Abstract: Various embodiments provide a wellness tracking device with a base plate that may be utilized as a combination electrode by a variety of sensors. The base plate may be a multi-material electrode that includes a conductor and a transparent or semi-transparent material to enable optical sensing. In certain embodiments, the base plate supports a plurality of different sensors, which may selectively utilize the base plate as an electrode.

Abstract: The invention relates to a display device having an integrated, optically operating proximity sensor system (76) for detecting an object present within an observation space in front of the display device, such as a hand or a finger of a hand of a person. The display device is provided with a display unit (11) which has a front side (60) having an information-displaying display surface (62) and having an edge region (64), which adjoins said display surface and is not used for the display of information, and a rear side. The display device also has a proximity sensor system (76) having at least one transmitter (78) for emitting sensor radiation towards the observation space and having at least one receiver (74) for receiving sensor radiation reflected from the observation space.

Abstract: A camera module includes: a first substrate on which an image sensor configured to convert an optical signal incident through a lens module into an electrical signal is disposed and a first connection terminal is disposed; a second substrate spaced apart from the first substrate and including a second connection terminal formed in a position facing the first connection terminal; and a terminal connector electrically connecting the first connection terminal and the second connection terminal to each other and configured to maintain a preset distance between the first substrate and the second substrate. In the camera module, the terminal connector includes: a connecting member including a first connection portion, a second connection portion, and a deformable portion; and a support member configured to maintain the preset distance between the first substrate and the second substrate.

Abstract: An optical measuring device which measures absorbance of a measuring object at a plurality of wavelengths, the optical measuring device comprising: a light source device; and an optical measuring part which irradiates the measuring object with light from the light source device and performs optical measurement of the measuring object based on light from the measuring object, wherein the light source device has a first light source, a second light source, and a light source control part which drives the first light source and the second light source, the light source control part performs heating and light emitting drive of the first light source, and drives the second light source, and the light source device irradiates the measuring object with combined light of light from the first light source and light diffused and reflected on a surface of the filament.

Abstract: Described herein is a spectrometer device. The spectrometer device includes: at least one filter element adapted to separate at least one incident light beam into a spectrum of constituent wavelength; at least one sensor element having a matrix of optical sensors, the optical sensors (116,142) each having a light-sensitive area; and at least one evaluation device configured for determining at least one longitudinal coordinate of an object.

Abstract: Apparatuses, systems, method, reagents, and kits for conducting assays as well as process for their preparation are described. The apparatuses, systems, method, reagents, and kits may be employed in conducting automated analysis in a multi-well plate assay format.

Abstract: The subject matter of this specification can be embodied in, among other things, a graphene plasmon resonator that includes a planar patterned layer having a collection of electrically conductive segments, and a collection of dielectric segments, each dielectric segment defined between a corresponding pair of the electrically conductive segments, a graphene layer substantially parallel to the planar patterned layer and overlapping the collection of electrically conductive segments, and a planar dielectric layer between the planar patterned layer and the graphene layer.

Abstract: The patent application relates to a PN junction as well as the preparation method and use thereof. Said PN junction comprises a p-type CIGS semiconductor thin film layer and an n-type CIGS semiconductor thin film layer, wherein the n-type CIGS semiconductor thin film layer comprises or consists essentially of elements Cu, In, Ga and Se, where the Cu to In molar ratio is within the range of 1.1 to 1.5, and has a chemical formula of Cu(InxGa1-x)Se2, where x is within the range of 0.6 to 0.9. The patent application further relates to a semiconductor thin film element comprising said PN junction, in particular a photodiode element, and a photoelectric sensing module comprising said semiconductor thin film element as well as the various uses thereof.

Abstract: A flow imaging system based on matrix laser scanning are provided. In the system, a beam splitter component modulates continuous laser generated by a laser source, and the continuous laser is focused on a focal plane by an illumination objective to form matrix spots. The matrix spots are irradiated on a single-cell axial flow of a fluid focusing component. When cells in the single-cell axial flow pass through the matrix spots, a fluorescent signal and a scattered light signal generated are received by a light collecting objective, and then sent to a photoelectric detector through a condenser. The photoelectric detector converts the fluorescence and scattered light signals excited into voltage signals, and the collecting card collects and converts the signals into digital signals, and sends the digital signals to a computer to be recovered through the computer, so as to obtain a cell image.

