Abstract: A jet solder feeding device allowing the molten solder ejected from ejecting ports to be kept at a desired height in a stable manner. The molten solder is ejected and fed from multiple ejecting ports formed on a corrugated plate, each wall portion surrounding the multiple ejecting ports formed on the corrugated plate is projected upward by coining or extrusion. This configuration allows the molten solder introduced under the corrugated plate to be satisfactorily guided by the conically shaped wall portion which surrounds each ejecting port and projected upward. Thus the molten solder ejected from the ejecting ports can be kept at a desired height, and in addition, its state is satisfactorily maintained in a stable manner.

Abstract: The present invention relates to an apparatus and a method for inerting a wave soldering installation having a solder bath (19) and a conveying system for producing one or more solder waves (14, 15), in particular for soldering electric printed circuit boards, having an immersion box (1) which is closed on all sides, shaped like a frame, can be immersed in the solder bath (19) and which has porous pipes (2, 3, 4) to distribute nitrogen, said pipes being arranged inside the immersion box in cage-like housings (5, 6, 7) with outlet openings (8, 9, 10), the cage-like housings (5, 6, 7) being designed such that the porous pipes (2, 3, 4) are arranged therein in such a way that the porous pipes (2, 3, 4) are essentially not struck by solder splashes produced during the operation of the wave soldering installation.

Abstract: An apparatus used in a process for supporting a printed circuit board during a wave soldering operation including a frame with a frame opening in which a surface of the frame supports the board and also serves as a reference surface for vertically positioning the board above the solder pool. The board is secured against the reference surface with spring loaded clamps. Stiffeners preferably being an aluminum extrusion having a Tee or angle cross section is mounted along the outside edge of the reference surface of the frame and has a second reference surface facing in a direction opposite the reference surface of the frame. The second reference surface on the extrusion is accessible for support by a slide rail so that the height of the reference surface of the frame above the surface of the pool is independent of the thickness of the board or frame.

Abstract: Apparatus for inerting a wave soldering installation having a solder bath and a conveying system for producing one or more solder waves, in particular for soldering electric printed circuit boards, having an immersion box which is closed on all sides, shaped like a frame, can be immersed in the solder bath and which has porous pipes to distribute nitrogen, the pipes being arranged inside the immersion box in cage-like housings with outlet openings, the cage-like housings being designed such that the porous pipes are arranged therein in such a way that the porous pipes essentially cannot be struck by solder splashes produced during the operation of the wave soldering installation.

Abstract: The invention relates to a machine for wave soldering or tinning comprising a solder reservoir (9); means that can form at least one solder wave with a so-called laminar form (8b); a conveyor system (2) that can bring a piece (1) to be soldered or tinned into contact with said laminar wave; and means for injecting (12) a gas in the vicinity of the wave; characterized in that the said injection means includes an injector located in a position adjacent to and downstream from the wave and provided with a wall (17) facing the solder wave, wherein the wall of the injector has at least a first group (15) of openings positioned so as to provide a first gas jet directed toward the flat surface of the solder wave.

Abstract: A method by which a conventional circuit trace (14) is modified with a layer (16) of high-conductivity solder alloy to yield a high-current circuit trace (12) for high-current routing on a substrate (10). The method generally entails the use of a solder composition that contains a dispersion of metal particles (18) in a solder alloy (20). The metal particles (18) are selected on the basis of having a higher electrical conductivity than the solder alloy (20), and are present in sufficient amounts so that the electrical conductivity of the solder composition is significantly higher than that of the solder alloy (20). The solder composition is deposited on a conductor (14), and then reflowed to form a conductive layer (16) on the conductor (14). The metal particles (18) remain as a discrete dispersion within the conductive layer (16) in order to suitably promote the conductivity of the layer (16).

Abstract: The invention features soldering parts (e.g., printed circuit boards) by indexing the parts sequentially and continuously through a series of processing stations. Flux may be applied to precise areas of the parts at a flux station, and the flux station may include a rough part locator that roughly locates a part indexed into the flux station and a precise part locator that precisely locates the part. The flux station may further include a guide rail for supporting the part and a mechanism for raising and lowering the guide rail. The flux station may include a flux sprayer for applying flux to the part, where the flux sprayer includes an air valve, a flux valve, and a controller coupled to activate and deactivate separately the air valve and the flux valve. The controller may activate the air valve before activating the flux valve and deactivate the flux valve before deactivating the air valve.

