Discrete Light Emitting And Light Responsive Devices Patents (Class 257/82)
  • Patent number: 11222594
    Abstract: A digital pixel driving circuit and a digital pixel driving method. The digital pixel driving circuit includes a pixel driving module, a display module, a storage module and a short-circuiting module. An output terminal of the pixel driving module is electrically connected to an input terminal of the display module, and a control terminal of the pixel driving module is electrically connected to any output terminal of the storage module. An input terminal of the short-circuiting module is electrically connected to the input terminal of the display module, an output terminal of the short-circuiting module is electrically connected to an output terminal of the display module, and a control terminal of the short-circuiting module is electrically connected to any output terminal of the storage module.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: January 11, 2022
    Assignee: CHENGDU VISTAR OPTOELECTRONICS CO., LTD.
    Inventor: Cuili Gai
  • Patent number: 11216636
    Abstract: An electronic device is disclosed. According to an embodiment, an electronic device may comprise: a transparent member; a display panel that is disposed beneath the transparent member and comprises multiple pixels and at least one transmission area which is formed between the multiple pixels and through which light can pass; a biometric sensor which is disposed beneath the display panel and can acquire light that has been output through at least some of the multiple pixels, has been reflected by an external object near or in contact with the transparent member, and then has passed through the at least one transmission area; and a light path changing member disposed between the biometric sensor and the display panel and spaced a predetermined distance apart from the biometric sensor, the light path changing member being able to change an optical path with respect to at least a part of the light having passed through the at least one transmission area.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: January 4, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung Hoon Song, Jeong Hoo Kim, Sun A Kim, Kwang Sub Lee, Se Young Jang, Chi Hyun Cho
  • Patent number: 11197377
    Abstract: The present invention comprises: a base film on which a first element mounting part and a second element mounting part are defined; wiring patterns formed by extending from each of the first element mounting part and the second element mounting part on the base film, wherein the wiring patterns include a first terminal part in the first element mounting part and a second terminal part in the second element mounting part; and a first plating layer formed on the second terminal part, wherein the first plating layer includes a pure metal plating layer, and the first plating layer is not formed on the first terminal part.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: December 7, 2021
    Assignee: STEMCO CO., LTD.
    Inventors: Hong Man Kim, Kang Dong Kim, Won Tae Jo, Duck Jae Seo, Jung Sub Kim
  • Patent number: 11177248
    Abstract: A light-emitting component may include an IC chip and an LED chip arranged on a top surface of the IC chip and electrically coupled thereto. The LED chip may be electrically controllable by means of the IC chip. The IC chip may have at least two electrical connecting surface on a bottom surface remote from the LED chip. The light-emitting component is electrically contactable and operable by means of the connecting surfaces.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: November 16, 2021
    Assignee: OSRAM OLED GMBH
    Inventors: Thomas Schwarz, Frank Singer
  • Patent number: 11170705
    Abstract: The present specification provides a pixel circuit miniaturized using a smaller number of transistors as compared with the related art. A 4T static random-access memory (SRAM) is used in an embedded pixel memory, and in order to prevent a voltage floating problem from occurring in a logic low state, a leakage current is designed to flow in one direction by adjusting a threshold voltage of a transistor. In addition, a pulse width modulation (PWM) control unit uses a smaller number of transistors as compared with the related art, and in order to prevent a voltage floating problem from occurring, a circuit capable of removing a floating voltage is provided.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: November 9, 2021
    Assignee: SAPIEN SEMICONDUCTORS INC.
