With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package Patents (Class 257/98)
  • Patent number: 12007529
    Abstract: A multilayer metalens includes a substrate having first, second, and third axes that are perpendicular to each other. A first layer of antennas is arranged, relative to the third axis, on the substrate. Each antenna of the first layer of antennas is rotated relative to the first and second axes based on a position of each antenna of the first layer of antennas along the first and second axes. A second layer of antennas is arranged, in the third axis, on the first layer of antennas. Each antenna of the second layer of antennas is rotated relative to the first and second axes based on a position of each antenna of the second layer of antennas along the first and second axes. Each antenna in the first and second layers of antennas has, in a plane parallel to a top of the substrate an elongated shape.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: June 11, 2024
    Assignee: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Xiaohang Li, Ronghui Lin
  • Patent number: 11990571
    Abstract: A light emitting device includes a light emitting element having an emission peak wavelength in a range of 380 nm to 420 nm and a fluorescent member including at least one fluorescent material that is excited by light from the light emitting element for light emission, wherein a mixture of light from the light emitting element and light from the fluorescent material has a correlated color temperature in a range of 2000 K to 7500 K as measured according to JIS Z8725, and the light emitting device has a spectral distribution in which, when the integral value over a wavelength range of 380 nm to 780 nm is normalized to 100%, the proportion of an integral value over a wavelength range of 380 nm to 420 nm is 15% or more, and the ratio a as defined by the expression (1) is 0.9 or more and 1.6 or less.
    Type: Grant
    Filed: September 6, 2022
    Date of Patent: May 21, 2024
    Assignee: NICHIA CORPORATION
    Inventors: Makiko Iwasa, Kazushige Fujio
  • Patent number: 11990599
    Abstract: The invention relates to a method for producing a dry film (3), wherein a dry powder mixture is processed into the dry film (3) by a rolling device comprising a first roller (2a) and a second roller (2b). The first roller (2a) has a higher circumferential rotational speed than the second roller (2b), and the dry film (3) is placed on the first roller (2a).
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: May 21, 2024
    Assignees: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V., TECHNISCHE UNIVERSITAT DRESDEN
    Inventors: Holger Althues, Sebastian Tschoecke, Benjamin Schumm, Stefan Kaskel, Christian Girsule, Daniel Jordan, Kay Schoenherr
  • Patent number: 11984536
    Abstract: A semiconductor light emitting device includes a first electrode layer, a light emitting structure on the first electrode layer, a transparent electrode layer between the first electrode layer and the light emitting structure, an interlayer insulating layer between the transparent electrode layer and the first electrode layer, and having first and second openings, a second electrode layer between the first electrode layer and the interlayer insulating layer, and connected to the transparent electrode layer, and an electrode pad contacting the second electrode layer, each of the first openings and at least one of the second openings define one group to have at least first and second groups, the first group being closer to the electrode pad than the second group is, and a distance between the first and second openings in the first group being greater than a distance between the first and second openings in the second group.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: May 14, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Taehun Kim, Yongmin Kim, Sungwon Ko, Bokyoung Kim, Jinhwan Kim, Wongoo Hur
  • Patent number: 11984549
    Abstract: An optoelectronic device including an integrated circuit including light-emitting diodes, thin film transistors, and a stack of electrically-insulating layers, said stack being located between the light-emitting diodes and the transistors, said stack further including conductive elements, between and through said insulating layers, said conductive elements connecting at least some of the transistors to the light-emitting diodes.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: May 14, 2024
    Assignee: Aledia
    Inventors: Frédéric Mayer, Frédéric Mercier, Ivan-Christophe Robin, Xavier Hugon
  • Patent number: 11978825
    Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: May 7, 2024
    Assignee: Apple Inc.
    Inventors: Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl, Clayton Ka Tsun Chan, Daniel Arthur Haeger
  • Patent number: 11979980
    Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: May 7, 2024
    Assignee: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Patent number: 11973170
    Abstract: A semiconductor package includes a photonic die, an encapsulated electronic die, a substrate, and a lens structure. The photonic die includes an optical coupler. The encapsulated electronic die is disposed over and bonded to the photonic die. The encapsulated electronic die includes an electronic die and an encapsulating material at least laterally encapsulating the electronic die. The substrate is disposed over and bonded to the encapsulated electronic die. The lens structure is disposed over the photonic die and is overlapped with the optical coupler from a top view. The optical coupler is configured to be optically coupled to an optical signal source through the lens structure.
