Abstract: Various technologies described herein pertain to a heat spreader for an autonomous vehicle computing device. The heat spreader includes a top surface, a bottom surface, and a side surface. The top surface of the heat spreader is thermally conductive. The top surface of the heat spreader includes a section that is sized and shaped to align with a heat generating component (e.g., on a printed circuit board assembly). The top surface of the heat spreader is configured to receive heat from the heat generating component. The bottom surface of the heat spreader includes externally integrated fins. The heat spreader is configured to dissipate the heat from the heat generating component such that the heat from the heat generating component flows from the top surface to the externally integrated fins on the bottom surface.

Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); a first connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111); and a second connection part (140) that is provided on a main surface of the interposer (112) where the first connection part (130) is arranged and is connected to a cooling plate (115).

Abstract: An apparatus that includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.

Abstract: A power supply apparatus includes a transformer including primary and secondary coils, a heatsink that radiates heat, and a substrate supporting the heatsink and including primary and secondary circuits. The transformer outputs a voltage to the secondary coil according to a voltage input to the primary coil. The heatsink includes a protruding portion protruding from a position where the heatsink is in contact with the substrate in a direction protruding from a surface of the substrate. The heatsink further includes an extending portion extending from part of the protruding portion to an area of the secondary circuit of the transformer, in a state spaced apart from the substrate. The extending portion enters the area of the secondary circuit when viewed in a direction perpendicular to the surface of the substrate. A distance between the extending portion and the surface of the substrate is longer than at least 1 millimeter (mm).

Abstract: A power semiconductor device includes: a power semiconductor element; a control circuit that controls the power semiconductor element; a control substrate having the control circuit mounted thereon; a lid arranged to overlap with at least a portion of the control substrate in a first direction; and at least one external connection terminal having a first portion connected with the control substrate, a second portion to be connected with an external apparatus, and a third portion located between the first portion and the second portion and fixed to the lid, the first portion being constituted as a press-fit portion.

Abstract: The present disclosure relates to a semiconductor package that may include a substrate, at least one die coupled to the substrate, and a stiffener coupled to the substrate, wherein the stiffener may include a stiffener frame, wherein the stiffener frame at least partially surrounds the at least one die. The stiffener may include at least one resilient member extending from the stiffener frame towards the at least one die, and the at least one resilient member may include a distal end that extends at a height above the substrate.

Abstract: In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.

Abstract: A securing arrangement for securing at least one component to an appliance is provided. The at least one component is arranged on a receiving region of the appliance. The securing arrangement comprises a securing element configured for locking connection of the at least one component to the appliance. The securing element comprises a plate and has weakened regions and deformation zones between at least one peripheral, unweakened receiving region and at least one pressure and centering region resting on a surface of the component. The securing arrangement further comprises a plurality of spacers extending from the receiving region of the appliance to below the height of the surface of the at least one component. The at least one unweakened receiving region of the securing element is configured to be braced against the spacers.

Abstract: An electronic device includes an outer case, a heat generating component and a heat dissipating module. The heat generating component is disposed inside the outer case. The heat dissipating module is located between the outer case and the heat generating component and includes a heat conducting assembly including a first heat conducting portion fixed on the outer case and connected to the outer case and a second heat conducting portion connected to the first heat conducting portion and for abutting against the heat generating component. The second heat conducting portion is movable relative to the outer case for moving toward or away from the outer case. The heat conducting assembly is resiliently deformed to apply a force on the heat generating component in a contacting manner when the heat generating component pushes the second heat conducting portion of the heat conducting assembly to move toward the outer case.

Abstract: An electrical assembly includes a system board and a power board closely arranged with each other in a parallel relation. An electronic package and a system connector are mounted upon an upper surface of the system board. A power connector and a set of connector units are mounted on an undersurface of the power board. Another set of connector units are formed on an upper surface of the electronic package. A heat sink is positioned upon the power board and contacts the electronic package via a center opening in the power board. After assembled, the power supply is provide through connection between the two sets of the connector units and that between the system connector and the power connector.

