Abstract: A lighting device (1) for a motor vehicle headlamp, including an optoelectronic component (2), a cooling element (3), a circuit board (4), a stabilisation element (5) and a fastening element (6), wherein the stabilisation element (5) comprises an opening (5a) for enclosing the optoelectronic component (2), wherein at least two stabilisation arms (7) extend away from an edge of the opening (5a), which stabilisation arms (7) are equipped to act on the optoelectronic component (2), wherein the cooling element (3) contacts the optoelectronic component (2) on a side facing away from an active side of the optoelectronic component in such a manner that the same exerts a pressure on the optoelectronic component (2) acting in the direction of the active side of the optoelectronic component (2), wherein the at least two stabilisation arms (7) are designed resiliently and act on the active side of the optoelectronic component (2) in such a manner that the at least two stabilisation arms (7) counteract this pressure of t

Abstract: A connector device for an endoscope that can stably operate an endoscope is provided. A connector device (10) includes a hollow exterior case (20), a shield case (22) accommodated in the exterior case (20), and a power reception unit (24) to which power is supplied from a power feed unit (216) of a processor device (200) in a contactless manner. The exterior case (20) has a side wall part (32D) that faces the power feed unit (216). The shield case (22) has an inner case wall part (23) that is disposed to face and be spaced apart from the side wall part (32D). The power reception unit (24) is disposed on the inner case wall part (23).

Abstract: Devices and methods related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer.

Abstract: Implementations of image sensor packages may include an image sensor chip, a first layer including an opening therethrough coupled to a first side of the image sensor chip, and a optically transmissive cover coupled to the first layer. The optically transmissive cover, the first layer, and the image sensor chip may form a cavity within the image sensor. The image sensor package may also include at least one electrical contact coupled to a second side of the image sensor chip opposing the first side and an encapsulant coating an entirety of the sidewalls of the image sensor package.

Abstract: A device for capturing data in the region of a digital camera. Within a camera housing, electronic components are arranged on at least two printed circuit boards. The circuit boards are joined to form a stack. At least one recess is formed in the region of at least one circuit board on the side associated with another circuit board, to receive components arranged on another circuit board. The digital camera optionally has at least one contour milling in the region of a circuit board for height compensation relative to the image sensor in the digital camera. The mechanical securing mechanism of a connection device of an interface into a fastening element connected to the circuit board stack is integrated with the connecting of the housing parts by a preloaded clip. A method for electrical contacting, by which essential parts of the device for capturing data can be produced.

Abstract: In described examples, a device mounted on a substrate includes an encapsulant. In at least one example, an encapsulant barrier is deposited along a scribe line, along which the substrate is singulatable. To encapsulate one or more terminals of the substrate, an encapsulant is deposited between the encapsulant barrier and an edge of the device parallel to the encapsulant barrier.

Abstract: Reliability of a semiconductor device is improved. The semiconductor device PKG1 includes a wiring substrate SUB1, a semiconductor chip CHP1 and a capacitor CDC mounted on the upper surface 2t of the wiring substrate SUB1, and a lid LD formed of a metallic plate covering the semiconductor chip CHP1 and the wiring substrate SUB1. The semiconductor chip CHP1 is bonded to the lid LD via a conductive adhesive layer, and the capacitor CDC, which is thicker than the thickness of the semiconductor chip CHP1, is disposed in the cut off portion 4d1 provided in the lid LD, and is exposed from the lid LD.

Abstract: In a described example, a structure includes a substrate having a surface with multiple sides. A sensor is positioned within the substrate and a seed layer is over at least four sides of the surface of the substrate. A magnetic shield layer is over the seed layer for the at least four sides of the surface of the substrate.

Abstract: A semiconductor device and method of forming the same are provided. The semiconductor device includes at least one substrate and an interconnection structure. The at least one substrate has a cavity partially defined by an inner sidewall of the at least one substrate and a channel disposed at a bottom of the at least one substrate. The channel laterally penetrates through the at least one substrate. The interconnections structure is disposed over the substrate, and the interconnection structure has a through hole penetrating through the interconnection structure. The through hole, the cavity and the channel are in spatial communication with each other.