    Type: Grant
    Filed: October 5, 2022
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Fa Chen, Hsien-Wei Chen, Jie Chen
  • Patent number: 11973164
    Abstract: A light-emitting device includes a substrate including a top surface; a semiconductor stack including a first semiconductor layer, an active layer and a second semiconductor layer formed on the substrate, wherein a portion of the top surface is exposed; a distributed Bragg reflector (DBR) formed on the semiconductor stack and contacting the portion of the top surface of the substrate; a metal layer formed on the distributed Bragg reflector (DBR), contacting the portion of the top surface of the substrate and being insulated with the semiconductor stack; and an insulation layer formed on the metal layer and contacting the portion of the top surface of the substrate.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: April 30, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Che-Hung Lin, Chien-Chih Liao, Chi-Shiang Hsu, De-Shan Kuo, Chao-Hsing Chen
  • Patent number: 11973167
    Abstract: A method is described for low temperature curing of silicone structures, including the steps of providing patterning photoresist structures on a substrate. The photoresist structures define at least one open region that can be at least partially filled with a condensation cure silicone system. Vapor phase catalyst deposition is used to accelerate the cure of the condensation cure silicone, and the photoresist structure is removed to leave free standing or layered silicone structures. Phosphor containing silicone structures that are coatable with a reflective metal or other material are enabled by the method.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: April 30, 2024
    Assignee: Lumileds LLC
    Inventors: Daniel Bernardo Roitman, Emma Dohner, Kentaro Shimizu, Marcel Rene Bohmer
  • Patent number: 11968871
    Abstract: The disclosure provides a display substrate, a manufacturing method thereof and a display device. The display substrate has a plurality of subpixel regions. The display substrate includes a base substrate and a pixel definition layer on the base substrate. The pixel definition layer defines a plurality of subpixel openings and each of the subpixel openings occupies one subpixel region. The display substrate further includes a functional medium layer on a side of the pixel definition layer away from the base substrate. The functional medium layer includes a first portion covering side surfaces of the subpixel opening and a second portion covering a top surface of the pixel definition layer. In the same subpixel region, surface energy of the first portion is greater than surface energy of the second portion.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: April 23, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yong Yu, Yang Yue, Haitao Huang, Xiang Li, Shi Shu, Chuanxiang Xu
  • Patent number: 11961945
    Abstract: A light emitting element includes: a light emitting stack pattern including a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially stacked along one direction; and an insulating film surrounding an outer surface of at least one of the first semiconductor layer, the active layer, and the second semiconductor layer. The insulating film including a zinc oxide (ZnO) thin film layer.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: April 16, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jun Bo Sim, Chang Hee Lee, Yun Hyuk Ko, Sang Ho Jeon, Jae Kook Ha
  • Patent number: 11949047
    Abstract: Discussed is a display device having a plurality of semiconductor light emitting elements mounted on a substrate, wherein at least one of the semiconductor light emitting elements includes a first electrode and a second electrode spaced apart each other, a first conductivity type semiconductor layer disposed with the first electrode, a second conductivity type semiconductor layer configured to overlap with the first conductivity type semiconductor layer, and disposed with the second electrode, a first passivation layer covering outer surfaces of the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, and a second passivation layer covering the first passivation layer, wherein at least one portion of the second electrode is overlapped with at least one portion of the first electrode along the thickness direction of the semiconductor light emitting element.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: April 2, 2024
    Assignee: LG ELECTRONICS INC.
    Inventors: Hwanjoon Choi, Yonghan Lee
  • Patent number: 11948986
    Abstract: A mesa portion is formed on a substrate. An insulating film including an organic layer is disposed on the mesa portion. A conductor film is disposed on the insulating film. A cavity provided in the organic layer has side surfaces extending in a first direction. A shorter distance out of distances in a second direction perpendicular to the first direction from the mesa portion to the side surfaces of the cavity in plan view is defined as a first distance. A shorter distance out of distances in the first direction from the mesa portion to side surfaces of the cavity in plan view is defined as a second distance. A height of a first step of the mesa portion is defined as a first height. At least one of the first distance and the second distance is greater than or equal to the first height.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: April 2, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Atsushi Kurokawa, Masahiro Shibata, Hiroaki Tokuya, Mari Saji
  • Patent number: 11940637
    Abstract: Provided is a color transformation filter including a plurality of nanostructures included in a subpixel and spaced apart from each other, the plurality of nanostructures having a first refractive index, a low refractive index layer provided adjacent to the plurality of nanostructures, the low refractive index layer having a second refractive index less than the first refractive index, and a color transformation element included in the low refractive index layer.
