Discrete Light Emitting And Light Responsive Devices Patents (Class 257/82)
  • Patent number: 10352764
    Abstract: An optoelectronic module that includes a reflectance member which exhibits mitigated or eliminated fan-out field-of-view overlap can be concealed or its visual impact minimized compared to a host device in which the optoelectronic module is mounted. In some instances, the reflectance member can be implemented as a plurality of through holes and in other instances the reflectance member may be a contiguous spin-coated polymeric coating. In general, the reflectance member can be diffusively reflective to the same particular wavelengths or ranges of wavelengths as the host device in which it is mounted.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: July 16, 2019
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Jens Geiger, Frank Sobel, Rene Kromhof, Alberto Soppelsa, Kevin Hauser, Robert Lenart
  • Patent number: 10243111
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: March 26, 2019
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • Patent number: 10236464
    Abstract: An organic light emitting diode, including a first electrode; a second electrode facing the first electrode, the second electrode including magnesium; an emission layer between the first electrode and the second electrode; and an electron injection layer between the second electrode and the emission layer, the electron injection layer including a dipole material including a first component and a second component having different polarities, the dipole material including halide, and a content of the magnesium included in the second electrode being in a range of from 10 to 40 volume %.
    Type: Grant
    Filed: August 10, 2015
    Date of Patent: March 19, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Dong Chan Kim, Won Jong Kim, Eung Do Kim, Dong Kyu Seo, Da Hea Im, Sang Hoon Yim, Chang Woong Chu
  • Patent number: 10199428
    Abstract: A light-emitting device includes a mounting board, a first wiring, a plurality of light-emitting elements, a first light-transmissive member, and a second wiring. The first wiring includes a plurality of electrodes which are disposed away from each other on the mounting board. The plurality of light-emitting elements is provided on the mounting board and is electrically connected to the first wiring. The first light-transmissive member is disposed above the plurality of light-emitting elements. The second wiring is disposed on a lower surface of the first light-transmissive member and electrically connects between electrodes among the plurality of electrodes of the first wiring.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: February 5, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Masato Ono, Takahiro Oyu
  • Patent number: 10123710
    Abstract: A sensory-and-logic system comprises an illumination source configured to emit a blood-sensing light, a window through which the blood-sensing light passes en route to human tissue, an illumination receiver configured to measure the blood-sensing light reflected back through the window from the human tissue, a frame surrounding the window and elevating away from the window, and a pillow surrounding the frame and recessing from the frame and the window.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: November 13, 2018
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Gabriel Michael Rask Gassoway, Gregory Kim Justice, Mohammad Sakeri
  • Patent number: 10109759
    Abstract: A semiconductor module includes a photocoupler, a gate driving IC, and a switching element, and at least one of a first structure and a second structure, wherein the first structure is a structure where in a part of a surface of a first lead frame joined to a bottom surface electrode of a light-emitting element, a first conductive layer is disposed with an insulating layer interposed, and a top surface electrode of the light-emitting element, and the first conductive layer are electrically connected by a wire, and the second structure is a structure where in a part of a surface of a second lead frame joined to a bottom surface electrode of a light-receiving element, a second conductive layer is disposed with an insulating layer interposed, and a top surface electrode of the light-receiving element, and the second conductive layer are electrically connected by a wire.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: October 23, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventor: Toshiya Tadakuma
  • Patent number: 9978803
    Abstract: An imaging apparatus includes a plurality of unit circuits connected to a detection line, and a signal output circuit. Each of the plurality of unit circuits includes a light receiving device including an electrode connected to a wire and an electrode, and a transistor that controls electrical connection between the electrode and the detection line. The signal output circuit includes a light receiving device in a light-blocking state including an electrode connected to a wire and an electrode, and a detection circuit that outputs a detection signal according to a potential of a detection point between the electrode and the electrode when the light receiving device and the light receiving device are in a reverse bias state between the wire and the wire.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: May 22, 2018
    Assignee: Seiko Epson Corporation
    Inventor: Yasunori Koide
  • Patent number: 9966538
    Abstract: A novel compound for improving the power efficiency and the lifespan of a light-emitting element, and a light-emitting element and an electronic device including the same are provided. And the new compound may provide excellent light-emitting efficiency and extended lifespan, and may improve thermal stability (heat resistance) for the electronic device.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: May 8, 2018
    Assignee: LMS CO., LTD.
