Smart (e.g., Credit) Card Package Patents (Class 257/679)
  • Patent number: 11069601
    Abstract: The present disclosure is directed to leadless semiconductor packages with improved wettable flanks that encourage the formation of solder fillets when the leadless semiconductor package is mounted to a substrate. The solder fillets are consistently formed and are easily detectable by inspection systems, such as automated optical inspection (AOI) systems.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: July 20, 2021
    Assignee: STMicroelectronics, Inc.
    Inventors: Ian Harvey Arellano, Aaron Cadag, Ela Mia Cadag
  • Patent number: 11005152
    Abstract: An RFID transponder, comprising an antenna, comprising a radiating element an IC, and a ground plane arranged under the radiating element, the ground plane being solid without openings. The radiating element comprises a near field communication section extending over the edge of the ground plane for enabling near field communication of the antenna by the ground plane from backside of the RFID transponder.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: May 11, 2021
    Assignee: Confidex OY
    Inventors: Heikki Ahokas, Miika Pylvanainen
  • Patent number: 10939562
    Abstract: A manufacturing method of a multilayer board includes: forming a metal core layer including a main body, an island portion, and four connection portions, the island portion having a substantially rectangle shape and being located in an opening formed in the main body, the opening having a substantially rectangle shape, the four connection portions connecting side surfaces of four corners of the island portion or side surfaces of vicinities of the four corners of the island portion to a side surface of the main body; forming a first insulating layer on the metal core layer and in the opening; and forming, in the first insulating layer, a hole reaching each of the four connection portions and removing at least a part of each of the four connection portions through the hole to electrically separate the main body and the island portion from each other
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: March 2, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi Sugiyama, Masashi Miyazaki, Yutaka Hata, Hiroyuki Kobayashi
  • Patent number: 10923509
    Abstract: A thin film transistor (TFT) array substrate and a display panel are provided in the present application. The TFT array substrate includes a plurality of gate signal lines, a plurality of source signal lines, a plurality of gate traces, the gate traces including a plurality of first gate traces, a plurality of second gate traces, a plurality of first gate trace holes, and a plurality of second gate trace holes; a plurality of source traces, the source traces including a plurality of first source traces, a plurality of second source traces, a plurality of first source trace holes, and a plurality of second source trace holes connecting the source signal lines and the first source traces.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: February 16, 2021
    Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventor: Xiaoliang Feng
  • Patent number: 10922440
    Abstract: The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form. Customized smart devices, smart phones and touchscreen devices may be fabricated in examples of a cleanspace fabricator. In some examples, self-destruction devices may safely be installed into the assembly of the smart device in a cleanspace fabricator.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: February 16, 2021
    Inventor: Frederick A. Flitsch
  • Patent number: 10908685
    Abstract: A hand-wearable device includes an elastic sheet including a first elastic layer and a second elastic layer facing each other; a sensor unit formed by printing a predetermined conductive liquid metal between the first elastic layer and the second elastic layer; a wire unit extending from the sensor unit and electrically connected to the sensor unit; an electrode substrate formed on one side of the wire unit and spaced apart from the wire unit by a predetermined distance; and a connection electrode formed by printing a predetermined conductive liquid metal between the wire unit and the electrode substrate.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: February 2, 2021
    Assignee: FEEL THE SAME, INC.
    Inventors: Joon Bum Bae, Su In Kim, Woo Keun Park, Da Hee Jeong, Jin Hyeok Oh
  • Patent number: 10910324
    Abstract: A semiconductor device has a configuration in which a stacked assembly and a resin case are combined. The stacked assembly includes a semiconductor element, a stacked substrate on which the semiconductor element is mounted, and a metal substrate on which the stacked substrate is mounted. In the resin case, a notch groove is provided at a corner portion for reducing a stress. At least one of a width and a length of the notch groove is 2 mm or more.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: February 2, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Tatsuhiko Asai, Katsumi Taniguchi
  • Patent number: 10879145
    Abstract: An electronic device includes electronic components, a molded resin element wherein the electronic components are embedded and secured, and a heat transfer layer; the heat transfer layer has a higher thermal conductivity than the molded resin element. The heat transfer layer is in contact with portions of the electronic components other than an electrode pad and a terminal. This prevents increases in the cost of manufacturing the electronic device and the allows the electronic device to be thinner.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: December 29, 2020
    Assignee: OMRON Corporation
    Inventor: Wakahiro Kawai
  • Patent number: 10839344
    Abstract: The invention is a system and method of managing equipment. The system incorporates a tagging device to attach identification tags to each piece of equipment. A scanning device is used to read the identification tags and relay this information to an equipment server. An input device is used to input information to the equipment server. The equipment server runs the equipment management program. The system flags a potential asset assigned to an asset creating individual. Equipment is designated an asset after use in an asset creating event.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: November 17, 2020
    Assignee: PROVA GROUP, INC.
