With Window Means Patents (Class 257/680)
  • Patent number: 10836630
    Abstract: A MEMS package has a MEMS chip, and a package substrate which the MEMS chip is adhered. The MEMS chip has an element substrate which a movable element is formed. The MEMS package has a particle filter formed on the package substrate or the MEMS chip. The particle filter has a pierced-structure, which plural through holes are formed on a base surface by a regular arrangement. Further, in the particle filter, a plane-opening rate is set at least 45%, and a thickness-opening rate is set at least 50%.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: November 17, 2020
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Masashi Shiraishi, Toyotaka Kobayashi, Hironobu Hayashi, Ichiro Yagi, Bing Ma
  • Patent number: 10804215
    Abstract: A semiconductor package comprising: a frame having an opening and including wiring layers and one or more layer of connection vias; a semiconductor chip disposed in the opening and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant covering the frame and the semiconductor chip and filling the opening; a connection structure disposed on the frame and the active surface of the semiconductor chip, and including one or more redistribution layers electrically connected to the connection pads and the wiring layers; one or more passive components disposed on the connection structure; a molding material covering each of the passive components; and a metal layer covering outer surfaces of each of the frame, the connection structure, and the molding material. The metal layer is connected to a ground pattern included in the wiring layers of the frame.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: October 13, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Hyun Lim, Sang Jong Lee, Chul Kyu Kim, Yoon Seok Seo
  • Patent number: 10789446
    Abstract: A device for fingerprint recognition, a manufacturing method therefor, and an electronic apparatus are provided. The method includes: forming fingerprint recognition units in multiple independent preset regions of a substrate, where the fingerprint recognition units each include a fingerprint recognition component and a light emitting component; partitioning the substrate along boundaries of the preset regions to separate the fingerprint recognition units from each other; and coupling the fingerprint recognition units after partition with corresponding control circuits, to make the fingerprint recognition component and the light emitting component of each fingerprint recognition unit be electrically connected to a corresponding control circuit coupled with the each fingerprint recognition unit. The fingerprint recognition unit and the control circuit coupled with each other serve together as the device for fingerprint recognition. The method is for manufacturing the device for fingerprint recognition.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: September 29, 2020
    Assignees: BEIJING BOE TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ting Tian, Ming Zhai, Shuqian Dou, Xiaoliang Fu, Dayong Zhou, Zhiqiang Fan, Liguang Deng, Youcai Yang, Zhongjun Wang, Dong Zhang, Yongjie Han, Jinge Zhao, Jia Meng, Yanjun Liu, Yu Liu
  • Patent number: 10770492
    Abstract: Implementations of semiconductor packages may include: a die coupled to a glass lid; one or more inner walls having a first material coupled to the die; an outer wall having a second material coupled to the die; and a glass lid coupled to the die at the one or more inner walls and at the outer wall; wherein the outer wall may be located at the edge of the die and the glass lid and the one or more inner walls may be located within the perimeter of the outer wall at a predetermined distance from the perimeter of the outer wall; and wherein a modulus of the first material may be lower than a modulus of the second material.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: September 8, 2020
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Bingzhi Su, Derek Gochnour, Larry Kinsman
  • Patent number: 10756244
    Abstract: An LED package structure includes a ceramic substrate, a ceramic board, a light-emitting unit, a first adhesive layer, a second adhesive layer, and a cover. The ceramic board having a thru-hole is disposed on the ceramic substrate. The light-emitting unit is disposed on the ceramic substrate and is arranged in the thru-hole of the ceramic board. The first and second adhesive layers are disposed on the ceramic board, and the second adhesive layer covers the first adhesive layer. The cover is fixed on the ceramic board by the first and second adhesive layers. Thus, the shearing force of the LED package structure of the instant disclosure is increased by having the first and second adhesive layers, which are connected to each other.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: August 25, 2020
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Kuo-Ming Chiu, Meng-Sung Chou, Hung-Jui Chen, Han-Hsing Peng
  • Patent number: 10749046
    Abstract: An encapsulating structure to protect an image sensor chip at all times during manufacture and use includes a printed circuit board, an image sensor chip, a protecting sheet, and a package portion. The image sensor chip is mounted on the printed circuit board and the protecting sheet is mounted on the image sensor chip. The package portion is entirely opaque and is formed on the printed circuit board, the package portion encloses side wall of the image sensor chip, the protecting sheet, and portion of surface of the protecting sheet away from the image sensor chip. A method for manufacturing same is also disclosed.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: August 18, 2020
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    Inventors: Chia-Wei Chen, Shin-Wen Chen
  • Patent number: 10727144
    Abstract: A light emitting apparatus according to an embodiment of the present technology includes a base portion, a light emitting element, and a cover portion. The base portion includes a support surface. The light emitting element is disposed on the support surface of the base portion. The cover portion includes a light transmission portion through which light emitted from the light emitting element is transmitted and a protrusion portion which is provided on at least a part of a periphery of the light transmission portion and protruded relative to the light transmission portion, the cover portion being provided on the support surface in such a manner as to cover the light emitting element.