    Inventors: Jae Hoon Lee, Jin Woong Jang
  • Patent number: 11165026
    Abstract: A heterocyclic compound represented by Formula 1 and an organic electroluminescence device including the same in an emission layer. In Formula 1, Z is represented by Formula 2-1 or 2-2. In Formula 2-2, X1 to X3 are each independently CR10 or N, and at least one of X1 to X3 is N.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: November 2, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventor: Hiroaki Itoi
  • Patent number: 11120739
    Abstract: A display device including a substrate and a plurality of pixels in a display region of the substrate. Each of the pixels includes first and second sub-pixels, and each of the first and second sub-pixels has a light emitting region for emitting light. The first sub-pixel includes a first light emitting element in the light emitting region and configured to emit visible light. The second sub-pixel includes a second light emitting element in the light emitting region and configured to emit infrared light and a light receiving element configured to receive the infrared light emitted from the second light emitting element to detect a user's touch. The second light emitting element and the light receiving element in the second sub-pixel are electrically insulated from and optically coupled to each other to form a photo-coupler.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: September 14, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hyun Min Cho, Dae Hyun Kim, Sung Chul Kim, Hye Yong Chu, Keun Kyu Song
  • Patent number: 11069667
    Abstract: Wafer level proximity sensors are formed by processing a silicon substrate wafer and a silicon cap wafer separately, bonding the cap wafer to the substrate wafer, forming an interconnect structure of through-silicon vias within the substrate, and singulating the bonded wafers to yield individually packaged sensors. The wafer level proximity sensor is smaller than a conventional proximity sensor and can be manufactured using a shorter fabrication process at a lower cost. The proximity sensors are coupled to external components by a signal path that includes the through-silicon vias and a ball grid array formed on a lower surface of the silicon substrate. The design of the wafer level proximity sensor passes more light from the light emitter and more light to the light sensor.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: July 20, 2021
    Assignee: STMICROELECTRONICS PTE LTD
    Inventor: David Gani
  • Patent number: 11067884
    Abstract: A device includes a display stack and an optical receiver. The display stack includes a set of opaque elements defining a translucent aperture. The translucent aperture extends through the display stack. The optical receiver is spaced apart from and behind a back surface of the display stack. At least one micro-optic element is formed on the back surface of the display stack, between the display stack and the optical receiver. The at least one micro-optic element includes a micro-optic element having a focal point located within the translucent aperture. The optical receiver is configured to receive light through the translucent aperture and the at least one micro-optic element.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: July 20, 2021
    Assignee: Apple Inc.
    Inventors: Tong Chen, Mark T. Winkler, Meng-Huan Ho, Rui Liu, Xiao Xiang, Wenrui Cai
  • Patent number: 11056607
    Abstract: A complex sensing device packaging structure includes a light emitting element sealed in a first transparent molding material, a light sensing element sealed in a second transparent molding material, a substrate disposed with the light emission element, the light sensing element, the first transparent molding material and the second transparent molding material, and an opaque blocking element disposed on the substrate and between the first transparent molding material and the second transparent molding material, wherein the opaque blocking element is formed by performing a solidifying process to an opaque glue being liquid at the room temperature.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: July 6, 2021
    Assignee: SensorTek technology Corp.