    Inventors: Tommy Lee Davis, Jr., David Earl Doser, Jr.
  • Patent number: 10832538
    Abstract: Manufacturing a batch is provided which includes a plurality of items of an electronic device, the items including a plurality of corresponding main modules having a same functional structure substantially identical for the items. The method includes defining at least one security electric circuit, of an enclosure component for enclosing each item, adapted to protect the item from tampering, the security electric circuits having individual configurations substantially different among the items, for use in forming the security electric circuit with the corresponding configuration on each enclosure component. Additionally, the method includes determining one or more electric characteristics of each security electric circuit for use in configuring a monitoring circuit of the corresponding main module, the monitoring circuit being adapted to the corresponding security electric circuit for detecting the tampering, according to the electric characteristics of the corresponding security circuits.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: November 10, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Silvio Dragone, Christoph Hagleitner, Stefano S. Oggioni
  • Patent number: 10826158
    Abstract: A wireless communication device having an integrated antenna, and methods for making and using the same are disclosed. The device generally includes (a) a substrate; (b) an integrated circuit (IC) comprising a plurality of printed and/or thin film layers and/or structures on the substrate, (c) a dielectric or insulator layer in at least one area of the substrate other than the IC; and (d) an antenna on the dielectric or insulator layer, comprising one or more metal traces. The plurality of printed and/or thin film layers and/or structures include an uppermost layer of metal. The antenna has (i) an inner terminal continuous with the uppermost layer of metal or connected to the uppermost layer of metal through one or more contacts, and (ii) an outer terminal connected to the uppermost layer of metal through one or more contacts and optionally a metal bridge or strap.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 3, 2020
    Assignee: Thin Film Electronics ASA
    Inventors: Somnath Mukherjee, Aditi Chandra, Mao Ito, Arvind Kamath, Scott Bruner, Sambhu Kundu, Anand Deshpande
  • Patent number: 10825755
    Abstract: A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.
    Type: Grant
    Filed: January 4, 2020
    Date of Patent: November 3, 2020
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventor: Pedro Joel Rivera-Marty
  • Patent number: 10827632
    Abstract: A middle frame assembly may include a middle frame and a bearing plate, the middle frame may include a frame body having a first surface and a second surface opposite to the first surface, the frame body defines a first through hole penetrating the first surface and the second surface, the bearing plate may include a bearing body having a third surface and a fourth surface opposite to the third surface, and a first extending portion protruding from the third surface and configured to pass through the first through hole and fitting with the frame body, such that the bearing body may be connected to the frame body and that and that the first surface and the third surface may abut against each other.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: November 3, 2020
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD
    Inventor: Fuyong Huang
  • Patent number: 10810477
    Abstract: The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: October 20, 2020
    Assignee: Linxens Holding
    Inventors: Christophe Mathieu, Bertrand Hoveman
  • Patent number: 10777534
    Abstract: A three-dimensional stacking structure is described. The stacking structure includes at least a bottom die, a top die and a spacer protective structure. The bottom die includes contact pads in the non-bonding region. The top die is stacked on the bottom die without covering the contact pads of the bottom die and the bottom die is bonded with the top die through bonding structures there-between. The spacer protective structure is disposed on the bottom die and covers the top die to protect the top die. By forming an anti-bonding layer before stacking the top dies to the bottom dies, the top die can be partially removed to expose the contact pads of the bottom die for further connection.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: September 15, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Peter Yu Fei Huang, Chaochieh Tsai
  • Patent number: 10762322
    Abstract: A fingerprint sensor for incorporation into a smart card includes sensor electrodes for detecting fingerprint features of a finger placed on a contact surface, the sensor electrodes being disposed above a substrate layer that comprises a first portion, a second portion, and a ledge where an edge of the first portion extends beyond an edge of the second portion. Contact points disposed on the ledge connect the fingerprint sensor to electrical conductors of an intermediate layer of a multi-layer smartcard. The fingerprint sensor is disposed within a cavity formed in a body of the smartcard, and the contact points disposed on the ledge are set at a depth corresponding to the thickness of an outer layer covering the electrical conductors of the intermediate layer of the smartcard.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: September 1, 2020