Abstract: A debridging tool incorporated into an automated wave soldering system adjacent to and after a wave soldering station removes bridges and/or excess solder formed during the wave soldering process by emitting, at a desired temperature which can be set using a heater and one or more thermo measuring devices, a pressurized stream of air, inert gas or other fluid only under selected areas of a printed circuit board, including a flexible circuit. The tool comprises a movable nozzle from which the stream is emitted and a means for transporting the nozzle under the printed circuit board. The tool targets only those areas of the board where bridges or excess solder repeatedly form during the soldering process without disturbing solder joints where no bridges or excess solder form.

Abstract: An automatic soldering apparatus includes a conveyor for conveying a printed circuit board along a predetermined path, a heater located below the conveyor and adapted to heat the lower surface of the printed circuit board on which leads of chips and other electronic parts are to be electrically connected to circuits as printed, a flux applicator located downstream of the heater and arranged to apply a molten flux to the surface of the printed circuit board, and a supply of solder located downstream of the flux applicator and arranged to solder the leads to the circuits. The flux applicator includes a supply of flux for feeding flux in solid form at room temperature, a heater for heating the flux to a temperature above its melting point to provide a molten flux, and a spray nozzle for spraying the molten flux to the surface of the substrate.

Abstract: A debridging tool incorporated into an automated wave soldering system adjacent to and after a wave soldering station removes bridges and/or excess solder formed during the wave soldering process by emitting a pressurized stream of air, inert gas or other fluid only under selected areas of a printed circuit board, including a flexible circuit. The debridging tool, which comprises a movable nozzle from which the stream is emitted and a means for transporting the nozzle under the printed circuit board, targets only those areas of the board where bridges or excess solder repeatedly forms during the soldering process without disturbing solder joints where no bridges or excess solder form. More than one movable nozzle may be used where warranted.

Abstract: A wave solder pallet having a first side that is adapted to receive a printed circuit board and a plurality of through holes or apertures that will allow solder to be transmitted through to selected regions on the printed circuit board. The surface of the base plate that is positioned adjacent the solder wave has channels formed therein, the channels being tapered inwardly so that the overall volume of the channel is greatest at the periphery of the pallet. The increased volume of the channel reduces the pressure effect of the solder wave as it contacts the pallet at the periphery thereby reducing the amount of solder that is splashed over the pallet. The tapering of the channel uniformly increases the pressure so that the pressure effect of the solder wave is increased when it travels through the apertures.

Abstract: A molded selective solder pallet and a method for fabricating a molded selective solder pallet for use in a wave soldering process to selectively affix solder to an area of a circuit board having an electronic component thereon. The selective solder pallet according to the present invention includes a mold base configured having an aperture formed through its cross-section. A high temperature casting material is molded within the mold base and configured to have at least one recess and at least one solder flow opening. A high temperature silicone casting material may be employed as the high temperature casting material.

Abstract: An automatic soldering mechanism is for jetting a solder jet flow to a printed-circuit board to carry out a soldering of the printed-circuit board. The automatic soldering mechanism comprises a solder tank for storing a molten solder and a solder jetting nozzle section for jetting the solder jet flow higher than a melt surface of the molten solder within the solder tank in an inert gas atmosphere.

Abstract: An alignment fixture for aligning components of a solder-wave machine during manufacturing processes of PCB assemblies and other electronic devices. In one embodiment, an alignment fixture has a calibration member that is adapted to be positioned at least in part over a solder-wave of the solder-wave machine. The calibration member may be positioned at a PCB elevation defined by the elevation at which PCB assemblies move over the solder-wave during processing. The calibration member may be an alignment bar or other device that has a solder indicator to indicate the height of the solder-wave relative to the PCB elevation. Additionally, the solder indicator may indicate the extent of deviations between the height of the solder-wave and the PCB elevation across at least a portion of the solder-wave.

Abstract: A gas flow controlling device including a housing having a gas inlet and a gas outlet and defining therewithin a gas flow passage diverging in the direction from the inlet to the outlet so that the cross-sectional area of the gas flow passage increases from the inlet to the outlet, and a plurality of spaced apart baffle plates provided in the gas flow passage to render the gas flow passage meandering. An apparatus for soldering an article, including a wave-soldering zone for contacting the article with a solder wave, and one or more above-mentioned gas flow controlling devices for establishing an inert gas atmosphere in the soldering zone.

