Abstract: A semiconductor package includes a processor die, a storage module and a package substrate. The storage module includes an array of cache units and an array of memory units stacked over one another, and electrically connected to the processor die, wherein the array of cache units is configured to hold copies of data stored in the array of memory units and frequently used by the processor die. The package substrate is on which the processor die and the storage module are disposed.

Abstract: A card medium includes: a card body containing a metal material and having at least one aperture at a front surface thereof; an electronic component disposed in the at least one aperture and having an outer peripheral surface facing an aperture inner peripheral surface of the at least one aperture with a clearance from the aperture inner peripheral surface, at least part of the outer peripheral surface including a conductor exposed portion at which a conductor having conductive properties is exposed; a circuit substrate which is embedded into the card body and to which the electronic component is joined; and an electrical insulation portion provided between the electronic component and the aperture inner peripheral surface.

Abstract: A method of packaging an RF transistor device includes attaching one or more electronic devices to a carrier substrate, applying an encapsulant over at least one of the one or more electronic devices, and providing a protective structure on the carrier substrate over the one or more electronic devices. A packaged RF transistor device includes a carrier substrate, one or more electronic devices attached to the carrier substrate, an encapsulant material over at least one of the one or more electronic devices and extending onto the carrier substrate, and a protective structure on the carrier substrate over the one or more electronic devices and the encapsulant material.

Abstract: Packaged electronic devices and integrated circuits include a ceramic material or other thermally conductive, electrically insulating substrate with a patterned electrically conductive feature on a first side, and an electrically conductive layer on a second side. The IC further includes a semiconductor die mounted to the substrate, the semiconductor die including an electrically conductive contact structure, and an electronic component, with an electrically insulating lamination structure enclosing the semiconductor die, the frame and the thermal transfer structure. A redistribution layer with a conductive structure is electrically connected to the electrically conductive contact structure.

Abstract: In embodiments, a method is provided that includes writing a static data image in an invariant part of a non-volatile memory of an integrated circuit used to store an operating system; writing a set of personalization data in the static data image representing data specific to the integrated circuit; storing a subset of the set of personalization data in a reserved area of the non-volatile memory by reserving the reserved area and storing commands for writing the set of personalization data by an application or the operating system; converting the commands with a known code to obtain an inner command script, the inner script including the commands as encoded; storing the inner command script in the reserved area of the non-volatile memory; decoding and executing the inner command script to obtain the commands during an activation of the integrated circuit; and executing the commands by the integrated circuit.

Abstract: According to an embodiment, an IC card includes a communication interface and a processor. The communication interface communicates with an IC card processing apparatus. The processor transmits extended format support information indicating whether an extended format is supported for each of commands to the IC card processing apparatus.

Abstract: A crimper analyzer system is disclosed. The crimper analyzer system also includes a network interface. The crimper analyzer system also includes a memory storage. The crimper analyzer system also includes one or more processors configured to: receive hose specifications and fitting specifications from the network interface, generate crimp parameters based on the received hose specifications and crimp operation data, obtain additional crimp operation data for a hose assembly operation, update the crimp operation data with the additional crimp operation data and store in the updated crimp operation data in the memory storage, and generate a unique assembly identification (UAID) for the hose assembly operation subsequent to the hose assembly operation.

Abstract: A chip includes a substrate having a first surface and a second surface opposite the first surface, and an integrated circuit mounted on a landing zone on the first surface of the substrate. The chip also includes contacts provided about the first surface in the peripheral region, and wire-bonds providing electrical connections between the integrated circuit and the contacts. The chip further includes solder ball connections provided in the peripheral region on the second surface, and connections provided in the substrate for connecting the electrical contacts on the first surface with the solder ball connections on the second surface. The substrate includes at least one conductive track routed through the landing zone region of the substrate, and the chip is configured such that an alteration in the at least one conductive track prevents operation of the integrated circuit.

Abstract: A system and method for secure generation and distribution of digital encryption keys is disclosed. The system may also be used to protect and distribute other types of secure information, including digital, audio, video, or analog data, or physical objects. The system may include a tamper-respondent secure token device, which may be configured to destroy or disable access to the secure information contained therein in response to attempts to physically or electronically breach the device. Outputs may be provided in a secure manner through various interfaces without using electricity (wires) or electromagnetic radiation. Inputs may be provided in a secure manner, including through the use of a gesture-based input interface. Destruction or disablement of the device and/or its secure contents may be provided upon detection of tamper attempts or upon input of a self-destruct command. Proof of the destruction or disablement of the device or its contents may be provided.