Abstract: A test socket unit for electrically connecting a test object and a test circuit device. The test socket unit includes: a plurality of support locking pins configured to be stationarily installed on the surface of the test substrate; a socket main body configured to support a plurality of probes for signal transmission; a floating plate configured to include a pin guide hole in which the support locking pin is inserted; an elastic member configured to be interposed in between the socket main body and the floating plate; and at least one locking member configured to include a locking portion engaged with the locking engaging portion and prevented from separating upward by the locking stopper.

Abstract: A wave absorbing heat dissipation structure adapted to absorb electromagnetic waves of an electronic component and dissipate heat energy of the electronic component. The wave absorbing heat dissipation structure includes a wave absorbing heat dissipation layer and a metal film. The wave absorbing heat dissipation layer is provided at an electronic device, and has a first surface and a second surface opposite to each other, wherein the first surface covers the electronic component. The metal film covers the second surface. The wave absorbing heat dissipation layer is adapted to absorb electromagnetic waves and transmit heat energy. The metal film is adapted to reflect electromagnetic waves and dissipate heat energy. The wave absorbing heat dissipation structure is capable of alleviating interference of electromagnetic waves on an electronic component and enhancing heat dissipation of an electronic component.

Abstract: Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.

Abstract: Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.

Abstract: An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a torque applicator configured to apply an axial force. A bearing structure positioned between the torque applicator and a packaged device may be used to transfer a force (e.g., an axial force) applied using the torque applicator to the packaged device.

Abstract: A chip package may include: a first die; at least one second die disposed over the first die; and a lid disposed over lateral portions of the first die and at least partially surrounding the at least one second die, the lid having inclined sidewalls spaced apart from and facing the at least one second die.

Abstract: An electronic assembly for an inverter comprises a substrate having a dielectric layer and metallic circuit traces. A plurality of terminals are arranged for connection to a direct current source. A first semiconductor and a second semiconductor are coupled together between the terminals of the direct current source. A primary metallic island (e.g., strip) is located in a primary zone between the first semiconductor and the second semiconductor. The primary metallic island has a greater height or thickness than the metallic circuit traces. The primary metallic island provides a heat sink to radiate heat.

Abstract: A facing surface of a refrigerant jacket includes a contact portion which contacts a device main body, a first recessed portion which faces a first lead section and secures an insulation distance to the first lead section due to being positioned further away from a power device than the contact portion, and a second recessed portion which faces the second lead section and secures an insulation distance to the second lead section due to being positioned further away from the power device than the contact portion.

Abstract: A semiconductor module arrangement includes a semiconductor module having a top side, an underside opposite the top side, and a plurality of electrical connection contacts formed at the top side. The semiconductor module arrangement additionally includes a printed circuit board, a heat sink having a mounting side, and one or a plurality of fixing elements for fixing the printed circuit board to the heat sink. Either a multiplicity of projections are formed at the underside of the semiconductor module and a multiplicity of receiving regions for receiving the projections are formed at the mounting side of the heat sink, or a multiplicity of projections are formed at the mounting side of the heat sink and a multiplicity of receiving regions for receiving the projections are formed at the underside of the semiconductor module. In any case, each of the projections extends into one of the receiving regions.

Abstract: According to one embodiment, the base plate includes first and a second faces that are opposed to each other; the second face has a contoured rear surface, and the first area is set in the center of the plate. There is a second area with via holes in the peripheral areas of the center part. Also, the thickness of the second area is less than the thickness of the first area.

Abstract: A pressing portion of a fixture is put on a lid of a semiconductor package, and anchor portions on the opposite sides of the pressing portion are opposed to a baseplate. Two screw members are passed individually through opening parts formed spanning the pressing portion and anchor portions and threadedly engage with a heat sink through the baseplate. If the screw members are tightened in this state, the anchor portions are pressed by the baseplate, and the pressing portion presses the lid of the semiconductor package, whereby the baseplate is fixed to the heat sink in pressure contact with it.

Abstract: A method of manufacturing a modular semiconductor subassembly: providing at least one semiconductor subassembly having a modular sidewall element of modular dimensions and a semiconductor substrate base element coupled to the modular sidewall element that has at least one semiconductor element with a layout sized to be accommodated by modular dimensions of the modular sidewall element. If a modular package protective cover is to be used: providing the modular package protective cover configured to accommodate the semiconductor subassembly in accordance with a modular design; securing the semiconductor subassembly in the modular package protective cover to create a modular package assembly; and mounting the modular package assembly to a core, with a base side of the semiconductor substrate base element in contact with the core; otherwise: mounting the at semiconductor subassembly to the core, with the base side of the semiconductor substrate base element in contact with the core.