    Inventors: Jeong Og Choi, Joon Ho Jung, Oh Kwan Kwon
  • Patent number: 9946011
    Abstract: A laminated illuminating glazing unit includes a first sheet with a first main face, a second main face and an edge face, a second sheet with a first main face, a second main face and an edge face; a transparent lamination interlayer making adhesive contact with the second main face of the first sheet and with the first main face of the second sheet; a strip of light-emitting diodes (LEDs), including a printed circuit board and a plurality of LEDs, positioned so that the emitting faces of the LEDs face the edge face of the first sheet; and one or more scattering elements, wherein the lamination interlayer includes, on at least one of its main faces, an opaque masking layer extending from the edge of the interlayer toward the center of the glazing unit so as to cover a zone in which the light from the LEDs would, in the absence of the opaque masking layer, be visible, in the form of luminous halos, through the second sheet.
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: April 17, 2018
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Adèle Verrat-Debailleul, Mathieu Berard, Jean-Philippe Mulet
  • Patent number: 9941330
    Abstract: Devices and methods of forming the devices are disclosed. The device includes a substrate and a color LED pixel disposed on the substrate. The color LED pixel includes a red LED, a green LED and a blue LED. Each of the color LED includes a specific color LED body disposed on the respective color region on the substrate, a specific color multiple quantum well (MQW) on the respective color LED body and a specific color top LED layer disposed over the respective color MQW. The MQWs of the red LED, green LED and blue LED includes at least an indium gallium nitride (InxGa1?xN) layer and a gallium nitride (GaN), where x is the atomic percentage of In in the InxGa1?xN layer, and the MQWs of the red LED, green LED and blue LED have different bandgaps by varying x of the InxGa1?xN layer in the red LED, the green LED and the blue LED.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: April 10, 2018
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Srinivasa Banna, Deepak Nayak, Ajey P. Jacob
  • Patent number: 9847047
    Abstract: A display pixel suitable for being arranged on a carrier is provided. The display pixel includes a plurality of light-emitting diode chips. The light-emitting diode chips are disposed on and electrically connected to the carrier. Each of the light-emitting diode chips respectively serves as a sub-pixel and includes a semiconductor device layer, and the semiconductor device layer includes a display light-emitting mesa and at least one redundant light-emitting mesa. During a period of driving each of the light-emitting diode chips, one of the display light-emitting mesa and the at least one redundant light-emitting mesa in each of the light-emitting diode chips is capable of emitting light. A display panel including a plurality of the display pixels mentioned above is also provided.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: December 19, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Hsien Wu, Yen-Hsiang Fang, Yao-Jun Tsai
  • Patent number: 9825006
    Abstract: An electronic component device includes a first electronic component, a second electronic component disposed on and connected to the first electronic component, a first underfill resin filled between the first electronic component and the second electronic component, the first underfill resin having a base part arranged around the second electronic component and an alignment mark formed on an upper surface of the base part, a third electronic component disposed on and connected to the second electronic component, and a second underfill resin filled between the second electronic component and the third electronic component.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: November 21, 2017
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Shota Miki
  • Patent number: 9799633
    Abstract: A semiconductor light source comprising first and second light-emitting diode chips; and a conversion element containing a first phosphor and a second phosphor, wherein the conversion element is disposed downstream of the first and second light-emitting diode chips. The first light-emitting diode chip emits electromagnetic radiation with a first emission maximum. The second light-emitting diode chip emits electromagnetic radiation with a second emission maximum. The first phosphor has a first absorption maximum and a first radiating maximum. The second phosphor has a second absorption maximum, which differs from the first absorption maximum, and a second radiating maximum, which differs from the first radiating maximum. The degree of conversion of the first phosphor for the electromagnetic radiation of the first light-emitting diode chip is greater than the degree of conversion of the second phosphor for the electromagnetic radiation of the first light-emitting diode chip.
