Liquid Coolant Patents (Class 257/714)
  • Patent number: 10770435
    Abstract: Apparatuses and methods for semiconductor die heat dissipation are described. For example, an apparatus for semiconductor die heat dissipation may include a substrate and a heat spreader. The substrate may include a thermal interface layer disposed on a surface of the substrate, such as disposed between the substrate and the heat spreader. The heat spreader may include a plurality of substrate-facing protrusions in contact with the thermal interface layer, wherein the plurality of substrate-facing protrusions are disposed at least partially through the thermal interface layer.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: September 8, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Sameer S. Vadhavkar, Xiao Li, Anilkumar Chandolu
  • Patent number: 10770369
    Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a heat dissipation lid and a thermal isolation. The substrate has a surface. The first electronic component and the second electronic component are over the surface of the substrate and arranged along a direction substantially parallel to the surface. The first electronic component and the second electronic component are separated by a space therebetween. The heat dissipation lid is over the first electronic component and the second electronic component. The heat dissipation lid defines one or more apertures at least over the space between the first electronic component and the second electronic component. The thermal isolation is in the one or more apertures of the heat dissipation lid.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: September 8, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chih-Pin Hung, Tang-Yuan Chen, Jin-Feng Yang, Meng-Kai Shih
  • Patent number: 10770334
    Abstract: A substrate holding device includes a base body that has a flat plate-like shape and in which gas holes that open in an upper surface of the base body are formed, and a plurality of protrusions that protrude upward from the upper surface of the base body. A groove that opens in a lower surface of the base body and that is connected to the gas holes is formed in the base body, and a plurality of protrusions that protrude downward are formed in the groove.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: September 8, 2020
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Tomohiro Ishino, Shinya Kikuchi
  • Patent number: 10756001
    Abstract: Provided is a semiconductor module comprising: a semiconductor chip; a cooling portion having a refrigerant passing portion through which a refrigerant passes; and a laminated substrate having: a first metal interconnection layer; a second metal interconnection layer; and an insulation provided between the first metal interconnection layer and the second metal interconnection layer, wherein the cooling portion has: a top plate; a bottom plate; and a plurality of protruding parts which are provided on a surface of the bottom plate, and are separated from each other in a flow direction of the refrigerant, and are respectively provided continuously in a direction orthogonal to the flow direction, wherein the plurality of protruding parts are provided at a position overlapping with one end of the second metal interconnection layer and at a position overlapping with the semiconductor chip in the flow direction.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: August 25, 2020
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Akio Kitamura, Shinichiro Adachi, Nobuhide Arai
  • Patent number: 10665530
    Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: May 26, 2020
    Assignee: Microfabrica Inc.
    Inventors: Richard T. Chen, Will J. Tan
  • Patent number: 10607919
    Abstract: Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: March 31, 2020
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Seungwon Im, Oseob Jeon, Byoungok Lee, Yoonsoo Lee, Joonseo Son, Dukyong Lee, Changyoung Park
  • Patent number: 10557724
    Abstract: An angular detection system including a magnet and sensors is disclosed. The magnet can be located on a rotating component and the sensors can be located on a stationary component, or vice versa. The magnet can generate a plurality of magnetic flux lines. The plurality of sensors can be located and spatially separated along the motion path of the magnet for detecting the magnetic flux densities. The strength of the magnetic flux lines sensed by a given sensor can be used to determine the location of the magnet along its motion path. The plurality of sensors can generate one or more signals indicative of the strength of the sensed magnetic field lines. Based on the strength of the magnetic flux lines, the location of the magnet, or both, the system can determine the angle of rotation of the device by using a polynomial function or a look-up table.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: February 11, 2020
    Assignee: Apple Inc.
