With Specific Housing Or Contact Structure Patents (Class 257/81)
  • Patent number: 10704748
    Abstract: A light module includes a module main body and a flexible substrate. The module main body has a stem, and a high frequency lead and a DC lead. The flexible substrate has a stem contact portion in contact with the lower surface of the stem. A high frequency through-hole and a DC through-hole are formed in the stem contact portion in which the high frequency lead and the DC lead are respectively inserted. The flexible substrate includes plural surface wirings, a ground wiring provided in a first region which contains the high frequency through-hole, but does not contain the DC through-hole on the back surface of the stem contact portion, and an adhesive layer provided in a second region which is a region excluding the first region on the back surface of the stem contact portion.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: July 7, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventor: Masaaki Shimada
  • Patent number: 10700781
    Abstract: A bidirectional optical subassembly, an optical transceiver including the same, and methods of making and using the same are disclosed. The optical subassembly includes a photodiode configured to receive an incoming optical signal, a transmitter configured to transmit an outgoing optical signal, and a passive optical signal processing unit including a filter and a mirror. The filter is at a first predetermined angle relative to an optical path of the outgoing optical signal and is configured to (i) reflect one of the outgoing optical signal and the incoming optical signal and (ii) allow the other of the outgoing optical signal and the incoming optical signal to pass through. The mirror is configured to reflect the one of the outgoing optical signal and the incoming optical signal at a second predetermined angle. The first predetermined angle is adapted to reduce filter insertion losses.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: June 30, 2020
    Assignee: Source Photonics (Chengdu) Co., Ltd.
    Inventors: Xiaohui Tang, Jian Yang, Yong Zhang
  • Patent number: 10655805
    Abstract: Disclosed herein is a multi-element flexible strap light which includes a plurality of light elements disposed on a flexible chassis. The flexible chassis may include a first flexible layer, a printed circuit board, and a second flexible layer. The flexible chassis may be further contained within a third flexible layer, such as a layer of polycarbonate plastic. Further disclosed is a multi-element flexible strap light system which includes a plurality of light elements disposed on a flexible chassis and a remote battery.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: May 19, 2020
    Assignee: ZYNTONY, INC.
    Inventor: Robin Urry
  • Patent number: 10646918
    Abstract: A relay device and a pressure detection device are provided that are configured to eliminate the necessity of calibrating an output value from a pressure sensor in the pressure detection device even when a mold is replaced. A relay device for a pressure detection device provided with a pressure sensor (S1 to Sn) configured to detect an inner pressure in a cavity (CT) of a mold of an injection molding machine is provided. The relay device is integrally fixed to the mold. The relay device includes a storage configured to store specific information of the pressure sensor (S1 to Sn) provided to the mold to detect the inner pressure of the cavity (CT), the cavity (CT) being defined between a fixed-side mold and a movable-side mold of the mold.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: May 12, 2020
    Assignee: MINEBEA MITSUMI INC.
    Inventor: Yoshimasa Takayama
  • Patent number: 10644204
    Abstract: A method of manufacturing a light emitting element includes forming an n-type semiconductor layer that includes an n-type clad layer and AlxGa1-xN (0.1?x?1) as a main component, forming an n-side contact electrode that includes a laminate structure including a Ti layer and a Ru layer, the Ti layer being in contact with the n-type semiconductor layer, and forming an ohmic contact of the n-type semiconductor layer and the Ti layer by a heat treatment.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: May 5, 2020
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Yasuhiro Takenaka, Yoshiki Saito, Shinichi Matsui, Daisuke Shinoda, Takashi Hodota, Hironao Shinohara
  • Patent number: 10622518
    Abstract: A light-emitting device includes an n-semiconductor structure, a p-semiconductor structure and a light-emitting active-region sandwiched therebetween. An n-trough is formed to expose the n-semiconductor structure by removing a first portion of the p-semiconductor structure and the light-emitting active-region. The n-trough surrounds a p-mesa which contains a second portion of the n-semiconductor structure, the p-semiconductor structure and the light-emitting active-region. The n-trough and the p-mesa are path-connected spaces and are formed via lithography and etching using a lithographic mask which is topologically constructed via merging a unit cell's at least two transformations selected from the unit cell's translation, rotation, and reflection transformations.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: April 14, 2020
    Assignee: BOLB INC.