    Type: Grant
    Filed: November 25, 2016
    Date of Patent: July 28, 2020
    Assignee: SNY CORPORATION
    Inventors: Masahiro Murayama, Yuji Furushima
  • Patent number: 10693040
    Abstract: A light emitting device includes a semiconductor layer, and a light emitting layer disposed in the semiconductor layer and having a composition ratio of Ga(1-x)InxN. x is greater than 0.14 but less than 0.16 to emit a green light from the light emitting layer, or greater than 0.22 but less than 0.26 to emit a blue light from the light emitting layer.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: June 23, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae Bae Kim, Sang Kyun Im, Hyun Kyung Kim, Young Hun Choi
  • Patent number: 10686292
    Abstract: A laser module has a base portion having a metal holding portion; a laser light source fixed to the base portion; an optical outputting portion deriving the laser light from a collimating optical system out of the base portion. The collimating optical system includes an input lens receiving the laser light from the laser light source; and an output lens receiving the laser light from the input lens and outputting the laser light to the optical outputting portion, each located in order from the laser light source. The input lens is a convex lens fixed in a first cylinder body made of metal and welded to the holding portion. The output lens is a convex lens having a focal point length longer than that of the input lens and held by the holding member glued to the base portion.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: June 16, 2020
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Daisuke Nagatomo, Yoshio Okamoto, Takashi Nakai, Kenji Nagashima
  • Patent number: 10680139
    Abstract: An optical device package comprising a receptacle, an optical device received therein, and a window member disposed forward of the receptacle in a light emitting direction of the optical device. The window member is a member of synthetic quartz glass having front and back surfaces, at least one of the front and back surfaces being a rough surface.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: June 9, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shuhei Ueda, Masaki Takeuchi, Harunobu Matsui
  • Patent number: 10678006
    Abstract: An example method of manufacturing an optical interface. An optical socket may be provided that has an alignment feature that is to engage an optical connector, and first solder attachment pads. A printed circuit board may be provided that has an active optical device and second solder attachment pads. The optical socket may be connected to the printed circuit board by reflowing solder between the first and second solder attachment pads. The first and second solder attachment pads, the alignment feature, and the active optical device are positioned such that, while reflowing the solder, the solder automatically forces the optical socket into an aligned position.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: June 9, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Paul Kessler Rosenberg, Michael Renne Ty Tan, Kevin Leigh
  • Patent number: 10660507
    Abstract: An imaging module includes an electrical cable; a solid-state imaging element having an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together. The flexible wiring substrate includes an element mounting portion mounting the solid-state imaging element, and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction away from the element mounting portion. An internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with adhesive resin in which a glass-transition temperature is 135° C. or less.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: May 26, 2020
    Assignee: FUJIKURA LTD.
    Inventors: Takahiro Shimono, Hideo Shiratani, Kenichi Ishibashi
  • Patent number: 10643920
    Abstract: Techniques are described to limit heat transfer from a first electronic component to a second electronic such as by having an aperture in a lid over the second electronic component to form a gap in the conductance of heat from the first electronic component to the second electronic component. A semiconductor electronic package includes a substrate, a first electronic component that is of a first type and that is mounted along a surface of the substrate, a second electronic component that is of a second type different than the first type and that is mounted along the surface of the substrate, and a metallic component that is positioned over the first electronic component and that has an aperture through which the second electronic component is exposed.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: May 5, 2020
    Assignee: Juniper Networks, Inc.