Abstract: An interaction element is configured to receive touch or gesture inputs or provide tactile feedback outputs. A control element is configured to control the operation of at least one function of at least one device including at least one or more such interaction elements. A motor vehicle includes at least one or more such interaction elements or at least one or more such control elements.

Abstract: An exemplary photodetector system includes a plurality of photodetectors connected in parallel and a processor communicatively coupled to the plurality of photodetectors. The processor is configured to receive an accumulated output from the plurality of photodetectors. The accumulated output represents an accumulation of respective outputs from each of the plurality of photodetectors detecting photons during a predetermined measurement time period that occurs in response to a light pulse being directed toward a target within a body. The processor is further configured to determine, based on the accumulated output, a temporal distribution of photons detected by the plurality of photodetectors, and generate, based on the temporal distribution of photons, a histogram representing a light pulse response of the target within the body.

Abstract: The present disclosure relates to an automatic darkening filter 20 which is suitable for darkening for protection from light, in particular from high intensity light, with a simplified set-up, as well as to a set-up device 40 for setting up parameters of a such filter 20. The present disclosure also relates to a system 100, 100? comprising such an automatic darkening filter 20 and such a set-up device 40, in particular a welding device 110. The present disclosure furthermore relates to a method for setting up such an automatic darkening filter 20 as well as to a headgear 10 with such an automatic darkening filter 20 and to a welding device 110 with such a set-up device 40.

Abstract: Structures and methods for high speed interconnection in photonic systems are described herein. In one embodiment, a photonic device is disclosed. The photonic device includes: a substrate; a plurality of metal layers on the substrate; a photonic material layer comprising graphene over the plurality of metal layers; and an optical routing layer comprising a waveguide on the photonic material layer.

Abstract: To improve detection efficiency in a solid-state imaging element including a SPAD in which an electrode and wiring are placed in a central portion. A solid-state imaging element includes a photodiode and a light collecting section. The photodiode includes a light receiving surface and an electrode placed on the light receiving surface, and that outputs an electrical signal in accordance with light incident on the light receiving surface in a state where a voltage exceeding a breakdown voltage is applied to the electrode. The light collecting section causes light from a subject to be collected in the light receiving surface other than a region where the electrode is placed.

Abstract: Disclosed herein are communication devices and connected clothing systems. The communication devices comprise a circuit printed on a portion of fabric, the circuit comprising means for transmitting electrical signals to and from a user, a controller electrically pairable to the circuit, and means for attaching the circuit to an item of apparel. Connected clothing systems comprises a communication device as disclosed herein attached to an item of apparel.

Abstract: Disclosed herein is a device including at least one photoconductor configured for exhibiting an electrical resistance dependent on an illumination of a light-sensitive region of the photoconductor; and at least one photoconductor readout circuit, where the photoconductor readout circuit includes at least one voltage divider circuit, where the voltage divider circuit includes at least one reference resistor Rref being arranged in series with the photoconductor, where the photoconductor readout circuit includes at least one amplifier device, where the photoconductor readout circuit includes at least one capacitor arranged between an input of the amplifier device and an output of the voltage divider circuit.

Abstract: A semiconductor structure includes a bonded assembly of a first semiconductor die including first metal bonding pads and a second semiconductor die including second metal bonding pads, and a capacitor structure including a first electrode, a second electrode, and a node dielectric. The first electrode includes first bonded pairs of metal bonding pads. The second electrode includes second bonded pairs of metal bonding pads. The node dielectric includes portions dielectric material layers laterally surrounding the metal bonding pads.

Abstract: A method of manufacturing a semiconductor device includes embedding electrodes in insulating layers exposed to the joint surfaces of a first substrate and a second substrate, subjecting the joint surfaces of the first substrate and the second substrate to chemical mechanical polishing, to form the electrodes into recesses recessed as compared to the insulating layer, laminating insulating films of a uniform thickness over the entire joint surfaces, forming an opening by etching in at least part of the insulating films covering the electrodes of the first substrate and the second substrate, causing the corresponding electrodes to face each other and joining the joint surfaces of the first substrate and the second substrate to each other, heating the first substrate and the second substrate joined to each other, causing the electrode material to expand and project through the openings, and joining the corresponding electrodes to each other.

