Abstract: A compound closed-type metal lid for a semiconductor chip package is provided. The compound closed-type metal lid includes a cover plate, and a frame bottom board. The cover plate has a frame body, and a plurality of riveting holes. The riveting holes penetrate through the frame body and are distributed symmetrically on the frame body. The frame bottom board has a frame body, a plurality of riveting protrusions, and an opening. The riveting protrusions are distributed on an upper surface of the frame body. The cover plate is disposed on an upper surface of the frame bottom board. The riveting protrusions are correspondingly riveted in the riveting holes.

Abstract: A method includes providing a substrate having substrate terminals and providing a first component having a first terminal and a second terminal. The method includes providing a clip structure having a first clip, a second clip, and a clip connector coupling the first clip to the second clip. The method includes coupling the first clip to the first terminal and a substrate terminal and coupling the second clip to another substrate terminal. The method includes encapsulating the structure and removing a portion of the clip connector. In some examples, the first portion of the clip connector includes a first portion surface, the second portion of the clip connector includes a second portion surface, and the first portion surface and the second portion surface are exposed from a top side of the encapsulant. Other examples and related structures are also disclosed herein.

Abstract: In one example, a method of manufacturing a semiconductor device includes providing a substrate having substrate terminals and providing a component having a first component terminal and a second component terminal adjacent to a first major side of the component. The method includes providing a clip structure having a first clip, a second clip, and a clip connector coupling the first clip to the second clip. The method includes coupling the first clip to the first component terminal and a first substrate terminal and coupling the second clip to a second substrate terminal. The method includes encapsulating the component, portions of the substrate, and portions of the clip structure. the method includes removing a sacrificial portion of the clip connector while leaving a first portion of the clip connector attached to the first clip and leaving a second portion of the clip connector attached to the second clip.

Abstract: An integrated circuit package includes a transmission line structure, wire bonds, a first post and a second post. The transmission line structure runs from a printed circuit board (PCB) to an integrated circuit (IC) and includes a center transmission line between two ground lines and sealed from exposure to air. The wire bonds connect the transmission line structure to pads on the integrated circuit from where the center transmission line exits the integrated circuit package. The wire bonds are selected to have an impedance matched to impedance of the integrated circuit. The first post supports the center transmission line where the center transmission line enters the integrated circuit package from the printed circuit board. The second post supports the center transmission line where the center transmission line exits the integrated circuit package to connect to the wire bonds.

Abstract: A semiconductor device includes a semiconductor element having an electrode, material of which is first metal, a lead frame through which a plurality of holes extend with an outer contour of the electrode being avoided in a first portion, and having the first portion, material of which is second metal, a bonding layer interposed between the first portion and the electrode, and solder being inside the plurality of holes and adjoining the bonding layer, the solder being thicker than the bonding layer. The plurality of holes have a plurality of first holes extending through the first portion in a thickness direction of the first portion. The bonding layer has a first bonding layer located on the electrode side and being an alloy of the first metal and tin, and a second bonding layer located on the first portion side and being an alloy of the second metal and tin. The plurality of first holes are located in an annular region inside the outer contour of the electrode.

Abstract: A liquid cooling jacket with first and second heat receivers and a biasing spring. The first heat receiver having a first refrigerant pipe through which a refrigerant flow and a first heat conductive sheet that receives heat by being in contact with a cooling target. The second heat receiver is configured to approach and separate from the first heat receiver while facing the first heat conductive sheet. The spring biases the first heat receiver and the second heat receiver in an approaching direction.

Abstract: The object is to provide a technology that can prevent a spring electrode from being dissolved and broken upon a short circuit in a semiconductor chip. A spring electrode includes a main body. The main body is a tubular conductor, and varies in diameter in a longitudinal direction so that a side surface has bellows. Since the main body of the spring electrode does not include an edge portion, the local concentration of a short-circuit current that flows through the spring electrode upon a short circuit in a semiconductor chip can be reduced. This can prevent the spring electrode from being dissolved and broken.

