Abstract: A method for designing a semiconductor device and a semiconductor device of the present invention permits the achievement of a predetermined pattern area ratio while power supply lines are reinforced by connecting a dummy metal line, which is formed in an unoccupied region of a wiring layer for the purpose of achieving the predetermined area ratio, at its two or more points with a power supply line for VDD or VSS.

Abstract: A memory cell includes a semiconductor feature and a phase change material. The semiconductor feature defines a groove that divides the semiconductor feature into a first electrode and a second electrode. The phase change material at least partially fills this groove and acts to electrically couple the first and second electrodes. At least a portion of the phase change material is operative to switch between lower and higher electrical resistance states in response to an application of a switching signal to at least one of the first and second electrodes. The semiconductor feature comprises silicon and the groove comprises at least one silicon sidewall with a substantially <111> crystal plane orientation.

Abstract: A driving circuit of a liquid crystal display panel includes a substrate, a plurality of driver IC chips located on the substrate, a current supplier, and a first conductive wire set. The first conductive wire set has a plurality of conductive wire segments for connecting the driver IC chips in parallel to the current supplier. Furthermore, the conductive wire segments each have a form, such that paths formed of the conductive wire segments from the current supplier to the respective driver IC chips have an equal resistance, and, accordingly, each of the driver IC chips obtain the same input voltage. Hence, a problem of band mura is avoided.

Abstract: A semiconductor integrated circuit effectively makes use of wiring channels of wiring formed by a damascene method. When first cells are used, since the M1 power source lines are laid out at positions spaced away from a boundary between the cells, the power source lines are not combined in laying out a semiconductor integrated circuit. As a result, the width of the power source lines is not changed. Accordingly, an interval between the line and a line which is arranged close to the line, determined in response to a line width of the lines, can satisfy a design rule; and, hence, the reduction of the wiring channels can be obviated, whereby the supply rate of the wiring channels can be enhanced, and, further, the integrity of a semiconductor chip can be enhanced.

Abstract: A semiconductor memory device is constructed to include a memory cell formed by a plurality of transistors, wherein each of gate wiring layers of all of the transistors forming the memory cell is arranged to extend in one direction.

Abstract: In a method and structure for semiconductor failure analysis, the structure comprises: a plurality of analytic fields disposed on a predetermined area of a semiconductor device; semiconductor transistors arranged in each of the analytic fields, the semiconductor transistors arranged in an array; wordlines arranged on each of the plurality of the analytic fields, connecting the semiconductor transistors with each other in a first direction; and bitline structures on each of the plurality of the analytic fields, connecting the semiconductor transistors with each other in a second direction, wherein the bitline structures are configured in different patterns in each of the plurality of analytic fields.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: In an integrated circuit device, element power supply lines connected to a circuit containing a plurality of cells, element ground lines connected thereto, a trunk power supply line connected to each of the element power supply lines, and a trunk ground line connected to each of the element ground lines are provided in a first wiring layer. A branch power supply line connected to the trunk power supply line and a branch ground line connected to the trunk ground line are provided in an upper wiring layer located above the first wiring layer.

Abstract: A semiconductor device structure for a three-dimensional integrated circuit is provided. The semiconductor device structure includes: a substrate having a first surface and a second surface; a via defined in the substrate and extending from the first surface to the second surface; and a first plurality of contact structures on the first surface contacting the via. A cross section of each of the first plurality of contact structures parallel to the first surface has a first side and a second side, and a ratio of the longer side to the shorter side of the first side and the second side is more than about 2:1.

Abstract: It is an object of the invention to provide a thin, lightweight, high performance, and low in cost semiconductor device and a display device by reducing an arrangement area required for a power supply wiring and a ground wiring of a functional circuit and decreasing a drop in power supply voltage and a rise in ground voltage. In the functional circuit of the semiconductor device and the display device, a power supply wiring and a ground wiring are formed in a comb-like arrangement, and the tips thereof are electrically connected with a first wiring, a second wiring, and a contact between the first wiring and the second wiring, thereby forming in a grid-like arrangement. The drop in power supply voltage and the rise in ground voltage can be decreased and the arrangement area can be decreased in the grid-like arrangement.

