Abstract: Apparatus for soldering the winding to the commutator of a rotor of great weight of an electric machine. The apparatus has a vessel containing a bath of molten solder and electric resistance heaters, a single-phase magneto-hydrodynamic pump consisting of a first magnetic core disposed beneath the vessel, the first magnetic core being supported from below and surrounded by a winding and solder stream-formation unit made of ferro magnetic material which is concentric with the first magnetic core. The bottom wall of the vessel is disposed on the first magnetic core, and within the vessel and on the bottom thereof there is fastened rigidly an additional, second hollow magnetic core, which is a continuation of the first magnetic core, while a tubular casing which is concentric with the second magnetic core, and which is of stepped shape, seats with its external step on the additional, second hollow magnetic core.

Abstract: Apparatus for and method of desoldering and removing a soldered together integrated circuit from a mounting member and for cleaning the same in which the integrated circuit and the mounting member are placed in tension in preparation of separating the same so that when the securing solder is melted the integrated circuit and mounting member separate from each other. The integrated circuit and mounting member are subjected to a pressurized flow of fluid which bathes the integrated circuit in an enclosure that is completed by the mounting member so that the mounting member and the integrated circuit are cleaned of solder and are also cooled.

Abstract: Parts (10) to receive a thin strip of solder are advanced along top surfaces of a pair of upwardly inclined channel plates (26, 27). Pressurized solder (31) is pumped between the plates to a precise head which projects as a meniscus (28) above the top surfaces of the channel members and is deposited on the advancing parts. The head of solder is maintained at a height to insure a partial flow of solder through a V-shaped trough (51). Any fluctuations in the height of head of solder is rapidly compensated by an increased or decreased flow of solder through the trough. A significant reservoir of solder is maintained between the channel plates so that the solder is held at a substantially constant temperature.

Abstract: A soldering apparatus has a base, and a solder tank and a nozzle arranged in tandem with the base. A partition plate is arranged in the solder tank. The partition plate, a bottom plate disposed at the bottom of the solder tank, and a lower plate covering the bottom of the solder tank define a channel communicating with a portion of the solder tank remote form the nozzle and the interior of the nozzle. A moving magnetic field generating mechanism for exerting a force toward the nozzle to a solder in the channel is arranged in the base to extend along the channel under the partition wall. That portion of the solder tank at the side of the nozzle constitutes a wide portion of the same width as that of the nozzle while the remaining portion of the solder tank constitutes a narrow portion.

Abstract: Contact of a soldered board by a soldering oil supplied from within a solder wave takes place immediately following deposition of molten solder onto the board. The oil causes relocation of solder on and/or removal of excess solder from the underside of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges.

Abstract: A process and apparatus for fabricating an optical fiber communication cable are described herein. The optical fiber cable has a cable core including a metal containment tube and at least one optical fiber within the tube. The containment tube preferably is formed by drawing a strip of metal through at least one forming die. In a first aspect of the present invention, smooth operation of the forming die is promoted by first passing the metal strip through a shaving die to remove any shearing burrs along the strip edges and to maintain the width of the strip within a desired tolerance.In a second aspect of the present invention, various approaches for effectively sealing the containment tube are described. In a first embodiment, the tube is sealed using a wave soldering approach wherein a flow of moving molten solder is used to substantially fill a seam in the tube.

Abstract: A method of soldering wherein a component or components to be soldered, such as a printed circuit board and soldered preforms, are immersed in a vapor bath to melt the solder, following which the components are withdrawn from the vapor bath. In the method according to the invention, the vapor bath is composed predominantly of perfluorotetradecahydrophenanthrene (C.sub.14 F.sub.24).

Abstract: Parts (10) with terminals (17) wrapped with insulation coated wire (20) are loaded into quick clamp and release fixtures (24) and then advanced by a conveyor (26) through a flux applying station (42) and then through an insulation removing and solder depositing station (46). Solder is pumped through a well (47) and divided into two oppositely flowing sets of streams capped by open top housings (66, 67 and 68). The hot solder flowing counter to the direction of movement of the terminals acts to melt and wash away the insulation whereafter the solder flowing in the direction of movement of the terminals acts to deposit solder on the wire wrapped terminals.