    Inventors: Jianping Zhang, Ling Zhou, Alexander V. Lunev, Ying Gao
  • Patent number: 10615322
    Abstract: In various embodiments, a rigid lens is attached to a light-emitting semiconductor die via a layer of encapsulant having a thickness insufficient to prevent propagation of thermal expansion mismatch-induced strain between the rigid lens and the semiconductor die.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: April 7, 2020
    Assignee: CRYSTAL IS, INC.
    Inventors: Leo J. Schowalter, Jianfeng Chen, James R. Grandusky
  • Patent number: 10595398
    Abstract: To suppress peeling-off or cracks of a solder-fixing portion, which are caused by vibration during transportation or operation, in an optical modulator with FPC, thereby suppressing deterioration of radio-frequency characteristics of a signal path in an effective manner at low cost. An optical modulator 100 includes a flexible printed circuit (106) that performs electrical connection with a circuit substrate. The flexible printed circuit has a substantially quadrilateral shape. In the flexible printed circuit, a pad (210 and the like), which is electrically connected to the circuit substrate, is provided along one side of the substantial quadrilateral. In addition, in the flexible printed circuit, signal patterns (220 and the like), which are connected to signal lead pins (120 and the like) for signal transmission which is provided in the optical modulator, are provided in another side opposite to the one side.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: March 17, 2020
    Inventors: Norikazu Miyazaki, Toru Sugamata
  • Patent number: 10586749
    Abstract: Described herein are semiconductor devices and structures with improved power handling and heat dissipation. Embodiments are suitable for implementation in gallium nitride. Devices may be provided as individual square or diamond-shaped dies having electrode terminals at the die corners, tapered electrode bases, and interdigitated electrode fingers. Device matrix structures include a plurality of device dies arranged on a substrate in a matrix configuration with interdigitated conductors. Device lattice structures are based on a unit cell comprising a plurality of individual devices, the unit cells disposed on a chip with geometric periodicity. Also described herein are methods for implementing the semiconductor devices and structures.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: March 10, 2020
    Inventors: Zhanming Li, Yue Fu, Wai Tung Ng, Yan-Fei Liu
  • Patent number: 10535798
    Abstract: The present disclosure relates to a semiconductor light emitting device, comprising: a plurality of semiconductor layers that grows sequentially on a growth substrate, with the plurality of semiconductor layers including a first semiconductor layer having a first conductivity, a second semiconductor layer having a second conductivity different from the first conductivity, and an active layer interposed between the first semiconductor layer and the second semiconductor layer, generating a light with a first wavelength via electron-hole recombination; a first electrode, supplying either electrons or holes to the plurality of semiconductor layers; a second electrode, supplying, to the plurality of semiconductor layers, electrons if the holes are supplied by the first electrode, or holes if the electrons are supplied by the first electrode; a phosphor part provided over the first semiconductor layer on the side of the growth substrate, converting the light with the first wavelength generated in the active layer i
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: January 14, 2020
    Assignee: SEMICON LIGHT CO., LTD.
    Inventors: Soo Kun Jeon, Eun Hyun Park, Yong Deok Kim
  • Patent number: 10529896
    Abstract: The present disclosure provides a light-emitting device, comprising: a light-emitting stack; a first semiconductor layer on the light-emitting stack; a first electrode formed on the first semiconductor layer and comprising an inner segment, an outer segment, and a plurality of extending segments electrically connecting the inner segment with the outer segment.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: January 7, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Yao-Ru Chang, Wen-Luh Liao, Chun-Yu Lin, Hsin-Chan Chung, Hung-Ta Cheng
  • Patent number: 10510934
    Abstract: A light emitting device includes one or more light emitting elements, a light transmissive member, and a light reflective member. The one or more light emitting elements each includes an upper surface. The light transmissive member has an upper surface and a lower surface. The light reflective member covers surfaces of the light transmissive member and lateral surfaces of the one or more light emitting elements so as to expose the upper surface of the light transmissive member. The upper surface area of the light transmissive member is smaller than a sum of the upper surface areas of the one or more light emitting elements, and the lower surface area of the light transmissive member is larger than a sum of the upper surface areas of the one or more light emitting elements.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: December 17, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Masakatsu Tomonari, Masahiko Sano
  • Patent number: 10502758
    Abstract: Airtightness in a cavity of an inertial sensor (acceleration sensor) is increased to achieve high sensitivity. In the acceleration sensor having movable electrodes VE1, VE2 and fixed electrodes FE1, FE2, the fixed electrodes are formed by portions surrounded by a through hole TH1 provided in a cap layer CL, and the through hole is filled with an insulating film IF1 and polysilicon P and has a wide portion (WP). The wide portion has a gap SP that is not filled with the insulating film IF1 and the polysilicon P, and the gap SP is filled with the interlayer insulating film ID. With such a configuration, degassing can be exhausted through the gap (airway) SP in a pressure reducing step.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: December 10, 2019
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Shiota, Tatsuyuki Saito, Tatemi Ido, Noriyuki Sakuma, Yuudai Kamada, Atsushi Isobe, Chisaki Takubo
  • Patent number: 10465883
    Abstract: An optical module is provided for covering and being assembled on a light source module and providing light distribution and insulation protection for the light source module. The optical module includes a body comprising an optical portion and a power supply drive accommodating portion. The optical module also includes a mounting portion formed to integrally extend from the body. The optical portion is provided with a plurality of lens units that are formed to integrally project along a first direction from a surface of the body. The power supply drive accommodating portion is provided with an accommodating space formed to integrally extend along the first direction from the surface of the body so as to accommodate the power supply drive. The mounting portion at least partially accommodates a magnetic mounting element that includes a nonmagnetic base and a strong magnet which is connected integrally with the nonmagnetic base.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: November 5, 2019
    Assignee: OPPLE LIGHTING CO., LTD.