Abstract: A two-card assembly includes a first printed wiring board (PWB) on a first side of the two-card assembly, and a first stiffener secured to the first PWB. The two-card assembly also includes a second PWB on a second side of the two-card assembly, and a second stiffener secured to the second PWB. A center stiffener is disposed between the first stiffener and the second stiffener, and one or more electronic modules are secured to the center stiffener. The center stiffener dissipates heat from the one or more electronic modules.

Abstract: An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.

Abstract: An electrical assembly includes an electrical connector mounted upon the PCB to receive a CPU therein. A securing seat is fixed on the PCB with four upwardly extending posts. A heat sink is secured to the posts by the screw nuts and seated upon the CPU. A auxiliary retention piece is located upon the securing seat around one post so as to prevent the CPU from excessively tilting due to the screw nut fastening occurring on an opposite diagonal corner.

Abstract: A thermal stabilization system stabilizes inertial measurement unit (IMU) performance by reducing or slowing operating variations over time of the internal temperature. More specifically, a thermoelectric heating/cooling device operates according to the Peltier effect, and uses thermal insulation and a mechanical assembly to thermally and mechanically couple the IMU to the thermoelectric device. The thermal stabilization system may minimize stress on the IMU and use a control system to stabilize internal IMU temperatures by judiciously and bidirectionally powering the thermoelectric heating/cooling device. The thermal stabilization system also may use compensation algorithms to reduce or counter residual IMU output errors from a variety of causes such as thermal gradients and imperfect colocation of the IMU temperature sensor with inertial sensors.

Abstract: A communications cable having a plurality of twisted pairs of conductors and various embodiments of a metal foil tapes between the twisted pairs and a cable jacket is disclosed. In some embodiments, a metal foil tape includes a discontinuous metal layer and a polymer layer bonded to the metal layer. Portions of the metal layer and the polymer layer are deformed to form a plurality of dimples, the dimples forming air gaps between the polymer layer and the cable core or a barrier layer if used. The air gaps lower the overall dielectric constant between the metal layer and the cable core, thereby lowering the alien capacitance of the communications cable.

Abstract: A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

Abstract: An electrical connector includes an insulative housing retaining a plurality of contacts therein and surrounded by a metallic seat. A clip includes a frame with corresponding four walls to commonly form a receiving cavity to receive the electronic package therein, and each wall forms a pressing section to downwardly press an upward surface of the electronic package. A pair of latches are formed on a lower side of the frame to cooperate with the pressing sections of the walls to retain electronic package within the receiving cavity to be wholly a sub-assembly for being commonly received within the electrical connector. The clip includes a releasing handle to actuate the corresponding latch, and the releasing handle is positioned in an opening of the seat and intimately above the printed circuit board to function as a foolproof mechanism for loading the electronic package in a right orientation.

Abstract: In example implementations, a memory cooler is provided. The memory cooler includes a body. The body includes two pieces that are moveable relative to one another. Each piece of the body includes an inlet manifold, an outlet manifold, and a plurality of cold plates extending between the inlet manifold and the outlet manifold. The inlet manifold is to receive liquid coolant from a liquid coolant supply line. The outlet manifold is to return the liquid coolant to the liquid coolant supply line. The liquid coolant flows from the inlet manifold to the outlet manifold through interior channels of the cold plates. The plurality of cold plates of a first piece of the body are interleaved with the plurality of cold plates of a second piece of the body such that slots to receive memory modules are defined between adjacent pairs of cold plates.

Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

Abstract: A communications cable having a plurality of twisted pairs of conductors and various embodiments of a metal foil tapes between the twisted pairs and a cable jacket is disclosed. In some embodiments, a metal foil tape includes a discontinuous metal layer and a polymer layer bonded to the metal layer. Portions of the metal layer and the polymer layer are deformed to form a plurality of dimples, the dimples forming air gaps between the polymer layer and the cable core or a barrier layer if used. The air gaps lower the overall dielectric constant between the metal layer and the cable core, thereby lowering the alien capacitance of the communications cable.

Abstract: A semiconductor module includes case that houses a semiconductor device therein and a fastener that is connected at one end thereof to the case. The fastener includes a first extending portion that is connected at one end hereof to the case and extends away from the case, and a second extending portion that is connected at one end thereof to the first extending portion and extends toward the case, where the second extending portion has a variable angle with respect to the first extending portion depending on an external force. The second extending portion has a through hole penetrating through the second extending portion from a front surface of the second extending portion to a back surface of the second extending portion; and a projection that is provided on the back surface of the second extending portion, the projection being positioned closer to the case than the through hole is.

