract: Printed circuit boards are wavesoldered by a method featuring the use of a plurality of elementary jets of molten solder to form a single flat soldering wave. Such a single flat wave is achieved by revolving those jets in an orbital motion such that the orbital motion is in a horizontal plane substantially parallel to the printed circuit board. Such a method allows the removal of air/gas bubbles during wavesoldering from any side of a component that is attached to a printed circuit board.

Abstract: A cover plate extends over at least part of a solder reservoir and has a slot for a solder wave to extend up above the cover plate. Shield gas is supplied under the cover plate to blanket the solder wave and prevent air from contacting the solder wave and circuit boards passing through the solder wave. Circuit boards are generally supported by conveyor fingers at side edges and the fingers pass through the solder wave. End shrouds are provided at both ends of the solder wave to prevent the entry of air through the conveyor fingers and to ensure that the side edges of the circuit board are uniformly blanketed by shield gas directed to the side edges passing up through the slot in the cover plate. The under surface, front edge, back edge and side edges of a circuit board are therefore uniformly blanketed by shield gas as the board passes through a solder wave.

Abstract: A printed circuit board is provided with a solder pad configuration for wave soldering a surface mount device with its longitudinal axis in a direction perpendicular to the solder wave. A leading solder pad is not wider than the surface mount device. A trailing solder pad is wider than the surface mount device, thereby ensuring that the trailing pad is sufficiently wet by the solder wave.

Abstract: A splash protector assembly for printed wiring boards includes splash protector rails for permitting printed wiring boards to be coupled together without additional aids as they are conveyed in a given conveying direction across different conveying planes through soldering machines. The splash protector rails include successive front and rear splash protector rails as seen in the given conveying direction. Each of the splash protector rails are L-shaped and define a longer leg being in an upright position during use, and a shorter leg. Each of the splash protector rails have springs for clamping the printed wiring boards. The longer leg of the rear splash protector rail has hooks and the longer leg of the front splash protector has braces for hanging the rear splash protector rail from the front splash protector rail of the next printed wiring board, and the braces prevent the printed wiring boards from becoming unhung as they are conveyed across meeting points of the different conveying planes.

Abstract: A soldering apparatus includes a conveyor adapted to carry assembled circuit boards through a soldering chamber. A wave of solder is created in the chamber. The chamber has a curtain at its entrance and a curtain at its exit. Gas distributors are located within the chamber and are able to introduce nitrogen into the chamber in order to create a non-oxidizing atmosphere in the vicinity of the wave. In operation, the wave of solder wets connecting points between the components and the board to form permanent joints on solidification of the solder. The bottom edge of the curtain is of a shape complementary to the front elevation of the assembled circuit boards to be soldered and is arranged such that the circuit boards just pass thereunder without making contact with it.

Abstract: Wave soldering method and apparatus for fluxing a substrate in a low oxygen containing atmosphere, preheating the fluxed substrate at least partially in a non-low oxygen containing atmosphere, and soldering the preheated substrate in a low oxygen containing atmosphere.

Abstract: The invention relates to a wave soldering device in which solder is pumped up from a solder bath and through a tower and issues therefrom in the form of a wave which engages the underside of a circuit board, flows over a front and/or rear weir of the tower and returns to the solder bath. A conveyor transports circuit boards across the top of the tower and the solder wave. A confining structure is situated adjacent the wave and protrudes into the solder bath. A gas which substantially excludes oxygen is injected from a nozzle and follows a circuitous route bordered by solder in the bath, solder flowing over the rear weir, and walls of the confining structure. The gas exiting from an outflow opening of the confining structure is directed across the solder flowing over the rear weir and onto the downstream line of contact of the solder wave and the board as it leaves the solder wave.

Abstract: A cover plate extends over at least part of a solder reservoir and has a slot for a solder wave to extend up above the cover plate. Shield gas is supplied under the cover plate to blanket the solder wave and prevent air from contacting the solder wave and circuit boards passing through the solder wave. Circuit boards are generally supported by conveyor fingers at side edges and the fingers pass through the solder wave. End shrouds are provided at both ends of the solder wave to prevent the entry of air through the conveyor fingers and to ensure that the side edges of the circuit board are uniformly blanketed by shield gas directed to the side edges passing up through the slot in the cover plate. The under surface, front edge, back edge and side edges of a circuit board are therefore uniformly blanketed by shield gas as the board passes through a solder wave.

