Abstract: A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a base having an upper surface and a plurality of fins extending substantially upwardly from the upper surface. The condenser also includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator.

Abstract: A structure of a heat spreader substrate. A first heat spreader has a first upper surface, a corresponding first lower surface and an opening. A second heat spreader has a second upper surface and a corresponding second lower surface. The second heat spreader is fit tightly into the opening. The second lower surface and the first lower surface are coplanar. A thickness of the second heat spreader is smaller than that of the first heat spreader. A chip is located on the second upper surface. A substrate is located on the first upper surface of the first heat spreader, and the opening is exposed by the substrate.

Abstract: A microelectronic system includes a substrate that is preferably silicon and a microelectronic device supported on the substrate. The microelectronic device may be a light sensor that include a readout integrated circuit formed in the silicon substrate, and a light detector supported on and electrically interconnected with the readout integrated circuit. A cryocooler formed in and integral with the substrate includes a gas inflow channel formed in the substrate, an expansion nozzle formed in the substrate and receiving a gas flow from the gas inflow channel, and a gas outflow channel that receives the gas flow from the outlet of the expansion nozzle. The gas inflow channel and the gas outflow channel may be countercurrent spirals.

Abstract: Heat dissipation devices and molding processes for fabricating such devices, which have at least two regions comprising different conductive materials such that efficient thermal contact is made between the different conductive materials. The molding processes include injection molding at least two differing conductive materials.

Abstract: A flat evaporator is provided. In the evaporator, a common chamber formed on a substrate with a predetermined diameter and depth for containing a coolant is divided into a vaporization cavity region, a capillary region surrounding the vaporization cavity region, and a manifold region surrounding the capillary region. The capillary region has a capillarity generator capable of generating capillary action, and a top plate is configured to include an exhaust unit including a gas collector to exhaust a gas coolant generated in the vaporization cavity region. The evaporator can be implemented as a small and thin cooling device for performing cooling without external power. Furthermore, the evaporator can effectively prevent degradation of fluid flow force due to coexistence of gas and liquid by isolating a liquid coolant from a vaporized coolant by a capillary region, thereby significantly improving heat exchange characteristics.

Abstract: A thermosiphon for cooling an electronic device having a mean width of dimension “b” comprises a boilerplate having a top surface and including a plurality of pyramid shaped fins projecting upwardly from the top surface. The boilerplate also has a bottom surface for receiving the electronic device to be cooled. A plurality of spaced apart condenser tubes is mounted above the boilerplate such that the boilerplate and the condenser tubes define a vapor chamber therebetween for receiving a working fluid therein. A plurality of convoluted fins extends between each adjacent pair of condenser tubes.

Abstract: A heat dissipation device including a base portion having a plurality of projections extending therefrom. The base portion may have a vapor chamber defined therein and may have first surface sloped from a central apex portion to edges of the base portion. The vapor chamber includes at least one extension on a vapor chamber upper surface which is adapted to direct a condensed working fluid toward a desired location on a vapor chamber lower surface. The vapor chamber lower surface may have at least one depression to collect a greater portion of the working fluid in a desired location(s).

Abstract: A semiconductor clamped-stack assembly (32) has at least two clamped stacks, each of these clamped stacks having a plurality of power semiconductor components (8) and a plurality of heat sinks (6), which are arranged in series along a horizontally extending axial direction (A). According to the invention, power semiconductor components (8) from different clamped stacks are assigned to one another and are located in a common mounting plane, which is perpendicular to the axial directions (A) of the clamped stacks (31). Mutually associated power semiconductor components (8) can be removed from the clamped-stack assembly or, respectively, inserted into the clamped-stack assembly in a common mounting direction, which lies in the mounting plane. Mutually associated power semiconductor components (8) are preferably mounted on a common plate (14). As a result, they can be dismantled when the clamped-stack assembly (32) is loosened, without further power semiconductor components or heat sinks having to be dismantled.