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: March 26, 2024
    Assignees: SAMSUNG ELECTRONICS CO., LTD., IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Sunjin Song, Seokho Song, Wonjae Joo, Myongjong Kwon
  • Patent number: 11942567
    Abstract: Provided is a method of manufacturing a light-emitting element, the method including positioning a substrate, forming a first separation layer, which includes a first sacrificial layer, an etching control layer on the first sacrificial layer, and a second sacrificial layer on the etching control layer, on the substrate, forming at least one first light-emitting element on the first separation layer, and separating the first light-emitting element from the substrate.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: March 26, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jung Hong Min, Dae Hyun Kim, Hyun Min Cho, Jong Hyuk Kang, Dong Uk Kim, Seung A Lee, Hyun Deok Im, Hyung Rae Cha
  • Patent number: 11935883
    Abstract: Capacitor structures, and apparatus containing similar capacitor structures, might include a first conductive region having a first portion and second and third portions extending from an upper surface of its first portion, a second conductive region having a first portion and a second portion extending from an upper surface of its first portion, a dielectric overlying the second portion of the first conductive region, a conductor overlying the dielectric, and a conductive element overlying the third portion of the first conductive region and overlying the second portion of the second conductive region, wherein the first conductive region has a first conductivity type and the second conductive region has a second conductivity type different than the first conductivity type.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: March 19, 2024
    Assignee: Lodestar Licensing Group LLC
    Inventors: Vladimir Mikhalev, Michael Violette
  • Patent number: 11937468
    Abstract: There are provided a display unit and an electronic apparatus that are capable of preventing color mixture in adjacent color pixels, and improving color reproducibility and chromaticity viewing angle. The display unit includes: a drive substrate having a plurality of pixels with a partition therebetween; and a first light shielding film provided on the partition.
    Type: Grant
    Filed: April 6, 2023
    Date of Patent: March 19, 2024
    Assignee: Sony Group Corporation
    Inventors: Eisuke Negishi, Shinichi Teraguchi, Shuji Kudo
  • Patent number: 11935880
    Abstract: A dynamic random access memory (DRAM) device is provided. The DRAM device includes a circuit substrate, a light emitting element, a first light-permeable thermal dissipation element, and a first light blocking element. At least one DRAM chip is disposed on the circuit substrate. The light emitting element is disposed on the circuit substrate and coupled to the circuit substrate. The first light-permeable thermal dissipation element is disposed on the circuit substrate. The first light blocking element is disposed between the first light-permeable thermal dissipation element and the circuit substrate, and the first light blocking element is disposed on the first light-permeable thermal dissipation element.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: March 19, 2024
    Assignee: ADATA TECHNOLOGY CO., LTD.