    Inventors: Manoj K. Bhattacharyya, Daniel Ray Bloom, Rajesh Anantharaman
  • Patent number: 10561040
    Abstract: Systems and methods are provided for a gasket that allows for a single cooling cold plate to touch one or more devices. These devices may have precise but varying thermal interfaces and mounting pressure requirements; and height and co-planarity tolerances that need to be accommodated. The gasket may be sandwiched in between a top stiffener plate and a floating cold plate along an outer perimeter of the gasket; and a rigid, cold plate base and a bottom stiffener plate along an inner perimeter of the gasket. The resulting seal allows coolant to flow between the rigid and floating cold plates as these plates move (i.e., float) with respect to one another. Thus, the gasket aids in a cooling apparatus achieve an optimum thermal interface with each of the one or more devices simultaneously, while accounting for the individual tolerance variations across each device.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: February 11, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Harvey Lunsman, Tahir Cader, Michael Scott
  • Patent number: 10495386
    Abstract: A loop heat pipe includes a stacked structure formed by metal layers that are stacked, including an outermost metal layer arranged at one outermost surface of the loop heat pipe. The stacked structure forms an evaporator configured to vaporize a working fluid and generate vapor, a condenser configured to liquefy the vapor of the working fluid, a vapor pipe configured to connect the evaporator and the condenser, and a liquid pipe configured to connect the evaporator and the condenser, to form a loop-shaped passage. The outermost metal layer has an outer surface formed with grooves.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: December 3, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takahiko Kiso, Nobuyuki Kurashima
  • Patent number: 10468315
    Abstract: The power module includes: an insulating substrate having an upper surface on which a semiconductor element is mounted; a base plate joined to a lower surface of the insulating substrate; a case member surrounding the insulating substrate and adhered to the base plate; a sealing resin provided in a region surrounded by the base plate and the case member, so as to seal the insulating substrate; and a holding plate projecting from an inner wall of the case member to above an outer peripheral portion of the insulating substrate, the holding plate being fixed to the inner wall, the holding plate being in contact with the sealing resin.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: November 5, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kozo Harada, Hiroyuki Harada, Yasumichi Hatanaka, Takashi Nishimura, Masaki Taya
  • Patent number: 10462939
    Abstract: A semiconductor device includes a cooling jacket having an inlet for coolant and an outlet for the coolant, a base plate, a first semiconductor element provided on the base plate, a second semiconductor element provided on the base plate, a first fin provided directly under the first semiconductor element on a back surface of the base plate and placed within the cooling jacket, a second fin provided directly under the second semiconductor element on the back surface of the base plate and placed within the cooling jacket, and a separator provided within the cooling jacket to divide the coolant entering the cooling jacket through the inlet into portions respectively cooling the first fin and the second fin.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: October 29, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventor: Koichi Ushijima
  • Patent number: 10461061
    Abstract: Apparatuses and methods for semiconductor die heat dissipation are described. For example, an apparatus for semiconductor die heat dissipation may include a substrate and a heat spreader. The substrate may include a thermal interface layer disposed on a surface of the substrate, such as disposed between the substrate and the heat spreader. The heat spreader may include a plurality of substrate-facing protrusions in contact with the thermal interface layer, wherein the plurality of substrate-facing protrusions are disposed at least partially through the thermal interface layer.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: October 29, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Sameer S. Vadhavkar, Xiao Li, Anilkumar Chandolu
  • Patent number: 10386126
    Abstract: Apparatus for controlling the thermal uniformity of a substrate can control the thermal uniformity of the substrate to be more uniform or to be non-uniform. In some embodiments, an apparatus for controlling the thermal uniformity of a substrate includes: a substrate support having a support surface to support a substrate thereon. A flow path is disposed within the substrate support to flow a heat transfer fluid beneath the support surface. The flow path comprises a first portion and a second portion, each portion having a substantially equivalent axial length. The first portion is spaced about 2 mm to about 10 mm from the second portion. The first portion provides a flow of heat transfer fluid in a direction opposite a flow of heat transfer fluid of the second portion.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: August 20, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Kallol Bera, Xiaoping Zhou, Douglas A. Buchberger, Jr., Andrew Nguyen, Hamid Tavassoli, Surajit Kumar, Shahid Rauf
  • Patent number: 10306799
    Abstract: An electronic device, immersed in a coolant filled in a cooling apparatus, and directly cooled, is configured to be housed in housing parts of the cooling apparatus, and includes a metal board held with board retainers disposed in the housing part, and substrate groups attached to a first surface of the metal board and a second surface opposite the first surface. The substrate group includes first circuit boards, each including sockets for mounting processors and main memories on one surface of a substrate, and a component for interconnecting the processors, a second circuit board including a mother board component which includes a chipset for controlling the main memory, and a flow channel formed in a gap between a surface opposite the one surface of the first circuit boards, and one surface of the second circuit board, which faces the surface opposite the one surface of the first circuit boards.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: May 28, 2019
    Assignee: EXASCALER INC.
