With Reflector, Opaque Mask, Or Optical Element (e.g., Lens, Optical Fiber, Index Of Refraction Matching Layer, Luminescent Material Layer, Filter) Integral With Device Or Device Enclosure Or Package Patents (Class 257/98)
  • Patent number: 11929452
    Abstract: A method for manufacturing a light-emitting device includes: forming a cover, which comprises: sandwiching a fixing member by a molding device, injecting a light-transmissive material into a space defined in the molding device, and hardening or curing the injected light-transmissive material, wherein the formed cover comprises an upper portion, a sidewall, and a recess, the cover being integrated with the fixing member such that the fixing member projects from a part of an outer lateral surface of the sidewall; disposing a light-transmissive member on a light extraction surface of a light-emitting element to be disposed on a substrate; and disposing the cover so that the light-emitting element is housed in the recess. The fixing member is formed of a material that is deformable due to a pressing force generated in the event of an engagement with a counterpart member.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: March 12, 2024
    Assignee: NICHIA CORPORATION
    Inventors: Tsuyoshi Okahisa, Tomohito Shinomiya, Daizo Kiba
  • Patent number: 11929591
    Abstract: A semiconductor light-emitting device includes a stacked body, a cutout section, and a high-resistance region. The stacked body includes a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer in this order and has paired side faces opposed to each other. The cutout section is provided on at least one of the paired side faces of the stacked body and has a bottom face where the first conductive-type semiconductor layer is exposed. The high-resistance region is provided from the vicinity of the bottom face of the cutout section to the side face of the stacked body and has electric resistance higher than the electric resistance of the stacked body in a periphery of the high-resistance region.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: March 12, 2024
    Assignee: SONY CORPORATION
    Inventors: Masahiro Murayama, Takashi Sugiyama
  • Patent number: 11925056
    Abstract: The embodiments of the present application provide a package cover plate and a manufacturing method thereof, a display panel and a display device. The package cover plate includes a cover plate structure layer, a spacer structure on a side of the cover plate structure layer, the spacer structure includes a first spacer, and the first spacer includes a water absorbing structure, and an auxiliary electrode layer on a side of the spacer structure facing away from the cover plate structure layer.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: March 5, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Chengyuan Luo
  • Patent number: 11916096
    Abstract: An integrated optical display system includes a backplane with appropriate electronics, and an array of micro-devices. A touch sensing structure may be integrated into the system. In one embodiment, an integrated circuit and system is integrated on top of micro-devices transferred to a substrate. Openings in a planarization layer (or layers) may be provided to connect the micro-devices with electrodes and other circuitry. Light reflectors may be used to redirect the light, and color conversion layers or color filters may be integrated before the micro-devices or on the substrate surface opposite to the surface of micro-devices.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: February 27, 2024
    Assignee: VueReal Inc.
    Inventors: Gholamreza Chaji, Yaser Azizi, Ehsanollah Fathi
  • Patent number: 11916170
    Abstract: A micro-light-emitting diode chip includes an epitaxial structure, an electrode, a transparent structure, and a reflection layer. The epitaxial structure has a light exit surface, a back surface opposite to the light exit surface, and a sidewall surface. The sidewall surface is connected to the light exit surface and the back surface. The electrode is electrically coupled to the epitaxial structure. The transparent structure has an inner surface and an outer surface opposite to the inner surface. The inner surface is connected to the sidewall surface. A distance between the outer surface and the inner surface on a plane where the back surface is located is less than a distance between the outer surface and the inner surface on a plane where the light exit surface is located. The reflection layer is in direct contact with the outer surface. A micro-light-emitting diode display is also provided.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: February 27, 2024
    Assignee: PlayNitride Display Co., Ltd.
    Inventors: Sheng-Yuan Sun, Loganathan Murugan, Po-Wei Chiu
  • Patent number: 11908982
    Abstract: A light-emitting diode (LED) package includes an LED chip on a substrate, an adhesive phosphor film on the LED chip, a cell lens on the adhesive phosphor film, and a lateral reflective layer covering respective lateral surfaces of the LED chip, the adhesive phosphor film, and the cell lens, a lateral surface of the lateral reflective layer being coplanar with a lateral surface of the substrate.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: February 20, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jongsup Song, Tetsuo Ariyoshi, Taehyun Lee
  • Patent number: 11901489
    Abstract: An electrode structure includes: an indium tin oxide (ITO) electrode that includes ITO; an Al electrode that includes Al and covers the ITO electrode; and a barrier electrode that includes at least one of TiN and Cr and is interposed in a region between the ITO electrode and the Al electrode.
