Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.

Abstract: A method for producing a magnetic field sensor for use in drive train of a motor vehicle includes encapsulating an electrical assembly and an end of a connecting cable via injection molding and integrally extruding a fastening tab. After a first injection step in which the electrical assembly and the connecting cable are encapsulated in a core-type first molded part, a second injection molding step in implemented in which a fastening tab is integrally formed via injection molding on the core-type insertion part in a specifiable longitudinal and/or angular position. The core-like insertion part is held in the injection mold in a longitudinally displaceable and/or rotatable manner.

Abstract: An electronic device case having an antenna pattern embedded therein includes: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion of the radiator is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof; and a case frame covering the one side of the radiator frame on which the antenna pattern portion is provided so that the antenna pattern portion is embedded between the case frame and the radiator frame.

Abstract: A method for sealing a terminal to a hole through a plastic body includes applying a microencapsulated polymer to a portion of the terminal that is to be sealed to the hole, the microencapsulated polymer including a plurality of microcapsules where each microcapsule includes a capsule wall with reactants within the capsule wall. The method also includes surrounding the portion of the terminal with the hole after applying the microencapsulated polymer. The capsule walls are ruptured to release the reactants and seal the terminal to the hole.

Abstract: A method of manufacturing a terminal block for a telecommunication cable is disclosed, which includes: positioning at least one electrical connector in a mold, the at least one electrical connector comprising a first end adapted to receive a first electrical wire and a second end adapted to receive a second electrical wire; connecting at least one insulated electrical wire to the first end of each of the at least one electrical connectors; and injecting a dielectric material by a force of greater than 1 g into the mold containing the at least one electrical connector and the at least one electrical wire, wherein the dielectric material surrounds at least the first end of the electrical connector and the at least one electrical wire.

Abstract: Methods for forming an insulative body of an implantable medical device connector module assembly employ an injection molding process, whereby first and second shots of insulative material form core and an overlay portions, respectively. In some methods, a panel portion of an electrical component is mounted between opposing surfaces of a mold such that a finger-like portion of the component extends into a cavity of the mold, with a first side thereof touching another surface of the mold and a second, opposite side exposed within the cavity; following first shot injection, the core portion captures the finger-like portion in relatively rigid relation thereto. When two types of connector bores are formed, a color indicator may be engaged with a feature of the core portion that is located in proximity to a connector bore of the first type, and then the overlay portion is formed over the indicator.

Abstract: A headset can include a cable structure connecting non-cable components such as jacks and headphones. The cable structure can be constructed using a molding process. Different approaches can be used to ensure that a conductor bundle extending through the cable structure remains centered within the cable structure during the molding process. In some cases, a movable tube can be placed in the mold such that the conductor bundle is retained within the tube. As material is injected into the mold and reaches the tube, the tube can be displaced and progressively removed from the mold. Alternatively, the movable tube can be constructed such that the tube may combine with injected material to form a shell of the cable structure. In some cases, gates from which material is provided in the mold can be positioned and controlled to facilitate the injection of material in the mold while maintaining the centered position of the conductor bundle.

Abstract: The invention relates to a sensor system for implantation into a body of a living being, comprising a measuring unit for measuring parameters of the body and generating corresponding measurement signals, a transmitting unit for transmitting signals using the measurement signals, a control and analysis unit which is connected to the measuring unit and the transmitting unit in order to process and prepare the measurement signals and control the transmitting unit for transmitting the transmitting signals, an energy storing unit for supplying energy to the units, and an outer casing that at least partly surrounds the measuring unit, the transmitting unit, the analysis unit, and the energy storing unit.

Abstract: A housing for an optoelectronic component comprises a housing body and first and second electrical terminal strips. The first and second terminal strips extend in part inside the housing body and are guided out of the housing body at a first side face. Outside the housing body the two terminal strips are bent in such a way that they comprise a first portion extending at an angle to the first side face, and a second portion (11d, 12d) extending along and spaced from the first side face. A method for producing such a housing is also described.

Abstract: A printed circuit board supporter includes a top surface, a bottom surface and a central portion. The top surface enables location of a printed circuit board. The bottom surface enables the force from an injection mold to be distributed across the bottom of the printed circuit board. The central portion of the printed circuit board supporter contains force spreading columns which pass between the top surface of the printed circuit board supporter and the bottom surface of the printed circuit board supporter.

