For Device Having Potential Or Surface Barrier (epo) Patents (Class 257/E31.118)
  • Patent number: 10388841
    Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: August 20, 2019
    Assignee: LG Innotek Co., Ltd.
    Inventors: Byung Mok Kim, Hiroshi Kodaira, Su Jung Jung, Bo Hee Kang, Young Jin No, Yuichiro Tanda, Satoshi Ozeki
  • Patent number: 10243013
    Abstract: An imaging apparatus includes a substrate including an imaging element, one or two attachment portions that attach the substrate by screwing and are capable of inclining a board surface of the substrate, by screwing in a screw, relative to a plane perpendicular to an optical axis of an optical system that forms an optical image on the imaging element; and one or more supports configured to abut the substrate from an opposite direction to a screwing direction of the attachment portion at any position, on the substrate, that rotates in the screwing direction of the attachment portion when the board surface is inclined by screwing. As a result, an imaging apparatus that allows an imaging element to be installed at a desired position and orientation while reducing the size of the substrate is provided.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: March 26, 2019
    Assignee: KYOCERA Corporation
    Inventors: Takatoshi Nakata, Makoto Suzuki, Takahiro Okada
  • Patent number: 10171715
    Abstract: A camera module includes a circuit board, a camera device and an image processing chip. An image sensation chip of the camera device is directly integrated with the circuit board by means of chip-on-board (COB) manufacturing process to minify the total volume of the camera module, whereby the camera module can be disposed in a narrow space.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: January 1, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Wei-Chuan Wang, Xin-Lian Cheng, Ting-Yu Lin, Chun-Mei Zhang, Chin-Lian Yeh
  • Patent number: 9923020
    Abstract: Embodiments of the present invention provide a camera module and a method of manufacturing the same, the camera module comprising a sensor assembly, at least one semiconductor substrate, and a molding compound; wherein the sensor assembly comprises a semiconductor die, a sensor circuit disposed on the top surface of the semiconductor die, and a transparent cover coupled to the semiconductor die over the top surface of the semiconductor die; wherein each semiconductor substrate is disposed around the sensor assembly in a horizontal direction; and wherein the molding compound is filled between each semiconductor substrate and the sensor assembly.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: March 20, 2018
    Assignee: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.
    Inventor: Jing-En Luan
  • Patent number: 9526171
    Abstract: A package structure is provided, which includes: a substrate having opposite first and second surfaces; at least an electronic element disposed on the first surface of the substrate; and an encapsulant formed on the first surface of the substrate for encapsulating the electronic element. The encapsulant has a non-rectangular shape so as to reduce an ineffective space in the encapsulant.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: December 20, 2016
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chi-Liang Shih, Hsin-Lung Chung, Te-Fang Chu, Hao-Ju Fang, Kuang-Neng Chung
  • Patent number: 9419034
    Abstract: An image sensor module includes a substrate, an image sensor mounted on the substrate, a holder position on the substrate, a lens barrel for holding a lens module and at least one spring. The spring is positioned between the holder and the lens barrel, and the spring exerts forces on the holder and the lens barrel; and the lens barrel has at least one hole, and a screw penetrates through the hole and is screwed into the holder.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: August 16, 2016
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventor: Yu-Feng Yen
  • Patent number: 9040352
    Abstract: A semiconductor device package having a cavity formed using film-assisted molding techniques is provided. Through the use of such techniques the cavity can be formed in specific locations in the molded package, such as on top of a device die mounted on the package substrate or a lead frame. In order to overcome cavity wall angular limitations introduced by conformability issues associated with film-assisted molding, a gel reservoir feature is formed so that gel used to protect components in the cavity does not come in contact with a lid covering the cavity or the junction between the lid and the package attachment region. The gel reservoir is used in conjunction with a formed level setting feature that controls the height of gel in the cavity. Benefits include decreased volume of the cavity, thereby decreasing an amount of gel-fill needed and thus reducing production cost of the package.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: May 26, 2015
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Shun Meen Kuo, Li Li
  • Patent number: 8778705
    Abstract: A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encapsulant is disposed within an aperture of the receptacle on the elastomeric encapsulant.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: July 15, 2014
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventor: Tong Fatt Chew
  • Patent number: 8749074