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: February 13, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Ryosuke Ishimaru, Yohei Ito, Yasuo Nakanishi
  • Patent number: 11903227
    Abstract: A light-emitting element containing a fluorescent material and having high emission efficiency is provided. The light-emitting element contains the fluorescent material and a host material. The host material contains a first organic compound and a second organic compound. The first organic compound and the second organic compound can form an exciplex. The minimum value of a distance between centroids of the fluorescent material and at least one of the first organic compound and the second organic compound is 0.7 nm or more and 5 nm or less.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: February 13, 2024
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunsuke Hosoumi, Takahiro Ishisone, Tatsuyoshi Takahashi, Satoshi Seo
  • Patent number: 11894280
    Abstract: Provided is a semiconductor module comprising a semiconductor chip, a lead frame including a chip connection portion configured to connect the lead frame to the semiconductor chip, and a bonding member configured to connect the chip connection portion and the semiconductor chip, wherein the semiconductor chip includes a semiconductor substrate, an active portion provided on the semiconductor substrate, and a transverse protective film provided above the active portion and provided to traverse the active portion in a top view, wherein the chip connection portion includes a center portion which covers a center of the transverse protective film in a top view and a first cut-out portion provided from a first end side of the chip connection portion towards the center portion.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: February 6, 2024
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Yoshiaki Takahashi
  • Patent number: 11884093
    Abstract: A mechanical pencil includes a ball chuck, a rotation drive mechanism having a rotary part and receiving an axial direction retraction operation due to writing pressure received by the lead held by the ball chuck and an axial direction advance operation due to release of the writing pressure to drive the rotary part to rotate in one direction, a feed cam face having a ring-shaped cam face vertical to the axial direction and an axial direction step part, and a slider having an abutting part abutting against the feed cam face and a holding chuck holding a lead and rotating upon receiving a rotation drive force of the rotary part, which is configured so that the lead held by the holding chuck is pulled out from the ball chuck due to the advance operation of the slider.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: January 30, 2024
    Assignee: MITSUBISHI PENCIL COMPANY, LIMITED
    Inventors: Takamasa Fukuda, Yusuke Koizumi
  • Patent number: 11889739
    Abstract: The present invention provides an organic light-emitting diode (OLED) device and a manufacturing of the OLED device. The OLED device includes a light-emitting layer, an insulating layer, an electron transport layer, and an electron injection layer. The insulating layer is arranged on one side of the light-emitting layer, and a through hole is in the insulating layer. The through hole is arranged corresponding to a middle portion of the light-emitting layer. The electron transport layer is in a lower portion of the through hole and attached to a surface of the light-emitting layer. The electron injection layer is in an upper portion of the through hole and attached to one side of the electron transport layer away from the light-emitting layer.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: January 30, 2024
    Assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventors: Feng Wei, Aiguo Tu
  • Patent number: 11862758
    Abstract: The present disclosure relates to a lighting component which may comprise a light emitting diode (LED) or laser diode (LD) for generating at least one of blue light or ultraviolet light. A fluoride phosphor matrix may be included, which may be consolidated into a phosphor ceramic structure including at least one of a transparent fluoride ceramic structure or a translucent fluoride ceramic structure, and positioned adjacent to the LED or LD. The phosphor ceramic structure generates at least one of red or orange light when irradiated by the light emitted from the LED or LD. The phosphor ceramic structure exhibits reduced thermal quenching relative to a fluoride particulate structure irradiated by the LED or LD.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: January 2, 2024
    Assignees: Lawrence Livermore National Security, LLC, Current Lighting Solutiosn, LLC
    Inventors: Nerine Cherepy, Ross Allen Osborne, Stephen A. Payne, Zachary Seeley, Alok Srivastava, William Winder Beers, William Erwin Cohen
  • Patent number: 11862753
    Abstract: A light-emitting diode includes a first type semiconductor layer, a stress relief layer disposed on the first type semiconductor layer and including at least one first repeating unit containing a first well layer and a first barrier layer that are alternately stacked, an active layer disposed on the stress relief layer and including at least one second repeating unit containing a second well layer and a second barrier layer that are alternately stacked, a second type semiconductor layer disposed on the active layer, a first electrode electrically connected to the first type semiconductor layer, and a second electrode electrically connected to the second type semiconductor layer. The first well layer is made of an In-containing material. The second well layer is made of an In-containing material. The second barrier layer is formed with multiple sub-layers, each of which is made of an Al-containing material.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: January 2, 2024
    Assignee: ANHUI SAN'AN OPTOELECTRONICS CO., LTD.