    Inventors: Wen-Chieh Tsou, Yi-Hua Chang, Chih-Wei Chen
  • Patent number: 11024656
    Abstract: An active matrix substrate in which step-caused disconnection of a metal film in a contact hole does not easily occur includes a first to third insulating films and first to third metal films on a glass substrate and a contact hole electrically connecting the first and second metal film, the contact hole including first to third hole present respectively in the first to third insulating films, the first and third metal films being in contact with each other inside the first hole, the second insulating film and an oxide semiconductor film overlapping with each other in a region below the third hole, the second and third metal films being in contact with each other in a region above the first insulating film and either inside or below the third hole.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: June 1, 2021
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Tohru Okabe, Hirohiko Nishiki, Takeshi Yaneda
  • Patent number: 11005001
    Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: May 11, 2021
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Markus Rossi
  • Patent number: 11004894
    Abstract: A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: May 11, 2021
    Assignee: Intel Corporation
    Inventors: Khaled Ahmed, Kunjal Parikh, Peter L. Chang
  • Patent number: 10974645
    Abstract: A vehicle pane is disclosed which may have a film arranged on the pane inner side, with a lighting device, which is coupled to the film and which can radiate light into a lighting layer of the film, and with a screen-like cover covering the lighting device, wherein according to the invention the cover forms a fixed connection between a film portion of the film arranged further towards the center of the pane relative to the lighting device and a frame arranged further towards the outer edge of the pane relative to the lighting device or arranged along the edge of the pane.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: April 13, 2021
    Assignee: WEBASTO SE
    Inventor: Johannes Thannheimer
  • Patent number: 10957677
    Abstract: A plurality of modules are included by an electronic device, so as to be disposed adjacent to each other. Each of the modules includes a light emitting element configured to emit communication light toward an adjacent module disposed in one adjacent direction, and a light receiving element configured to receive communication light emitted by an adjacent module disposed in the other adjacent direction. Each of the modules disposed adjacent to each other is capable of emitting the communication light to the light receiving element of the adjacent module disposed in the one adjacent direction, and capable of receiving the communication light emitted by the light emitting element of the adjacent module disposed in the other adjacent direction.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: March 23, 2021
    Assignee: FANUC CORPORATION
    Inventors: Shinichi Kuwahata, Yoshiyuki Kubo
  • Patent number: 10947449
    Abstract: The present invention relates to an organic light-emitting diode exhibiting high efficiency and longevity. The organic light-emitting diode comprises: a first electrode; a second electrode facing the first electrode; and a light-emitting layer interposed between the first electrode and the second electrode, wherein the light-emitting layer contains at least one of the amine compounds represented by Chemical Formula A or Chemical Formula B and at least one of the compounds represented by Chemical Formulas H1 to H7, Chemical Formulas A, B, and H1 to H7 being the same as in the specification.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: March 16, 2021
    Assignee: SFC CO., LTD.
    Inventors: Hee-Dae Kim, Seok-Bae Park, Yoona Shin, Yu-Rim Lee, Sang-Woo Park, Soon-Wook Cha
  • Patent number: 10950755
    Abstract: A light emitting diode is provided to include a first conductive-type semiconductor layer; a mesa including a second conductive-type semiconductor layer disposed on the first conductive-type semiconductor layer and an active layer interposed between the first and the second conductive-type semiconductor layers; and a first electrode disposed on the mesa, wherein the first conductive-type semiconductor layer includes a first contact region disposed around the mesa along an outer periphery of the first conductive-type semiconductor layer; and a second contact region at least partially surrounded by the mesa, the first electrode is electrically connected to at least a portion of the first contact region and at least a portion of the second contact region, and a linewidth of an adjoining region between the first contact region and the first electrode is greater than the linewidth of an adjoining region between the second contact region and the first electrode.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: March 16, 2021
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Jong Hyeon Chae, Joon Sup Lee, Daewoong Suh, Won Young Roh, Min Woo Kang, Jong Min Jang, Se Hee Oh, Hyun A Kim
  • Patent number: 10897015
    Abstract: Provided is an organic light-emitting device including a first electrode, a second electrode, and an emission layer therebetween, wherein the emission layer includes a compound represented by the following formula: Wherein X1 and X2 are each independently O or S, A1 is a 6-membered aromatic group or a 6-membered heteroaromatic group, and details of other constituents are provided in the disclosure.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: January 19, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Daeyup Shin, Seulong Kim, Taekyung Kim
  • Patent number: 10895372
    Abstract: A light source board includes a substrate; a metal reactive layer disposed on the substrate; a metal conductive layer disposed on the metal reactive layer; a metal alloy layer disposed on the metal conductive layer; and at least one light source disposed on the metal alloy layer. A material of the metal reactive layer is a Sn—Bi type alloy or a Sn—Ag—Cu type alloy, and arrangements of materials of the metal reactive layer and the metal conductive layer are respectively an arrangement of silver paste and copper, an arrangement of silver paste and nickel, an arrangement of silver paste and silver, an arrangement of copper paste and copper, an arrangement of copper paste and nickel, or an arrangement of copper paste and silver.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: January 19, 2021
    Assignee: Darfon Electronics Corp.
