With Fins Patents (Class 257/722)
  • Patent number: 10674640
    Abstract: An electronic device with heat sink is provided. The heat sink includes a base and fins. One side of the base has a first placement plane and a second placement plane. The electronic device includes a circuit board, a power module and transistors. The power module includes a power body and soldering legs, and the power body is attached to the first placement plane. The transistor has a transistor body and pins, and the transistor body is attached to the second placement plane. The circuit board is disposed at one side of the base formed with the first placement plane, and soldering legs of the power module and pins of the transistor are inserted on the circuit board. Thereby the heat sinks and the space which the circuit board occupied will be reduced for increasing the power density of the heat sink.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: June 2, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chao-Li Kao, Jin-Zhong Huang, Yi-Ping Hsieh, Chang-Ye Li
  • Patent number: 10673211
    Abstract: A contactor assembly post is provided. The contactor assembly post includes a first portion electrically connected to an external bus bar at an exterior of an electrical contactor housing, a second portion electrically connected to an internal bus bar at the exterior of the electrical contactor housing, a third portion and fins. The internal bus bar is configured to extend into an interior of the electrical contactor housing to be electrically coupled to another internal bus bar. The third portion extends transversely between the first and second portions. The fins extend transversely from multiple points defined along a longitudinal axis of the third portion.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: June 2, 2020
    Assignee: HAMILTON SUNSTRAND CORPORATION
    Inventors: Debabrata Pal, Mark Hamilton Severson
  • Patent number: 10622277
    Abstract: A heat dissipating assembly including a layered stack of materials with a highly thermally conductive path for cooling a circuit, the stack including a structurally isolated material having a high coefficient of thermal expansion connected between materials having low coefficients of thermal expansion.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: April 14, 2020
    Assignee: Honeywell Federal Manufacturing & Technologies, LLC
    Inventor: Matthew Johnson
  • Patent number: 10281962
    Abstract: An information handling system (IHS) includes a heatsink retention apparatus. A processor mounted on a board receives a heatsink base having peripheral, spaced apertures. At least two latching mechanisms include a mounting portion received respectively in peripheral, spaced apertures on opposites sides of the heatsink base. A latching surface is mounted to one of (i) the heatsink base and (ii) a terminal portion of the mounting portion to engage respectively with either the mounting portion or an upper edge of the corresponding peripheral, spaced aperture of the heatsink base. At least two peripheral, spaced loading screws are sized to be engageable by loading nuts when the heatsink base is positioned not higher than the engagement height. The engaged, at least two, latching mechanisms prevent tipping of the heatsink base during loading of the at least two peripheral, spaced loading screws with the at least two spaced apart loading nuts.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: May 7, 2019
    Assignee: Dell Products, L.P.
    Inventors: Corey D. Hartman, Lawrence A. Kyle
  • Patent number: 10257932
    Abstract: A light source module comprising a semiconductor light source mounted directly to a conducting trace of a multilayer printed circuit board having a core comprising a plurality of core layers electrically and thermally coupled by a plurality of buried vias wherein at least one of the core layers comprises a heat sink plane.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: April 9, 2019
    Assignee: Microsoft Technology Licensing, LLC.