    Abstract: Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having an interposer including at least one topological feature, such as a depression in a surface of the interposer, a die coupled to the surface of the interposer, and an encapsulant material formed over the die and the interposer, and disposed in the at least one depression to resist movement of the encapsulant material relative to the interposer. Other embodiments may be described and claimed.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: June 10, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Steven Eskildsen, Aravind Ramamoorthy
  • Patent number: 8624344
    Abstract: A solid state imaging device according to an embodiment includes a light sensing part which conducts photoelectric conversion on incident light. The solid state imaging device includes a ferroelectric layer including an organic compound on a surface of the light sensing part on which light is incident. The solid state imaging device includes a transparent electrode formed on the ferroelectric layer.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: January 7, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yusuke Arayashiki, Kazuaki Nakajima
  • Patent number: 8519411
    Abstract: A semiconductor light emitting device includes an active layer, an electrode formed above the active layer, a current spreading layer formed between the active layer and the electrode, having n-type conductivity, having a larger bandgap energy than the active layer, and spreading electrons injected from the electrode in the plane of the active layer, and a surface processed layer formed on the current spreading layer, having a larger bandgap energy than the active layer, and having an uneven surface region with a large number of concave-convex structures. The electrode is not formed on the uneven surface region. The conduction band edge energy from the Fermi level of the surface processed layer is higher than that of the current spreading layer.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: August 27, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yukie Nishikawa, Shinji Nunotani
  • Publication number: 20130139868
    Abstract: This invention relates to an encapsulation structure comprising a luminescent wavelength conversion material for at least one solar cell or photovoltaic device which acts to enhance the solar harvesting efficiency of the solar cell device. The luminescent wavelength conversion material comprises at least one chromophore and an optically transparent polymer matrix. Application of the encapsulation structure, as disclosed herein, to solar harvesting devices, including solar cells, solar panels, and photovoltaic devices, improves the solar harvesting efficiency of the device by widening the spectrum of incoming sunlight that can be effectively converted into electricity by the device.
    Type: Application
    Filed: September 28, 2012
    Publication date: June 6, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventor: NITTO DENKO CORPORATION
  • Patent number: 8450847
    Abstract: A method for producing an optoelectronic device includes providing a carrier, applying at least one first metal layer on the carrier, providing at least one optical component, applying at least one second metal layer on the at least one optical component, and mechanically connecting the carrier to the at least one optical component by the at least one first and the at least one second metal layer, wherein the connecting includes friction welding or is friction welding.
    Type: Grant
    Filed: November 2, 2009
    Date of Patent: May 28, 2013
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Patrick Ninz, Herbert Brunner
  • Publication number: 20130118557
    Abstract: A photovoltaic module comprising a first substrate, a backing sheet, a solar cell or a plurality of solar cells, each solar cell positioned between the substrate and the backing sheet, at least one thin electrically conducting board positioned between the substrate and the backing sheet and preferably where the module has at least one electronic device, preferably positioned on the electrically conducting board, that provides the module with a desired function or capability.
    Type: Application
    Filed: November 11, 2011
    Publication date: May 16, 2013
    Applicant: BP Corporation North America Inc.
    Inventors: Jean P. Posbic, Dinesh S. Amin
  • Publication number: 20120329196
    Abstract: A solar cell packaging process is disclosed. At first, a solar cell is provided, and at least one liquid packaging material is spray-coated onto a surface of the solar cell by a spray-coating process. A liquid packaging material is directly spread on the surface of the solar cell in at least one covering process. Then, the liquid packaging material is hardened in curing process. Therefore, a packaging layer is formed on the surface of the solar cell to finish the solar cell packaging. By implementing the above packaging process, it ensures there is no over stress applied on the solar cell in the packaging process to avoid generating broken pieces for significantly improving the yield.
    Type: Application
    Filed: June 22, 2011
    Publication date: December 27, 2012
    Inventor: Chien-Chih HSU
  • Publication number: 20120301992
    Abstract: It is to provide an electrolyte solution for a dye sensitized solar cell that does not generate a gas, can be used in a wide temperature range, and is excellent in durability. The electrolyte solution contains a chain sulfone compound represented by formula (1) as a solvent. (In the formula, R1 and R2 each independently represent an alkyl group having from 1 to 12 carbon atoms, which may be partially substituted by a halogen, an alkoxy group or an aromatic ring, an alkoxy group, or a phenyl group.