Abstract: An apparatus for welding connections of components, comprising a heating tube having an opening over the entire length of its upper generating line and having in its lower part a notch; a welding device disposed in the notch; and a device for advancing along the heating tube components mechanically held by conductive elements for forming the connections after welding. The heating tube is supplied by a low voltage generator.

Abstract: An apparatus for soldering workpieces (29) has a main solder bath (20) with main solder wave (15) and the workpiece (29) is brought into contact with the surface of the main solder wave. The surface can be modulated by means of at least one additional solder outlet or inlet nozzle (11), in order to solder even densely packed circuit boards without problem and with complete wetting of all solder locations (FIG. 1).

Abstract: Wave soldering is accomplished in an enclosure having an atmosphere which is substantially free of oxygen and which provides a fluxing action due to the presence of a gaseous reducing agent. A conveyor carries articles to be soldered through the enclosure by means of an entrance and exit which are provided with gas curtains to inhibit atmosphere exchange with the ambient air.

Abstract: Wave soldering apparatus particularly adapted for soldering printed circuit boards which have closely packed chip components adhesively mounted on one side of the boards is described. A novel nozzle assembly is dimensioned to be mounted to the solder supply conduit of a conventional wave soldering reservoir. The nozzle assembly comprises a first nozzle which delivers a turbulent jet to the undersides of the printed circuit boards as they are conveyed over the nozzle assembly, and a second nozzle which delivers a smooth laminar wave through which the undersides of the printed circuit boards immediately subsequently pass. The turbulent jet forces solder into the restricted spaces at which chip component contact pads are located and the smooth wave completes this soldering action by building of additional solder in a manner which discourages the formation of solder "icicles" and bridging.

Abstract: Printed circuit boards bearing chip type electric parts on its underside surface and travelling along a predetermined path are soldered by contact with a progressive wave of a molten solder progressing in a direction transverse to the path of travel of the printed circuit board. A nozzle member provided with an array of molten solder overflowing ports arranged in a direction transverse to the travelling path is moveable in the same direction so as to form the progressive wave of molten solder.

Abstract: Pressurized molten solder 71 is flowed along a confined first channel 86 and forced through a series of spaced, aligned apertures 88 as solder jets which rise, fall and merge to form a solder stream which flows along a second channel defined by channel walls 93 and 94. Spring held printed circuit boards 10 are advanced by a conveyor 21 which is tilted to move a far section of each board into engagement with the top of channel wall 93 and then a near section of each board into engagement with the top of channel wall 94 whereafter the board is spring held to ride along the tops of channel walls while a thin stripe of solder is applied to the board.

Abstract: An improved solder wave apparatus and method that minimizes the undesirable phenomenon of solder splash is presented. A V-shaped trough is placed across the top of the inner container or box of an otherwise conventional solder wave machine. The V-shaped trough is positioned so that the bottom thereof is lower than the lowest side wall or walls of the inner container. A hole in the bottom at a first end of the trough allows molten solder to enter therein. A dam is placed along the length of the trough and divides the trough into the first and second sections. The dam includes a hole at the bottom to allow molten solder to pass from the first section into the second section. A slot or opening placed in the side wall of the inner container above a second end of the trough allows the molten solder to fall back into an outer container of the solder wave machine, from which location the solder is pumped back into the inner container in conventional fashion.

Abstract: An apparatus for soldering the wires of the rotor winding of an electric machine to its commutator. The apparatus comprises a tank with molten solder and heaters, a magneto-hydrodynamic pump for the solder, a device for holding the rotor, and a device for the protection of the molten solder from oxidation. The device for holding the rotor comprises a base in the shape of a hollow cylinder with holes and having a chamfered bottom part of the internal surface thereof in which there is movable disposed a replacement nozzle, which is made up of a sleeve and a rotor holding case rigidly connecting together. The nozzle reciprocates in the base. The commutator of the rotor to be solder is inserted into the case. Between the sleeve and the case there is formed a ring-shaped duct, connected with a booster zone which directs the molten solder toward the commutator.

Abstract: Method and apparatus for forming an electrical contact between mounting pins extending from an electrical component and insulated wires from the component that are wrapped around the pins in which the tips of the pins are held in a flowing pool of molten solder until the heat travelling up the pins loosens the insulation up to a desired level, and the pins are then quickly immersed up to that level and then quickly removed so as to cause the solder to melt and carry away the loosened insulation but to leave substantially intact the insulation that is not loosened.