    Inventors: Tsung-Hsing Kuo, Wen-Tsung Chen, Yu-Ning Lee, Tzu-Jan Tai
  • Patent number: 11937489
    Abstract: The present application provides a display panel and a manufacturing method thereof. The display panel includes an array substrate, a light emitting layer, and a water and oxygen adsorption layer. The light emitting layer is disposed on the array substrate. The light emitting layer includes a pixel definition structure and a plurality of light emitting parts, the pixel definition structure includes a plurality of grooves, and the light emitting parts are disposed in the grooves. The water and oxygen adsorption layer includes a plurality of water and oxygen adsorption parts, the water and oxygen adsorption parts are disposed on the pixel definition structure, and a surface of the water and oxygen adsorption parts is convex.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: March 19, 2024
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Gaozhen Wang
  • Patent number: 11929452
    Abstract: A method for manufacturing a light-emitting device includes: forming a cover, which comprises: sandwiching a fixing member by a molding device, injecting a light-transmissive material into a space defined in the molding device, and hardening or curing the injected light-transmissive material, wherein the formed cover comprises an upper portion, a sidewall, and a recess, the cover being integrated with the fixing member such that the fixing member projects from a part of an outer lateral surface of the sidewall; disposing a light-transmissive member on a light extraction surface of a light-emitting element to be disposed on a substrate; and disposing the cover so that the light-emitting element is housed in the recess. The fixing member is formed of a material that is deformable due to a pressing force generated in the event of an engagement with a counterpart member.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: March 12, 2024
    Assignee: NICHIA CORPORATION
    Inventors: Tsuyoshi Okahisa, Tomohito Shinomiya, Daizo Kiba
  • Patent number: 11929591
    Abstract: A semiconductor light-emitting device includes a stacked body, a cutout section, and a high-resistance region. The stacked body includes a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer in this order and has paired side faces opposed to each other. The cutout section is provided on at least one of the paired side faces of the stacked body and has a bottom face where the first conductive-type semiconductor layer is exposed. The high-resistance region is provided from the vicinity of the bottom face of the cutout section to the side face of the stacked body and has electric resistance higher than the electric resistance of the stacked body in a periphery of the high-resistance region.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: March 12, 2024
    Assignee: SONY CORPORATION
    Inventors: Masahiro Murayama, Takashi Sugiyama
  • Patent number: 11925056
    Abstract: The embodiments of the present application provide a package cover plate and a manufacturing method thereof, a display panel and a display device. The package cover plate includes a cover plate structure layer, a spacer structure on a side of the cover plate structure layer, the spacer structure includes a first spacer, and the first spacer includes a water absorbing structure, and an auxiliary electrode layer on a side of the spacer structure facing away from the cover plate structure layer.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: March 5, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Chengyuan Luo
  • Patent number: 11916096
    Abstract: An integrated optical display system includes a backplane with appropriate electronics, and an array of micro-devices. A touch sensing structure may be integrated into the system. In one embodiment, an integrated circuit and system is integrated on top of micro-devices transferred to a substrate. Openings in a planarization layer (or layers) may be provided to connect the micro-devices with electrodes and other circuitry. Light reflectors may be used to redirect the light, and color conversion layers or color filters may be integrated before the micro-devices or on the substrate surface opposite to the surface of micro-devices.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: February 27, 2024
    Assignee: VueReal Inc.
    Inventors: Gholamreza Chaji, Yaser Azizi, Ehsanollah Fathi
  • Patent number: 11916170
    Abstract: A micro-light-emitting diode chip includes an epitaxial structure, an electrode, a transparent structure, and a reflection layer. The epitaxial structure has a light exit surface, a back surface opposite to the light exit surface, and a sidewall surface. The sidewall surface is connected to the light exit surface and the back surface. The electrode is electrically coupled to the epitaxial structure. The transparent structure has an inner surface and an outer surface opposite to the inner surface. The inner surface is connected to the sidewall surface. A distance between the outer surface and the inner surface on a plane where the back surface is located is less than a distance between the outer surface and the inner surface on a plane where the light exit surface is located. The reflection layer is in direct contact with the outer surface. A micro-light-emitting diode display is also provided.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: February 27, 2024
    Assignee: PlayNitride Display Co., Ltd.
    Inventors: Sheng-Yuan Sun, Loganathan Murugan, Po-Wei Chiu
  • Patent number: 11908982
    Abstract: A light-emitting diode (LED) package includes an LED chip on a substrate, an adhesive phosphor film on the LED chip, a cell lens on the adhesive phosphor film, and a lateral reflective layer covering respective lateral surfaces of the LED chip, the adhesive phosphor film, and the cell lens, a lateral surface of the lateral reflective layer being coplanar with a lateral surface of the substrate.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: February 20, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jongsup Song, Tetsuo Ariyoshi, Taehyun Lee
  • Patent number: 11901489
    Abstract: An electrode structure includes: an indium tin oxide (ITO) electrode that includes ITO; an Al electrode that includes Al and covers the ITO electrode; and a barrier electrode that includes at least one of TiN and Cr and is interposed in a region between the ITO electrode and the Al electrode.