    Inventors: Kunlun Zhu, Ruikai Lian, Xuanxiong Gu, Jianguo Li
  • Patent number: 10453827
    Abstract: Light emitting diode (LED) devices and systems include a superstrate (e.g., a light-transmissive layer), LEDs attached to the superstrate at a die-attach layer formed thereon, and an encapsulant layer formed over and/or around the LEDs with a non-reflective or clear material. A method for producing LED devices and systems includes providing a superstrate with a die-attach layer formed thereon, attaching LEDs to the superstrate at the die-attach layer, forming conductive surfaces on a side of the LED opposite the die-attach layer, dispensing an encapsulant layer to at least partially encapsulate the LEDs, and forming one or more metal traces to electrically interconnect the conductive surfaces of at least some of the LEDs with each other.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: October 22, 2019
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Alan Wellford Dillon, Peter Scott Andrews
  • Patent number: 10453759
    Abstract: A base substrate include a first substrate (110) having a first principal surface (110a) and a second principal surface (110b), and a first wiring member placed over the first or second principal surface. A pixel substrate includes a second substrate (201) having a third principal surface (201a) and a fourth principal surface (201b), a plurality of light-emitting elements (202) mounted over the third principal surface, a driver IC (205) mounted over the third principal surface, an external connection terminal mounted over the third principal surface, and a second wiring member (206) placed on the third or fourth principal surface. The driver IC drives the plurality of light-emitting elements. The external connection terminal receives an input signal that is supplied from outside the pixel substrate. The second substrate (201) is disposed to be stacked on top of the first substrate (110) so that the first principal surface and the fourth principal surface face each other.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: October 22, 2019
    Assignee: SHARP KABUSHIKI KAISHA
    Inventor: Katsuji Iguchi
  • Patent number: 10454061
    Abstract: This disclosure relates to an organic electroluminescent display device and a method of sealing the same capable of reducing a manufacturing time and a complexity of manufacturing process. The organic electroluminescent display device comprises a first substrate including an active area and a bezel area outside the active area, the first substrate including an organic light emitting layer and a passivation film covering the organic light emitting layer thereon; a second substrate facing to the first substrate; and a filling layer in a space between the first substrate and the second substrate, wherein the filling layer includes; a first region having a first hardness, and spaced apart at a predetermined distance from the a passivation film to surround the protective layer in the bezel area; and a second region having a second hardness lower than the first hardness, and positioned inside the first region to be contacted with the first region.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: October 22, 2019
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Jang Jo, Jongsung Kim, Hyunggeun Kwon
  • Patent number: 10444445
    Abstract: An integrated silicon-based photo-detection system, fabricated in an integrated silicon based structure on a silicon-on-insulator (SOI) wafer, includes a photodiode fabricated on an isolated area surrounded by a light barrier, where the light barrier is an area where the SOI wafer is removed, an optical waveguide that guides an input signal light into the photodiode, and external electrical traces that the free electron carriers flow into as photocurrent. A method of fabricating an integrated silicon-based photo-detection system in an integrated silicon based structure on a silicon-on-insulator (SOI) wafer, includes performing deep etching to create a light barrier surrounding an isolated area on the SOI wafer, fabricating a photodiode in the isolated area surrounded by the light barrier, fabricating an optical waveguide that guides an input signal light into the photodiode, and wirebonding external electrical traces to connect to the remainder of the integrated silicon based structure.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: October 15, 2019
    Assignee: Ciena Corporation
    Inventor: Francois Pelletier
  • Patent number: 10446708
    Abstract: An optocoupler device for receiving a load voltage larger than or equal to 5 KV includes a carrier, a supporting frame connected to the carrier, a light emitter and a light receiver spacedly mounted on the carrier, an electrical isolator at least partially disposed on the supporting frame, a translucent encapsulate, and an opaque encapsulate. The electrical isolator is translucent and has a dielectric strength larger than or equal to 50 KV/mm. A shortest light transmitting path between the light emitter and the light receiver passes through the electrical isolator. The supporting frame, the light emitter, the light receiver, and at least part of the electrical isolator are embedded in the translucent encapsulate, and the translucent encapsulate is embedded in the opaque encapsulate.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: October 15, 2019