Abstract: Workpieces 11 carrying electronic components 17 are soldered using an automatic soldering machine. In this machine the circuit boards 11 are transported between treatment stations such as a fluxing station I, a drying station II and a soldering station III. The arrangement is such that the circuit boards 11 are separated from the forwarding system 1, 2 at the treatment stations and are either held at rest during treatment or are caused to execute a movement matched to the treatment but independent of the movement of the forwarding system. In this way there is no need to specially tailor the automatic soldering machine to the particular workpiece to be soldered. Instead, a wide variety of different workpieces can be treated efficiently by one and the same soldering machine simply by coding the workpieces and by arranging the machine so that preprogrammed treatments can be carried out in dependence on the coding on the workpieces.

Abstract: The solder applying apparatus enables applying solder to both sides or faces of printed-circuit boards travelling essentially in horizontal direction through a production or manufacturing line, and which circuit boards are not yet equipped with electrical components or the like. The apparatus contains a solder applicator means or device where liquid solder is pumped from a supply container in such a quantity that a solder wave forms over an outlet or discharge opening of the applicator device. This solder wave extends beyond the feed or transport plane of the printed-circuit boards. At the side walls of the applicator solder device there are mounted guide elements formed of metal plating or sheet metal which extend beneath the feed plane, the solder flowing-off by means of such guide elements. The angle of inclination of the metal guide elements is adjustable with respect to the feed plane. Also the spacing between the discharge opening of the applicator solder device and the feed plane is variable.

Abstract: Printed circuit boards bearing chip type electric parts on its underside surface and travelling along a predetermined path are soldered using first and second molten solder, successively. The first molten solder is forced to overflow from a nozzle member to form a wave of overflowing solder extending in the direction of the path of travel of the printed circuit board so that the lower side of the printed circuit board is brought into co-current contact with the upper surface of the solder wave for effecting both preheating and first soldering treatment by the first molten solder. A solder applicator is provided adjacent to and downstream of the nozzle member to effect a second soldering treatment by the second molten solder.

Abstract: An apparatus for wave soldering component leads to a conductor on a printed circuit board surface includes a fountain for forming a standing wave of hot molten solder. A pool of hot oil having a specific gravity lower than the solder floats in a depression in the surface of the solder adjacent to the standing wave. A printed circuit board whose surface is to be soldered is passed through the crest of the molten solder standing wave and then while the solder adhering to the component leads and conductor is still molten, into contact with the pool of hot oil.

Abstract: A solder or other liquid wave forming machine has a solder delivery chamber with a tapered depth profile to deliver solder uniformly from a horizontal stream to plural vertical chambers from which the upwardly flowing solder exits to form a solder wave. The wave has substantially uniform height and contour over its width. A slide valve cooperates with baffles that form the vertical chambers selectively to block flow from a prescribed number of chambers to adjust the width of the solder wave. Curved re-entry baffles direct the flow vector of the solder returning from the wave into a main solder supply tank in a horizontal direction to minimize turbulence at such surface and, thus, the formation and circulation of dross.

Abstract: The formation of dross in a molten solder bath (28) by surface agitation of the bath, and the adverse effects of dross on a solder pumping operation, are essentially eliminated by suspending a pump shaft (36) and an impeller (38) thereon for free rotation within a housing (96) in the molten solder bath so that solder in the solder bath is precluded from making any significant contact with the rotating shaft. To insure against binding between the impeller (38) and an opposed horizontal inner surface (132) of the housing (96), a small amount of solder is permitted to flow continuously between the impeller and the surface into contact with the rotating shaft (36) adjacent the impeller. The small solder flow then is exposed to the atmosphere to form a correspondingly small amount of light powdery solder dross (134).

Abstract: Compressed air is blown into a pool of molten solder during soldering to form air bubbles which rapidly rise in the molten solder toward the top. The rising air bubbles strike against a printed circuit board and electric and or electronic components temporarily fixed thereto to achieve soldering. After soldering, inert gas is introduced into the molten solder instead of the air.

Abstract: A dip-coating method for forming a smooth coated film on the surface of an article by dipping the article in a coating solution while making ultrasonic waves act on the coating solution and forming a uniform liquid flow on the surface of the coating solution. An apparatus for practicing the method is also disclosed.