    Inventor: Motoaki Saito
  • Patent number: 10294559
    Abstract: A sputter target assembly particularly useful for a large panel plasma sputter reactor having a target assembly sealed both to the main processing chamber and a vacuum pumped chamber housing a moving magnetron. The target assembly to which target tiles are bonded includes an integral plate with parallel cooling holes drilled parallel to the principal faces. The ends of the holes may be sealed and vertically extending slots arranged in two staggered groups on each side and machined down to respective pairs of cooling holes on opposite sides of the backing plate in pairs. Four manifolds tubes are sealed to the four groups of slots and provide counter-flowing coolant paths.
    Type: Grant
    Filed: March 15, 2012
    Date of Patent: May 21, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Yoshiaki Tanase, Makoto Inagawa, Akihiro Hosokawa
  • Patent number: 10277011
    Abstract: Provided is a laser light source device which has a plurality of semiconductor laser elements arranged in an array and is provided with: a heat sink; a sub-mount substrate which is placed on one end edge of the heat sink, which has a power feed path, and on which the semiconductor laser array is mounted; an insulation plate placed in an area other than the sub-mount substrate on the heat sink; a first electrode plate mounted on the insulation plate; a second electrode plate mounted on the insulation plate separately from the first electrode plate; metal wires electrically connecting respectively between the first electrode plate and the sub-mount substrate and between the second electrode plate and the semiconductor laser array; and a cooling block on which the heat sink is mounted and which has a cooling water flow channel inside of the cooling block.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: April 30, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kazutaka Ikeda, Daisuke Morita, Motoaki Tamaya
  • Patent number: 10231363
    Abstract: The present invention relates to a modular cooling apparatus for a high-voltage direct-current transmission system. A sub-module (10) according to the present invention comprises a power unit (12) in the front and a capacitor unit (13) in the rear, and a heat sink (30) for discharging heat generated from the interior is provided in an interior space (14?) of a power unit housing (14) forming the exterior of the power unit (12). A coolant path (31) is provided in the interior of the heat sink (30). The entrance and exit of the coolant path (31) are located adjacent to the bottom surface of the interior space (14?). Connecting couplers (20) for supplying coolant to the interior space (14?) are provided on the sloped surface (16) on the bottom end of the front surface (15) of the power unit housing (14). The sloped surface (16) is formed so as to face the ground at an angle.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: March 12, 2019
    Assignee: HYOSUNG HEAVY INDUSTRIES CORPORATION
    Inventors: June-Sung Kim, Hong-Ju Jung, Jong-Yun Choi
  • Patent number: 10212849
    Abstract: The present application discloses a liquid immersion tank capable of withstanding, though made of a resin, a load of coolants and keeping dimensional accuracy. The liquid immersion tank including: a tank body being receivable of an electronic equipment and filled with a fluorine-series insulating coolant; and a fixing portion being provided on an inner wall surface of the tank body and receiving fixation of the electronic equipment, the tank body being equal to or smaller than 2% in modulus of volume change when immersed in the fluorine-series insulating coolant, and being composed of a resin material being equal to or smaller than 15×10?5/K in coefficient of linear expansion.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: February 19, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Yoshio Matsumoto, Hideo Kubo
  • Patent number: 10186501
    Abstract: An electric power converter includes a switching device that performs electric-power conversion through switching, an insulated substrate having a first side and a second side that are opposite to each other, a first circuit with which the switching device is electrically connected and that is bonded to the first side of the insulated substrate, a second circuit that is formed in a shape the same as that of the first circuit and is bonded to the second side of the insulated substrate, and a base to which the second circuit is bonded through the intermediary of a bonding layer; each of corner portions in the respective planar shapes of the first circuit and the second circuit has a stress relaxation portion that is formed in such a way as to have a smaller thickness than the other portion.
