Abstract: The present disclosure is directed to a thermal unit for a device for thermal cycling, also referred to as thermocycling, of a plurality of biological samples simultaneously, to such device itself, and also to a method for thermal cycling a plurality of biological samples simultaneously using such device and thermal unit.

Abstract: An electrical assembly that includes a semiconductor die, a heat sink and a case. The semiconductor die includes a power semiconductor device with a plurality of terminals, and a plurality of electrically conductive leads. Each of the electrically conductive leads is electrically coupled to an associated one of the terminals on the power semiconductor device. The heat sink has a base, a mount, and a plurality of fins. The mount extends from a first side of the base and is coupled to the semiconductor die. The fins are fixedly coupled to the base and extend from a second side of the base that is opposite the first side of the base. The case is formed of a first electrically insulating material. A first one of the leads is integrally and unitarily formed with the mount.

Abstract: A microfluidic device having a channel within a first material to thermally couple with an IC die. The channel defines an initial fluid path between a fluid inlet port and a fluid outlet port. A second material is within a portion of the channel. The second material supplements the first material to modify the initial fluid path into a final fluid path between the fluid inlet port and the fluid outlet port. The second material may have a different composition and/or microstructure than the first material.

Abstract: A heat dissipation module, including a fan and a heat dissipation fin set, is provided. The fan has an air outlet side and an air inlet side opposite to each other. The heat dissipation fin set is configured at the air outlet side and includes a base, first heat dissipation fins, and second heat dissipation fins. The base is divided into a first area and a second area along a direction of a rotation axis of the fan. The first area is located between the air outlet side and the second area. The first heat dissipation fins are connected to the base and located in the first area, and arranged at equal intervals in a configuration direction perpendicular to the direction of the rotation axis. The second heat dissipation fins are connected to the base and located in the second area, and arranged at equal intervals in the configuration direction.

Abstract: This document describes a cooling device for cooling a heatsink having a plurality of cooling fins provided on a heatsink base. The cooling device includes a centrifugal fan having a fan inlet and a fan outlet, a support for mounting the fan above the heatsink, and a baffle locatable between the support and the heatsink base. The baffle defines an inlet pathway for feeding air between the cooling fins over the heatsink base to the fan inlet and an outlet pathway for expelling air from the fan outlet.

Abstract: A liquid-cooling heat dissipation plate with unequal height pin-fins and an enclosed liquid-cooling cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of full-height pin-fins, and a plurality of non-full-height pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that face away from each other, the first heat dissipation surface is configured to be in contact with a plurality of heat sources, and the second heat dissipation surface is configured to be in contact with a cooling fluid. The full-height and non-full-height pin-fins are formed at the second heat dissipation surface of the heat dissipation plate body. A first heat dissipation region to an Nth heat dissipation region are defined on the heat dissipation plate body along a flowing direction of the cooling fluid.

Abstract: A refrigeration system configured to receive a refrigerant is provided, as well as a walk-in refrigeration unit configured to utilize said system. The refrigeration system comprises: a power source, a condenser unit, an evaporation unit, a plurality of compressors, wherein each of the plurality of compressors is communicably coupled to the condenser unit, and a plurality of expansion devices, wherein each of the plurality of expansion devices is communicably coupled to the evaporation unit. The system is configured to receive an A3 refrigerant having a Global Warming Potential (GWP) value less than 10.

Abstract: Various embodiments of the teachings herein include an electronic module comprising: a circuit carrier with an electrically conductive thick film with a thickness of at least 0.5 millimeter; and a plurality of thermally conductive elements connected to one another by a thermally conductive material. The thermally conductive elements have a base area with rotational symmetry.

Abstract: A heatsink can include a body, one or more thermal fin arrays defined by and/or extending from the body, and a phase change material disposed in contact with the one or more fin arrays. The phase change material can be configured to be a first phase in a cool state and a second phase in a heated state. The phase change material is configured to be cooled back to the solid state.

Abstract: Not only cooling performance for an integrated circuit such as a central processing unit (CPU) but also cooling performance for a power supply unit is improved. An electronic apparatus includes a first heat sink and a power supply unit including a power supply unit case having an intake air wall in which a plurality of air intake holes are formed. The intake air wall is located in front of the first heat sink. The intake air wall has an external surface being inclined with respect to both a front-rear direction and a left-right direction and facing the first heat sink. A cooling fan is disposed to feed air toward the intake air wall.

