Abstract: An electronic power connector including at least one contact configured to electrically connect a power supply to a load. The electronic power connector further including an insulating sleeve configured to receive the at least one contact. The insulating sleeve includes a sensor slot located at a first end of the insulating sleeve.

Abstract: A method for producing an electric circuit in which a contact carrier comprising a first contact area and a second contact area is provided. An insulating body is applied to the circuit carrier and at least partially covers the first contact area and the second contact area. The insulating body comprises cut-outs in regions both contact areas. A flowable electrical conducting medium is introduced into the insulating body.

Abstract: A barrier device for an electrical connector is disclosed. In embodiments, the barrier device can comprise a first barrier element interposedly arranged between a substrate and a base assembly of the electrical connector. A second barrier element arranged for mating engagement with an upper surface of the substrate of the electrical connector; the second barrier element comprising a plurality of openings defined by a plurality of protruding structures that are configured and arranged to accommodate electronic components mounted to the upper surface of the substrate. The barrier device is designed such that the collective arrangement and positioning of the first barrier element and the second barrier element relative to substrate forms a thermal protection barrier and damping mechanism around the substrate.

Abstract: The present disclosure is directed to a reconfigurable repeater system. A system may comprise a PCB to which devices are coupled. At least one communication channel may convey communications signals between the devices. At least one receptacle may also be coupled to the PCB and may intersect the at least one communication channel so as to separate the at least one communication channel into sections. Inserting at least one extender module into the at least one receptacle may couple the at least one extender module to the sections of the communication module. The at least one extender module may include at least one conductor to convey communication signals between the sections of the at least one communication channel. Another configuration of the at least one extender module may include a repeater to receive, amplify and transmit communication signals between the sections of the at least one communication channel.

Abstract: A method which comprises arranging a plurality of electronic chips in a plurality of chip accommodation cavities each defined by a respective surface portion of a substrate and a wall delimited by a respective one of a plurality of holes in an electrically conductive frame arranged on the substrate, at least partially encapsulating the electronic chips in the chip accommodation cavities by an encapsulant, and forming electrically conductive contacts for electrically contacting the at least partially encapsulated electronic chips.

Abstract: Provided are a light emitting device package and a lighting system including the light emitting device package. The light emitting device package includes a package body, at least one electrode on the package body, a light emitting device on the package body, a reflective structure around the light emitting device on the package body and a lens on the light emitting device and the electrode.

Abstract: An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package.

Abstract: An ultrasonic flow meter unit, mounted to a fluid passage through which a measurement target fluid flows, comprises a pair of ultrasonic transducers each including a piezoelectric substrate, and an acoustic matching member; a measuring circuit which measures a flow of a target fluid based on time for which an ultrasonic pulse propagates between the pair of ultrasonic transducers; and an insulating damping member unitarily formed to cover at least a portion of each of a portion of each of the pair of ultrasonic transducers, which portion contacts the fluid passage, the piezoelectric substrate, and the measuring circuit.

Abstract: There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step.

Abstract: A mold includes a top portion, and an edge ring having a ring-shape. The edge ring is underlying and connected to edges of the top portion. The edge ring includes air vents. The edge ring further encircles the inner space under the top portion of the mold. A plurality of injection ports is connected to the inner space of the mold. The plurality of injection ports is substantially aligned to a straight line crossing a center of the top portion of the mold. The plurality of injection ports has different sizes.

Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.

Abstract: Provided is a technology with which, when producing a resin molded article, the inside of which is provided with an insert component such as a terminal fitting, it is possible to prevent the insert component from being exposed at an inappropriate position, and to ensure the desired positional accuracy. In an injection molding device, the accuracy of the position of a terminal is improved by allowing a core-back mold to move after a terminal, which is an insert component, has been inserted in a terminal tip holding section of a slide mold. By allowing the core-back mold to move by only a prescribed amount prior to injection molding, a resin wall is formed between the core-back mold and the terminal. The inappropriate exposure and shorting of and the adhesion of foreign substances to, and the like, the terminal can thus be prevented.

Abstract: The invention relates to an assembly for a prefabricated terminal block and to a method for producing a prefabricated terminal block, wherein two pre-moulded parts are held together by an injection-moulded base frame. The pre-moulded parts can be designed to provide electrical contacts for contacting an engine control unit for example, in order to establish electrical connections to the engine control unit. In particular, prefabricated parts for terminal blocks that are flexible with respect to material and colouring can be implemented in this way.