    Assignee: ANPEC ELECTRONICS CORPORATION
    Inventors: Chien-Chung Hsiao, Chih-Cheng Chien
  • Patent number: 10439117
    Abstract: An optical device includes a substrate, a conductive layer formed over the substrate, an insulating layer formed over the conductive layer, a first optical element disposed over the conductive layer, and a sealing resin part configured to cover the first optical element. The conductive layer includes a first conductive section, a second conductive section spaced apart from the first conductive section, and a first conductive portion extending in a first direction from the first conductive section. The first conductive portion is spaced apart from the second conductive section in a second direction intersecting with the first direction, and the insulating layer includes a first insulating part formed over the first conductive portion, and the first insulating part includes a portion overlapping with the second conductive section in the first direction.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: October 8, 2019
    Assignee: Rohm Co., Ltd.
    Inventor: Riki Shimabukuro
  • Patent number: 10436990
    Abstract: Methods and systems for two-dimensional mode-matching grating couplers may include in a photonic chip comprising a grating coupler at a surface of the photonic chip, the grating coupler having increased scattering strength in a direction of a light wave traveling through the grating coupler: receiving an optical signal from a first direction within the photonic chip; and scattering the optical signal out of the surface of the photonic chip. A second optical signal may be received in the grating coupler from a second direction within the photonic chip. The second optical signal may be scattered out of the surface of the photonic chip. The increasing scattering strength may be configured by increased width scatterers along a direction perpendicular to the direction of light travel. The increased scattering strength may be configured by a transition of shapes of scatterers in the grating coupler.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: October 8, 2019
    Assignee: Luxtera, Inc.
    Inventors: Roman Bruck, Attila Mekis
  • Patent number: 10432832
    Abstract: An alignment member for alignment of a sensor board relative an optics unit where the alignment member is arranged to couple the sensor board to the optics unit. The alignment member comprises: a section formed by a thermoplastic material and arranged to support the sensor board; and a heating element which upon activation is arranged to transfer heat to the section such that the section at least partly is heated to a temperature being at least the glass transition temperature for the thermoplastic material for enabling alignment of the sensor board relative the optics unit. A camera arrangement comprises a sensor board, an optics unit, and an alignment member. A method for aligning a sensor board relative an optics unit.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: October 1, 2019
    Assignee: Axis AB
    Inventors: Stig Frohlund, Andreas Karlsson Jägerman
  • Patent number: 10400958
    Abstract: A light-emitting device package includes a metalized substrate, a light-emitting diode (LED) die, and a single primary optic. The metalized substrate includes a top surface, pads on the top surface, and traces extending from the pads. The LED die is mounted on the pads of the metalized substrate. The LED die includes individually addressable segments. Each segment includes one or more junctions. The primary optic is located over the LED die.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: September 3, 2019
    Assignee: LUMILEDS LLC
    Inventor: Kenneth John Vampola
  • Patent number: 10381524
    Abstract: To provide a semiconductor light emitting element of which color irregularity is improved, the semiconductor light emitting element according to the present invention comprises: a support substrate; a semiconductor laminated structural body provided on the support substrate, the semiconductor laminated structural body having a first semiconductor layer, a luminescent layer, and a second semiconductor layer; a first electrode electrically connected to the first semiconductor layer; a second electrode electrically connected to the second semiconductor layer; a light shielding member covering a portion of an upper surface and side surfaces of the semiconductor laminated structural body, the light shielding member electrically separated from both of the first electrode and the second electrode; and a wavelength conversion member covering an upper surface not covered by the light shielding member of the semiconductor laminated structural body.