Abstract: A semiconductor package includes a first redistribution structure, including a first insulating layer and a first redistribution layer disposed below the first insulating layer; a semiconductor chip disposed on the first redistribution structure, including a connection terminal electrically connected to the first redistribution layer and buried in the first insulating layer; an encapsulant disposed on the first redistribution structure that seals a portion of the semiconductor chip; a second redistribution structure, including a second redistribution layer disposed on the encapsulant; and a through via, including a pattern portion buried in the first insulating layer and electrically connected to the first redistribution layer and a via portion penetrating through the encapsulant and electrically connecting the pattern portion and the second redistribution layer.

Abstract: Coil structures and methods of forming are provided. The coil structure includes a substrate. A plurality of coils is disposed over the substrate, each coil comprising a conductive element that forms a continuous spiral having a hexagonal shape in a plan view of the coil structure. The plurality of coils is arranged in a honeycomb pattern, and each conductive element is electrically connected to an external electrical circuit.

Abstract: Device of the chip or electronic system-in-package type, comprising at least one element for protecting at least part of at least one face of the device, said protective element comprising at least: an attack detection element of the device comprising at least one GMI-effect electrically conductive material, and a magnetic field emitter to which said GMI-effect electrically conductive material is to be subjected, and wherein the GMI effect is to be achieved in said GMI-effect electrically conductive material when an exciting alternating electric current flows therethrough and when subjected to the magnetic field of the magnetic field emitter.

Abstract: A method for fabricating packaged semiconductor devices is disclosed. In one example the method comprises providing a plurality of semiconductor dies, the semiconductor dies being arranged in an array on a carrier such that a first side of the semiconductor dies faces the carrier and such that an empty space is arranged laterally besides each semiconductor die. A substrate comprising a plurality of conductive elements is arranged over the plurality of semiconductor dies such that a conductive element is arranged in the respective empty space besides each one of the semiconductor dies. The plurality of semiconductor dies are molded over to form a molded body, and singulating packaged semiconductor devices from the molded body by cutting through the molded body.

Abstract: It is aimed to provide a shielded connector capable of improving heat dissipation performance while suppressing enlargement. A shielded connector 10 includes a housing 11, a shield shell 12 for covering the housing 11 from outside, a connection terminal 14 to be accommodated into the housing 11 and electrically connected to a mating device, and an inner conductive member 13 for electrically connecting the connection terminal 14 and a wire W. High radiation portions 51 having at least a higher radiation rate than a core W1 of the wire W are provided on at least some of a surface 11a of the housing 11, a surface 12a of the shield shell 12, a surface 14a of the connection terminal 14 and a surface 13a of the inner conductive member 13.

Abstract: A transaction card that includes a card body that can include a ceramic material. The card body can include a primary surface and a secondary surface, a laser marked feature disposed on the card body and a laser etched feature disposed on the card body. A method of making a transaction card can include forming a ceramic material slurry comprising a ceramic material and a binder, forming a green body from the ceramic material slurry, firing the green body at a firing temperature to create a fired ceramic body, grinding the fired ceramic body into a card body, and polishing a primary surface of the card body.

Abstract: An electronic device, according to various embodiments of the present disclosure, may comprise: a housing including a seating groove therein; a battery seated in the seating groove, at least a partial area of which includes a curved surface; and an adhesive member disposed between the battery and the seating groove and formed along at least a portion of an edge of the battery. The adhesive member may be formed having varied predetermined thicknesses, corresponding to a position of the battery.

Abstract: An adhesion between a sealing resin layer and a shield film is improved by a mesh sheet disposed on an opposite surface of the sealing resin layer. A radio frequency module includes a wiring board, a component mounted on an upper surface of the wiring board, a sealing resin layer that covers the component, a mesh sheet disposed on an upper surface of the sealing resin layer, and a shield film provided to cover the upper surface and side surfaces of the sealing resin layer, and the mesh sheet. The mesh sheet and the sealing resin layer, as well as the mesh sheet and the shield film are firmly in adhesion with one another. Thus, the adhesion between the sealing resin layer and the shield film can be improved.

Abstract: A stacked semiconductor device is disclosed that includes a plurality of semiconductor dies. Each die has oppositely disposed first and second surfaces, with pads formed on each of the surfaces. A plurality of through-vias connect respective pads on the first surface to respective pads on the second surface. The through-vias include a first group of through-vias coupled to respective I/O circuitry on the semiconductor die and a second group of through-vias not coupled to I/O circuitry on the semiconductor die. The plurality of semiconductor dies are stacked such that the first group of through-vias in a first one of the plurality of semiconductor dies are aligned with respective ones of at least a portion of the second group of through-vias in a second one of the plurality of semiconductor dies.