    Inventors: Yung-Ling Lan, Chenghung Lee, Chan-Chan Ling, Chia-Hao Chang
  • Patent number: 11851596
    Abstract: A lighting device is specified. The lighting device comprises a phosphor having the general molecular formula (MA)a(MB)b(MC)c(MD)d(TA)e(TB)f(TC)g(TD)h(TE)i(TF)j(XA)k(XB)l(XC)m(XD)n:E. In this case, MA is selected from a group of monovalent metals, MB is selected from a group of divalent metals, MC is selected from a group of trivalent metals, MD is selected from a group of tetravalent metals, TA is selected from a group of monovalent metals, TB is selected from a group of divalent metals, TC is selected from a group of trivalent metals, TD is selected from a group of tetravalent metals, TE is selected from a group of pentavalent elements, TF is selected from a group of hexavalent elements, XA is selected from a group of elements which comprises halogens, XB is selected from a group of elements which comprises O, S and combinations thereof, XC=N and XD=C and E=Eu, Ce, Yb and/or Mn. The following furthermore hold true: a+b+c+d=t; e+f+g+h+i+j=u; k+l+m+n=v; a+2b+3c+4d+e+2f+3g+4h+5i+6j?k?2l?3m?4n=w; 0.8?t?1; ?3.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: December 26, 2023
    Assignee: OSRAM OLED GmbH
    Inventors: Markus Seibald, Simon Peschke, Gregor Hoerder, Gina Maya Achrainer, Klaus Wurst, Dominik Baumann, Tim Fiedler, Stefan Lange, Hubert Huppertz, Daniel Dutzler, Thorsten Schroeder, Daniel Bichler, Gudrun Plundrich
  • Patent number: 11855240
    Abstract: A light-emitting device includes a substrate having a first surface and a second surface opposite to the first surface; a light-emitting stack formed on the first surface; and a distributed Bragg reflection structure formed on the second surface, wherein the distributed Bragg reflection structure includes a first film stack and a second film stack; wherein the first film stack includes a plurality of first dielectric-layer pairs consecutively arranged, the second film stack includes a plurality of second dielectric-layer pairs consecutively arranged, each of the first dielectric-layer pairs and each of the second dielectric-layer pairs respectively includes a first dielectric layer having an optical thickness and a second dielectric layer having an optical thickness; wherein the second dielectric layer has a refractive index higher than that of the first dielectric layer; wherein in each of the first dielectric-layer pairs of the first film stack, the optical thickness of the first dielectric layer to the opt
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: December 26, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Heng-Ying Cho, De-Shan Kuo
  • Patent number: 11848406
    Abstract: A radiation-emitting semiconductor device (1) is specified, comprising a semiconductor body (2) having an active region (20) provided for generating radiation, a carrier (3) on which the semiconductor body is arranged and an optical element (4), wherein the optical element is attached to the semiconductor body by a direct bonding connection. Furthermore, a method for producing of radiation-emitting semiconductor devices is specified.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: December 19, 2023
    Assignee: OSRAM OLED GMBH
    Inventors: Roland Heinrich Enzmann, Hubert Halbritter, Martin Rudolf Behringer
  • Patent number: 11799060
    Abstract: A light-emitting device includes a substrate including a top surface, a first side surface and a second side surface, wherein the first side surface and the second side surface of the substrate are respectively connected to two opposite sides of the top surface of the substrate; a semiconductor stack formed on the top surface of the substrate, the semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a first electrode pad formed adjacent to a first edge of the light-emitting device; and a second electrode pad formed adjacent to a second edge of the light-emitting device, wherein in a top view of the light-emitting device, the first edge and the second edge are formed on different sides or opposite sides of the light-emitting device, the first semiconductor layer adjacent to the first edge includes a first sidewall directly connected to the first side surface of the substrate,
    Type: Grant
    Filed: February 23, 2023
    Date of Patent: October 24, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Chao-Hsing Chen, Cheng-Lin Lu, Chih-Hao Chen, Chi-Shiang Hsu, I-Lun Ma, Meng-Hsiang Hong, Hsin-Ying Wang, Kuo-Ching Hung, Yi-Hung Lin
  • Patent number: 11793049
    Abstract: Disclosed is a display apparatus, the display apparatus includes: a base, a display layer disposed on a side of the base, and a color filter layer disposed on a display side of the display layer. The display layer includes a plurality of sub-pixels. The color filter layer includes a plurality of color resistance portions in one-to-one correspondence with the plurality of sub-pixels. A thickness of any color resistance portion of the plurality of color resistance portions is decreased in a direction away from a reference line of the color resistance portion, and the reference line is a straight line passing through a geometric center of the color resistance portion and perpendicular to the base.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: October 17, 2023
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Chuanxiang Xu, Guangcai Yuan, Shi Shu, Qi Yao
  • Patent number: 11783757