    Type: Grant
    Filed: March 27, 2013
    Date of Patent: August 13, 2019
    Assignee: NICHIA CORPORATION
    Inventor: Hiroaki Matsumura
  • Patent number: 10355146
    Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, such as proximity sensing or optical ranging devices. One embodiment is directed to an optical sensor package that includes a substrate, a sensor die coupled to the substrate, a light-emitting device coupled to the substrate, and a cap. The cap is positioned around side surfaces of the sensor die and covers at least a portion of the substrate. The cap includes first and second sidewalls, an inner wall having first and second side surfaces and a mounting surface, and a cover in contact with the first and second sidewalls and the inner wall. The first and second side surfaces are transverse to the mounting surface, and the inner wall includes an opening extending into the inner wall from the mounting surface. A first adhesive material is provided on the sensor die and at least partially within the opening, and secures the inner wall to the sensor die.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: July 16, 2019
    Assignee: STMICROELECTRONICS PTE LTD
    Inventors: Jing-En Luan, Laurent Herard, Yong Jiang Lei
  • Patent number: 10340660
    Abstract: A tunable laser configured in a small package subassembly including a gain chip positioned in the interior space between first and second tunable filter subassemblies. The tunable laser is packaged in either a rectangular or cylindrical housing, with an electrical input interface positioned at one end of the housing.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: July 2, 2019
    Assignee: NeoPhotonics Corporation
    Inventor: Andrew John Daiber
  • Patent number: 10333094
    Abstract: Optoelectronic device comprising an organic active layer provided for generating electromagnetic radiation, and first and second electrodes contacting the active layer. The second electrode has a second electrode layer. The first electrode comprises a first electrode layer and a first connection layer spaced at least in places from the first electrode layer, with the active layer being arranged at least in places therebetween, and through vias extend through the active layer and form an electrical contact between the first electrode layer and the first connection layer. The through vias form a contiguous through via structure that subdivides the second electrode layer into a plurality of sub-regions which are spaced from one another and wherein the contiguous through via structure subdivides the active layer into a plurality of regions which are separate from one another. In operation, the through vias are electrically conductively connected to one another directly.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: June 25, 2019
    Assignee: OSRAM OLED GmbH
    Inventor: Thomas Wehlus
  • Patent number: 10312661
    Abstract: A composite semiconductor laser is made by securing a III-V wafer to a transfer wafer. A substrate of the III-V wafer is removed, and the III-V wafer is etched into a plurality of chips while the III-V wafer is secured to the transfer wafer. The transfer wafer is singulated. A portion of the transfer wafer is used as a handle for bonding the chip in a recess of a silicon device. The chip is used as a gain medium for the semiconductor laser.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: June 4, 2019
    Assignee: Skorpios Technologies, Inc.
    Inventor: Damien Lambert
  • Patent number: 10310174
    Abstract: According to one embodiment, a light source device includes a light-emitting chip, and a case in which the light-emitting chip is accommodated. The case includes a light-emitting surface which transmits light from the light-emitting chip, and a plurality of sidewalls extending so as to intersect the light-emitting surface. At least a part of the sidewalls is colored or painted in black.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: June 4, 2019
    Assignee: Japan Display Inc.
    Inventor: Ken Sugiyama
  • Patent number: 10256386
    Abstract: A light emitting device includes a substrate, a plurality of first wiring members, a plurality of second wiring members and a plurality of light emitting elements. The first wiring members extend in a first direction. The second wiring members extend in a second direction. Each of the second wiring members is segmented into a plurality of second wiring portions. The light emitting elements are disposed along the second direction. A first electrode of the light emitting element is connected to a corresponding one of the first wiring members. A second electrode of the light emitting element has a first connection part and a second connection part that is linked to the first connection part. The first connection part and the second connection part are connected to a corresponding one of the second wiring members and bridge at least two of the segmented second wiring portions in the second direction.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: April 9, 2019
    Assignee: NICHIA CORPORATION
    Inventor: Takuya Nakabayashi
  • Patent number: 10181550
    Abstract: A lateral light emitting diode device includes: a substrate; an n-type GaN layer disposed on the substrate; an activation layer disposed on the n-type GaN layer; a p-type GaN layer disposed on the activation layer; a current spreading layer disposed on the p-type GaN layer; a p-electrode disposed on the current spreading layer; a MESA region formed by removing portions of the current spreading layer, the p-type GaN layer, the activation layer, and the n-type GaN layer; a transparent window layer disposed on the n-type GaN layer in the entire or part of the MESA region; a plurality of contact plugs which is in contact with the n-type GaN layer through the transparent window layer; and an n-electrode disposed on the transparent window layer to connect the plurality of contact plugs to each other.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: January 15, 2019