    Inventors: David Mandelboum, Shlomo Felzenshtein, Boaz Shem-Tov, Raymond Kirk Price, Ravi Kiran Nalla
  • Patent number: 10211124
    Abstract: An apparatus is provided which comprises: a first heat spreader surface, a second heat spreader surface, and a plurality of heat spreading fins on, and extending substantially perpendicularly from, the first and second heat spreader surfaces, wherein the plurality of heat spreading fins are arranged substantially parallel to one another in a plurality of substantially linear columns, wherein the columns of heat spreading fins are separated by gap regions wider than the heat spreading fins, and wherein the columns of heat spreading fins on the first heat spreader surface are sited to line up with gap regions between columns of heat spreading fins on the second heat spreader surface when the first and second heat spreader surfaces are aligned. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: February 19, 2019
    Assignee: Intel Corporation
    Inventor: Douglas Heymann
  • Patent number: 10211707
    Abstract: An electronic device has a substrate, a heat sink, and a heat conductive material. The substrate has a first surface on which an electronic part is arranged. The heat sink has (i) a second surface facing the first surface and distanced from the electronic part and (ii) an annular groove extending annularly and defining an area that is circled by the annular groove on the second surface and faces the electronic part. The heat conductive material is arranged between the first surface and the second surface to be in contact with the electronic part and the annular groove. The heat conductive material guides heat generated by the electronic part to the heat sink.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: February 19, 2019
    Assignee: DENSO CORPORATION
    Inventor: Takahiro Yamanaka
  • Patent number: 10103089
    Abstract: An exemplary cooling system includes a heat transfer device having a base and a plurality of curved fins defining a curved air flow channel. Air flow is provided through the air flow channel, and a plurality of openings through a fin communicate air flow from a first side to a second side of the curved fin.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: October 16, 2018
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Scott F. Kaslusky, Brian St. Rock, John H. Whiton, Vincent C. Nardone
  • Patent number: 10027246
    Abstract: An object of the present invention is to achieve both low height and miniaturization of a double side cooling type electric power conversion device.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: July 17, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Takeshi Tokuyama, Takahiro Shimura, Toshiya Satoh
  • Patent number: 9970648
    Abstract: A light source module includes at least one light source, and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof, the heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer provided on at least one surface of the heat sink, the insulating layer having electrical insulating properties, and a conductive layer provided on the insulating layer. The conductive layer includes connection regions through which electric current is supplied to the light source, and a light source region disposed between the connection regions, the light source region having the light source mounted therein. A protective layer is stacked in the connection region.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: May 15, 2018
    Assignee: LG ELECTRONICS INC.
    Inventors: Jaepyo Hong, Jaechan Kim, Injoong Kim, Hyeuk Chang, Sumin Jun
  • Patent number: 9912107
    Abstract: Plug assembly including a pluggable connector having a mating end and a trailing end and a central axis extending therebetween. The pluggable connector includes internal electronics that generate thermal energy within the pluggable connector. The mating end is configured to engage a data connector. The pluggable connector also includes a thermal interface region that is coupled to the pluggable connector. The thermal interface region includes a series of transfer plates that extend parallel to each other and to the central axis. The transfer plates define a series of plate-receiving slots extending parallel to the central axis. The thermal interface region transfers the thermal energy generated by the internal electronics through the transfer plates.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: March 6, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Alan Weir Bucher
  • Patent number: 9892991
    Abstract: A semiconductor packaging system includes a semiconductor device package having a semiconductor chip with two or more terminals and a protective structure encapsulating and electrically insulating the semiconductor chip. Two or more electrical conductors that are each electrically connected to one of the terminals extend to an outer surface of the protective structure. A first surface feature is on an exterior surface of the semiconductor device package. The system further includes a connectable package extender having a second surface feature configured to interlock with the first surface feature when the first surface feature is mated with the second surface feature so as to secure the package extender to the semiconductor device package. An extension portion adjoins and extends away from the exterior surface of the semiconductor device package when the package extender is secured to the semiconductor device package.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: February 13, 2018
    Assignee: Infineon Technologies AG
    Inventors: Tian San Tan, Theng Chao Long, Ming Kai Benny Goh
  • Patent number: 9851732