    Inventors: Alexander I. Yatskov, Gautam Ganguly
  • Patent number: 10608406
    Abstract: A light emitting device includes: a base including: a main body, and a frame disposed on an upper surface of the main body; one or more laser elements disposed on the upper surface of the main body inward of the frame; a cover comprising: a support member that is fixed on an upper surface of the frame and has an opening inside the frame, and a light transmissive portion disposed so as to close the opening; and a lens body disposed above the light transmissive portion. The support member includes; a first portion fixed on the upper surface of the frame, a second portion on which the lens body is disposed, the second portion being positioned inward of and lower than the first portion, and a third portion on which the light transmissive portion is disposed, the third portion being disposed inward of and lower than the second portion.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: March 31, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Hashimoto, Eiichiro Okahisa
  • Patent number: 10608125
    Abstract: Packaging techniques are described for fabricating an sensor package that include one or more sensor devices, such as optical sensors or light sources, where an active side of the sensor device is exposed. Additionally, the side of the sensor package including the sensor die is substantially flat (e.g., topology is less than about 75 ?m), the sensor package does not include wire bonding, and the package interconnect (e.g., solder bump array or other connection) is disposed on a side of the sensor package opposite the sensor die.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: March 31, 2020
    Assignee: MAXIM INTEGRATED PRODUCTS, INC.
    Inventor: Tiao Zhou
  • Patent number: 10580912
    Abstract: An arrangement including a carrier substrate, and a component situated on a cover surface of the carrier substrate in a hollow space, and electrical contacts for the component, wherein the hollow space is comprised of a plurality of spacer elements arranged on the cover surface of the carrier substrate and a cover substrate mounted on the plurality of spacer elements is provided. A semi-finished product comprising a carrier substrate made of silicon, wherein one or more recesses are formed on one side of the carrier substrate, and wherein the semi-finished product further comprises an alkaline evaporated glass applied to the side of the carrier substrate having the one or more recesses is also provided.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: March 3, 2020
    Assignee: MSG LITHOGLAS AG
    Inventors: Simon Maus, Ulli Hansen
  • Patent number: 10575374
    Abstract: An emitter for an LED-based lighting device can incorporate “flip-chip” LEDs, in which all electrical contacts are disposed on the bottom surface of the chip. The emitter base can be a multilayer high-temperature cofired ceramic (HTCC) substrate, with metal traces formed between the layers and vias through the layers to join traces in different layers, thereby providing electrical connectivity to each LED. The paths can be arranged such that current can be supplied independently to different subsets of the LEDs. The top layer of the emitter base is fabricated with exposed vias at the top surface. Metal pads are then printed onto the exposed vias on the top surface, and flip-chip LEDs are bonded to the metal pads, e.g., using solder.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: February 25, 2020
    Assignee: LedEngin, Inc.
    Inventor: Xiantao Yan
  • Patent number: 10565427
    Abstract: A fingerprint sensor package includes a substrate, a fingerprint sensor chip, and a flexible printed circuit board (FPC). The substrate includes a first portion and a second portion. A line layer is disposed on the first portion. The fingerprint sensor chip is disposed on the substrate. The fingerprint sensor chip is electrically connected to the FPC by the line layer. The package is simple, reliable, and easy for manufacturing process, reducing materials and processing costs.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: February 18, 2020
    Assignee: SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
    Inventor: Jun Yang
  • Patent number: 10558779
    Abstract: A method of redistribution layer routing for 2.5D integrated circuit packages is proposed, which is executed by a computer, the method comprising using the computer to perform the following: performing a MMSIM (modulus-based matrix splitting iteration method) based routing to assign pre-assignment nets to tracks such that total vertical distance from each bump pair to the assigned track is minimized; and performing a MWMCBM (minimum weighted maximum cardinality bipartite matching) based routing for bumps connected to the assigned tracks according to matching result to complete redistribution layer routing for integrated circuit packages.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: February 11, 2020
    Assignee: AnaGlobe Technology, Inc.