Abstract: A cover plate or shroud extends over a solder reservoir and has a slot for a solder wave to extend up above the cover plate. A reduced oxygen atmosphere is supplied from gas outlets under the cover plate on both sides of the solder wave. Furthermore a gas knife is located to direct a stream of gas on an element such as a circuit board as it passes through the solder wave. The cover plate or shroud provides reduced oxides on the solder surfaces and the gas knife removes excess solder on elements that have been solder coated. The apparatus has a solder reservoir for holding solder with a solder nozzle projecting therefrom and a pump for forming a solder wave from the nozzle. Two solder waves may be provided each with their own cover plate and gas supplied on each side of each wave below the cover plate.

Abstract: A preheater for a wave soldering machine has high volume convection heating permitting components on circuit boards to be heated to more uniform temperatures throughout the assembly and more rapidly without damage to the components, the assemblies or both. The machine comprises a conveyor for circuit assembly boards, a housing through which the conveyor passes having an entrance and an exit, and a plurality of heating zones in the housing extending along the conveyor. Dividers are provided between heating zones and apertured heating panels are disposed in each of the zones with a space behind each of the panels and a recirculating gap around each of the panels. A fan is positioned in the space behind each of the panels for recirculating gas, either air or inert gas through the panels and the recirculating gap.

Abstract: A solder nozzle to produce a smooth turbulent free solder wave has at least one air jet associated therewith to remove solder icicles and bridges that can form on the under surface of circuit boards and other elements. The circuit boards move in an upward inclined path in the direction of travel and after passing through the solder wave an air knife projects a non-oxidizing gas with sufficient force to remove excess solder. The soldering can occur in a non-oxidizing gas enclosure such as an inert gas, or a reducing gas, and vibrating the solder wave below ultrasonic frequencies can assist in the soldering.

Abstract: A horizontal solder leveller for applying solder to a board comprises: means 15.sub.u,15.sub.1, 16.sub.u ; 16.sub.1 ; 17.sub.u,17.sub.1 including a solder bath 1 for applying molten solder 2 to a board. means 47 for levelling solder applied to the board, including nozzles for directing solder-levelling air jets at the board, and means 19.sub.u,19.sub.1,48 for creating a dispersion of oil in an air stream from the levelling means, the oil dispersion means being provided between the solder applying means and the levelling means.

Abstract: Apparatus for soldering, leveling and cooling printed circuit panels including a preheater, a fluxer, and soldering, leveling and cooling stations. The cooperation of the soldering, leveling and cooling stations provides for efficient processing of printed circuit panels. The soldering station, which includes a solder immersion chamber through which the panels are conveyed, provides an oil coating on the solder to minimize formation of dross. Automatic replenishment of oil through use of suitable flux on the panels to be soldered provide continuous cleaning of the soldering system to permit extended operation. A cooling table transports the soldered panels on a cushion of air to prevent marring.

Abstract: Provided is an apparatus for circulating a body of molten solder. An enclosure, attached to the base of an impeller motor extends downward into the body of molten solder. A rotatable shaft, advantageously attached to the impeller motor by a flexible coupling device, extends through the interior of the enclosure, terminating beyond the open end of the enclosure and connected at that end to an impeller. A seal between the rotatable shaft and the open end of the enclosure acts to prevent solder from entering the interior of the enclosure. The seal is comprised of a self-lubricating material which expands as the temperature of solder increases, forming a solder tight fit between the rotatable shaft and the seal and further securing the exterior of the seal to the interior wall of the enclosure while permitting shaft rotation. The self-lubricating and high temperature characteristics of the sealing material preclude the production of by-products from wear by the rotatable shaft.

Abstract: A cover plate extends over a solder reservoir and has a slot for a solder wave to extend up above the plate, a gas excluding oxygen is supplied under the cover plate and flows up through the slot on both sides of the solder wave to blanket the solder wave. It has been found that oxygen content on the surface of the solder and on the solder wave is reduced so that clean oxide free soldering occurs. The apparatus has a solder reservoir for holding solder with a solder nozzle projecting therefrom, a pump for forming a solder wave from the nozzle, a cover plate for covering at least a portion of the reservoir having a longitudinal slot for the solder wave to pass therethrough. Provision is made for supplying pressurized gas, which is oxygen free, to pass upwards through the slot on both sides of the solder wave to provide a gas blanket over the solder wave, and a conveyor conveys elements to be soldered to pass through the solder wave.