Abstract: A method of and an apparatus for vapor phase/solder wave soldering contacts of electronic components including temperature sensitive portions in wh the components while moving through a soldering chamber are only partially immersed in a saturated vapor whereas the contacts are wholly immersed in the vapor. A solder wave having a crest substantially coinciding with the components to be soldered is provided within the saturated vapor and a layer of an inert gas is provided above the vapor ceiling.

Abstract: A solder wave height measuring device is provided that may be constructed using a horizontal supporting member that is positioned on a set of conveyors. Perpendicularly attached to the horizontal supporting member is a graduated beam that slidably supports a measuring jacket. The jacket may have a cubic shape, drum shape, or any polyhedron shape, but the jacket will preferably have an upper surface that is perpendicular to the graduated beam to simplify taking visual readings. A surface of the measuring jacket is in contact with the top end of the solder wave to allow the measuring jacket to accurately indicate the height of the solder wave on the graduated beam. Additionally, a fastener can be used to fix the measuring jacket to the graduated beam. The measuring jacket is fixed to the graduated beam by a fastener when the measuring jacket indicates an optimum height to solder at maximum efficiency. This provides an easy and convenient measurement of the solder wave height.

Abstract: The invention relates to a machine for wave soldering or tinning comprisinga solder reservoir (9);means that can form at least one solder wave with a so-called laminar form (8b);a conveyor system (2) that can bring a piece (1) to be soldered or tinned into contact with said laminar wave; andmeans for injecting (12) a gas in the vicinity of the wave;characterized in that the said injection means includes an injector located in a position adjacent to and downstream from the wave and provided with a wall (17) facing the solder wave, wherein the wall of the injector has at least a first group (15) of openings positioned so as to provide a first gas jet directed toward the flat surface of the solder wave.

Abstract: A liquid dosing device, comprising an open-ended vitreous capillary tube which is connected to a reservoir for liquid, heating means for heating the liquid in the reservoir to a given temperature T.sub.1, and a ceramic actuator element which is in intimate contact with a portion of the external surface of the tube. The tube and the element are mutually adhered using a solder having a melting point in excess of T.sub.1. The liquid in the reservoir may be molten solder or glue.

Abstract: A first electromagnetic induction pump system includes a first plurality of electromagnetic induction pumps, arranged in the direction parallel to the width of workpiece. The first plurality of electromagnetic induction pumps extend vertically along a first vertical plate portion at a workpiece inlet side of a single reservoir. A second electromagnetic induction pump system includes a second plurality of electromagnetic induction pumps, arranged in the direction parallel to the width of workpiece. The second plurality of electromagnetic induction pumps extend vertically extends along a second vertical plate portion at the workpiece outlet side of the reservoir. Brazing filler metal is ejected upward in waves by the electromagnetic induction pump systems to braze workpieces carried by the ejected waves into and out of the device.

Abstract: A single reservoir contains brazing filler metal. A first electromagnetic induction pump extends vertically along a vertical plate portion at a workpiece inlet side. A second electromagnetic induction pump extends vertically along a vertical plate portion at the workpiece outlet side. Heaters for melting the brazing filler metal are disposed between the first electromagnetic induction pump and the second electromagnetic induction pump. Each electromagnetic induction pump has a first iron core having an induction coil wound therearound disposed at the outer side of a vertical plate portion at the workpiece inlet side or the workpiece outlet side respectively. A second iron core is disposed at the inner side of the respective vertical plate portion. A brazing filler metal rising gap is disposed between the second iron cores.

Abstract: An apparatus for measuring the height of a solder wave having a supporting horizontal member, at least one elongated pin slidably affixed to the horizontal member extending vertically downward. The elongated pins have a sensing means affixed to it and the sensing means communicate with and indicator means to notify a technician the height of a solder wave relative to the top surface of the solder pot. The elongated pins with sensors attached thereto are set up to notify a technician if the solder wave is too low, too high, or at an optimum level. A screw and nut provide height adjustment for the elongated pins.

Abstract: A solder immersion chamber in a solder crater/leveler includes a solder manifold having upper and lower solder chambers, from which solder is directed onto the top and bottom surfaces of printed circuit boards conveyed therebetween. The solder immersion chamber has a pair of driven rollers at either end thereof for conveying the printed circuit boards through the solder immersion chamber, and for damming and holding the molten solder within the solder immersion chamber. A pair of oil weirs is provided adjacent either side of the upper solder chamber for continuously flowing oil to flood the top surface of the molten solder in the solder immersion chamber. A skimmer skims oil from the top surface of the molten solder, and returns the separated oil to the pair of oil weirs.