Abstract: Plug connections on radar sensors include plug pins which are inserted into plastic. The plastic that surrounds the plug pins is at least partially provided with a granulate that absorbs radar waves, such that the electrical impedance of the plastic has a high value in low-frequency range, and the plastic comprises a characteristic which absorbs radar waves in a region of higher-frequency radar waves. The plug pins are surrounded by a thin layer of plastic without radar-absorbent granulate, and a remainder of an area surrounding the plug pins includes the plastic with the granulate which absorbs radar waves.

Abstract: One embodiment of a molded shield can include a cavity to conform to and receive an electrical component, a slit to conform to and receive a metal frame and a metal layer coupled to the top and lateral sides of the molded shield. In one embodiment, the molded shield can be formed from silicon and can include material to enhance electrical conductivity. The molded shield can couple to the metal frame which in turn can be coupled to ground with the resulting configuration acting to reduce electrical emissions. The molded shield can transfer heat away from the electrical component through conduction.

Abstract: Techniques for component protective overmolding using protective external coatings include selectively applying a protective material substantially over one or more elements coupled to a framework configured to be worn, the elements including at least a sensor, and forming one or more moldings substantially over a subset or all of the framework, the protective material and the elements, after the protective material has been selectively applied, at least one of the one or more moldings having a protective property.

Abstract: A mold includes a top portion, and an edge ring having a ring-shape. The edge ring is underlying and connected to edges of the top portion. The edge ring includes air vents. The edge ring further encircles the inner space under the top portion of the mold. A plurality of injection ports is connected to the inner space of the mold. The plurality of injection ports is substantially aligned to a straight line crossing a center of the top portion of the mold. The plurality of injection ports has different sizes.

Abstract: Components and methods for forming such components with mechanically-bonded plastic are provided. A representative method includes: providing a metal chassis, the chassis having an opening extending through; placing the chassis in a mold; flowing plastic into the mold such that the plastic flows into the opening, the plastic being mechanically bonded to the metal of the chassis to form an integrated metal and plastic component; and removing the integrated metal and plastic component from the mold.

Abstract: The invention relates to a device for producing a sealed electrical connection through an engine block crankcase wall in order to connect a sensor or actuating unit contained in the engine block to a central unit comprising a connector provided with at least one bore, which is intended to be arranged in an opening of said wall, at least one electrical contact connected to a wiring harness, said electric contact being surrounded by at least one O-ring seal and arranged in the bore of the connector, said device also comprising an over-moulded part on the wiring harness, an end of the electrical contact connected to the wiring harness and an end of the connector, such that, after the device has been mounted in the opening, the junction between said over-moulded part and the connector is situated on one side of the wall.

Abstract: A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode.

Abstract: A rotational intravascular ultrasound probe for insertion into a vasculature and a method of manufacturing the same. The rotational intravascular ultrasound probe comprises an elongate catheter having a flexible body and an elongate transducer shaft disposed within the flexible body. The transducer shaft comprises a proximal end portion, a distal end portion, a drive shaft extending from the proximal end portion to the distal end portion, an ultrasonic transducer disposed near the distal end portion for obtaining a circumferential image through rotation, and a transducer housing molded to the drive shaft and the ultrasonic transducer.

Abstract: A non-contact input apparatus for computer peripheral includes an induction module and a pointing module. The induction module includes an electric supply coil and an induction element, and the pointing module includes an energy coil and a non-linear element. The electric supply coil is used to send a first oscillation signal. The energy coil receives the first oscillation signal. The non-linear element converts the first oscillation signal to be a second oscillation signal having multiple higher harmonics. The induction element generates a control signal based on the second oscillation signal.

Abstract: A method of manufacturing an implantable neural tissue reporting probe may include affixing multiple electrodes to polymeric material; heating the polymeric material to a temperature that is above its glass transition temperature, but below its melting temperature; applying force to the polymeric material while heated so as to cause the polymeric material to change into a shape that is suitable for implanting in neural tissue, the shape including a compartment having at least one opening therein sized to permit dendritic growth to occur through the opening from outside of the compartment to within the compartment after the probe is implanted; and allowing the polymeric material to cool down below its glass transition temperature while maintaining the shape of the compartment, including while maintaining the shape of the opening therein. Related probes and methods of implanting them into neural tissue are also disclosed.