    Abstract: A novel display is provided. A display having a small change in chromaticity of a micro light-emitting diode in proportion to current density is provided. A display capable of reducing power consumption in the driver circuit when displaying a still image is provided. The display includes a plurality of pixels each including a display element and a microcontroller. The microcontroller includes a first transistor, a triangular wave generator circuit, a comparator, a switch, and a constant current circuit. The first transistor has a function of retaining a potential corresponding to data written to the pixel by being switched off. The triangular wave generator circuit has a function of generating a triangular wave signal. The comparator has a function of generating an output signal corresponding to the potential and the triangular wave signal.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: October 10, 2023
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Kei Takahashi, Koji Kusunoki, Kazunori Watanabe, Susumu Kawashima, Kouhei Toyotaka, Shunpei Yamazaki
  • Patent number: 11778855
    Abstract: A light-emitting diode structure, a fabrication method therefor, and a display panel. The light-emitting diode structure includes: a base substrate; and a first electrode layer, a light-emitting layer and a second electrode layer that are successively stacked on the base substrate, wherein the second electrode layer includes a first coarse surface that is located at a side far from the base substrate.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: October 3, 2023
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Zhuo Chen
  • Patent number: 11774662
    Abstract: A light guiding structure, a light source module and a display module are disclosed. The light guiding structure includes a light guiding body and at least one light guiding cavity disposed in the light guiding body. The light guiding body includes a light incident surface and a light exit surface which are disposed opposite to each other. Each light guiding cavity includes a first end close to the light incident surface of the light guiding body and a second end away from the light incident surface of the light guiding body, and the light guiding cavity extends from the first end to the second end.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: October 3, 2023
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE Technology Group Co., Ltd.
    Inventors: Jian Zhao, Chaoyue Zhao, Xiuyun Chen, Lingyu Sun, Fei Liang, Tingxiu Hou, Peng Zhong, Jingjun Du, Yongkang Xiao
  • Patent number: 11769780
    Abstract: An image sensor with stress adjusting layers and a method of fabrication the image sensor are disclosed. The image sensor includes a substrate with a front side surface and a back side surface opposite to the front side surface, an anti-reflective coating (ARC) layer disposed on the back side surface of the substrate, a dielectric layer disposed on the ARC layer, a metal layer disposed on the dielectric layer, and a stress adjusting layer disposed on the metal layer. The stress adjusting layer includes a silicon-rich oxide layer. The concentration profiles of silicon and oxygen atoms in the stress adjusting layer are non-overlapping and different from each other. The image sensor further includes oxide grid structure disposed on the stress adjusting layer.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: September 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Feng-Chien Hsieh, Kuo-Cheng Lee, Ying-Hao Chen, Yun-Wei Cheng
  • Patent number: 11769703
    Abstract: A semiconductor element is mounted on a die pad, and electrode pads arranged at an outer circumference of a surface of the semiconductor element are electrically connected to leads by wires, respectively. The semiconductor element, the die pad, and the leads are covered with an encapsulating resin. The semiconductor element has an element region having a high sensitivity with respect to stress, and an element region having a relatively low sensitivity with respect to stress. A recessed portion is formed in a surface of the encapsulating resin at a position above the element region having a high sensitivity with respect to stress.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: September 26, 2023
    Assignee: ABLIC INC.
    Inventor: Mitsuhiro Sakuma
  • Patent number: 11764193
    Abstract: A display apparatus includes: a substrate; a light-emitting diode (“LED”) disposed above the substrate; a pixel-defining layer disposed above the substrate and including a concave portion which defines a space in which the LED is disposed; a light guider disposed in the space and between the LED and a first inner side surface of the concave portion; and a light blocker disposed above the pixel-defining layer to cover a top portion of the LED. The LED is disposed a second inner side surface of the concave portion, which is opposite to the first inner side surface, and spaced apart from a center of the concave portion, and the light guider guides light emitted from the LED to a region adjacent to the second inner side surface of the concave portion.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: September 19, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Youngseok Seo, Mugyeom Kim, Minsoo Kim, Junghyun Kim, Seunglyong Bok
  • Patent number: 11762513
    Abstract: A mesh-patterned touch panel includes a base layer, a first transparent oxide layer formed on the base layer, a metal electrode layer formed on the first transparent oxide layer, and a blackening layer formed on the metal electrode layer.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: September 19, 2023
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Ki Joon Park, Sung Jin Noh, Jungu Lee
  • Patent number: 11757075
    Abstract: Provided is a silica glass member for hermetic sealing of an ultraviolet SMD LED element to be suitably used for hermetic sealing of, and as a transmission window material for, a surface mount-type package (SMD) having an ultraviolet LED mounted thereon and configured to emit ultraviolet light in a wavelength range of from 200 nm to 350 nm.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: September 12, 2023
    Assignee: SHIN-ETSU QUARTZ PRODUCTS CO., LTD.