Abstract: A jet solder bath is comprised of a bath unit which contains a molten solder, a nozzle member provided within the bath unit and constructing a nozzle mouth, a tank provided in at least one side of the nozzle member along the nozzle mouth and temporarily accumulating a solder jetted from the nozzle mouth, and a molten solder outlet provided on the lower portion of the tank and communicating the tank with a molten solder still area provided within the solder bath unit under the liquid level of the molten solder. According to the above-mentioned arrangement, the molten solder can be suppressed from being oxidized as much as possible and the removal of a resultant oxide can be facilitated.

Abstract: An apparatus for stiffening a circuit board during soldering, assembly, and repair/rework, which includes an elongated crossmember having two opposing ends, an outer support leg extending downward from each crossmember end to form a bridge support with the crossmember and a central support leg extending downward from a central portion of the crossmember. A central portion of the circuit board is attached to the central support member to prevent the circuit board from softening and sagging when exposed to the heat from soldering.

Abstract: A short hood for enclosing and providing a protective atmosphere over not more than the solder pot of a machine for wave soldering printed circuit boards. Other operative areas of the machine are exposed to air. The entrance and exit openings to the hood for the circuit boards are covered by electrically conductive curtains of thin material cut into vertical strips. The process employs a thin layer of no-clean flux and allows up to 5% oxygen content in the protective atmosphere.

Abstract: This invention relates to an apparatus for coating solder on the outer leads of TAB-type semiconductor devices. The solder coating apparatus comprises a solder tank accommodating a heater, a discharge tank having an open top and a solder inlet opening at a lower part thereof, a square pillar having a top of substantially the same or slightly greater size than a semiconductor element and arranged inside the discharge tank and projecting beyond the open top thereof, and a solder pressure feed screw near the inlet opening of the discharge tank. A film carrying semiconductor elements is intermittently stopped when one of the semiconductor elements arrives above the square pillar. Molten solder is discharged from gaps between the inner walls of the discharge tank and the square pillar onto the outer leads of the semiconductor element positioned over the pillar.

Abstract: A device for providing a non-oxidizing atmosphere above a soldering bath in a vat of a machine for wave soldering, includes a hooding assembly closing the vat, an inner space and a conveyor for electronic circuits extending through the inner space. The inner space is separated from the surrounding atmosphere through seals disposed along the path of the circuits. There is structure for providing and maintaining a non-oxidizing atmosphere in the inner space, for example an inert gas or a mixture of inert and reducing gas.

Abstract: A machine for soldering printed circuit boards and the like includes a housing enclosing an outer process chamber having a soldering station and fluxing station enclosed therein and an inner heating chamber, in combination with input and output transport conveyors on which the circuit boards enter and exit the housing. The heating chamber includes an elevator rack assembly which transports a succession of circuit boards vertically between the input and output conveyors while subjecting the circuit boards to controlled heating. The heating chamber may also be supplied with an inert or reducing gas to facilitate or eliminate fluxing requirements. The environment within the housing is maintained by air lock doors.

Abstract: An apparatus for solder joining metal tapes to form laminated metal tapes comprises a channel means having a base, and sidewall means extending therefrom to a cover extending over the sidewall means. The sidewall means define converging channels having an entrance end for admitting the tapes spaced apart, and an exit end where facing tape surfaces can come into contact. The sidewall means separate the base and cover by a distance selected to align the tapes in the width dimension. The cover having a first section extending from the exit end, and a second section extending from the first section to the entrance end, the second section being formed with a cavity facing the channel that permits a solder flow therethrough that minimizes accumulation of particles in the channels. A solder duct means mounted on the channel means for directing molten solder into the channels to flow from the exit end to the entrance end. The solder duct means having a slot extending therethrough and aligned with the exit end.