Abstract: Terminals (2b, 2c) are divided into two along a common boundary, coatings (10, 11) most suitable for two conductive bonding materials (5, 6) to be used are exposed on the terminals (2b, 2c), the most suitable one of the coatings (10, 11) is selected, and the corresponding conductive bonding material (5, 6) is bonded onto the coating. Thus it is possible to improve the reliability of bonding and easily reduce a bonding resistance while suppressing a decrease in the reliability of a semiconductor element 3.

Abstract: Provided is an electronic device whereby it is possible to suppress a decline in heat-dissipating properties. This liquid crystal display device (electronic device) (1) is provided with a semiconductor element (6a, 6b), a substrate (7) to which the semiconductor element is attached, and a chassis (5) disposed in opposition to the substrate and furnished with a rib (11, 12) that protrudes towards the semiconductor element side. The rib includes a contact part (11a, 12a) for contacting the semiconductor element. A pressing member (9) for inducing the semiconductor element into contact with the contact part is furnished at least at a position corresponding to the center part (7c) of the substrate.

Abstract: A semiconductor device includes a semiconductor module that has a joint surface, a first fitting portion and a second fitting portion provided on the joint surface of the semiconductor module, the second fitting portion having a shape different from the first fitting portion; and a radiating fin that has a joint surface, a third fitting portion and a fourth fitting portion provided on the joint surface of the radiating fin, the fourth fitting portion having a shape different from the third fitting portion. The semiconductor module is bonded to the radiating fin so that the first fitting portion is fitted into the third fitting portion or the third fitting portion is fitted into the first fitting portion, and the second fitting portion is fitted into the fourth fitting portion or the fourth fitting portion is fitted into the second fitting portion.

Abstract: A semiconductor device includes a semiconductor module and a pressing member configured to press the semiconductor module to a heat radiation member. The semiconductor module includes switching elements, conductors, and a molded member. Each of the switching elements is mounted on a corresponding one of the conductors. The molded member covers the switching elements and the conductors. More than three of the switching elements are disposed around the pressing member. The switching elements are disposed in a region in which a pressure generated between the semiconductor module and the heat radiation member by pressing with the pressing member is greater than or equal to a predetermined pressure with which heat generated from the switching elements is releasable from the semiconductor module to the heat radiation member.

Abstract: Provided are a power device package coupled to a heat sink using a bolt and a semiconductor package mold for fabricating the same. The power device package includes: a substrate; at least one power device mounted on the substrate; a mold member sealing the substrate and the power device; and at least one bushing member fixed to the mold member to provide a through hole for a bolt member for coupling a heat sink to the mold member.

Abstract: A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.

Abstract: An organic electroluminescence device which can prevent the deterioration thereof attributed to moisture by preventing a desiccant from influencing organic electroluminescence elements is provided. The organic electroluminescence device includes: first and second substrates which are arranged to face each other in an opposed manner with a gap therebetween; organic electroluminescence elements which are formed on a first surface of the first substrate which faces the second substrate in an opposed manner; a desiccant which is formed on a second surface of the second substrate which faces the first substrate in an opposed manner; and a resin which is adhered to the first and second surfaces and covers the desiccant and the organic electroluminescence elements.

Abstract: An integrated circuit package system includes a bottom pad with a bottom tie bar, attaching an integrated circuit die over the bottom pad, attaching a top pad with a top tie bar, over the integrated circuit die, and applying an encapsulant wherein the top tie bar integral to the top pad, is exposed on a side of the encapsulant.

Abstract: A package board module wherein a semiconductor chip such as an LSI is mounted on the topside surface of a package board, and a package mounted module wherein the package board is mounted on the motherboard of a large-sized computer or the like. A stiffener for supporting the package board and/or a stiffener for supporting the motherboard each has a bimetal structure wherein a first member and a second member having mutually different thermal expansion coefficients are respectively adhered to each other, so as to cause the stiffeners to warp in harmony with the warpage of the package board and the motherboard caused by a temperature change, thereby preventing stress from arising in the solder-bonded portions.