Abstract: A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.

Abstract: An electronic device package is provided. The electronic device package includes a redistribution layer (RDL), a first electronic component and an interconnector. The RDL includes a topmost circuit layer, and the topmost circuit layer includes a conductive trace. The first electronic component is disposed over the RDL. The interconnector is disposed between the RDL and the first electronic component. A direction is defined by extending from a center of the first electronic component toward an edge of the first electronic component, and the direction penetrates a first sidewall and a second sidewall of the interconnector, the second sidewall is farther from the center of the first electronic component than the first sidewall is, and the conductive trace is outside a projection region of the second sidewall.

Abstract: Aspects described herein may allow for a payment card having enhanced edge patterns. The payment card may include a complex edge morphology on the physical card that may make the payment card more likely to be used by consumers and makes the payment card stand out due to the enhanced edge design. The edge of the payment card may be reeded, crenelated, or may include various shapes of various sizes on one or more of the edge walls extending around the payment card. The edge of the payment card may also include dimples, chips, and/or other complex design patterns cut into the face of the payment card close to the edge. The payment card may also include inclusions of other materials, such as metals, ceramic, and/or polymer to be added which fill or partially fill any voids produced by the edge patterns.

Abstract: A spectrometer includes a support having a bottom wall part and a side wall part arranged on one side of the bottom wall part, a light detection element supported by the support to face a surface of the bottom wall part on the one side through a spectroscopic space, a resin molded layer provided at least on the surface of the bottom wall part on the one side, and a reflecting layer provided on the resin molded layer and included in an optical function part on the bottom wall part. The resin molded layer has a first part having a shape corresponding to the optical function part and a second part which surrounds the first part and is thinner than the first part.

Abstract: An electronic component array includes a base tape including paper and having approximately elongated and substantially planar shape, the base tape being provided with a plurality of accommodation recesses provided in a longitudinal direction of the base tape; a plurality of electronic components; and a cover tape. The electronic component array includes a first bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are included in the respective accommodation recesses, and a second bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are not included in the respective accommodation recesses. A peel strength of the second bonding portion is about 10% or more and about 70% or less of a peel strength of the first bonding portion.

Abstract: A near-field communication device having one or more processors configured to control the near-field communication device, an energy supplier having an energy supply circuit and a supply antenna configured to provide energy to a second antenna circuit arranged externally to the near-field communication device, wherein the supply antenna of the energy supplier is galvanically coupled to the energy supply circuit, and a first antenna circuit having a first communication circuit and a first antenna, wherein the first communication circuit is configured for communication with a second communication circuit of the second antenna circuit by means of an inductive coupling by means of the first antenna of the first antenna circuit.

Abstract: A method for manufacturing a circuit board is disclosed. An inner wiring base board with a first opening is provided. A base board is fixed in the first opening, and a first wiring base board and a second wiring base board are pressed on opposite surfaces of the inner wiring base board. The base board is made of ceramic and has a high light reflectivity of 92% to 97%. A first conductor layer and a second conductor layer are formed on opposite surfaces of the laminated structure. The first conductor layer includes a plurality of connecting pads on the base board. A solder mask is formed on an outer side of the first conductor layer, the solder mask has a high light reflectivity of 92% to 95%, and the base board is exposed outside the solder mask.

Abstract: Embodiments of the present disclosure relate to solutions for introducing personalization data in nonvolatile memories of a plurality of integrated circuits, comprising writing in the nonvolatile memory of a given integrated circuit a static data image, corresponding to an invariant part of nonvolatile memory common to the plurality of integrated circuits, and a personalization data image representing data specific to the given integrated circuit.

Abstract: A memory card is provided with various pad layouts to prevent a data signal pad from contacting a power contact in a host during insertion and removal of the memory card. The memory card can have a form factor and features that accommodate a relatively-large memory with relatively-high performance and accompanying thermal conditions. An efficient card lock mechanism is also provided.

Abstract: A semiconductor package includes a redistribution substrate including a first redistribution layer; a semiconductor chip having a connection pad connected to the first redistribution layer; a vertical connection conductor electrically connected to the connection pad by the first redistribution layer; a core member having a first through-hole accommodating the semiconductor chip and a second through-hole accommodating the vertical connection conductor; an encapsulant filling the first and second through-holes; and a redistribution member including a second redistribution layer. The vertical connection conductor and the core member include a same material. A width of a lower surface of the vertical connection conductor is wider than that of an upper surface thereof, a width of a lower end of the first through-hole is narrower than that of an upper end thereof, and a width of a lower end of the second through-hole is narrower than that of an upper end thereof.