Abstract: A heat sink apparatus for gathering and dissipating heat from a heat source having a heat source housing includes an impeller chamber having a chamber interior containing a heat transfer fluid and comprising a heat transfer wall for transferring heat from the heat source into the chamber; a heat transfer fluid within the chamber; a fluid circulation path including the chamber interior; a fluid propelling mechanism for propelling the fluid through the circulation path and across the heat transfer wall so that the fluid absorbs heat at the heat transfer wall and flows to a heat discharge region remote from the heat transfer wall where the heat is dissipated into the surrounding environment; where the fluid propelling mechanism includes a mechanical fluid driving structure including blades within the chamber rotatably secured to the apparatus with a blade mounting structure to move adjacent to and along the heat transfer wall and within the flow layer of the fluid adjacent to the heat transfer wall to mechanical

Abstract: A power module or other circuit is formed with transistor assemblies, each having one or more semiconductor slices electrically connected to one another and fixed to a supporting system. The supporting system includes a tubular element suited to allow the flood of a refrigerating and insulating fluid in the inside and which has the semiconductor slices directly welded on its external surface.

Abstract: An assembly of N laser diode arrays. Each diode is fitted to the end of a base which forms the anode and is traversed by a hole. The holes of all the bases define a channel for the circulation of fluid for cooling the assembly of diode arrays. Each module includes an array, a base and a corresponding cathode. The modules are separated from each other by a flat joint or gasket.

Abstract: A semiconductor device or other suitable substrate and method with single or multi layers of buried micro pipes are disclosed. This is achieved by controlling the aspect ratio of trenches as well as controlling the deposition characteristics of the material used to fill the trenches. A buried micro pipe is formed by filling a trench that has a height which is larger than a width thereof, so that the trench filler material lines sidewalls and bottom of the trench, and covers the top of the trench to form the micro pipe within the trench. Another layer can be formed over the filler material and planarized. Alternatively, the filler material itself can be planarized. Forming trenches in the planarized layer, and repeating the above steps forms a second set of buried micro pipes in these new trenches. This forms a semiconductor device having multiple layer of buried micro pipes. Via holes may be etched to contact a micro pipe, or to inter connect micro pipes buried at different levels.

Abstract: An electronic device (10) having a thermal control capability is disclosed. The electronic device includes a substrate (16), a signal conductive region (26) disposed on at least a portion of the substrate, the signal conductive region configured to provide a signal path, and a first semiconductor die (12) having an active surface (18) and a back surface (20). The back surface is configured with a plurality of bubbler cavities positioned to receive a cooling fluid (24). In addition, the first semiconductor die includes a first plurality of solder bumps (30) disposed on the active surface, the first plurality of solder bumps contiguous with, and electrically coupling the active surface to the signal conductive region. Further, an electrically reactive metal region (402) in communication with the signal conductive region is sized to provide a location for real-time iterative tuning of the electronic device.

Abstract: An electrical cartridge of the present invention includes a spring that pushes an integrated circuit package into a thermal plate. The integrated circuit package and substrate are attached to a substrate such as a printed circuit board. A cover may be attached to an opposite side of the substrate. There is typically a space between the integrated circuit package and the thermal plate that is filled with a thermal grease. The spring is located between the cover and the substrate in a manner which deflects the spring and exerts a force on the substrate. The spring force pushes the substrate and the integrated circuit package into the thermal plate. The spring may be designed to always provide a sufficient force to ensure a minimum space between the integrated circuit package and the thermal plate for assemblies produced in a mass production process.