    Type: Grant
    Filed: December 24, 2013
    Date of Patent: January 22, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventor: Ryuichi Ishii
  • Patent number: 10170961
    Abstract: A blower motor of a heating, ventilating and air conditioning (HVAC) system for a vehicle includes: a base including an introduction path to introduce air into the base and a substrate having a plurality of elements attached to the substrate, and a heat sink formed to have a plate shape in surface contact with one surface of the substrate and having a contact surface contacting the air introduced through the introduction path and configured to guide the introduced air to heat generation parts formed on the contact surface.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: January 1, 2019
    Assignees: Hyundai Motor Company, Hanon Systems, Hyoseong Electric Co., Ltd.
    Inventors: Dong Won Yeon, Jae Won Heo, Sang Yeop Lee, June Kyu Park, Jong Sik Bae, Dong Gyun Kim, Jin Gun Jung
  • Patent number: 10152097
    Abstract: A heat-dissipating device for expansion card is provided. The expansion card has a printed circuit card. The printed circuit card has an inserting-type connecter at one end thereof and a securing hole formed at the other end thereof. The heat-dissipating device includes a base plate, a plurality of cooling fins protruded from the base plate, a screwing portion, and at least one hooking part. The base plate has a flat bottom surface, a first side and a second side opposite to the first side. The screwing portion is formed at the first side of the base plate. The position of the screwing portion is corresponding to that of the securing hole of the expansion card. The at least one hooking part is disposed at the second side of the base plate and is hooked with one side of the printed circuit card.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: December 11, 2018
    Assignee: ADATA TECHNOLOGY CO., LTD.
    Inventor: Chih-Chun Huang
  • Patent number: 9961807
    Abstract: An electric power converter includes a semiconductor module with a built-in switching element, a cooler that cools the semiconductor module, and a metallic case provided with an internal space that accommodates the semiconductor module and the cooler. The case is formed by combining a first case member and a second case member. The case includes an outer fixing portion for connecting and fixing the first case member and the second case member on an outside of the internal space, an inner fixing portion for connecting and fixing the first case member and the second case member on an inside of the internal space. The case includes a partition wall that is formed continuously from the inner fixing portion and partitions the internal space. A heat-generating component disposed along a wall surface of the partition wall is accommodated in the internal space.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: May 1, 2018
    Assignee: DENSO CORPORATION
    Inventors: Yoshiki Kawaguchi, Akio Yokota, Kazuhiro Kosaka
  • Patent number: 9960147
    Abstract: A power module includes a base plate, first, second, and third semiconductor chips. At least one of a third edge or fourth edge of the first semiconductor chip is disposed adjacent to a side end of the base plate. Among a half of a distance from a first edge of the first semiconductor chip to one edge of the second semiconductor chip, a half of a distance from a second edge of the first semiconductor chip to one edge of the third semiconductor chip, and a distance from the third edge or fourth edge of the first semiconductor chip disposed adjacent to the side end of the base plate to the side end of the base plate, a length of a solder fillet formed on the edge of the first semiconductor chip at the shortest distance is formed in the shortest length.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: May 1, 2018
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Shiro Yamashita, Yusuke Takagi, Takahiro Shimura
  • Patent number: 9961798
    Abstract: In various embodiments, a package may be provided. The package may include a chip carrier. The package may further include a chip arranged over the chip carrier. The package may also include encapsulation material encapsulating the chip and partially the chip carrier. A coolant receiving recess may be provided over the chip in the encapsulation material, wherein the coolant receiving recess is configured to receive coolant.