Abstract: A wound therapy system includes an instillation fluid canister configured to contain an instillation fluid, a pump fluidly coupled to the instillation fluid canister and operable to deliver the instillation fluid from the instillation fluid canister to a wound, a user interface configured to receive user input indicating one or more geometric attributes of the wound, and a controller electronically coupled to the pump and the user interface. The controller is configured to determine a volume of the wound based on the user input, determine a volume of the instillation fluid to deliver to the wound based on the volume of the wound, and operate the pump to deliver the determined volume of the instillation fluid to the wound.

Abstract: LED drive control circuitry according to one embodiment outputs an LED drive control signal serving as driving a light emitting diode included in a photocoupler that performs insulation communication in synchronization with a reference clock signal. The LED drive control circuit includes a duty cycle changer that changes a duty cycle of the LED drive control signal in accordance with the reference clock signal and a signal synchronized with the reference clock signal.

Abstract: In an illumination device, an incidence angle of a laser beam, which is scanned by a laser beam scanning mechanism, with respect to a wavelength conversion member is set to an angle where the laser beam does not directly enter a projection lens when the wavelength conversion member is damaged, chipped or fallen off, and a laser light source and the laser beam scanning mechanism are located at a position corresponding to at least one of an upper side and a lower side of a light distribution pattern with respect to the wavelength conversion member, and are disposed to be deviated to either one of one side corresponding to a left side of the light distribution pattern and other side corresponding to a right side of the light distribution pattern.

Abstract: A biometric sensing device and a display apparatus including the same are provided. The biometric sensing device includes a first thin film transistor, a second thin film transistor, and a photodiode. The first thin film transistor has a gate. The second thin film transistor has a semiconductor layer and a non-gate electrode terminal. The non-gate electrode terminal is electrically connected to the gate of the first thin film transistor. The photodiode contacts a semiconductor layer.

Abstract: An image sensor includes a first layer including pixels in a pixel array, and a first logic circuit configured to control the pixel array. Each of the pixels include at least one photodiode configured to generate a charge in response to light, and a pixel circuit configured to generate a pixel signal corresponding to the charge. A second layer includes a second logic circuit that is connected to the pixel array and the first logic circuit and is on the first layer. A third layer includes storage elements that are electrically connected to at least one of the pixels or the first logic circuit and an insulating layer on the storage elements. A lower surface of the insulating layer is attached to an upper portion of the first layer, and an upper surface of the insulating layer is attached to a lower portion of the second layer.

Abstract: Technology for light detection and ranging (LIDAR) sensor can include an optical signal source, an optical modulation array and optical detector on the same integrated circuit (IC) chip, multi-chip module (MCM) or similar solid-state package.

Abstract: The present technology relates to a light receiving element, an imaging element, and an imaging device. A light receiving element includes an on-chip lens, a wiring layer, and a semiconductor layer arranged between the on-chip lens and the wiring layer. The semiconductor layer includes a first voltage application unit to which a first voltage is applied, a second voltage application unit to which a second voltage is applied, a first charge detection unit, and a second charge detection unit. The wiring layer includes at least one layer including first voltage application wiring configured to supply the first voltage, second voltage application wiring configured to supply the second voltage, and a reflection member that overlaps the first charge detection unit or the second charge detection unit, in plan view. The present technology, for example, can be applied to a light receiving element configured to measure a distance.

Abstract: There is provided a circuit to improve the sensing efficiency of pixels that uses the induction effect of a capacitor to duplicate a voltage deviation caused by additional electrons and uses a circuit to cancel out the voltage deviation during reading pixel data thereby improving the sensing efficiency.

Abstract: An obstacle detection system includes a light emitter that emits a light signal and a light detector configured to receive a portion of the light signal reflected back from an object. The system includes a processor operatively coupled to the light emitter and the light detector to determine a presence of an obstacle based on the portion of the light signal received by the light detector. The system includes a heater operatively coupled to a power source and at least one sensor configured to determine an ambient temperature and an ambient relative humidity. The processor is operatively coupled to the power source, the heater, and the at least one sensor. The processor is configured to calculate a dew point of the environment from the ambient relative humidity and the ambient temperature and to activate the heater in response to the ambient temperature being less than the dew point.