Abstract: An approach is provided for placing and securing a chip package portion in an aligned position during a curing process. The approach involves providing an apparatus having a first reservoir configured to receive a first chip package, a second reservoir, and a third reservoir. The approach also involves placing the first chip package portion into the first reservoir, the second chip package portion into the second reservoir, and the third chip package portion into the third reservoir. The approach further involves causing the first chip package portion to be secured in a first curing position, the second chip package portion to be secured in a second curing position and the third chip package portion to be secured in a third curing position.

Abstract: Device for identifying articles such as animals, comprising a male part and a female part, which male part comprises an arrow-shaped element and which female part is provided with a passage with a front end and a rear end, wherein the arrow-shaped element can be inserted into the passage along the front end, wherein the passage is provided close to the front end with at least one protruding element, and wherein the passage is partly closed close to the rear end by a closing part, wherein the partly closed passage, including the protruding element, are manufactured integrally from a hard material; method for manufacturing such a device.

Abstract: In order for light conductor pins (6) in dead hole channels (5) of a plastic cover not to be melted together at their entire side walls with the cover they are produced through a particular injection molding tool in the same tool as the cover and the tool slide (104) which is a component of the injection molding tool (100) is aligned in the injection molding tool (100) with the dead hole channels (5) and inserted into the dead hole channels. The front plate is integrally molded with the base component before or after the light conductor pins are inserted into the base component. When the integral molding is performed after inserting the light conductor pins (6) the integral molding is also provided e.g. at a face of the inserted light conductor pins (6).

Abstract: An inner diameter of a third stator core is greater than an inner diameter of a second stator core. When a first stator core, the second stator core, and the third stator core are placed in an inner periphery of a coil, a jig is inserted from an inner-periphery opening of a first end side of the third stator core into the third stator core to directly position the first stator core, the second stator core, and the third stator core in a radial direction. Therefore, a side force generated by an axis deviation between the first stator core, the second stator core, and the third stator core can be reduced.

Abstract: In one embodiment, a method comprising rotationally molding a snout of a corn row divider assembly, the snout comprising a double-walled structure; rotationally molding a first conduit into a surface of the double-walled structure, the first conduit extending from an aft end of the snout to a location proximal to the fore end of the snout; attaching a sensor to the snout at a location proximal to the fore end of the snout; inserting a first wire harness into the first conduit, the first wire harness extending between the aft end of the snout and the location proximal to the fore end; and connecting the first wire harness to the sensor.

Abstract: An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal; a ground portion extending from the antenna pattern portion; a connection portion connecting the antenna pattern portion and the ground portion to be arranged in different planes; and a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion may be provided on one side of the radiator frame and the connection terminal portion may be provided on the other side thereof, the radiator frame allowing the antenna pattern portion to be embedded in the electronic device case.

Abstract: A method for injection molding of thermoplastic pole parts utilizes a mold to fix at least one vacuum interrupter and contact terminals during a molding process. At least one injection opening or gate for injection of thermoplastic material is formed into the mold. The mold is applied with multiple injection openings at least along its long axis, for injection of hot thermoplastic material, and the injection openings or gates can be steered in such a way that they inject thermoplastic material simultaneously or with a defined time dependent injection pattern. This process alleviates the issue of a pressure gradient along the long axis of the molded pole part, shortens process times, and achieves a homogenous dissipation of material during the molding process.

Abstract: Methods for forming an insulative body of an implantable medical device connector module assembly employ an injection molding process, whereby first and second shots of insulative material form core and an overlay portions, respectively. In some methods, a panel portion of an electrical component is mounted between opposing surfaces of a mold such that a finger-like portion of the component extends into a cavity of the mold, with a first side thereof touching another surface of the mold and a second, opposite side exposed within the cavity; following first shot injection, the core portion captures the finger-like portion in relatively rigid relation thereto. When two types of connector bores are formed, a color indicator may be engaged with a feature of the core portion that is located in proximity to a connector bore of the first type, and then the overlay portion is formed over the indicator.

