Noble Metal (gold, Silver, Ruthenium, Rhodium, Palladium, Osmium, Iridium, Platinum) Patents (Class 252/514)
  • Patent number: 11747365
    Abstract: An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: September 5, 2023
    Assignees: KABUSHIKI KAISHA NIHON MICRONICS, TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Toshinori Omori, Kazuya Goto, Yasuaki Osanai, Takashi Akiniwa, Takeki Sugisawa, Takeshi Kondo, Shintaro Abe, Maki Watanabe
  • Patent number: 11735737
    Abstract: An object of the present invention is to provide a binder which exhibits excellent dispersibility of a conductive assistant; a slurry composition and an electrode, each of which uses this binder; and an electricity storage device which is provided with this electrode. The present invention relates to a binder for an electricity storage device, in which a loss tangent tan ? in a linear region of an aqueous dispersion liquid of 0.5% by mass of the binder and 4.6% by mass of a conductive assistant satisfies tan ?>1 in a strain dispersion measurement under measurement conditions of a measurement temperature of 25° C. and a frequency of 1 Hz, and the conductive assistant is an acetylene black having an average particle diameter of 30 nm or more and 40 nm or less and a specific surface area of 65 m2/g or more and 70 m2/g or less; a slurry composition and an electrode, each of which uses this binder; an electricity storage device which is provided with this electrode; and the like.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: August 22, 2023
    Assignee: FUJIFILM WAKO PURE CHEMICAL CORPORATION
    Inventors: Kaho Mori, Tomoyuki Mori, Kazuki Takimoto, Masahiro Takano, Kei Kawano
  • Patent number: 11715579
    Abstract: An electronic device is provided. The device comprises a singulated carrier portion, a substrate molded onto the singulated carrier portion, and conductive traces disposed on the substrate. The substrate comprises a polymer composition that includes an aromatic polymer and an electrically conductive filler, wherein the polymer composition exhibits a surface resistivity of from about 1×1012 ohms to about 1×1018 ohms as determined in accordance with ASTM D257-14.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: August 1, 2023
    Assignee: Ticona LLC
    Inventor: Young Shin Kim
  • Patent number: 11710599
    Abstract: A ceramic electronic device includes an element body and an external electrode. The element body is formed by laminating a ceramic layer and an internal electrode layer. The external electrode is electrically connected to at least one end of the internal electrode layer. The external electrode includes a baked electrode layer. The baked electrode layer includes a first region and a second region. The first region is contacted with an end surface of the element body and located near a joint boundary with the element body. The second region is located outside the first region and constituting an outer surface of the baked electrode layer. The first region includes a first glass having a predetermined composition. The second region includes a second glass having a predetermined composition.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: July 25, 2023
    Assignee: TDK CORPORATION
    Inventors: Toshihiro Iguchi, Yuichiro Sueda, Ryota Namiki, Yasuhiro Okui, Atsushi Watanabe
  • Patent number: 11700733
    Abstract: A photoelectric conversion element according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; and a photoelectric conversion layer provided between the first electrode and the second electrode, and including a first organic semiconductor material, a second organic semiconductor material, and a third organic semiconductor material that have mother skeletons different from one another. The first organic semiconductor material is one of fullerenes and fullerene derivatives. The second organic semiconductor material in a form of a single-layer film has a higher linear absorption coefficient of a maximal light absorption wavelength in a visible light region than a single-layer film of the first organic semiconductor material and a single-layer film of the third organic semiconductor material. The third organic semiconductor material has a value equal to or higher than a HOMO level of the second organic semiconductor material.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: July 11, 2023
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yuta Hasegawa, Nobuyuki Matsuzawa, Yoshiaki Obana, Ichiro Takemura, Norikazu Nakayama, Masami Shimokawa, Tetsuji Yamaguchi, Iwao Yagi, Hideaki Mogi
  • Patent number: 11697612
    Abstract: The present disclosure discloses a low LOI tellurium-lithium-silicon-zirconium frit system and a conductive paste and application thereof, and belongs to the field of conductive paste. In the low LOI tellurium-lithium-silicon-zirconium frit system, components of the frit are 24%-40% TeO2, 18%-24% Li2O, 4%-13% SiO2, 0-2% ZrO2, and a balance MOx, and M is one or a mixture of Na, K, Mg, Ca, Sr, Ti, V, Cr, Mo, W, Mn, Cu, Ag, Zn, Cd, B, Al, Ga, Tl, Ge, Pb, P, and Bi. There is no need to add additional surfactants, a viscosity change of the conductive paste prepared after standing for 30 days is less than 20%, the conductive paste has good stability, the water related weight loss of inorganic oxide of the conductive paste is less than 1.6%, and the application performance of the conductive paste is not affected after standing for 30 days.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: July 11, 2023