    Type: Grant
    Filed: June 6, 2013
    Date of Patent: October 24, 2017
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Ales Markytan, Christian Gärtner
  • Patent number: 9680107
    Abstract: Provided are a novel compound and an organic electronic device (OED) including the same. The novel compound has better hole injection and hole transport properties than a conventional material, and thus may enhance thermal stability and efficiency when used as a material for a hole injection or hole transport layer of the OED.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: June 13, 2017
    Assignee: LMS Co., Ltd.
    Inventors: Joon Ho Jung, Jeong Og Choi, Oh Kwan Kwon, Ah Reum Hwang
  • Patent number: 9588224
    Abstract: A proximity sensing device having an emitter die, a receiver die, a body is disclosed. The proximity sensor has an optical structure provided on the body. The optical structure may provide an optical path to allow radiation reflected by a near object that may be otherwise blocked by the body to be transmitted towards the receiver die. In addition to the proximity-sensing device, a sensing device having at least two trenches that allow close proximity sensing is disclosed. A method for sensing an object that involve determining whether the object correspond to a near object or a far object is presented.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: March 7, 2017
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Cherng Woei Heng, James Costello, Wee Sin Tan
  • Patent number: 9570002
    Abstract: Exemplary methods and systems use a micro light emitting diode (LED) in an active matrix display to emit light and a sensing IR diode to sense light. A display panel includes a display substrate having a display region, an array of subpixel circuits, and an array of selection devices. Each subpixel circuit includes a driving circuit to operate a corresponding infrared (IR) emitting LED in a light emission mode. Each selection device may be coupled to a corresponding sensing IR diode to operate the corresponding sensing IR diode in a light sensing mode.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: February 14, 2017
    Assignee: Apple Inc.
    Inventors: Kapil V. Sakariya, Tore Nauta
  • Patent number: 9530529
    Abstract: This invention relates to a radioisotope battery and a method of manufacturing the same, wherein manufacturing the radioisotope battery and shielding radiation emitted from the radioisotope Ni-63 from the outside are achieved simultaneously. This radioisotope battery includes a semiconductor layer, a seed layer formed on the semiconductor layer, a radioisotope layer formed on the seed layer, and a radiation shielding layer formed on the radioisotope layer and for shielding radiation of the radioisotope layer form the outside.
    Type: Grant
    Filed: April 10, 2014
    Date of Patent: December 27, 2016
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Byoung-Gun Choi, Sung-Weon Kang, Kyung-Hwan Park, Myung-Ae Chung
  • Patent number: 9520281
    Abstract: A method of fabricating an epitaxial device, comprising: providing a substrate having a first surface and a normal direction; epitaxially forming a first transition layer in a first temperature on the first surface of the substrate and in-situ incorporating a porogen into the first transition layer; and adjusting the first temperature to a second temperature to burn out the porogen from the first transition layer to form a hollow component inside the first transition layer.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: December 13, 2016
    Assignee: EPISTAR CORPORATION
    Inventor: Ai-Sen Liu
  • Patent number: 9490295
    Abstract: An optoelectronic device including a substrate having a first site, a second side opposite to the first side, and an outer boundary; a light emitting unit formed on the first side; a first electrode electrically connected to the light emitting unit; a second electrode electrically connected to the light emitting unit; and a heat dissipation pad formed between the first electrode and the second electrode and electrically insulated from the light emitting unit.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: November 8, 2016
    Assignee: EPISTAR CORPORATION
    Inventors: Chao Hsing Chen, Jia Kuen Wang, Chien Fu Shen, Chun Teng Ko