Abstract: A temperature controlled cryogenic package system for efficiently and precisely monitoring and controlling the operating temperature of a high temperature superconductor circuit placed on a substrate. The cryogenic package system comprises a heating element formed on the same substrate as the high temperature superconductor circuit, a control circuit capable of activating and deactivating the heating element, and a temperature sensor placed in thermal proximity to the high temperature superconductor circuit. The temperature sensor monitors the operating temperature of the high temperature superconductor circuit, and conveys temperature information to the control circuit. The control circuit activates or deactivates the heating element according to the warming or cooling effect that is necessary in order to maintain the high temperature superconductor circuit within a predetermined temperature range, where the range of temperature fluctuation is within plus or minus 0.1 K of a predetermined temperature.

Abstract: A liquid cooling module for cooling electronic circuit components and the like comprises the use of a fluidic amplifier element in conjunction with a thermally sensitive fluidic element. The thermally sensitive fluidic element responds to the change in viscosity with respect to temperature of a coolant flowing through a cooling plate. In response to the viscosity change, the thermally sensitive element produces a fluidic control signal to the fluidic amplifier element, which increases the rate of flow through the cooling plate with increasing coolant temperature and decreases the rate of flow through the cooling plate with decreasing coolant temperature.

Abstract: A superconductive electrical device is operable simultaneously at relatively higher temperatures, i.e., 60-90K, and at relatively lower temperatures, i.e., less than 12K. The device comprises a non-superconductive substrate with two regions, a first relatively high temperature region and a second relatively low temperature region. A high temperature superconductor is on the first region and a portion of the second region. A dielectric layer is on the high temperature superconductor. A low temperature superconductor is on the second region of the substrate and on a portion of the dielectric layer. Integrated circuit chips can be secured to both superconductors, thereby yielding a superconductive multi-chip module operable at two different temperatures, such as in a cryo-cooler with two temperature stages.

Abstract: An apparatus for controlling the operating conditions of individual electic circuit boards and a circuit board cabinet for holding one or more environmentally controlled circuit packs is provided. The enclosure provides both electronic ports and cooling ports. The cooling ports may be used to circulate liquid or gaseous coolant over the surface of the circuit board thereby dissipating built up heat. The electronic ports allow the board to be externally connected to other electronic components. Additionally, the enclosure provides an electrostatic buffer that protects the enclosed circuit board from electrostatic shock during operation or while the board is being externally handled and stored. Finally, the enclosure provides a barrier against foreign particles such as dust and moisture. The cabinet allows a plurality of circuit boards to be mounted in one cabinet and cooled by a single cooling source. It also provides coolant draining capabilities and a coolant distribution system.

Abstract: A device for receiving thermal conduit comprising a thermally conductive material for coupling between an end of a conducting element of the thermal conduit and an end of an outer shell of the thermal conduit. The thermally conductive material is arranged to physically define a best thermal path from the end of the conducting element to the end of the outer shell such that substantially all thermal energy dissipated from the conducting element to the outer shell flows along the best thermal path. The length of the best thermal path is significantly greater than a nearest distance between the conducting element and the outer shell, and the conductive material is thin and manufactured of a poor thermal conductor such that the total energy dissipated along the best thermal path is reduced.

Abstract: Apparatus for cooling charge-coupled device (CCD) imaging systems. The apparatus comprises a thermoelectric cooler thermally coupled to the imaging system for transferring heat away from and cooling the imaging system portion of the imaging system. The thermoelectric cooler has a cold side and an opposing hot side, with the cold side thermally coupled to the imaging sensor to enable the transfer of heat from the sensor in response to a supply of power. A power supply is coupled to the cooler for supplying required power. The hot side of the cooler is thermally coupled to a heat pipe, which is composed of a heat-conducting material having a hollow portion containing a wicking material and a working fluid. A heat sink is thermally coupled to the heat pipe enabling heat dissipation. The working fluid cyclically evaporates into vapor and condenses into liquid to effect the heat transfer from the heat pipe to the heat sink.