Abstract: A circuit board that is to be mounted in a connector socket includes a plurality of electrical connectors located along a side edge of the circuit board. Retention bosses are formed on first and second opposite sides of the circuit board, each of the retention bosses protruding from a surface of the circuit board and extending parallel to and adjacent to the first edge of the circuit board. When the first edge of the circuit board is inserted into a slot of a connector socket, contact surfaces of the first and second retention bosses contact top surfaces of the connector socket to help immobilize the circuit board with respect to the connector socket. Adhesive layers on the contact surfaces of the first and second retention bosses may adhere to the top surfaces of the connector socket to help hold the circuit board immobile with respect to the connector socket.

Abstract: A molded resin body for surface-mounted light-emitting device has cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 ?m to 10 ?m, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMS) under the conditions of a temperature range of ?50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.

Abstract: A battery headlamp assembly that includes a light engine bezel, an adjustable linkage supporting the bezel and including an electrically conductive system terminating at the bezel. Also, a headband assembly supports the adjustable linkage and includes a longitudinal rigid-flex circuit assembly. This assembly has a strip of rigid-flex circuit having two longitudinally opposed ends and including battery contacts on the ends. Also, two networks of electrical components are each supported by and electrically connected together, and to one of the battery contacts, by the strip of rigid-flex circuit, which includes conductive traces connecting both the networks to the electrically conductive system and to each other, to power the bezel from the battery contacts and to permit communications between the networks. In addition, a further electrically conductive element, electrically connects at least one conductive trace of the rigid-flex circuit to the electrically conductive system of the adjustable linkage.

Abstract: A method for forming a cover assembly on an electrical power transmission cable includes: mounting a tubular cover member around the cable such that a portion of the cover member defines a cavity surrounding the cable; providing a flowable electrical stress grading material in the cavity; and applying a vacuum to the cavity to evacuate air from the cavity and compact the electrical stress grading material in the cavity.

Abstract: In a method of manufacturing a semiconductor device, a molding die for molding a resin case for a semiconductor device is prepared such that the molding die has protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position. Each of the plurality of terminals is held to the corresponding protrusions in the molding die, and resin is injected into the molding die to integrally mold the plurality of terminals and the resin case.

Abstract: A semiconductor chip which is mounted on a wiring substrate and which is electrically connected to the wiring substrate is disposed in a sealing apparatus. A sealing resin material made of a thermosetting resin composition is supplied into the sealing apparatus. The sealing resin material contains a solid foreign matter having a cured product of a thermosetting resin, and includes particulates of the thermosetting resin composition pulverized with the solid foreign matter, a granulation powder of the particulates, or a preform of the particulates. The semiconductor chip is resin sealed by using the sealing resin material.

Abstract: A method includes placing a package structure into a mold chase, with top surfaces of device dies in the package structure contacting a release film in the mold chase. A molding compound is injected into an inner space of the mold chase through an injection port, with the injection port on a side of the mold chase. During the injection of the molding compound, a venting step is performed through a first venting port and a second venting port of the mold chase. The first venting port has a first flow rate, and the second port has a second flow rate different from the first flow rate.

Abstract: An integrally-formed single-piece flexible light strip includes a substrate populated with at least one LED light circuit. A clear flexible plastic housing is molded around the LED light circuit to completely encapsulate the light circuit. A flexible electrical cable and contoured strain relief for the electrical cable are also integrally formed as part of the light strip to maintain complete environmental and physical protection and eliminate any non-flexible portions of the light strip such as when a connector is used. The light strip is manufactured in a cost efficient manner, and is impervious to moisture penetration and highly resistant to physical damage, thereby allowing the light strip to be used in a variety of applications and environments. The shape of the illustrated light strip is specially designed for attachment to the round tubing of a bicycle frame.

Abstract: Disclosed is a method of making solar collector assemblies for photovoltaic conversion. The method comprises providing a mold for receiving encapsulant, the mold having serially arranged, alternating peaks and valleys. A respective PV solar cell is placed into each of a series of the valleys such that the light-receiving surfaces of the PV solar cells face upwards. Uncured encapsulant is delivered into the mold and onto the light-receiving surfaces, and from the light-receiving surfaces to a level at least as high as the peaks so as to form, above the light-receiving surfaces, optical concentrators for concentrating light received by the optical concentrators and directing the light to the light-receiving surfaces. The encapsulant is then cured.

Abstract: Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components.