    Inventors: Akira Fujinoki, Hiroyuki Nishimura, Akira Sato, Yuya Yokosawa, Tatsuya Mori
  • Patent number: 11749784
    Abstract: A light emitting device includes a substrate; a first conductivity type semiconductor layer disposed on the substrate; a mesa; a transparent electrode; a contact electrode; a first insulating reflection layer; a first pad electrode and a second pad electrode; and a second insulating reflection layer. The first insulating reflection layer covers at least a portion of the light emitting structure, the transparent electrode and the contact electrode. The second insulating reflection layer is disposed on an opposite end of the substrate. The first and/or second insulating reflection layer have at least two regions which have different reflectivity properties.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: September 5, 2023
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Jin Woong Lee, Kyoung Wan Kim, Tae Jun Park, Sang Won Woo
  • Patent number: 11739899
    Abstract: Provided is a lighting device, comprising: a light source module comprising: at least one light source disposed on a printed circuit board; and a resin layer disposed on the printed circuit board so that the light source is embedded; a light reflection member formed on at least any one of one side surface and another side surface of the resin layer; and a diffusion plate having an upper surface formed on the light source module, and a side wall which is integrally formed with the upper surface and formed to extend in a lower side direction and which is adhered onto the light reflection member, wherein a first separated space is formed between the light source module and the upper surface of the diffusion plate, whereby flexibility of the product itself can be secured, and durability and reliability of the product can be also improved.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: August 29, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Kwang Ho Park, Chui Hong Kim, Hyun Duck Yang, Moo Ryong Park, Jun Chul Hyun
  • Patent number: 11735696
    Abstract: A light-emitting diode (LED) includes a light-transmissive substrate which has a first surface, an epitaxial structure which is disposed on the first surface, a first insulation layer, and a second insulation layer. The epitaxial structure has an upper surface opposite to the first surface, and a side wall interconnecting the upper surface and the first surface. The first insulation layer covers the side wall and the upper surface. The second insulation layer covers a portion of the first surface that is not covered by the epitaxial structure and the first insulation layer, and has a light transmittance greater than that of the first insulation layer. An LED package, an LED module, and a display device including the LEDs are also disclosed.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: August 22, 2023
    Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO. LTD.
    Inventors: Feng Wang, Zhanggen Xia, Yu Zhan, En-song Nie, Anhe He, Kang-Wei Peng, Su-Hui Lin
  • Patent number: 11728444
    Abstract: An arrangement for an optoelectronic component includes a substrate and an optical semiconductor chip arranged on the substrate. The optical semiconductor chip has an optically active region, a first optically non-active region, and a second optically non-active region. A connection structure connects a chip-side electrical connection to the optically active region. An electrical connection connects the chip-side electrical connection to a second substrate-side electrical connection. A coating is provided in a layer stack in the optically active region, in the first optically non-active region, and in the second optically non-active region. The layer stack includes a first layer and a second layer arranged above the first layer. The chip-side electrical connection and the connection structure in the first optically non-active region and the protective layer in the second optically non-active region are each arranged between the first layer and the second layer.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: August 15, 2023
    Assignee: First Sensor AG
    Inventors: Martin Wilke, Sabine Friedrich, Stephan Dobritz
  • Patent number: 11728371
    Abstract: An LED module includes light emission windows; LED cells corresponding to the light emission windows, the LED cells each including a lower and upper light emitting structure, the lower light emitting structure having an upper surface with first and second regions and having a first conductivity-type semiconductor layer, the upper light emitting structure being on the first region of the lower light emitting structure and having a second conductivity-type semiconductor layer, the LED cells including an active layer between the first and second conductivity-type semiconductor layers; a protective insulating film on a side surface of the lower light emitting structure and on the second region; a light blocking film on the protective insulating film, between the LED cells; a gap-fill insulating film on the protective insulating film between the LED cells and contacting a side surface of the upper light emitting structure; a first electrode; and a second electrode.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: August 15, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jihye Yeon, Hanul Yoo, Jihoon Yun, Suhyun Jo
  • Patent number: 11728359
    Abstract: Disclosed is an image sensor having a plurality of groups of pixels, each group of pixels including: first to third image detection color filter sets and a phase difference detection color filter set, which are arranged in a matrix with rows and columns. The phase difference detection color filter set comprises first to fourth phase difference detection color filter pairs arranged in a matrix with rows and columns. The first to fourth phase difference detection color filter pairs comprise first to fourth left phase difference detection color filters positioned on the left of each of the first to fourth phase difference detection color filter pairs and first to fourth right phase difference detection color filters positioned on the right of each of the first to fourth phase difference detection color filter pairs, respectively.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: August 15, 2023
    Assignees: SK hynix Inc., Dong-A University Research Foundation for Industry-Academy Cooperation
    Inventors: Kyoung-In Lee, Min-Su Cho, Sung-Wook Cho, Yun-Kyung Kim
  • Patent number: 11721791