Abstract: A device for desoldering electronic components from circuit boards has a soldering nozzle which produces a solder wave that is directed from below the circuit board against the component to be desoldered; thereby dissolving previous solder bonds. The component can then be lifted out from above and suction is applied from below to the now-opened bores of the circuit board, to remove residual solder from them. A new component can then be installed, using the same equipment.

Abstract: A method of soldering connection pins on carrier strips to printed circuit boards, notably to thick-film modules. Prior to soldering in a soldering bath, a printed circuit board is detachably connected to the connection pins. An endless carrier strip with the connection pins and printed circuit boards in the upright position is horizontally fed through liquid solder which flows off the components to be soldered at the surface. Solder which does not wet or connect the components flows away at the end of the predetermined soldering path, preferably in the transport direction of the parts, to a level below that of the carrier strip.

Abstract: A soldering system is described in which a freshly soldered board is heated substantially immediately following deposition of molten solder onto the board so as to maintain the freshly applied solder in molten condition, and a fluid stream is then directed onto the molten solder. Preferably, but not necessarily, the fluid, which may comprise a gas or mixture of gases, is heated prior to contacting the board. The impinging fluid stream relocates solder on, and/or blasts excess solder from the bottom of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges. If desired, liquid droplets such as soldering oil may be included in the fluid stream.

Abstract: A soldering system is described in which a fluid stream is directed onto a soldered board substantially immediately following deposition of molten solder onto the board. Preferably, but not necessarily, the fluid, which may comprise a gas or mixture of gases, is heated prior to contacting the board. The impinging fluid stream relocates solder on, and/or blasts excess solder from the bottom of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges. If desired, liquid droplets such as soldering oil may be included in the fluid stream.

Abstract: Apparatus for soldering the winding of armatures of electrical machines to the collectors thereof. The apparatus includes a device for gripping, displacing and fixing the armature with the collector, a single-phase magnetic-hydrodynamic pump with metal conduit and a bath with molten solder and heaters. The magnetic core of the single-phase magnetic-hydrodynamic pump is embraced by a metal conduit disposed underneath the bottom of the bath, and the inlet of the metal conduit is connected to the bottom of the bath, while its outlet end is rigidly connected to a casing fastened to the bottom of the bath. To the bottom of the casing there is pressed by means of an easily releasable joint a changeable nozzle unit. When it is necessary to solder a collector with a diameter different from the previous one, the changeable nozzle unit is taken out of the apparatus and new one of a size corresponding to that of the collector to be soldered is inserted in the apparatus.

Abstract: A soldering method comprises forming bubbles by blowing gas into a pool of molten solder, and striking the bubbles against a printed circuit board with electric and or electronic components temporarily fixed thereto to solder them to each other.

Abstract: A uniform plating treatment is carried out on one-side of a steel strip in that the strip is travelled horizontally over a still surface of a plating bath while the plating bath is jetted onto the one-side of the strip, and the one-side is positively given on its edges a plating flow running in width of the strip outwardly from the edges and the other part except the edges is given the plating flow running in length of the strip.

Abstract: A soldering installation (1) is provided for run-through and shuttle operation, in particular for the run-through soldering of printed circuit boards on a soldering machine. It is equipped with a feeder mechanism (4) for the transport of soldering frames (18) to which printed circuit boards are fixed. The feeder mechanism (4) has a travel distance of at least 2 frames. In the first half of the feeder mechanism (4) is a device (31) for the holding of a frame (18) as well as an activator (32) for the release of the frame (18). A transport mechanism, (5) running synchronously with the feeder mechanism (4) bridges the soldering machine. An electric motor (37) with adjustable speed and reversibility drives these parts (4 and 5).

Abstract: Apparatus for soldering the wires of the coil on the armature of an electric machine to the commutator thereof. The apparatus has a device for clamping, shifting and fixing the armature, a monophase magnet-hydrodynamic pump with a charger and a pan with molten solder. The magnetic core of the pump has the shape of a hollow cylinder and is externally chamfered at its upper end. The armature to be soldered is disposed vertically with the lower portion of its commutator telescoped within the upper end of the core. Around the core within the pan there is an annular charger disposed coaxially of the core, the charger having its lower end above the bottom of the pan and its upper end on the level of the upper chamfered end of the core so as to form between the upper end of the charger and the upper chamfered end of the core an annular frusto-conical channel with a discharge end directed toward the upper portion of the commutator and the parts of the wires adjacent thereto to solder the wires to the commutator.

