Special Photocell Patents (Class 250/214.1)
  • Patent number: 11493382
    Abstract: Systems and methods for providing invisible sensor aperture for electronic devices. In one embodiment, an example device may have a display that includes a cover layer, a first layer disposed on the cover layer, the first layer having a substantially white ink that is translucent, a second layer disposed on the first layer, the second layer having the substantially white ink, a third layer disposed on the second layer, the third layer having the substantially white ink, and a fourth layer comprising a dark-colored ink, wherein the fourth layer includes a first aperture aligned with a sensor of the device located beneath the fourth layer.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: November 8, 2022
    Assignee: Amazon Technologies, Inc.
    Inventors: Angeles Marcia Almanza-Workman, Ruomeng Yu, Ever Edgardo Lopez, Seokchan Hong
  • Patent number: 11482556
    Abstract: Various embodiments of the present disclosure are directed towards an image sensor. The image sensor includes a first semiconductor substrate having a photodetector and a floating diffusion node. A transfer gate is disposed over the first semiconductor substrate, where the transfer gate is at least partially disposed between opposite sides of the photodetector. A second semiconductor substrate is vertically spaced from the first semiconductor substrate, where the second semiconductor substrate comprises a first surface and a second surface opposite the first surface. A readout transistor is disposed on the second semiconductor substrate, where the second surface is disposed between the transfer gate and a gate of the readout transistor. A first conductive contact is electrically coupled to the transfer gate and extending vertically from the transfer gate through both the first surface and the second surface.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: October 25, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Seiji Takahashi, Jhy-Jyi Sze
  • Patent number: 11430400
    Abstract: The present application discloses a display panel, a driving method and a display device. The display panel includes: a substrate, where the substrate is provided thereon with a plurality of data lines, a plurality of gate lines, and a plurality of pixels; each row of pixels includes a plurality of pixel groups, and each pixel group includes a first column of pixels and a second column of pixels; and a timing control chip configured to control the turn-on time of gate activating signals of the first column of pixels and the second column of pixels. The turn-on time of the gate activating signal of the first column of pixels is greater than the turn-on time of the gate activating signal of the corresponding second column of pixels.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: August 30, 2022
    Assignee: HKC CORPORATION LIMITED
    Inventor: Chuan Wu
  • Patent number: 11418686
    Abstract: An imaging module includes: a substrate on which an imaging element is mounted and in which a through-hole is formed; a holding section that has a support pin inserted into the through-hole in such a manner that the support pin penetrates the through-hole and that holds an optical system forming a subject image on the imaging element; and an adhesive that is provided in the through-hole and that fixes the substrate to the support pin, and at least a tip end portion of the support pin has a tapered shape from a root side of the support pin toward a tip end of the support pin.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: August 16, 2022
    Assignee: HITACHI ASTEMO, LTD.
    Inventors: Masayuki Okamura, Akihiro Yamaguchi, Chiemi Kubota, Hidenori Shinohara, Kenichi Takeuchi
  • Patent number: 11418743
    Abstract: A photoelectric conversion apparatus includes a pulse shaping circuit that shapes an output from a diode of avalanche amplification type into a pulse, and a pulse conversion circuit that converts a pulse signal output from the pulse shaping circuit. The pulse conversion circuit converts a pulse signal having a first amplitude and output from the pulse shaping circuit into a pulse signal having a second amplitude smaller than the first amplitude.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: August 16, 2022
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Yukihiro Kuroda
  • Patent number: 11411036
    Abstract: A solid-state imaging device includes a first substrate including a first semiconductor substrate and a first multi-layered wiring layer stacked on the first semiconductor substrate, a second substrate including a second semiconductor substrate and a second multi-layered wiring layer stacked on the second semiconductor substrate, a third substrate including a third semiconductor substrate and a third multi-layered wiring layer stacked on the third semiconductor substrate, and a first coupling structure for electrically coupling the first substrate and the second substrate. The first substrate, the second substrate, and the third substrate are stacked in this order. The first substrate and the second substrate are bonded together such that the first multi-layered wiring layer and the second multi-layered wiring layer are opposed to each other. The first substrate excludes a coupling structure formed from the first substrate as a base over bonding surfaces of the first substrate and the second substrate.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: August 9, 2022
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Takatoshi Kameshima, Hideto Hashiguchi, Ikue Mitsuhashi, Hiroshi Horikoshi, Reijiroh Shohji, Minoru Ishida, Tadashi Iijima, Masaki Haneda
  • Patent number: 11412590