Abstract: The invention discloses a data cable and a forming method thereof. The data cable includes a data connector, a transmission line, and an insulating layer utilized to integrally enclose the data connector and the transmission line. The insulating layer includes an upper insulating portion formed in a first forming process and a lower insulating portion formed in a second forming process, wherein upper insulating portion covers on an outer surface of an upper end of the data connector and an outer surface of an upper end of the transmission line, the lower insulating portion covers on an outer surface of a lower end of the data connector and an outer surface of a lower end of the transmission line, and the upper insulating portion and the lower insulating portion formed in the second forming process are plastically attached to each other.

Abstract: A gas generator includes an initiator having a case, two electrodes and a cap having a wall delimiting an aperture for insertion of the case, a part delimiting an aperture for access to the electrodes and a retaining part made of plastic material overmoulded into the aperture between the initiator, the cap and the part. The wall includes, near the aperture and the protrusion retaining the cap, a second protrusion for supporting the mould in a support direction having a component extending from the bottom toward the aperture, the second protrusion having an outer edge at least partially not covered by the part for use as a support surface in said support direction for a mould to be used for overmoulding.

Abstract: To provide an insert molding method for a connector which enables terminals to be inserted easily into insertion destination places for the terminals. An insert-molding method for insert molding a connector 1 equipped with a plurality of terminals 10 integrated with a housing 40 and aligned in two rows, includes setting the plurality of terminals 10 in a housing mold 80 to uniform warping directions D of the terminals 10 so that the warping directions D are respectively directed toward outer sides of the rows of the terminals 10.

Abstract: A method for producing electric components (1) for high-voltage applications, in particular ignition systems. An insulator (3) is produced as a hollow body from a thermoplastic material by an injection-molding method, the electrical functional part (2) is introduced into the insulator (3), and a casting material is cast in the intermediate space between the electrical functional part (2) and the insulator (3). Also, an electric component (1) having an electrical functional part (2) and an insulator (3) for high-voltage applications, in particular ignition systems The insulator (3) preferably consists of polyphenylene sulfide having a glass fiber content.

Abstract: The embodiments disclose a method for creating a silicone encased flexible cable using manufacturing machinery including automatically arranging plural individual conduits, into custom grouped arrangements including electrical wiring, pneumatic tubing and fluid tubing, inserting the custom grouped arrangements including connectors and flexible silicone junction devices into a shaped silicone encasement extrusion apparatus, depositing a mixture of silicone and additives to the custom grouped arrangements encasement using the extrusion apparatus, customizing the mixture of silicone and additives to create differing characteristics of the custom grouped arrangements, using the extrusion apparatus to create a singular encasement and to cure the singular encasement to a desired shape of the custom grouped arrangements and integrating one or more encased flexible junction box to the custom grouped arrangements, wherein the one or more flexible junction box contains at least one incoming and two outgoing conduit con

Abstract: A method of producing a surface-mount inductor by encapsulating a coil with an encapsulation material containing a resin and a filler using a mold die assembly is provided. A tablet is prepared by preforming the encapsulation material into a shape having a flat plate-shaped portion and a pillar-shaped convex portion on a peripheral thereof A coil is a wound conductive wire having a cross-section of rectangular-shape. The coil is placed on the tablet to allow both ends of the coil to extend along an outer side surface of the pillar-shaped convex portion of the tablet. The coil and the encapsulation material are integrated together while clamping the both ends of the coil between an inner wall surface of the mold die assembly and the outer side surface of the pillar-shaped convex portion of the tablet, to form a molded body.

Abstract: An integrally-formed single-piece flexible light strip includes a substrate populated with at least one LED light circuit. A clear flexible plastic housing is molded around the LED light circuit to completely encapsulate the light circuit. A flexible electrical cable and contoured strain relief for the electrical cable are also integrally formed as part of the light strip to maintain complete environmental and physical protection and eliminate any non-flexible portions of the light strip such as when a connector is used. The light strip is manufactured in a cost efficient manner, and is impervious to moisture penetration and highly resistant to physical damage, thereby allowing the light strip to be used in a variety of applications and environments. The shape of the illustrated light strip is specially designed for attachment to the round tubing of a bicycle frame.