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: February 13, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Ryosuke Ishimaru, Yohei Ito, Yasuo Nakanishi
  • Patent number: 11903227
    Abstract: A light-emitting element containing a fluorescent material and having high emission efficiency is provided. The light-emitting element contains the fluorescent material and a host material. The host material contains a first organic compound and a second organic compound. The first organic compound and the second organic compound can form an exciplex. The minimum value of a distance between centroids of the fluorescent material and at least one of the first organic compound and the second organic compound is 0.7 nm or more and 5 nm or less.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: February 13, 2024
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunsuke Hosoumi, Takahiro Ishisone, Tatsuyoshi Takahashi, Satoshi Seo
  • Patent number: 11894280
    Abstract: Provided is a semiconductor module comprising a semiconductor chip, a lead frame including a chip connection portion configured to connect the lead frame to the semiconductor chip, and a bonding member configured to connect the chip connection portion and the semiconductor chip, wherein the semiconductor chip includes a semiconductor substrate, an active portion provided on the semiconductor substrate, and a transverse protective film provided above the active portion and provided to traverse the active portion in a top view, wherein the chip connection portion includes a center portion which covers a center of the transverse protective film in a top view and a first cut-out portion provided from a first end side of the chip connection portion towards the center portion.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: February 6, 2024
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Yoshiaki Takahashi
  • Patent number: 11884093
    Abstract: A mechanical pencil includes a ball chuck, a rotation drive mechanism having a rotary part and receiving an axial direction retraction operation due to writing pressure received by the lead held by the ball chuck and an axial direction advance operation due to release of the writing pressure to drive the rotary part to rotate in one direction, a feed cam face having a ring-shaped cam face vertical to the axial direction and an axial direction step part, and a slider having an abutting part abutting against the feed cam face and a holding chuck holding a lead and rotating upon receiving a rotation drive force of the rotary part, which is configured so that the lead held by the holding chuck is pulled out from the ball chuck due to the advance operation of the slider.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: January 30, 2024
    Assignee: MITSUBISHI PENCIL COMPANY, LIMITED
    Inventors: Takamasa Fukuda, Yusuke Koizumi
  • Patent number: 11889739
    Abstract: The present invention provides an organic light-emitting diode (OLED) device and a manufacturing of the OLED device. The OLED device includes a light-emitting layer, an insulating layer, an electron transport layer, and an electron injection layer. The insulating layer is arranged on one side of the light-emitting layer, and a through hole is in the insulating layer. The through hole is arranged corresponding to a middle portion of the light-emitting layer. The electron transport layer is in a lower portion of the through hole and attached to a surface of the light-emitting layer. The electron injection layer is in an upper portion of the through hole and attached to one side of the electron transport layer away from the light-emitting layer.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: January 30, 2024
    Assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventors: Feng Wei, Aiguo Tu
  • Patent number: 11862758
    Abstract: The present disclosure relates to a lighting component which may comprise a light emitting diode (LED) or laser diode (LD) for generating at least one of blue light or ultraviolet light. A fluoride phosphor matrix may be included, which may be consolidated into a phosphor ceramic structure including at least one of a transparent fluoride ceramic structure or a translucent fluoride ceramic structure, and positioned adjacent to the LED or LD. The phosphor ceramic structure generates at least one of red or orange light when irradiated by the light emitted from the LED or LD. The phosphor ceramic structure exhibits reduced thermal quenching relative to a fluoride particulate structure irradiated by the LED or LD.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: January 2, 2024
    Assignees: Lawrence Livermore National Security, LLC, Current Lighting Solutiosn, LLC
    Inventors: Nerine Cherepy, Ross Allen Osborne, Stephen A. Payne, Zachary Seeley, Alok Srivastava, William Winder Beers, William Erwin Cohen
  • Patent number: 11862753
    Abstract: A light-emitting diode includes a first type semiconductor layer, a stress relief layer disposed on the first type semiconductor layer and including at least one first repeating unit containing a first well layer and a first barrier layer that are alternately stacked, an active layer disposed on the stress relief layer and including at least one second repeating unit containing a second well layer and a second barrier layer that are alternately stacked, a second type semiconductor layer disposed on the active layer, a first electrode electrically connected to the first type semiconductor layer, and a second electrode electrically connected to the second type semiconductor layer. The first well layer is made of an In-containing material. The second well layer is made of an In-containing material. The second barrier layer is formed with multiple sub-layers, each of which is made of an Al-containing material.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: January 2, 2024
    Assignee: ANHUI SAN'AN OPTOELECTRONICS CO., LTD.