    Abstract: A single photon avalanche diode based range detecting apparatus includes a reference array of single photon avalanche diodes configured to receive light from an illumination source via an internally coupled path. A return array of single photon avalanche diodes is configured to receive light from the illumination source via an external free space path. A calibration pulse generator is configured to generate a calibration signal pulse. Readout circuitry is configured to receive an output of the reference array via a reference signal path, an output of the return array via a return signal path, and an output of the calibration pulse generator via a calibration signal path. The readout circuitry is configured to determine a delay difference value between the reference signal path and the return signal path based on the output of the calibration pulse generator via the calibration signal path.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: August 9, 2022
    Assignee: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
    Inventors: John Kevin Moore, Caixin Zhuang
  • Patent number: 11405567
    Abstract: A dynamic vision sensor including a dynamic vision sensor pixel array including an active region and an optical black region, the active region configured to output a plurality of first signals corresponding to a plurality of first events indicating a change in an intensity of light, the optical black region configured to output a plurality of second signals corresponding to a plurality of second events not indicating the change in the intensity of light, and processing circuitry configured to, generate a plurality of event signals based on the plurality of first signals, generate a plurality of noise signals based on the plurality of second signals, calculate a value representing real events among the plurality of first events based on the plurality of event signals and the plurality of noise signals, and selectively output the plurality of event signals based on the value representing real events and a threshold value.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: August 2, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Jong-Seok Seo
  • Patent number: 11350054
    Abstract: Techniques and architectures for simultaneous readout and integration of image data from pixels while increasing their sensitivity and reducing required data rates for moving information off of the chip using pixels configured to conduct Analog-to-Digital Conversions (ADCs) of image data, wherein each pixel operates in a rolling Integrate While Read (IWR) mode using SRAM in place of traditional latches for in-pixel storage.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: May 31, 2022
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventor: Allen W. Hairston
  • Patent number: 11340403
    Abstract: One illustrative device disclosed herein includes a layer of semiconductor material and a first Bragg reflector structure positioned in the layer of semiconductor material, wherein the first Bragg reflector structure comprises a plurality of dielectric elements and a first internal area defined by an innermost of the first plurality of dielectric elements. In this example, the device also includes an optical component positioned above the layer of semiconductor material, wherein at least a portion of the optical component is positioned within a vertical projection of the first internal area.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: May 24, 2022
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yusheng Bian, Ajey Poovannummoottil Jacob
  • Patent number: 11335723
    Abstract: An image pickup element using an APD is provided. The image pickup element has a first substrate, a second substrate, and a connector. The first substrate is provided with a plurality of light receivers having the APD. The second substrate has a pixel circuit that corresponds to each of the APDs. Additionally, the connector electrically connects the APD and the pixel circuit corresponding to the APD.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: May 17, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventor: Masanori Tanaka
  • Patent number: 11322635
    Abstract: A photodetecting device includes a semiconductor substrate including a one-dimensionally distributed plurality of pixels. The photodetecting device includes, for each pixel, a plurality of avalanche photodiodes arranged to operate in Geiger mode, a plurality of quenching resistors electrically connected in series with the respective avalanche photodiodes, and a signal processing unit arranged to process output signals from the plurality of avalanche photodiodes. Light receiving regions of the plurality of avalanche photodiodes are two-dimensionally distributed for each pixel. Each signal processing unit includes a gate grounded circuit and a current mirror circuit electrically connected to the gate grounded circuit. The gate grounded circuit is electrically connected to the plurality of avalanche photodiodes of the corresponding pixel via the plurality of quenching resistors. The current minor circuit is arranged to output a signal corresponding to output signals from the plurality of avalanche photodiodes.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: May 3, 2022
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi Baba, Shunsuke Adachi, Shigeyuki Nakamura, Terumasa Nagano, Koei Yamamoto
  • Patent number: 11313718
    Abstract: A light detection system is provided for association with a light source. The light detection system includes a light detector and circuitry. The light detector includes semiconductor film and phototube devices and is disposed with at least one line-of-sight (LOS) to the light source. The circuitry is coupled to the light detector and the light detector and the circuitry are configured to cooperatively identify a presence and a characteristic of a light emission event at the light source.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: April 26, 2022
    Assignee: CARRIER CORPORATION
    Inventors: Marcin Piech, Peter R. Harris
  • Patent number: 11296245