    Assignee: JIANGSU RIYU PHOTOVOLTAIC NEW MATERIAL TECHNOLOGY CO. LTD
    Inventors: Li Yan, Song Xu, Rui Tian
  • Patent number: 11676833
    Abstract: A protective sheeting for use in processing a semiconductor-sized wafer includes a protective film and a cushioning layer attached to a back surface of the protective film. At least in a central area of the protective sheeting, no adhesive is applied to a front surface and a back surface of the protective sheeting, the central area having an outer diameter which is equal to or larger than an outer diameter of the semiconductor-sized wafer. Further, a protective sheeting for use in processing a wafer has a protective film and a cushioning layer attached to a back surface of the protective film, wherein, on an entire front surface and an entire back surface of the protective sheeting, no adhesive is applied. A handling system for a semiconductor-sized wafer and to a combination of a wafer and the protective sheeting are also described.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: June 13, 2023
    Assignee: DISCO CORPORATION
    Inventor: Karl Heinz Priewasser
  • Patent number: 11652197
    Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: May 16, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Masafumi Kuramoto, Satoru Ogawa, Katsuaki Suganuma, Keun-Soo Kim
  • Patent number: 11639025
    Abstract: Methods and apparatus for fabricating high-resolution thin-layer metal patterns and 3D Metal structures are provided. The methods and apparatus operate via photo-(stereo)lithography at room temperature. The printed metal patterns, for example silver patterns, exhibit high electrical conductivity, comparable to or better than the conductivity of the silver printed by current laser sintering or thermal annealing at high temperature.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: May 2, 2023
    Assignee: The Regents of the University of California
    Inventors: Ximin He, Xingyun Yang, Dong Wu, Mutian Hua
  • Patent number: 11639453
    Abstract: An electrically conductive material includes an anionic polymer having a polymer backbone that is bonded to a plurality of terminal catechol moieties and a plurality of terminal sulfonate moieties. It also includes a cationic polymer including poly(3,4-ethylenedioxythiophene).
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: May 2, 2023
    Assignee: Florida State University Research Foundation, Inc.
    Inventors: Hoyong Chung, Minkyu Kim
  • Patent number: 11635863
    Abstract: An object of the present invention is to provide a conductive film further improved in at least any of mechanical characteristics, electrical characteristics, and optical characteristics while enjoying improvement in transparency by the thinning of a fine metal wire, and a conductive film roll, an electronic paper, a touch panel, and a flat-panel display comprising the same.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: April 25, 2023
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Takeshi Kamijo, Kazuma Komatsu, Akira Ikeda, Sora Hida, Tetsuro Sugimoto
  • Patent number: 11634355
    Abstract: The present disclosure discloses a ceramic glass powder and a solar cell metallization paste containing the ceramic glass powder, and belongs to the technical field of solar cells. The present disclosure provides a novel formula mode of a glass powder including a crystallization nucleus component and a glass network component, that is, a formula of a ceramic glass powder that has a special crystallization behavior, a low crystallinity before sintering and a high crystallinity after the sintering, and a conductive metallization paste containing the ceramic glass powder is further obtained. The present disclosure solves the technical problem that by using metallization pastes in the prior art, a balance between corrosion of a silicon wafer and an ohmic contact is difficult to achieve. The efficiency of a solar cell is improved.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: April 25, 2023
    Assignee: JIANGSU RIYU PHOTOVOLTAIC NEW MATERIAL TECHNOLOGY
    Inventors: Song Xu, Rui Tian
  • Patent number: 11628501
    Abstract: Composite particles sinterable at a low temperature and allow forming a sintered body that exhibits a large extension are provided. The composite particles include microparticles having an average crystallite diameter of 0.6 to 10 ?m and containing a metal, and nanoparticles adhered to a surface of the microparticle, having an average crystallite diameter of 3 to 100 nm, and containing a metal of a same kind as the metal contained in the microparticle.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: April 18, 2023
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Daiki Kuboyama, Akira Kato, Jyunya Murai
  • Patent number: 11628642
    Abstract: A thread made from extruded silicone rubber that is cross-linked after the extrusion and woven into a fabric having warp threads and/or weft threads and a coating including cross-linked silicone rubber, the thread or the coating including a fluorinated rubber portion. The invention also relates to a method for producing such threads and woven fabrics. The object of the invention is to improve thermal and chemical resistance. To this end the fluorinated rubber part is produced only by surface fluorination of the cross-linked thread or the coating by means of a fluorinated gas.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: April 18, 2023