    Type: Application
    Filed: January 25, 2011
    Publication date: November 29, 2012
    Applicants: SUMITOMO SEIKA CHEMICALS CO., LTD., Japan Carlit Co., Ltd.
    Inventors: Kazumi Chiba, Youji Yamaguchi, Takehiro Hiyama, Ichiro Fuseya, Kazato Yanada
  • Publication number: 20120217535
    Abstract: The invention relates to a method of encapsulating a flexible optoelectronic multi-layered structure (6) provided on a polymer substrate (2) comprising the steps of providing the flexible optoelectronic multi-layered structure with one or both a bottom encapsulation stack (B) and a top encapsulation stack (T), wherein the bottom encapsulation stack and the top encapsulation layer comprise a first inorganic layer (4a, 8a) separated from a second inorganic layer (4b, 8b) by a substantially continuous getter layer (5, 8) comprising a metal oxide, the first and the second inorganic layers having an intrinsic water vapour transmission of 10?5 g·m?2·day?1 or less.
    Type: Application
    Filed: July 9, 2010
    Publication date: August 30, 2012
    Applicant: Nederlandse Organisatie voor toegepase- Natuurwetenschappelijk onderzoek TNO
    Inventors: Peter Van de Weijer, Antonius Maria Bernardus Van Mol, Cristina Tanase
  • Patent number: 8232129
    Abstract: A method of constructing a solar cell panel is disclosed that includes providing a solar cell that has a front side and a back side, where the front side faces the sun during normal operation, heating a thermoplastic polyimide to at least its reflow temperature, flowing the thermoplastic polyimide onto the back side of the solar cell while heated to at least its reflow temperature, and cooling the thermoplastic polyimide to a temperature below its reflow temperature to bond the thermoplastic polyimide directly to the solar cell. The direct bonding of the thermoplastic polyimide to the solar cell is accomplished without an adhesive such as RTV adhesives. The method may also include bonding a substrate directly to the thermoplastic polyimide opposite the solar cell.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: July 31, 2012
    Assignee: The Boeing Company
    Inventor: Andrew Streett
  • Patent number: 8148803
    Abstract: A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
    Type: Grant
    Filed: February 15, 2002
    Date of Patent: April 3, 2012
    Assignee: Micron Technology, Inc.
    Inventors: Chad A. Cobbley, Cary J. Baerlocher
  • Publication number: 20120056291
    Abstract: According to one embodiment, an imaging device includes a substrate, a photodetecting portion, a circuit portion and a through interconnect. The substrate has a first major surface, a second major surface on a side opposite to the first major surface, a recess portion provided on the first major surface and retreated in a first direction going from the first major surface to the second major surface, and a through hole communicating with the first major surface and the second major surface and extending in the first direction. The photodetecting portion is provided above the recess portion and away from the substrate. The circuit portion is electrically connected to the photodetecting portion and provided on the first major surface. The through interconnect is electrically connected to the circuit portion and provided inside the through hole. The recess portion has a first inclined surface. The through hole has a second inclined surface.
    Type: Application
    Filed: March 18, 2011
    Publication date: March 8, 2012
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Kazuhiro Suzuki, Risako Ueno, Honam Kwon, Koichi Ishii, Hideyuki Funaki
  • Publication number: 20110308578
    Abstract: A solar cell module and a method for manufacturing the same are discussed. The solar cell module includes a plurality of solar cells, a front substrate a front substrate positioned at first surfaces of the plurality of solar cells, a back substrate positioned at second surfaces of the plurality of solar cells, a front protective member positioned between the front substrate and the plurality of solar cells, the front protective member including a first silicone resin, a back protective member positioned between the back substrate and the plurality of solar cells, the back protective member including a second silicone resin, and a fiber material disposed between the front substrate and the back substrate.
    Type: Application
    Filed: August 30, 2011
    Publication date: December 22, 2011
    Inventors: Jongkyoung Hong, Jemin Yu, Taeyoon Kim, Eunjoo Lee, Seiyoung Mun, Youngho Choe, Taeki Woo
  • Publication number: 20110241146
    Abstract: The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof.
    Type: Application
    Filed: January 21, 2011
    Publication date: October 6, 2011
    Applicant: Kingpak Technology Inc.