    Abstract: Methods and systems for electrical bias generation are disclosed. Two or more different voltage levels can be created, one above a mid-rail value and one below the mid-rail value for each pair of voltage levels. Such voltage levels can be used to power processes in other circuits by providing a safe but adequate voltage value. Transition control between an on state and an off state for a power supply can also be implemented using this bias generation.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: December 26, 2017
    Assignee: Peregrine Semiconductor Corporation
    Inventor: Robert Mark Englekirk
  • Patent number: 9812444
    Abstract: A semiconductor device and method for fabricating such a device are presented. The semiconductor device includes a fin extending away from a substrate, a plurality of epitaxially grown regions disposed along a top surface of the fin, and at least two contacts that provide electrical contact to the fin. The plurality of epitaxially grown regions are arranged to alternate with regions having no epitaxial material grown on the top surface of the fin. A resistance exists between the two contacts that is at least partially based on the arrangement of the plurality of epitaxially grown regions.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: November 7, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Hsin Hu, Hsueh-Shih Fan, Huan-Tsung Huang
  • Patent number: 9786822
    Abstract: A light emitting diode (LED) device and packaging for same is disclosed. In some aspects, the LED is manufactured using a vertical configuration including a plurality of layers. Certain layers act to promote mechanical, electrical, thermal, or optical characteristics of the device. The device avoids design problems, including manufacturing complexities, costs and heat dissipation problems found in conventional LED devices. Some embodiments include a plurality of optically permissive layers, including an optically permissive cover substrate or wafer stacked over a semiconductor LED and positioned using one or more alignment markers.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: October 10, 2017
    Inventor: Mordehai Margalit
  • Patent number: 9761974
    Abstract: A connector is disclosed that includes housing positioned within a cage, the connector having a first port and second port that are vertically spaced apart. A thermal management module is positioned between the two ports. The thermal management module directs thermal energy from one or both ports out a rear wall of the connector. A heat sink can be coupled to the thermal management module to improve thermal dissipation.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: September 12, 2017
    Assignee: Molex, LLC
    Inventors: Frank L'Esperance, Jerry Kachlic
  • Patent number: 9651318
    Abstract: A system and method for cooling heat-producing devices using synthetic jet embedded heat sinks is disclosed. The cooling system includes a heat sink comprising a base portion and a plurality of fins disposed on the base portion and extending vertically out therefrom, the plurality of fins spaced to define a channel between adjacent fins. The cooling system also includes at least one synthetic jet actuator attached to the heat sink, with each of the at least one synthetic jet actuators comprising a plurality of orifices therein and being configured to generate and project a series of fluid vortices out from the plurality of orifices and toward at least a portion of the channels of the heat sink.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: May 16, 2017
    Assignee: General Electric Company
    Inventors: Mehmet Arik, Yogen Vishwas Utturkar, Mustafa Gursoy
  • Patent number: 9464800
    Abstract: A light emitting module includes a light source board having a first surface and a second surface opposing the first surface and extending from one end to the other end, forming a spiral shape; at least one light source disposed on the first surface of the light source board; and a heat dissipation plate disposed on the second surface of the light source board and provided with a contact surface having a spiral shape corresponding to that of the light source board.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: October 11, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Wook Kim, Se Mook Lim, Woo Suck Jang, Myoung Sik Jung
  • Patent number: 9455213
    Abstract: Effective utilization of a parallel flow air-cooled microchannel array at the micro electro mechanical systems (MEMS) scale is prohibited by unfavorable flow patterns in simple rectangular arrays. The primary problem encountered is the inability of the flow stream to penetrate a sufficient depth into the fin core to achieve the desired fin efficiency. Embodiments of the present invention overcome this problem using a manifold with open nozzle discharge and integrated lateral exhaust along with a microchannel array cooler with micro spreading cavities for internal air distribution.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: September 27, 2016
    Assignee: RAYTHEON COMPANY
    Inventor: Scott T. Johnson
  • Patent number: 9447948
    Abstract: The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: September 20, 2016
    Assignee: EPISTAR CORPORATION
    Inventors: Jin-Hua Wang, Hsueh-Hung Fu, Pei-Wen Ko, Chih-Hsuan Sun
  • Patent number: 9316389
    Abstract: A modular LED heat-dissipating device includes an LED circuit board, a heat-conducting adhesive layer, a heat-dissipating structure, and a wire terminal module. The LED light source illuminates by power supplied via the wire terminal module. Heat generated from the LED light source is dissipated by the heat-dissipating structure. This device does not dissipate heat by a lamp housing. So the lamp housing can be made of, but not limited to, plastic, thereby decreasing a production cost of the LED lamp. In addition, the modular LED heat-dissipating device can fit various kinds of lamp housings. When the LED light source breaks down, the modular LED heat-dissipating device and the lamp housing can be easily separated to replace or repair the LED light source.