    Type: Grant
    Filed: April 4, 2013
    Date of Patent: May 1, 2018
    Assignee: Infineon Technologies Austria AG
    Inventors: Ralf Otremba, Klaus Schiess, Khalil Hosseini
  • Patent number: 9956776
    Abstract: A liquid-ejection head including: a substrate on or above which a plurality of actuators are formed, the plurality of actuators generating energy for ejecting a liquid; and a flow-passage-forming member on or above the substrate, the flow-passage-forming member defining ejection ports through which the liquid is ejected and a plurality of liquid chambers each having a corresponding one of the plurality of actuators, the flow-passage-forming member including an orifice plate defining the ejection ports and liquid-chamber side walls defining side walls of the plurality of liquid chambers, the flow-passage-forming member being formed of an inorganic material and having a depressed portion between the liquid chambers, and the depressed portion being filled with a photosensitive resin.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: May 1, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masahisa Watanabe, Toshiyasu Sakai
  • Patent number: 9953894
    Abstract: A semiconductor device including: a semiconductor element, a substrate having a first surface on which the semiconductor element is provided, and a second surface located opposite the first surface, a metal species provided on the second surface, and a plated metal portion provided at least in part on the second surface on the metal species. The semiconductor device further includes a first region where the plated metal portion is provided and a second region where the plated metal portion is not provided are alternately arranged at a peripheral portion of the second surface.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: April 24, 2018
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Shingo Masuko, Yoshiharu Takada, Kazuo Fujimura
  • Patent number: 9905506
    Abstract: An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and including an upper portion formed on a side of the chip, a lower portion formed on another side of the chip, and a cooling inlet and a cooling outlet for transferring a coolant, provided in an upper surface of the casing, and forming outer sidewalls of the upper portion and inner sidewalls of the lower portion, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board. The card includes an upper card connected to the upper portion of the casing, and a lower card connected to the lower portion of the casing.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: February 27, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kerry Bernstein, Thomas Brunschwiler, Bruno Michel
  • Patent number: 9905505
    Abstract: An assembly includes a chip including an integrated circuit, a casing including an integrated circuit including plural active elements and including an upper portion formed on a side of the chip, a lower portion formed on another side of the chip, and a cooling inlet and a cooling outlet for transferring a coolant, provided in an upper surface of the casing, and forming outer sidewalls of the upper portion and inner sidewalls of the lower portion, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: February 27, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kerry Bernstein, Thomas Brunschwiler, Bruno Michel
  • Patent number: 9893641
    Abstract: In an upper phase module 2, a second electrode terminal 24V is located at a center C1 of the upper phase module 2, and a first electrode terminal 24U and a third electrode terminal 24W, and a first P terminal 25P and a second P terminal 26P are located so as to be symmetric with respect to the second electrode terminal 24V in an X-direction. The first electrode terminal 24U, the second electrode terminal 24V, the third electrode terminal 24W, the first P terminal 25P and the second P terminal 26P of the upper phase module 2 are located at the same positions as those of a fourth electrode terminal 34U, a fifth electrode terminal 34V, a sixth electrode terminal 34W, a first N terminal 35N and a second N terminal 36N of a lower phase module 3, respectively, in the X-direction.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: February 13, 2018
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kiyofumi Nakajima, Yuki Ide
  • Patent number: 9870934
    Abstract: An electrostatic chuck includes a chuck base and cooling pipes. The chuck base has at least four cooling zones, in which the cooling zones viewed at a direction normal to the chuck base are fan-shaped. The cooling pipes are respectively disposed in the cooling zones of the chuck base. Therefore, the cooling pipes disposed in the different cooling zones can be controlled individually.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: January 16, 2018
    Assignee: Micron Technology, Inc.