    Assignee: Korea University Research and Business Foundation
    Inventors: Tae Yeon Seong, Ki Seok Kim, Hwan Kyo Kim, Dae-Hyun Kim
  • Patent number: 10181552
    Abstract: A package, includes a cup-shaped resin component having a bottom surface and side walls that surround the bottom surface, an opening which is opened at an upper part of the side walls, a pair of leads exposed on part of the bottom surface, and a reflective film, the resin component having a 3-D shape defined by an X axis, a Y axis and a Z axis, the outer surface of the side walls that has a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening, and the reflective film being disposed in the recess.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: January 15, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Koji Abe, Tomohisa Kishimoto
  • Patent number: 10163994
    Abstract: The invention provides an OLED panel manufacturing method and OLED panel. The method comprises: forming first (21) and second (22) pixel electrodes inside each pixel unit (2); depositing an insulation film by an atomic layer deposition method, and patternizing to form a pixel electrode isolation insulation layer (3); the pixel electrode isolation insulation layer having a longitudinal portion (31) filling between the first (21) and second (22) pixel electrodes, and a latitudinal portion (32) having both ends covering respectively a part of the first pixel electrode (21) closer to the second pixel electrode (22) and a part of the second pixel electrode (22) closer to the first pixel electrode (21); forming a pixel isolation layer (4), and printing LOED elements (5); the invention can increase OLED panel resolution without changing printing accuracy so that the first (21) and second (22) pixel electrodes are completely insulated.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: December 25, 2018
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Xiaoxing Zhang
  • Patent number: 10128400
    Abstract: The present invention relates to an optocoupler including a light source having a body and electrical leads, a light detector having a diode stack a metal end cap and electrical leads, and an optical cavity including optically transparent material at least partially covering the body of the light source and the diode stack of the light detector. Also included is a reflective layer including optically reflective material surrounding the optical cavity. The electrical leads of the light source, the metal end cap and the electrical leads of the light detector protrude from the optical cavity and the reflective layer.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: November 13, 2018
    Assignee: HARRIS CORPORATION
    Inventors: Stuart D. Wood, Steven M. DeSmitt, Eugene G. Olczak
  • Patent number: 10074769
    Abstract: A method of producing an optoelectronic component includes providing a carrier having a carrier surface, a first lateral section of the carrier surface being raised relative to a second lateral section of the carrier surface; arranging an optoelectronic semiconductor chip having a first surface and a second surface on the carrier surface, wherein the first surface faces toward the carrier surface; and forming a molded body having an upper side facing toward the carrier surface and a lower side opposite the upper side, the semiconductor chip being at least partially embedded in the molded body.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: September 11, 2018
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Thomas Schwarz, Hans-Jürgen Lugauer, Jürgen Moosburger, Stefan Illek, Tansen Varghese, Matthias Sabathil
  • Patent number: 10064272
    Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: August 28, 2018
    Assignee: GENESIS PHOTONICS INC.
    Inventors: Hao-Chung Lee, Yu-Feng Lin, Meng-Ting Tsai
  • Patent number: 10026879
    Abstract: A light emitting element includes an n-type semiconductor layer having an upper surface; a p-type semiconductor layer over a portion of the upper surface of the n-type semiconductor layer, the p-type semiconductor layer having an upper surface; a protective film continuously covering the n-type semiconductor layer and the p-type semiconductor layer, the protective film defining an n-side opening at the upper surface of the n-type semiconductor layer and a p-side opening at an upper surface of the p-type semiconductor layer; a p-side electrode on the upper surface of the p-type semiconductor layer that is exposed in the p-side opening; an n-side electrode on the upper surface of the n-type semiconductor layer that is exposed at the n-side opening, n-side electrode having an n-side light-transmissive electrode; and an n-side pad electrode on the upper surface of the n-side light-transmissive electrode.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: July 17, 2018
    Assignee: NICHIA CORPORATION
    Inventors: Masahiko Onishi, Yasuhiro Miki
  • Patent number: 10020426
    Abstract: A light emitting device includes a base and a light emitting diode chip, the light emitting diode chip is formed on a top surface of the base, an outline of a projection of the light emitting diode chip projected on the top surface of the base is positioned in the top surface of the base. The light emitting device further includes a light reflecting portion, the light reflecting portion is formed on the top surface of the base, the light reflecting portion is defined around the light emitting diode chip, a height of the light reflecting portion is less than a height of the light emitting diode chip.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: July 10, 2018
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC
    Inventors: Chia-Hui Shen, Tzu-Chien Hung, Chien-Chung Peng, Chien-Shiang Huang, Chih-Jung Liu