Abstract: An antenna device includes a substrate, a chip, and an antenna. The chip is disposed on the substrate, and the chip has at least two pads. The antenna is disposed on the substrate, and the chip is disposed between the substrate and the antenna. The antenna has a first bonding line segment and a second bonding line segment electrically connected to the at least two pads respectively. The first bonding line segment is located at an outermost coil of the antenna, and is disposed across a short side direction of the chip in a manner of completely covering one of the at least two pads. The second bonding line segment is located at an innermost coil of the antenna, and is disposed across the short side direction of the chip in a manner of completely covering another of the at least two pads.

Abstract: A liquid ejecting apparatus includes a drive element, and a drive circuit that outputs a drive signal that drives the drive element, wherein the drive circuit includes a modulation circuit that modulates a base drive signal to output a modulation signal, an amplifier circuit that amplifies the modulation signal to output an amplified modulation signal, a demodulation circuit that demodulates the amplified modulation signal to output the drive signal, and a substrate on which the modulation circuit, the amplifier circuit, and the demodulation circuit are provided, wherein the substrate includes a base material includes a metal and a first layer laminated on the base material, wherein the first layer includes a first propagation wire through which at least one of the amplified modulation signal and the drive signal propagates, and wherein the base material has a thickness greater than a thickness of the first layer.

Abstract: The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. An information carrying card includes a body defining a first cavity and a second cavity. The first cavity has a first area and the second cavity has a second area. The first cavity is continuous with the second cavity and the second area is less than the first area. A circuit element is disposed within the first cavity.

Abstract: Coil structures and methods of forming are provided. The coil structure includes a substrate. A plurality of coils is disposed over the substrate, each coil comprising a conductive element that forms a continuous spiral having a hexagonal shape in a plan view of the coil structure. The plurality of coils is arranged in a honeycomb pattern, and each conductive element is electrically connected to an external electrical circuit.

Abstract: A metal smartcard (SC) having a transponder chip module (TCM) with a module antenna (MA), and a card body (CB) comprising two discontinuous metal layers (ML), each layer having a slit (S) overlapping the module antenna, the slits being oriented differently than one another. One metal layer can be a front card body (FCB, CF1), and the other layer may be a rear card body (RCB, CF2) having a magnetic stripe (MS) and a signature panel (SP). The slits in the metal layers may have non-linear shapes.

Abstract: A robotic device having in-mold electronics is provided. According to one or more aspects, a robotic device includes an electronic computing unit for controlling the robotic device and a molded part. The molded part includes a thermoformed first film, structural layer, electronic circuit, and a functional component. The molded structural layer is arranged under the first film. The thermoformed second film arranged under the structural layer. The electronic circuit arranged over the second film and adjacent the structural layer. The electronic circuit includes a functional component communicably coupled to the electronic computing unit. The first film is arranged to cover the structural layer, the second film, and the electronic circuit to define an exposed surface of the molded part.

Abstract: A punching process for wireless charging coils comprises: punching a metal piece for forming a coil structure and a fixing element, the coiling structure having a plurality of coil segments, a gap being between two of the plurality of coil segments, and the fixing element connecting the coil segments for keeping the width of the gap.

Abstract: A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.

Abstract: The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof.

Abstract: The disclosure provides a method to authenticate an integrated circuit (IC) structure. The method may include forming a first authentication film (AF) material within the IC structure. A composition of the first AF material is different from an adjacent material within the IC structure. The method includes converting the first AF material into a void within the IC structure. Additionally, the method includes creating an authentication map of the IC structure to include a location of the void in the IC structure for authentication of the IC structure.

Abstract: A wireless signal device is provided. The wireless signal device includes a device body, a fastening belt, a wireless signal module and a switch unit. The device body includes a through hole. A fixed end of the fastening belt is affixed to the device body, and a free end of the fastening belt is adapted to be inserted into the through hole. The wireless signal module is disposed in the device body. The switch unit is disposed in the device body, wherein in a signal transmission mode, the fastening belt passes through the through hole, and the switch unit is pressed by the fastening belt to activate the wireless signal module.

Abstract: A first object and a second object are movable in relation to one another. The first object includes a transponder using an integrated circuit having two terminals which may or may not be shorted. The presence or absence of a short circuit between the two terminals is detected. This is accomplished at least partly by the second object depending on the relative positioning of the first and second objects. The transponder transmits, to a module having a contactless reader function, positioning information corresponding to said relative positioning using a contactless communication protocol.