Abstract: Two opposing hollow non-turbulent solder waves are provided which project inwards and solder is collected in a containment area. The two solder waves can have different flows and pressures, the first solder wave flooding the underside of a circuit board or other item and the second solder wave reducing a build up of solder. The soldering apparatus has a solder tank with a conveyor to convey items to a first solder wave and to a second solder wave. A solder containment area is provided between the two solder waves which receives solder from the solder waves and feeds the solder back into the solder tank.

Abstract: The selective wave soldering apparatus (101) of the present invention permits wave soldering of select components on a printed circuit board. This is accomplished by narrowing the flow of solder from the wave solder apparatus and creating the proper back pressure on two sides of the flow to form the proper height wave. The back pressure is created by an extended, angled lip (102) on one side and a trough (103) on the side opposite the lip. The trough (103) is open on top and has small openings in one end to slow the flow of molten solder from the trough (103).

Abstract: A wave soldering apparatus and process occurs in an atomsphere which substantially excludes oxygen. By providing a gas blanket over the solder, reduction in dross occurs and improved soldering results avoiding the necessity of removing flux residues. Gas diffusers are provided on both sides of a solder wave in an enclosure, the diffusers are placed below the path of the element to be soldered and a further gas diffuser is positioned above the element to be soldered. The gas diffusers supply a calm gas blanket over the solder wave so no turbulent movement of gas occurs within the enclosure.

Abstract: An apparatus for solder joining metal tapes to form laminated metal tapes comprises an alignment box having a base and a sidewall means extending therefrom to define a tapered inner channel extending through the box. The tapered channel having an entrance end and narrowing to an exit end. At least one tapered wall extending from the base and within the inner channel to define subchannels that are spaced at the entrance end and converge into the inner channel before the exit end. The sidewall means and tapered wall extending from the base to respective wall tops, and a cover extending over the channel and subchannels is mounted on the wall tops. The base, sidewalls, inner wall, and cover being configured to form the channel and subchannels to have a first preselected distance between the base and cover that is greater than the width of the tapes.

Abstract: An apparatus for selectively tinning a zone of a plurality of leads overhanging a window of a substrate for a very large scale integrated circuit is provided, which employs a vise made up of a pair of hollow jaws forming a shaft when the jaws are in clamping position, wherein the shaft communicates with a supply of tin, a wave of tin being provided through the shaft to bathe the zone of the leads to be tinned, the apparatus further being adapted to send a jet of gas to the tinned zone of the leads.

Abstract: An apparatus and a method for applying a solder material to a square leadless chip carrier using a solder wave technique. The carrier is placed on a pallet so that one side of the carrier forms an angle of 45.degree. to the direction of travel of the solder wave. The carrier has attachment pads spaced equidistantly around a peripheral surface thereof, and the carrier is retained on the holder so that the attachment pads are positioned adjacent the solder material. A solderable pin is positioned on the holder behind the carrier, when considered in the direction of movement of the pallet. One pin is necessary for each of the last pads to be soldered. The pin extends from the surface of the carrier a distance substantially equal to the distance the carrier extends from the pallet surface, and the area of the pin corresponds substantially to the area of a pad.

Abstract: A tunnel for fluxless soldering, is a straight linear tunnel which contains vibrating means to vibrate a solder wave and a non-explosive gas atmosphere. The gas atmosphere includes a small portion of hydrogen or other gaseous reducing agent, sufficient to achieve a fluxing action. A process for soldering an element comprises the steps of conveying the element through a tunnel containing a non-explosive gas atmosphere substantially excluding oxygen, heating the element in the tunnel, soldering the element, and retaining the element in the gas atmosphere of the tunnel until solder on the element has solidified.

Abstract: A wave soldering apparatus and process occurs in an atmosphere which substantially excludes oxygen. By providing a pressurized effect on an element to be soldered while passing through a solder wave, fluxless soldering is accomplished avoiding the necessity to remove flux residues. The element is preheated in a shield gas atmosphere substantially excluding oxygen, moved in a predetermined path so that at least a portion of the element passes through the solder wave which is oscillated while the element is in the solder wave and maintained in the shield gas until solder on the element has solidified.