Abstract: A heat sink comprises a first portion and a second portion. The first portion is configured to contact a heat-generating electronic component. The first portion is formed from a first group of materials and has a first plurality of fins. The second portion is coupled to the first portion. The second portion is formed from a second group of materials and has a second plurality of fins. The second group of materials is different than the first group of materials. The first group of materials can include extruded aluminum, stamped aluminum, or both. The second group of materials can include die-cast metal. The first plurality of fins can have a smaller fin pitch than the second plurality of fins. The heat sink can further comprise a third portion coupled to the first portion, such that the first portion is positioned between the second portion and the third portion.

Abstract: An electronic device includes a heat generator including at least an electronic component generating heat, a case dissipating heat from the heat generator, a heat conductive member conducting heat of the heat generator to a heat dissipation member, and a metal bonding layer interposing between the heat generator and the heat conductive member and including at least a first bonding layer using gold or gold alloy as a constituting material. Thickness of the metal bonding layer is smaller than flatness of a bonding region which is bonded to a metal bonding layer on a facing surface of the heat generator and a facing surface of the heat conductive member. The heat conductive member has flexibility, is joined to the heat generator via the metal bonding layer, and is in contact with the case.

Abstract: A system including at least one heat-generating structure and a cooling system is described. The cooling system includes a cooling element and an exhaust system. The cooling element is in communication with a fluid and is configured to direct the fluid toward the heat-generating structure(s) using vibrational motion. The exhaust system is configured to direct fluid away from the heat-generating structure to extract the heat and/or to draw the fluid toward the cooling element.

Abstract: In one example, a semiconductor device includes a substrate having a top side and a conductor on the top side of the substrate, an electronic device on the top side of the substrate connected to the conductor on the top side of the substrate via an internal interconnect, a lid covering a top side of the electronic device, and a thermal material between the top side of the electronic device and the lid, wherein the lid has a through-hole. Other examples and related methods are also disclosed herein.

Abstract: A heat sink includes a heat conduction portion and a heat dissipation portion. The heat conduction portion is a flat plate with two main surfaces parallel with each other and a plurality of side surfaces. One of the two main surfaces is a contacting surface contacting a heat source. The heat dissipation portion is extended outward from at least one of the plurality of side surfaces of the heat conduction portion. The heat dissipation portion includes a plurality of first branches and a plurality of second branches. Each of the first branches is a flat plate and has two opposite main surfaces and four side surfaces. The two opposite main surfaces of each of the first branches are parallel to the two main surfaces of the heat conduction portion. The second branches are extended from the first branches and parallel to the heat conduction portion.

Abstract: A cooling device for dissipating heat from an object. The cooling device comprises a base part arranged for contact with the object, and fins attached to and protruding from the base part in a direction substantially away from the object when in use. The fins are arranged in a first configuration adapted for heat dissipation by natural convection of air and in a second configuration adapted for heat dissipation by forced convection of ambient air movement such as wind. Thereby, the cooling device can provide ample or at least adequate cooling effect on the object both when there is more or less ambient air movement chiefly using the second configuration, and when the ambient air is not moving chiefly using the first configuration.

Abstract: A cooling system is described. The cooling system includes a bottom plate, a support structure, and a cooling element. The bottom plate has orifices therein. The cooling element has a central axis and is supported by the support structure at the central axis. A first portion of the cooling element is on a first side of the central axis and a second portion of the cooling element is on a second side of the central axis opposite to the first side. The first and second portions of the cooling element are unpinned. The first portion and the second portion are configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The support structure couples the cooling element to the bottom plate. At least one of the support structure is an adhesive support structure or the support structure undergoes rotational motion in response to the vibrational motion.

Abstract: A heat dissipation device includes at least a temperature plate and a cooling fin assembly. The temperature plate includes a plate body and a supporter. The plate body includes a vacuum chamber and a first external surface. The plate body is bent to form at least a bent portion with the first external surface being a compressive side, and the supporter is disposed at the bent portion. The supporter is disposed inside the vacuum chamber and connected to an inner wall of the vacuum chamber. The cooling fin assembly is disposed on the first external surface.

Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.