Abstract: A solder bath apparatus includes an outer open-ended vessel for containing molten solder and an inner open-ended vessel provided inside the outer vessel and adapted for forming thereon an overflowing layer of molten solder. A conduit member is connected at one end thereof to the bottom portion of the inner vessel and opens at the other end into the outer vessel. A feeding member, preferably, a rotating propeller, is provided in the conduit member for continuously feeding molten solder from the outer vessel to the inner vessel. A plate member is located in the upper portion of the inner vessel and has an opening along one side of the inner vessel to let the molten solder coming from the conduit to the inner vessel flow out only through the opening so that the overflowing layer is formed on the plate member and runs mainly in the direction away from the one side wall and toward the opposite side wall thereof.

Abstract: A conveyor device containing transport frames, each of which is structured for receiving a printed circuit or wiring board carrying circuit components and guided at their leading and their trailing corners by related guide tracks, leads the transport frames to a solder bath, where the transport device lowers the transport frames together with the printed circuit boards towards the solder bath and again raises the same therefrom. During the course of travel of a transport frame containing a printed circuit board carrying one or more of the circuit components through the solder bath one side of the printed circuit board is immersed into the solder bath and then again lifted out of the solder bath.

Abstract: A mass wave soldering apparatus is described. The apparatus comprises a sump having upwardly diagonally extending front and rear walls, and a pair of vertical end walls which cooperate to form an upwardly extending open ended nozzle chamber of increasing plan area. A Z-shaped baffle screen is positioned within the nozzle chamber and distributes the molten solder pumped upwardly in the sump as a wide, smooth substantially unidirectional solder wave ideally contoured for high-speed production soldering.

Abstract: A solder delivery apparatus is provided for delivering molten solder to an applicator for soldering the side seams of can bodies moving in a predetermined path. The apparatus comprises an insulated housing having a unitary body portion, a specially designed crucible located in one part of the unitary body portion, a solder gate in fluid communication with the crucible positioned above the floor of the crucible, yet also providing unimpeded gravity delivery of the molten solder therefrom, heating units partially located within the unitary body portion of the housing to uniformly heat the solder gate and to maintain the molten solder therein at a substantially constant temperature throughout, and an applicator, removably mounted to the unitary body of the housing in fluid communication with the solder gate having heaters therein which maintain the molten solder at a substantially constant temperature.

Abstract: Apparatus is disclosed herein for extending the length of a trailing wave of a double sided laminar wave of solder by the use of a dam in an oil intermix wave soldering system to create a dead zone while still being able to remove oil from the surface of the dead zone area on a continuous basis to prevent contaminants from interfering with soldering operations.

Abstract: A fixture is provided for holding a hybrid substrate having a plurality of components already soldered to conductive patterns and/or lands on the front side thereof and having fingers of a lead frame pressed over one edge thereof for dip soldering lead frame fingers to lands. The fixture comprises a flat plate having a plurality of titanium clips or hook elements extending below the bottom edge of the plate, assembled hybrid substrates being loaded into the fixture with the base of the lead frame resting on the hooks. Slots cut in the front of the plate define a rib that extends over the length of the plate near the bottom edge. The rib contacts the backside of a substrate to form an air gap that prevents flux and solder wicking up it. A hinged cover rests against components on a substrate to hold the latter in place. Only the hook ends of the titanium clips, the lead frame, and a portion of the substrate adjacent the one edge are dipped into molten solder to solder lead fingers to associated lands.

Abstract: Solder is forced through an ejector and flow well to impinge a solder fountain against soldered leads extending through a circuit board from a component. The solder on the leads is melted to permit the removal and replacement of the component. Overflowing solder is collected and recirculated by action of the ejector. The construction of the solder fountain is such that there are no close fitting moving parts which may become clogged by solder inclusions.

Abstract: A wave solder machine is provided which includes an endless moving mesh belt that is made of a nonsolderable material such as titanium wire. The belt is supported so as to be totally immersed in the solder wave as it passes the latter. This causes the undersides of stuffed printed circuit boards on the belt to be brought into contact with the molten solder. The belt wires preferably have a plurality of projections thereon to support the circuit boards above the major portion of the belt. In another machine, the circuit boards are moved along a plurality of parallel wires that pass through the solder wave. Alternatively, the wires themselves may be moving for carrying circuit boards across the solder wave.