    Inventors: Chun-Han Chiang, Fu-Yu Chuang, Yao-Wen Chang, Chih-Che Lin, Chun-Yi Yang
  • Patent number: 10539280
    Abstract: It is an object of the present invention to provide a small and simply-structured light-source device. A light-source device according to the present invention includes a laser light source section, a stem on which the laser light source section is mounted, a cap with an opening, the cap being bonded to the stem in such a manner that the cap covers the laser light source section, a lens holder joined to an outer surface of the cap in such a manner that the lens holder extends over the opening, and a collimating lens supported by the lens holder, the collimating lens collimating a light ray emitted from the laser light source section and then passing through the opening.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: January 21, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Seiji Nakano
  • Patent number: 10535617
    Abstract: A method and circuit for implementing transient electronic circuits for security applications, and a design structure on which the subject circuit resides are provided. Silver nanowire traces are fabricated forming a protection circuit in a soluble material. A frangible material is provided separating the soluble material from a solvent layer proximately located. During a tampering event the frangible material is ruptured releasing the solvent which contacts and dissolves the soluble material and disperses the silver nanowire traces creating an electrical open in the protection circuit. The electrical open enables enhanced tampering detection.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: January 14, 2020
    Assignee: International Business Machines Corporation
    Inventors: Eric J. Campbell, Sarah Czaplewski-Campbell, Timothy Tofil, Joseph Kuczynski
  • Patent number: 10519032
    Abstract: A method embodiment includes providing a MEMS wafer. A portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the MEMS wafer. The carrier wafer is etched to expose the first membrane and a first surface of the second membrane to an ambient environment. A MEMS structure is formed in the MEMS wafer. A cap wafer is bonded to a side of the MEMS wafer opposing the carrier wafer to form a first sealed cavity including the MEMS structure and a second sealed cavity including a second surface of the second membrane for the pressure sensor device. The cap wafer comprises an interconnect structure. A through-via electrically connected to the interconnect structure is formed in the cap wafer.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: December 31, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu
  • Patent number: 10485404
    Abstract: An image sensor module includes a circuit board, image sensor, electronic component assembly, and cable assembly. The circuit board includes a center section located between two end sections. The end sections each extend away from the center section and define an interior area there between. The image sensor is secured to an outer face of the circuit board in the center section with sensor contact fingers being connected at the circuit board outer face in one or both end sections. The electronic component arrangement is mounted on an inner face of the circuit board in the center section. A number of wires of the cable assembly extend through an end gap between the circuit board end sections and are connected to the inner face of the circuit board so as to overlap with the sensor contact fingers along a module longitudinal axis.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: November 26, 2019
    Assignee: KARL STORZ Endovision, Inc.
    Inventors: Dashiell Birnkrant, Gerard Vadenais, Jordan He, Jason Curtis
  • Patent number: 10490487
    Abstract: An electronic device structure includes a leadframe with a die pad and a lead. A semiconductor die is mounted adjacent to the die pad. A clip having a clip tail section is attached to the lead. The clip further has a clip top section attached to the clip tail section, and the clip top section is attached to a die top side of the semiconductor die with a conductive material. The clip further has an opening disposed to extend through the clip top section. In one embodiment, after a reflow step the conductive material forms a conductive fillet at least partially covering sidewall surfaces of the opening, and has a height within the opening with respect to a bottom surface of the clip top section. The opening and the conductive fillet provide an improved approach to monitoring coverage of the conductive material between the clip top section and the die top side of the semiconductor die.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: November 26, 2019
    Assignee: Amkor Technology, Inc.