Abstract: An organic semiconductor detector for detecting radiation has an organic conducting active region, an output electrode and a field effect semiconductor device. The field effect semiconductor device has a biasing voltage electrode and a gate electrode. The organic conducting active region is connected on one side to the field effect semiconductor device and is connected on another side to the output electrode. The organic semiconductor detector has an option switching circuitry having a field effect semiconductor device and resistance.

Abstract: The present technology relates to a measurement circuit, a driving method, and an electronic instrument capable of reducing power consumption. In the measurement circuit, irradiation light is emitted from the light emitting unit toward the object, and light from the object is received to measure pulse waves or the like. The measurement circuit includes: a light receiving unit that receives light from an object; an integrating unit that performs integration of a current generated in accordance with the reception of the light by the light receiving unit and generates a voltage according to the amount of reception of the light; and a pulse generating unit that generates a pulse signal having a pulse width corresponding to the amount of reception of the light on the basis of the voltage. The present technology can be applied to electronic instruments such as wearable devices, for example.

Abstract: Provided is a high-sensitivity-side transfer transistor that transfers a charge from a high-sensitivity photodiode having a sensitivity higher than a predetermined sensitivity to a first charge storage unit. A low-sensitivity-side transfer transistor that transfers a charge from a low-sensitivity photodiode having a sensitivity lower than the predetermined sensitivity to a second charge storage unit. An amplification transistor that amplifies a voltage of the first charge storage unit. A first conversion efficiency control transistor that controls conversion efficiency of converting the charge to the voltage by opening and closing a pathway between the first and second charge storage units. A second conversion efficiency control transistor that controls the conversion efficiency by opening and closing a pathway between the second charge storage unit and a third charge storage unit.

Abstract: A method includes capturing light reflected off one or more objects and splitting the captured light into a plurality of light fields with a plurality of phase curvatures. The method further includes generating, for the one or more objects, a plurality of holograms based on the plurality of light fields and determining, for each of the plurality of holograms, an intensity and a phase-shift of the hologram. The method thus includes generating a depth map comprising depth information for the one or more objects based at least in part on a function determined by the respective phase-shifts of the plurality of holograms.

Abstract: The present invention provides a photosensor device with temperature compensation, which can adjust or calibrate the number, time and power of luminescence of light emitting elements under different ambient temperatures, so that the light signal values received by the photosensor device can be kept consistent or within the error range, there are multiple applications.

Abstract: An electronic device is provided that includes a photodiode. The photodiode includes a semiconductor region coupled to a node of application of a first voltage, and at least one semiconductor wall. The at least one semiconductor wall extends along at least a height of the photodiode and partially surrounds the semiconductor region.

Abstract: A plasma processing apparatus that performs plasma processing to a substrate held on a transport carrier including a frame and a holding sheet that covers an opening of the frame includes: a transport mechanism that transports the transport carrier; a position measuring section that measures a position of the substrate to the frame; a plasma processing section that includes a plasma processing stage on which the transport carrier is loaded and a cover that covers the frame and a part of the holding sheet loaded on the plasma processing stage, and has a window section for exposing a part of the substrate; and a control section that controls the transport mechanism such that the transport carrier is loaded on the plasma processing stage to satisfy a positional relationship between the window section and the substrate based on the position information of the substrate to the frame.

Abstract: The present application relates to an apparatus for determining a position of at least one element on a photolithographic mask, said apparatus comprising: (a) at least one scanning particle microscope comprising a first reference object, wherein the first reference object is disposed on the scanning particle microscope in such a way that the scanning particle microscope can be used to determine a relative position of the at least one element on the photolithographic mask relative to the first reference object; and (b) at least one distance measuring device, which is embodied to determine a distance between the first reference object and a second reference object, wherein there is a relationship between the second reference object and the photolithographic mask.