Abstract: The invention relates to a method for encapsulating electrical and/or electronic components in a housing, the components being arranged on a printed circuit or a strip conductor in an assembly. Said assembly is positioned in the housing and is encapsulated with a curing, electrically insulating molding compound. The method according to the invention is characterized by encapsulating preferably in a molding chamber at a pressure below atmospheric pressure and by removing the negative pressure after encapsulation and before curing.

Abstract: The plastic sheet (22), involved in the formation of a plurality of smart cards which respectively include a plurality of electronic units, is formed of a first material (2), having a first hardness or a first Vicat softening temperature, and of a second material (6) having a second hardness lower than the first hardness, respectively a second Vicat softening temperature lower than the first Vicat softening temperature. The second material is located in a plurality of areas of the plastic sheet which are respectively intended to at least partially receive said plurality of electronic units, via penetration of this plurality of electronic units into the second material during fabrication of the plurality of smart cards.

Abstract: This invention relates to electrical devices that are implantable inside an animal, including humans. The invention particularly relates to polyurethane headers mounted on the electrical devices to house electrical contacts. The polyurethane headers are formed by (a) mixing (i) a prepolymer comprising a silicon-containing diol of formula (I) in which R1, R2, R3 and R4 are independently selected from C1-6alkyl; R5 and R6 are independently selected from C1-6alkylene; R7 is C1-6alkylene, O, S or NR in which R is H or C1-6alkyl; and n is 1 to 3 and a diisocyanate; and (ii) a C2-12alkanediol; (b) injecting the mixture of the prepolymer and the C2-12alkanediol into a mold having a cavity shaped to form a header; (c) allowing the mixture to cure and form a polyurethane header within the mold; and (d) releasing the formed polyurethane header from the mold.

Abstract: Disclosed herein, among other things, is a system for constrained layer damping for hearing assistance devices. According to various embodiments, a hollow in-the-ear (ITE) hearing instrument shell is formed. The shell has an air space within a wall of the shell, in various embodiments. A port is created in the wall of the shell. The port is adapted to interface the air space to an area outside the shell, in an embodiment. A viscous fluid is dispensed into the air space via the port, and the viscous fluid is cured within the air space. The cured fluid acts as a constrained layer of mechanical damping within the wall of the ITE shell, reducing audible feedback to a wearer of the ITE.

Abstract: Provided is a method of manufacturing a semiconductor device which includes a semiconductor chip, an insulating board mounted with the semiconductor chip and having a wiring pattern, and a leadframe connected to the wiring pattern, the semiconductor chip, the wiring pattern and the leadframe being partially sealed with a sealing resin, wherein: an epoxy resin composition formed by adding 0.3 to 0.7 mass % of epoxysilane as a silane coupling agent to an epoxy resin is used as the sealing resin; and a copper member made of copper or a copper alloy and having an oxide film formed in the surface with a film thickness in a color indicated by an L* value in the range of 48 to 51, an a* value in the range of 40 to 49 and a b* value in the range of 24 to 40 is used as the leadframe and the wiring pattern.

Abstract: Provided is a light-emitting device package strip that includes a lead frame strip, a plurality of resin molding products that are injection-molded in the lead frame strip, and runner and gate members that are formed between adjacent resin molding products and on end sides of a line of adjacent resin molding products, each runner and gate member having a smaller thickness than a thickness of the resin molding products to facilitate cutting thereof.

Abstract: The present disclosure involves a method and apparatus for attaching two electrical dies by wire bonding and then encasing the assembly in a protective casting that works by arranging two dies into a fixture conducive to wire bonding. Doped epoxy may be immediately dispensed over the assembly to form a near-net-shape protective cover, or Drive Can.

Abstract: The present invention relates to a wearable device (10) wearable by a user for measuring skin conductance of the user (1), the wearable device comprising at least two skin conductance electrodes (12) for contacting skin (2) of the user, and an elastic material portion (14) which surrounds the skin conductance electrodes (12) and forms a material surface (16). The elastic material of the elastic material portion (14) is non-permeable for gaseous and liquid substances. The present invention further relates to a method of manufacturing such a wearable device (10).