    Inventor: Marc Alan Mangrum
  • Patent number: 10477084
    Abstract: A manufacturing method for a camera module including a multilayer body in which an image sensor IC and a lens are arranged with an optical path provided in the multilayer body being disposed therebetween includes a first step and a second step. In the first step, the multilayer body is formed by stacking and combining flexible sheets. In the second step, a through hole is formed in flexible base material layers that constitute a portion of the multilayer body to form the optical path defined by the through hole.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: November 12, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Nobuo Ikemoto, Atsushi Kumano, Jerry Hsieh, Jun Sasaki
  • Patent number: 10468565
    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The LED package are also directed to features or arrangements that allow for improved or tailored emission characteristic for LED packages according to the present invention. Some of these features or arrangements include, but are not limited to, higher ratio of light source size to submount size, the used of particular materials (e.g. different silicones) for the LED package layers, improved arrangement of a reflective layer, improved composition and arrangement of the phosphor layer, tailoring the shape of the encapsulant, and/or improving the bonds between the layers. There are only some of the improvements disclosed herein, with some of these resulting in LED packages the emit light with a higher luminous intensity over conventional LED packages.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: November 5, 2019
    Assignee: CREE, INC.
    Inventors: Arthur Pun, Jeremy Nevins, Jesse Reiherzer, Joseph Clark
  • Patent number: 10467450
    Abstract: A fan-out sensor package includes: a core member including a wiring layer including a plurality of layers and having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole; an encapsulant encapsulating at least portions of the core member and the IC for a sensor; and a connection member disposed on the core member and the IC for a sensor and including a plurality of circuit layers, wherein the circuit layer includes sensing patterns detecting a change in capacitance.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: November 5, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Ho Kim, Eun Sil Kim, Sang Kyu Lee, Jong Man Kim, Seok Hwan Kim
  • Patent number: 10461239
    Abstract: A microscale sensor structure is provided that enables backside electrical connection to flush-mounted microscale sensors without through-wafer-vias (TWVs). A flush-mounted microscale sensor can be fabricated without TWVs by providing a sensor support substrate with openings for electrical connection access to the backside of a device layer. Backside electrical connection is made to the sensing element(s) of the device layer through the openings in the support substrate. Electrical isolation of the sensing element(s) from the support substrate is accomplished through use of an insulating support substrate and/or an insulating layer between the support substrate and the device layer.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: October 29, 2019
    Assignee: INTERDISCIPLINARY CONSULTING CORP.
    Inventor: David Alan Mills
  • Patent number: 10451490
    Abstract: Provided is a sensor package that measures an internal temperature of a measurement object. A sensor package includes: a package including a bottomed tubular casing and plural leads substantially parallel to each other, each of the leads piercing the bottomed tubular casing; and a MEMS chip including at least one thermopile that measures a temperature difference in an identical direction. The MEMS chip is disposed in an inner bottom surface of the bottomed tubular casing of the package in a posture in which a measurement direction of the temperature difference measured with the thermopile is substantially orthogonal to a longitudinal direction of each lead.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: October 22, 2019
    Assignee: OMRON Corporation
    Inventors: Shinya Nakagawa, Masao Shimizu
  • Patent number: 10451863
    Abstract: Apparatuses and methods for an interposer for integration of multiple image sensors are disclosed herein. An example apparatus includes an interposer including laterally spaced first and second windows, and first and second image sensors disposed on the interposer over the first and second windows, respectively. The interposer including conductive conduits formed in or on to provide electrically conductive paths there through with the first and second image sensors coupled to the conductive conduits. The first and second image sensors laterally spaced by a gap, and an active area of the first and second image sensors to receive incident light through the respective first and second windows, where a perspective of the first image is different than a perspective of the second image sensor based at least in part on the gap.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: October 22, 2019
    Assignee: Verily Life Sciences LLC
    Inventors: Sam Kavusi, Brian M. Pepin
  • Patent number: 10424702
    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same or different wavelengths of light than the others. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant can be on the submount, over at least some of the LEDs, with each of the planar surfaces being vertical and aligned with one of the edges of the submount. The packages can also comprise reflective layers to minimize losses due to light absorption, which in turn can increase the overall package emission efficiency.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: September 24, 2019
    Assignee: CREE, INC.
