Abstract: A device for cooling a processor which comprises a chamber which is bottomless and having a perimeter sealably mounted directly on a surface of a processor; a microgap plate, separate from the chamber, which is installed at a bottom of the chamber and forms a microgap with the surface of a processor; and a lid, separate from the chamber, which is installed onto the chamber to close a top of the chamber, the lid comprising downward projections to urge the microgap plate to the bottom of the chamber during installation. Walls forming the downward projections of the lid form a lining conforming to an inner surface of walls of the chamber, wherein the lid and the downward projections thereof together form a bottomless enclosure that defines an inlet plenum volume for receiving the coolant. The microgap comprises a central inlet through the microgap plate for coolant flow into the microgap.

Abstract: An LED assembly is provided herein. The assembly comprises a thermally conductive housing (201), wherein a portion of said housing is equipped with a plurality of fins (203); an LED (205) disposed in said housing; and a synthetic jet actuator (207) adapted to direct a synthetic jet onto said portion of the housing.