    Type: Grant
    Filed: August 27, 2014
    Date of Patent: April 19, 2016
    Inventor: Cheng-Feng Huang
  • Patent number: 9282675
    Abstract: A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: March 8, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons, Prabjit Singh
  • Patent number: 9272498
    Abstract: Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: March 1, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Evan George Colgan, Paul W. Coteus, Michael Anthony Gaynes, Kenneth Charles Marston, Steven P. Ostrander
  • Patent number: 9220184
    Abstract: A system includes an electronic device, a heat spreader with a vapor chamber attached to a bottom end of the electronic device, so that heat flows from the electronic device to the heat spreader, and a heat sink with microchannels running through it attached to a bottom end of the heat spreader, so that heat from the heat spreader flows through the heat sink and to an ambient. A method for cooling a device includes transferring heat generated by a device through a conductivity layer, spreading the heat through a heat spreader, transferring the heat from the heat spreader to a heat sink that contains microchannels, and releasing the heat from the heat sink into an ambient.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 22, 2015
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Ram Ranjan, Matthew Robert Pearson, Shashank Krishnamurthy
  • Patent number: 9196604
    Abstract: A power semiconductor module includes a base plate as a metallic heat dissipating body, a first insulating layer on the base plate, and a first wiring pattern on the first insulating layer. On a predetermined region that is a part of the first wiring pattern, a second wiring pattern for a second layer is laminated via only a second insulating layer made of resin, thereby forming a pattern laminated region. A power semiconductor element is mounted in a region other than the pattern laminated region on the first wiring pattern. The base plate, the first insulating layer, the first wiring pattern, the second insulating layer, the second wiring pattern, and the power semiconductor element are integrally sealed with a transfer mold resin, thus obtaining the power semiconductor module.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: November 24, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yoshiko Tamada, Seiji Oka
  • Patent number: 9171769
    Abstract: A semiconductor device has a plurality of semiconductor die mounted active surface to a carrier. An encapsulant is deposited over semiconductor die and carrier. Openings are formed through a surface of the encapsulant to divide the encapsulant into discontinuous segments. The openings have straight or beveled sidewalls. The openings can be formed partially through the surface of the encapsulant in an area between the semiconductor die. The openings can be formed partially through the surface of the encapsulant over the semiconductor die. The openings can be formed through the encapsulant in an area between the semiconductor die. A portion of the surface of the encapsulant is removed down to a bottom of the openings. The carrier is removed. An interconnect structure is formed over the encapsulant and the semiconductor die. The encapsulant is cured prior to or after forming the openings.
    Type: Grant
    Filed: December 6, 2010
    Date of Patent: October 27, 2015
    Assignee: STATS ChipPAC, Ltd.
    Inventors: Seng Guan Chow, Lee Sun Lim, Rui Huang, Xusheng Bao, Ma Phoo Pwint Hlaing
  • Patent number: 9047060
    Abstract: A heating element and circuit module stack structure includes a circuit module carrying a chip unit, a heat sink having a flat bottom block protruded from a thermally conductive base member and in contact with the chip unit, a heat transfer layer set between the thermally conductive base member and the chip unit around the flat bottom block, an electric heating element mounted in between the heat transfer layer and the thermally conductive base member around the flat bottom block for heating the chip unit, and a thermal insulation component isolating the thermally conductive base member from the electric heating element. The circuit module turns on the electrical heating element when the temperature of the chip unit drops blow 0° C., and turns off the electrical heating element when the temperature reaches the normal operating temperature range, enabling the computer to be used in a low temperature or cold outdoor environment.