    Inventor: Yi Chang
  • Patent number: 9859252
    Abstract: An integrated circuit structure includes a die including a semiconductor substrate, dielectric layers over the semiconductor substrate, an interconnect structure including metal lines and vias in the dielectric layers, a plurality of channels extending from inside the semiconductor substrate to inside the dielectric layers, and a dielectric film over the interconnect structure and sealing portions of the plurality of channels. The plurality of channels is configured to allow a fluid to flow through.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: January 2, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Ching, Ching-Wen Hsiao, Tsung-Ding Wang, Ming Hung Tseng, Chen-Shien Chen
  • Patent number: 9848498
    Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.
    Type: Grant
    Filed: October 26, 2015
    Date of Patent: December 19, 2017
    Assignee: FINISAR CORPORATION
    Inventors: Maziar Amirkiai, Yunpeng Song, Peter Henry Mahowald, Hongyu Deng
  • Patent number: 9826662
    Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: November 21, 2017
    Assignee: General Electric Company
    Inventors: Joo Han Kim, Graham Charles Kirk, Jay Todd Labhart, Binoy Milan Shah, Yogen Vishwas Utturkar, Pramod Charmarthy, Tao Deng
  • Patent number: 9768584
    Abstract: A laser diode package includes a heat pipe having a fluid chamber enclosed in part by a heat exchange wall for containing a fluid. Wicking channels in the fluid chamber is adapted to wick a liquid phase of the fluid from a condensing section of the heat pipe to an evaporating section of the heat exchanger, and a laser diode is connected to the heat exchange wall at the evaporating section of the heat exchanger so that heat produced by the laser diode is removed isothermally from the evaporating section to the condensing section by a liquid-to-vapor phase change of the fluid.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: September 19, 2017
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Todd Bandhauer, Robert J. Deri, John W. Elmer, Jack Kotovsky, Susant Patra
  • Patent number: 9740250
    Abstract: An electronic device includes a housing body, a dividing member that divides the housing body into a first compartment and a second compartment, a sealing member that divides the first compartment into a liquid-stopper region and an exterior communication region, one or more heat emitting components disposed in the liquid-stopper region, a fan disposed in the exterior communication region, and a ventilation pathway through which an airflow passes through the dividing member to the second compartment due to driving the fan.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: August 22, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Masao Honda, Yoshito Fukata, Takeshi Karuishi
  • Patent number: 9721870
    Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: August 1, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz
  • Patent number: 9713290
    Abstract: The subject disclosure is directed towards a datacenter or partial datacenter (e.g., a datacenter module) contained in a sealed container. The container may be filled with a cooling fluid, such as a dielectric fluid, to help cool the datacenter components. The container and its internal datacenter or datacenter portion may be submerged in water, in which event the fluid also helps to equalize the external water pressure.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: July 18, 2017
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Sean James, Todd Robert Rawlings
  • Patent number: 9691692
    Abstract: A semiconductor device in which the electrical connection is established using conductive pins and a printed wiring board, wherein the printed wiring board is mounted parallel to an insulated circuit board to prevent poor bonding of the conductive pins. A third-type conductive pin is arranged in such a manner as to be connected to a first metal layer at a position farther than a first-type conductive pin arranged at a position farthest from a side that is in contact with a gap between island regions. Similarly, another third-type conductive pin is arranged in such a manner as to be connected to another first metal layer at a position farther than another first-type conductive pin arranged at a position farthest from another side that is in contact with the gap between the island regions.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: June 27, 2017
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Masaoki Miyakoshi