    Abstract: A light receiving element includes a surface recombination prevention layer composed of a first compound semiconductor on which light is incident; a photoelectric conversion layer composed of a second compound semiconductor; and a compound semiconductor layer composed of a third compound semiconductor, the surface recombination prevention layer having a thickness of 30 nm or less. Also, there are provided an image capturing element including the light receiving element, and an image capturing apparatus including the image capturing element.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: April 5, 2022
    Assignee: Sony Corporation
    Inventors: Shiro Uchida, Hideshi Abe, Tomomasa Watanabe, Hiroshi Yoshida
  • Patent number: 11283977
    Abstract: A camera module includes a support base, an optical filter and a lens assembly. The lens assembly is installed on the support base. The support base includes a plastic platform and a metal frame. The metal frame is bonded to the plastic platform. The optical filter is sandwiched between the plastic platform and the metal frame. The present invention further involves a mobile terminal. The support base is formed by bonding the plastic platform to the metal frame and bonding the optical filter between the plastic platform and the metal frame. The metal frame embedded in the plastic platform can greatly increase the strength of the support base, and besides, the optical filter is fixedly sandwiched between the plastic platform and the metal frame without needing to further fix the optical filter by using adhesives, preventing the optical filter from becoming dirty in the process of fixing.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: March 22, 2022
    Assignee: KUNSHAN Q TECHNOLOGY COMPANY LIMITED
    Inventors: Yangliu Xu, Aiguo Deng, Huanhuan Yan, Yuanbin Jin
  • Patent number: 11283980
    Abstract: An apparatus and method for recording a scene using two lighting setups in alternation so as to concurrently record motion picture footage of the scene for each lighting setup, the footage for the two lighting setups having minimized motion offset. The apparatus includes: a plurality of light sources, a controller to define two lighting setups using the plurality of light sources, and to actuate the lighting setups in alternation, a camera to capture a sequence of frames showing the scene illuminated by one of the two lighting setups in alternation, and optionally a processing module to process the sequence of frames to generate two clips of footage of the scene, each corresponding to a lighting setup. The timing of actuation of the lighting setups relative to the frame boundaries avoids the need to use optical flow algorithms to remove motion artifacts, and the need for a specialized high speed camera.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: March 22, 2022
    Assignee: Satellite Lab, LLC
    Inventors: Carlo Van de Roer, Stuart Rutherford
  • Patent number: 11276794
    Abstract: A semiconductor substrate includes first and second main surfaces opposing each other. The semiconductor substrate includes second semiconductor regions in a side of the second main surface. Each of the second semiconductor regions includes a first region including a textured surface, and a second region where a bump electrode is disposed. The second semiconductor regions are two-dimensionally distributed in a first direction and a second direction orthogonal to each other when viewed in a direction orthogonal to the semiconductor substrate. The first region and the second region are adjacent to each other in a direction crossing the first direction and the second direction. The textured surface of the first region is located toward the first main surface in comparison to the surface of the second region in a thickness direction of the semiconductor substrate. The first main surface is a light incident surface of the semiconductor substrate.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: March 15, 2022
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Tomoya Taguchi, Yuki Yoshida, Katsumi Shibayama
  • Patent number: 11268849
    Abstract: A method, an inspection system and a sensing unit. The sensing unit may include a light recycling optics and a photon to electron converter. The photon to electron converter is configured to receive a first light beam emitted from the object and impinging on the partially reflective surface at a first oblique angle, absorb a first portion and reflect a second portion of the first light beam to provide a first reflected beam. The light recycling optics is configured to redirect, towards the partially reflective surface, one or more reflected beams reflected from the partially reflective surface to provide one or more recycled beams. The photon to electron converter is configured to output electrons that represents an absorbed portion of the input light beam and an absorbed portion of each one of the one or more recycled beam.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: March 8, 2022
    Assignee: Applied Materials Israel Ltd.
    Inventor: Pavel Margulis
  • Patent number: 11266759
    Abstract: An illuminator comprising more than one set of ultraviolet radiation sources. A first set of ultraviolet radiation sources operate in a wavelength range of approximately 270 nanometers to approximately 290 nanometers. A second set of ultraviolet radiation sources operate in a wavelength range of approximately 380 nanometers to approximately 420 nanometers. The illuminator can also include a set of sensors for acquiring data regarding at least one object to be irradiated by the first and the second set of ultraviolet radiation sources. A control system configured to control and adjust a set of radiation settings for the first and the second set of ultraviolet radiation sources based on the data acquired by the set of sensors.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: March 8, 2022
    Assignee: Sensor Electronic Technology, Inc.