    Type: Grant
    Filed: August 16, 2013
    Date of Patent: June 2, 2015
    Assignee: Adlink Technology Inc.
    Inventors: Fang-Yu Chiu, Chun-Hung Chou
  • Patent number: 9042100
    Abstract: An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: May 26, 2015
    Assignee: Aavid Thermalloy, LLC
    Inventor: Sukhvinder S. Kang
  • Patent number: 9041196
    Abstract: A semiconductor module arrangement includes a semiconductor module having a top side, an underside opposite the top side, and a plurality of electrical connection contacts formed at the top side. The semiconductor module arrangement additionally includes a printed circuit board, a heat sink having a mounting side, and one or a plurality of fixing elements for fixing the printed circuit board to the heat sink. Either a multiplicity of projections are formed at the underside of the semiconductor module and a multiplicity of receiving regions for receiving the projections are formed at the mounting side of the heat sink, or a multiplicity of projections are formed at the mounting side of the heat sink and a multiplicity of receiving regions for receiving the projections are formed at the underside of the semiconductor module. In any case, each of the projections extends into one of the receiving regions.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: May 26, 2015
    Assignee: Infineon Technologies AG
    Inventor: Reinhold Bayerer
  • Patent number: 9018757
    Abstract: Embodiments of mechanisms for forming a semiconductor die are provided. The semiconductor die includes a semiconductor substrate and a protection layer formed over the semiconductor substrate. The semiconductor die also includes a conductive layer conformally formed over the protection layer, and a recess is formed in the conductive layer. The recess surrounds a region of the conductive layer. The semiconductor die further includes a solder bump formed over the region of the conductive layer surrounded by the recess.
    Type: Grant
    Filed: July 16, 2013
    Date of Patent: April 28, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chung-Hao Tsai, Chuei-Tang Wang, Chen-Hua Yu
  • Patent number: 9013877
    Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: April 21, 2015
    Assignee: Hitachi Power Semiconductor Device, Ltd.
    Inventors: Yu Harubeppu, Takayuki Kushima, Yasuhiro Nemoto, Keisuke Horiuchi, Hisashi Tanie
  • Patent number: 9001513
    Abstract: A semiconductor switch insulation protection device and a power supply assembly. Said semiconductor switch protection device comprises a semiconductor switch having a metal component, an insulation component, and a pin installed at a bottom plane of said insulation component, and an insulation protection cover having a body with a second hole and a side belt. A front surface of said metal component is installed on a back surface of said insulation component. A metal portion, with a first hole and having a first height, is extended above an upper plane of said insulation component. Said second hole and said side belt are extended toward a back surface of said body, respectively, to form a hole column having a second height and a sidewall having a third height. Said metal portion is disposed in a groove formed by said back surface of said body, hole column and sidewall.
    Type: Grant
    Filed: August 14, 2012
    Date of Patent: April 7, 2015
    Assignee: Delta Electronics (Shanghai) Co., Ltd.
    Inventors: Lifeng Pan, Hongming Li
  • Patent number: 8987893
    Abstract: Embodiments of the present disclosure provide an apparatus that comprises a connection circuit situated within a substrate and configured to communicatively couple a first integrated circuit disposed adjacent to a top surface of the apparatus to a second integrated circuit disposed adjacent to a bottom surface of the apparatus. The apparatus further comprises one or more enclosed heat dissipation structures situated within the substrate and configured to convey heat away from the first and second integrated circuits.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: March 24, 2015
    Assignee: Marvell International Ltd.