Abstract: There is provided an endoscope imaging unit including parallel electric wires, an image sensor located on a front end side by being separated from front ends of the respective electric wires, and having a light incident surface substantially perpendicular to the electric wires, a flexible substrate located between the electric wires and the image sensor, having a circuit, and conductively connecting the respective electric wires to the circuit, an image sensor mounting peninsula portion bent with respect to the substrate, and mounting the image sensor thereon by conductively connecting the image sensor to the circuit, and a circuit mounting peninsula portion extending from the substrate, located by being bent to a side opposite to the image sensor before the image sensor mounting peninsula portion, and mounting and conductively connecting an electronic component or the circuit pattern to the circuit.

Abstract: Provided are a fingerprint identification apparatus and an electronic device. The fingerprint identification apparatus is applicable to an electronic device having a display screen, and includes: a fingerprint sensor chip; and a substrate, where an upper surface of the substrate extends downward to form a first groove, and at least a portion of the fingerprint sensor chip is disposed in the first groove and electrically connected to the substrate. By disposing at least a portion of the fingerprint identification sensor in the first groove, not only could costs and complexity of the electronic device be reduced, but also a thickness of the fingerprint identification apparatus could be effectively reduced.

Abstract: An electronic device includes a support substrate to which a first electronic chip and a second electronic chip are mounted in a position situated on top of one another. First electrical connection elements are interposed between the first electronic chip and the support substrate. Second electrical connection elements are interposed between the second electronic chip and the support substrate and are situated at a distance from a periphery of the first electronic chip. Third electrical connection elements are interposed between the first electronic chip and the second electronic chip.

Abstract: A method for manufacturing a MEMS device includes disposing at least one bonding portion having a smaller bonding area in a region where an airtight chamber will be formed, and disposing a metal getter on a bonding surface of the bonding portion. According to this structure, when substrates are bonded to define the airtight chamber, the metal getter is squeezed out of the bonding position due to the larger bonding pressure of the bonding portion with a smaller bonding area. Then, the metal getter is activated to absorb the moisture in the airtight chamber. According to the above process, no additional procedure is needed to remove the moisture in the airtight chamber. A MEMS device manufactured by the above manufacturing method is also disclosed.

Abstract: A mode locking device is disclosed for altering repetition rate in a mode-locked laser. In an example device, laser light is coupled from a fiber into a cavity through a sliding pigtail collimator with a diameter selected such that it is a close tolerance fit with a female snout on a package. A lens focuses laser light to an appropriate spot size onto a SAM or SESAM, such that back-reflection into the fiber is maximized. A piezoelectric transducer is mounted in cooperation with the SAM or SESAM for cavity tuning.

Abstract: An optical assembly includes a window having an interior surface and an opposed exterior surface. A perimeter surface connects between the interior surface and the exterior surface. A metal layer is bonded to the perimeter surface of the window. An anti-reflective coating (ARC) is bonded to the interior surface of the window. A metallic lid is joined to the metal layer for enclosing a focal plane array (FPA) aligned with the window.

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The LED package are also directed to features or arrangements that allow for improved or tailored emission characteristic for LED packages according to the present invention. Some of these features or arrangements include, but are not limited to, higher ratio of light source size to submount size, the used of particular materials (e.g. different silicones) for the LED package layers, improved arrangement of a reflective layer, improved composition and arrangement of the phosphor layer, tailoring the shape of the encapsulant, and/or improving the bonds between the layers. There are only some of the improvements disclosed herein, with some of these resulting in LED packages the emit light with a higher luminous intensity over conventional LED packages.

Abstract: A semiconductor device has a first semiconductor die and a modular interconnect structure adjacent to the first semiconductor die. An encapsulant is deposited over the first semiconductor die and modular interconnect structure as a reconstituted panel. An interconnect structure is formed over the first semiconductor die and modular interconnect structure. An active area of the first semiconductor die remains devoid of the interconnect structure. A second semiconductor die is mounted over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die. The reconstituted panel is singulated before or after mounting the second semiconductor die. The first or second semiconductor die includes a microelectromechanical system (MEMS). The second semiconductor die includes an encapsulant and an interconnect structure formed over the second semiconductor die.