Abstract: An apparatus for soldering, leveling and cooling printed circuit panels including a preheater, a fluxer, and soldering, leveling and cooling stations. The cooperation of the soldering, leveling and cooling stations provides for efficient processing of printed circuit panels. The soldering station, which includes a solder immersion chamber through which the panels are conveyed, provides an oil coating on the solder to minimize formation of dross. Automatic replenishment of oil through use of suitable flux on the panels to be soldered provide continuous cleaning of the soldering system to permit extended operation. A cooling table transports the soldered panels on a cushion of air to prevent marring.

Abstract: An automatic soldering method and the apparatus thereof is disclosed, wherein a transporting device progressively moves up a horizontal position of a base board as the latter is transported to be soldered in a direction from a base board entrance side to a soldered base board exit side of a base board transporting path. An elongated molten solder storing tank is arranged laterally of the base board transporting path. The solder storing tank has an elongated molten solder jetting nozzle located therein and is inclined in a horizontal plane with respect to a base board transporting direction. An operating device is provided to adjust an inclination of the base board in a vertical plane intersecting the base board transporting direction such that a distance between a lower side of the base board and a top end of the molten solder jetting nozzle is constant all through the length of the nozzle as the base board is transported past over the nozzle.

Abstract: Apparatus for soldering, leveling and cooling printed circuit panels including a preheater, a fluxer, and soldering, leveling and cooling stations. The cooperation of the soldering, leveling and cooling stations provides for efficient processing of printed circuit panels. The soldering station, which includes a solder immersion chamber through which the panels are conveyed, provides an oil coating on the solder to minimize formation of dross. Automatic replenishment of oil through use of suitable flux on the panels to be soldered provide continuous cleaning of the soldering system to permit extended operation. A cooling table transports the soldered panels on a cushion of air to prevent marring.

Abstract: Apparatus for coating the endmost threaded section of a pipe with corrosion resistant powder coating material by rotating the pipe and spraying the section to be coated with electrostatically charged, air-entrained powder through two stationary nozzles, one of which is directed at the section to be coated, and the other of which is directed at the chamfered end of the pipe. To prevent overspray of the powder from contacting the pipe adjacent to the area to be coated, a pair of air nozzles are directed at the area of the pipe adjacent to the area to be coated.

Abstract: An automatic jet soldering apparatus comprising: a solder bath for holding molten solder therein; a nozzle body having an open top and an open bottom through which the molten solder rises from the solder bath; a punched panel having numerous holes and disposed inside of the nozzle body in such a way to be opened and closed; and a jet source connected to the lower part of the nozzle body, the molten solder rising upward through the nozzle body via the open bottom and the open top of the nozzle body by means of jet power from the jet source. The soldering apparatus further comprises a back rectifying plate mounted on the rear portion of the top opening of the nozzle body, the sloping angle of the back rectifying plate being adjustable, thereby attaining an easy removal of solder residues from the punched panel and achieving a zero relative speed between a printed circuit board and the solder flow velocity, so that the reliability of soldering can be enhanced.

Abstract: Apparatus for automatically tinning leads of components mounted on tapes to carry the components through solder wave stations have adjustments incorporated to permit tinning components of different sizes. Foam generators with independent foam rate adjustments are also provided to permit the adjusting foam height separately for each component lead. Guards are used with the foam generators to select specific segments of each lead for fluxing. A vacuum port with a vertical heated connection leading to a vertically oriented heated collector insures that excess solder will not clog the collection systrem. A shield between the vacuum port and the solder wave prevents solder being ingested by the port.

Abstract: An apparatus for the application of foam flux in a system for soldering printed boards, including a flux tank, a partition possessing a top portion rising above the fixed level of flux liquid and containing near the bottom portion thereof a perforated portion, serving to divide the interior of the flux tank into an inner tank portion and an outer tank portion, and a plurality of porous tubes disposed inside the inner tank portion having one end thereof communicating with an external compressed air feed mechanism and the other end thereof closed, the improvement wherein the porous tubes are porous ceramic tubes and are each obtained by molding an aggregate of uniform and fine ceramic-forming particles into the shape of a tube with the aid of an organic plasticizer and an inorganic binder and calcining, the porous tubes possessing pore diameters in the range of 10 to 30 microns and a porosity in the range of 35 to 55%.