Abstract: The invention relates to a wave soldering machine with at least one device for generating at least one solder wave (10a) consisting of liquid solder (10) for wetting assembled units (22) which are conducted over the solder wave (10a). To achieve a reproducible adjustment and control of the wave height (24), it is proposed to mount at least one temperature-compensated pressure sensor (18) in the transport path of the solder (10), preferably in the immediate vicinity of the nozzle opening (13).

Abstract: The linear motor pump for a wave soldering apparatus comprises in accordance with the invention several pumping channels arranged substantially parallel to each other and separate from each other. It includes preferably a multiply segmented stator. Each stator segment has one pumping channel allocated to same. By means of this a homogeneous pumping performance i.e. homogeneous pumping pressure distribution over a practically arbitrary width is achieved, which leads to a homogeneous solder wave. By the arrangement of the pumping channels and the design of the stator in accordance with the invention a turbulent whirling of the solder is made practically impossible.

Abstract: A method is provided for wave-soldering printed circuit boards. In order to obtain wave-soldered printed circuit boards with smallest possible number of solder globules, after the passage on the wave of solder, the printed circuit boards are further artificially cooled at an approximately constant time-temperature gradient of 20 K/sec.

Abstract: A flow control device for a solder wave apparatus that includes an outlet or nozzle from which molten solder flows in an upward direction to contact the lower surface of a target, such as a circuit board. The flow control device provides a screen and baffle that control the flow pattern of molten solder to the nozzle so as to result in a near-parallel solder wave above the nozzle. The screen includes a pair of spaced-apart parallel panels that are disposed upstream of the nozzle. Each of the panels has apertures through which the molten solder flows before entering the nozzle. The apertures of the panels are offset from each other, such that none of the apertures are coaxial but instead overlap each other when superimposed. The baffle is disposed further upstream of the screen, and includes a number of fins disposed substantially perpendicular to the panels. The fins are arranged such that their lengths become progressively shorter in a direction away from the center of the baffle.

Abstract: A wave soldering machine welling up molten solder by means of a pump for soldering a printed circuit board. The wave soldering machine comprises a nozzle formed of an enclosure surrounded by a front upright, a rear upright and side plates, a rear baffle plate extended from the top edge of the rear upright in a manner that the height of the rear baffle plate is adjusted, and a generally L-shaped front baffle plate having a large radius of curvature pivotally attached to the top edge of the front upright, whereby a solder wave formed on the top end of the rear baffle plate by surface tension of molten solder flows along the top surface of the front baffle plate. The rear baffle plate is particularly shaped and a bypass is formed to present a stable solder wave.

Abstract: A soldering device includes a solder vessel for containing a molten solder, solder ejecting nozzle disposed in the solder vessel for upwardly ejecting the molten solder to form a solder wave thereabove, a cover plate covering the vessel and having an opening such that the solder wave can pass therethrough, a nozzle forming body provided adjacent at least one side of the solder wave to define a thin space between the nozzle forming body and the cover plate, and a gas feed conduit connected to the nozzle forming body for feeding a gas to the thin space, so that the gas is jetted through the thin space and flows toward the solder wave.

Abstract: The present invention pertains to a device for the flux-free soldering of printed circuit boards guided over the soldering wave of a wave soldering nozzle, wherein the solder is vibrated by means of at least one ultrasonic electrode (sonotrode), the surface of the sonotrode is directly rinsed by the soldering wave, and the printed circuit boards are guided just above the surface of the sonotrode. It is provided that the surface (12, 28) of the sonotrode (5, 21) forms at least a partial area of the surface of the wave former (11, 13) of the wave soldering nozzle (2, 22).

Abstract: Wave soldering or tinning machine comprising:a solder reservoir;a means that forms at least one solder wave having a laminar form and including a flat surface;a means for bringing a piece to be soldered or tinned into contact with the laminar wave; andmeans for injection of a gas in the vicinity of the wave comprising an injector located in a position adjacent to and downstream from the wave and provided with a wall facing the solder wave, wherein the wall has at least a first group of openings positioned so as to produce a first gas jet directed toward the flat surface of the solder wave.