    Inventor: Arthur Peter Barber, III
  • Patent number: 11264424
    Abstract: An imaging device includes a photodetector and an optical filter disposed on a light-receiving surface of the photodetector. The optical filter may include a diffraction grating, a core layer, and a reflector disposed on first and second opposing sides of the core layer. In some cases, the optical filter (e.g., a guided mode resonance (“GMR”) filter) uses interference of electromagnetic waves on an incidence plane of light or a plane parallel to the incidence plane. The reflector may reflect electromagnetic waves between adjacent optical filters. In some cases, the imaging device is a back-side-illuminated or front-side-illuminated CMOS or CCD image sensor.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: March 1, 2022
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Sozo Yokogawa, Hirotaka Murakami, Mikinori Ito
  • Patent number: 11265498
    Abstract: A Time-of-Flight (ToF)-based three-dimensional (3D) image sensor includes at least two first photogates symmetrically arranged in a central portion of a pixel, at least two first gates configured to remove an overflow charge generated in the at least two first photogates, and a first gate group. The at least two first gates are arranged symmetrically in an outer portion of the pixel. The first gate group includes a plurality of gates configured to store and transmit charges generated in the at least two first photogates. The first gate group is arranged in the outer portion of the pixel.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: March 1, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Gu Jin, Young-Chan Kim, Sung-Ho Choi
  • Patent number: 11262460
    Abstract: A radiation monitor for a lighting device, and operating methods and systems therefor are provided. In one example, a radiation monitor may include a first sensor receiving radiation output directly from a light-emitting element of the lighting device and radiation output from external sources; and a second sensor receiving the radiation output from the external sources without receiving the radiation output directly from the light-emitting element of the lighting device. The radiation monitor may determine an intensity of the radiation output directly from the light-emitting element based on a difference in the output signals from the first sensor and the second sensor.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: March 1, 2022
    Assignee: Phoseon Technology, Inc.
    Inventors: Gary Nordseth, Garth Eliason, Gordon Neumann, Gary Till, Gary McKenzie
  • Patent number: 11262785
    Abstract: The disclosure describes an adaptive and optimal imaging of individual quantum emitters within a lattice or optical field of view for quantum computing. Advanced image processing techniques are described to identify individual optically active quantum bits (qubits) with an imager. Images of individual and optically-resolved quantum emitters fluorescing as a lattice are decomposed and recognized based on fluorescence. Expected spatial distributions of the quantum emitters guides the processing, which uses adaptive fitting of peak distribution functions to determine the number of quantum emitters in real time. These techniques can be used for the loading process, where atoms or ions enter the trap one-by-one, for the identification of solid-state emitters, and for internal state-detection of the quantum emitters, where each emitter can be fluorescent or dark depending on its internal state.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: March 1, 2022
    Assignee: University of Maryland, College Park
    Inventors: Christopher Monroe, Jiehang Zhang, David Wong-Campos, Antonios Kyprianidis, Patrick Michael Becker
  • Patent number: 11239265
    Abstract: Example embodiments relate to single-photon avalanche diode detector (SPAD) arrays. One embodiment includes a SPAD array that includes a silicon substrate, a plurality of primary electrodes, and a plurality of secondary electrodes. Each of the primary electrodes includes a semiconductor material of a first doping type, extends in the silicon substrate in a first direction, and has a rotationally symmetric cross-section in a first plane perpendicular to the first direction. The plurality of secondary electrodes includes a semiconductor material of a second doping type and extends parallel to the primary electrodes in the silicon substrate. Further, the silicon substrate includes a doped upper field redistribution layer, a doped lower field redistribution layer, and a doped depletion layer arranged between the upper field redistribution layer and the lower field redistribution layer.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: February 1, 2022
    Assignees: IMEC VZW, Katholieke Universiteit Leuven, KU LEUVEN R&D
    Inventor: Edward Van Sieleghem
  • Patent number: 11209308
    Abstract: Provided is a semiconductor light detection device having a relatively high detection sensitivity to a light component of a specific wavelength. The semiconductor light detection device includes: a semiconductor light receiving element, in which a first conductive layer is formed on a surface of a semiconductor substrate, a second conductive layer is formed below the first conductive layer, a third conductive layer is formed below the second conductive layer, and a photocurrent based on the intensity of incident light is output from the third conductive layer while an input voltage is applied to the first conductive layer; and a semiconductor detection circuit configured to output an output voltage based on a current difference between a first photocurrent and a second photocurrent being output in response to the application of the first input voltage and the second input voltage, respectively.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: December 28, 2021
    Assignee: ABLIC INC.