Abstract: A refrigeration system configured to receive a refrigerant is provided, as well as a walk-in refrigeration unit configured to utilize said system. The refrigeration system comprises: a power source, a condenser unit, an evaporation unit, a plurality of compressors, wherein each of the plurality of compressors is communicably coupled to the condenser unit, and a plurality of expansion devices, wherein each of the plurality of expansion devices is communicably coupled to the evaporation unit. The system is configured to receive an A3 refrigerant having a Global Warming Potential (GWP) value less than 10.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises an interposer, a first die attached to the interposer, and a second die attached to the interposer. In an embodiment, the electronic package further comprises a heatsink thermally coupled to the first die and the second die. In an embodiment, the heatsink has a first surface facing away from the first die and the second die and a second surface facing the first die and the second die. In an embodiment, the heatsink comprises a thermal break between the first die and the second die.

Abstract: A cooling device includes a heat-receiving block, a heat conductor, and first heat pipes. The heat-receiving block has a first main surface to which a heating element is fixed. The heat conductor extends along the first main surface and is fixed to the heat-receiving block. The first heat pipes are arranged in a direction in which the heat conductor extends and are fixed to the heat-receiving block at positions farther from the first main surface than the heat conductor is.

Abstract: A heat dissipation system of a portable electronic device is provided. The heat dissipation system includes a body and at least one fan. A heat source of the portable electronic device is disposed in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet, at least one flow outlet, and at least one spacing portion. The flow outlet faces toward the heat source, and the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body.

Abstract: Systems and methods that may be implemented to provide supplemental cooling air for a portable information handling system from one or more mechanically-adjustable cooling air supply outlets that may be positioned and/or repositioned at multiple different locations relative to a portable information handling system, such as notebook computer or laptop computer. In one example, the disclosed systems and methods may be implemented to have one or more mechanically-adjustable cooling air supply outlets that may be positioned and/or repositioned to align with differing geometries of cooling air inlet opening locations that correspond to different portable information handling system sizes and/or designs.

Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.

Abstract: A fast heat-sinking device for evaporators according to the present invention is disclosed, comprising at least one heat-sinking component which is formed by means of conjunctively assembling an outer wall board and an inner wall board; the interior of the outer wall board includes a semi-open first evaporation area; the interior of the inner wall board includes a semi-open second evaporation area, and the inner wall board is concavely configured with a gap; as such, the inner wall board is attached onto one side of the outer wall board thus further being assembled into the heat-sinking component, and the first evaporation area and the second evaporation area are connected in communication at the notch so as to together form an air concentration area, as a heat-sinking structure of the evaporator.

Abstract: Systems, methods, and computer-readable media are disclosed. An example coolant system can be configured in an autonomous vehicle. The system can include a first coolant loop configured with a first series of coolant hoses to communicate a first volume of coolant fluid between a first reservoir, a first coolant pump, a three-way heat exchanger, and a computer system heat exchanger and a second coolant loop configured with a second series of coolant hoses to communicate a second volume of coolant fluid between a second reservoir, a second coolant pump, the three way heat exchanger, and the computer system heat exchanger. The system can further include a third coolant loop configured with a third series of coolant hoses to communicate third volume of coolant fluid between the three-way heat exchanger and an engine heat exchanger of the vehicle.

Abstract: A heat dissipation apparatus, a remote radio unit, a baseband processing unit and a base station are disclosed. According to an embodiment, the heat dissipation apparatus comprises a base and a plurality of first heat sink fins arranged in parallel on the base. On a top of each first heat sink fin of the plurality of first heat sink fins, a first heat dissipation component and a second heat dissipation component are sequentially arranged along the parallel direction of the plurality of first heat sink fins. The first heat dissipation component comprises a bottom plate and a plurality of second heat sink fins which are arranged at intervals along the parallel direction on a top face of the bottom plate. Each second heat sink fin has a shape of a comb having three or more comb teeth.

Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

Abstract: A heat exchanger system is provided and includes a heat sink, fins arrayed on a central region of the heat sink to form channels between adjacent fins and an integrated blower. Each of the fins extends radially outwardly from the central region and has a height that increases with increasing distance from the central region. The integrated blower is disposed at the central region to generate flows of coolant directed into and through the channels.

Abstract: A receptacle assembly includes a heat sink assembly for a receptacle cage for dissipating heat from a pluggable module plugged into the receptacle cage. The heat sink assembly includes fin plates and spacer plates arranged in a plate stack independently movable for engaging and conforming to the pluggable module. Each spacer plate includes a thermal interface at a bottom of the spacer plate engaging the pluggable module. Each fin plate includes a thermal interface at a bottom of the fin plate engaging the pluggable module. The fin plates include branched fin plates and unbranched fin plates. Each of the unbranched fin plates are planar between the bottom and the distal end thereof. Each of the branched fin plates are non-planar and include at least one bend between the bottom and the distal end thereof.