Abstract: Implementations of a clip may include a die attach portion including at least one protrusion extending from the die attach portion and a lead frame alignment portion including at least one alignment feature. The at least one alignment feature may be configured to couple into at least one hole in a lead frame thereby aligning the clip with the lead frame. The at least one protrusion may be configured to couple into at least one recess in the die.

Abstract: A heat sink according to one embodiment of the present invention includes: a base portion having a first surface and a second surface which oppose each other; at least one heat dissipating fin extending vertically from the first surface, each of the at least one heat dissipating fin having an insertion groove extending from an end portion thereof toward the base portion, and a first fin portion and a second fin portion which are separated by the insertion move; and a connector included in the base portion, the connector being above the insertion groove in plan view, and the connector being configured to electrically connect a first heat generating component to be inserted into the insertion groove from a side of the first surface and a second heat generating component to be disposed on a side of the second surface.

Abstract: A substrate connector to provide a connection to a substrate during substrate processing includes a spring pin assembly defining a first contact and including a first groove. A retention spring clip includes a body arranged in the first groove and projections extending from the body. A second contact includes a body defining a second groove. The second contact is arranged around the first contact of the spring pin assembly. The projections of the retention spring clip extend into the second groove in the second contact.

Abstract: An electrical device includes a printed-circuit board which is fitted with heat-generating components, the printed-circuit board being disposed in a housing of the device, the housing having a housing part, particularly a cup-shaped housing part, and a cooling plate connected to the printed-circuit board being pressed by a wedge against the inner wall of the housing part, in particular, being pressed such that heat from at least one heat-generating component, especially a power module having power semiconductor switches, is able to be dissipated at a contact surface to the housing part.

Abstract: Embodiments of the present invention provide a heat dissipater and relate to the communications field. The heat dissipater includes a sub heat dissipater, a connecting apparatus, and a shared bracket; the sub heat dissipater is connected to the shared bracket through the connecting apparatus; the sub heat dissipater includes a first heat conducting surface, and the sub heat dissipater contacts a first heat source through the first heat conducting surface to dissipate heat for the first heat source; the shared bracket includes a second heat conducting surface, and the shared bracket contacts a second heat source through the second heat conducting surface to dissipate heat for the second heat source; and the second heat conducting surface and the sub heat dissipater are disposed in different positions of the shared bracket respectively.

Abstract: A retention structure which provides both soldering and vibration stabilization of a capacitor as the capacitor is mounted to a printed circuit board (PCB) of an electronic module. An aperture is part of the PCB to stabilize and prevent the capacitor from rolling during manufacturing. Once secured to the PCB, Room Temperature Vulcanization (RTV), or similar adhesive bead, is placed onto a rigidizer or base plate (typically a casted or aluminum sheet plate). Once the capacitor is soldered in place and fixated on the PCB, the assembly is then placed onto the rigidizer such that the PCB is attached to the rigidizer using an adhesive, and the RTV bead contacts and is deformed by the capacitor, connecting the capacitor to the rigidizer to provide vibration stabilization support. The electronic module includes a cover, and optional dampening/constraint pads are attached to the cover of the electrolytic capacitor for additional vibration stabilization.

Abstract: Various embodiments provide a dual purpose press-bar and heat sink for an integrated circuit card (ICC) reader. The dual purpose press-bar and heat sink provides two functions. First, the dual purpose press-bar and heat sink conducts and dissipates internal heat generated by a high data transfer ICC inserted in to the ICC reader. Second, the dual purpose press-bar and heat sink ensures that contact pads of the high data transfer ICC create reliable electrical connections with ICC contacts of the ICC reader. As such, the dual purpose press-bar and heat sink simultaneously dissipates heat from a high data transfer ICC and ensures that a high data transfer ICC maintains proper electrical connections with ICC contacts of an ICC reader.