    Assignee: HUECK Rheinische GmbH
    Inventor: Rolf Espe
  • Patent number: 11621101
    Abstract: Disclosed are conductive composites comprising a polymer, a conductor selected from metals and metal alloys, and a thickening agent.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: April 4, 2023
    Assignee: THE BOEING COMPANY
    Inventors: Ashley M. Dustin, Andrew P. Nowak, Xin N. Guan, Adam F. Gross, Richard E. Sharp
  • Patent number: 11620028
    Abstract: An object of the present invention is to provide a conductive film further improved in at least any of mechanical characteristics, electrical characteristics, and optical characteristics while enjoying improvement in transparency by the thinning of a fine metal wire, and a conductive film roll, an electronic paper, a touch panel, and a flat-panel display comprising the same.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: April 4, 2023
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Takeshi Kamijo, Kazuma Komatsu, Akira Ikeda, Sora Hida, Tetsuro Sugimoto
  • Patent number: 11610831
    Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: March 21, 2023
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L. Strader, Richard F. Hill
  • Patent number: 11596089
    Abstract: A method for shielding components includes the steps of providing a component and applying at least one coating region, designed to shield from a magnetic and/or an electrical field, to the component by a thermal and/or kinetic spraying method such that a first arrangement space is shielded from a second arrangement space.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: February 28, 2023
    Assignee: Bayerische Motoren Werke Aktiengesellschaft
    Inventor: Wolfram Wagener
  • Patent number: 11588238
    Abstract: An antenna assembly includes a plurality of antenna elements, a microstrip feed network that is configured to supply power to the plurality of antenna elements, and one or more resistors disposed within the microstrip feed network proximate to one or more of the plurality of antenna elements. The resistors are configured to control sidelobes of the antenna assembly.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: February 21, 2023
    Assignee: THE BOEING COMPANY
    Inventor: John E. Rogers
  • Patent number: 11553862
    Abstract: An electrode measuring the presence of an analyte is described as one embodiment. The electrode includes a working conductor with an electrode reactive surface and a first reactive chemistry that is responsive to the analyte. The electrode further includes a first transport material that enables flux of the first analyte to the first reactive chemistry and a second transport material that supplies a reactant to the first reactive chemistry. Wherein the first reactive chemistry does not contact the electrode reactive surface while at least partially shadowing a portion of the electrode reactive surface.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: January 17, 2023
    Assignee: PercuSense, Inc.
    Inventors: Rajiv Shah, Bradley Liang, Katherine Wolfe, Ellen Messer, Shaun Pendo
  • Patent number: 11522193
    Abstract: Systems and methods utilizing water soluble (aqueous) PAA-based polymer binders for silicon-dominant anodes may include an electrode coating layer on a current collector, where the electrode coating layer is formed from silicon and a pyrolyzed water soluble PAA-based polymer blend, wherein the water soluble PAA-based polymer blend comprises PAA and one or more additional water-soluble polymer components. The electrode coating layer may include more than 70% silicon and the anode may be in a lithium ion battery.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: December 6, 2022
    Assignee: Enevate Corporation
    Inventors: Sanjaya D. Perera, Benjamin Park, Younes Ansari
  • Patent number: 11520451
    Abstract: An object of the present invention is to provide a conductive film further improved in at least any of mechanical characteristics, electrical characteristics, and optical characteristics while enjoying improvement in transparency by the thinning of a fine metal wire, and a conductive film roll, an electronic paper, a touch panel, and a flat-panel display comprising the same.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: December 6, 2022
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Takeshi Kamijo, Kazuma Komatsu, Akira Ikeda, Sora Hida, Tetsuro Sugimoto
  • Patent number: 11515459
    Abstract: The present invention relates to a micro light-emitting diode display panel and a method for producing the same. A backplane and a light-emitting diode display layer are subjected to a bonding process to form eutectic structures between the backplane and light-emitting diodes of the light-emitting diode display layer. Then, an adhesive bonding layer including a resin material and conducting materials is formed on a surface of the backplane, and a heating process is performed, thereby causing the conducting materials to form a plurality of metallic bridge connection structures. Therefore, a bonding between the light-emitting diode and the backplane is reinforced, and tensile strength of the micro light-emitting diode display panel is enhanced.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: November 29, 2022