    Inventors: Sehat Sutardja, Albert Wu
  • Patent number: 8982559
    Abstract: A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: March 17, 2015
    Assignees: Fuchigami Micro Co., Ltd., Kagoshima University
    Inventors: Kenji Ohsawa, Katsuya Tsuruta, Toshiaki Kotani, Kei Mizuta
  • Patent number: 8981444
    Abstract: Novel etch techniques are provided for shaping silicon features below the photolithographic resolution limits. FinFET devices are defined by recessing oxide and exposing a silicon protrusion to an isotropic etch, at least in the channel region. In one implementation, the protrusion is contoured by a dry isotropic etch having excellent selectivity, using a downstream microwave plasma etch.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: March 17, 2015
    Assignee: Round Rock Research, LLC
    Inventors: Kevin J. Torek, Mark Fischer, Robert J. Hanson
  • Patent number: 8932936
    Abstract: A method for fabricating a device is disclosed. An exemplary method includes providing a substrate and forming a plurality of fins over the substrate. The method further includes forming a first opening in the substrate in a first longitudinal direction. The method further includes forming a second opening in the substrate in a second longitudinal direction. The first and second longitudinal directions are different. The method further includes depositing a filling material in the first and second openings.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: January 13, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Chu Liu, Kuei-Shun Chen, Chih-Hsiung Peng, Chi-Kang Chang, Chiang Mu-Chi, Sheng-Yu Chang, Hua Feng Chen, Chao-Cheng Chen, Ryan Chia-Jen Chen
  • Patent number: 8933557
    Abstract: A semiconductor module including a cooling unit by which a fine cooling effect is obtained is provided. A plurality of cooling flow paths (21c) which communicate with both of a refrigerant introduction flow path which extends from a refrigerant introduction inlet and a refrigerant discharge flow path which extends to a refrigerant discharge outlet are arranged in parallel with one another in a cooling unit (20). Fins (22) are arranged in each cooling flow path (21c). Semiconductor elements (32) and (33) are arranged over the cooling unit (20) so that the semiconductor elements (32) and (33) are thermally connected to the fins (22). By doing so, a semiconductor module (10) is formed. Heat generated by the semiconductor elements (32) and (33) is conducted to the fins (22) arranged in each cooling flow path (21c) and is removed by a refrigerant which flows along each cooling flow path (21c).
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: January 13, 2015
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Hiromichi Gohara, Akira Morozumi, Keiichi Higuchi
  • Patent number: 8912603
    Abstract: A method of fabricating a semiconductor device is provided. The method forms a fin arrangement on a semiconductor substrate, the fin arrangement comprising one or more semiconductor fin structures. The method continues by forming a gate arrangement overlying the fin arrangement, where the gate arrangement includes one or more adjacent gate structures. The method proceeds by forming an outer spacer around sidewalls of each gate structure. The fin arrangement is then selectively etched, using the gate structure and the outer spacer(s) as an etch mask, resulting in one or more semiconductor fin sections underlying the gate structure(s). The method continues by forming a stress/strain inducing material adjacent sidewalls of the one or more semiconductor fin sections.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: December 16, 2014
    Assignee: GLOBALFOUNDRIES, Inc.
    Inventors: Scott Luning, Frank Scott Johnson
  • Patent number: 8913389
    Abstract: Disclosed is a heat radiation device, which is in contact with a first heat-producing component having a higher value of guaranteed temperature and a second heat-producing component having a lower value of guaranteed temperature, and the heat radiation device comprises a metal member provided with a slit. The metal member is divided by the slit to have two heat radiation regions, a first heat radiation region and a second heat radiation region that are loosely coupled with each other in terms of heat conduction. The first heat-producing component is placed in contact with the first heat radiation region, and the second heat-producing component is placed in contact with the second heat radiation region.