    Inventor: Toshiro Futatsugi
  • Patent number: 11194089
    Abstract: A method for manufacturing a light emitting module including the steps of: preparing a light source including a light emitting element that has a pair of electrodes on the same surface side, and an encapsulation member that covers the light emitting element so as to expose a portion of a surface of the pair of electrodes; preparing a lightguide plate having a first primary surface to be a light emitting surface, and a second primary surface on an opposite side from the first primary surface, wherein the second primary surface has a recessed portion that has a bottom surface and at least one lateral surface; placing the light source on the bottom surface of the recessed portion with the electrodes facing up so as to be spaced apart from the lateral surface of the recessed portion; arranging a cover member that buries a gap between the lateral surface of the recessed portion and the light source and covers the light source including the electrodes; removing the cover member until the electrodes are exposed; and
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: December 7, 2021
    Assignee: NICHIA CORPORATION
    Inventor: Shinichi Daikoku
  • Patent number: 11177373
    Abstract: A semiconductor device is manufactured with high mass productivity at low cost. Yield in a manufacturing process of the semiconductor device is improved. An island-shaped metal oxide layer is formed over a substrate, a resin layer is formed over the metal oxide layer to cover an end portion of the metal oxide layer, and the metal oxide layer and the resin layer are separated by light irradiation. After forming the resin layer and before the light irradiation, an insulating layer is formed over the resin layer. For example, the resin layer is formed in an island shape and the insulating layer is formed to cover an end portion of the resin layer. In the case where an adhesive layer is formed over the resin layer, the adhesive layer is preferably formed to be located inward from the end portion of the metal oxide layer.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: November 16, 2021
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Masahiro Katayama, Masayoshi Dobashi, Masataka Nakada
  • Patent number: 11177310
    Abstract: A solid-state image pickup device capable of suppressing the generation of dark current and/or leakage current is provided. The solid-state image pickup device has a first substrate provided with a photoelectric converter on its primary face, a first wiring structure having a first bonding portion which contains a conductive material, a second substrate provided with a part of a peripheral circuit on its primary face, and a second wiring structure having a second bonding portion which contains a conductive material. In addition, the first bonding portion and the second bonding portion are bonded so that the first substrate, the first wiring structure, the second wiring structure, and the second substrate are disposed in this order. Furthermore, the conductive material of the first bonding portion and the conductive material of the second bonding portion are surrounded with diffusion preventing films.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: November 16, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Mineo Shimotsusa
  • Patent number: 11171165
    Abstract: The present invention provides a photoelectric conversion element including a photoelectric conversion film having a narrow half-width of absorption peak and an excellent photoelectric conversion efficiency, and an imaging element, an optical sensor, and a compound. The photoelectric conversion element according to the present invention includes a conductive film, a photoelectric conversion film, and a transparent conductive film, in this order, in which the photoelectric conversion film contains a compound represented by Formula (1).
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: November 9, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Eiji Fukuzaki, Tomoyuki Mashiko, Tomoaki Yoshioka, Koichi Iwasaki
  • Patent number: 11156497
    Abstract: A device including a plurality of epitaxial chips is disclosed. An epitaxial chip can have one or more of a light source and a detector, where the detector can be configured to measure the optical properties of the light emitted by a light source. In some examples, one or more epitaxial chips can have one or more optical properties that differ from other epitaxial chips. The epitaxial chips can be dependently operable. For example, the detector located on one epitaxial chip can be configured for measuring the optical properties of light emitted by a light source located on another epitaxial chip by way of one or more optical signals. The collection of epitaxial chips can also allow detection of a plurality of laser outputs, where two or more epitaxial chips can have different material and/or optical properties.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: October 26, 2021
    Assignee: Apple Inc.
    Inventors: Alfredo Bismuto, David I. Simon, Jason Pelc
  • Patent number: 11121268
    Abstract: A semiconductor light-receiving element includes a substrate; a light-receiving mesa portion, formed on top of the substrate, including a first semiconductor layer of a first conductivity type, an absorption layer, and a second semiconductor layer of a second conductivity type; a light-receiving portion electrode, formed above the light-receiving mesa portion, connected to the first semiconductor layer; a pad electrode formed on top of the substrate; and a bridge electrode, placed so that an insulating gap is interposed between the bridge electrode and the second semiconductor layer, configured to connect the light-receiving portion electrode and the pad electrode on top of the substrate, the bridge electrode being formed in a layer separate from layers of the light-receiving portion electrode and the pad electrode.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: September 14, 2021
    Assignee: Lumentum Japan, Inc.