    Inventors: Heng-Yi Huang, Hsin-Cheng Ho, Tsai-Yu Chen, Hung-Chuan Cheng
  • Patent number: 10826001
    Abstract: An Organic Light-Emitting Diode (OLED) array substrate and a display apparatus. The OLED array substrate includes a base substrate, a pixel driving circuit and an OLED display element layer which are arranged on the base substrate. The OLED array substrate further includes a solar cell, the solar cell is arranged on a side of the pixel driving circuit which faces an incident ambient light, the solar cell and the pixel driving circuit are insulated from each other, and the solar cell and the OLED display element layer are insulated from each other.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: November 3, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Weilong Zhou
  • Patent number: 10784406
    Abstract: A light emitting diode is provided to include a first conductive-type semiconductor layer; a mesa including a second conductive-type semiconductor layer disposed on the first conductive-type semiconductor layer and an active layer interposed between the first and the second conductive-type semiconductor layers; and a first electrode disposed on the mesa, wherein the first conductive-type semiconductor layer includes a first contact region disposed around the mesa along an outer periphery of the first conductive-type semiconductor layer; and a second contact region at least partially surrounded by the mesa, the first electrode is electrically connected to at least a portion of the first contact region and at least a portion of the second contact region, and a linewidth of an adjoining region between the first contact region and the first electrode is greater than the linewidth of an adjoining region between the second contact region and the first electrode.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: September 22, 2020
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Jong Hyeon Chae, Joon Sup Lee, Daewoong Suh, Won Young Roh, Min Woo Kang, Jong Min Jang, Se Hee Oh, Hyun A Kim
  • Patent number: 10741126
    Abstract: Disclosed are a transistor assembly, an organic light emitting display panel including the same, and an organic light emitting display device including the organic light emitting display panel, in which a first electrode of a switching transistor is used as a gate of a driving transistor.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: August 11, 2020
    Assignee: LG DISPLAY CO., LTD.
    Inventors: HongRak Choi, SeHee Park, PilSang Yun, HyungJoon Koo, Kwanghwan Ji, Jaeyoon Park
  • Patent number: 10658422
    Abstract: A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: May 19, 2020
    Assignee: Intel Corporation
    Inventors: Khaled Ahmed, Kunjal Parikh, Peter L. Chang
  • Patent number: 10608830
    Abstract: The disclosure generally relates to power over fiber technology configured to provide electrical power and communications via fiber to one or more sensors of one or more varieties. More particularly, the disclosure relates to a sensor system comprising a laser data module operatively connected to a powered sensor module, wherein the powered sensor module receives a light, converts the light to electrical power, and powers a sensor with the electrical power, and wherein the powered sensor module transmits signals from the sensor to a laser data module.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: March 31, 2020
    Assignee: MH GOPOWER COMPANY LIMITED
    Inventors: Mei-huan Yang, Cheng-liang Wu, Terry Zahuranec, Remigio Perales, Kun-Hsien Chen, Wei-sheng Chao, Ying-lin Tseng, Te-chih Huang, Jheng-syuan Shih, Mu-kai Su
  • Patent number: 10581008
    Abstract: The present disclosure relates to a method of manufacturing a quantum dot having a tunable and narrow light emission wavelength for achieving a high color purity, which for example includes preparing a mixture by dissolving an indium precursor and a zinc precursor in an acid, forming an In(Zn)P-based core by adding a phosphorus compound to the mixture, forming a first shell coated on the In(Zn)P-based core by adding a selenium compound and the zinc precursor to the mixture, and forming a second shell coated on the first shell by adding a sulfur compound and the zinc precursor to the mixture and in which the first shell is formed of ZnSe and the second shell is formed of ZnS.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: March 3, 2020
    Assignee: DAEGU GYEONGBUK INSTITUTE OF SCIENCE & TECHNOLOGY
    Inventors: Jong Soo Lee, Parthiban Ramasamy
  • Patent number: 10578279
    Abstract: A light emitting device is disclosed. The light emitting device includes a mounting board, one or more light emitting elements arranged on the mounting board, a frame disposed to surround the one or more light emitting elements, and a light transmissive member encapsulating an area surrounded by the frame. The frame has an inner perimeter that includes at least a pair of opposing sides and four acute-angled portions each provided at each end of the pair of opposing sides, in a plan view.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: March 3, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Tomonori Miyoshi, Kenji Ozeki