  • Patent number: 9418913
    Abstract: A semiconductor device has a semiconductor die with a plurality of bumps formed over an active surface of the semiconductor die. A plurality of first conductive traces with interconnect sites is formed over a substrate. The bumps are wider than the interconnect sites. A surface treatment is formed over the first conductive traces. A plurality of second conductive traces is formed adjacent to the first conductive traces. An oxide layer is formed over the second conductive traces. A masking layer is formed over an area of the substrate away from the interconnect sites. The bumps are bonded to the interconnect sites so that the bumps cover a top surface and side surface of the interconnect sites. The oxide layer maintains electrical isolation between the bump and second conductive trace. An encapsulant is deposited around bumps between the semiconductor die and substrate.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: August 16, 2016
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Seong Bo Shim, Kyung Oe Kim, Yong Hee Kang
  • Patent number: 9397075
    Abstract: An illuminating glazing unit for a vehicle includes a first sheet made of mineral or organic glass, a peripheral light source with a support profiled member referred to as source support, the emitting region or face of the source facing the edge face, referred to as injection face, of the first sheet for a propagation of the injected light within the thickness of the first sheet, the first sheet then playing the role of guide for the injected light, a device of extraction of the guided light so as to form at least one illuminating region, the source support being within an accommodation surrounded by material and covered by a cover, the cover and the source support being removable from the glazing unit.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: July 19, 2016
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Pascal Bäuerle, Adéle Verrat-Debailleul, Christophe Kleo, Laurent Lamoureux, Pascal Lefevre
  • Patent number: 9392985
    Abstract: A direct-conversion x-ray detector or x-ray detector module includes: a direct converter; at least one collimator; and at least one radiation source. The at least one collimator is arranged in a direction of radiation of the x-ray radiation in front of the direct converter, and to restrict direct irradiation of the direct converter by the x-ray radiation. The at least one radiation source is at a side of the direct converter, and configured to irradiate the direct converter with additional radiation. The at least one collimator includes: at least one reflection layer on a side facing the direct converter, and configured to reflect the additional radiation onto the direct converter; and a cooling facility configured to cool the at least one radiation source.
    Type: Grant
    Filed: July 10, 2014
    Date of Patent: July 19, 2016
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Thorsten Ergler, Andreas Freund, Björn Kreisler, Christian Schröter, Stefan Wirth
  • Patent number: 9362531
    Abstract: An organic light emitting display device and manufacturing method thereof are disclosed. One inventive aspect includes a first substrate, a second substrate, a pixel unit, a circuit unit, a sealing member and a radiation unit. The pixel unit is formed on the first substrate and comprises an organic light emitting device and a thin-film transistor (TFT). The radiation unit includes radiation fins formed in the sealing member and a radiation layer contacting first ends of the radiation fins.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: June 7, 2016
    Assignee: Samsung Display Co., Ltd.
    Inventor: Sang-Min Hong
  • Patent number: 9312322
    Abstract: An organic light emitting diode (OLED) display device in which an oxide-based semiconductor is used as an active layer of a TFT and the fabrication method thereof are provided. In the OLED display device, the active layer is formed at an upper portion of the gate electrode and a source electrode is patterned to completely cover the channel region of the active layer, to block light introduced from upper and lower portions of the active layer, thereby improving reliability of the oxide TFT.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: April 12, 2016
    Assignee: LG Display Co., Ltd.
