Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.

Abstract: Provided is a module substrate including an inductor that can be made thinner and smaller. A module substrate according to an aspect of the present invention includes a substrate member having a mounting surface on which electronic components are mounted, a magnetic core disposed within the substrate member, and a conductor coil provided in the substrate member and wound around the magnetic core. The module substrate has a configuration in which an inductor is built into the substrate member, which makes it possible to make the overall module substrate smaller and thinner.

Abstract: A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.

Abstract: A device includes a circuit board, a plastic case accommodating the circuit board therein, the plastic case protecting the circuit board, and a plurality of conductive support members supporting the circuit board such that the circuit board is fixed to the plastic case. In the device, the conductive support members are fixed to the circuit board inside the plastic case, and extend to the outside of the plastic case to be fixed to the plastic case.

Abstract: A package includes a device die, and an encapsulating material encapsulating the device die therein. The encapsulating material has a top surface coplanar with a top surface of the device die. A coil extends from the top surface to a bottom surface of the encapsulating material, and the device die is in the region encircled by the coil. At least one dielectric layer is formed over the encapsulating material and the coil. A plurality of redistribution lines is in the at least one dielectric layer. The coil is electrically coupled to the device die through the plurality of redistribution lines.

Abstract: A chip card module arrangement may include a first surface and a second surface, which are opposite from one another, and a chip receptacle for one or more semiconductor chips on the surfaces. The chip card module arrangement may further include a connecting material receiving area on one of the two surfaces, the connecting material receiving area only taking up a portion of the surface.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor element, a plurality of terminals, and a sealing resin. The semiconductor element has a front surface and a back surface. The front surface and the back surface face in opposite directions to each other in a thickness direction of the semiconductor element. The plurality of terminals are disposed at a distance from the semiconductor element and are electrically connected to the front surface. The sealing resin has a first surface facing in a same direction as the direction in which the front surface faces. Each of the plurality of terminals has a main surface exposed from the first surface.

Abstract: A method of tracking a package. The method includes applying a package label to a package in which the package label comprises an antenna circuit, an activation tab configured to activate the antenna circuit, and a deactivation tab configured to deactivate the antenna circuit. The method also includes activating the antenna circuit by removing the activation tab and periodically transmitting a signal by the antenna circuit upon activation. The signal comprises information that identifies the package. The method also includes receiving the signal and using the information in the signal to track a location of the package.

Abstract: Magnetic keys having a plurality of magnetic layers having holes are disclosed. The location and orientation of the holes are controlled to generate magnetic fields that are of sufficient strength to be reliably read and sufficient complexity to be difficult to counterfeit. The magnetic keys are located on imaging-device supply items along with non-volatile memory devices containing measurements of the magnetic fields that are digitally signed. These supply items are difficult to counterfeit. Other devices are disclosed.

Abstract: A semiconductor device package includes a flexible substrate, an electronic component, at least one flexible member, and a package body. The electronic component is disposed on the flexible substrate. The at least one flexible member is disposed on the flexible substrate. The package body encapsulates the electronic component and has a first part and a second part separated from the first part by the at least one flexible member.

Abstract: An electronic paper apparatus including a communication module and a control module is provided. The communication module receives an electrical signal and generates a power voltage according to the electric signal. The communication module wakes up a controller during a first period of a work period by using the power voltage. The control module is electrically connected to the communication module, and includes the controller and an electronic paper display. The control module establishes a communication connection with the communication module during a second period of the work period. The power circuit module generates a driving voltage according to the power voltage to drive the electronic paper display to display image information according to the driving voltage during a display period. The first period and the second period are two continuous time intervals forming the work period. Furthermore, a driving method of the electronic paper apparatus is also provided.

Abstract: The integrated circuit includes a functional block performing a logic and/or analog function. A control circuit is configured to transmit at least a first signal to the receiver and receive a second signal from receiver. The electrically conducting lines' first and second series connect the control circuit and receiver to perform the first and second signals' transit. A plurality of monitoring stations is simultaneously connected to first and second series of electrically conducting lines to define a first elementary electric pattern in the electrically conducting lines' first series and a distinct second elementary electric pattern equivalent to first elementary electric pattern in the electrically conducting lines' second series. A shield at least partially covers the functional block. The control circuit is configured to detect modification of first elementary electric pattern with respect to the second elementary electric pattern by absence of receipt of the second signal after a predefined time-out.