  • Patent number: 10505140
    Abstract: The present disclosure provides an OLED display panel and a method for manufacturing the same. The OLED display panel includes an anode electrode layer, an anode electrode modifying layer, a first common layer, a light-emitting layer, a second common layer, and a cathode electrode layer. The anode electrode modifying layer is formed from an azobenzene-based compound. The azobenzene-based compound includes at least one functional group for transporting holes and at least one functional group for increasing solubility of the azobenzene-based compound in an organic solvent. In addition, the anode electrode modifying layer has a three-dimensional embossment grating structure.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: December 10, 2019
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Yunan Zhang
  • Patent number: 10352764
    Abstract: An optoelectronic module that includes a reflectance member which exhibits mitigated or eliminated fan-out field-of-view overlap can be concealed or its visual impact minimized compared to a host device in which the optoelectronic module is mounted. In some instances, the reflectance member can be implemented as a plurality of through holes and in other instances the reflectance member may be a contiguous spin-coated polymeric coating. In general, the reflectance member can be diffusively reflective to the same particular wavelengths or ranges of wavelengths as the host device in which it is mounted.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: July 16, 2019
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Jens Geiger, Frank Sobel, Rene Kromhof, Alberto Soppelsa, Kevin Hauser, Robert Lenart
  • Patent number: 10243111
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: March 26, 2019
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • Patent number: 10236464
    Abstract: An organic light emitting diode, including a first electrode; a second electrode facing the first electrode, the second electrode including magnesium; an emission layer between the first electrode and the second electrode; and an electron injection layer between the second electrode and the emission layer, the electron injection layer including a dipole material including a first component and a second component having different polarities, the dipole material including halide, and a content of the magnesium included in the second electrode being in a range of from 10 to 40 volume %.
    Type: Grant
    Filed: August 10, 2015
    Date of Patent: March 19, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Dong Chan Kim, Won Jong Kim, Eung Do Kim, Dong Kyu Seo, Da Hea Im, Sang Hoon Yim, Chang Woong Chu
  • Patent number: 10199428
    Abstract: A light-emitting device includes a mounting board, a first wiring, a plurality of light-emitting elements, a first light-transmissive member, and a second wiring. The first wiring includes a plurality of electrodes which are disposed away from each other on the mounting board. The plurality of light-emitting elements is provided on the mounting board and is electrically connected to the first wiring. The first light-transmissive member is disposed above the plurality of light-emitting elements. The second wiring is disposed on a lower surface of the first light-transmissive member and electrically connects between electrodes among the plurality of electrodes of the first wiring.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: February 5, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Masato Ono, Takahiro Oyu
  • Patent number: 10123710
    Abstract: A sensory-and-logic system comprises an illumination source configured to emit a blood-sensing light, a window through which the blood-sensing light passes en route to human tissue, an illumination receiver configured to measure the blood-sensing light reflected back through the window from the human tissue, a frame surrounding the window and elevating away from the window, and a pillow surrounding the frame and recessing from the frame and the window.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: November 13, 2018
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Gabriel Michael Rask Gassoway, Gregory Kim Justice, Mohammad Sakeri
  • Patent number: 10109759