    Assignees: Interface Technology (ChengDu) Co., Ltd., Interface Optoelectronics (ShenZhen) Co., Ltd., General Interface Solution Limited
    Inventors: Ping-Hsiang Kao, Po-Lun Chen, Chun-Ta Chen, Po-Ching Lin, Ya-Chu Hsu, Chia-Ming Fan, Chien-Yu Huang
  • Patent number: 11510314
    Abstract: The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: November 22, 2022
    Assignee: XEROX CORPORATION
    Inventors: Naveen Chopra, Barkev Keoshkerian, Chad Steven Smithson, Kurt I. Halfyard, Michelle N. Chretien
  • Patent number: 11483936
    Abstract: Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I): (M1?M2)/M1×100?1.0??(I) [in Formula (I), M1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M2 represents a non-volatile content in the joining material.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: October 25, 2022
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki Kawana, Motohiro Negishi, Yuichi Yanaka
  • Patent number: 11478177
    Abstract: A physiological signal collection electrode comprises a signal collection pad having a skin contact portion, a signal output pad and an elongate bridging portion interconnecting the signal collection pad and the signal output pad. The signal collection pad, the signal output portion and the bridging portion are integrally molded of a flexible, conductive and resilient material. The width of the bridging portion is substantially smaller than that of the skin contact portion. A narrowed bridging portion operates to concentrate collected physiological signals collected by the skin contact portion before the signals are output to the signal output pad. An elongate bridging portion reduces skin covering area for better wearer comfort as well as providing better resiliency to the electrode when the bridging portion is extended.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: October 25, 2022
    Assignee: Dayton Technologies Limited
    Inventor: Paul Anthony Yuen
  • Patent number: 11466181
    Abstract: The present disclosure relates to a metal particle-containing composition contains at least one thermosetting resin (R), a hardening agent (H), and at least three types of metal particles (P) different from one another. The metal particles (P) contain a solder alloy particle (P1) containing a tin alloy containing at least one metal (A), wherein the metal (A) is a metal that forms a eutectic crystal with tin at a eutectic temperature of 200° C. or lower, at least one metal particle (P2) containing a metal (B) having a melting point exceeding 420° C. in a bulk, the metal particle (P2) having a melting point higher than a solidus temperature of the solder alloy particle (P1), and at least one metal particle (P3) containing a metal (C) that forms an intermetallic compound with a metal contained in the solder alloy particle (P1).
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: October 11, 2022
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Norzafriza Nitta, Tomohiro Ishii, Hidemichi Fujiwara
  • Patent number: 11444240
    Abstract: Methods, systems, and devices are disclosed for enhancement of spin-orbit torque. In one aspect, a magnetic device includes a magnetic tunneling junction (MTJ), including a free magnetic layer, a pinned magnetic layer and a non-magnetic junction layer between the free magnetic layer and the pinned magnetic layer, and a spin Hall effect metal layer that includes one or more insertion metal layers operable to introduce interfacial scattering of electrons flowing in the spin Hall metal layer to increase the spin current that interacts with and changes the magnetization of the free magnetic layer of the MTJ.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: September 13, 2022
    Assignee: Cornell University
    Inventors: Robert A. Buhrman, Lijun Zhu
  • Patent number: 11407030
    Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 ?m and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 ?m·% (preferably 1.5 to 10.5 ?m·%).
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: August 9, 2022
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Atsushi Ebara, Kenichi Inoue, Yoshiyuki Michiaki, Takahiro Yamada, Masahiro Yoshida
  • Patent number: 11370023
    Abstract: Disclosed is a process for producing metal nanowires having a diameter or thickness from 2 nm to 100 nm, the process comprising: (a) preparing a source metal particulate having a size from 50 nm to 500 ?m, selected from a transition metal, Al, Be, Mg, Ca, an alloy thereof, a compound thereof, or a combination thereof; (b) depositing a catalytic metal, in the form of nanoparticles or a coating having a diameter or thickness from 1 nm to 100 nm, onto a surface of the source metal particulate to form a catalyst metal-coated metal material, wherein the catalytic metal is different than the source metal material; and (c) exposing the catalyst metal-coated metal material to a high temperature environment, from 100° C. to 2,500° C., for a period of time sufficient to enable a catalytic metal-assisted growth of multiple metal nanowires from the source metal particulate.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: June 28, 2022
    Assignee: Global Graphene Group, Inc.