Abstract: A power electronics unit may include a circuit board and a cooling device. The circuit board may include at least one electronic component which, in a heat transfer region, is disposed flat against an electronics side of the circuit board. The cooling device may include at least one impingement jet chamber through which a cooling fluid is flowable from an inlet to an outlet. The cooling device may further include at least one nozzle plate having at least one flow nozzle. The at least one nozzle plate may be arranged in and divide the at least one impingement jet chamber into an inlet chamber and an outlet chamber, which may be fluidically connected to one another via the at least one flow nozzle. The at least one flow nozzle may accelerate and conduct the cooling fluid towards the heat transfer region of the at least one electronic component.

Abstract: A heat dissipation device, a heat dissipating method, and a terminal are described. In an embodiment, the heat dissipation device, a heat dissipating method, and a terminal are configured to correspondingly form at least one ventilation wall that is configured to dissipate heat on different heat source positions of the terminal, and form a flow path of the heat dissipation airflow generated by the at least one ventilation wall, based on different heat source positions of the terminal in different applications. In an embodiment, the entire heat dissipation of the terminal can be achieved by the flexible and variable flow path to provide a good user experience.

Abstract: A clamp configured to be coupled to a printed circuit board to cool and compress one or more electrical connections subject to repeated power and thermal cycling. A first conductive column of the clamp is configured to compress a first electrical connection between a first power device lead and a first printed circuit board trace of the printed circuit board, and draw thermal energy away from the first power device lead. The first conductive column extends from a load spreading plate. The load spreading plate is an insulator that electrically isolates a fastener extending therefrom from the first conductive column. The fastener is configured to cooperate with the circuit board to connect the clamp to the circuit board, compress the load spreading plate against the first conductive column to compress the first electrical connection, and connect the clamp to ground.

Abstract: An information handling system includes a printed circuit board (PCB), a barrier frame, thermal potting material that fills the barrier frame, and a heat removing structure embedded into the thermal potting material. The barrier frame encloses a first device, and extends to also enclose a second location of the PCB. The thermal potting material surrounds the first device. The heat removing structure includes a first pad co-located with the first device, a second pad co-located with the second location, and a thermally conductive connection between the first pad and the second pad. The heat removing structure may remove heat generated by the first device to the second pad.

Abstract: There is provided a semiconductor module including: a base for semiconductor cooling; a stacked substrate provided above the base; a semiconductor chip provided above the stacked substrate; a coating layer provided on an upper surface of the semiconductor chip; and a sealing resin for sealing the semiconductor chip, in which the base is in contact with the sealing resin.

Abstract: A heat transfer device for thermal coupling of a component to be soldered with a heat source or a heat sink in a soldering machine includes a heat source or a heat sink, and at least one base plate, said base plate being in thermally conductive contact at least with the heat source or the heat sink, said base plate comprising at least two contact units having respective contact surfaces, said contact surfaces being thermally contactable to the component, said contact units being designed in such a way that relative distances between the contact surfaces and the surface of the base plate facing the component are changeable.

Abstract: In an example, a composite thermal interface object includes a first layer including a first thermal interface material that has first compliance characteristics. The first layer includes first graphite fibers, and the first graphite fibers are aligned in a direction that is substantially orthogonal to a surface of the first layer. The composite thermal interface object further includes a second layer including a second thermal interface material that has second compliance characteristics that are different from the first compliance characteristics.

Abstract: A device includes a hybrid heat sink, and a heat generation component. The hybrid heat sink is attached to the heat generation component. The hybrid heat sink includes a front plate and a rear plate. The front plate is connected to the rear plate by a wall. The front plate includes fins extending away from the front plate and toward the rear plate.

Abstract: A high-frequency module 1a includes: a circuit board 2; a first component 3a, which has characteristics likely to be changed by heat, and a second component 3b, which generates heat, that are mounted on an upper surface 20a of the circuit board 2; a sealing resin layer 4 configured to cover each of the components 3a and 3b and a component 3c; a shield film 5 configured to cover a surface of the sealing resin layer 4; and a heat dissipation member 6 disposed above an upper surface 4a of the sealing resin layer 4. A recessed portion 11 is formed in the upper surface 4a of the sealing resin layer 4 as viewed in a direction perpendicular to the upper surface 20a of the circuit board 2. The recessed portion 11 can prevent the heat generated from the second component 3b from affecting the first component 3a.