    Inventors: Yung-Ling Lan, Chenghung Lee, Chan-Chan Ling, Chia-Hao Chang
  • Patent number: 11851596
    Abstract: A lighting device is specified. The lighting device comprises a phosphor having the general molecular formula (MA)a(MB)b(MC)c(MD)d(TA)e(TB)f(TC)g(TD)h(TE)i(TF)j(XA)k(XB)l(XC)m(XD)n:E. In this case, MA is selected from a group of monovalent metals, MB is selected from a group of divalent metals, MC is selected from a group of trivalent metals, MD is selected from a group of tetravalent metals, TA is selected from a group of monovalent metals, TB is selected from a group of divalent metals, TC is selected from a group of trivalent metals, TD is selected from a group of tetravalent metals, TE is selected from a group of pentavalent elements, TF is selected from a group of hexavalent elements, XA is selected from a group of elements which comprises halogens, XB is selected from a group of elements which comprises O, S and combinations thereof, XC=N and XD=C and E=Eu, Ce, Yb and/or Mn. The following furthermore hold true: a+b+c+d=t; e+f+g+h+i+j=u; k+l+m+n=v; a+2b+3c+4d+e+2f+3g+4h+5i+6j?k?2l?3m?4n=w; 0.8?t?1; ?3.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: December 26, 2023
    Assignee: OSRAM OLED GmbH
    Inventors: Markus Seibald, Simon Peschke, Gregor Hoerder, Gina Maya Achrainer, Klaus Wurst, Dominik Baumann, Tim Fiedler, Stefan Lange, Hubert Huppertz, Daniel Dutzler, Thorsten Schroeder, Daniel Bichler, Gudrun Plundrich
  • Patent number: 11855240
    Abstract: A light-emitting device includes a substrate having a first surface and a second surface opposite to the first surface; a light-emitting stack formed on the first surface; and a distributed Bragg reflection structure formed on the second surface, wherein the distributed Bragg reflection structure includes a first film stack and a second film stack; wherein the first film stack includes a plurality of first dielectric-layer pairs consecutively arranged, the second film stack includes a plurality of second dielectric-layer pairs consecutively arranged, each of the first dielectric-layer pairs and each of the second dielectric-layer pairs respectively includes a first dielectric layer having an optical thickness and a second dielectric layer having an optical thickness; wherein the second dielectric layer has a refractive index higher than that of the first dielectric layer; wherein in each of the first dielectric-layer pairs of the first film stack, the optical thickness of the first dielectric layer to the opt
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: December 26, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Heng-Ying Cho, De-Shan Kuo
  • Patent number: 11848406
    Abstract: A radiation-emitting semiconductor device (1) is specified, comprising a semiconductor body (2) having an active region (20) provided for generating radiation, a carrier (3) on which the semiconductor body is arranged and an optical element (4), wherein the optical element is attached to the semiconductor body by a direct bonding connection. Furthermore, a method for producing of radiation-emitting semiconductor devices is specified.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: December 19, 2023
    Assignee: OSRAM OLED GMBH
    Inventors: Roland Heinrich Enzmann, Hubert Halbritter, Martin Rudolf Behringer
  • Patent number: 11799060
    Abstract: A light-emitting device includes a substrate including a top surface, a first side surface and a second side surface, wherein the first side surface and the second side surface of the substrate are respectively connected to two opposite sides of the top surface of the substrate; a semiconductor stack formed on the top surface of the substrate, the semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a first electrode pad formed adjacent to a first edge of the light-emitting device; and a second electrode pad formed adjacent to a second edge of the light-emitting device, wherein in a top view of the light-emitting device, the first edge and the second edge are formed on different sides or opposite sides of the light-emitting device, the first semiconductor layer adjacent to the first edge includes a first sidewall directly connected to the first side surface of the substrate,
    Type: Grant
    Filed: February 23, 2023
    Date of Patent: October 24, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Chao-Hsing Chen, Cheng-Lin Lu, Chih-Hao Chen, Chi-Shiang Hsu, I-Lun Ma, Meng-Hsiang Hong, Hsin-Ying Wang, Kuo-Ching Hung, Yi-Hung Lin
  • Patent number: 11793049
    Abstract: Disclosed is a display apparatus, the display apparatus includes: a base, a display layer disposed on a side of the base, and a color filter layer disposed on a display side of the display layer. The display layer includes a plurality of sub-pixels. The color filter layer includes a plurality of color resistance portions in one-to-one correspondence with the plurality of sub-pixels. A thickness of any color resistance portion of the plurality of color resistance portions is decreased in a direction away from a reference line of the color resistance portion, and the reference line is a straight line passing through a geometric center of the color resistance portion and perpendicular to the base.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: October 17, 2023
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Chuanxiang Xu, Guangcai Yuan, Shi Shu, Qi Yao
  • Patent number: 11783757