    Assignee: IDEX Biometrics ASA
    Inventors: Øyvind Sløgedal, Ralph W. Bernstein
  • Patent number: 10756487
    Abstract: A plug contact set, comprising a plug contact strip (10) having several first plug contacts (12, 14) arranged in a first housing (11), at least one of which is formed as a checking contact (14) having a shorter length than the rest of the plug contacts (12), and having a plug connector (20) having several second plug contacts (22) arranged in a second housing (21), at least one of which is configured to come into electrical contact with the checking contact (14), wherein the first housing (11) has at least one first latch element (31) and the second housing (21) has at least one second latch element (32) which are configured to latch together when the first plug contacts (12) are completely contacted with the second plug contacts (22), is characterised in that the second housing (21) has a third latch element (33) which can be latched with the first latch element (31) and which is arranged to be spaced apart from the second latch element (32) in the plugging direction (S) in such a way that, by latching the t
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: August 25, 2020
    Assignee: ERNI PRODUCTION GMBH & CO. KG
    Inventor: Juergen Lappoehn
  • Patent number: 10755157
    Abstract: A structure for a contact-less card, the contact-less card may include a buzzer coupled to a fixed power source. The contact-less card may include a vibration motor coupled to the fixed power source. The contact-less card may include a controller coupled to the buzzer and the vibration motor. The controller includes a first integrated circuit. The first integrated circuit transmits a trigger signal to the buzzer and the vibration motor based on an enablement signal. The contact-less card may include a contact-less communication controller electrically coupled to the controller. The contact-less communication controller comprises a second integrated circuit containing card information. The second integrated circuit transmits the card information based on an induced voltage. The second integrated circuit transmits the enablement signal to the controller based on an induced voltage. The contact-less card may include an antenna electrically coupled to the contact-less communication controller.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: August 25, 2020
    Assignee: International Business Machines Corporation
    Inventor: Cesar Augusto Rodriguez Bravo
  • Patent number: 10727085
    Abstract: A method includes applying a die attach material to a die pad of an integrated circuit package. The die attach material is employed as a bonding material to the die pad. The method includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material. The method includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit package to mitigate delamination between the integrated circuit die and the die pad.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: July 28, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Yong Lin, Rongwei Zhang, Benjamin Stassen Cook, Abram Castro
  • Patent number: 10720388
    Abstract: A package includes a device die, and an encapsulating material encapsulating the device die therein. The encapsulating material has a top surface coplanar with a top surface of the device die. A coil extends from the top surface to a bottom surface of the encapsulating material, and the device die is in the region encircled by the coil. At least one dielectric layer is formed over the encapsulating material and the coil. A plurality of redistribution lines is in the at least one dielectric layer. The coil is electrically coupled to the device die through the plurality of redistribution lines.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: July 21, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Chiang-Jui Chu, Chung-Shi Liu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo
  • Patent number: 10714148
    Abstract: A SSD storage module comprising a printed circuit board, an encapsulating colloid, and an electronic circuit welded on an inner surface of the printed circuit board and having a data storage function; the encapsulating colloid is formed on the inner surface of the printed circuit board and is configured for seamlessly encapsulating the electronic circuit, an outer surface of the printed circuit board is provided with a plurality of metal contact pieces, the plurality of metal contact pieces are electrically connected with the electronic circuit, and the plurality of metal contact pieces comprise a plurality of SATA interface contact pieces. The encapsulating colloid seamlessly encapsulates the electronic circuit and isolates the electronic circuit from the air, such that a problem that the electronic circuit is directly exposed to the air, and performances of components of the electronic circuit may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: July 14, 2020
    Assignee: SHENZHEN LONGSYS ELECTRONICS CO., LTD.