    Abstract: A semiconductor module includes a photocoupler, a gate driving IC, and a switching element, and at least one of a first structure and a second structure, wherein the first structure is a structure where in a part of a surface of a first lead frame joined to a bottom surface electrode of a light-emitting element, a first conductive layer is disposed with an insulating layer interposed, and a top surface electrode of the light-emitting element, and the first conductive layer are electrically connected by a wire, and the second structure is a structure where in a part of a surface of a second lead frame joined to a bottom surface electrode of a light-receiving element, a second conductive layer is disposed with an insulating layer interposed, and a top surface electrode of the light-receiving element, and the second conductive layer are electrically connected by a wire.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: October 23, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventor: Toshiya Tadakuma
  • Patent number: 9978803
    Abstract: An imaging apparatus includes a plurality of unit circuits connected to a detection line, and a signal output circuit. Each of the plurality of unit circuits includes a light receiving device including an electrode connected to a wire and an electrode, and a transistor that controls electrical connection between the electrode and the detection line. The signal output circuit includes a light receiving device in a light-blocking state including an electrode connected to a wire and an electrode, and a detection circuit that outputs a detection signal according to a potential of a detection point between the electrode and the electrode when the light receiving device and the light receiving device are in a reverse bias state between the wire and the wire.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: May 22, 2018
    Assignee: Seiko Epson Corporation
    Inventor: Yasunori Koide
  • Patent number: 9966538
    Abstract: A novel compound for improving the power efficiency and the lifespan of a light-emitting element, and a light-emitting element and an electronic device including the same are provided. And the new compound may provide excellent light-emitting efficiency and extended lifespan, and may improve thermal stability (heat resistance) for the electronic device.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: May 8, 2018
    Assignee: LMS CO., LTD.
    Inventors: Jeong Og Choi, Joon Ho Jung, Oh Kwan Kwon
  • Patent number: 9946011
    Abstract: A laminated illuminating glazing unit includes a first sheet with a first main face, a second main face and an edge face, a second sheet with a first main face, a second main face and an edge face; a transparent lamination interlayer making adhesive contact with the second main face of the first sheet and with the first main face of the second sheet; a strip of light-emitting diodes (LEDs), including a printed circuit board and a plurality of LEDs, positioned so that the emitting faces of the LEDs face the edge face of the first sheet; and one or more scattering elements, wherein the lamination interlayer includes, on at least one of its main faces, an opaque masking layer extending from the edge of the interlayer toward the center of the glazing unit so as to cover a zone in which the light from the LEDs would, in the absence of the opaque masking layer, be visible, in the form of luminous halos, through the second sheet.
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: April 17, 2018
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Adèle Verrat-Debailleul, Mathieu Berard, Jean-Philippe Mulet
  • Patent number: 9941330
    Abstract: Devices and methods of forming the devices are disclosed. The device includes a substrate and a color LED pixel disposed on the substrate. The color LED pixel includes a red LED, a green LED and a blue LED. Each of the color LED includes a specific color LED body disposed on the respective color region on the substrate, a specific color multiple quantum well (MQW) on the respective color LED body and a specific color top LED layer disposed over the respective color MQW. The MQWs of the red LED, green LED and blue LED includes at least an indium gallium nitride (InxGa1?xN) layer and a gallium nitride (GaN), where x is the atomic percentage of In in the InxGa1?xN layer, and the MQWs of the red LED, green LED and blue LED have different bandgaps by varying x of the InxGa1?xN layer in the red LED, the green LED and the blue LED.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: April 10, 2018
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Srinivasa Banna, Deepak Nayak, Ajey P. Jacob
  • Patent number: 9847047
    Abstract: A display pixel suitable for being arranged on a carrier is provided. The display pixel includes a plurality of light-emitting diode chips. The light-emitting diode chips are disposed on and electrically connected to the carrier. Each of the light-emitting diode chips respectively serves as a sub-pixel and includes a semiconductor device layer, and the semiconductor device layer includes a display light-emitting mesa and at least one redundant light-emitting mesa. During a period of driving each of the light-emitting diode chips, one of the display light-emitting mesa and the at least one redundant light-emitting mesa in each of the light-emitting diode chips is capable of emitting light. A display panel including a plurality of the display pixels mentioned above is also provided.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: December 19, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Hsien Wu, Yen-Hsiang Fang, Yao-Jun Tsai