Abstract: A method of wave-soldering assembled units which are conducted over a soldering unit by a transport device including propelling solder against the assembled units in a turbulent zone by a first turbulent soldering wave at an acute angle in the transport direction and subsequently by a quiet soldering wave approximately at right angles thereto. To avoid cold soldered spots and shadow regions, the method includes propelling solder against the assembled units by a second turbulent wave at an acute angle against the transport direction in the turbulent zone. A device for wave-soldering assembled units is also provided.

Abstract: An apparatus and method for soldering components to a circuit board. The apparatus includes a conveyor in a tunnel for transporting the board through a preheat zone, molten waves of solder including a turbulent wave and a laminar wave, and a cool down zone through which the board passes upon exit from the laminar flow wave of the solder wave. The improvement comprises at least one distributing manifold mounted in the tunnel having an inlet port for receiving a cold gas under pressure and at least one outlet nozzle for directing the cold gas to the circuit board, thereby rapidly cooling the circuit board and the components.

Abstract: A liquid flux using water instead of a volatile organic compound as the liquid carrier is used in a wave soldering process. Undesirable formation of solder balls, solder bridges and solder webbing is prevented by using an air knife to direct a vigorous jet of gas at the dielectric substrate in the preheating section.

Abstract: A device is described for automatically populating the top and bottom side of printed-circuit boards with SMD components, synchronously controllable switching points being arranged in the entry and outlet of the SMD (surface mounted device) insertion device.

Abstract: The invention features soldering parts (e.g., printed circuit boards) by indexing the parts sequentially and continuously through a series of processing stations. Each of the series of processing stations includes at least one processing position, and the indexer indexes the parts from processing position to processing position. At different processing stations, the parts indexed into those processing stations are simultaneously processed.

Abstract: The invention relates to a soldering apparatus, comprising a solder vessel; at least one soldering tower located in said solder vessel; transport means for transporting objects to be soldered over said soldering tower; solder wave generating means for generating a solder wave emerging from the apex of the soldering tower and contacting the objects to be soldered, the soldering tower comprising a weir such that at least a part of the solder wave flows parallel to the direction of movement of the objects to be soldered over said weir; and guide means for guiding said part of the solder wave such that the solder wave leaves the soldered object substantially abruptly. As a consequence of said feature the stream of solder is abruptly guided away from the printed circuit board, so that the possibilities for developing short circuits on the printed circuit board are substantially reduced.

Abstract: The method and the device serve for soldering of workpieces, namely of pc boards and substrates, which are equipped with chip component parts and/or microelements and/or assemblies comprised thereof. Such boards are passed through a main solder bath or at least one main solder wave, and the workpiece is contacted with the surface of the wave. The solder wave has an imaginary break edge 2, i.e., a break edge at which the solder loses the contact with the workpiece in connection with an unwettable workpiece. The imaginary break edge 2 of the soldering device 1 extends not in a straight line and, viewed in the direction of conveyance 3, has at least one diminution 4, i.e., two edge parts ending in a point, i.e., the edges form a triangle.

Abstract: The invention relates to a device for measuring the height of a solder wave in a soldering apparatus which comprises a solder bath and which is provided with at least one solder tower for generating a solder wave and a pump connected to the solder tower, wherein the measuring device comprises: means for measuring the liquid pressure in the connection between the pump and the solder tower. As a result of these steps it is possible to measure accurately the pressure of the solder moving out of the pump to the solder tower. This pressure is in any case a good measure for the height of the solder wave. According to a first preferred embodiment the means for measuring the liquid pressure comprise a measuring vessel joined to the connection between pump and tower and communicating at its top with the atmosphere, the upper edge of which vessel is located higher than the outflow opening of the solder tower.

Abstract: A lead oxide preventing apparatus for an automatic soldering device does not generate lead oxides around an impeller shaft inside a lead chamber. Industrial waste in the form of heavy-metal-contaminated material is reduced by installing a ring member and by placing an oxidation preventing agent into the ring members, or by installing a beating therein so that the molten lead does not contact portions of the impeller shaft.

Abstract: The automatic soldering of printed circuit boards wherein different boards can be simultaneously processed at different stations, e.g. a fluxing station, a preheating station and a soldering station. An identification station in advance of the fluxing station controls various parameters at the processing stations in response to board type as the boards are indexed through the various stations. Parameters such as location of application, time of application, pump speed etc. may be controlled in response to board type.