Abstract: A semiconductor integrated circuit able to reduce a load of layout design when arranging switches in a power lines for preventing leakage current and able to reduce the influence of a voltage drop occurring in the switches on a signal delay, wherein a plurality of groups of power lines are arranged in stripe shapes, power is supplied to circuit cells by a plurality of groups of branch lines branching from the groups of power lines, power switch cells arranged in the groups of branch lines turn on or off the supply of power to the circuit cells, the power switch cells are arranged dispersed in the area of arrangement of the circuit cells, and the supply of power by the power switch cells is finely controlled for every relatively small number of circuit cells.

Abstract: In a semiconductor integrated circuit device, a VDD wiring trace and a GND wiring trace are routed along an N-well and a P-well, respectively, within a substrate. A substrate-bias VDD2 wiring trace is routed in a direction that intersects the VDD wiring trace and GND wiring trace in the same layer thereof and is electrically connected thereto. A P+ diffusion layer is disposed in the N-well in the vicinity of a portion where the wiring directions of the VDD wiring trace and substrate-bias VDD2 wiring trace intersect and is electrically connected to the VDD wiring trace via a contact. An N+ diffusion layer is disposed in the P-well in the vicinity of a portion where the wiring directions of the GND wiring trace and substrate-bias VDD2 wiring trace intersect and is electrically connected to the GND wiring trace via a contact. The P+ diffusion layer is used as a wiring route regarding the VDD wiring trace and the N+ diffusion layer is used as a wiring route regarding the GND wiring trace.

Abstract: A semiconductor integrated circuit able to reduce a load of layout design when arranging switches in a power lines for preventing leakage current and able to reduce the influence of a voltage drop occurring in the switches on a signal delay, wherein a plurality of groups of power lines are arranged in stripe shapes, power is supplied to circuit cells by a plurality of groups of branch lines branching from the groups of power lines, power switch cells arranged in the groups of branch lines turn on or off the supply of power to the circuit cells, the power switch cells are arranged dispersed in the area of arrangement of the circuit cells, and the supply of power by the power switch cells is finely controlled for every relatively small number of circuit cells.

Abstract: An integrated circuit including an assembly of functional blocks and an interconnection network formed of at least N levels of conductive tracks separated by conductive via levels, the interconnection network including a power supply network comprising a first assembly of substantially parallel rails placed at the N-th track level, and a second assembly of substantially parallel rails placed at the (N?1)-th track level under the first rail assembly, the rails of the first assembly being non-parallel to those of the second assembly, the power supply network further including, for each functional block, a third assembly of power supply rails placed at the (N?2)-th track level above the elements of the considered block, and in which the rails of the second assembly form an acute angle smaller than 80° with the rails of each third rail assembly.

Abstract: The semiconductor device has insulating films 40, 42 formed over a substrate 10; an interconnection 58 buried in at least a surface side of the insulating films 40, 42; insulating films 60, 62 formed on the insulating film 42 and including a hole-shaped via-hole 60 and a groove-shaped via-hole 66a having a pattern bent at a right angle; and buried conductors 70, 72a buried in the hole-shaped via-hole 60 and the groove-shaped via-hole 66a. A groove-shaped via-hole 66a is formed to have a width which is smaller than a width of the hole-shaped via-hole 66. Defective filling of the buried conductor and the cracking of the inter-layer insulating film can be prevented. Steps on the conductor plug can be reduced. Accordingly, defective contact with the upper interconnection layer and the problems taking place in forming films can be prevented.

Abstract: Wirings connected to a gate electrode of a slave switch circuit cell for substrate bias circuits are respectively electrically connected to a wiring for a power supply potential and a wiring for a reference potential. Thus, the switch operation of the slave switch circuit cell is made invalid. Wirings connected to n wells of respective circuit cells are electrically connected to a wiring for the power supply potential, and wirings connected to p wells of the respective circuit cells are electrically connected to the wiring. Thus, the n wells are fixed to the power supply potential, and the p wells are fixed to the reference potential.

Abstract: The invention provides an electro-optical device in which a voltage drop due to the wiring resistance of a cathode is reduced and therefore steady image signals are transmitted such that erroneous image display, such as low contrast, is reduced or prevented. The invention also provides an electronic apparatus including such an electro-optical device. An electro-optical device includes red, green, and blue luminescent power-supply lines to apply currents to light-emitting elements arranged in an actual display region in a matrix; and a cathode line disposed between the light-emitting elements and a cathode. The cathode line has a width larger than a width of red, green, and blue luminescent power-supply lines.