    Inventors: KiSul Cho, JinChae Jeon
  • Patent number: 9269848
    Abstract: A method for producing a plurality of optoelectronic semiconductor components in combination is specified. A plurality of radiation-emitting and radiation-detecting semiconductor chips are applied on a carrier substrate. The semiconductor chips are potted with a respective potting compound. The potting compounds are subsequently severed by sawing between adjacent semiconductor chips. A common frame is subsequently applied to the carrier substrate The common frame has a plurality of chambers open toward the top. The frame is arranged in such a way that a respective semiconductor chip is arranged in a respective chamber of the frame. A semiconductor component produced in such a way and the use of the semiconductor component are furthermore specified.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: February 23, 2016
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Markus Lermer, Martin Haushalter
  • Patent number: 9249946
    Abstract: An illuminating glazing unit includes a first sheet having a first main face, a second main face and an edge face; a second sheet having a first main face, a second main face and an edge face; a lamination interlayer having an extent smaller than that of each of the glass sheets and defining a space between the edge of the second main face of the first sheet and the edge of the first main face of the second sheet; a strip of LEDs, including a printed circuit board and a plurality of LEDs, positioned so that the emitting faces of the LEDs face the edge face of the first sheet; and an encapsulating element made of an opaque polymer encapsulating at least the edge face of the second sheet and the LED strip. The PCB bears against the first main face of the second glass sheet with a plurality of spacers and the space is filled by the opaque polymer.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: February 2, 2016
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Jean-Philippe Mulet, Mathieu Berard, Fabienne Piroux, Christophe Kleo, Adele Verrat-Debailleul, Pascal Bauerle
  • Patent number: 9190541
    Abstract: In an aspect of the present disclosure, there is disclosed a manufacture method of an antireflection coating using a self-assembly nano structure, which includes forming a first metal droplet on a substrate by means of droplet epitaxy, depositing a first non-metal on the formed first metal droplet, and forming a first nano compound crystal by means of self-assembly of the deposited first non-metal and the first metal droplet.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: November 17, 2015
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jin-Dong Song, Eunhye Lee, Min Hwan Bae, Won Jun Choi, Jae Jin Yoon, Il Ki Han
  • Patent number: 9166128
    Abstract: A light-emitting assembly and a method for manufacturing the same are provided. The light-emitting assembly includes a circuit board with a light-emitting element and a plurality of optical microstructures disposed thereon. The optical microstructures adjacent to the light-emitting element absorb or guide a portion of light emitted from the light-emitting element.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: October 20, 2015
    Assignee: Lextar Electronics Corporation
    Inventor: Yei-How Ho
  • Patent number: 9166189
    Abstract: An organic light emitting device includes a cathode made of metal, at least one organic material layer including a light emitting layer, and an anode in the sequentially layered form. The organic light emitting device also includes a thin metal film that is interposed between the cathode and the organic material layer.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: October 20, 2015
    Assignee: LG CHEM, LTD.
    Inventors: Jung-Bum Kim, Jung-Hyoung Lee
  • Patent number: 9163982
    Abstract: An optical receiver device including: a light-receiving element having a first electrode acting as an outputting electrode and a second electrode coupled to a potential that is different from a ground potential; an amplifier device having an amplifier element, a connection terminal including a signal electrode and a ground electrode on an upper face thereof; a first conductor coupling a potential of the first electrode of the light-receiving element to the signal electrode, the first conductor being introduced from the upper face side of the amplifier device; and a second conductor coupling a potential of the second electrode of the light-receiving element to the ground electrode, the second conductor introduced from the upper face side of the amplifier device.
    Type: Grant
    Filed: April 25, 2011
    Date of Patent: October 20, 2015
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Masaru Takechi, Sousaku Sawada, Yoshihiro Tateiwa
  • Patent number: 9166103
    Abstract: Disclosed is a single-chip twin light source light emitting device including a first epitaxial layer, a substrate, and a second epitaxial layer. The first epitaxial layer includes a first n-type semiconductor layer with a n-type conducting structure, a first light emitting layer with a multi-quantum well structure, and a first p-type semiconductor layer with a p-type conducting structure. The second epitaxial layer includes a second n-type semiconductor layer with a n-type conducting structure, a second light emitting layer with a multi-quantum well structure, and a second p-type semiconductor layer with a p-type conducting structure. Therefore, the light emitting device can emit one-color or two-color light by controlling the first epitaxial layer and the second epitaxial layer respectively.
    Type: Grant
    Filed: June 19, 2013
    Date of Patent: October 20, 2015
    Assignee: Unity Opto Technology Co., Ltd.