    Abstract: A light-emitting device includes a semiconductor structure including a first semiconductor layer, a second semiconductor layer on the first semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, wherein the second semiconductor layer includes a first edge; a reflective structure located on the second semiconductor layer and including an outer edge; a first electrode pad located on the reflective structure, wherein the first electrode pad including an outer side wall adjacent to the outer edge, wherein the outer edge extends beyond the outer side wall and does not exceed the first edge in a cross-sectional view of the light-emitting device.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: August 8, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Chao-Hsing Chen, Jia-Kuen Wang, Wen-Hung Chuang, Tzu-Yao Tseng, Cheng-Lin Lu
  • Patent number: 11715816
    Abstract: A display apparatus is provided. The display apparatus includes a substrate, a transistor, a metal layer, and a light-emitting diode. The transistor is disposed on the substrate. The metal layer is disposed on the transistor and electrically connected to the transistor, wherein a first distance is between the upper surface of the metal layer and the substrate in a direction perpendicular to the substrate. The light-emitting diode is disposed on the metal layer, wherein the light-emitting diode includes a light-emitting diode body and an electrode, the light-emitting diode body is electrically connected to the metal layer via the electrode, the light-emitting diode body has a first surface and a second surface opposite to the first surface, the first surface and the second surface are parallel to the substrate, and in the direction above, a second distance is between the first surface and the second surface, wherein the ratio of the second distance to the first distance is greater than or equal to 0.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: August 1, 2023
    Assignee: Innolux Corporation
    Inventors: Kuan-Feng Lee, Ting-Kai Hung, Yu-Hsien Wu, Chia-Hsiung Chang
  • Patent number: 11710806
    Abstract: A light-emitting unit is provided. The light-emitting unit includes a light-emitting element, a light conversion layer, and a color filter layer. The light conversion layer is disposed on the light-emitting element. The color filter layer covers the sidewalls of the light conversion layer. In addition, the light-emitting unit further includes a protection layer located between the color filter layer and the light conversion layer.
    Type: Grant
    Filed: November 27, 2020
    Date of Patent: July 25, 2023
    Assignee: INNOLUX CORPORATION
    Inventor: Shu-Ming Kuo
  • Patent number: 11706948
    Abstract: An organic light emitting display apparatus is disclosed, which comprises a substrate, a thin film transistor provided on the substrate, a planarization film provided on the thin film transistor, a light emitting diode provided on the planarization film and electrically connected with the thin film transistor, an encapsulation layer covering the light emitting diode, and an encapsulation substrate provided on the encapsulation layer, wherein the encapsulation substrate may include a first portion that includes a first member and a second portion that includes a second member.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: July 18, 2023
    Assignee: LG Display Co., Ltd.
    Inventors: JooHwan Shin, Dohyung Kim, MinJoo Kang, Sungsoo Gil, MinHo Oh, TaeJin Choi
  • Patent number: 11706935
    Abstract: An electroluminescent device, a method for fabricating the same, a display panel, and a display device are disclosed. The electroluminescent device includes a hole inject layer, a hole transport layer, an electron transport layer, and an electron inject layer. At least one of the hole inject layer, the hole transport layer, the electron transport layer, and electron inject layer is a target film including a small molecular layer and a large molecular layer which are arranged in a stacked manner.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: July 18, 2023
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Wenjun Hou
  • Patent number: 11705540
    Abstract: A display device includes a substrate, a first electrode disposed on the substrate, a second electrode disposed on the substrate and spaced apart from the first electrode, a plurality of first protruding electrodes disposed on the first electrode, a plurality of second protruding electrodes disposed on the second electrode, and a plurality of light emitting elements electrically connected to the plurality of first protruding electrodes and the plurality of second protruding electrodes.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: July 18, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Chongsup Chang, Youngdae Kim, Hyunae Kim, Euikang Heo
  • Patent number: 11699365
    Abstract: A flexible battery and a display device are provided. The flexible battery includes: a plurality of flexible electric core blocks; wherein the plurality of flexible electric core blocks are arranged at intervals along a curling traveling direction, a spacing between adjacent flexible electric core blocks is gradually increased along the curling traveling direction; at least one flexible connecting bridge is arranged between the adjacent flexible electric core blocks, and two ends of the flexible connecting bridge are electrically connected with the adjacent flexible electric core blocks respectively.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: July 11, 2023
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yue Cui, Hong Zhu, Boyang Shi, Yuehan Wei
  • Patent number: 11688837
    Abstract: A light-emitting device, including a mount substrate, at least one light emitting element, a first light transparent member, a second light transparent member and a covering member, is disclosed. The at least one light emitting element is disposed on the mount substrate in a flip-chip manner. The first light transparent member is configured to receive the incident light emitting from the light emitting element, wherein the first light transparent member is formed of an inorganic substance and an inorganic phosphor, and includes a top surface and a first side surface contiguous to the top surface. The second light transparent member is disposed on the top surface of the first light transparent member and is formed of the inorganic substance and contains no the inorganic phosphor, and includes an externally exposed light emission surface and a second side surface contiguous to the externally exposed light emission surface.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: June 27, 2023
    Assignee: EVERLIGHT ELECTRONICS CO., LTD.