Abstract: A power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device. An embodiment describes the routing of a shield mesh of both power and ground lines to remove noise created by capacitive and inductive coupling. Relatively long signal lines are routed in between fully connected power and ground shield mesh which may be generated by a router during the signal routing phase or during power mesh routing phase. Leaving only the odd tracks or the even tracks for signal routing, power mesh (VDD) and ground mesh (VSS) are routed and fully interconnected leaving shorter segments and thereby reducing the RC effect of the circuit device. Another embodiment presents a technique where the signals are shielded using the power and ground mesh for a gridless routing. Another embodiment presents a multi-layer grid routing technique where signals are routed on even grid and the power and ground lines are routed on odd grid.

Abstract: Methods and systems for optimal decoupling capacitance in a dual-voltage power-island architecture. In low-voltage areas of the chip, accumulation capacitors of two different types are used for decoupling, depending on whether the capacitor is located in an area which is always-on or an area which is conditionally powered.

Abstract: Repeaters are arranged at arbitrary positions to substantially improve transmission speed of a signal. In the semiconductor integrated circuit device 1, repeater regions 10 where repeaters are provided as relay points for wiring are provided in the central parts of the core power source regions 2, 3 and 5, on the left side of the core power source regions 4 to 8 and at the upper and lower parts of the semiconductor integrated circuit device 1. A power switch region for repeater 11 is formed so as to surround the core power source regions 2 to 8 and the repeater regions 10. The power source lines of the reference potential connected to the repeater regions 10 are laid out at equally spaced intervals throughout the core power source regions 2 to 8, which enables the repeater regions 10 to be flexibly laid out. This permits the repeaters to be more effectively arranged, which improves the performances of semiconductor integrated circuit device 1.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: A phase-changeable memory device includes a phase-changeable material pattern and first and second electrodes electrically connected to the phase-changeable material pattern. The first and second electrodes are configured to provide an electrical signal to the phase-changeable material pattern. The phase-changeable material pattern includes a first phase-changeable material layer and a second phase-changeable material layer. The first and second phase-changeable material patterns have different chemical, physical, and/or electrical characteristics. For example, the second phase-changeable material layer may have a greater resistivity than the first phase-changeable material layer. For instance, the first phase-changeable material layer may include nitrogen at a first concentration, and the second phase-changeable material layer may include nitrogen at a second concentration that is greater than the first concentration. Related devices and fabrication methods are also discussed.

Abstract: A memory device. An array of memory elements is formed on a semiconductor chip. A parallel array of word lines extends in a first direction, connecting each memory element to a data source, and a parallel array of bit lines extends in a second direction, connecting each memory element to a data source, the second direction forming an acute angle to the first direction. The connection between each bit line and each memory element is a phase change element composed of memory material having at least two solid phases.

Abstract: A power bus for use in an IC is disclosed that is configured as a grid and further formed using strips formed on I/O pads such as data I/O and multi-level voltage I/O pads. An IC is disclosed comprising a power supply I/O pad and a data I/O pad which are made of a deposited conductor. The power supply I/O pad is connected to a power bus and the data I/O pad is connected to circuitry. A strip of deposited conductor is formed closely adjacent to the data I/O pad wherein the strip is connected to the power bus. Parallel paths are developed within the integrated circuit to distribute power within the circuit. A similar approach is taken with respect to multi-level I/O pads. The power bus provide for reduced IR drops and better power supplies to core logic within an integrated circuit.

Abstract: Multilevel metallization layouts for an integrated circuit chip including transistors having first, second and third elements to which metallization layouts connect. The layouts minimize current limiting mechanism including electromigration by positioning the connection for the second contact vertically from the chip, overlapping the planes and fingers of the metallization layouts to the first and second elements and forming a pyramid or staircase of multilevel metallization layers to smooth diagonal current flow.

Abstract: Semiconductor devices that include a semiconductor substrate and a gate line are provided. The gate line is on the semiconductor substrate and includes a gate insulation pattern and a gate electrode which are stacked on the substrate in the order named. A spacer is on a sidewall of the gate line. A conductive line pattern is on the gate line. The conductive line pattern is parallel with the gate line and is electrically connected to the gate electrode.