    Inventors: Zhixiong Li, Weiwen Pang, Xiaoqiang Li, Honghui Hu, Jinmou Qin
  • Patent number: 10699981
    Abstract: A package includes a device die, a through-via having a sand timer profile, and a molding material molding the device die and the through-via therein, wherein a top surface of the molding material is substantially level with a top surface of the device die. A dielectric layer overlaps the molding material and the device die. A plurality of redistribution lines (RDLs) extends into the dielectric layer to electrically couple to the device die and the through-via.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: June 30, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Lin Huang, Jung-Hua Chang, Jy-Jie Gau, Jing-Cheng Lin
  • Patent number: 10678951
    Abstract: Various embodiments of the present invention relates generally to an integrated circuit, and more particularly, to systems, devices and methods of incorporating a tamper detection countermeasure into a security ASIC to deter physical attacks. The tamper detection countermeasure architects an active mesh to cover a sensitive area in the security ASIC. A plurality of time-varying random numbers is generated by a random number generator (RNG), and the active mesh is driven and configured according to these random numbers. During tamper detection cycles, the active mesh is monitored with respect to the plurality of random numbers that is directly provided by the RNG. Upon a tampering attempt, a flag signal is generated and used to initialize subsequent anti-tampering actions. The active mesh may be controlled and monitored based on time-varying codes, and therefore, an adversary may not easily bypass the active mesh and attack the sensitive area.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: June 9, 2020
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Subbayya Chowdary Yanamadala, Anish Dhanekula
  • Patent number: 10643932
    Abstract: A semiconductor package substrate, in which a base substrate having an upper surface and a lower surface and formed of a conductive material is filled with resin formed of an insulating material, includes a die pad formed of the conductive material on the upper surface and a lead arranged on the upper surface by being electrically separated from the die pad and comprising a bonding pad that is a wire bonding area. A protrusion protruding toward the lower surface is formed in a central area of the bonding pad. A central thickness of the bonding pad is greater than a peripheral thickness of the bonding pad.
    Type: Grant
    Filed: November 10, 2016
    Date of Patent: May 5, 2020
    Assignee: Haesung DS CO., LTD.
    Inventors: In Seob Bae, Sung Il Kang
  • Patent number: 10622700
    Abstract: An electromagnetic communication device includes a device substrate, an antenna formed on or in the device substrate, and a circuit element having an electrical circuit and one or more electrically conductive connection posts protruding from the circuit element. Each of the connection posts is electrically connected to the electrical circuit and at least one connection post is electrically connected to the antenna.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: April 14, 2020
    Inventor: Ronald S. Cok
  • Patent number: 10601156
    Abstract: Plug contact set, comprising a plug contact strip (17) having several first contact elements (12, 14) that are formed as components of a circuit board (10) and are arranged in the region of a circuit board edge (19), at least one of which contact elements (12, 14) being formed in the plugging direction (S) as a checking contact (14) having a smaller length than the remaining contact elements, and having a plug connector having several second contact elements (22) that are arranged in a housing, at least one of which contact elements (22) being set up to electrically make electric contact with the checking contact (14), wherein at least one first latch element (31, 51) that is formed as part of the circuit board (10) is arranged on the circuit board edge (19) and at least one second latch element (32) is arranged on the housing, said latch elements being set up to latch with one another when the first contact elements (12, 14) are completely contacted by the second contact elements (22), and wherein a third la
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: March 24, 2020
    Assignee: ERNI PRODUCTION GMBH & CO. KG
    Inventor: Juergen Lappoehn
  • Patent number: 10561021
    Abstract: The area projections or a spacer occupies on the upper surface of a resin casing increases as the size of a power semiconductor module decreases, and therefore another means for defining a clearance between a control board and the resin casing is desired. A power semiconductor module is provided, including: a housing which houses a power semiconductor chip; and at least one control pin or guide pin which protrudes outward from an upper surface of the housing, wherein the at least one control pin or guide pin has at least one step in a height direction from the upper surface of the housing toward a tip farthest from the housing.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: February 11, 2020
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Kenshi Terashima
  • Patent number: 10547640
    Abstract: A security matrix layer between a first and second conductive shorting layers are located within a printed circuit board (PCB). The security matrix layer includes at least two types of microcapsules with each type of microcapsule containing a different reactant. When the security matrix layer is accessed, drilled, or otherwise damaged, the microcapsules rupture and the reactants react to form at least an electrically conductive material. The electrically conductive material may contact and short the first and second conductive shorting layers.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: January 28, 2020
    Assignee: International Business Machines Corporation
    Inventors: Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Joseph Kuczynski, Timothy J. Tofil
  • Patent number: 10535620
    Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device structure (e.g., a sensor device structure), and method for manufacturing thereof, that comprises a three-dimensional package structure free of wire bonds, through silicon vias, and/or flip-chip bonding.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: January 14, 2020
    Assignee: Amkor Technology, Inc.