    Abstract: A novel display is provided. A display having a small change in chromaticity of a micro light-emitting diode in proportion to current density is provided. A display capable of reducing power consumption in the driver circuit when displaying a still image is provided. The display includes a plurality of pixels each including a display element and a microcontroller. The microcontroller includes a first transistor, a triangular wave generator circuit, a comparator, a switch, and a constant current circuit. The first transistor has a function of retaining a potential corresponding to data written to the pixel by being switched off. The triangular wave generator circuit has a function of generating a triangular wave signal. The comparator has a function of generating an output signal corresponding to the potential and the triangular wave signal.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: October 10, 2023
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Kei Takahashi, Koji Kusunoki, Kazunori Watanabe, Susumu Kawashima, Kouhei Toyotaka, Shunpei Yamazaki
  • Patent number: 11778855
    Abstract: A light-emitting diode structure, a fabrication method therefor, and a display panel. The light-emitting diode structure includes: a base substrate; and a first electrode layer, a light-emitting layer and a second electrode layer that are successively stacked on the base substrate, wherein the second electrode layer includes a first coarse surface that is located at a side far from the base substrate.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: October 3, 2023
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Zhuo Chen
  • Patent number: 11774662
    Abstract: A light guiding structure, a light source module and a display module are disclosed. The light guiding structure includes a light guiding body and at least one light guiding cavity disposed in the light guiding body. The light guiding body includes a light incident surface and a light exit surface which are disposed opposite to each other. Each light guiding cavity includes a first end close to the light incident surface of the light guiding body and a second end away from the light incident surface of the light guiding body, and the light guiding cavity extends from the first end to the second end.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: October 3, 2023
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE Technology Group Co., Ltd.
    Inventors: Jian Zhao, Chaoyue Zhao, Xiuyun Chen, Lingyu Sun, Fei Liang, Tingxiu Hou, Peng Zhong, Jingjun Du, Yongkang Xiao
  • Patent number: 11769703
    Abstract: A semiconductor element is mounted on a die pad, and electrode pads arranged at an outer circumference of a surface of the semiconductor element are electrically connected to leads by wires, respectively. The semiconductor element, the die pad, and the leads are covered with an encapsulating resin. The semiconductor element has an element region having a high sensitivity with respect to stress, and an element region having a relatively low sensitivity with respect to stress. A recessed portion is formed in a surface of the encapsulating resin at a position above the element region having a high sensitivity with respect to stress.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: September 26, 2023
    Assignee: ABLIC INC.
    Inventor: Mitsuhiro Sakuma
  • Patent number: 11769780
    Abstract: An image sensor with stress adjusting layers and a method of fabrication the image sensor are disclosed. The image sensor includes a substrate with a front side surface and a back side surface opposite to the front side surface, an anti-reflective coating (ARC) layer disposed on the back side surface of the substrate, a dielectric layer disposed on the ARC layer, a metal layer disposed on the dielectric layer, and a stress adjusting layer disposed on the metal layer. The stress adjusting layer includes a silicon-rich oxide layer. The concentration profiles of silicon and oxygen atoms in the stress adjusting layer are non-overlapping and different from each other. The image sensor further includes oxide grid structure disposed on the stress adjusting layer.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: September 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Feng-Chien Hsieh, Kuo-Cheng Lee, Ying-Hao Chen, Yun-Wei Cheng
  • Patent number: 11764193
    Abstract: A display apparatus includes: a substrate; a light-emitting diode (“LED”) disposed above the substrate; a pixel-defining layer disposed above the substrate and including a concave portion which defines a space in which the LED is disposed; a light guider disposed in the space and between the LED and a first inner side surface of the concave portion; and a light blocker disposed above the pixel-defining layer to cover a top portion of the LED. The LED is disposed a second inner side surface of the concave portion, which is opposite to the first inner side surface, and spaced apart from a center of the concave portion, and the light guider guides light emitted from the LED to a region adjacent to the second inner side surface of the concave portion.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: September 19, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Youngseok Seo, Mugyeom Kim, Minsoo Kim, Junghyun Kim, Seunglyong Bok
  • Patent number: 11762513
    Abstract: A mesh-patterned touch panel includes a base layer, a first transparent oxide layer formed on the base layer, a metal electrode layer formed on the first transparent oxide layer, and a blackening layer formed on the metal electrode layer.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: September 19, 2023
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Ki Joon Park, Sung Jin Noh, Jungu Lee
  • Patent number: 11757075
    Abstract: Provided is a silica glass member for hermetic sealing of an ultraviolet SMD LED element to be suitably used for hermetic sealing of, and as a transmission window material for, a surface mount-type package (SMD) having an ultraviolet LED mounted thereon and configured to emit ultraviolet light in a wavelength range of from 200 nm to 350 nm.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: September 12, 2023
    Assignee: SHIN-ETSU QUARTZ PRODUCTS CO., LTD.