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a substrate having a cavity formed therein for enclosing an integrated circuit. The integrated circuit package also includes a carrier for holding the integrated circuit. The carrier is positioned within the cavity of the substrate. A thermally reactive connector is coupled to the carrier. The thermally reactive connector is for selectively coupling the carrier to the substrate when a temperature of the thermally reactive connector is above a first temperature such that the carrier is held in position within the opening. The thermally reactive connector is also for decoupling the carrier from the substrate when the carrier temperature is at the first temperature. In this manner, the number of thermal paths between the integrated circuit and the substrate of the integrated circuit is reduced.

Abstract: Semiconductor wafer (22) and substrate (20) are enclosed in housing (12) on heat extracting base (14) . The space within the housing is filled with a phase change material (28) which absorbs heat at a transitional temperature below the critical temperature of the semiconductor wafer to absorb heat during peak loads. Wires (44) thermally couple the wafer (22) to the phase change material (28). Heat is extracted from both the semiconductor wafer and the phase change material through the base (14).

Abstract: A superconducting apparatus has a superconducting element, which is a member to be cooled and which exhibits a superconducting phenomenon; an electronic cooling element composed of a cooling electrode provided to the superconducting element via an insulating layer, p-type and n-type semiconductor layers formed to be connected to the cooling electrode, heat-radiation electrodes provided to the semiconductor layers independently of each other, and a heat-radiation plate provided to the heat-radiation electrodes via the insulating layer; lead wires for electrically connecting the superconducting element and the electronic cooling element to external circuits, respectively. The superconducting element and the electronic cooling element, which are integrally packaged, are installed within the first container. Internally sealed by an inert gas atmosphere, the first container is installed within the second container. The second container is internally sealed in a vacuum state.

Abstract: An apparatus for cooling an integrated circuit device includes a container defining a chamber that is partially filled with a coolant which forms a coolant pool in the chamber, wherein heat generated by the integrated circuit device causes boiling of the coolant at a heating area of the coolant pool so that vaporized coolant rises upwardly from the coolant pool and condenses on a ceiling of the chamber forming coolant droplets thereon. The apparatus further includes a baffle positioned within the chamber and at least partially out of the coolant pool, the baffle further being positioned within a path traveled by the coolant droplets falling from the ceiling due to gravity, wherein the baffle is configured to guide the coolant droplets away from the heating area of the coolant pool as the coolant droplets fall from the ceiling towards the coolant pool due to gravity.

Abstract: A low temperature conduction module comprising a cold plate having recesses around the periphery thereof to accommodate memory cubes is disclosed. The recesses accommodating the memory cubes are of such depth and dimension as to enclose the memory cube on all but one side, thereby greatly enhancing the conduction of the heat generated by the memory cube to the cold plate. The memory cube may be surrounded by a material which possesses excellent thermal conductive properties to insure efficient transfer of the heat from the memory cube to the cold plate. The plurality of memory cubes so positioned within the cold plate may be connected by a flexible cable surrounding the cold plate and having branch conductors extending to connect with computer processors enclosed within the same low temperature conduction module.

Abstract: A system provides for convective transferring of material between a workpiece and a flowing fluid which chemically reacts with the workpiece. A gap is formed between the workpiece and a facesheet. The fluid is fed to supply nozzles, travels a short distance within the gap adjacent to the facesheet and exits via return nozzles. The flow cross section and flow density facilitate convective transfer at a moderate flow rate and low fluid pressure. The system is also applicable for chemical transfer such as plating or etching printed circuit boards.

Abstract: A board containing plural superconducting power planes, one for each required potential level, is used to distribute power to one or more semiconductor logic chips which, together with the board, are immersed in liquid nitrogen. Each chip is coupled thermally to a heat exchanger and is coupled electrically to the board through leads that minimize heat transfer from the chip to the board.

Abstract: A superconductive apparatus including a superconductive member to be cooled, a cooling element which exhibits Peltier effect upon supply of electric power thereto such that the superconductive member is thermally coupled with a cooling portion of the cooling element and a container for accommodating the superconductive member and the cooling portion.