Abstract: One aspect relates to a power semiconductor arrangement includes a power semiconductor module which is mechanically connected to a heat sink. In order to improve the thermal cycling stability of the connection between a baseplate of the module and a circuit carrier connected thereto, recesses are provided in the baseplate. One aspect further relates to a power semiconductor module.

Abstract: A package structure includes a substrate; a die over and flip bonded on the substrate; a heat sink over the die; and one or more spacer separating the heat sink from the substrate.

Abstract: To provide a semiconductor device and a semiconductor module in which breakage of a semiconductor element due to a pressing force given from the outside is prevented. A semiconductor device according to the present invention has a configuration mainly including an island, a semiconductor element mounted on a front surface of the island, a lead that functions as an external connection terminal, and a sealing resin that covers these components in an integrated manner and mechanically supports them. Further, a through-hole is provided so as to penetrate the sealing resin. A front surface of the sealing resin around the through-hole forms a flat part. The front surface of the sealing resin that overlaps the semiconductor element is depressed inward with respect to the flat part to form a depressed part.

Abstract: An integrated circuit (IC) package module includes a carrier, an IC chip, a number of wires, a number of pins, a seal member, and a thermal conductor. The IC chip is attached on a top surface of the carrier. The number of pins is connected to the IC chip via the number of wires. The seal member contains the carrier, the IC chip, and the number of wires. The thermal conductor is located over or located on a top surface of the IC chip. Parts of each of the number of pins and the thermal conductor are projected out of the seal member.

Abstract: A system for cooling a semiconductor includes a heat sink in thermal contact with the semiconductor, a thermal interface material (TIM) layer disposed between the heat sink and the semiconductor, and a picture frame support disposed between a substrate of the semiconductor and the heat sink, wherein the picture frame support encloses at least a portion of the semiconductor in a plane between the substrate and the heat sink, and wherein the picture frame support has a height that is greater than a height of the semiconductor.

Abstract: A power semiconductor module and a method of manufacture thereof includes a lead frame carrying lead having inner and outer lead portions. The outer lead portions, which are connected by soldering to semiconductor chips simultaneously, eliminate the need for using bonding wires. Since no bonding wire is used for connecting the leads and the semiconductor chips, a sufficient current capacity is obtained. The bonding between an insulating circuit board and the semiconductor chips and the bonding between the semiconductor chips and the leads can be made simultaneously in a single step of reflow-soldering. As a result, the mounting time can be shortened and the power semiconductor module can be manufactured more efficiently.

Abstract: A chip package for a computer system includes a substrate having a first region and a second region on a first surface, at least one die coupled to the first region on the first surface of the substrate and a main logic board coupled to the second region on the first surface of the substrate. By coupling the die and the main logic board on the first surface of the substrate, an overall thickness of the chip package is reduced.

Abstract: An electronic component has a portion adjacent to a surface of a base to which elements are mounted is immersed into a liquid resin or semi-solid resin such that an element surface of the base to which the elements are mounted is not immersed and in which the resin is then hardened. This causes a gap to be disposed between the hardened resin and the element surface of the base, such that a cover supported by some of the elements is formed.

Abstract: A semiconductor chip 36 is mounted on a package substrate 30 with its circuit side facing to a board 38. Heat is dissipated from an upper side of the semiconductor chip 36 opposite to the circuit side. A sealing resin 32 seals around the periphery of the semiconductor chip 36 so that the upper side of the semiconductor chip 36 is exposed to atmosphere. A fixing member 34 is buried in the sealing resin 32 so that a hook 40 formed on the tip of the fixing member 34 extends above the upper side of the semiconductor chip 36. A spreader 10 dissipates heat emitted from the semiconductor chip 36. A guiding slot 12 is formed on the side facing to the package substrate 30 of the spreader 10. The hooks 40 of the fixing members 34 are inserted into the guiding slots 12 respectively, and then the spreader 10 is rotated by predetermined angle against the package substrate 30. Then, the hooks 40 travel along the slots 12.