  • Patent number: 10014441
    Abstract: Disclosed is a light-emitting device comprising a light-emitting stack having a length, a width, a first conductivity type semiconductor layer, an active layer on the first conductivity type semiconductor layer, and a second conductivity type semiconductor layer on the active layer, wherein the first conductivity type semiconductor layer, the active layer, and the second conductivity type semiconductor layer are stacked in a stacking direction. A first electrode is coupled to the first conductivity type semiconductor layer and extended in a direction parallel to the stacking direction and a second electrode is coupled to the second conductivity type semiconductor layer and extended in a direction parallel to the stacking direction. A dielectric layer is disposed between the first electrode and the second electrode.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: July 3, 2018
    Assignee: EPISTAR CORPORATION
    Inventors: Shih-I Chen, Wei-Yu Chen, Yi-Ming Chen, Ching-Pei Lin, Tsung-Xian Lee
  • Patent number: 10001611
    Abstract: An optical transceiver by hybrid multichip integration. The optical transceiver includes a PCB with a plurality of prefabricated surface bonding sites. A first chip includes a FOWLP package of multiple electronics devices embedded in a dielectric molding layer overlying a dielectric redistribution layer is disposed on the PCB by respectively bonding a plurality of conductor balls between the dielectric redistribution layer and the plurality of prefabricated surface bonding sites while exposing soldering material filled in multiple through-mold vias (TMVs) in the dielectric molding layer. The optical transceiver further includes a second chip configured as a Sipho die comprising photonics devices embedded in a SOI wafer substantially free from any electronics device process. The second chip is stacked over the first chip with multiple conductor bumps being bonded respectively to the soldering material in the multiple TMVs.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: June 19, 2018
    Assignee: INPHI CORPORATION
    Inventors: Liang Ding, Radhakrishnan L. Nagarajan, Roberto Coccioli
  • Patent number: 9991430
    Abstract: A light emitting device includes a light emitting layer, a substrate that is transparent to an emission wavelength of the light emitting layer and positioned to receive an emission wavelength from the light emitting layer, a convex pattern including a collection of a plurality of convex portions discretely arranged on a front surface of the substrate with a first pitch, an n type nitride semiconductor layer located on the front surface of the substrate to cover the convex pattern and a p type nitride semiconductor layer located on the light emitting layer. The light emitting layer is located on the n type semiconductor layer. Each of the convex portions includes a sub convex pattern comprising a plurality of fine convex portions discretely formed at the top of the convex portion with a second pitch smaller than the first pitch, and a base supporting the sub convex pattern.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: June 5, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Nobuaki Matsui, Hirotaka Obuchi, Yasuo Nakanishi, Kazuaki Tsutsumi, Takao Fujimori
  • Patent number: 9909738
    Abstract: The invention provides a lighting device comprising (i) a light source configured to generate light source light, and (ii) a light converter configured to convert at least part of the light source light into visible converter light, wherein the light converter comprises a polymeric host material with light converter nanoparticles embedded in the polymeric host material, wherein the polymeric host material is based on radical polymerizable monomers, and wherein the polymeric host material contains equal to or less then 5 ppm radical initiator based material relative to the total weight of the polymeric host material.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: March 6, 2018
    Assignees: Koninklijke Philips N.V., Samsung Electronics Co., Ltd.
    Inventors: Shu Xu, Marius Gabriel Ivan, Craig Allen Breen, Rifat Ata Mustafa Hikmet
  • Patent number: 9899465
    Abstract: A structure with an interconnection layer for redistribution of electrical connections includes a plurality of first electrical connections disposed on a substrate in a first arrangement. An insulating layer is disposed on the substrate over the first electrical connections. A plurality of second electrical connections is disposed on the insulating layer on a side of the insulating layer opposite the plurality of first electrical connections in a second arrangement. Each second electrical connection is electrically connected to a respective first electrical connection. An integrated circuit is disposed on the substrate and is electrically connected to the first electrical connections. The first electrical connections in the first arrangement have a greater spatial density than the second electrical connections in the second arrangement.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: February 20, 2018
    Assignee: X-Celeprint Limited
    Inventors: Christopher Bower, Matthew Meitl, Ronald S. Cok
  • Patent number: 9893817
    Abstract: A programmable integrated circuit (IC) comprising a single body of semiconductor is disclosed. The IC comprises at least one optical transducer as an integral part of the programmable integrated circuit on the same body of semiconductor, the optical transducer being operable to receive an optical input indicative of programming instructions and at least one storage element communicatively coupled to the optical transducer and being operable to store thereon the programming instructions or an adaptation thereof. The programming instructions received via the optical input are configured to direct the operation of the IC.