Abstract: In one embodiment of the present invention, a multilayer wiring substrate includes: a first wiring substrate having a first core member made of metal with cavities therein; a second wiring substrate having a second core member made of metal; and a bonding layer between the first wiring substrate and the second wiring substrate to bond a top surface of the first wiring substrate to a bottom surface of the second wiring substrate, the bonding layer having a patterned conductive layer.

Abstract: A semiconductor element mounting board includes: a circuit conductor disposed on the insulating board, a plurality of semiconductor element connection pads connected to the circuit conductor, a semiconductor element mounted on a surface of the insulating board, a first capacitor and a second capacitor disposed on a surface or an inside of the insulating board, and a first conductor path configured to connect the first capacitor between the semiconductor element connection pads, and a second conductor path configured to connect the second capacitor between the semiconductor element connection pads; and an inductance of the first conductor path is smaller than an inductance of the second conductor path, and capacitance of the first capacitor is smaller than capacitance of the second capacitor, and an internal inductance of the first capacitor is smaller than an internal inductance of the second capacitor.

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.

Abstract: A transaction card having three layers, wherein the first layer is metal, the second layer is a polymer, and the third layer is a carbon-containing layer.

Abstract: A printed circuit board assembly comprises a printed circuit board (PCB) defining a mounting end and an opposite contacting end, a row of first pads on the mounting end, a row of second pads on the contacting end, and an edge connector on the contacting end electrically contacted with the second pads, and a high speed line module mounted on a top side of the PCB and including a group of conductive lines, the conductive lines extending parallel to each other over the plane of the PCB, each conductive line having two ends electrically connected to corresponding first and second pads, respectively.

Abstract: A flexible package may be provided. The flexible package may include a flexible molding member including a top surface. The flexible package may include a first chip within the flexible molding member, and including a first top surface. The flexible package may include a second chip within the flexible molding member, and including a second top surface. The first top surface may face away from the top surface of the flexible molding member and the second top surface may face towards the top surface of the flexible molding member.

Abstract: A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

Abstract: A method of manufacturing an electronic device package includes structuring a metal layer to generate a structured metal layer having a plurality of openings. Semiconductor chips are placed into at least some of the openings. An encapsulating material is applied over the structured metal layer and the semiconductor chips to form an encapsulation body. The encapsulation body is separated into a plurality of electronic device packages.

Abstract: A Printed Circuit Board Assembly (PCBA) forming an enhanced fingerprint module is disclosed. The PCBA includes a Printed Circuit Board (PCB), an image sensing chip, at least one electrode and a protection layer. An opening in a first insulation layer and a second insulation layer of the PCB together form a sensor portion so that the image sensing chip can be packaged in the opening. Thus, the thickness of the enhanced fingerprint module can be thinner than other fingerprint modules provided by the conventional package methods.

Abstract: Three-dimensional flexible photonic integrated circuits on silicon are fabricated in semiconductor wafer form and then transferred to Silicon-on-Polymer (SOP) substrates. SOP provides flexibility for conformal mounting with devices capable of maintaining performance when dynamically deformed to allow routing of light in x, y and z directions. Bonding a wafer or individual die of III-V semiconductor, such as Gallium Arsenide or similar photonic material, to the flexible silicon creates an active region for lasers, amplifiers, modulators, and other photonic devices using standard processing. Mounting additional photonic devices to the opposite side of a flexible photonic waveguide produces a stack for three-dimensional devices. Multiple flexible photonic waveguides may be stacked to increase functionality by transferring light between stacked waveguides.

Abstract: In a smart card having an antenna structure and a metal layer, an insulator layer is formed between the antenna structure and the metal layer to compensate for the attenuation due to the metal layer. The thickness of the insulator layer affects the capacitive coupling between the antenna structure and the metal layer and is selected to have a value which optimizes the transmission/reception of signals between the card and a card reader.

Abstract: In data processing including high-speed cipher calculation for which it is not appropriate to employ a leveling technique, tamper resistance is improved against an attack to a specific position performed by knowing a layout of functional blocks in a semiconductor chip. Examples of the attack include micro-probing, fault injection, and electromagnetic wave analysis. A semiconductor device, in which a plurality of IC chips that perform the same cipher calculation in parallel are laminated or stacked, performs data processing including the cipher calculation. A chip that compares and verifies results of the cipher calculations performed by the plurality of chips is laminated in an intermediate layer whose element surface is covered by another chip. For example, when three chips are laminated, a chip in the intermediate layer sandwiched by the upper layer and the lower layer has a comparative verification function.