    Inventor: Ching-Huei Wu
  • Patent number: 9159948
    Abstract: To inhibit surface reflection of a display device. A display device which includes a reflective electrode layer 110; a partition 118 formed to surround the reflective electrode layer; a layer 120 containing a light-emitting organic compound and formed over the partition and the reflective electrode layer; a semi-transmissive electrode layer 122 formed over the layer containing the light-emitting organic compound; and a coloring layer 162 formed over the semi-transmissive electrode layer. The coloring layer overlaps with the reflective electrode layer and the partition. The partition does not overlap with the reflective electrode layer.
    Type: Grant
    Filed: March 17, 2014
    Date of Patent: October 13, 2015
    Assignees: Semiconductor Energy Laboratory Co., Ltd., Sharp Kabushiki Kaisha
    Inventors: Nozomu Sugisawa, Hisao Ikeda, Katsuhiro Kikuchi, Manabu Niboshi, Satoshi Inoue, Yuto Tsukamoto, Shinichi Kawato
  • Patent number: 9130109
    Abstract: An optical apparatus includes a substrate 1, a wiring pattern 8 formed on the substrate 1, a light-receiving element 3 and a light-emitting element 2 provided on the substrate 1 and spaced apart from each other in a direction x, a light-transmitting resin 4 covering the light-receiving element 3, a light-transmitting resin 5 covering the light-emitting element 2, and a light-shielding resin 6 covering the light-transmitting resin 4 and the light-transmitting resin 5. The wiring pattern 8 includes a first light-blocking portion 83 interposed between the light-shielding resin 6 and the substrate 1 and positioned between the light-receiving element 3 and the light-emitting element 2 as viewed in x-y plane. The first light-blocking portion 83 extends across the light-emitting element 2 as viewed in the direction x.
    Type: Grant
    Filed: January 12, 2012
    Date of Patent: September 8, 2015
    Assignee: ROHM CO., LTD.
    Inventors: Yuji Makimura, Okimoto Kondo
  • Patent number: 9082921
    Abstract: A light-emitting device comprising (a) a submount having front and back sides and including a ceramic layer; (b) an array of light-emitting diodes (LEDs) on the front side; and (c) a lens overmolded on the submount and covering the LED array. In some embodiments, the submount comprises at least two electrically-conductive contact pads on the front side, and each LED in the array is secured with respect to one of the contact pads.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: July 14, 2015
    Assignee: Cree, Inc.
    Inventors: Kurt S. Wilcox, Bernd P. Keller, Theodore Lowes, Peter Scott Andrews
  • Patent number: 9064773
    Abstract: Embodiments provide a light emitting device package including a package body having a top-opened cavity disposed in at least a portion thereof, a first electrode layer and a second electrode layer electrically isolated from the package body with an insulating layer interposed therebetween, the first electrode layer and the second electrode layer being electrically isolated from each other at a bottom surface of the cavity, a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the cavity, and a sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output of the light emitting device.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: June 23, 2015
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Bum Chul Cho, Moon Sub Kim, Jin Kwan Kim
  • Publication number: 20150137148
    Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical package that includes a stacked arrangement with a plurality of optical devices arranged over an image sensor processor die that is coupled to a first substrate. Between the two optical devices and the image sensor processor die there is provided at least a second substrate. In one embodiment, the optical package is a proximity sensor package and the optical devices include a light-emitting diode die and a light-receiving diode die. In one embodiment, the light-emitting diode die is secured to a surface of the second substrate and the light-receiving diode die is secured to a surface of a third substrate. The second and the third substrate may be secured to a surface of the image sensor processor die or to a surface of encapsulation material.
    Type: Application
    Filed: November 18, 2013
    Publication date: May 21, 2015
    Applicant: STMicroelectronics Pte Ltd.