Abstract: Described herein is a system and method for performing eye tracking. One embodiment provides a system (100) including a camera (106) for capturing images of a vehicle driver's (102) eye and light emitting diodes (LEDs—108 and 110) configured to selectively illuminate the driver's eye during image capture by the camera (106). A processor (118) is configured to process at least a subset of the captured images to determine one or more eye tracking parameters of the subjects eye and to determine one or more illumination characteristics of the images. A controller (120) is configured to send an LED control signal to the LEDs (108 and 110) to control the drive current amplitude and pulse time of the LEDs (108 and 110). The controller (120) selectively adjusts the drive current amplitude and/or pulse time based on the determined illumination characteristics of a previous captured image or images.

Abstract: A semiconductor apparatus includes included first and second semiconductor components which are stacked on each other. The first component includes a first insulating layer and a first plurality of metal pads. The second component includes a second insulating layer and a second plurality of metal pads. Each of the first plurality of metal pads and each of the second plurality of metal pads are bonded to each other to form each of a plurality of bonding portions. First and second openings along an edge of the apparatus and passing through a bonding face between the first and second insulating layer are formed in the apparatus. A first bonding portion between the first opening and the second opening of the plurality of bonding portions is arranged in a distinctive location.

Abstract: A semiconductor apparatus comprises first and second semiconductor component having first and second metal pads, respectively. The first and second semiconductor components are stacked on each other to be bonded to each other at a bonding face. In a plane including the bonding face, first and second ranges each having a circular contour with a diameter of 10 ?m or more are definable. None of bonded portions is provided inside of each of the first and second ranges. At least a part of the bonded portions is located between the first and second ranges. The bonded portions are disposed between the first and second ranges such that any straight line passing through the first and second ranges and parallel to a direction connecting centers of the first and second ranges intersects at least one bonded portion of the bonded portions.

Abstract: A TOF sensor includes: a light-emitting element that emits light in accordance with reference pulses; a first light-receiving unit that outputs pulses in response to light incident thereon; a first digital computation unit that calculates the number of third output pulses of the first light-receiving unit in response to reflected light incident thereon; and a distance computation unit that calculates the distance from this device to the object if the number of third output pulses is greater than a first reference value.

Abstract: An autonomous mobile device (AMD) moves within a physical space. Various wireless devices with transmitters may be present, such as internet of things (IoT) devices, smartphones, tablets, user devices, and so forth. At different physical locations in the physical space a radio receiver of the AMD receives radio signals sent by transmitters sending data. Data is stored that is indicative of the physical location where the data was acquired, an identifier of the transmitter, and a received signal strength indication (RSSI). Estimated distances, each with respect to a different physical location, are determined based on the received signal strength. A plurality of the estimated distances and associated physical locations are used to determine an estimated location of a transmitter. For example, the estimated transmitter location may be determined as a point where the estimated distances coincide.

Abstract: A method, a device, and a non-transitory storage medium having instructions to attach to a user device, wherein the network device provides wireless access coverage in a cell area or a sector area of a first network; detect whether the network device is in a congested state; generate a message that indicates that the network device is in the congested state when the network device is in the congested state; and transmit the message on a control or signaling channel for receipt by user devices attached to the network device in the cell area or the sector area. The user device scans the control or signaling channel before initiating a session and determines whether the network device is in the congested state. When the network device is in the congested state, the user device performs a switchover to a second network. The user device has multimode capabilities.

Abstract: To implement a configuration for enabling independent adjustment of a spatial resolution and a wavelength resolution of a spectroscopic measurement device. A spatial resolution adjustment unit configured to adjust a spatial resolution of the spectroscopic measurement device, and a wavelength resolution adjustment unit configured to adjust a wavelength resolution of the spectroscopic measurement device are included, and the spatial resolution adjustment unit maintains output light from a condensing unit to a spectroscopic imaging unit of the spectroscopic measurement device as parallel light, adjusts a parameter of a constituent element of the condensing unit, and changes the spatial resolution without changing the wavelength resolution of the spectroscopic measurement device.

Abstract: Disclosed herein is a system comprising: an avalanche photodiode (APD); a bias source configured to supply a reverse bias to the APD; a current meter configured to measure electric current through the APD; a controller configured to reduce the reverse bias to a value below a breakdown voltage of the APD from a value above the breakdown voltage when an intensity of light incident on the APD is above a threshold, and configured to determine the intensity of the light above the threshold based on the electric current through the APD when the reverse bias is below the breakdown voltage.