  • Patent number: 9659838
    Abstract: An electronic chip package including a base defining a fluid inlet opening for receiving pressurized fluid from a fluid source and a fluid outlet opening. A dielectric body is arranged on the base and configured to support an electronic device. The dielectric body comprises a coolant flow chamber formed in a first surface thereof, and a plurality of impingement openings formed within the coolant flow chamber. The plurality of impingement openings are in communication with the fluid inlet opening of the base for generating a plurality of fluid streams to be expelled into the coolant flow chamber. The body further comprises a coolant return port formed within the coolant flow chamber and in communication with the fluid outlet opening of the base.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: May 23, 2017
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventors: Daniel W. Harris, John Ditri, Joseph W. Hahn, Michael K. McNulty
  • Patent number: 9564386
    Abstract: A semiconductor assembly for use with forced liquid and gas cooling. A relatively rigid nano-structure (for example, array of elongated nanowires) extends from an interior surface of a cap toward a top surface of a semiconductor chip, but, because of the rigidness and structural integrity of the nano-structure built into the cap, and of the cap itself, the nano-structure is reliably spaced apart from the top surface of the chip, which helps allow for appropriate cooling fluid flows. The cap piece and nano-structures built into the cap may be made of silicon or silicon compounds.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: February 7, 2017
    Assignee: International Business Machines Corporation
    Inventors: Wei Lin, Son V. Nguyen, Spyridon Skordas, Tuan A. Vo
  • Patent number: 9536748
    Abstract: Various embodiments herein relate to methods and apparatus for performing anisotropic ion beam etching to form arrays of channels. The channels may be formed in semiconductor material, and may be used in a gate-all-around device. Generally speaking, a patterned mask layer is provided over a layer of semiconductor material. Ions are directed toward the substrate while the substrate is positioned in two particular orientations with respect to the ion trajectory. The substrate switches between these orientations such that ions impinge upon the substrate from two opposite angles. The patterned mask layer shadows/protects the underlying semiconductor material such that the channels are formed in intersecting shadowed regions.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: January 3, 2017
    Assignee: Lam Research Corporation
    Inventors: Ivan L. Berry, III, Thorsten Lill
  • Patent number: 9456527
    Abstract: Methods of fabricating cooling apparatus are provided which facilitate cooling a multi-component assembly, such as a hub module assembly. The cooling apparatus includes a first liquid-cooled heat sink configured to facilitate removal of heat generated by one or more first electronic components of the multi-component assembly, and a second liquid-cooled heat sink configured to facilitate removal of heat generated by one or more second electronic components of the multi-component assembly. The first liquid-cooled heat sink is separably coupled to the multi-component assembly, and the second liquid-cooled heat sink is fixedly secured to the multi-component assembly. Fluid couplers fluidically couple the first and second liquid-cooled heat sinks to facilitate liquid coolant flow through the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink.
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: September 27, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Amilcar R. Arvelo, Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever
  • Patent number: 9450503
    Abstract: The present subject matter is directed to apparatus and methods for producing a variable frequency output waveform from a power converter for use in a power generation system, such as a wind turbine power generation system. A voltage divider is employed to provide plural voltage levels to which a multi-level bridge circuit employing selectively activated switches in pairs of switches is coupled. The switches are operated in such a fashion as to produce a generally sinusoidal waveform that may be easily filtered by low cost filters due to the plural voltage levels to produce a generally smooth sine wave from the converter. Such converters may be used in various environments including in pairs in multi-phase power converters.