    Inventors: Hsiu-Wen Tu, Chung-Hsien Hsin, Han-Hsing Chen, Ming-Hui Chen, Ren-Long Kuo, Chih-Cheng Hsu, Young-Houng Shiao, Tsao-Pin Chen
  • Publication number: 20110241147
    Abstract: The present invention discloses a wafer level image sensor packaging structure and a manufacturing method of the same. The manufacturing method includes the following steps: providing a silicon wafer, dicing the silicon wafer, providing a plurality of transparent lids, fabricating a plurality of semi-finished products, performing a packaging process, mounting solder balls, and cutting an encapsulant between the semi-finished products. The manufacturing method of the invention has the advantage of being straightforward, uncomplicated, and cost-saving. Thus, the wafer level image sensor package structure is lightweight, thin, and compact. To prevent the image sensor chip from cracking on impact during handling, the encapsulant will be arranged on the lateral sides of the semi-finished products during the packaging process.
    Type: Application
    Filed: January 25, 2011
    Publication date: October 6, 2011
    Applicant: Kingpak Technology Inc.
    Inventors: Hsiu-Wen Tu, Chung-Hsien Hsin, Han-Hsing Chen, Ming-Hui Chen, Ren-Long Kuo, Chih-Cheng Hsu, Young-Houng Shiao, Tsao-Pin Chen
  • Publication number: 20110224487
    Abstract: Size reduction of an image pickup module is promoted, and reliability of electric connection and electric noise resistance are improved by decreasing the numbers of components and connection spots. The problems are solved by providing an image pickup module including a solid-state image pickup element chip having an image pickup surface, a cover glass that covers the image pickup surface, and a wiring board on which the solid-state image pickup element chip is mounted, in which the solid-state image pickup element chip and the wiring board have an overlap structure in which end portions thereof are overlapped with each other, and a first electrode portion formed on the end portion of the solid-state image pickup element chip and a second electrode portion formed on the end portion of the wiring board are electrically connected through a bump.
    Type: Application
    Filed: January 25, 2011
    Publication date: September 15, 2011
    Applicant: FUJIFILM CORPORATION
    Inventor: Teppei OGAWA
  • Patent number: 7915717
    Abstract: A package for an image sensor includes a lead frame having a first surface and a second surface opposite the first surface; an image sensor mounted on the first surface of the lead frame; an optical cover spanning the first surface; and a plastic, optically transparent window in the optical cover and aligned with the image sensor.
    Type: Grant
    Filed: August 18, 2008
    Date of Patent: March 29, 2011
    Assignee: Eastman Kodak Company
    Inventor: Carlos F. Rezende
  • Patent number: 7897422
    Abstract: A new structure of a semiconductor optical device and a method to produce the device are disclosed. One embodiment of the optical device of the invention provides a blocking region including, from the side close to the mesa, a p-type first layer and a p-type second layer. The first layer is co-doped with an n-type impurity and a p-type impurity. The doping concentration of the p-type impurity in the first layer is smaller than that in the second layer, so, the first layer performs a function of a buffer layer for the Zn diffusion from the second layer to the active layer in the mesa structure.
    Type: Grant
    Filed: April 22, 2008
    Date of Patent: March 1, 2011
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventor: Kenji Hiratsuka
  • Publication number: 20110036400
    Abstract: A method for manufacturing a photovoltaic module may include coating a portion of a substrate with a coating material; depositing a barrier material layer on a least a portion of an edge of the substrate; and curing the barrier material layer, where the barrier material layer is effective as a barrier to the coating material.
    Type: Application
    Filed: August 17, 2010
    Publication date: February 17, 2011
    Applicant: First Solar, Inc.
    Inventors: Stephen P. Murphy, Kevin V. Crots
  • Patent number: 7768086
    Abstract: The present invention is directed to provide a back illuminated photodetector having a sufficiently small package as well as being capable of suppressing the scattering of to-be-detected light. A back illuminated photodiode 1 comprises an N-type semiconductor substrate 10, a P+-type impurity semiconductor region 11, a recessed portion 12, a coating layer 13, and a window plate 14. In the surface layer on the upper surface S1 side of the N-type semiconductor substrate 10 is formed the P+-type impurity semiconductor region 11. In the rear surface S2 of the N-type semiconductor substrate 10 and in an area opposite the P+-type impurity semiconductor region 11 is formed the recessed portion 12 that functions as an incident part for to-be-detected light. Also, the coating layer 13 having a substantially flat surface is provided on the rear surface S2 of the N-type semiconductor substrate 10. Further, the window plate 14 is provided on the coating layer 13.