Abstract: A heat exchanger can include a cooling air conduit having at least one baffle, as well as a hot air conduit having at least two passes through the cooling air conduit. The heat exchanger can further include at least one perforation extending into the least one baffle. The perforation can have a passage connecting an inlet to an outlet.

Abstract: An electronic device with heat sink is provided. The heat sink includes a base and fins. One side of the base has a first placement plane and a second placement plane. The electronic device includes a circuit board, a power module and transistors. The power module includes a power body and soldering legs, and the power body is attached to the first placement plane. The transistor has a transistor body and pins, and the transistor body is attached to the second placement plane. The circuit board is disposed at one side of the base formed with the first placement plane, and soldering legs of the power module and pins of the transistor are inserted on the circuit board. Thereby the heat sinks and the space which the circuit board occupied will be reduced for increasing the power density of the heat sink.

Abstract: A contactor assembly post is provided. The contactor assembly post includes a first portion electrically connected to an external bus bar at an exterior of an electrical contactor housing, a second portion electrically connected to an internal bus bar at the exterior of the electrical contactor housing, a third portion and fins. The internal bus bar is configured to extend into an interior of the electrical contactor housing to be electrically coupled to another internal bus bar. The third portion extends transversely between the first and second portions. The fins extend transversely from multiple points defined along a longitudinal axis of the third portion.

Abstract: A heat dissipating assembly including a layered stack of materials with a highly thermally conductive path for cooling a circuit, the stack including a structurally isolated material having a high coefficient of thermal expansion connected between materials having low coefficients of thermal expansion.

Abstract: An information handling system (IHS) includes a heatsink retention apparatus. A processor mounted on a board receives a heatsink base having peripheral, spaced apertures. At least two latching mechanisms include a mounting portion received respectively in peripheral, spaced apertures on opposites sides of the heatsink base. A latching surface is mounted to one of (i) the heatsink base and (ii) a terminal portion of the mounting portion to engage respectively with either the mounting portion or an upper edge of the corresponding peripheral, spaced aperture of the heatsink base. At least two peripheral, spaced loading screws are sized to be engageable by loading nuts when the heatsink base is positioned not higher than the engagement height. The engaged, at least two, latching mechanisms prevent tipping of the heatsink base during loading of the at least two peripheral, spaced loading screws with the at least two spaced apart loading nuts.

Abstract: A light source module comprising a semiconductor light source mounted directly to a conducting trace of a multilayer printed circuit board having a core comprising a plurality of core layers electrically and thermally coupled by a plurality of buried vias wherein at least one of the core layers comprises a heat sink plane.

Abstract: An apparatus is provided which comprises: a first heat spreader surface, a second heat spreader surface, and a plurality of heat spreading fins on, and extending substantially perpendicularly from, the first and second heat spreader surfaces, wherein the plurality of heat spreading fins are arranged substantially parallel to one another in a plurality of substantially linear columns, wherein the columns of heat spreading fins are separated by gap regions wider than the heat spreading fins, and wherein the columns of heat spreading fins on the first heat spreader surface are sited to line up with gap regions between columns of heat spreading fins on the second heat spreader surface when the first and second heat spreader surfaces are aligned. Other embodiments are also disclosed and claimed.

Abstract: An electronic device has a substrate, a heat sink, and a heat conductive material. The substrate has a first surface on which an electronic part is arranged. The heat sink has (i) a second surface facing the first surface and distanced from the electronic part and (ii) an annular groove extending annularly and defining an area that is circled by the annular groove on the second surface and faces the electronic part. The heat conductive material is arranged between the first surface and the second surface to be in contact with the electronic part and the annular groove. The heat conductive material guides heat generated by the electronic part to the heat sink.

Abstract: An exemplary cooling system includes a heat transfer device having a base and a plurality of curved fins defining a curved air flow channel. Air flow is provided through the air flow channel, and a plurality of openings through a fin communicate air flow from a first side to a second side of the curved fin.

Abstract: An object of the present invention is to achieve both low height and miniaturization of a double side cooling type electric power conversion device.