Abstract: An array substrate and a manufacturing method thereof, a flexible display panel and a display device are provided. The array substrate includes a flexible substrate divided into a display region and a periphery region, the periphery region surrounding the display region. The array substrate further includes: an array layer and a first film layer sequentially formed in the display region on the flexible substrate; a plurality of integrate circuits and a flexible printed circuit board interface formed in the periphery region on the flexible substrate; a flexible protective film layer formed on a junction of the periphery region and the first film layer and in a region of the periphery region other than the integrate circuits and the flexible printed circuit board interface on the flexible substrate.

Abstract: An electronic card including an antenna, a chip, a charging circuit and a battery is provided. The antenna receives an external electric signal, and the chip is coupled to the antenna, so as to receive the external electric signal and provide a demodulated electric signal. The charging circuit is coupled to the chip, receives the demodulated electric signal and converts the demodulated electric signal to generate a charging power. The battery is coupled to the charging circuit, wherein, the charging circuit provides the charging power to the battery according to a residual electricity of the battery, so as to charge the battery.

Abstract: A semiconductor device has a plurality of semiconductor die. A first prefabricated insulating film is disposed over the semiconductor die. A conductive layer is formed over the first prefabricated insulating film. An interconnect structure is formed over the semiconductor die and first prefabricated insulating film. The first prefabricated insulating film is laminated over the semiconductor die. The first prefabricated insulating film includes glass cloth, glass fiber, or glass fillers. The semiconductor die is embedded within the first prefabricated insulating film with the first prefabricated insulating film covering first and side surfaces of the semiconductor die. The interconnect structure is formed over a second surface of the semiconductor die opposite the first surface. A portion of the first prefabricated insulating film is removed after disposing the first prefabricated insulating film over the semiconductor die.

Abstract: A mold package being a half-mold type includes: a substrate includes a first face and a second face; an electronic component that is mounted on the first face; and a mold resin that is provided on the first face and seals the first face with the electronic component. The second face is exposed from the mold resin. The mold resin is disposed on the first face so as to seal a sealed portion and to expose a remaining part of the first face as an exposure portion. One side face is provided by an end side face. One side face is provided by a boundary side face. At least a site on a lower end of the boundary side face is provided by an inclined face. In the boundary side face, a site on an upper end side is provided by an other inclined face having a second inclination angle.

Abstract: In a case where a first mounted substrate to which a semiconductor element is bounded by solder is mounted on a second substrate, connection strength becomes low, when the first mounted substrate is bonded to the second substrate by using a solder having a low melting point. A mounted structure, in which a first mounted substrate on which a semiconductor element is bonded by using a first solder having a melting point of 217° C. or more, is mounted on a second substrate, includes plural bonding parts bonding the first mounted substrate to the second substrate; and a reinforcing member formed around the bonding part. Each of the bonding parts contains a second solder having a melting point, that is lower than the melting point of the first solder, and a space exists, in which the reinforcing members do not exist, between the bonding parts neighboring each other.

Abstract: Disclosed is a technique for tamper detection in an electronic device by use of an internal power supply signal. The technique includes electrically coupling a conductive trace, in series via a resistor, to an internal power supply that supplies power to a security module within a processor of the device. The technique further includes electrically coupling the power supply to a detector for use in tamper detection on the trace. Upon occurrence of a short-circuit condition on the conductive trace, substantially all voltage of the local power supply is dropped across the resistor. As a result, the detector detects a drop in voltage below a predetermined threshold, and perceives such drop as a “collapse” of the internal power supply. The collapse of the power supply is indicative of a tampering event to the detector, which in response, outputs a signal to disable an operation of the security module.

Abstract: An electronic device comprising: a semiconductor die integrating an electronic component; a leadframe housing the semiconductor die; a protection body, which surrounds laterally and at the top the semiconductor die and, at least in part, the leadframe structure, defining a top surface, a bottom surface, and a thickness of the electronic device; and a conductive lead electrically coupled to the semiconductor die. The conductive lead is modelled in such a way as to extend throughout the thickness of the protection body for forming a front electrical contact accessible from the top surface of the electronic device, and a rear electrical contact accessible from the bottom surface of the electronic device.