    Inventors: Ryu Washino, Hiroshi Hamada, Takafumi Taniguchi
  • Patent number: 11122224
    Abstract: An event-based sensor includes a dummy pixel that generates a dark current, a current mirror that generates a mirrored current using the dark current, and a sensing pixel that generates a sense current based on an intensity of incident light, and outputs an activation signal, indicating whether a variation in the incident light is sensed, based on a light current that is obtained by subtracting the mirrored current from the sense current.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: September 14, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yunjae Suh, Sung Ho Kim, Junseok Kim, Hyunsurk Ryu
  • Patent number: 11105292
    Abstract: According to the conventional knowledge, a thermal humidity measurement device has problems in which the direction of air flow is limited to one direction is too hard to handle in securing the humidity responsiveness because there are limitations on the mounting direction of the thermal humidity measurement device and the state of air flow. An introduction guide protrudes from an air introduction surface to the outside of a measurement chamber, is parallel to a humidity introduction port surface, and has a portion not in contact with an inlet surface of a humidity introduction tube as seen from any direction to guide the flow of air to the humidity introduction tube from any direction of 360°.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: August 31, 2021
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Ryo Ando, Hiroshi Onuki, Yoshiyuki Akiyama, Shigenobu Komatsu, Takeo Hosokawa
  • Patent number: 11102438
    Abstract: A two-by-two array consists of four pixels. Each pixel comprises one light-sensing transistor and one reading transistor. Both the light sensing transistor and the reading transistor are formed above a same P-type semiconductor substrate, and have a composite dielectric gate structure. The substrates of the four reading transistors are connected to form a regular octagonal ring structure located in the center of the array. On four sides of the regular octagonal ring structure, four heavily-doped N+ regions are formed on the substrates not covered with the composite dielectric gate, of which every two regions are opposite to each other and form right angles, wherein two opposite heavily-doped N+ regions are connected to form a shared N+ source, and the other two are connected to form a shared N+ drain.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: August 24, 2021
    Assignee: NANJING UNIVERSITY
    Inventors: Haowen Ma, Zhijian Huang, Yi Shi, Feng Yan, Limin Zhang, Xiaofeng Bu, Yuqian Li, Zhangnan Li, Xiangshun Kong, Cheng Mao, Cheng Yang, Xu Cao
  • Patent number: 11081511
    Abstract: According to some aspects, an imaging device is provided comprising a photoelectric conversion layer configured to receive light and to produce an electric charge in response to the received light, including a first filter region corresponding to a first pixel of the imaging device, the first filter region having a first thickness and a plurality of through holes formed therein, wherein the first filter region transmits light incident on the first filter region with a first peak transmission wavelength, and a second filter region corresponding to a second pixel of the imaging device, the second filter region having a second thickness greater than the first thickness and having a plurality of through holes formed therein, wherein the second filter region transmits light incident on the second filter region with a second peak transmission wavelength that is greater than the first peak transmission wavelength.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: August 3, 2021
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Taro Sugizaki
  • Patent number: 11067436
    Abstract: The proposed concept relates to an optical sensor arrangement comprising an optical sensor with an integrated circuit arranged in or on a substrate. The substrate comprises at least a first surface area and a second surface area. At least one optically active sensor component is arranged on or in the substrate of the first surface area. The optically active sensor component is arranged for emitting and/or detecting light of a desired wavelength range. Optically inactive sensor circuitry is arranged on or in the substrate of the second surface area. A display panel comprises an active display area and a non-active display area, wherein the non-active display area comprises a material which is optically transparent in the desired wavelength range and wherein the non-active display area at least partly frames the active display layer.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: July 20, 2021
    Assignee: AMS AG
    Inventors: Bernhard Greimel-Längauer, Franz Lechner, Josef Kriebernegg, Herbert Lenhard, Manuel Hoerbinger, Dan Jacobs
  • Patent number: 11031349
    Abstract: In one embodiment, a method of forming a semiconductor device may include forming a sensing circuit to apply a voltage to a doped region wherein the voltage expands depletion region toward a second depletion region but substantially does not intersect the second depletion region. An embodiment may include configuring the sensing circuit to detect electrons within the doped region and to responsively assert a detection signal representing detection of the electrons wherein the sensing circuit detects the electrons while applying the voltage to the second doped region.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: June 8, 2021
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Johan Camiel Julia Janssens
  • Patent number: 11009772
    Abstract: An imaging system comprises a light source generating a pump beam, and an optical coupling system for receiving an input beam of infrared light from a scene and combining the input beam with the pump beam, wherein an intensity of the pump beam is higher than an intensity of the input beam. The imaging system further comprises a crystal configured for adiabatically mixing the beams and providing an output beam having a frequency which is a sum of frequencies of the input and pump beams, and a visible, near-infrared or ultraviolet light imager configured for collecting and to spectrally resolving the output beam.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: May 18, 2021
    Assignee: Ramot at Tel-Aviv University Ltd.