Abstract: The present technology relates to a camera module, a production method, and an electronic device that can prevent reduction of optical module positioning accuracy or heat dissipation performance. An image pickup element is joined on one face of a flexible board so that a light receiving surface of the image pickup element is exposed through an opening of the flexible board, and an optical module is joined on an other face of the flexible board. A reinforcing member is joined on the one face of the flexible board at a circumference of the image pickup element and reinforces a joining part of the flexible board where the optical module is joined. The reinforcing member is joined so as to face an area including at least a part of the joining part and is formed so that a part of the circumference of the image pickup element is kept open.

Abstract: A semiconductor device including a semiconductor substrate having oppositely facing first and second surfaces, the first surface being an active surface and provided with an electronic element thereon, a pad electrode to be connected to the electronic element in a peripheral portion of the electronic element on the active surface, a first opening extending from the second surface toward the pad electrode so as not to reach the first surface of the semiconductor substrate, a second opening formed to reach the pad electrode from a bottom surface of the first opening and having a diameter smaller than that of the first opening, an insulating layer formed to cover sidewall surfaces of the first opening and the second opening, and a conductive layer formed, inside of the insulating layer, to cover at least an inner wall surface of the insulating layer and a bottom surface of the second opening.

Abstract: According to examples, an apparatus may include a chamber having a hole and a microphone unit. The microphone unit may include a first substrate having a first opening aligned with the hole of the chamber, a second substrate positioned with respect to the first substrate to form a gap between the second substrate and the first substrate, the second substrate having a second opening, and a diaphragm housed within the gap formed between the first substrate and the second substrate, in which the first opening is positioned on a first side of the diaphragm and the second opening is positioned on a second side of the diaphragm.

Abstract: An optical module includes a light-forming part configured to form light; and a protective member that includes an output window configured to transmit light from the light-forming part and that is disposed so as to surround the light-forming part. The light-forming part includes a base member; a plurality of semiconductor light-emitting devices mounted on the base member and configured to emit light differing from each other in wavelength; and a filter mounted on the base member and configured to directly receive and coaxially multiplex diverging light from the plurality of semiconductor light-emitting devices.

Abstract: An image sensor module includes an interposer substrate having a first surface and a second surface opposite to the first surface, the interposer substrate being light-transmissive and having a plurality of through-holes; an image sensor located to face the first surface of the interposer substrate, the image sensor having a light receiving surface on a side of the interposer substrate, a plurality of photoelectric conversion elements being located at the light receiving surface, the image sensor being connected with an external circuit via electrodes provided in the plurality of through-holes; and a lens unit located to face the second surface of the interposer substrate.

Abstract: An integrated device, the device including: a first level including a first mono-crystal layer, the first mono-crystal layer including a plurality of single crystal transistors; an overlaying oxide on top of the first level; a second level including a second mono-crystal layer, the second level overlaying the oxide, where the second mono-crystal layer includes a plurality of first image sensors and alignment marks; and a third level overlaying the second level, where the third level includes a plurality of second image sensors, where the third level is aligned to the alignment marks, where the second level is bonded to the first level, and where the bonded includes an oxide to oxide bond.

Abstract: An optical module includes an eyelet having a first surface, a second surface opposite to the first surface, and a penetration hole penetrating from the second surface to the first surface; a lead pin in the penetration hole, for transmitting electric signals; a pedestal protruding from the first surface in an extension direction of the lead pin; and a relay board on the pedestal, the relay board having a transmission line for electrically connecting an optical element and the lead pin. The lead pin is in no contact with an inner surface of the penetration hole. The lead pin has a flat surface which is at least a part of a surface bonded to the transmission line.

Abstract: An imager includes: an imaging element chip; a fixing member to which the imaging element chip is adhered, and which is electrically connected to the imaging element chip; a circuit board that is fixed to the fixing member via a plurality of conductive members; and a stress relaxing member that is fixed to a second surface of the circuit board opposite to a first surface of the circuit board, the first surface being a surface of the circuit board to a side of which the fixing member is fixed, a linear expansion coefficient of the fixing member, a linear expansion coefficient of the circuit board, and a linear expansion coefficient of the stress relaxing member are as defined herein, and the stress relaxing member overlaps an entire adhesion portion between the imaging element chip and the fixing member as defined herein.