  • Patent number: 9825006
    Abstract: An electronic component device includes a first electronic component, a second electronic component disposed on and connected to the first electronic component, a first underfill resin filled between the first electronic component and the second electronic component, the first underfill resin having a base part arranged around the second electronic component and an alignment mark formed on an upper surface of the base part, a third electronic component disposed on and connected to the second electronic component, and a second underfill resin filled between the second electronic component and the third electronic component.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: November 21, 2017
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Shota Miki
  • Patent number: 9799633
    Abstract: A semiconductor light source comprising first and second light-emitting diode chips; and a conversion element containing a first phosphor and a second phosphor, wherein the conversion element is disposed downstream of the first and second light-emitting diode chips. The first light-emitting diode chip emits electromagnetic radiation with a first emission maximum. The second light-emitting diode chip emits electromagnetic radiation with a second emission maximum. The first phosphor has a first absorption maximum and a first radiating maximum. The second phosphor has a second absorption maximum, which differs from the first absorption maximum, and a second radiating maximum, which differs from the first radiating maximum. The degree of conversion of the first phosphor for the electromagnetic radiation of the first light-emitting diode chip is greater than the degree of conversion of the second phosphor for the electromagnetic radiation of the first light-emitting diode chip.
    Type: Grant
    Filed: June 6, 2013
    Date of Patent: October 24, 2017
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Ales Markytan, Christian Gärtner
  • Patent number: 9680107
    Abstract: Provided are a novel compound and an organic electronic device (OED) including the same. The novel compound has better hole injection and hole transport properties than a conventional material, and thus may enhance thermal stability and efficiency when used as a material for a hole injection or hole transport layer of the OED.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: June 13, 2017
    Assignee: LMS Co., Ltd.
    Inventors: Joon Ho Jung, Jeong Og Choi, Oh Kwan Kwon, Ah Reum Hwang
  • Patent number: 9588224
    Abstract: A proximity sensing device having an emitter die, a receiver die, a body is disclosed. The proximity sensor has an optical structure provided on the body. The optical structure may provide an optical path to allow radiation reflected by a near object that may be otherwise blocked by the body to be transmitted towards the receiver die. In addition to the proximity-sensing device, a sensing device having at least two trenches that allow close proximity sensing is disclosed. A method for sensing an object that involve determining whether the object correspond to a near object or a far object is presented.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: March 7, 2017
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Cherng Woei Heng, James Costello, Wee Sin Tan
  • Patent number: 9570002
    Abstract: Exemplary methods and systems use a micro light emitting diode (LED) in an active matrix display to emit light and a sensing IR diode to sense light. A display panel includes a display substrate having a display region, an array of subpixel circuits, and an array of selection devices. Each subpixel circuit includes a driving circuit to operate a corresponding infrared (IR) emitting LED in a light emission mode. Each selection device may be coupled to a corresponding sensing IR diode to operate the corresponding sensing IR diode in a light sensing mode.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: February 14, 2017
    Assignee: Apple Inc.
    Inventors: Kapil V. Sakariya, Tore Nauta
  • Patent number: 9530529
    Abstract: This invention relates to a radioisotope battery and a method of manufacturing the same, wherein manufacturing the radioisotope battery and shielding radiation emitted from the radioisotope Ni-63 from the outside are achieved simultaneously. This radioisotope battery includes a semiconductor layer, a seed layer formed on the semiconductor layer, a radioisotope layer formed on the seed layer, and a radiation shielding layer formed on the radioisotope layer and for shielding radiation of the radioisotope layer form the outside.