    Inventors: Jong Sik Paek, No Sun Park
  • Patent number: 10529655
    Abstract: A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: January 7, 2020
    Assignee: Amkor Technology, Inc.
    Inventor: Pedro Joel Rivera-Marty
  • Patent number: 10474206
    Abstract: According to some embodiments, before an M.2 compatible module or device is mounted onto a data processing system that operates an autonomous driving vehicle (ADV), the M.2 module is placed onto a tray device to increase the stiffness of the M.2 module. The tray device containing the M.2 module is then mounted on a board or motherboard of the data processing system. Since the M.2 module is placed on the tray device, the overall stiffness has been significantly increased, which can sustain the physical impact on the M.2 module due to the physical movement and oscillation during the autonomous driving of the ADV. In addition, the tray device also provides suspension effect on the M.2 module during the movement of the ADV. As a result, the M.2 module would not easily damaged during the autonomous driving.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: November 12, 2019
    Assignee: BAIDU USA LLC
    Inventors: Weiyu Lu, Ji Li, Fu-kang Liao
  • Patent number: 10475775
    Abstract: A semiconductor package device comprises a circuit layer, an electronic component disposed on the circuit layer, a package element and a first encapsulant. The package element is disposed on the circuit layer. The package element includes at least two electrical contacts electrically connected to the circuit layer. The first encapsulant is disposed on the circuit layer. The first encapsulant encapsulates the electronic component and the package element and exposes the electrical contacts of the package element.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: November 12, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsu-Nan Fang, Chun-Jun Zhuang
  • Patent number: 10420219
    Abstract: A printed circuit board (PCB) able to accommodate different types of interconnection slots without an increase in size includes a mounting area which accommodates some individual conductive pads and some conductive sharing pads. When a first type connector is mounted on the PCB, the data pins of the first type connector correspond to the sharing pads and when a second type connector is mounted on the PCB, the data pins of the second type connector correspond to the individual pads and the sharing pads.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: September 17, 2019
    Assignees: HONGFUJIN PRECISION INDUSTRY (WUHAN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Jian-Cai Chen
  • Patent number: 10399306
    Abstract: Provided is a sheet 2 for forming a protective film including a protective film-forming film 1 of which the light transmittance at a wavelength of 1600 nm is 25% or greater, and light transmittance at a wavelength of 550 nm is 20% or less, and a release sheet 21 which is laminated on one or both surfaces of the protective film-forming film 1. According to such a sheet 2 for forming a protective film, cracks existing in a workpiece or a manufactured product obtained by processing the workpiece can be inspected and a protective film in which grinding marks existing in the workpiece or the manufactured product are not visually recognized can be formed.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: September 3, 2019
    Assignee: Lintec Corporation
    Inventors: Naoya Saiki, Daisuke Yamamoto, Hiroyuki Yoneyama, Ken Takano
  • Patent number: 10402583
    Abstract: The present invention relates to a method of privacy-preserving during an access to a restricted e-service requiring user private data from a smart card. The invention relates more particularly to the field of methods implemented so that the user has the guarantee that only the private data needed to access to the e-service are extracted from the smart card. It is to guarantee that the user has a perfect knowledge of his private data provided by his smart card to a requester. With the invention a message notifying to the user the very nature of the identity assertion is displayed on the screen of the smart card. By doing so, the card ensure 100% security with regard to user consent: the data read out of his card cannot differ comparing to the data requested by the service provider through the terminal.