Abstract: A near field communication antenna device of a mobile terminal is provided. The near field communication antenna device includes a window including a display region for transmitting an image displayed by a display and a black mark region formed around the display region, a multi-layer Flexible Printed Circuit Board (FPCB) on which a plurality of layers are laminated on the lower side of the black mark region of the window, and a spiral loop-shaped antenna pattern in which conductive lines are formed on respective layers of the multi-layer FPCB and are connected to each other. Accordingly, a near field communication antenna is not disposed in a separated installation space, an antenna pattern width can be reduced, and performance of the near field communication antenna may be prevented from being degraded when a battery cover is made of metal or has a curved shape.

Abstract: Electronic device packages and related fabrication methods are provided. An exemplary electronic device includes a semiconductor die having debug circuitry fabricated thereon, a framing structure including an interior portion having the semiconductor die mounted thereto, and a conductive element providing an electrical connection between the interior portion and a contact pad on the semiconductor die that corresponds or is otherwise coupled to an interface of the debug circuitry.

Abstract: A multi-chip semiconductor device comprises a thermally enhanced structure, a first semiconductor chip, a second semiconductor chip, an encapsulation layer formed on top of the first semiconductor chip and the second semiconductor chip. The multi-chip semiconductor device further comprises a plurality of thermal vias formed in the encapsulation layer. The thermally enhanced structure comprises a heat sink block attached to a first semiconductor die. The heat sink block may further comprise a variety of thermal vias and thermal openings. By employing the thermal enhanced structure, the thermal performance of the multi-chip semiconductor device can be improved.

Abstract: According to an aspect of the invention an integrated circuit is conceived which comprises a physical unclonable function which is at least partially implemented in a passivation layer of said integrated circuit. According to a further aspect of the invention, a corresponding method for manufacturing an integrated circuit is conceived. According to a further aspect of the invention, an electronic device is conceived which comprises an integrated circuit of the kind set forth.

Abstract: A membrane is formed from a release liner upon which a plurality of labels and a margin sheet are attached. Each label is a flexible planar body, including a display surface on a top side and an electronic circuit on a bottom side. A first adhesive coating is applied to the bottom of the flexible planar body, allowing the label to be temporarily adhered to the release liner. An antenna is joined to the electronic circuit and connected to the flexible planar body. The electronic circuit itself enables item identification, such as through Radio-Frequency Identification or Electronic Article Surveillance. In order to provide visual information, a primary printed graphic can be applied to each of the labels, while a supplementary printed graphic can be applied to the margin sheet. The plurality of labels can be arranged in different arrays, such as a plurality of rows or a tessellated pattern.

Abstract: When a conductive layer occupying a large area is provided in a coiled antenna portion, it has been difficult to supply power stably. A memory circuit portion and a coiled antenna portion are disposed by being stacked together; therefore, it is possible to prevent a current from flowing through a conductive layer occupying a large area included in the memory circuit portion, and thus, power saving can be achieved. In addition, the memory circuit portion and the coiled antenna portion are disposed by being stacked together, and thus, it is possible to use a space efficiently. Therefore, downsizing can be realized.

Abstract: An electromagnetic transponder including a resonant circuit; a rectifying bridge having input terminals connected across the resonant circuit and having rectified output terminals providing an electronic circuit power supply voltage; and a device for limiting the voltage across the resonant circuit, connected between the input terminals of the rectifying bridge.

Abstract: A card is provided comprising an information setting unit configured to output a first signal including unique information of the card, and a bending sensor configured to output a second signal corresponding to a curvature of the card. An information processing apparatus is also provided comprising a card reading unit configured to acquire information from a card a processor, and a memory device. The memory device stores instructions which when executed by the processor, causes the processor to acquire unique information from the card, and acquire curvature information from the card corresponding to a curvature of the card.

Abstract: The component comprises a first memory (MM) comprising a first portion (P1) having a content modified with a first modification entity (K1) and a second portion (P2) having a content modified with a second entity (K2), a storage means (MS) configured to store the first entity (K1) secretly, a non-volatile memory (NVM) storing an item of entity information representative of the second entity (K2) in a location (END) designated by a first indication (INDK2) contained in the said first portion of the first memory.