Abstract: Display device includes a display panel. The display panel includes a first substrate, a sealant, and, a second substrate fastended to the first substrate via the sealant. At least one of the first substrate and the second substrate is a non-planar substrate including at least two portions correspondingly extending in different planes.

Abstract: In at least some embodiments, an electronic package to maximize heat transfer comprises a plurality of components on a substrate. A stiffener plate is installed over the components. The stiffener plate has openings to expose the components. A plurality of individual integrated heat spreaders are installed within the openings over the components. A first thermal interface material layer (TIM1) is deposited between the components and the plurality of individual integrated heat spreaders. In at least some embodiments, the thickness of the TIM1 is minimized for the components.

Abstract: A temperature switch electrically interconnects a first wire and a second wire, and includes a conducting mechanism and a temperature control mechanism controlling electrical connection between the first and second wires using the conducting mechanism in a normal condition. The conducting mechanism includes a safety unit composed of a conducting resilient bracket and a deformable component abutting against the conducting resilient bracket, thereby enabling the conducting resilient bracket to electrically interconnect the first and second wires. The deformable component is deformed upon reaching a specific temperature, such that interconnection between the first and second wires made via the conducting resilient bracket is broken.

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract: A cycling heat dissipation module is used for removing the heat generated by a heat-generating element of a circuit board and includes at least one main body and at least one conducting pipe. The main body has a chamber and a heat guiding part. The chamber is filled with a fluid and has a wall to divide the chamber into a first compartment and a second compartment adjacent to each other. The heat guiding part is used for conducting the heat generated from the heat generating element. The conducting pipe has a first end, a second end and a heat exchanging section. The fluid is pushed into the heat-exchanging section by the pressure difference after absorbing the heat of the heat guiding part, and then moved to the second compartment.

Abstract: A semiconductor device includes a semiconductor substrate in which an active region and an edge termination region are defined, a semiconductor element formed in the active region, and first to fourth P layers formed in a region spanning from an edge portion of the active region to the edge termination region in the surface of the semiconductor substrate. The first to fourth P layers respectively have surface concentrations P(1) to P(4) that decrease in this order, bottom-end distances D(1) to D(4) that increase in this order, and distances B(1) to B(4) to the edge of the semiconductor substrate that increase in this order. The surface concentration P(4) is 10 to 1000 times the impurity concentration of the semiconductor substrate, and the bottom-end distance D(4) is in the range of 15 to 30 ?m.

Abstract: A vehicle lamp that includes components structured to be simply coupled to each other. The vehicle lamp includes a light source unit that emits light, a metal plate onto which the light source unit is mounted on a surface thereof and dissipates heat generated from the light source unit, and a fixing plate that is coupled to the metal plate and supports the metal plate. A coupling protrusion is formed on any one of the metal plate and the fixing plate, a coupling groove coupled to the coupling protrusion is formed in the other one of the metal plate and the fixing plate, and the metal plate includes two or more walls that face each other and a connection surface which connects the walls.

Abstract: Provided is a coupling assembly of a power semiconductor device and a printed circuit board (PCB). The coupling assembly of the power semiconductor device and the printed circuit board (PCB) includes a PCB, a power semiconductor device comprising a plurality of legs electrically connected to a circuit pattern disposed on the PCB, a connection member disposed above the power semiconductor device, the connection member being formed of an electrically conductive material, a main fixing unit fixing the power semiconductor device to the PCB, and a housing disposed outside the PCB. Thus, a coupling force between the power semiconductor device and the PCB and electric efficiency may be improved to a heat generation amount. In addition, heat may be more quickly dissipated through the connection member to improve a cooling effect.

Abstract: An integrated circuit package system includes: providing an integrated circuit substrate; forming an internal stacking module coupled to the integrated circuit substrate including: forming a flexible substrate, coupling a stacking module integrated circuit to the flexible substrate, and bending a flexible extension over the stacking module integrated circuit; and molding a package body on the integrated circuit substrate and the internal stacking module.

Abstract: A pressed-contact type semiconductor device includes a power semiconductor element, on an upper surface of which at least a first electrode is formed and on a lower surface of which at least a second electrode is formed, lead frames which face the first electrode and the second electrode of the power semiconductor element respectively, and a clip which applies a pressure to the lead frames while the power semiconductor element is sandwiched by the lead frames, wherein a metallic porous plating part is formed on a surface which faces the first electrode or the second electrode, the surface being a surface of at least one of the lead frames.

Abstract: Within a cassette of a press pack module, a conductive shim is bonded to the backside of a device die by a layer of sintered metal. The die, sintered metal, and shim together form a sintered assembly. The cassette is compressed between a metal top plate member and a metal bottom plate member such that the backside of the assembly is pressed against the top plate member, and such that the frontside of the assembly is pressed against another shim. A central portion of the frontside surface of the die is contacted on the bottom by the other shim, but there is no shim contacting a peripheral portion of the frontside surface. Despite there being no shim in contact with the peripheral portion of the frontside surface, the peripheral portion is in good thermal contact with the top plate member through the sintered metal and the bonded conductive shim.

Abstract: A thin power device comprises a substrate having a first set of first contact pads at a front surface of the substrate electrically connecting to a second set of second contact pads at a back surface of the substrate, a through opening opened from the front surface and through the substrate exposing a third contact pad at the back surface of the substrate, a semiconductor chip embedded into the through opening with a back metal layer at a back surface of the semiconductor chip attached on the third contact pad, and a plurality of conductive structures electrically connecting electrodes at a front surface of the semiconductor chip with the corresponding first contact pads in the first sets of first contact pads.

Abstract: An aspect of the present embodiment, there is provided a semiconductor device, including an insulating substrate, at least one semiconductor chip provided above the insulating substrate, a wiring terminal including a connection portion electrically connected to the semiconductor chip, a surrounding frame surrounding the semiconductor chip and the connection portion, an embedded material provided in the surrounding frame covering the semiconductor chip and the connection portion, and a pressing unit provided on a surface of the embedded material.

Abstract: In various embodiments, a chip module may include a first chip; and a leadframe with a first leadframe area and a second leadframe area, wherein the first leadframe area is electrically insulated from the second leadframe area; wherein the first chip is arranged at least partially on the first leadframe area and at least partially on the second leadframe area.

Abstract: A compliant printed circuit semiconductor tester interface that provides a temporary interconnect between terminals on integrated circuit (IC) devices being tested. The compliant printed circuit semiconductor tester interface includes at least one dielectric layer printed with recesses corresponding to a target circuit geometry. A conductive material is deposited in at least a portion of the recesses comprising a circuit geometry and a plurality of first contact pads accessible along a first surface of the compliant printed circuit. At least one dielectric covering layer is preferably applied over the circuit geometry. A plurality of openings in the dielectric covering layer are provided to permit electrical coupling of terminals on the IC device and the first contact pads. Testing electronics that to test electrical functions of the IC device are electrically coupled to the circuit geometry.

Abstract: The invention relates to an electronic module and to a method for producing same, comprising a mold body (2), a first circuit carrier (3; 13) having a first inner face (3a; 13a), on which electronic components (5) are arranged, and a first outer face (3b; 13b), a second circuit carrier (4; 14) having a second inner face (4a; 14a), on which electronic components (5) are arranged, and a second outer face (4b; 14b), and at least one spring device (6, 7; 16) which connects the inner faces (3a, 14a; 13a, 14a), or surfaces of electronic components (5) arranged thereon, of the first and second circuit carriers (3, 4; 13, 14), wherein the first and second outer faces (3a, 4a; 13a, 14a) are exposed towards the outside of the electronic module in order to emit heat directly to the outside, and wherein the first and second outer faces (3a, 4a; 13a, 14a) are parallel to each other.

Abstract: In a semiconductor device, a semiconductor module is pressed against a cooler by a spring member. The spring member is compressed by a beam member that is connected with a strut fixed to the cooler. The cooler has a pressed part in which the semiconductor module is pressed, and a strut fixing part to which the strut is fixed. The strut fixing part has higher rigidity than the pressed part.

Abstract: A semiconductor device is provided that comprises a semiconductor substrate comprising an active area and a peripheral region adjacent the active area and structure positioned in the peripheral region for hindering the diffusion of mobile ions from the peripheral region into the active area.