    Type: Grant
    Filed: May 28, 2015
    Date of Patent: February 13, 2018
    Assignee: INSiAVA (Pty) Ltd.
    Inventors: Petrus Johannes Venter, Marius Eugene Goosen, Christo Janse Van Rensburg, Nicolaas Matteus Fauré
  • Patent number: 9882073
    Abstract: A composite photonic device comprises a platform, a chip, and a contact layer. The platform comprises silicon. The chip is made of a III-V material. The contact layer has indentations to help control a flow of solder during bonding of the platform with the chip. In some embodiments, pedestals are placed under an optical path to prevent solder from flowing between the chip and the platform at the optical path.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: January 30, 2018
    Assignee: Skorpios Technologies, Inc.
    Inventors: Stephen B. Krasulick, John Dallesasse, Amit Mizrahi, Timothy Creazzo, Elton Marchena, John Y. Spann
  • Patent number: 9859465
    Abstract: A method of manufacturing a nitride semiconductor element includes dry etching a main surface of a sapphire substrate at a c-plane side thereof, using a mask provided on the main surface, to form a plurality of projections, each having a circular bottom surface; wet etching the sapphire substrate to form an upper part of each projection into a triangular pyramid shape while maintaining the circular bottom surface of the projection; and growing a semiconductor layer made of a nitride semiconductor on a dry etched surface and a wet etched surface of the sapphire substrate.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: January 2, 2018
    Assignee: NICHIA CORPORATION
    Inventor: Tomohiro Shimooka
  • Patent number: 9831407
    Abstract: Disclosed herein are a light emitting device package, a backlight unit, an illumination apparatus, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: November 28, 2017
    Assignee: LUMENS CO., LTD.
    Inventors: Seung-Hyun Oh, Sung-Sik Jo, Jung-A Lim, Sung-Yole Yun, Ji-Yeon Lee, Bo-Young Kim
  • Patent number: 9820637
    Abstract: An image pickup apparatus includes a substrate, on a first surface of which a light receiving section and a peripheral circuit section are formed, a multilayer wiring layer stacked on the first surface and including a plurality of metal layers and insulating layers, a translucent cover located on the multilayer wiring layer, and a side surface sealing member which extends from a peripheral section of a surface in the translucent cover to the substrate side while having a frame shape, and protects outer peripheral side surfaces of the multilayer wiring layer.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: November 21, 2017
    Assignee: OLYMPUS CORPORATION
    Inventors: Takatoshi Igarashi, Noriyuki Fujimori
  • Patent number: 9768153
    Abstract: A light-emitting apparatus package of the present invention includes (i) an electrically insulated ceramic substrate, (ii) a first concave section formed in the direction of thickness of the ceramic substrate so as to form a light exit aperture in a surface of the ceramic substrate, (iii) a second concave section formed within the first concave section in the further direction of thickness of the ceramic substrate so that one or more light-emitting devices are provided therein, (iv) a wiring pattern for supplying electricity, which is provided in the first concave section, and (v) a metalized layer having light-reflectivity, which is (a) provided between the light-emitting device and the surface of the second concave section of the substrate, and (b) electrically insulated from the wiring pattern.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: September 19, 2017
    Assignee: SHARP KABUSHIKI KAISHA
    Inventor: Tsukasa Inoguchi
  • Patent number: 9748208
    Abstract: A light-emitting device includes a substrate, and a plurality of light-emitting arrays or light-emitting groups arranged on the substrate. The light-emitting arrays or light-emitting groups include a plurality of LED elements connected in parallel with a pair of adjacent electrodes. The number of the LED elements constituting each of the light-emitting arrays or the light-emitting groups differs in each of the light-emitting arrays or the light-emitting groups. Of the plurality of light-emitting arrays arranged in parallel with each other or the light-emitting groups arranged in a line, the number of the LED elements of the light-emitting arrays or the light-emitting groups positioned inside the substrate is more than the number of the LED elements of the light-emitting arrays or the light-emitting groups positioned outside the substrate.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: August 29, 2017
    Assignees: CITIZEN ELECTRONICS CO., LTD., CITIZEN WATCH CO., LTD.
    Inventor: Koichi Fukasawa