    Type: Grant
    Filed: February 3, 2011
    Date of Patent: December 16, 2014
    Assignee: Panasonic Corporation
    Inventors: Yasuhito Fukui, Takashi Sawa, Shinichi Shinohara
  • Patent number: 8912645
    Abstract: A semiconductor element cooling structure includes a side wall provided on a downstream side of flow of cooling air in a cooling air passage, a plurality of cooling fins forming cooling air branch passages, and a plurality of cooling fins forming cooling air branch passages. The cooling fins each have an end portion at a tip extending toward the cooling air passage. A virtual line obtained by connecting the end portions of the plurality of cooling fins and a virtual line obtained by connecting the end portions of the plurality of cooling fins each have a gradient with respect to a direction of the flow of the cooling air in the cooling air passage which is greater on an upstream side of the flow of the cooling air in the cooling air passage than on the downstream side thereof.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: December 16, 2014
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Hiroto Kusaka
  • Patent number: 8902581
    Abstract: A notebook computer is provided with: a casing in which electronic components including a CPU are accommodated; and a heat-dissipating unit including a heat-dissipating component 37 having plural fins, and a fan 31 for supplying air to the heat-dissipating component 37. A communicating path 35 is formed between an air outlet 32b of the fan 31 and a surface 37b of the heat-dissipating component 37 on a side thereof that opposes the fan 31, so as to communicate them. An opening 32c is formed in a fan case 32 between the air outlet 32b and a main unit 33 of the fan. A duct 36 is provided so as to communicate the opening 32c with the heat-dissipating component 37. With this structure, an electronic device can be provided which has a built-in heat-dissipating unit that can restrain increase in cost and weight, and remove dust on the heat-dissipating component.
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: December 2, 2014
    Assignee: Panasonic Corporation
    Inventors: Shinji Goto, Kazuhiro Shiraga, Naoyuki Ito
  • Patent number: 8891241
    Abstract: An electronic assembly includes a heat generating element, a heat dissipation fin set and a filter circuit board. The filter circuit board is disposed between the heat generating element and the heat dissipation fin set. The filter circuit board includes a metal layer, an electromagnetic band gap structure layer, an insulation layer disposed between the metal layer and the electromagnetic band gap structure layer and plural first thermal vias. The heat dissipation fin set is disposed on the heat generating element and directly contacts the metal layer. The electromagnetic band gap structure layer has plural conductive patterns arranged in the same pitches. The heat generating element directly contacts at least one of the conductive patterns. The first thermal vias pass through the insulation layer, the metal layer and the conductive patterns. Two ends of each first thermal via respectively connect the metal layer and the corresponding conductive pattern.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: November 18, 2014
    Assignee: Tatung Company
    Inventors: Shih-Chieh Chao, Chih-Wen Huang
  • Patent number: 8860213
    Abstract: A power converter including: a plurality of semiconductor devices forming a power conversion circuit; a base section to which the plurality of semiconductor devices are attached; and radiating fins dissipating heat generated from the semiconductor devices into outside air, in the power converter in which the direction of the flow of a refrigerant flowing into the radiating fins changes depending on the operation status of the power conversion circuit, the shape of each radiating fin changes in such a way that the cross-sectional area of a channel of the refrigerant on the outflow side becomes smaller than the cross-sectional area of the channel of the refrigerant on the inflow side in the radiating fins depending on the direction of the flow of the refrigerant.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: October 14, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Tsutomu Kominami, Mami Kunihiro, Katsumi Ishikawa, Yosuke Yasuda, Sunao Funakoshi
  • Patent number: 8860209
    Abstract: Disclosed is a luminaire, comprising a front convective heat sink, a rear convective heat sink, and a removable thin printed circuit board. The front convective heat sink has at least one optical aperture. The removable thin printed circuit board has an electrically-insulated back surface and a selectively electrically-insulated front surface. The front surface has exposed electrical contacts in at least one area corresponding to the at least one optical aperture. The removable thin printed circuit board is sandwiched between the front and rear convective heat sinks with a compressive force.
    Type: Grant
    Filed: August 13, 2011
    Date of Patent: October 14, 2014
    Assignee: NuLEDs, Inc.