    Type: Grant
    Filed: July 4, 2014
    Date of Patent: September 3, 2019
    Assignee: GEMALTO SA
    Inventor: Mourad Faher
  • Patent number: 10388329
    Abstract: A SSD storage module comprising a printed circuit board (1), an encapsulating colloid (2), and an electronic circuit (3) welded on an inner surface of the printed circuit board (1) and having a data storage function; the encapsulating colloid (2) is formed on the inner surface of the printed circuit board (1) and is configured for seamlessly encapsulating the electronic circuit (3), an outer surface of the printed circuit board (1) is provided with a plurality of metal contact pieces (11), the plurality of metal contact pieces (11) are electrically connected with the electronic circuit (3), and the plurality of metal contact pieces (11) comprise a plurality of SATA interface contact pieces (110).
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: August 20, 2019
    Assignee: SHENZHEN LONGSYS ELECTRONICS CO., LTD.
    Inventors: Zhixiong Li, Weiwen Pang, Xiaoqiang Li, Honghui Hu, Jinmou Qin
  • Patent number: 10381067
    Abstract: Systems, among other embodiments, include topologies (data and/or control/address information) between an integrated circuit buffer device (that may be coupled to a master, such as a memory controller) and a plurality of integrated circuit memory devices. For example, data may be provided between the plurality of integrated circuit memory devices and the integrated circuit buffer device using separate segmented (or point-to-point link) signal paths in response to control/address information provided from the integrated circuit buffer device to the plurality of integrated circuit buffer devices using a single fly-by (or bus) signal path. An integrated circuit buffer device enables configurable effective memory organization of the plurality of integrated circuit memory devices. The memory organization represented by the integrated circuit buffer device to a memory controller may be different than the actual memory organization behind or coupled to the integrated circuit buffer device.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: August 13, 2019
    Assignee: Rambus Inc.
    Inventors: Ian Shaeffer, Ely Tsern, Craig Hampel
  • Patent number: 10366321
    Abstract: An RFIC device including a resin block having a first surface, a second surface that faces the first surface, and a through-hole that extends through the first surface and the second surface. Moreover, the RFIC device includes an RFIC element that is embedded in the resin block and a coil antenna disposed in the resin block that is connected with the RFIC element and that has a central axis that extends from the first surface to the second surface. In addition, the through-hole extends inside the coil antenna.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: July 30, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kunihiro Komaki, Shunji Mandai, Kengo Matsumoto
  • Patent number: 10362699
    Abstract: An electronic device includes a display screen, one or more internal components, and a foam outer housing coupled to the display screen and enclosing the one or more internal components. The electronic device may also include a foam midframe enclosed by the foam outer housing. The foam outer housing may be resilient so as to provide impact absorption and water resistance, while the foam midframe may be rigid to provide stiffness to the electronic device. The electronic device may have a density less than 1 gram/centimeter3 such that the electronic device is buoyant in liquid water.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: July 23, 2019
    Assignee: Amazon Technologies, Inc.
    Inventors: ChengChien Lu, David Eric Peters
  • Patent number: 10347576
    Abstract: A semiconductor package includes a package substrate, the package substrate including a conductive plate, an insulating plate on the conductive plate, the insulating plate including a mounting region and a peripheral region surrounding the mounting region, and at least one capillary channel in the peripheral region, a semiconductor chip on the mounting region of the insulating plate, and a molding member on the insulating plate to cover the semiconductor chip, a portion of the molding member being in the at least one capillary channel.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: July 9, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kwang-Won Choi, Sang-Woo Pae, Seong-Won Jeong, Min-Jae Kwon, Da-Hye Min, Jin-Chul Park, Jae-Won Chang
  • Patent number: 10314216
    Abstract: The invention relates to a method for fabricating electronic cards by A) forming a plurality of card bodies in the form of a thick sheet with a plurality of electronic units or modules embedded in the sheet; B) printing a plurality of first patterns on a first face of the thick sheet in a printing station where ink is applied on the first face; C) applying a first at least partially transparent coating on each printed first pattern, that adheres to the card body. The method can also include printing a plurality of second patterns on the inner surface of a film forming the first coating. Preferably, the printing of the first patterns is carried out in an offset type station for printing high definition patterns, essentially of the security type. The second patterns define personal data. The printed thick sheet defines an intermediate product according to the invention.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: June 4, 2019
    Assignee: Nagravision S.A.