Abstract: An electrostatic discharge (ESD) protection structure is disclosed. The ESD protection structure includes an active device. The active device includes a plurality of drains. Each of the drains has a contact row and at least one body contact row. The at least one body contact row is located on the active device in a manner to reduce the amount of voltage required for triggering the ESD protection structure.

Abstract: In a layout structure of a semiconductor integrated circuit, when transistors are arranged in a constant gate wiring pitch, a common source diffusion region is provided between two adjacent transistors, a CA via is provided on the common source diffusion region, and a source wiring connected to the CA via is provided on the common source diffusion region. An inter-drain wiring connecting the drain regions of the two transistors is formed in a wiring layer higher than the source wiring. Therefore, the wiring path of the source wiring is not limited by the wiring path of the inter-drain wiring, and can be provided, covering the common source diffusion region to a further extent. As a result, the number of high-resistance CA vias or the flexibility of arrangement is increased, leading to a reduction in source resistance, resulting in an increase in operating speed of the semiconductor integrated circuit.

Abstract: A wafer-level package includes a semiconductor wafer having at least one semiconductor chip circuit forming region each including a semiconductor chip circuit each provided with test chip terminals and non test chip terminals, at least one external connection terminal, at least one redistribution trace provided on the semiconductor wafer, at least one testing member, and an insulating material. A first end of the redistribution trace is connected to one of the test chip terminals and a second end of said redistribution trace is extended out to a position offset from the chip terminals. The testing member is provided in an outer region of the semiconductor chip circuit forming region, and the second end of the redistribution trace is connected to the testing member.

Abstract: A semiconductor integrated circuit device has a plurality of CMOS-type base cells arranged on a semiconductor substrate and m wiring layers, and gate array type logic cells are composed of the base cells and the wiring layers. Wiring within and between the logic cells is constituted by using only upper n (n<m) wiring layers. It becomes possible to shorten a development period and reduce a development cost when a gate array type semiconductor integrated circuit device becomes large in scale.

Abstract: A pad section serving as an electrode for external connection of a semiconductor device includes a first pad metal (61) formed in the top layer, a second pad metal (62) formed under the first pad metal (61) via an interlayer insulating film (71), and vias (63) which penetrate the interlayer insulating film (71) and electrically connect the first pad metal (61) and the second pad metal (62). The first pad metal (61) and the second pad metal (62) have edges displaced from each other so as not to be aligned with each other along the thickness direction of each layer. Thus, it is possible to reduce stress occurring on an edge of the second pad metal (62), thereby reducing damage on the interlayer insulating film (71) and so on.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: The invention relates to a semiconductor element (10) with an integrated circuit (12), which has at least two layers (14, 16, 18), which are electrically conductive in areas, arranged one over the other, and spaced from one another by at least one intermediate layer (24, 26), whereby in a first layer (14), trace sections (28) for providing a first voltage potential and in a second layer (16), trace sections (30) for providing a second voltage potential are provided, and with at least one protection diode (36) electrically connected to a trace section (28) of the first layer (14) and to a trace section (30) of the second layer (16), said diode which is configured to eliminate voltage peaks in a substrate layer (38) arranged beneath the first and second layer (14, 16) and which is arranged at least in part beneath a trace section.

Abstract: A power semiconductor device that includes a plurality of gate structure each having a gate insulation of a first thickness, and a termination region, the termination including a field insulation body surrounding the active region and having a recess that includes a bottom insulation thicker than the first thickness.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: A capacitor including a polysilicon layer doped with impurities to be conductive, a first dielectric layer formed on the polysilicon layer, a first conductive layer formed on the first dielectric layer, a second dielectric layer formed on the first conductive layer, and a second conductive layer formed on the first dielectric layer. The second conductive layer is coupled to the polysilicon layer.

Abstract: An integrated circuit has a power rail formed of a first wire in a lower metal layer and a second wire in an upper metal layer and that run in the same direction in their respective layers. A number of vias connect the first and second wires, to form a sandwich power rail structure. Other embodiments are also described and claimed.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length-by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: A semiconductor forming transistors on a semiconductor substrate includes a low concentration source/drain region formed in the semiconductor substrate, a high concentration source/drain region formed in the source/drain region, a gate electrode formed on the substrate through gate oxide film, a P type body region formed under the gate electrode and placed between the source/drain regions and, plug contact portions contacting the source/drain region and arranged in plural, and a source/drain electrode connecting to the source/drain region with contact through the contact portions.