    Type: Grant
    Filed: July 22, 2004
    Date of Patent: August 3, 2010
    Assignee: Hamamatsu Photonics K.K.
    Inventor: Katsumi Shibayama
  • Patent number: 7759754
    Abstract: An economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules is provided. A manufactured item in accordance with this technology includes a substrate with an optoelectronic component contacted in a planar manner.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: July 20, 2010
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Ewald Gunther, Jorg-Erich Sorg, Karl Weidner, Jorg Zapf
  • Patent number: 7723741
    Abstract: Methods of packaging microelectronic imagers and packaged microelectronic imagers. An embodiment of such a method can include providing an imager workpiece having a plurality of imager dies arranged in a die pattern and providing a cover substrate through which a desired radiation can propagate. The imager dies include image sensors and integrated circuitry coupled to the image sensors. The method further includes providing a spacer having a web that includes an adhesive and has openings arranged to be aligned with the image sensors. For example, the web can be a film having an adhesive coating, or the web itself can be a layer of adhesive. The method continues by assembling the imager workpiece with the cover substrate such that (a) the spacer is between the imager workpiece and the cover substrate, and (b) the openings are aligned with the image sensors. The attached web is not cured after the imager workpiece and the cover substrate have both been adhered to the web.
    Type: Grant
    Filed: June 13, 2006
    Date of Patent: May 25, 2010
    Assignee: Aptina Imaging Corporation
    Inventors: Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree, Rickie C. Lake
  • Patent number: 7707712
    Abstract: Provided is an apparatus for assembling a camera module comprising a support frame that is formed in a rectangular shape and has a jig horizontally connected to an upper end thereof; a plurality of stages that are vertically stacked and installed in the support frame and adjust a printed circuit board (PCB) in three-axis directions; a board holder that is formed to extend from one end of the uppermost stage and has the PCB mounted on the extending end thereof; and a jig assembly that is disposed on an opening of the jig and has a barrel-integrated housing mounted on the central portion thereof.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: May 4, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Duck Hun Kim
  • Publication number: 20090200629
    Abstract: A semiconductor device which includes a semiconductor chip formed with a light-reception area, a spacer, and a transparent substrate. The spacer is bonded to the semiconductor chip via a first adhesive and surrounding the light-reception area. The transparent substrate is bonded to the spacer via a second adhesive and disposed above the light-reception area. A first projection having a predetermined height is formed on a surface of the spacer which is on a side of the semiconductor chip, and the first projection abuts on the semiconductor chip.
    Type: Application
    Filed: February 2, 2009
    Publication date: August 13, 2009
    Applicant: SONY CORPORATION
    Inventors: Hiroshi Asami, Yoshihiro Nabe, Akihiro Morimoto
  • Patent number: 7560790
    Abstract: The present invention provides a back illuminated photodetector having a sufficiently small package as well as being capable of suppressing the scattering of to-be-detected light and method for manufacturing the same. A back illuminated photodiode 1 comprises an N-type semiconductor substrate 10, a P+-type impurity semiconductor region 11, a recessed portion 12, and a window plate 13. In the surface layer on the upper surface S1 side of the N-type semiconductor substrate 10 is formed the P+-type impurity semiconductor region 11. In the rear surface S2 of the N-type semiconductor substrate 10 and in an area opposite the P+-type impurity semiconductor region 11 is formed the recessed portion 12 that functions as an incident part for to-be-detected light. Also, the window plate 13 is bonded to the outer edge portion 14 of the recessed portion 12. The window plate 13 covers the recessed portion 12 and seals the rear surface S2 of the N-type semiconductor substrate 10.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: July 14, 2009
    Assignee: Hamamatsu Photonics K.K.
    Inventor: Katsumi Shibayama
  • Publication number: 20090127544
    Abstract: The invention relates to the production of organic field-effect transistors (OFETs), solar cells or light-emitting diodes (OLEDs) and circuits based thereon on the surface of solvent- and/or temperature-sensitive plastics, e.g. thermoplastic injection-moulded bodies. A protective layer, which comprises a polymer compound, such as polyacrylate, polyphenol, melamine resin or polyester resin, which is applied from an aqueous-alcoholic solution or without solvent to the substrate surface or one of the function-determining layers of the electronic semiconductor component in a low-temperature process at temperatures of less than 100° C. and dried, protects the substrate against undesirable action of solvents and may simultaneously serve as a planarization layer and/or as as electrical insulation layer.