    Inventor: François Droz
  • Patent number: 10282655
    Abstract: A chip card module is provided. The chip card module may include a carrier having a first side and an opposite second side, a chip arranged over the carrier, the chip having a first chip contact, a first and a second antenna contact formed over the first side, a metal-free area formed over the first side between the first antenna contact and the second antenna contact, wherein the metal-free area extends between a first edge portion and a second edge portion of the carrier, and a first chip connection electrically connecting the first chip contact to the first antenna contact, wherein the first chip connection is at least partially arranged over the second side in a region opposite the metal-free area.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: May 7, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Frank Pueschner, Siegfried Hoffner, Jens Pohl
  • Patent number: 10236187
    Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: March 19, 2019
    Assignee: MediaTek Inc.
    Inventors: Wen-Sung Hsu, Ta-Jen Yu
  • Patent number: 10204733
    Abstract: Provided is a module substrate including an inductor that can be made thinner and smaller. A module substrate according to an aspect of the present invention includes a substrate member having a mounting surface on which electronic components are mounted, a magnetic core disposed within the substrate member, and a conductor coil provided in the substrate member and wound around the magnetic core. The module substrate has a configuration in which an inductor is built into the substrate member, which makes it possible to make the overall module substrate smaller and thinner.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: February 12, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi Sugiyama, Masashi Miyazaki, Yutaka Hata
  • Patent number: 10199312
    Abstract: A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.
    Type: Grant
    Filed: September 9, 2017
    Date of Patent: February 5, 2019
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventor: Pedro Joel Rivera-Marty
  • Patent number: 10187993
    Abstract: A device includes a circuit board, a plastic case accommodating the circuit board therein, the plastic case protecting the circuit board, and a plurality of conductive support members supporting the circuit board such that the circuit board is fixed to the plastic case. In the device, the conductive support members are fixed to the circuit board inside the plastic case, and extend to the outside of the plastic case to be fixed to the plastic case.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: January 22, 2019
    Assignee: SAMSUNG SDI CO., LTD.
    Inventor: Jun Young Lee
  • Patent number: 10163780
    Abstract: A package includes a device die, and an encapsulating material encapsulating the device die therein. The encapsulating material has a top surface coplanar with a top surface of the device die. A coil extends from the top surface to a bottom surface of the encapsulating material, and the device die is in the region encircled by the coil. At least one dielectric layer is formed over the encapsulating material and the coil. A plurality of redistribution lines is in the at least one dielectric layer. The coil is electrically coupled to the device die through the plurality of redistribution lines.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: December 25, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Chiang-Jui Chu, Chung-Shi Liu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo
  • Patent number: 10157848
    Abstract: A chip card module arrangement may include a first surface and a second surface, which are opposite from one another, and a chip receptacle for one or more semiconductor chips on the surfaces. The chip card module arrangement may further include a connecting material receiving area on one of the two surfaces, the connecting material receiving area only taking up a portion of the surface.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: December 18, 2018
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Jens Pohl, Thomas Spoettl, Peter Stampka
  • Patent number: 10153424
    Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor element, a plurality of terminals, and a sealing resin. The semiconductor element has a front surface and a back surface. The front surface and the back surface face in opposite directions to each other in a thickness direction of the semiconductor element. The plurality of terminals are disposed at a distance from the semiconductor element and are electrically connected to the front surface. The sealing resin has a first surface facing in a same direction as the direction in which the front surface faces. Each of the plurality of terminals has a main surface exposed from the first surface.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: December 11, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Shinsei Mizuta, Satohiro Kigoshi, Takaaki Masaki
  • Patent number: 10108898
    Abstract: A method of tracking a package. The method includes applying a package label to a package in which the package label comprises an antenna circuit, an activation tab configured to activate the antenna circuit, and a deactivation tab configured to deactivate the antenna circuit. The method also includes activating the antenna circuit by removing the activation tab and periodically transmitting a signal by the antenna circuit upon activation. The signal comprises information that identifies the package. The method also includes receiving the signal and using the information in the signal to track a location of the package.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: October 23, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Robert Scott Ballam, Robert Ganton