Abstract: A printed circuit board has a coating comprising a selected deformable material which is solder-compatible, and has a melting point below that of solder. Electrical and electronic components are then loaded in position on the board with their leads extending through holes in the board, and imbedded into or through the coating. The coating acts as a jig to steady or stabilize the components in position in the board so that the component leads may then be trimmed to finish length, and the components are then soldered in place. Alternatively the board may be placed in storage for future soldering operation. The coating is melted and displaced simultaneously with soldering. Preferred as coating material are naturally occurring and synthetic waxes having a melting point in the range of about 120.degree.-195.degree. F. In a preferred embodiment of the invention compatible flux active agents are intermixed with the coating material.

Abstract: In the wave soldering of terminals of an electrical device, such as a miniaturized printed circuit board assembly, the board is moved along a predetermined path so that it initially engages a first solder wave flowing counter to the direction of the board movement and subsequently engages a second solder wave flowing in the direction of board movement. The velocity of the solder in each of the solder waves is controlled independently by having separate independent pumping systems. Thus, the solder waves can be set at different independent velocities to achieve proper soldering of the terminals and associated conductor paths while reducing crossovers or bridges (i.e., shorts) between the terminals and the conductor paths as a result of the close spacing thereof.

Abstract: A tapered array of apertures are provided in a wall of a solder pot to permit passage of molten solder therethrough. Molten solder is pumped along an outside channel, perpendicular to the axes of the apertures, and through the apertures to cause the solder pot to overflow with a uniformly distributed wave. The array tapers in the direction of pumped fluid flow.

Abstract: A pallet for holding a printed circuit board on a conveyor in a solder wave machine which applies molten solder to the underside of the printed circuit board for completing connections, includes a pair of longitudinally extending first and second bars mounted on a frame, the bars including a pair of oppositely disposed longitudinally-extending grooves for receiving the opposite side marginal edges of the printed circuit board. Each one of the grooves is substantially channel-shaped and extends to the rear end portion of the bars so that the printed circuit board may be slipped into the grooves at the rear end portion of the bars to insert the board in position. One of the bars is transversely movable relative to the frame, and the other bar is fixed in position on the frame, the movable bar being fixed releasably to the first bar in an adjusted position to the frame for accommodating various different sizes of boards.

Abstract: A printed wiring board is oriented with a wiring surface facing up for mass soldering. Molten solder is pumped from a tank onto a trough and flows in a thin, wide stream across the upper surface of the printed wiring board which is held down to prevent the board from floating on top of the solder.

Abstract: A mass soldering system is described in which a standing wave of molten solder is formed. The solder wave is characterized by having a substantially horizontal crest, and the wave has varying pressures along its flow path. In a preferred embodiment of the invention the wave pressures are varied to produce a wave having increasing pressure along its flow path whereby a substantially uni-directional wave may be formed which is highest adjacent its rear.

Abstract: A mass wave soldering system is described in which a standing wave of molten solder is formed from a static head of solder. The system comprises a soldering apparatus which has a two-compartment solder reservoir. The first compartment is designed to hold a first portion of the solder supply at a first liquid level with a layer of oil floating on the solder therein. The second compartment is designed for holding a second portion of the solder supply at a second liquid level above the first liquid level with a layer of oil floating on the solder therein. A sump and nozzle are positioned in the first compartment so that the sump is partially submerged in the molten solder therein, with the nozzle above the solder and oil levels therein, but below the solder and oil levels in the second compartment.

Abstract: .[.Article.]. .Iadd.An article .Iaddend.to be soldered, fused or brazed is placed in hot saturated vapors generated by continuously boiling .Iadd.a .Iaddend.heat transfer liquid having selected properties including .Iadd.a .Iaddend.boiling point at least equal to, and preferably above, .Iadd.the .Iaddend.temperature required for .Iadd.such .Iaddend.operation. Vapors condense on .Iadd.the .Iaddend.article and give up latent heat of vaporization to heat .Iadd.the .Iaddend.article to .Iadd.the .Iaddend.temperature for soldering, fusing or brazing. .[.Heat.]. .Iadd.The heat .Iaddend.transfer liquid may be a fluorocarbon. Apparatus is shown for soldering, fusing or brazing a single article, a batch of articles, or a continuously moving line of articles. Specifically, mass reflow soldering and mass wave soldering operations are described. .Iadd.