    Inventors: Akira Fujinoki, Hiroyuki Nishimura, Akira Sato, Yuya Yokosawa, Tatsuya Mori
  • Patent number: 11749784
    Abstract: A light emitting device includes a substrate; a first conductivity type semiconductor layer disposed on the substrate; a mesa; a transparent electrode; a contact electrode; a first insulating reflection layer; a first pad electrode and a second pad electrode; and a second insulating reflection layer. The first insulating reflection layer covers at least a portion of the light emitting structure, the transparent electrode and the contact electrode. The second insulating reflection layer is disposed on an opposite end of the substrate. The first and/or second insulating reflection layer have at least two regions which have different reflectivity properties.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: September 5, 2023
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Jin Woong Lee, Kyoung Wan Kim, Tae Jun Park, Sang Won Woo
  • Patent number: 11739899
    Abstract: Provided is a lighting device, comprising: a light source module comprising: at least one light source disposed on a printed circuit board; and a resin layer disposed on the printed circuit board so that the light source is embedded; a light reflection member formed on at least any one of one side surface and another side surface of the resin layer; and a diffusion plate having an upper surface formed on the light source module, and a side wall which is integrally formed with the upper surface and formed to extend in a lower side direction and which is adhered onto the light reflection member, wherein a first separated space is formed between the light source module and the upper surface of the diffusion plate, whereby flexibility of the product itself can be secured, and durability and reliability of the product can be also improved.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: August 29, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Kwang Ho Park, Chui Hong Kim, Hyun Duck Yang, Moo Ryong Park, Jun Chul Hyun
  • Patent number: 11735696
    Abstract: A light-emitting diode (LED) includes a light-transmissive substrate which has a first surface, an epitaxial structure which is disposed on the first surface, a first insulation layer, and a second insulation layer. The epitaxial structure has an upper surface opposite to the first surface, and a side wall interconnecting the upper surface and the first surface. The first insulation layer covers the side wall and the upper surface. The second insulation layer covers a portion of the first surface that is not covered by the epitaxial structure and the first insulation layer, and has a light transmittance greater than that of the first insulation layer. An LED package, an LED module, and a display device including the LEDs are also disclosed.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: August 22, 2023
    Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO. LTD.
    Inventors: Feng Wang, Zhanggen Xia, Yu Zhan, En-song Nie, Anhe He, Kang-Wei Peng, Su-Hui Lin
  • Patent number: 11728371
    Abstract: An LED module includes light emission windows; LED cells corresponding to the light emission windows, the LED cells each including a lower and upper light emitting structure, the lower light emitting structure having an upper surface with first and second regions and having a first conductivity-type semiconductor layer, the upper light emitting structure being on the first region of the lower light emitting structure and having a second conductivity-type semiconductor layer, the LED cells including an active layer between the first and second conductivity-type semiconductor layers; a protective insulating film on a side surface of the lower light emitting structure and on the second region; a light blocking film on the protective insulating film, between the LED cells; a gap-fill insulating film on the protective insulating film between the LED cells and contacting a side surface of the upper light emitting structure; a first electrode; and a second electrode.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: August 15, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jihye Yeon, Hanul Yoo, Jihoon Yun, Suhyun Jo