Abstract: An imaging device includes a photoelectric converter that converts light into signal charge, a charge accumulation region that accumulates the signal charge, a first transistor having a gate connected to the charge accumulation region, and a common gate amplifier circuit that amplifies an output of the first transistor to output to the charge accumulation region. The common gate amplifier circuit includes a second transistor. One of a source and a drain of the second transistor is connected to one of a source and a drain of the first transistor, and the other of the source and the drain of the second transistor is connected to the charge accumulation region.

Abstract: A semiconductor apparatus comprising: a first semiconductor component including a first semiconductor layer and a first insulation film; and a second semiconductor component including a second semiconductor layer and a second insulation film, wherein the first semiconductor component and the second semiconductor component are bonded to each other by each of a plurality of first electric conductor portions provided in the first insulation film and each of a plurality of second electric conductor portions provided in the second insulation film, each of the plurality of first electric conductor portions is constituted by one pad surrounded by the first insulation film and N vias bonded to the one pad so as to be positioned between the one pad and the first semiconductor layer, and a volume VTR of the one pad and a total volume VTH of the N vias satisfy VTR/VTH?N.

Abstract: The invention relates to a photonic sensor chip comprising a semiconductor substrate with a cavity extending from a back side through an entire depth of the semiconductor substrate, a photonic plane located on the front side of the semiconductor substrate. The chip includes a photonic particle sensor element with an active-surface element having an exposed active surface facing towards the back side of the semiconductor substrate, for capturing selected particles from at least one fluid or gas to which the active surface is exposable. The cavity provides access to the active surface from the back side. The photonic particle sensor element receives an optical input wave via the photonic plane, to expose captured particles on the active-surface element to interaction with the optical input wave and to provide a resulting optical output wave having a spectral component indicative of the interaction between the optical input wave and captured particles.

Abstract: A solid-state imaging device includes a first semiconductor layer of a first conductivity type; a second semiconductor layer of a second conductivity type on the first semiconductor layer; and first and second detectors positioned inside the second semiconductor layer. The first and second detectors are arranged in a first direction along a boundary between the first semiconductor layer and the second semiconductor layer. The device further includes first and second semiconductor regions provided between the first semiconductor layer and the first and second detectors, respectively. The first and second semiconductor regions include second conductivity type impurities with a higher concentration than that in the second semiconductor layer.

Abstract: An extendible membrane system may include: an extendible central column; one or more membranes; and/or one or more foldable membrane supports configured to support the one or more membranes. Each of the one or more foldable membrane supports may be configured to extend from the extendible central column. In some embodiments, one or more of the one or more foldable membrane supports includes two or more segments that may be configured to couple with each other. A method of deploying one or more membranes may include unfolding one or more foldable membrane supports from a folded configuration to a linear configuration. An extendible membrane device may include one or more membranes and one or more foldable membrane supports configured to support the one or more membranes.

Abstract: A light sensor is provided that includes an exposed light transducer for accumulating charge in proportion to light incident thereon over an integration period; and a light-to-pulse circuit in communication with the exposed light transducer, the light-to-pulse circuit operative to output a pulse having a pulse width based on the charge accumulated by the exposed light transducer. The light-to-pulse circuit may include a one shot logic circuit that contributes to generation of the pulse. The light sensor may include an input/output pad, a capacitor provided at the input/output pad for blocking static electricity, an input low pass filter provided at the input/output pad for blocking electromagnetic interference, and/or a bandgap voltage reference circuit connected to a power source having a supply voltage level in a range of about 3.3V to about 5.0V, and for generating a set of stable reference voltages throughout the supply voltage level range.

Abstract: A backside illuminated image sensor includes pixel regions disposed in a substrate, an insulating layer disposed on a frontside surface of the substrate, a bonding pad disposed on a frontside surface of the insulating layer, and an anti-reflective layer disposed on a backside surface of the substrate. The substrate has a first opening for partially exposing a backside surface of the insulating layer, and the insulating layer has a third opening for partially exposing a backside surface of the bonding pad. The anti-reflective layer comprises a first portion disposed on an inner side surface of the first opening and a second portion disposed on a portion of the backside surface of the insulating layer exposed by the first opening and having a second opening connecting the first opening with the third opening, and a first spacer is disposed on inner side surfaces of the second opening and the third opening.