    Type: Grant
    Filed: April 10, 2014
    Date of Patent: December 27, 2016
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Byoung-Gun Choi, Sung-Weon Kang, Kyung-Hwan Park, Myung-Ae Chung
  • Patent number: 9520281
    Abstract: A method of fabricating an epitaxial device, comprising: providing a substrate having a first surface and a normal direction; epitaxially forming a first transition layer in a first temperature on the first surface of the substrate and in-situ incorporating a porogen into the first transition layer; and adjusting the first temperature to a second temperature to burn out the porogen from the first transition layer to form a hollow component inside the first transition layer.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: December 13, 2016
    Assignee: EPISTAR CORPORATION
    Inventor: Ai-Sen Liu
  • Patent number: 9490295
    Abstract: An optoelectronic device including a substrate having a first site, a second side opposite to the first side, and an outer boundary; a light emitting unit formed on the first side; a first electrode electrically connected to the light emitting unit; a second electrode electrically connected to the light emitting unit; and a heat dissipation pad formed between the first electrode and the second electrode and electrically insulated from the light emitting unit.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: November 8, 2016
    Assignee: EPISTAR CORPORATION
    Inventors: Chao Hsing Chen, Jia Kuen Wang, Chien Fu Shen, Chun Teng Ko
  • Patent number: 9418913
    Abstract: A semiconductor device has a semiconductor die with a plurality of bumps formed over an active surface of the semiconductor die. A plurality of first conductive traces with interconnect sites is formed over a substrate. The bumps are wider than the interconnect sites. A surface treatment is formed over the first conductive traces. A plurality of second conductive traces is formed adjacent to the first conductive traces. An oxide layer is formed over the second conductive traces. A masking layer is formed over an area of the substrate away from the interconnect sites. The bumps are bonded to the interconnect sites so that the bumps cover a top surface and side surface of the interconnect sites. The oxide layer maintains electrical isolation between the bump and second conductive trace. An encapsulant is deposited around bumps between the semiconductor die and substrate.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: August 16, 2016
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Seong Bo Shim, Kyung Oe Kim, Yong Hee Kang
  • Patent number: 9392985
    Abstract: A direct-conversion x-ray detector or x-ray detector module includes: a direct converter; at least one collimator; and at least one radiation source. The at least one collimator is arranged in a direction of radiation of the x-ray radiation in front of the direct converter, and to restrict direct irradiation of the direct converter by the x-ray radiation. The at least one radiation source is at a side of the direct converter, and configured to irradiate the direct converter with additional radiation. The at least one collimator includes: at least one reflection layer on a side facing the direct converter, and configured to reflect the additional radiation onto the direct converter; and a cooling facility configured to cool the at least one radiation source.
    Type: Grant
    Filed: July 10, 2014
    Date of Patent: July 19, 2016
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Thorsten Ergler, Andreas Freund, Björn Kreisler, Christian Schröter, Stefan Wirth
  • Patent number: 9397075
    Abstract: An illuminating glazing unit for a vehicle includes a first sheet made of mineral or organic glass, a peripheral light source with a support profiled member referred to as source support, the emitting region or face of the source facing the edge face, referred to as injection face, of the first sheet for a propagation of the injected light within the thickness of the first sheet, the first sheet then playing the role of guide for the injected light, a device of extraction of the guided light so as to form at least one illuminating region, the source support being within an accommodation surrounded by material and covered by a cover, the cover and the source support being removable from the glazing unit.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: July 19, 2016
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Pascal Bäuerle, Adéle Verrat-Debailleul, Christophe Kleo, Laurent Lamoureux, Pascal Lefevre
  • Patent number: 9362531
    Abstract: An organic light emitting display device and manufacturing method thereof are disclosed. One inventive aspect includes a first substrate, a second substrate, a pixel unit, a circuit unit, a sealing member and a radiation unit. The pixel unit is formed on the first substrate and comprises an organic light emitting device and a thin-film transistor (TFT). The radiation unit includes radiation fins formed in the sealing member and a radiation layer contacting first ends of the radiation fins.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: June 7, 2016
    Assignee: Samsung Display Co., Ltd.
    Inventor: Sang-Min Hong