Abstract: A standard cell is read from a library and automatic layout wiring is performed, thereby configuring a circuit. Next, each cell column in the configured circuit is searched for an empty region. In the empty region in the cell column searched for, a spacer cell or a filler cell is placed. At this time, using the spacer cell or filler cell, the well potential of the standard cells in the cell column is fixed.

Abstract: An integrated circuit is provided with a first power line, a plurality of additional power lines intersecting with the first power line, a plurality of power switch transistors each having a drain connected with the first power line and a source connected with one of the additional power lines, a well provided to extend along the first power line; and a plurality of primitive cells each including a first transistor prepared within the well, the first transistor having a source connected with the first power line. The plurality of additional power lines includes first and second additional power lines The plurality of primitive cells are provided between the first and second additional power lines along the first power line. A bias voltage is fed to the well through both of first and second well contacts, the first well contact providing a connection between the first additional power line and the well, and the second well contact providing a connection between the second additional power line and the well.

Abstract: In a semiconductor integrated circuit, a cell arrangement area is provided on a semiconductor substrate to allow a plurality of basis cells to be arranged. A basic power supply line is provided in an upper layer than the cell arrangement area to supply a power. A switch cell is configured to control the power supply from the basic power supply line to an inside of the cell arrangement area. An always operating cell is arranged in the cell arrangement area adjacently to the switch cell, and is configured to receive the power from the switch cell even when the switch cell stops the power supply to the cell arrangement area.

Abstract: The collector, emitter, and base of a bipolar transistor circuit are connected to a high side power supply terminal, the drain of a level shift transistor, and a floating power supply terminal, respectively. When a high side output transistor is on, the floating power supply terminal is at the potential of a high potential power supply terminal. The high side power supply terminal is at a potential higher than the potential of the floating power supply terminal by a constant voltage. Turning the level shift transistor on, its drain potential drops below the potential of the floating power supply terminal; The base current flows through the bipolar transistor circuit and the drain potential of the level shift transistor is clamped near the potential of the floating power supply terminal; The bipolar transistor circuit is turned on and its collector current supplies the drain current of the level shift transistor.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: A semiconductor integrated circuit includes: a macro cell having a plurality of circuit elements; a first macro cell power supply line for supplying a first potential to the macro cell; and a second macro cell power supply line formed in a same wiring layer as a wiring layer of the first macro cell power supply line, for supplying a second potential to the macro cell. The first and second macro cell power supply lines are provided on the macro cell. The second macro cell power supply line extends in a first direction that is a longitudinal direction of the first macro cell power supply line.

Abstract: A memory capable of reducing the memory cell size is provided. In this memory, a first gate electrode of a first selection transistor and a second gate electrode of a second selection transistor are provided integrally with a word line, and arranged to obliquely extend with respect to the longitudinal direction of a first impurity region on a region formed with memory cells and to intersect with the first impurity region on regions formed with the first selection transistor and the second selection transistor in plan view.

Abstract: Provided are a flash memory device and a method of manufacturing the same. The flash memory device includes strings. Each of the strings has a string selection line, a ground selection line, and an odd number of word lines formed between the string selection line and the ground selection line.

Abstract: Inverters are connected between a pseudo power supply wiring and a main power supply wiring, while inverters are connected between a main power supply wiring VDD and a pseudo power supply wiring. Connected to the sources of transistors are switching areas for switching to the main power supply wiring or the pseudo power supply wiring. Connected to the sources of transistors are switching areas for switching to the main power supply wiring or the pseudo power supply wiring. Even if improper connections are found or logical changes are required, the connection destination of the source is switched easily.

Abstract: A first intermediate power supply wiring is arranged on an upper layer of a lowest power supply wiring arranged along a first direction. A second intermediate power supply wiring is arranged on an upper layer of the first power supply wiring. A third intermediate power supply wiring is arranged on an upper layer of the second intermediate power supply wiring. A highest power supply wiring is arranged along a second direction on an upper layer of the third intermediate power supply wiring. The first intermediate power supply wiring extends from an intersecting region of the highest power supply wiring and the lowest power supply wiring to an outer side of the intersecting region along the first direction. The second intermediate power supply wiring includes a wiring site extending from the intersecting region to the outer side of the intersecting region along the first direction and a wiring site extending from the intersecting region to the outer side of the intersecting region along the second direction.