    Inventor: Bor Z. Jang
  • Patent number: 11371961
    Abstract: A sensor is achieved by applying a layer of a mixture that contains polymer and conductive particles over a substrate or first surface, when the mixture has a first viscosity that allows the conductive particles to rearrange within the material. An electric field is applied over the layer, so that a number of the conductive particles are assembled into one or more chain-like conductive pathways with the field and thereafter the viscosity of the layer is changed to a second, higher viscosity, in order to mechanically stabilise the material. The conductivity of the pathway is highly sensitive to the deformations and it can therefore act as deformation sensor. The pathways can be transparent and is thus suited for conductive and resistive touch screens. Other sensors such as strain gauge and vapour sensor can also be achieved.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: June 28, 2022
    Assignee: CONDALIGAN AS
    Inventors: Mark Buchanan, Matti Knaapila, Geir Helgesen, Henrik Hoeyer
  • Patent number: 11359116
    Abstract: Conventionally, there was a need to add a large amount of electroconductive particles for improving conductivity, but when the electroconductive particles were added too much, initial viscosity was increased, and at the same time, it was difficult to stabilize preservation stability. However, conductivity can be improved without adding a large amount of the electroconductive particles by selecting a monomer, and at the same time, preservation stability can be stabilized by using certain electroconductive particles. A thermocurable electroconductive adhesive including components (A) to (D): component (A): an oligomer having a (meth)acryl group; component (B): a monomer having one methacryl group in a molecule; component (C): an organic peroxide having a specific structure; and component (D): electroconductive particles which are surface-treated with a stearic acid.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: June 14, 2022
    Assignee: THREEBOND CO., LTD.
    Inventors: Tomoya Kodama, Soichi Ota, Masayuki Osada, Hitoshi Mafune, Makoto Kato, Kanako Morii
  • Patent number: 11352700
    Abstract: Electrically-conductive silver metal is provided in a pattern on a substrate having a first supporting side and a second opposing supporting side. One or both of the first supporting side and the second opposing supporting side has one or more electrically-conductive silver metal containing patterns containing the electrically-conductive silver metal; an ?-oxy carboxylate; a 5- or 6-membered N-heteroaromatic compound; and a polymer that is either (i) a hydroxy-containing cellulosic polymer or (ii) a non-cellulosic acrylic polymer having a halo- or hydroxy-containing side chain. Such articles can be used in various devices and electrodes.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: June 7, 2022
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Deepak Shukla, Kevin M. Donovan, Dianne Marie Meyer
  • Patent number: 11352481
    Abstract: Methods include producing tunable carbon structures and combining carbon structures with a polymer to form a composite material. Carbon structures include crinkled graphene. Methods also include functionalizing the carbon structures, either in-situ, within the plasma reactor, or in a liquid collection facility. The plasma reactor has a first control for tuning the specific surface area (SSA) of the resulting tuned carbon structures as well as a second, independent control for tuning the SSA of the tuned carbon structures. The composite materials that result from mixing the tuned carbon structures with a polymer results in composite materials that exhibit exceptional favorable mechanical and/or other properties. Mechanisms that operate between the carbon structures and the polymer yield composite materials that exhibit these exceptional mechanical properties are also examined.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: June 7, 2022
    Assignee: Lyten, Inc.
    Inventors: Michael W. Stowell, Bryce H. Anzelmo, Bruce Lanning, Daniel Cook, Elena Rogojina, Karel Vanheusden, Margaret Hines, John Baldwin, Chandra B. KC
  • Patent number: 11270872
    Abstract: Cathode structures are disclosed for use with pulsed cathodic arc deposition systems for forming diamond-like carbon (DLC) films on devices, such as on the sliders of hard disk drives. In illustrative examples, a base layer composed of an electrically- and thermally-conducting material is provided between the ceramic substrate of the cathode and a graphitic paint outer coating, where the base layer is a silver-filled coating that adheres to the ceramic rod and the graphitic paint. The base layer is provided, in some examples, to achieve and maintain a relatively low resistance (and hence a relatively high conductivity) within the cathode structure during pulsed arc deposition to avoid issues that can result from a loss of conductivity within the graphitic paint over time as deposition proceeds. Examples of suitable base material compounds are described herein where, e.g., the base layer can withstand temperatures of 1700° F. (927° C.).