    Type: Grant
    Filed: August 15, 2013
    Date of Patent: September 20, 2016
    Assignee: General Electric Company
    Inventors: Robert Gregory Wagoner, Allen Michael Ritter
  • Patent number: 9423534
    Abstract: An optical module is disclosed. The optical module includes: a package substrate; an optical device disposed on the package substrate; a clear mold disposed on the package substrate and the optical device; an light blocking mold disposed on the package substrate, surrounding an optical device on the package substrate, and having an opening above the optical device; and a flexible buffer layer disposed on the light blocking mold. The light blocking mold and the flexible buffer layer are integrally formed of light blocking materials different from each other. An optical module including a plurality of optical devices is also disclosed.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: August 23, 2016
    Assignee: VISHAY CAPELLA MICROSYSTEMS (TAIWAN) LIMITED
    Inventors: Cheng-Chung Shih, Yung-Chuan Chuang, Feng-Gang Shiue
  • Patent number: 9406603
    Abstract: A semiconductor device is disclosed in which an implant board and a semiconductor element of a semiconductor mounting board are bonded and electrically connected through implant pins and which can be manufactured with high productivity. Implant pins are bonded to a semiconductor element and/or a circuit pattern of a semiconductor mounting board through cylindrical terminals press-fitted into the other ends of the implant pins. Press-fitting depth L2 of each of the implant pins into corresponding cylindrical terminals is adjustable, so that total length of the implant pin and cylindrical terminal which are press-fitted to each other matches up with the distance between the semiconductor element and/or the circuit pattern on the semiconductor mounting board and an implant board.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: August 2, 2016
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Tatsuo Nishizawa, Shinji Tada, Yoshito Kinoshita, Yoshinari Ikeda, Eiji Mochizuki
  • Patent number: 9391000
    Abstract: A method includes forming a first oxide layer on a surface of an integrated heat spreader, and forming a second oxide layer on top surfaces of fins, wherein the fins are parts of a heat sink. The integrated heat spreader is bonded to the heat sink through the bonding of the first oxide layer to the second oxide layer.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: July 12, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chieh Hsieh, Jing-Cheng Lin
  • Patent number: 9291404
    Abstract: The cooling device comprises a heat exchange unit provided in a cooling water flow path. The heat exchange unit has a plate part in the form of a plate and multiple fins erected on the plate face of the plate part, and provided in the manner that the plate face of the plate part extends along the cooling water flow path and the cooling water runs through the space between the fins. The multiple fins are each in the form of a rhombic column and provided on the plate part in a lattice pattern in the manner that the longer diagonal of the rhombic column extends along the cooling water flow path.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: March 22, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Masayoshi Tamura, Seiji Haga, Yosuke Kikuchi
  • Patent number: 9281261
    Abstract: An integrated circuit (IC) stack device for thermal management is disclosed. The IC stack device can include a primary IC having a first set of cores with a ratio of first enabled cores and first disabled cores. The IC stack device can also have a supplementary IC interfaced with the primary IC, and having a second set of cores with a second ratio of second enabled cores and second disabled cores, with the second ratio being less than the first ratio. The integrated circuit stack device can also include a cooling element located such that the primary integrated circuit is between the cooling element and the supplementary integrated circuit. The cooling element can be designed to facilitate heat dissipation of the first and second enabled cores of the primary integrated circuit and the supplementary integrated circuit.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: March 8, 2016
    Assignee: International Business Machines Corporation
    Inventors: Gerald K. Bartley, Darryl J. Becker, Philip R. Germann, William P. Hovis
  • Patent number: 9265144
    Abstract: A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: February 16, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masanori Minamio, Hiroki Ikeuchi
  • Patent number: 9263366
    Abstract: A semiconductor assembly for use with forced liquid and gas cooling. A relatively rigid nano-structure (for example, array of elongated nanowires) extends from an interior surface of a cap toward a top surface of a semiconductor chip, but, because of the rigidness and structural integrity of the nano-structure built into the cap, and of the cap itself, the nano-structure is reliably spaced apart from the top surface of the chip, which helps allow for appropriate cooling fluid flows. The cap piece and nano-structures built into the cap may be made of silicon or silicon compounds.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: February 16, 2016
    Assignee: International Business Machines Corporation
    Inventors: Wei Lin, Son V. Nguyen, Spyridon Skordas, Tuan A. Vo