    Inventor: Wing Shenq Wong
  • Patent number: 9035326
    Abstract: Disclosed is a light emitting module capable of representing improved heat radiation and improved light collection. there is provided a light emitting module. The light emitting module includes a metallic circuit board formed therein with a cavity, and a light emitting device package including a nitride insulating substrate attached in the cavity of the metallic circuit board, at least one pad part on the nitride insulating substrate, and at least one light emitting device attached on the pad part.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: May 19, 2015
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Yun Min Cho
  • Patent number: 9029833
    Abstract: Ultraviolet or Extreme Ultraviolet and/or visible detector apparatus and fabrication processes are presented, in which the detector includes a thin graphene electrode structure disposed over a semiconductor surface to provide establish a potential in the semiconductor material surface and to collect photogenerated carriers, with a first contact providing a top side or bottom side connection for the semiconductor structure and a second contact for connection to the graphene layer.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: May 12, 2015
    Assignee: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Francis J. Kub, Karl D. Hobart, Travis J. Anderson
  • Patent number: 9024349
    Abstract: Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.
    Type: Grant
    Filed: January 22, 2007
    Date of Patent: May 5, 2015
    Assignee: Cree, Inc.
    Inventors: Ashay Chitnis, James Ibbetson, Arpan Chakraborty, Eric J. Tarsa, Bernd Keller, James Seruto, Yankun Fu
  • Patent number: 9018645
    Abstract: An electronics assembly includes a semiconductor die assembly, an enclosure affixed to the semiconductor die assembly, the enclosure defining first and second chambers over the semiconductor die assembly, and first and second optical elements mounted in the first and second chambers, respectively. The semiconductor die assembly includes a semiconductor die encapsulated in a molded material, an encapsulation layer located on the top surface of the semiconductor die, and at least one patterned metal layer and at least one dielectric layer over the encapsulation layer. Conductive pillars extend through the encapsulation layer for electrical connection to the semiconductor die. The encapsulation layer blocks optical crosstalk between the first and second chambers. A method is provided for making the electronics assembly.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: April 28, 2015
    Assignee: STMicroelectronics Pte Ltd
    Inventor: Yonggang Jin
  • Patent number: 9006752
    Abstract: Embodiments of the invention pertain to a method and apparatus for sensing infrared (IR) radiation. In a specific embodiment, a night vision device can be fabricated by depositing a few layers of organic thin films. Embodiments of the subject device can operate at voltages in the range of 10-15 Volts and have lower manufacturing costs compared to conventional night vision devices. Embodiments of the device can incorporate an organic phototransistor in series with an organic light emitting device. In a specific embodiment, all electrodes are transparent to infrared light. An IR sensing layer can be incorporated with an OLED to provide IR-to-visible color up-conversion. Improved dark current characteristics can be achieved by incorporating a poor hole transport layer material as part of the IR sensing layer.
    Type: Grant
    Filed: February 10, 2014
    Date of Patent: April 14, 2015
    Assignee: University of Florida Research Foundation, Inc.
    Inventors: Franky So, Do Young Kim
  • Patent number: 9006751
    Abstract: A luminous vehicle glazing containing: a first sheet having a first and a second main face; a peripheral light source, the emitting face facing an injection side, which is a side of the second face; a surface diffusion extractor, which extracts the guided light via the first and/or the second main face, or a volume diffusion extractor in the first sheet; a fluid-tight cap, which covers the peripheral light source and is impermeable to liquid water or water vapor, wherein the cap is a facial cap, faces the second face, joined by a fastening element, and associated with an interfacial sealing element.
    Type: Grant
    Filed: January 24, 2011
    Date of Patent: April 14, 2015
    Assignee: Saint-Gobain Glass France
    Inventors: Christophe Kleo, Bastien Grandgirard, Alexandre Richard, Adele Verrat-Debailleul
  • Publication number: 20150091024
    Abstract: A package structure of an optical module includes: a substrate defined with a light-emitting region and a light-admitting region; a light-emitting chip disposed at the light-emitting region of the substrate; a light-admitting chip disposed at the light-admitting region of the substrate; two encapsulants for enclosing the light-emitting chip and the light-admitting chip, respectively; and a shielding layer formed on the substrate and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively. Accordingly, the optical module package structure simplifies a packaging process and cuts manufacturing costs.