Abstract: A soldering apparatus wherein lead pins of a part inserted from above in through-holes of a printed circuit board are soldered to the through-holes from below. The soldering apparatus comprises a solder supplying nozzle, a preliminary heating nozzle and a flux nozzle. Each of the nozzles has an opening and a pair of slits formed to extend downwardly from the opening. The nozzles are moved upwardly and downwardly in a Z direction by respective elevators and are moved and positioned in X and Y directions by a moving table. A printed circuit board to which a lead part to be soldered is temporarily fastened is disposed on the nozzles.

Abstract: A pallet for holding a printed circuit board comprises first and second parallel rails and third and fourth parallel rails. The third and fourth rails each have first and second ends and form an angle of between about 30.degree. and 60.degree. with the first and second rails. The first and second ends of the third and fourth rails are connected to one of the first and second rails. The pallet further comprises an attachment for securing the printed circuit board to the third and fourth rails. The angled pallet has advantages over conventional pallets as shorts and shadowing are reduced.

Abstract: In a wave solder manufacturing process, a test device is used to measure the contact-area between a solder wave and a printed wiring board. In particular, the test device is a printed wiring board (PWB) that includes at least two arrays of electrical contacts, one array near each side of the PWB. As the PWB makes contact with a solder wave, the number of electrical contacts in each array that are grounded by the solder wave are counted and displayed on an alpha-numeric display mounted on top of the PWB. This "distance-based" measurement provides an accurate determination of the uniformity of the contact-area, and concomitantly the dwell-time of the soldering process. This test device provides a basis for real-time adjustment of solder wave height, and end-to-end balance, in a solder wave machine. In particular a wave solder machine includes a means for receiving contact-area information from the test device and a means for adjusting the solder wave in response to the contact-area information.

Abstract: A wave soldering process and apparatus in which a localized low oxygen-containing atmosphere is provided at the point of contact of the solder wave and the substrate to be soldered by bubbling an inert gas through the solder wave.

Abstract: An automatic soldering apparatus and method includes compressed air pipes on both sides of a ceramic foaming tube to prevent through holes of the ceramic foaming tube from being clogged by a foreign substance and to constantly maintain the air pressure within the ceramic foaming tube for uniform dimension of foaming flux and uniform foaming height, thereby performing uniform flux treatment upon a circuit board to eliminate inferiority caused by the foaming flux.

Abstract: Fluxing and soldering terminals on a printed circuit board by an in-line process in which flux concentration is determined at specific locations laterally of the passline. At each of the positions infrared light is passed through a wall of flux which is being directed at the board. The infrared light becomes partly absorbed by materials in the flux and the unabsorbed light which passes through the wall of flux is used to generate signals corresponding to the different wavelengths of unabsorbed light at each of the locations. This enables a determination to be made of the flux concentration at each location. The signals are preferably used to effect a change in the flow rate of flux at any specific location so as to control the amount of flux deposited upon the board. Particularly useful for "no-clean" flux applications.

Abstract: Fluxing and soldering terminals on a printed circuit board in an in-line process in which a wall of flux is directed against a surface of the board which moves in inclined manner as it passes through a fluxing station and towards a soldering station. The process controls flux application to decrease the amount of flux applied from the leading end to the trailing end of the board, the board inclination resulting in flow of flux to redistribute it towards providing a constant flux thickness for the soldering step. Particularly useful for processes involving "no-clean" flux application where residual flux after soldering is to be avoided because of potential electrical problems.

Abstract: An improved wave soldering apparatus that protects the molten solder and the components being soldered from exposure to ambient air while the solder is in a liquid condition. At the soldering station, which is enclosed in a controlled atmosphere chamber, all the liquid solder, pumps and other elements exposed to liquid solder are enclosed within the chamber. This eliminates the formation of dross which interferes with the soldering process and also with the operation of the solder pumps. The inlet and outlet paths from the chamber, through which the components pass, are extended both to exclude ambient air and to permit the components to cool in a controlled atmosphere.

Abstract: The invention relates to a soldering apparatus comprising: a vessel for liquid solder; at least one soldering tower placed in the vessel for causing liquid solder to leave the soldering tower on the upper side, wherein the soldering tower is adapted to cause the liquid solder to run off on all sides; a conveyor for carrying objects for soldering along the top side of the soldering tower such that the objects for soldering come into contact with the liquid solder; and a cover for maintaining an atmosphere with a reduced oxygen content at least in the surrounding area of the liquid solder.