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: March 8, 2022
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Cherngye Hwang, Reimar Azupardo, Randall Simmons, Mary Agnes Gupit Perez
  • Patent number: 11254827
    Abstract: The present invention provides a silver coating composition that develops excellent conductivity (low resistance value) by low-temperature and short-time calcining and that has excellent printability. A silver particle coating composition including: silver nano-particles whose surfaces are coated with a protective agent including an aliphatic hydrocarbon amine; and a dispersion solvent, wherein the dispersion solvent includes a solvent selected from the group consisting of a glycol ether-based solvent and a glycol ester-based solvent. The silver particle coating composition is suitable for various printing methods such as intaglio offset printing and screen printing.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: February 22, 2022
    Assignee: DAICEL CORPORATION
    Inventor: Hiroyoshi Koduma
  • Patent number: 11224130
    Abstract: Composite transparent conductors are described, which comprise a primary conductive medium based on metal nanowires and a secondary conductive medium based on a continuous conductive film.
    Type: Grant
    Filed: February 24, 2019
    Date of Patent: January 11, 2022
    Assignee: Cambrios Film Solutions Corporation
    Inventors: David Jones, Florian Pschenitzka, Xina Quan, Michael A. Spaid, Jeffrey Wolk
  • Patent number: 11155924
    Abstract: A silver mirror film includes a plurality of silver particles arranged in a film surface direction, a plurality of interparticle silicon particles between the silver particles, and a plurality of surface silicon particles on surfaces of the silver particles so as to at least partially cover the surfaces. The interparticle silicon particles and the surface silicon particles are present as (SixO2y)n{x?1, y?1, and n?1}.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: October 26, 2021
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Miki Kitamoto, Shintarou Okawa, Hiroaki Ando
  • Patent number: 11118089
    Abstract: The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is for use as a die bonding material and which has high heat-conducting properties and high-temperature adhesiveness. The present invention relates to a thermally-conductive and electrically-conductive adhesive composition including (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: September 14, 2021
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Shintaro Abe, Kanako Furutachi, Takeshi Kondo, Rikia Furusho
  • Patent number: 11098227
    Abstract: The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200° C. from 5.0×104 Pa to 4.0×105 Pa.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: August 24, 2021
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Yoshihiko Aoyagi, Osamu Isobe, Kenji Kamino
  • Patent number: 11056539
    Abstract: A photoelectric conversion element according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; and a photoelectric conversion layer provided between the first electrode and the second electrode, and including a first organic semiconductor material, a second organic semiconductor material, and a third organic semiconductor material that have mother skeletons different from one another. The first organic semiconductor material is one of fullerenes and fullerene derivatives. The second organic semiconductor material in a form of a single-layer film has a higher linear absorption coefficient of a maximal light absorption wavelength in a visible light region than a single-layer film of the first organic semiconductor material and a single-layer film of the third organic semiconductor material. The third organic semiconductor material has a value equal to or higher than a HOMO level of the second organic semiconductor material.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: July 6, 2021
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Yuta Hasegawa, Nobuyuki Matsuzawa, Yoshiaki Obana, Ichiro Takemura, Norikazu Nakayama, Masami Shimokawa, Tetsuji Yamaguchi, Iwao Yagi, Hideaki Mogi
  • Patent number: 11017945
    Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, a main component of the internal electrode layer being a metal, wherein an arithmetic average roughness Ra of at least a part of the internal electrode layer is 30 nm or less, wherein a maximum height Rz of the at least a part of the internal electrode layer is 360 nm or less.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: May 25, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Toru Makino
  • Patent number: 11008443
    Abstract: A latex of a carboxyl group-containing nitrile rubber contains an ?,?-ethylenically unsaturated nitrile monomer unit in a content of 8 to 60 wt % and having an iodine value of 120 or less, wherein the total content of potassium and sodium contained in the latex is 2,300 to 10,000 ppm by weight with respect to the whole latex.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: May 18, 2021