    Inventors: Jesse Reiherzer, Jeremy Nevins, Michael John Bergmann, Joseph Gates Clark
  • Patent number: 10389925
    Abstract: Provided are a camera module and a mobile terminal having the same. The camera module includes a first lens assembly, a second lens assembly disposed to be adjacent to the first lens assembly, a lens cover accommodating the first and second lens assemblies and having first and second through holes allowing light to be incident to the first and second lens assemblies, an actuator provided on one side of the first and second lens assemblies to drive the first and second lens assemblies, one image sensor disposed below the first and second lens assemblies and converting light signals incident through the first and second lens assemblies into first and second image signals, and a camera case having a through hole formed on a front side thereof and accommodating the lens cover to allow light to be incident to the first and second lens assemblies through the through hole.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: August 20, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Jongpil Kim, Byunghwa Lee
  • Patent number: 10381334
    Abstract: A semiconductor package includes a package substrate having an upper surface and a lower surface and including a plurality of substrate pads formed on the upper surface, a capacitor structure arranged on the upper surface of the package substrate and including a semiconductor substrate and at least one decoupling capacitor formed in the upper surface of the semiconductor substrate, a plurality of first semiconductor chips mounted on the package and supported by the capacitor structure, first conductive connection members electrically connecting chip pads of the first semiconductor chips to the substrate pads, and second conductive connection members electrically connecting capacitor pads of the decoupling capacitor to the substrate pad.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: August 13, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hee-Won Kang, Jong-Joo Lee
  • Patent number: 10347550
    Abstract: The present disclosure provides a semiconductor device and a method of making the same for suppressing warpages of an article due to a difference of temperature strains during the process of making the semiconductor device. The semiconductor device of the present disclosure includes a substrate having a main surface and a recess recessed therefrom; a semiconductor element disposed in the recess; a wiring portion connected to the substrate and electrically connected to the semiconductor element; and a sealing resin filled in the recess. The substrate includes an electrical insulative synthetic resin. The recess has a bottom surface and a connecting surface connected to the bottom surface and the main surface. The connecting surface includes a first inclined surface connected to the bottom surface; a second inclined surface connected to the main surface; and an intermediate surface connected to the first inclined surface and the second inclined surface.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: July 9, 2019
    Assignee: ROHM CO., LTD.
    Inventor: Isamu Nishimura
  • Patent number: 10308502
    Abstract: A semiconductor pressure sensor assembly for measuring a pressure of an exhaust gas which contains corrosive components, comprising: a first cavity, a pressure sensor comprising first bondpads for electrical interconnection, a CMOS chip comprising second bondpads for electrical interconnection with the pressure sensor, an interconnection module having electrically conductive paths connected via bonding wires to the pressure sensor and to the CMOS chip; the interconnection module being a substrate with corrosion-resistant metal tracks, wherein the CMOS chip and part of the interconnection module are encapsulated by a plastic package.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: June 4, 2019
    Assignee: MELEXIS TECHNOLOGIES NV
    Inventors: Laurent Otte, Jian Chen, Appolonius Jacobus Van Der Wiel
  • Patent number: 10297468
    Abstract: A semiconductor device is provided with a substrate made of a semiconductor material, an interconnect layer, at least one electronic element, and a sealing resin. The substrate has a main surface and a pair of lateral surfaces that are orthogonal to the main surface and face in opposite directions to each other. A recessed portion that is recessed from the main surface and has an opening portion that opens on at least one of the pair of lateral surfaces is formed in the substrate. The interconnect layer is formed on the substrate. The electronic element is an orientation sensor, for example, and is accommodated in the recessed portion of the substrate. The sealing resin covers the electronic element.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: May 21, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Yuichi Nakao, Yasuhiro Fuwa
  • Patent number: 10290672
    Abstract: An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of the CIS die. The second surface of the CIS die is coupled with the first surface of the PCB. A transparent cover is coupled over the photosensitive region of the CIS die. An image signal processor (ISP) is embedded within the PCB. One or more electrical couplers electrically couple the CIS die with the PCB. A plurality of electrical contacts on the second surface of the PCB are electrically coupled with the CIS die and with the ISP. The ISP is located between the plurality of electrical contacts of the second surface of the PCB and the CIS die.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: May 14, 2019
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Larry Kinsman, Yusheng Lin, Yu-Te Hsieh, Oswald Skeete, Weng-Jin Wu, Chi-Yao Kuo
  • Patent number: 10219383
    Abstract: A printed wiring board includes a laminate including resin insulating layers and conductor layers such that the resin insulating layers and the conductor layers are laminated alternately and that the laminate has a through hole opening to a first surface of the laminate and a component accommodating cavity that accommodates an electronic component and having an opening part formed on a second surface of the laminate on the opposite side with respect to the first surface. The through hole is formed through the laminate such that the through hole is extending to the component accommodating cavity, and the laminate has a resin coating formed on an inner wall surface of the through hole.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: February 26, 2019
    Assignee: IBIDEN CO. , LTD.