Abstract: A PUF-film includes a flat circuit structure including a plurality of circuit elements and includes a flat electric shield. The circuit structure is evaluable with respect to a plurality of electric capacitance values being arranged between the plurality of circuit elements. The electric shield at least partially covers the circuit structure and provides for a counter reference electrode of the plurality of electric capacitance values.

Abstract: A housing includes a base and a mark piece. The base includes a bottom wall and at least one side wall. The at least one side wall is vertically connected to the bottom wall. A height of the side wall exists between a top end of the at least one side wall and the bottom wall. The mark piece is disposed on the bottom wall and extends from the bottom wall in a direction away from the bottom wall. The mark piece has a low scale and a high scale. A distance from the low scale to the bottom wall is less than the height of the side wall. A distance from the high scale to the bottom wall is substantially the same as the height of the side wall.

Abstract: A semiconductor device, or semiconductor device package, that includes a substrate having an antenna structure on a surface of the substrate and a wire bond that electrically connects the antenna structure to the substrate to form an antenna or a first antenna configuration. The substrate may include a second antenna structure with the wire bond connected to the second antenna structure forming a second antenna or antenna configuration. The semiconductor device may include a radio communication device electrically connected to the substrate. The antenna or antenna configuration may be tuned to the requirements of the radio communication device. The antenna configuration may be tuned by connected to different antenna structures on the surface of the substrate. The antenna configuration may be tuned by changing a length of the wire bond, changing a diameter of the wire bond, and/or changing the material of the wire bond.

Abstract: A semiconductor device has a plurality of semiconductor die. A first prefabricated insulating film is disposed over the semiconductor die. A conductive layer is formed over the first prefabricated insulating film. An interconnect structure is formed over the semiconductor die and first prefabricated insulating film. The first prefabricated insulating film is laminated over the semiconductor die. The first prefabricated insulating film includes glass cloth, glass fiber, or glass fillers. The semiconductor die is embedded within the first prefabricated insulating film with the first prefabricated insulating film covering first and side surfaces of the semiconductor die. The interconnect structure is formed over a second surface of the semiconductor die opposite the first surface. A portion of the first prefabricated insulating film is removed after disposing the first prefabricated insulating film over the semiconductor die.

Abstract: The disclosure relates to a dual-interface integrated circuit (IC) card module for use in a dual-interface IC card. Embodiments disclosed include a dual-interface integrated circuit card module (150), the module comprising: a substrate (104) having first and second opposing surfaces; a contact pad (102) on the first surface of the substrate; an integrated circuit (110) on the second surface of the substrate (104), the integrated circuit (110) having electrical connections to the contact pad (102) through the substrate (104); and a pair of antenna pads (108) disposed in recesses (103) in the second surface of the substrate (104) and electrically connected to corresponding antenna connections on the integrated circuit (110).

Abstract: A semiconductor device includes a circuit board including an insulating layer having opposite front and rear surfaces, an electrode pad disposed on the front surface, a housing having an installation area for the circuit board, and a bonding material embedded in a recess within either a first area located at the rear surface of the insulating layer directly below an area of the circuit board in which the electrode pad is disposed, or at a second area located within the installation area of the housing and corresponding to the first area in a plan view.

Abstract: A flexible semiconductor package includes a semiconductor chip accommodated in a cavity formed in a substrate, a molding layer covering an entire upper surface of the substrate and the cavity, and a wiring portion including an insulating layer and a redistribution member provided under lower surfaces of the substrate and the semiconductor chip, wherein the molding layer includes a pre-preg in which a resin is impregnated with a glass fabric, and the molding layer and the insulating layer are attached to the semiconductor chip accommodated in the cavity by a roll-to-roll continuous process.

Abstract: A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.

Abstract: Embodiments of an active shielding device and method for active shielding are disclosed.

Abstract: A method of manufacturing a semiconductor package includes mounting and electrically connecting a semiconductor die to a substrate. The semiconductor die and the substrate are encapsulated to form an encapsulation. Via holes are laser-ablated through the encapsulation and conductive material is deposited within the via holes to form vias. A first buildup dielectric layer is formed on the encapsulation. Laser-ablated artifacts are laser-ablated in the first buildup layer. The laser-ablated artifacts in the first buildup layer are filled with a first metal layer to form a first electrically conductive pattern in the first build up layer. The operations of forming a buildup layer, forming laser-ablated artifacts in the buildup layer, and filling the laser-ablated artifacts with an electrically conductive material to form an electrically conductive pattern can be performed any one of a number of times to achieve the desired redistribution.