    Inventors: Haim Suchowski, Michael Mrejen, Assaf Levanon
  • Patent number: 10998372
    Abstract: A method of manufacturing a hybrid focal-plane array includes: forming a read-out integrated circuit with integral bending slit; forming a detector die separately from the read-out integrated circuit and including a detector with integral bending slit; and joining the read-out integrated circuit and the detector die to each other such that the read-out bending slit and the detector bending slit are aligned with each other.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: May 4, 2021
    Assignee: HRL Laboratories, LLC
    Inventors: Geoffrey P. McKnight, Andrew C. Keefe, Alexander R. Gurga, Ryan Freeman
  • Patent number: 10999549
    Abstract: A column parallel ADC circuit includes: plural column ADCs and a digital processing circuit. The plural column ADCs generate respective plural digital counts. The plural column ADCs include a first column ADC and a second column ADC. The first column ADC generates a first digital count according to a first analog signal, and the second column ADC generates a second digital count according to a second analog signal. The first digital count is a difference between a first digital signal and a second digital signal. The first and the second digital signals correspond to the first and the second analog signals respectively. The digital processing circuit generates the plural digital signals, wherein the digital processing circuit generates the first digital signal according to the first digital count and the second digital signal.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: May 4, 2021
    Assignee: PIXART IMAGING INCORPORATION
    Inventors: Kuan Tang, Yi-Cheng Chiu, Chia-Chi Kuo, Jui-Te Chiu
  • Patent number: 10980093
    Abstract: System and method for current control. As an example, the system for current control includes: a transistor including a drain terminal, a gate terminal, and a source terminal, the drain terminal being coupled to one or more light emitting diodes; a resistor coupled to the source terminal of the transistor and configured to generate a resistor voltage related to a current flowing through the one or more emitting diodes; a voltage detector configured to receiver a first input voltage related to a second input voltage received by the one or more light emitting diodes; and a voltage controller coupled to the voltage detector, the resistor, and the gate terminal of the transistor; wherein the voltage detector is further configured to: detect the first input voltage; and generate a control signal based at least in part on the first input voltage.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: April 13, 2021
    Assignee: On-Bright Electronics (Shanghai) Co., Ltd.
    Inventors: Liqiang Zhu, Zhuoyan Li, Jiqing Yang
  • Patent number: 10976239
    Abstract: A method of remotely sensing an object includes: collecting photons from the object; directing the photons down pathways, wherein photons in each of the pathways have a different polarization state; detecting photons in each of the pathways using at least one optical detector, wherein the photons in each of the polarization states produce a signal; receiving, with at least one processor in communication with the at least one optical detector, signals corresponding to the photons in the pathways; determining, with the at least one processor and for a segment of the signals, at least one of: an angle of linear polarization, a degree of polarization, and a degree of circular polarization; and generating a signal corresponding to a sequential output of the angle of linear polarization, degree of polarization, or the degree of circular polarization for each segment.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: April 13, 2021
    Assignee: HART SCIENTIFIC CONSULTING INTERNATIONAL LLC
    Inventors: Michael Hart, Zachary Watson
  • Patent number: 10979621
    Abstract: The inventive concepts provide an auto-focus image sensor and a digital image processing device including the same. The auto-focus image sensor includes a substrate including at least one first pixel used for detecting a phase difference and at least one second pixel used for detecting an image, a deep device isolation portion disposed in the substrate to isolate the first pixel from the second pixel, and a light shielding pattern disposed on the substrate of at least the first pixel. The amount of light incident on the first pixel is smaller than the amount of light incident on the second pixel by the light shielding pattern.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: April 13, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bumsuk Kim, Jungchak Ahn
  • Patent number: 10978015
    Abstract: Embodiments of the present disclosure disclose a method, a device and a display apparatus for adjusting a gate-off voltage. In that the method for adjusting the gate-off voltage includes: obtaining a contrast of the display brightness of the display panel by at least one photosensitive element; comparing the contrast with an initial contrast, and if the difference between the contrast and the initial contrast is greater than the set threshold value, adjusting the gate-off voltage.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: April 13, 2021
    Assignees: HKC Corporation Limited, Chongqing HKC Optoelectronics Co., Ltd.