    Type: Application
    Filed: December 8, 2014
    Publication date: April 2, 2015
    Inventors: Ming-Te TU, Yao-Ting YEH
  • Patent number: 8987756
    Abstract: An LED luminaire has a dye-sensitized solar cell for converting light emitted from a light source to electric energy and uses the converted electric energy. Since the dye-sensitized solar cell plays a role of a diffusion plate, the LED luminaire may diffuse light and convert wasted light into power. Further, since energy consumption and green-house gas generation decrease, it is possible to provide an environment-friendly LED luminaire. Moreover, if the power generated by the dye-sensitized solar cell is used for cooling the LED luminaire, it is possible to enhance heat dissipation efficiency of the LED luminaire.
    Type: Grant
    Filed: December 29, 2010
    Date of Patent: March 24, 2015
    Assignee: University-Industry Cooperation Group Of Kyung Hee University
    Inventors: Jeong-Tai Kim, Won-Woo Kim, Geun-Young Yun
  • Publication number: 20150076526
    Abstract: A light receiving element includes: a semiconductor layer; an insulating layer; an interconnect layer; and a film. The semiconductor layer includes a light receiving unit configured to convert a signal light incident on the light receiving unit into an electrical signal. The insulating layer is provided on the semiconductor layer. The interconnect layer is provided on the insulating layer. The film is provided on the insulating layer to cover the light receiving unit and be connected to the interconnect layer, the film being made of a metal or a metal nitride.
    Type: Application
    Filed: March 10, 2014
    Publication date: March 19, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Miki Hidaka, Osamu Takata, Masahito Nishigoori, Yukiko Takiba, Hiroshi Suzunaga, Hiroshi Shimomura
  • Publication number: 20150076525
    Abstract: A light receiving element includes: a semiconductor layer; a first layer; and a second layer. The semiconductor layer has a first impurity concentration. The first layer of a first conductivity type is provided inward from an upper surface of the semiconductor layer. The first layer has a second impurity concentration higher than the first impurity concentration. The first layer has a surface region on an upper surface of the semiconductor layer side and an inner region being narrower than the first region. The second layer of a second conductivity type is provided inward from the upper surface of the first semiconductor layer. The second layer has a third impurity concentration higher than the first impurity concentration.
    Type: Application
    Filed: March 10, 2014
    Publication date: March 19, 2015
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Miki Hidaka, Toyoaki Uo, Shigeyuki Sakura
  • Patent number: 8981387
    Abstract: A light emitting diode assembly includes a base, a light emitting chip mounted on the base, an elastic lens covering the light emitting chip, two rotation members rotatably arranged on the base, and two stopper poles fixed on the base. The two rotation members are capable of driving the elastic lens to rotate with respect to the two stopper poles. The stopper poles compress the elastic lens to cause the elastic lens to deform resiliently when the elastic lens is rotated by the rotation members to engage with the stopper poles.
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: March 17, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hou-Te Lin, Chao-Hsiung Chang
  • Publication number: 20150069423
    Abstract: A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.
    Type: Application
    Filed: January 23, 2014
    Publication date: March 12, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Mami Yamamoto, Yoshio Noguchi
  • Publication number: 20150060891
    Abstract: An electronics assembly includes a semiconductor die assembly, an enclosure affixed to the semiconductor die assembly, the enclosure defining first and second chambers over the semiconductor die assembly, and first and second optical elements mounted in the first and second chambers, respectively. The semiconductor die assembly includes a semiconductor die encapsulated in a molded material, an encapsulation layer located on the top surface of the semiconductor die, and at least one patterned metal layer and at least one dielectric layer over the encapsulation layer. Conductive pillars extend through the encapsulation layer for electrical connection to the semiconductor die. The encapsulation layer blocks optical crosstalk between the first and second chambers. A method is provided for making the electronics assembly.
    Type: Application
    Filed: August 29, 2013
    Publication date: March 5, 2015
    Applicant: STMicroelectronics Pte Ltd.
    Inventor: Yonggang Jin
  • Publication number: 20150060892
    Abstract: A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region.
    Type: Application
    Filed: January 23, 2014
    Publication date: March 5, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yoshio Noguchi, Mami Yamamoto, Naoya Takai