Abstract: A fastening device for a heat sink includes a one-piece shaft. The shaft includes a head at one end thereof, an engaging section at an opposite end thereof, a connecting section between the head and the engaging section, and a tray extending above the engaging section. A spring surrounds the connecting section between the head and the tray of the shaft. A gasket engages with the connecting section of the shaft and is retained between the spring and the tray of the shaft. In this way the shaft, the spring and the gasket are assembled. The gasket extends a downward, annular sidewall for engaging in the heat sink, by which the fastening device can be stably fixed to the heat sink. A back plate extends a nut toward the shaft for engaging with the engaging section of the shaft.

Abstract: Standard solderless connectors extend from a molded package body supporting at least one high power LED. The package includes a relatively large metal slug extending completely through the package. The LED is mounted over the top surface of the metal slug with an electrically insulating ceramic submount in-between the LED and metal slug. Electrodes on the submount are connected to the package connectors. Solderless clamping means, such as screw openings, are provided on the package for firmly clamping the package on a thermally conductive mounting board. The slug in the package thermally contacts the board to sink heat away from the LED. Fiducial structures (e,g., holes) in the package precisely position the package on corresponding fiducial structures on the board. Other packages are described that do not use a molded body.

Abstract: A heat dissipation device includes a heat sink assembly, a fan holder and two fans mounted on the two sides of the fan holder. The heat sink assembly includes a heat spreader for contacting with a heat-generating electronic component, and a fin assembly thermally connecting with the heat spreader. The fin assembly has a plurality of channels therein. The fan holder includes a top plate mounted on a top of the fin assembly and a pair of vertical baffle walls extending from two opposite ends of the top plate. The baffle walls of the fan holder are located at two lateral ends of the fin assembly and sandwich the fin assembly therebetween. The two fans respectively abut against inlets and outlets of the channels of the fin assembly. An airflow generated by one fan flows through the fin assembly and is sucked by the other fan.

Abstract: An assembly structure of an electronic element and a heat sink is disclosed. An assembly structure of an electronic element and a heat sink comprises a fastening element, an electronic element having a first through hole, and an insulating piece having a second through hole, an insulating element disposed in the first through hole of the electronic element and having a channel therein, and a heat sink. The second through hole is disposed correspondingly to the first through hole of the electronic element, the electronic element and the insulating piece are secured on the heat sink by inserting the fastening element through the channel of the insulating element, so as to insulate the electronic element from the heat sink by the insulating element.

Abstract: A power semiconductor module according to the present invention includes: a planar base plate having a plurality of insulated substrates soldered on the top surface, the insulated substrates each having power semiconductor elements to be cooled mounted thereon; a plurality of radiation fins projecting from the bottom surface side of the base plate; and a peripheral wall projecting from the bottom surface side of the base plate so as to surround the radiation fins, the projecting length of the radiation fins is less than or equal to that of the peripheral wall, and the peripheral wall has end surfaces present in the same plane.

Abstract: Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.

Abstract: An integrated circuit chip mounting structure includes a chip carrier electrically connected to a circuit board with an integrated circuit chip mounted on the chip carrier. In addition, a thermally conductive device is thermally connected to the chip and a set of compressible support members are provided to transmit a portion of an applied compressive load from the thermally conductive device to the chip and chip carrier.

Abstract: In a memory module, a plurality of semiconductor memory packages are arranged and mounted on a module board, and a control semiconductor package is disposed in a central region of the arrangement of the semiconductor memory packages, and mounted on the module board. A control semiconductor radiator thermally connected to the control semiconductor package, and a semiconductor memory radiator thermally connected to the plurality of memory packages are disposed without being thermally connected to each other in relation to a direction in which the semiconductor memory packages are arranged.

Abstract: Provided are a power device package coupled to a heat sink using a bolt and a semiconductor package mold for fabricating the same. The power device package includes: a substrate; at least one power device mounted on the substrate; a mold member sealing the substrate and the power device; and at least one bushing member fixed to the mold member to provide a through hole for a bolt member for coupling a heat sink to the mold member.

Abstract: According to one embodiment, an electronic apparatus is provided with a semiconductor package, a heat receiving plate, and a gap adjusting member. The semiconductor package includes a substrate and a silicon die mounted on the substrate. The heat receiving plate is opposed to the silicon die and thermally connected to the silicon die. The gap adjusting member is disposed between the heat receiving plate and a region of the substrate apart from the silicon die and serves to reduce a gap which exists between the substrate and the heat receiving plate.