Abstract: Provided are a fingerprint identification apparatus and an electronic device. The fingerprint identification apparatus is applicable to an electronic device having a display screen, and includes: a fingerprint sensor chip; and a substrate, where an upper surface of the substrate extends downward to form a first groove, and at least a portion of the fingerprint sensor chip is disposed in the first groove and electrically connected to the substrate. By disposing at least a portion of the fingerprint identification sensor in the first groove, not only could costs and complexity of the electronic device be reduced, but also a thickness of the fingerprint identification apparatus could be effectively reduced.

Abstract: Systems and methods are disclosed for pad ring generation for integrated circuits. For example, a method may include accessing a pad ring configuration data structure, wherein the pad ring configuration data structure declares rules for inputs and outputs of an integrated circuit using a scripting language; based on the pad ring configuration data structure, automatically generating an integrated circuit design data structure that encodes a physical design for the integrated circuit that includes a pad ring with bumps satisfying the rules for inputs and outputs of the integrated circuit and also includes a placeholder for additional logic circuits, wherein the placeholder includes connections to one or more input drivers of the pad ring and to one or more output drivers of the pad ring; and transmitting, storing, or displaying the integrated circuit design data structure.

Abstract: An integrated device, the device including: a first level including a first mono-crystal layer, the first mono-crystal layer including a plurality of single crystal transistors and alignment marks; an overlaying oxide on top of the first level; a second level including a second mono-crystal layer, the second level overlaying the oxide, where the second mono-crystal layer includes a plurality of first image sensors; and a third level overlaying the second level, where the third level includes a plurality of second image sensors, where the second level is aligned to the alignment marks, where the second level is bonded to the first level, and where the bonded includes an oxide to oxide bond.

Abstract: An electronic device includes a first substrate having a wiring trace, a second substrate having an external terminal, a first electronic component disposed on a first surface of the first substrate, a second electronic component electrically connected to the first electronic component and disposed on a second surface of the first substrate, a mold layer encapsulating the first electronic component, and a conductive member disposed in the mold layer. The conductive member electrically connects the first substrate to the second substrate. A step is formed at an end of the mold layer, and the conductive member is exposed at the step. A distance between the first substrate and the second substrate is smaller than a distance between the first surface of the first substrate and a surface of the first electronic component that is positioned opposite to the first substrate.

Abstract: The present invention provides an optical scanning control device and a retina scanning projection device provided with a structure for suppressing heat transfer to a laser module, and a heat dissipation structure for dissipating the heat of the laser module. The optical scanning control device (10) is configured to emit, as image light, a laser light in accordance with an image signal. The optical scanning control device includes: a housing (11) made of metal; a laser module (125) configured to emit laser light, which abuts the top of the base (11a) of the housing, and is arranged on one side inside the housing; a power supply unit (16) arranged inside the housing on a side opposite that of the laser module; and an electronic circuit board (12) having heat source members (IC chips 14) configured to cause the laser module to emit image light, the electronic circuit board being arranged on a side opposite the base-side of the laser module.

Abstract: A semiconductor device includes a semiconductor element on an insulated circuit board, a housing having a side wall surrounding the circuit board, a lead terminal including a lead part and a terminal part extending orthogonal to the lead part, the terminal part having a base portion adjacent to the lead part and being embedded in the side wall, the remaining portion of the terminal part being exposed from the side wall and being connected to the semiconductor element via a wiring member, and a sealing resin provided in the housing. The side wall has an anchor part formed in an inner surface at a position within an area where the lead part is embedded and above the terminal part, the anchor part including concave portions that are each defined by a pair of opposed surfaces parallel to each other and orthogonal to the upper surface of the insulation plate.

Abstract: Disclosed herein are integrated circuit (IC) packages with an electronic component having a patterned protective material on a face, as well as related devices and methods. In some embodiments, a computing device may include: an integrated circuit (IC) package with an electronic component having a protective material on the back face of the electronic component, where the protective material is patterned to include an area on the back face of the electronic component that is not covered by the protective material; a circuit board, where the IC package is electrically coupled to the circuit board; and a heat spreader, where the heat spreader is secured to the circuit board and in thermal contact with the area on the back face of the electronic component that is not covered by the protective material.