    Inventors: Hung-Hsiang Yeh, Robert Yeh, Tsung-Yuan Chen, Bo-Yu Chen
  • Patent number: 11682684
    Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a sensor, an optical component and a fixing element. The optical component directly contacts the sensor. An interfacial area is defined by a contacting region of the optical component and the sensor. The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: June 20, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Ling Huang, Lu-Ming Lai, Ying-Chung Chen
  • Patent number: 11677048
    Abstract: A light emitting device includes a first light emitting element including a rectangular first light extraction surface, a second light emitting element including a rectangular second light extraction surface and emitting light having an emission peak wavelength different from an emission peak wavelength of the first light emitting element, and a light-transmissive member covering the first light extraction surface and the second light extraction surface. The light-transmissive member includes a first light-transmissive layer facing the first light extraction surface and the second light extraction surface, a wavelength conversion layer located on the first light-transmissive layer, and a second light-transmissive layer located on the wavelength conversion layer. The first light-transmissive layer contains a first matrix and first diffusive particles. The wavelength conversion layer contains a second matrix and wavelength conversion particles.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: June 13, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Nakabayashi, Tadaaki Ikeda, Toru Hashimoto, Yukiko Yokote
  • Patent number: 11658271
    Abstract: A deep ultraviolet (DUV) light-emitting diode (LED) module structure contains: a holder configured to accommodate a substrate. The holder including a receiving cup mounted therein and a transparent layer mounted on a top of the receiving cup. The holder includes a DUV LED chip adhered on the substrate, and the holder, the substrate, and the DUV LED chip are connected and packaged. The substrate is electrically connected with a drive circuit, and the drive circuit is configured to turn on/off the DUV LED chip. Thereby, the DUV LED module structure enhances DUV radiation intensity, reduces a loss of optical path, and slows down deterioration because of DUV irradiation.
    Type: Grant
    Filed: April 2, 2021
    Date of Patent: May 23, 2023
    Assignee: Cheng Mei Optronics Inc.
    Inventors: Bin-Chun Hsieh, Siang-Jyun Chen, Sin-yu Chen
  • Patent number: 11639465
    Abstract: A phosphor is specified. The phosphor has the general molecular formula: (MA)a(MB)b(MC)c(MD)d(TA)e(TB)f(TC)g(TD)h(TE)i(TF)j(XA)k(XB)l(XC)m(XD)n:E. In this case, MA is selected from a group of monovalent metals, MB is selected from a group of divalent metals, MC is selected from a group of trivalent metals, MD is selected from a group of tetravalent metals, TA is selected from a group of monovalent metals, TB is selected from a group of divalent metals, TC is selected from a group of trivalent metals, TD is selected from a group of tetravalent metals, TE is selected from a group of pentavalent elements, TF is selected from a group of hexavalent elements, XA is selected from a group of elements which comprises halogens, XB is selected from a group of elements which comprises O, S and combinations thereof, -E=Eu, Ce, Yb and/or Mn, XC?N and XD=C. The following furthermore hold true: a+b+c+d=t; e+f+g+h+i+j=u; k+l+m+n=v; a+2b+3c+4d+e+2f+3g+4h+5i+6j?k?2l?3m?4n=w; 0.8?t?1; 3.5?u?4; 3.5?v?4; (?0.2)?w?0.2 and 0?m<0.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: May 2, 2023
    Assignee: OSRAM OLED GMBH
    Inventors: Markus Seibald, Dominik Baumann, Tim Fiedler, Stefan Lange, Hubert Huppertz, Daniel Dutzler, Thorsten Schroeder, Daniel Bichler, Gudrun Plundrich, Simon Peschke, Gregor Hoerder, Gina Maya Achrainer, Klaus Wurst
  • Patent number: 11637270
    Abstract: A method of manufacturing a display apparatus includes separating a mother substrate that includes a plurality of connected unit display apparatuses into a plurality of separated unit display apparatuses. Each separated unit display apparatus includes a display panel and at least one supporting unit attached below the display panel. The display panel includes a display substrate that has a pad area on which are disposed a plurality of pads and a thin film encapsulation layer on the display substrate. The method further includes consecutively cutting the display panel and the at least one supporting unit of each separated unit display apparatus along cutting lines in the pad area, where a first cut surface of the pad area of the display substrate and a second cut surface of the at least one supporting unit are respectively cut at different angles.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: April 25, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Geunwoo Yug, Myeongseok Jeong, Soobum Park, Junghwa You, Ilyoung Jeong