    Inventors: Katsutoshi Kitagawa, Takema Adachi
  • Patent number: 10199344
    Abstract: A MEMS sensor device package comprises a sensor assembly comprising a sensor device and a sensor circuit communicating coupled to the sensor device, The MEMS sensor device package further comprises an assembly package housing having a top member and a bottom member attached to the top member for encapsulating the sensor assembly. A passageway fluidly coupled the sensor device to attributes outside the package housing the passageway is embedded into the package housing, wherein the top member comprising a top wall and side walls, the side walls are attached to the bottom member, and the passageway is embedded into at least one of the side walls.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: February 5, 2019
    Assignees: Akustica, Inc., Robert Bosch GmbH
    Inventor: Mikko V A Suvanto
  • Patent number: 10187560
    Abstract: A notched-spacer camera module includes a chip-scale package, a lens plate, a spacer ring, and a glue ring. The chip-scale package has an image sensor and a top surface. The spacer ring includes a glue gate having a gate height and a spacer base, having a base height, between the glue gate and the lens plate. The glue ring is between the spacer ring and the top surface and has (i) an outer region between the top surface and a bottom surface of the spacer base, and (ii) an inner region, having an inner thickness, between the top surface and a bottom surface of the glue gate. The lens plate, the spacer ring, the glue ring, and the top surface form a sealed cavity having a cavity height equal to at least a sum of the inner thickness, the gate height, and the base height.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: January 22, 2019
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Chia-Yang Chang, Yi Qin
  • Patent number: 10177188
    Abstract: A semiconductor package including a substrate, a memory chip on the substrate, a mold layer on the substrate to cover a side surface of the memory chip, an image sensor chip on the memory chip and the mold layer, and a connection terminal between and electrically connecting the memory chip to the image sensor chip may be provided.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: January 8, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Un-Byoung Kang, Yungcheol Kong, Hyunsu Jun, Kyoungsei Choi
  • Patent number: 10175447
    Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: January 8, 2019
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang, Zhongyu Luan, Fengsheng Xi, Feifan Chen, Liang Ding
  • Patent number: 10170508
    Abstract: An optical package structure is provided. The optical package structure includes a substrate, a frame layer, an optical unit, a bonding layer, a transparent plate and an encapsulation layer. The frame layer formed on the substrate surrounds a cavity where the optical unit is located. The bonding layer covers a portion of an upper edge of the frame layer and exposes the other portion of the upper edge of the frame layer. The transparent plate mounted on the bonding layer extends across the optical unit and extends beyond an outer edge of the bonding layer. The encapsulation layer covers a lateral edge of the transparent plate and the outer edge of the bonding layer.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: January 1, 2019
    Assignee: KINGPAK TECHNOLOGY INC.
    Inventors: Hsiu Wen Tu, Chung-Hsien Hsin, Jina-Ru Chen
  • Patent number: 10147853
    Abstract: Emitter packages are disclosed having a thixotropic agent or material, with the encapsulant exhibiting significant reduction of thixotropic agent scattering. The packages exhibit a corresponding reduction or elimination of encapsulant clouding and increased package emission efficiency. This allows for the thixotropic agents to be included in the encapsulant to alter certain properties (e.g. mechanical or thermal) while not significantly altering the optical properties of the encapsulant. One embodiment of a light emitting diode (LED) package according to the present invention comprises an LED chip with an encapsulant over the LED chip. The encapsulant has an encapsulant refractive index and also has a thixotropic material with a refractive index that is substantially the same as the encapsulant refractive index.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: December 4, 2018
    Assignee: CREE, INC.