    Assignee: ZEON CORPORATION
    Inventor: Sayaka Inoue
  • Patent number: 10982107
    Abstract: A metal nanoparticle ink composition comprises an ink vehicle and a plurality of metal nanoparticles dispersed in the ink vehicle. The metal nanoparticles including both a first organic stabilizing group and a second organic stabilizing group attached thereto, the first organic stabilizing group being different from the second organic stabilizing group, the first organic stabilizing group being selected from the group consisting of decylamine, undecylamine, dodecylamine, tridecylamine, tetradecylamine and mixtures thereof, and the second organic stabilizing group being selected from group consisting of butylamine, pentylamine, hexylamine, heptylamine, octylamine, nonylamine, decylamine and mixtures thereof.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: April 20, 2021
    Assignee: XEROX CORPORATION
    Inventors: Hojjat Seyed Jamali, Adela Goredema, Biby Esther Abraham, Jonathan Lee, Cuong Vong
  • Patent number: 10950770
    Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: March 16, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Masafumi Kuramoto, Satoru Ogawa, Katsuaki Suganuma, Keun-Soo Kim
  • Patent number: 10898952
    Abstract: A composition for forming an electrode includes a conductive powder, a glass frit, an organic binder, and a solvent. The organic binder includes a polymer including a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2. In Chemical Formulae 1 and 2, each substituent of Chemical Formulae 1 and 2 is the same as in the detailed description.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: January 26, 2021
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Sungil Moon, Kyoungjin Ha, Hansong Lee
  • Patent number: 10883011
    Abstract: A flake-less molecular ink suitable for printing (e.g. screen printing) conductive traces on a substrate has 30-60 wt % of a C8-C12 silver carboxylate or 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate, 0.1-10 wt % of a polymeric binder (e.g. ethyl cellulose) and balance of at least one organic solvent. Conductive traces formed with the molecular ink are thinner, have lower resistivity, have greater adhesion to a substrate than metal flake inks, have better print resolution and are up to 8 times less rough than metal flake inks. In addition, the shear force required to remove light emitting diodes bonded to the traces using Loctite 3880 is at least 1.3 times stronger than for commercially available flake-based inks.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: January 5, 2021
    Assignees: Groupe Graham International Inc., National Research Council of Canada
    Inventors: Arnold Kell, Sylvie Lafreniere, Chantal Paquet, Patrick Malenfant, Olga Mozenson
  • Patent number: 10868200
    Abstract: The present invention relates to a conductive paste for forming a conductive track or coating on a substrate, particularly suitable for use in solar cells. The paste comprises a solids portion dispersed in an organic medium, the solids portion comprising electrically conductive material and an inorganic particle mixture wherein the inorganic particle mixture comprises substantially crystalline particles. The present invention also relates to a method of preparing a conductive paste, a method for the manufacture of a surface electrode of a solar cell, an electrode for a solar cell and a solar cell.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: December 15, 2020
    Assignee: Johnson Matthey Public Limited Company
    Inventors: Beatriz Cela Greven, Jonathan Charles Shepley Booth, Nicholas Nowak, Simon Johnson, Tobias Droste
  • Patent number: 10833209
    Abstract: A conductive paste including: a conductive powder containing silver; an indium powder; a silver-tellurium-coated glass powder; a solvent; and an organic binder, wherein the silver-tellurium-coated glass powder is a silver-tellurium-coated glass powder including a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more, and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: November 10, 2020
    Assignee: DOWA Electronics Materials Co., Ltd.
    Inventors: Kenichi Harigae, Hiroshi Kamiga, Noriaki Nogami
  • Patent number: 10821506
    Abstract: A method for producing a silver nanoparticle dispersion according to the present invention includes the steps of mixing an amine compound, a resin, and a silver salt to yield a complex compound; and heating and decomposing the complex compound to form silver nanoparticles. A silver nanoparticle ink can be obtained by adding an organic solvent to the silver nanoparticle dispersion obtained by this method. The resin includes, for example, a polymer exhibiting viscosity at a temperature within the range of 20° C. to 50° C. or a high molecular weight compound exhibiting viscosity at a temperature within the range of 20° C. to 50° C.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: November 3, 2020
    Assignee: NATIONAL UNIVERSITY CORPORATION YAMAGATA UNIVERSITY
    Inventors: Konami Izumi, Daisuke Kumaki, Shizuo Tokito, Daisuke Shiokawa