Abstract: An internally disposed cooling device is provided. The cooling device includes a cooling member and a docket member. The cooling member includes a first cooling unit, a second unit and a cryogenic element. The cryogenic element has a cold surface that contacts the first cooling unit, and a hot surface that contacts the second cooling unit. Since the cold surface of the cryogenic element has a temperature much lower than that of the room temperature, the first cooling unit can thus produce cold and dry air to cool down the electronic apparatus. Meanwhile, the second cooling unit is employed to dissipate heat generated from the cryogenic element.

Abstract: A device for thermal sensing is disclosed based on one thermopile. The cold junctions of the thermopile are coupled thermally to a first channel comprising a first substance while the hot junctions of the thermopile are coupled thermally to a second channel comprising a second substance, the first and the second channel are separated and thermally isolated one from another. The device can further comprise a membrane to thermally and electrically isolate the thermopile and to mechanically support the thermopile. Particularly a liquid rubber, i.e., ELASTOSIL LR3003/10A, B can be used as a membrane material. Further disclosed is a method for fabricating such a device using micromachining techniques.

Abstract: A Peltier effect cooling device is formed in combination with an electronic device to form a unique thermal and electrical relationship. An electronic device to be cooled is placed in a serial electrical relationship between at least two thermoelectric couples while simultaneously being in thermal contact with a cold side of the cooler arrangement. The same current which produces the thermoelectric effect in the Peltier thermocouples also drives the electronic device. A balanced effect results as a higher driving current through the electronic device to causes greater heating, it is offset by the added cooling due to a greater current in the thermocouples. In addition, a unique spatial arrangement provides improved heat distribution and transfer to a heat sink. Due to the unique shapes of Peltier elements, heat is pulled radially from a heat generating source and distributed at a peripheral region.

Abstract: A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit cooling. The three-dimensional integrated circuit includes two or more electrically connected integrated circuits, separated by a cooling channel.

Abstract: A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation plate is provided below an insulated substrate to which the first and second electronic devices are mounted. The second electronic device is cooled by a heat radiation path which extends through the insulated substrate and the heat radiation plate and a heat radiation path which extends through the second electronic device and the electrode to the heat radiation plate. The first and the second electronic device have substantially the same temperature due to heat radiation through the heat leveling plate. As a result, cooling effect of the electronic devices can be enhanced.

Abstract: An optical module includes a package; an optical device housed in the package, and having a temperature-dependent characteristic; a thermo-module connected to the optical device to control its temperature and configured to heat or cool the optical device when supplied with a first electric current in one direction or a second electric current in a direction opposite to the first electric current, respectively; and a heating element disposed close to the optical device and configured to heat the optical device when supplied with an electric current.