Abstract: A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.

Abstract: Implementations of a molded image sensor chip scale package may include an image sensor having a first side and a second side. A first cavity wall and a second cavity wall may be coupled to the first side of the image sensor and extend therefrom. The first cavity wall and the second cavity wall may form a cavity over the image sensor. A transparent layer may be coupled to the first cavity wall and the second cavity wall. A redistribution layer (RDL) may be coupled to the second side of the image sensor. At least one interconnect may be directly coupled to the RDL. A mold material may encapsulate a portion of the RDL, a portion of the image sensor, and a side of each cavity wall, and a portion of the transparent layer.

Abstract: A display panel. The display panel may include a substrate having a display region and a non-display region; a cover plate; a sealant between the substrate and the cover plate; and a filler layer covered by the sealant to cause the sealant to have tight contact with the substrate and with the cover plate. The sealant may be in the non-display region for bonding the substrate and the cover plate.

Abstract: Techniques are described to limit heat transfer from a first electronic component to a second electronic such as by having an aperture in a lid over the second electronic component to form a gap in the conductance of heat from the first electronic component to the second electronic component. A semiconductor electronic package includes a substrate, a first electronic component that is of a first type and that is mounted along a surface of the substrate, a second electronic component that is of a second type different than the first type and that is mounted along the surface of the substrate, and a metallic component that is positioned over the first electronic component and that has an aperture through which the second electronic component is exposed.

Abstract: A semiconductor device includes a substrate includes a first layer and a second layer over the first layer, a bump disposed over the second layer, a molding disposed over the second layer and surrounding the bump, and a retainer disposed over the second layer, wherein the retainer is disposed between the molding and a periphery of the substrate. Further, a method of manufacturing a semiconductor device includes providing a substrate, disposing several bumps on the substrate, disposing a retainer on the substrate and surrounding the bumps, and disposing a molding between the bumps and the retainer.

Abstract: A MEMS package has a MEMS chip, and a package substrate which the MEMS chip is adhered. The MEMS chip has an element substrate which a movable element is formed. The MEMS package has a particle filter formed on the package substrate or the MEMS chip. The particle filter has a pierced-structure, which plural through holes are formed on a base surface by a regular arrangement. Further, in the particle filter, a plane-opening rate is set at least 45%, and a thickness-opening rate is set at least 50%.

Abstract: A semiconductor package comprising: a frame having an opening and including wiring layers and one or more layer of connection vias; a semiconductor chip disposed in the opening and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant covering the frame and the semiconductor chip and filling the opening; a connection structure disposed on the frame and the active surface of the semiconductor chip, and including one or more redistribution layers electrically connected to the connection pads and the wiring layers; one or more passive components disposed on the connection structure; a molding material covering each of the passive components; and a metal layer covering outer surfaces of each of the frame, the connection structure, and the molding material. The metal layer is connected to a ground pattern included in the wiring layers of the frame.

Abstract: A device for fingerprint recognition, a manufacturing method therefor, and an electronic apparatus are provided. The method includes: forming fingerprint recognition units in multiple independent preset regions of a substrate, where the fingerprint recognition units each include a fingerprint recognition component and a light emitting component; partitioning the substrate along boundaries of the preset regions to separate the fingerprint recognition units from each other; and coupling the fingerprint recognition units after partition with corresponding control circuits, to make the fingerprint recognition component and the light emitting component of each fingerprint recognition unit be electrically connected to a corresponding control circuit coupled with the each fingerprint recognition unit. The fingerprint recognition unit and the control circuit coupled with each other serve together as the device for fingerprint recognition. The method is for manufacturing the device for fingerprint recognition.

Abstract: Implementations of semiconductor packages may include: a die coupled to a glass lid; one or more inner walls having a first material coupled to the die; an outer wall having a second material coupled to the die; and a glass lid coupled to the die at the one or more inner walls and at the outer wall; wherein the outer wall may be located at the edge of the die and the glass lid and the one or more inner walls may be located within the perimeter of the outer wall at a predetermined distance from the perimeter of the outer wall; and wherein a modulus of the first material may be lower than a modulus of the second material.