Abstract: According to one embodiment, there are provided a memory which is provided on a circuit board, a controller which is provided on the circuit board and controls the memory, and a signal line which is formed on the circuit board and configured to perform data transmission between the controller and the memory, in which a width of the signal line in the place where the signal line is led out from the memory is large compared with a place disposed under the memory.

Abstract: A method of making an integrated circuit (IC) package including electrically and physically attaching a die to an interposer, attaching the interposer to a bottom leadframe, attaching a discrete circuit component to the interposer and attaching a top leadframe to the bottom leadframe.

Abstract: A package and integrated circuit assembly is configured to perform signal conditioning on a signal. The assembly includes a line card having line card contacts that correspond to conductors in the line card connector. Two or more integrated circuits are configured to perform signal conditioning on the signal and the two or more integrated circuits are configured within a package into at least a first row and a second row on the package. The package includes a grid array of bonding pads to electrically connect to the two or more integrated circuits through bond wires or down bonds such that the structure of the grid array corresponds in physical arrangement or bond pad pitch to the line card contacts. This assembly also includes an electrical connection from the two or more integrated circuits to the line card through the package.

Abstract: Some embodiments described herein include apparatuses and methods of forming such apparatuses. One such embodiment may include a routing arrangement having pads to be coupled to a semiconductor die, with a first trace coupled to a first pad among the pads, and a second trace coupled to a second pad among the pads. The first and second traces may have different thicknesses. Other embodiments including additional apparatuses and methods are described.

Abstract: The invention relates to a method for manufacturing a contactless microcircuit antenna coil, including steps of: depositing a first electrically conducting layer on a first face of a wafer, and forming in the first layer an antenna coil in a spiral having several turns, including an internal turn coupled to an internal contact pad and an external turn coupled to an external contact pad, the external turn following the entire contour of antenna coil except for a zone through which a conducting path coupling the external contact pad to the external turn can pass, the external and internal contact pads of the antenna coil being formed in a central zone of the external turn, the antenna coil having a bypass zone in which each turn bypasses the external contact pad.

Abstract: A high-density Subscriber Identity Module (SIM) card package and a production method thereof are provided. The SIM card package includes a substrate, an Integrated Circuit (IC) chip, a bonding wire, and a mold cap. The substrate is a two-layer, a four-layer, a six-layer or an eight-layer high-density interlinked and packaged organic laminated substrate that is manufactured through an etching-back process, and a passive device and a crystal oscillator are provided on the organic laminated substrate. Two IC chips are provided side by side, or one of the IC chips is stacked with a third IC chip, the third IC chip being respectively connected to the organic laminated substrate and the IC chip under the third IC chip by the bonding wire. The IC chip, the passive device, and the crystal oscillator are adhered to the organic laminated substrate.

Abstract: An electronic device module as described herein includes an electronic device package having device contacts. The electronic device package is fixed within encapsulating material, along with an electrically conductive ground layer. The ground layer has a device opening in which the electronic device package resides, and the ground layer also has an antenna opening spaced apart from the device opening. The device contacts and one side of the ground layer correspond to a first surface, and a patch antenna element overlies the first surface. The antenna element is coupled to the electronic device package, and a projection of the patch antenna element onto the first surface resides within the antenna opening. Also provided are methods for manufacturing such an electronic device module.

Abstract: A smart card capable of independently displaying information is wirelessly connectable to an external interface. The smart card includes a main body, an antenna module, an electronic paper, a drive member and a radio frequency identification chip isolated from the drive member. The antenna module includes a first antenna for receiving first electromagnetic wave and a second antenna for receiving/transmitting second electromagnetic wave. The first and second antennas are respectively connected to the drive member and the radio frequency identification chip. The information can be independently displayed on the smart card to ensure confidence of the data. Moreover, the smart card can be more conveniently used.

Abstract: A portable data carrier with a card body in which an integrated circuit is embedded may include a token, a token holder, and one or more fixing portions. The token may comprise the integrated circuit. The token holder may include a first end and a second end, the first end configured to flexibly extend from the card body, and the second end configured to be releasably attached to the token, and a separation line along a length of the token holder between the token holder and the token, the separation line configured to allow the token to be detached from the token holder. The one or more fixing portions may be configured to releasably hold the token and the token holder to corresponding portions of the card body surrounding the token and the token holder.

Abstract: Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a larger contact pad, the bump having a large diameter.