    Inventors: Bernd Keller, Theodore Lowes
  • Patent number: 10126510
    Abstract: A detection device is provided with a holding body that holds a light-receiving module, an optical fiber pigtail, and a lens. The light-receiving module is provided with a light-receiving element and a stem that supports the light-receiving element. The lens collimates an input light from one end of an input fiber and guides a portion of the input light to the light-receiving element. The lens separates the input light into a transmitted light and a reflected light, guiding the transmitted light to the light-receiving element and guiding the reflected light to an output fiber. The light-receiving element has a center of a light-receiving surface thereof disposed in a position away from an axis of the stem.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: November 13, 2018
    Assignee: Santec Corporation
    Inventor: Yasuki Sakurai
  • Patent number: 10121043
    Abstract: A printed circuit board assembly (PCBA) and a method to assemble the PCBA are disclosed. The PCBA includes a printed circuit board (PCB), an image sensing chip and a protection layer. The PCB includes a first insulation layer, a second insulation layer, a first electrically conductive layer, a second electrically conductive layer, and a third electrically conductive layer. The image sensing chip has a number of bonding pads with a sensor portion facing down through the second opening. The PCBA can function as an image sensing module and make the module have the thinnest thickness.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: November 6, 2018
    Assignee: Sunasic Technologies, Inc.
    Inventors: Chi-Chou Lin, Zheng-Ping He
  • Patent number: 10103191
    Abstract: A semiconductor wafer has an image sensor area with a light transmissive wafer, such as glass, disposed over the semiconductor wafer. A portion of the semiconductor wafer is removed to thin the wafer. A semiconductor die is disposed over a surface of the semiconductor wafer opposite the light transmissive wafer. An encapsulant is deposited around the semiconductor die. A portion of the encapsulant is removed to planarize the encapsulant. A conductive via is formed through the semiconductor wafer and first encapsulant. An interconnect structure is formed over the encapsulant and semiconductor die. The interconnect structure includes multiple insulating layers and multiple conductive layers. The multiple insulating layers can be an encapsulant. The semiconductor wafer is singulated to form a multi-die semiconductor package, which integrates the image sensor semiconductor die with other types of semiconductor die to enhance the image performance within the multi-die package.
    Type: Grant
    Filed: January 16, 2017
    Date of Patent: October 16, 2018
    Assignee: Semiconductor Components Industries, LLC
    Inventor: Yu-Te Hsieh
  • Patent number: 10074756
    Abstract: A method for producing an optical component includes presenting a laminate and separating a second layer from a substrate. In presenting the laminate, the laminate includes the substrate, a first layer disposed on the substrate, the second layer disposed on the first layer, and a third layer disposed on the second layer. The first layer includes a portion that does not overlap with the second layer and the third layer. In separating the second layer from the substrate, the second layer is separated from the substrate by dissolving the first layer from the substrate with a liquid. The first layer and the third layer each contain a compound.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: September 11, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventor: Hiroshi Mizuno
  • Patent number: 10062815
    Abstract: A light emitting device includes a carrier, a light emitting chip, and a covering part disposed on the carrier. The carrier includes a board, a guiding metal layer, and a sealing material. The board has a first surface, a second surface, and a through vent that is divided into a first partial hole and a second partial hole. The first partial hole extends from the first surface to the second partial hole, and the second partial hole extends from the second surface to the first partial hole. The guiding metal layer is formed on the second surface and in the second partial hole, and covers the sidewall of the second partial hole. The guiding metal layer extends from the second partial hole to the second surface, and does not cover the sidewall of the first partial hole and the first surface. The sealing material seals the second partial hole.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: August 28, 2018
    Assignee: UNISTARS CORPORATION
    Inventors: Hsin-Hsien Hsieh, Shang-Yi Wu
  • Patent number: 10062661
    Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: August 28, 2018
    Assignee: Tessera, Inc.
    Inventors: Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi