Abstract: A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a frame 5 compatible with a wiring board 1 in thermal expansion rate is fixed with solder 8 to the face of the wiring board 1 for mounting semiconductor devices 2; a rubber O-ring 15 is placed between the upper face of the frame 5 and the under face of the circumference of an air-cooled: heat sink 7; the plastic member 6 making possible relative sliding is placed between the upper face of the circumference of the heat sink 7 and the upper frame 10; the upper face of a plastic member 6 is restrained with the inside middle stage of an upper frame 10; and the lower part of the upper frame 10 and the frame 5 are fastened together with bolts 9.

Abstract: In a pressing cap forming part of a semiconductor device carrier unit, a pressing portion of a pressure body has recesses, to each of which a bump is inserted.

Abstract: A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the substrate; and an adhesive for bonding the sealing structure and the substrate, wherein the sealing structure has a groove for storing the adhesive.

Abstract: A notebook/laptop computer or other personal electronic device locking assembly includes a locking base frame. The locking base frame locks the notebook computer or other personal electronic device securely in place to a work surface such as a desk top or table top. The lock is adapted to engage the notebook computer or other personal electronic device screen in the open position, leaving a front surface of the screen viewable. The lock prevents removal of the notebook computer or other personal electronic device from the work surface. A security table top/work surface clamp includes a cable clamp having a fixed or adjustably sized generally C-shaped clamp body insertable over a table top or other flat work surface. The lower operating knob has a transverse hole or slot preventing loosening of the threaded bolt once the flexible cable is installed through the transverse hole or slot.

Abstract: A portable music player or other personal electronic device locking assembly includes a locking base frame. The locking base frame locks the portable music player or other personal electronic device securely in place to a work surface such as a desk top or table top. The lock is adapted to engage the portable music player or other personal electronic device screen in the open position, leaving a front surface of the screen viewable. The lock prevents removal of the portable music player or other personal electronic device from the work surface. A security table top/work surface clamp includes a cable clamp having a fixed or adjustably sized generally C-shaped clamp body insertable over a table top or other flat work surface. The lower operating knob has a transverse hole or slot preventing loosening of the threaded bolt once the flexible cable is installed through the transverse hole or slot.

Abstract: An apparatus for heatsink attachment. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includes a heatsink on top of the lid. The heatsink includes a second thermally conductive material. The semiconductor chip and the substrate share a common interface surface that defines a reference direction perpendicular to the common interface surface and pointing from the substrate towards the semiconductor chip. The lid is disposed between the substrate and the heatsink. The lid includes a first protruding member. The first protruding member of the lid is farther away from the substrate than a portion of the heatsink in the reference direction.

Abstract: A heat dissipation device includes a retention module (60), a heat sink (10), a fan bracket (50), a fan (70) mounted on the fan bracket, and a pair of wire clips (30) cooperating with the fan bracket and the retention module to secure the heat sink to a heat-generating electronic element (82). The retention module forms a pair of fixture blocks (64) at a pair of lateral sidewalls thereof. The heat sink defines grooves (160) at lateral sides thereof. Each of the clips includes an operating portion (356) fastened to the fan bracket, a central axle (33) connecting with the operating portion and a locking portion (31) connecting with the central axle. Each central axle is slidably engaged in corresponding grooves of the heat sink and the locking portions of the clips engage with the fixture blocks of the retention module.

Abstract: A semiconductor device is shown and described which includes a metal can that receives a semiconductor die in an interior thereof. The metal can has a recess formed on a top portion thereof. The recess provides rigidity to the top portion of the metal can which allows the wall of the can to be spaced farther apart from the die, thereby providing a much larger open channel which allows for the easier cleaning of flux residue after soldering.

Abstract: A semiconductor switching module includes a power semiconductor element that is embodied in planar technology. In at least one embodiment, the power semiconductor element is provided with a base layer, a copper layer, and at least one power semiconductor chip that is mounted on the copper layer, and another electrically conducting layer which covers at least one load terminal of the power semiconductor chip. According to at least one embodiment of the invention, devices are provided for safely connecting the load terminal to a load circuit. The devices are configured such that a contact area thereof presses in a planar manner onto the electrically conducting layer.

Abstract: An apparatus and method for manufacturing a display device substrate are provided. In one embodiment, the apparatus comprises a clamp for clamping an edge of a plastic substrate, and a tension member applying tension along a surface of the plastic substrate by interacting with the clamp to strain the plastic substrate. Advantageously, the flexible plastic substrate is substantially prevented from deflecting in a manufacturing process thereby reducing defects in the display device substrate.

Abstract: Consistent with an example embodiment, an integrated circuit device (IC) is assembled on a package substrate and encapsulated in a molding compound. There is a semiconductor die having a circuit pattern with contact pads. A package substrate having bump pad landings corresponding to the contact pads of the circuit pattern, has an interposer layer sandwiched between them. The interposer layer includes randomly distributed mutually isolated conductive columns of spherical particles embedded in an elastomeric material, wherein the interposer layer is subjected to a compressive force from pressure exerted upon an underside surface of the semiconductor die. The compressive force deforms the interposer layer causing the conductive columns of spherical particles to electrically connect the contact pads of the circuit pattern with the corresponding bump pad landings of the package substrate.

Abstract: A fixing means for a heat dissipater is provided to position the heat dissipater and a heat-generating element, which includes a heat-dissipating base and a positioning frame. The surface of the heat-dissipating base is provided with a plurality of heat-dissipating pieces. The center of the plurality of heat-dissipating pieces is provided with a sliding groove. Further, the positioning frame is formed into a T-lettered shape and constituted of a transverse rod and a pressing end. The pressing end is accommodated in the sliding groove of the base to abut against the surface of the base. Both side faces of the transverse rod are provided with a screw hole, respectively, for receiving a locking element.

Abstract: This invention is related to an improvement in the structure of a fastener which includes a rod and a sleeve, wherein the rod has a flat top for depression and a rod body extending downwardly from the flat top to form three stepped portions. The upper end of the rod body is provided with a circular groove. The sleeve is formed with a through hole and a flange close to its upper end. The inner side of the sleeve is provided above the flange with a first engaging section engageable with the circular groove of the rod. The sleeve is provided with a second engaging section below the flange and a third engaging section at the lower end thereof. By means of the engagement between the circular groove of the rod and the first engaging section of the sleeve, the rod will be prevented from detaching from the sleeve. The second and third engaging sections are used for preventing the fastener from disengaging from a workpiece.

Abstract: A heat dissipator of a signal transmission member for a display apparatus can sufficiently dissipate heat from devices of the signal transmission member and protect the devices, and includes a thermal conductive supporter for dissipating heat generated by a signal transmission member, which transmits electrical signals between a chassis member supporting a panel displaying image and including at least one device and a circuit unit separated from the chassis member to drive the panel. The thermal conductive supporter includes: a base portion formed of a thermal conductive material, and having a side surface contacting the chassis member and another side surface contacting the signal transmission member; and a recess portion oriented on the base portion toward the chassis member so that the at least one device does not contact the base portion.

Abstract: An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip carrier by a land grid array (LGA) connector; a metal stiffener including at least one force-adjustable member contacting an underside of the PCB; and at least two couplers for coupling the metal stiffener to a lid or a heat sink, with the PCB, the chip carrier and the LGA connector therebetween. The force-adjustable member reduces the required assembly forces and accommodates natural and non-systematic out-of flatness tolerances of the PCB and the chip carrier.

Abstract: A notebook/laptop computer or other personal electronic device locking assembly includes a locking base frame. The locking base frame locks the notebook computer or other personal electronic device securely in place to a work surface such as a desk top or table top. The lock is adapted to engage the notebook computer or other personal electronic device screen in the open position, leaving a front surface of the screen viewable. The lock prevents removal of the notebook computer or other personal electronic device from the work surface. A security table top/work surface clamp includes a cable clamp having a fixed or adjustably sized generally C-shaped clamp body insertable over a table top or other flat work surface. The lower operating knob has a transverse hole or slot preventing loosening of the threaded bolt once the flexible cable is installed through the transverse hole or slot.

Abstract: A heat sink retaining device for attaching a heat sink on a chip unit is provided, which includes a retaining component and a rotating component. The retaining component is locked to the heat sink in a state of pressing by a hook portion thereof, and the rotating component is pivotally disposed on the retaining component and pivotally rotated between a release position and a locking position. When the rotating component is at the locking position, a clamping portion of the rotating component is snapped onto the chip unit and presses the retaining component against the heat sink and the chip unit, thus improving the stability, reliability and fastness of the integral combination and meanwhile achieving the goal of being extremely convenient in assembling or disassembling.

Abstract: An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric structure is placed between the circuit board and the base member. The elastomeric structure has voids between a first defining plane adjacent the circuit board and a second defining plane adjacent the base member, with the voids adapted to permit local deformation of elastomeric material in the structure. The method includes applying a compressive force between the circuit board and base member to at least partially compressing the elastomeric structure to improve load equalization on the circuit board.

Abstract: A heat sink fastening assembly includes a fastener comprising a latching member and an operating member. The latching member includes a pressing part, a first latching leg and a second latching leg bent downwards respectively from two opposite ends of the pressing part. The operating member has a coping and a sidewall extending downwards from an edge of the coping. The sidewall defines two locking slots engaging with the first latching leg and an elastic rib extending downwards from the coping and engaged with the first latching leg of the latching member for inhibiting any movement of the operating member in a direction along the locking slot of the sidewall.

Abstract: Provided are semiconductor low-K Si die wire bonding packages with package stress control and fabrication methods for such packages. The packages include molding interface material applied onto the low-K Si die. In general, the molding interface material is selectively applied onto the low-K Si die surface in order to minimize to safe levels the package stress experienced by the low-K Si die. Selective application includes defining various combinatorial patterns of coated and non-coated regions. In addition, selective application may also include a general application of molding interface material to create a stress buffer zone. The results are packages with less stress experienced by the low-K Si die and so improved reliability (in compliance with industry specifications).

Abstract: A heat dissipating module includes a releasing member, a heat pipe, which has a first end connected to the releasing member and a second end attached to the top surface of a thermal chip on a circuit board, and a fastening member, which has a protruded arch portion that defines an arch chamber that accommodates the second end of the heat pipe, two press portions respectively extended from two opposite lateral sides of the protruded arch portion and pressed on the top surface of the thermal chip, and a plurality of hook portions respectively extended from the press portions and hooked on the bottom edge of the circuit board.

Abstract: A heat dissipation device includes a retention module surrounding a heat-generating component therein and a heat sink secured in the retention module. The retention module has a plurality of sidewalls. The heat sink includes a base positioned in the retention module for contacting with the heat-generating component. The base includes a plurality of first walls and a plurality of second walls. The sidewalls of the retention module enclose a periphery of the base, and the first walls and the second walls respectively abut against the sidewalls of the retention module when the base is located at a first position and a second position. A rotation of the base from the first position to the second position reduces an adhering force generated by a thermal grease located between the base and the heat-generating component.

Abstract: A clip includes a body having a first end and a second end. A connecting member extends through the first end of the body. A hook plate is attached to a bottom of the connecting member and an actuating member is pivotally coupled to an upper end of the connecting member. The actuating member is pivotable relative to the hook plate in a first direction so that the actuating member is turnable relative to the hook plate between a locked position and an unlocked position. Furthermore, the actuating member is turnable about an axis of the connecting member in a second direction different from the first direction.

Abstract: A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the supporting portion. The first hook plate is detachably coupled to a distal end of the arms of the body. The second hook plate extends through the supporting portion and is pivotally coupled to the cam of the actuating member. The actuating member is turnable relative to the second hook plate between a locked position and an unlocked position.

Abstract: In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with one or more spacers.

Abstract: Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis.

Abstract: A heat sink with a twist lock mounting mechanism. An electronic device may be mounted to the heat sink without the use of external fasteners, such as screws or rivets. Instead of using external fasteners, the heat sink includes resilient mounting flanges for securing an electronic device. Rotating an electronic device on the heat sink secures the electronic device in a friction fit with the resilient mounting flanges. Multiple electronic devices may be mounted to the heat sink, either manually or through an automated process.

Abstract: A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a retention module and an elongated slot above the retaining hole. The actuating member includes a curving slot and is pivotally coupled to the movable fastener via a pivot. The sliding axle extends through the second leg of the body and the elongated slot of the movable fastener to couple them together, and the sliding axle has one portion inserted into the curving slot of the actuating member. When the actuating member is rotated about the pivot, the movable fastener is driven to move relative to the sliding axle between a relaxed position and a locked position.

Abstract: A clip assembly (30) for mounting a heat sink (20) on a printed circuit board (10) includes a closed annular positioning portion (32) interferingly engaging with the heat sink, a securing portion (34) secured to the positioning portion. The securing portion has a pressing member (340) extending through an opening (320) defined in the positioning portion for resiliently abutting against the heat sink, and two arms (344) extending from free ends of the pressing member with a pair of hooks (342) formed at distal portions of the two arms for engaging with the printed circuit board.

Abstract: Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.

Abstract: Corresponding parts to a first path portion in a first signal transmission path to a first semiconductor chip are an interconnection member and a second path portion a second signal transmission path to a second semiconductor chip and are not formed on the first tape. An electric length of the second signal transmission path is allowed to be adjusted independently of the first tape, so that the electric length of the second signal transmission path can be easily made equal to or substantially equal to that of the first signal transmission path.

Abstract: A chip card retaining mechanism for retaining a chip card mounted in an electronic device. The electronic device includes a housing (10). The housing has a battery compartment (12) defined therein. The chip card retaining mechanism includes a receiving portion, and a locking assembly. The receiving portion is formed on the housing for receiving the chip card therein. The receiving portion has an open end (142) facing the battery compartment of the electronic device. The locking assembly includes a stop mechanism, and an elastic arm (26). The stop mechanism is configured for preventing the chip card from being withdrawn from the receiving portion via a top of the receiving portion. The elastic arm is formed on the housing, and has latching portion (262) disposed adjacent the open end for abutting with the chip card.

Abstract: According to some embodiments, an arrangement is provided for cooling a heat-generating device, including a memory module (e.g., a small outline dual inline memory module), in a system such as a laptop computer. The arrangement includes a heat spreader having a first section including at least one thermally conductive coupling member to thermally engage surfaces of electronic components on the heat-generating device and a second section including at least one spring member to cause pressurized engagement between the first section and the surfaces of the electronic components. The heat spreader may further be thermally coupled to a heat exchanger or a keyboard from which the heat is dissipated. Other embodiments are also described and claimed.

Abstract: A heat dissipation device includes a heat sink having a heat conducting core and a plurality of fins extending from the core. The core has a downward extension portion extending away the fins for contacting a heat generating device. A locking device includes a locking plate defining a central opening accommodating the extension portion of the core of the heat sink therein and has a plurality of locking arms extending from the locking plate. Pluralities of cutouts circumferentially surrounding and communicating with the opening are defined in the locking plate. The extension portion of the core of the heat sink is punched to press the locking plate of the locking device toward the heat sink and have portions thereof engaged in the cutouts of the locking plate of the locking device, whereby the locking device is stably fixed to the heat sink.

Abstract: An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one configurable diamond pin; at least one heat pipe; and a heat sink structure. At least one diamond pin is configured to displace junction temperature on a hot spot location of the microprocessor. The heat sink structure and at least one heat pipe are configured atop the second thermal interface material layer.

Abstract: A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip package. The image sensor chip package has a number of outer pads. The outer pads are positioned in the receiving portion of the holder. The conductive elements are received in the receiving portion. One end of each of the conductive elements is connected to the inner pads, the other end of each of the conductive elements is connected to the circuit board.

Abstract: A mounting plate that is secured between a substrate and a component is used to mount a heat sink. The plate includes holes to accommodate the leads of the component and mounting flanges that partially surround the component and are used to mount the heat sink. In the mounted position, the heat sink is held in thermal communication with the component directly or through a thermally conductive material.

Abstract: A swage hermetic sealing of a MEMS or microdevice or nanodevice package using high force. A cutting and flowing edge 430 is formed on a package cover which is pressed into a mating , integral gasket 425 on a package base. A material extension of the package cover 450 is simultaneously folded under the package base to supply force maintenance for permanent hermaticity. The swage hermetic sealing of single or an array of covers to an extended wafer or substrate is accomplished by a cutting and flowing edge 560. Permanent force maintenance is achieved through a re-entrant cavity 565 and annular ring 535 on the wafer or substrate.

Abstract: A wirebond-less packaged semiconductor device includes a plurality of I/O contacts, at least one semiconductor die, the semiconductor die having a bottom major surface and a top major surface, the top major surface having at least two electrically isolated electrodes, and a conductive clip system disposed over the top major surface, the clip system comprising at least two electrically isolated sections coupling the electrodes to respective I/O contacts.

Abstract: A integrated circuit housing includes a first clamping hardware, a second clamping hardware operatively connected to the first clamping hardware, and an integrated circuit stack comprising a top portion and a bottom portion, wherein the first clamping hardware contacts the top portion and the second clamping hardware contacts the bottom portion, and wherein a first shim is interposed between the bottom portion and the second clamping hardware.

Abstract: A support structure for reducing shock to a camera module for use in a mobile communications terminal is provided. The mobile communication terminal comprises a camera case for housing the camera module, the support structure comprising a first projection protruding from an inner surface of the camera case, the first projection in operational relationship with a first receiving cavity formed in the camera module to firmly hold the camera module inside the camera case and prevent the camera module from moving in relationship to the camera case.

Abstract: A notebook/laptop computer or other personal electronic device locking assembly includes a locking base secured to a working surface. The locking base locks the notebook computer or other personal electronic device securely in place to a work surface such as a desk top or table top. The lock is adapted to engage the notebook computer or other personal electronic device screen in the open position, leaving a front surface of the screen viewable. The lock includes a locking member which prevents removal of the notebook computer or other personal electronic device from the work surface.

Abstract: A notebook/laptop computer locking assembly includes a locking base secured to a working surface. The locking base has a first rear wall to receive a keyboard portion of the notebook computer, with a screen portion of the notebook computer in the open position resting against the rear wall. A locking bar is adapted to pivot over the notebook computer screen in the open position, extending across a front surface of the screen portion. This locking bar has a rearwardly extending locking plug insertable within a locking receptacle of a lock. The locking bar is deployed on the notebook computer, thereby preventing removal of the notebook computer from the locking base. Additionally, locking holes are aligned with each other to receive a padlock to lock the locking bar to the locking base.

Abstract: Methods and apparatus to couple a device, such as, for example, a surface mount device, with a substrate, such as, for example, a printed circuit, are disclosed. An apparatus, according to one aspect, may include a substrate, a plurality of terminals coupled with the substrate, a conductive bonding material coupled with the plurality of terminals, an electronic device coupled with the conductive bonding material, and a holder that is coupled with the substrate to hold the electronic device. A method, according to one aspect, may include coupling a holder with a substrate such that terminals of the substrate are included in an opening of the holder, mounting an electronic device over the terminals with a conductive bonding material disposed therebetween, heating the conductive bonding material to its melting point, and cooling the conductive bonding material.

Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

Abstract: In a multi-device holding structure for integrally holding two heat generative elements which are transistors having through-holes so as to be mounted on a base plate, and a heat sensitive element which is a temperature fuse sandwiched between the heat sensitive elements and is mounted on the base plate, the heat generative elements and the heat sensitive element are covered with a metallic holding member provided with first flat spring segments for urging the heat generative elements on both ends as well as inserting segments extending upward and inserted into the through-holes, and second flat spring segments for supporting the sides of the heat sensitive element.

Abstract: A bracing apparatus is disclosed that has a component located within an opening in a cantilevered end of a heatsink. The component has a form factor that is expandable for stabilizing the heatsink at a given elevation relative to a printed circuit board. The bracing apparatus includes a tensioning device located within an opening in the component. When deployed, the tensioning device causes the component to expand. Also included in the bracing apparatus is a coupling medium for coupling the component to the printed circuit board.

Abstract: A semiconductor power circuit in which multiple field effect transistor dies are solder connected between opposed contact surfaces of overlying flat conductors and are clamped by means of spring clips which are arranged in symmetrically opposed relationship. A circuit board also disposed between the clamped surfaces is protected from the clamping forces by means of a soft paper layer with holes registering with similar holes in the circuit board to permit solder pads to pass there through.

Abstract: A semiconductor chip packaging structure comprising a dielectric film having one or more through holes aligned with the one or more contact pads of at least one power semiconductor chip. A patterned electrically conductive layer adjacent to the dielectric film has one or more electrically conductive posts which extend through the one or more though holes aligned with the contact pads to electrically couple the conductive layer to the contact pads. In certain embodiments, one or more air gaps may be formed between the dielectric film and the active surface of the at least one power semiconductor chip. Methods for fabricating the semiconductor chip packaging structure are also disclosed.

Abstract: A method of fabricating an integrated circuit sensor package. The method comprises the steps of: 1) mounting a substrate on a first mold block, the substrate comprising a substantially planar material having a first substrate surface and a second substrate surface that contacts a mounting surface of the first mold block; 2) placing an adhesive on the first substrate surface; 3) placing an integrated circuit sensor on the adhesive; and 4) pressing a second mold block against the first substrate surface. The second mold block comprising a cavity portion for receiving the integrated circuit sensor, a contact surface surrounding the cavity portion, and a compliant layer mounted with the cavity portion. Pressing the second mold block against the first substrate surface causes the contact surface to form with the first substrate surface a seal surrounding the integrated circuit sensor.