Abstract: The soldering arrangement has a lengthwise extending tunnel arrangement (1) with a soldering tunnel (3) through which a conveyor arrangement (10) for the work pieces extends. A soldering tunnel (3) which is inclined upwardly in the conveying direction is provided with a floor opening which is surrounded by a downwardly protruding sealing skirt (18) which is immersed in the molten liquid solder material (20) in a tub (19) below the soldering tunnel (3). The soldering nozzles (24, 25) arranged within the soldering tunnel (3) are supplied through riser channels within the sealing skirt (18). A protective gas conduit (41) for supplying nitrogen opens into the soldering tunnel (3). The soldering tunnel (3) and the conveyor path of the conveyor arrangement (10) extending within the soldering tunnel (3), are tiltable about a horizontal crosswise axis (47), whereby the inclination of the soldering tunnel (3) is adjustable.

Abstract: A solder leveller comprises a solder bath into which a printed circuit board can be dipped to be preliminarily tinned. A pair of upright laterally acting jaws are adapted along an extended part of their length to hold the board at its opposite side edges and operate to insert in and withdraw the board from the bath. An air knife removes excess solder. The jaws are guided centrally of the bath by engagement of the side faces with the air knife nozzles which act as fixed guides.

Abstract: A computer controlled flow solder machine is controlled by a computer, operating in conjunction with two other computers, to control the operation of the machine and to control and monitor the process parameters for each circuit board processed through the flow solder machine. The flow solder machine is made up of a conveyer system, a flux system, a preheat system, and a solder pot system.

Abstract: A soldering apparatus capable of forming a flowing layer of a molten solder with which an article to be soldered is contacted and the height of the upper surface of which is automatically controlled between predetermined upper and lower levels by continuously detecting the upper surface with two detectors. Each detector has a vertical pipe whose top is connected to a source of a pressurized gas and whose bottom is opened downward so that the pressure within the pipe is increased or released when the upper surface of the solder is positioned above or below the open bottom end of the pipe. A pressure switch is provided in each pipe to detect the increase and decrease of the pressure within the pipe to detect the upper surface of the solder layer.

Abstract: A solder wave nozzle construction allows components to be disassembled for cleaning and removing dross from a solder reservoir. The quick connection joints allow downtime for cleaning a solder wave machine to be greatly reduced. In one embodiment a solder nozzle duct fits over a chimney flow duct and has quick release clips on each side. In another embodiment, a quick release back plate, front plate, exit trough, dross reduction tray and front gate are all easily removable. In a further embodiment a solder nozzle duct fits within a chimney flow duct, and has an adjustable height so it can be positioned for optimum solder wave height.

Abstract: A controlled amount of flux is applied to a circuit board (10) by first directing liquid flux through a nozzle (54) containing means for disintegrating the flux into a very fine fog of tiny flux droplets (62). The fog of flux droplets is injected into a laminar gas stream (52), thereby creating a laminar flux stream which is directed at the circuit board to coat the board with flux. As the flux spray is being directed at the circuit board, the concentration of flux solids on the board is being regulated, typically by controlling the rate of flux pumped into the nozzle.

Abstract: A method and apparatus for producing flush solder fill over recessed pins and over passage holes in circuitized substrates. A substrate carrying rack is immersed in a vessel of molten solder after it has been similarly immersed in a flux bath. While in the molten solder, the rack is vigorously agitated. The rack is then withdrawn from the molten solder and is pivoted upwardly while positioned over the molten solder. Simultaneously, an anvil is rotated from a home position to an impact position at precisely the correct moment. With the solder still molten on the substrate surfaces, the rack is then permitted to descend and is positively biased to strike the anvil thereby dislodging any excess molten solder. A unique supporting arrangement for the rack insures that only a minimum of mass acutally impacts against the anvil while insuring the effectiveness of the operation.

Abstract: Wave soldering process and apparatus for the soldering of elements such as, for example, printed circuit assemblies with surface mounted components and the like which yield improved soldering results by promoting the penetration of solder into narrow spaces between components, the filling of small holes in a board, filling crevices, filling corners adjacent to solder masks and all other areas where solder wetting is difficult to achieve with conventional machines. The process provides the steps of moving an element in a predetermined path, forming a solder wave beneath the path so that at least a portion of the element passes through the solder wave, and producing an oscillation in the solder wave during the passage of the element therethrough.