    Type: Application
    Filed: July 26, 2006
    Publication date: May 21, 2009
    Inventors: Mario Schrodner, Karin Schultheis, Hannes Schache
  • Patent number: 7534645
    Abstract: A CMOS type of image sensor module for use in a mobile camera or a PC camera includes an image sensoring semiconductor chip encapsulated in a transparent block of polymeric material on a substrate having a circuit to which the ship is connected. The image sensoring semiconductor chip is disposed on an upper surface of the substrate as spaced vertically from a digital signal processing second semiconductor chip mounted on a lower surface of the substrate. The transparent polymeric encapsulation material constitutes a sealing resin unit. The digital signal processing second semiconductor chip may also be encapsulated by the sealing resin unit. The sealing transfer unit can be formed by injection and/or transfer molding. The forming of the sealing resin unit by a single molding process keeps production costs low.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: May 19, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Kyoung-Sei Choi
  • Publication number: 20090121250
    Abstract: An (Al, Ga, In)N and ZnO direct wafer bonded light emitting diode (LED) combined with a shaped optical element in which the directional light from the ZnO cone or any high refractive index material in contact with the LED surface entering the shaped optical element is extracted to air.
    Type: Application
    Filed: November 20, 2008
    Publication date: May 14, 2009
    Inventors: Steven P. DenBaars, Shuji Nakamura, Hisashi Masui
  • Publication number: 20080254556
    Abstract: A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encapsulant is disposed within an aperture of the receptacle on the elastomeric encapsulant.
    Type: Application
    Filed: June 19, 2008
    Publication date: October 16, 2008
    Applicant: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
    Inventor: Tong F. Chew
  • Patent number: 7423331
    Abstract: A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
    Type: Grant
    Filed: September 2, 2004
    Date of Patent: September 9, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Chad A Cobbley, Cary J Baerlocher
  • Publication number: 20080073740
    Abstract: The present invention is directed to provide a back illuminated photodetector having a sufficiently small package as well as being capable of suppressing the scattering of to-be-detected light. A back illuminated photodiode 1 comprises an N-type semiconductor substrate 10, a P+-type impurity semiconductor region 11, a recessed portion 12, a coating layer 13, and a window plate 14. In the surface layer on the upper surface S1 side of the N-type semiconductor substrate 10 is formed the P+-type impurity semiconductor region 11. In the rear surface S2 of the N-type semiconductor substrate 10 and in an area opposite the P+-type impurity semiconductor region 11 is formed the recessed portion 12 that functions as an incident part for to-be-detected light. Also, the coating layer 13 having a substantially flat surface is provided on the rear surface S2 of the N-type semiconductor substrate 10. Further, the window plate 14 is provided on the coating layer 13.
    Type: Application
    Filed: July 22, 2004
    Publication date: March 27, 2008
    Inventor: Katsumi Shibayama
  • Publication number: 20080061313
    Abstract: A photosensitive chip package includes a substrate, a photosensitive chip bonded on the substrate and having a photo-active zone and a photo-inactive zone surrounding the photo-active zone, a plurality of bonding wires electrically connected with the photosensitive chip and the substrate, and an encapsulant covering the photo-inactive zone of the photosensitive chip, the bonding wires and a part of the substrate and having an opening corresponding to the photo-active zone of the photosensitive chip.
    Type: Application
    Filed: July 3, 2007
    Publication date: March 13, 2008
    Inventor: Tzu-Yin YEN
  • Patent number: 7274096
    Abstract: A light transmissive cover for a device comprising: a cover member of light transmissive material; and a junction member joined to the cover member, the junction member being a member used to be joined to the body of the device and having a light interrupting film on the inner surface thereof. A device provided with a light transmissive cover, the device being provided with a cover member of light transmissive material joined to the body of device via a junction member so as to cover at least a part of the device, and having a light interrupting film on the inner surface of the junction member is also disclosed. In addition, methods for manufacturing them disclosed.
    Type: Grant
    Filed: October 21, 2004
    Date of Patent: September 25, 2007
    Assignee: Shinko Electric Industries, Co., Ltd.
    Inventor: Akinori Shiraishi