Abstract: An electrical interconnect between terminals on an IC device and contact pads on a printed circuit board (PCB). The electrical interconnect includes a substrate with a first surface having a plurality of openings arranged to correspond to the terminals on the IC device. A compliant material is located in the openings. A plurality of first conductive traces extend along the first surface of the substrate and onto the compliant material. The compliant material provides a biasing force that resists flexure of the first conductive traces into the openings. Vias extending through the substrate are electrically coupled the first conductive traces. A plurality of second conductive traces extend along the second surface of the substrate and are electrically coupled to a vias. The second conductive traces are configured to electrical couple with the contact pads on the PCB.

Abstract: A device and method for minimizing the forces that may compromise a lead frame mount to a support structure in an integrated circuit die package during various packaging method steps. When a window clamp is used to provide pressure during a lead frame bonding step or during a wire bonding step during packaging, the vertical force applied by the window clamp may be transferred in lateral direction by the physical contour of the top plate of the support structure. By changing the physical contour of the top plate of the support structure, such as by disposing a specific kind of contoured protrusion, one may minimize or eliminate the lateral forces that act against achieving a solid bond of the lead frame to the support structure. Further, during wire bonding, the same minimization or elimination of lateral forces lead to improved wire bonding.

Abstract: A semiconductor module includes a semiconductor having a semiconductor substrate, a first electrode formed on one surface of the semiconductor substrate, and a second electrode formed on an opposite surface of the semiconductor substrate. A first conductive member is in contact with the first electrode. A second conductive member is in contact with the second electrode. A third conductive member is in contact with the second conductive member and extends along the first conductive member. An insulating member provides insulation between the first conductive member and the third conductive member. The third conductive member is fixed to the first conductive member and the second conductive member by being sandwiched between the first conductive member and the second conductive member. The semiconductor device is fixed to the first conductive member and the second conductive member by being sandwiched between the first conductive member and the second conductive member.

Abstract: Certain embodiments provide a semiconductor device including a first substrate, a circuit element, a second substrate, a metal layer, and a radiation plate. The circuit element is formed on a front surface of the first substrate and has an electrode. The second substrate has a first face, and is laminated on the first substrate so that the first face of the second substrate faces a front surface of the first substrate. The second substrate has a via hole arranged on the electrode. The metal layer is formed inside of the via hole. The radiation plate is formed on a second face of the second substrate, and is connected to the metal layer.

Abstract: A method and structures are provided for implementing enhanced thermal conductivity between a lid and heat sink for stacked modules. A chip lid and lateral heat distributor includes cooperating features for implementing enhanced thermal conductivity. The chip lid includes a groove along an inner side wall including a flat wall surface and a curved edge surface. The lateral heat distributor includes a mating edge portion received within the groove. The mating edge portion includes a bent arm for engaging the curved edge surface groove and a flat portion. The lateral heat distributor is assembled into place with the chip lid, the mating edge portion of the lateral heat distributor bends and snaps into the groove of the chip lid. The bent arm portion presses on the curved surface of the groove, and provides an upward force to push the flat portion against the flat wall surface of the groove.

Abstract: A stacked structure includes a first die bonded over a second die. The first die has a first die area defined over a first surface. At least one first protective structure is formed over the first surface, around the first die area. At least one side of the first protective structure has at least one first extrusion part extending across a first scribe line around the protective structure. The second die has a second die area defined over a second surface. At least one second protective structure is formed over the second surface, around the second die area. At least one side of the second protective structure has at least one second extrusion part extending across a second scribe line around the protective structure, wherein the first extrusion part is connected with the second extrusion part.

Abstract: A magnetic memory device including a memory layer having a vertical magnetization on the layer surface, of which the direction of magnetization is changed according to information; and a reference layer provided against the memory layer, and being a basis of information while having a vertical magnetization on the layer surface, wherein the memory device memorizes the information by reversing the magnetization of the memory layer by a spin torque generated when a current flows between layers made from the memory layer, the nonmagnetization layer and the reference layer, and a coercive force of the memory layer at a memorization temperature is 0.7 times or less than a coercive force at room temperature, and a heat conductivity of a center portion of an electrode formed on one side of the memory layer in the direction of the layer surface is lower than a heat conductivity of surroundings thereof.