Abstract: An LED package structure includes a ceramic substrate, a ceramic board, a light-emitting unit, a first adhesive layer, a second adhesive layer, and a cover. The ceramic board having a thru-hole is disposed on the ceramic substrate. The light-emitting unit is disposed on the ceramic substrate and is arranged in the thru-hole of the ceramic board. The first and second adhesive layers are disposed on the ceramic board, and the second adhesive layer covers the first adhesive layer. The cover is fixed on the ceramic board by the first and second adhesive layers. Thus, the shearing force of the LED package structure of the instant disclosure is increased by having the first and second adhesive layers, which are connected to each other.

Abstract: An encapsulating structure to protect an image sensor chip at all times during manufacture and use includes a printed circuit board, an image sensor chip, a protecting sheet, and a package portion. The image sensor chip is mounted on the printed circuit board and the protecting sheet is mounted on the image sensor chip. The package portion is entirely opaque and is formed on the printed circuit board, the package portion encloses side wall of the image sensor chip, the protecting sheet, and portion of surface of the protecting sheet away from the image sensor chip. A method for manufacturing same is also disclosed.

Abstract: A light emitting apparatus according to an embodiment of the present technology includes a base portion, a light emitting element, and a cover portion. The base portion includes a support surface. The light emitting element is disposed on the support surface of the base portion. The cover portion includes a light transmission portion through which light emitted from the light emitting element is transmitted and a protrusion portion which is provided on at least a part of a periphery of the light transmission portion and protruded relative to the light transmission portion, the cover portion being provided on the support surface in such a manner as to cover the light emitting element.

Abstract: A light emitting device includes a semiconductor layer, and a light emitting layer disposed in the semiconductor layer and having a composition ratio of Ga(1-x)InxN. x is greater than 0.14 but less than 0.16 to emit a green light from the light emitting layer, or greater than 0.22 but less than 0.26 to emit a blue light from the light emitting layer.

Abstract: A laser module has a base portion having a metal holding portion; a laser light source fixed to the base portion; an optical outputting portion deriving the laser light from a collimating optical system out of the base portion. The collimating optical system includes an input lens receiving the laser light from the laser light source; and an output lens receiving the laser light from the input lens and outputting the laser light to the optical outputting portion, each located in order from the laser light source. The input lens is a convex lens fixed in a first cylinder body made of metal and welded to the holding portion. The output lens is a convex lens having a focal point length longer than that of the input lens and held by the holding member glued to the base portion.

Abstract: An optical device package comprising a receptacle, an optical device received therein, and a window member disposed forward of the receptacle in a light emitting direction of the optical device. The window member is a member of synthetic quartz glass having front and back surfaces, at least one of the front and back surfaces being a rough surface.

Abstract: An example method of manufacturing an optical interface. An optical socket may be provided that has an alignment feature that is to engage an optical connector, and first solder attachment pads. A printed circuit board may be provided that has an active optical device and second solder attachment pads. The optical socket may be connected to the printed circuit board by reflowing solder between the first and second solder attachment pads. The first and second solder attachment pads, the alignment feature, and the active optical device are positioned such that, while reflowing the solder, the solder automatically forces the optical socket into an aligned position.

Abstract: An imaging module includes an electrical cable; a solid-state imaging element having an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together. The flexible wiring substrate includes an element mounting portion mounting the solid-state imaging element, and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction away from the element mounting portion. An internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with adhesive resin in which a glass-transition temperature is 135° C. or less.

Abstract: Techniques are described to limit heat transfer from a first electronic component to a second electronic such as by having an aperture in a lid over the second electronic component to form a gap in the conductance of heat from the first electronic component to the second electronic component. A semiconductor electronic package includes a substrate, a first electronic component that is of a first type and that is mounted along a surface of the substrate, a second electronic component that is of a second type different than the first type and that is mounted along the surface of the substrate, and a metallic component that is positioned over the first electronic component and that has an aperture through which the second electronic component is exposed.