  • Patent number: 11637229
    Abstract: A micro light emitting diode display includes a substrate, an electrode layer and a micro light emitting diode device. The substrate has a first surface, a second surface opposite to the first surface, and at least one air passage extending from the first surface to the second surface. The electrode layer is disposed on and in contact with the first surface of the substrate. The air passage has an opening on the first surface of the substrate, and the electrode layer is spaced apart from the opening. The micro light emitting diode device is disposed on the electrode layer and has a light emitting area that is less than or equal to 2500 ?m2.
    Type: Grant
    Filed: August 29, 2021
    Date of Patent: April 25, 2023
    Assignee: MIKRO MESA TECHNOLOGY CO., LTD.
    Inventor: Li-Yi Chen
  • Patent number: 11626389
    Abstract: A display device includes a display element layer on a substrate. The display element layer may include first and second electrodes, and light emitting elements electrically coupled to the first and second electrodes. The first electrode may include first protrusions, a first portion located between the first protrusions, a second portion corresponding to a side of each first protrusion, and a third portion coupled between the first portion and a first end of the second portion. The second electrode may include second protrusions that protrude toward the first electrode and are spaced apart from each other in the first direction, a first portion located between the second protrusions, a second portion corresponding to a side of each of the second protrusions, and a third portion coupled between the first portion and a first end of the second portion.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: April 11, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jun Hong Park, Tae Gyun Kim, Jun Chun, Eui Suk Jung, Hyun Young Jung
  • Patent number: 11621255
    Abstract: An optoelectronic component and an assembly with an optoectronic component are disclosed. In an embodiment an optoelectronic component includes an optical element with an outer surface and an inner surface that faces away from the outer surface, wherein the inner surface includes a first region of the optical element, in which the inner surface is flat, wherein the inner surface includes a second region of the optical element, wherein the second region adjoins the first region, and wherein the inner surface includes a third region of the optical element, in which the inner surface extends from the second region in the direction of a housing.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: April 4, 2023
    Assignee: OSRAM OLED GMBH
    Inventors: Claus Jaeger, Stephan Haslbeck
  • Patent number: 11621292
    Abstract: Pixelated array light emitters are formed with closely-spaced pixels having ultra-smooth sidewalk. In methods for making such pixelated array light emitters, a converter layer of phosphor particles dispersed in a binder is disposed on a carrier, and then singulated by saw cuts or similar methods to form an array of phosphor pixels. The binder is fully cured prior to singulation of the converter layer. Further, the carrier is rigid rather than flexible. As a consequence of fully curing the binder and of using a rigid carrier to support the converter layer, singulation results in phosphor pixels having smooth side walls. The array of phosphor pixels is subsequently attached to a corresponding array of LEDs with an adhesive layer, separate from the binder used to form the converter layer. The pixel sidewalls may be formed with controlled morphology, for example at acute or obtuse angles with respect to the carrier.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: April 4, 2023
    Assignee: Lumileds LLC
    Inventors: Hisashi Masui, Ken Shimizu, Emma Dohner
  • Patent number: 11621378
    Abstract: An optoelectronic component includes an optoelectronic semiconductor chip that, during intended operation, generates primary radiation coupled out of the semiconductor chip via an emission side of the semiconductor chip; and a first conversion element on the emission side, wherein the first conversion element includes a first matrix material and first phosphor particles in the form of quantum dots, the first phosphor particles are distributed and embedded in the first matrix material, and the first matrix material is formed by a polysiloxane in which an atomic percentage of carbon is smaller than an atomic percentage of oxygen.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: April 4, 2023
    Assignee: OSRAM OLED GmbH
    Inventors: Dajana Durach, Kathy Schmidtke