    Inventor: Yu-Jen Chen
  • Patent number: 10972183
    Abstract: A multimode combiner or coupler (MMC) may combine the inputs into a larger core multimode fiber. The multimode combiner may be combined with a re-transmitting laser for detecting and re-transmitting signals. Thus, the multi-mode combiner may detect and combine input signals, and then retransmit the detected, combined signal. The detection can be implemented with multiple single mode fibers to small single mode detectors or a multi-mode coupler with a larger multi-mode detectors. In embodiments of the MMC, a bi-directional optical splitter/combiner includes a transmitter for re-transmitting an RF signal received at a receiver, a first wave division multiplexer (WDM) combiner combining the output of the first transmitter in an upstream direction to a downstream signal in a downstream direction, and a second WDM combiner combining split downstream signals in the downstream direction with upstream signals received via at least two optical fiber inputs.
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: April 6, 2021
    Assignee: ARRIS Enterprises LLC
    Inventors: Venkatesh G. Mutalik, Marcel F. Schemmann, Dean Stoneback, John Chrostowski
  • Patent number: 10971539
    Abstract: A solid-state imaging device includes a photon detector that operates in a Geiger mode and outputs an output signal in accordance with incidence of a photon, a quench element that causes the photon detector to transition to a non-Geiger mode in accordance with the output signal, a control unit that, when the photon detector transitions from a Geiger mode to a non-Geiger mode, switches the quench element from a detection mode, in which the quench element is in a relatively low resistance state and the photon detector detects a photon, to a hold mode, in which the quench element is in a relatively high resistance state and holds the output signal, and a signal processing circuit that performs a predetermined process on the output signal.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: April 6, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yu Maehashi, Yasuji Ikeda
  • Patent number: 10962409
    Abstract: The invention discloses a method and system for measuring orbital angular momentum modes of photons based on spiral transformation. A phase plate located in an input plane transforms the incident beam along a spiral path in the input plane into a straight line in an output plane and a phase plate located in the output plane compensate the phase accumulated when the beam propagates from the input plane to the output plane during the above transformation process, thereby realizing that the orbital angular momentum modes of photons to be measured in the input plane are transformed into plane wave modes with specific tilted wavefronts in the output plane. The plane wave modes with different tilted wavefronts can be focused on different positions on the focal plane and thus realize one-to-one mapping and detection between orbital angular momentum modes of photons and spatial locations.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: March 30, 2021
    Assignee: SUN YAT-SEN UNIVERSITY
    Inventors: Yujie Chen, Yuanhui Wen, Ioannis Chremmos, Siyuan Yu
  • Patent number: 10957724
    Abstract: A back side illuminated image sensor may operate using the single-photon avalanche diode (SPAD) concept in a Geiger mode of operation for single photon detection. The image sensor may be implemented using two layer stacking with a silicon on insulator (SOI) chip. The chip-to-chip electrical connections between the top level image sensing chip and the second level ASIC circuit chip may be realized at each pixel with a single bump connection per pixel. A light level signal may be obtained from pixels that have photon counting capabilities while a distance measurement signal for 3-dimensional imaging may be obtained from pixels that have time-of-flight (ToF) detection capabilities. Both types of pixels may be integrated within the same array and use the same SPAD structure placed on the top chip.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: March 23, 2021
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Jaroslav Hynecek
  • Patent number: 10955555
    Abstract: Optical apparatus includes a projector, which directs a sequence of pulses of radiation toward a scene so as to form one or more lines of the radiation on the scene. A receiver includes an array of single-photon detectors, which output, in response to the radiation that is incident thereon, signals indicative of a time-of-flight of the pulses from the projector to the receiver via the points in the scene, and collection optics, which form an image the scene on the array, including the one or more lines of the radiation, such that each single-photon detector receives the radiation reflected from a corresponding point in the scene. A processor receives the signals output by the sensing elements, and derives depth coordinates of the points in the scene from both the time-of-flight of the pulses and triangulation of the one or more lines in the image.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: March 23, 2021
    Assignee: APPLE INC.
    Inventors: Thierry Oggier, Scott T. Smith, Andrew Herrington
  • Patent number: 10950640
    Abstract: An image sensor includes a plurality of pixels, at least one of the pixels comprising: a photodiode configured to generate charges in response to light; and a pixel circuit disposed on the substrate, and including a storage transistor configured to store the charges generated by the photodiode, and a transfer transistor connected between the storage transistor and a floating diffusion node, wherein a potential of a boundary region between the storage transistor and the transfer transistor has a first potential when the transfer transistor is in a turned-off state, and has a second potential, lower than the first potential, when the transfer transistor is in a turned-on state.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: March 16, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young Gu Jin, Yong Hun Kwon, Young Chan Kim, Sae Young Kim, Sung Young Seo, Moo Sup Lim, Tae Sub Jung, Sung Ho Choi