    Inventor: Chris Isaacson
  • Patent number: 8854807
    Abstract: A converter arrangement includes a housing having a first cooling air channel, at least one capacitor disposed in the housing, a fan for generating a cooling air flow, and a first power electronics module disposed in the housing between the at least one capacitor and the fan, as viewed in a direction of the cooling air flow. The first power electronics module is positioned in relation to the fan so as to only be cooled by a first partial air flow. A second partial air flow provided for cooling the at least one capacitor is routed via the first cooling air channel past the first power electronics module such that the second partial air flow is thermally separated from the first power electronics module.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: October 7, 2014
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ingolf Hoffmann, Wolfgang Lottes
  • Patent number: 8846477
    Abstract: One illustrative method disclosed herein includes forming a sacrificial gate structure above a fin, wherein the sacrificial gate structure is comprised of a sacrificial gate insulation layer, a layer of insulating material, a sacrificial gate electrode layer and a gate cap layer, forming a sidewall spacer adjacent opposite sides of the sacrificial gate structure, removing the sacrificial gate structure to thereby define a gate cavity that exposes a portion of the fin, and forming a replacement gate structure in the gate cavity. One illustrative device disclosed herein includes a plurality of fin structures that are separated by a trench formed in a substrate, a local isolation material positioned within the trench, a gate structure positioned around portions of the fin structures and above the local isolation material and an etch stop layer positioned between the gate structure and the local isolation material within the trench.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: September 30, 2014
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Xiuyu Cai, Ruilong Xie
  • Patent number: 8837139
    Abstract: A flat radiator with flat type heat pipe and its application for portable computers is provided. The heat pipe in a radiator use tubular type and plate type structures. An air convective extended heat exchange surface surrounds and is over against the fan impeller, such that the radiator is extremely compacted, and the heat transport distance in heat pipe is shortened. Further introducing enhanced convective heat transfer structure and setting the fins according to the aerodynamics improve the heat dissipating capacity. The restrictions to a radiator when installing are reduced, which helps to implement the standardization of the radiator series. Also portable computers using the radiator are provided.
    Type: Grant
    Filed: July 28, 2008
    Date of Patent: September 16, 2014
    Inventor: Biao Qin
  • Patent number: 8836092
    Abstract: A lead frame for assembling a semiconductor device has a die pad surrounded by lead fingers. Each of the lead fingers has a proximal end close to but spaced from an edge of the die pad and a distal end farther from the die pad. A semiconductor die is attached to a surface of the die pad. The die has die bonding pads on its upper surface that are electrically connected to the proximal ends of the lead fingers with bond wires. An encapsulation material covers the bond wires, semiconductor die and the proximal ends of the lead fingers. Prior to assembly, hot spots of the die are determined and the lead fingers closest to the hot spots are selected to project closer to the die than the other lead fingers. These longer lead fingers assist in dissipating the heat at the die hot spot.
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: September 16, 2014
    Assignee: FreeScale Semiconductor, Inc.
    Inventors: Chetan Verma, Piyush Kumar Mishra, Cheong Chiang Ng
  • Patent number: 8816496
    Abstract: Electronic assemblies and methods are described. One embodiment includes a circuit board and a socket coupled to the circuit board. The assembly also includes a package positioned in the socket, the package including a substrate, a die, and a heat spreader, the die positioned between the substrate and the heat spreader. The assembly also includes a load plate positioned on the heat spreader, the load plate covering a majority of the heat spreader, the load plate applying a force to the heat spreader that couples the package to the socket. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: August 26, 2014
    Assignee: Intel Corporation
    Inventors: Ted Lee, Tejinder Pal S. Aulakh
  • Patent number: 8789578
    Abstract: A cooling structure for an electric device includes a plurality of cooling medium paths (724) through which a cooling medium for an inverter flows, an inlet (722) into which the cooling medium to be supplied to the plurality of cooling medium paths (724) flows, and a wall (726) provided between the inlet (722) and the plurality of cooling medium paths (724) to promote distribution of the cooling medium to each of the cooling medium paths (724).
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: July 29, 2014
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Ken Asakura