Abstract: A method for producing a capacitive contact sensor and a capacitive contact sensor having a carrier plate made of plastic are described. The front surface of the sensor initiates a switching process when contacted, and the rear surface of the sensor has one or more capacitive sensor electrodes disposed thereon and connected via conductors to analysis electronics. The regions on the front surface of the carrier plate opposite the sensor electrodes thereby form contact zones. A plastic film supporting the sensor electrodes and conductors is placed on a first side wall of a cavity of an injection molding tool, wherein the sensor electrodes face the first side wall, and then a polycarbonate forming the carrier plate is injected into the cavity on the side of the plastic film facing away from the sensor electrodes.

Abstract: In one embodiment, a method of fabricating stimulation leads, the method comprises: providing a spool of polymer film; providing a plurality of payout carriers of wires; drawing the polymer film from the spool and the wires from the plurality of payout carriers over a rotating drum, wherein the drum comprises a plurality of grooves over an outer circumferential surface of the drum for directing the wires from the plurality of payout carriers, wherein a distance of each groove from an edge of the drum is varied about the circumference of the drum; bonding the wires to the polymer film while performing the drawing to form an intermediate assembly comprising the polymer film as a carrier with the bonded wires in a repeating pattern along a length of the intermediate assembly.

Abstract: A method of manufacturing a medical electrical lead includes molding a lead body pre-form, stringing an electrode onto the pre-form and overmolding the pre-form with a polymer to form a lead body portion. The pre-form has a proximal end, a distal end and at least one lumen extending between the proximal and distal ends. At least one asymmetric region of the pre-form has a transverse cross-section that has a non-circular outer dimension. The overmolding causes the asymmetric region to become substantially circular.

Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.

Abstract: A connector is fixed in the vicinity of a distal end to which a conductor of a wire harness is exposed. The connector includes a primary molded part and a secondary molded part. The primary molded part is annularly molded by injection molding so as to cover the whole periphery of a part of a coating part in a state separated from the distal end. Also, a stopper is formed in a top part of the primary molded part. The secondary molded part is annularly molded by an injection molding method so as to cover the whole peripheries of a part of the coating part in the vicinity of the distal end and the portion excluding the top part of the primary molded part.

Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces, Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

Abstract: An overmoulded electronic assembly wherein a moulded thermoplastic cover encapsulates and is in direct contact with the electronic components, printed circuit board and an antenna is disclosed. There also a disclosed a method of fabricating an overmoulded electronic assembly using an injection moulding machine and where the thermoplastic cover encapsulates and is in direct contact with the electronic components, printed circuit board and an antenna.

Abstract: A resin molded product for reducing the external force applied to a first element from each electroconductive member due to a pressure of a resin at the time of molding, when each of the electroconductive members and the first element are insert-molded with the resin, and a method for producing the same. A second element fixing the electroconductive members to each other is connected to each of the electroconductive members so as to lie astride each of the electroconductive members. Accordingly, even though a pressure of the resin which flows into a die has been applied to each of the electroconductive members when a resin part that covers each of the electroconductive members and the first element is formed by insert molding, the distortion occurring among each of the electroconductive members is reduced by the second element.

Abstract: The present disclosure is directed to a system and method for forming a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier. The forming includes providing a quantity of molding compound to a molding module based on the total number of the unpackaged dice on the carrier. The providing includes accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium, determining the quantity of molding compound based on the indication of the total number of unpackaged dice on the carrier, and molding the unpackaged dice into the packaged dice using the quantity of molding compound.

Abstract: A method for manufacturing a distal portion of a mapping and/or ablation device with fewer components and manufacturing steps than are required for presently known devices. The method generally includes aligning one or more electrodes and electrode wires within a housing mold, overmolding a biocompatible material over the one or more wires and a portion of each of the one or more electrodes, creating a housing component that integrates a dome component and an insulation component. Alternatively, the method generally includes aligning one or more wires within a housing mold so that at least a portion of each wire protrudes from the mold, overmolding a biocompatible material over the one or more wires, thus creating a housing component that integrates a dome component and insulation component. The protruding wire portions are cleaved off and at least a portion of the housing component is coated with a layer of conductive material.

Abstract: An apparatus for molding a semiconductor device includes an upper mold chase and a lower mold chase. The mold chases are capable of being aligned with each other, forming spaced cavities for receiving a lead frame array that includes semiconductor dies for encapsulation. The cavities are aligned in spaced, vertical columns and gates are provided at the opening of each column of cavities. A molding compound is passed through the gates and flows uninterrupted through each cavity and encapsulates the semiconductor dies.