Abstract: A manufacturing method for an EMI-preventing socket comprises the following steps of: providing an EMI-preventing element and a plurality of pins that include a ground pin; connecting a connecting portion of the EMI-preventing element to the ground pin; providing a mold; placing the EMI-preventing element, the ground pin and the other pins in the mold in such a manner that the EMI-preventing element surrounds the pins; and providing a molding material into the mold to wrap the pins, and a joint of the connection portion of the EMI-preventing element and the ground pin to form a socket body of the EMI-preventing socket. Parts of the EMI-preventing element and one ends of the pins are exposed out of the socket body of the EMI-preventing socket. An EMI-preventing socket made by the manufacturing method is also disclosed.

Abstract: A lead has a paddle body with a non-conductive material and multiple electrodes disposed within the nonconductive material. At least one of the electrodes includes one or more anchoring arrangement, such as opening(s) through the electrode through which the non-conductive material can pass; anchors that extend away from the electrode and into the non-conductive material of the paddle body; or flow-through anchors attached to the electrode with an opening through which the non-conductive material may pass.

Abstract: Disclosed herein is a battery cell assembly including a battery cell array including two or more battery cells, each of which has an electrode assembly of a cathode/separator/anode structure disposed in a battery case together with an electrolyte in a sealed state, arranged in the lateral direction, and a protection circuit module (PCM) connected to the upper end of the battery cell array to control the operation of the battery pack, wherein the outer sides of the battery cells or the outer side of the battery cell array is coated with a resin by insert injection molding excluding electrode terminals of the battery cells.

Abstract: A method of making an electric component includes: (a) stamping a metal stock plate to form a plurality of conductive terminals that are partially connected to an excess portion of the metal stock plate; (b) bending each of the conductive terminals to form a bended portion; and (c) forming a housing body over the conductive terminals by insert molding the bended portions of the conductive terminals in the housing body, each of the conductive terminals having an internal portion that is disposed within the housing body and that includes the bended portion, and an external portion that extends out of the housing body and that is connected to the excess portion.

Abstract: A method for manufacturing a Universal Serial Bus (USB) head comprises: locating metal sheets with both ends being closed into a first mould and performing a first injection molding; removing a sprue portion and a fixing portion at top of the metal sheets from a product subjected to the first injection molding, to obtain a first-injected-product; locating the first-injected-product into a second mould and performing a second injection molding; removing an exposed fixing portion of the metal sheets from a second-injected-product, to obtain the USB head desired. In the USB head, four metal sheets are arranged with a certain spacing, and the metal sheets are closed at both ends.

Abstract: There are provided a communications terminal, in which an antenna and a case are integrally formed, and a method of manufacturing the same. The communications terminal includes: a terminal body; a case coupled to the terminal body to form an exterior of the terminal; and an antenna part including an antenna pattern integrally formed with the case and an elastic pin formed at one end of the antenna pattern to be electrically connected to a wireless module provided in the terminal body.

Abstract: Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.

Abstract: This invention relates to electrical devices that are implantable inside an animal, including humans. The invention particularly relates to polyurethane headers mounted on the electrical devices to house electrical contacts. The polyurethane headers are formed by (a) mixing (i) a prepolymer comprising a silicon-containing diol of formula (I) in which R1, R2, R3 and R4 are independently selected from C1-6alkyl; R5 and R6 are independently selected from C1-6alkylene; R7 is C1-6alkylene, O, S or NR in which R is H or C1-6alkyl; and n is 1 to 3 and a diisocyanate; and (ii) a C2-12alkanediol; (b) injecting the mixture of the prepolymer and the C2-12alkanediol into a mould having a cavity shaped to form a header; (c) allowing the mixture to cure and form a polyurethane header within the mould; and (d) releasing the formed polyurethane header from the mould.

Abstract: A portable electrical device includes a chassis, a plurality of conductive bodies, a wireless RF module and a cable. The chassis includes a casing layer and a radiator layer stacked with each other. The conductive bodies are embedded inside the casing layer, in which one end of each conductive body exposes outwards one surface of the plastic casing layer, and the other end of each conductive body exposes outwards the other surface of the casing layer and electrically conducts the radiator layer. The cable is electrically conducted with the conductive bodies and the wireless RF module.

Abstract: A housing combination includes a housing, and at least two antenna modules embedded at corners of the housing. Each antenna module includes an antenna carrier and an antenna radiator. The antenna carrier defines a first receiving groove and a second receiving groove opposite to each other. The antenna radiator includes a main portion and a conductive contact. The main portion is received in the first receiving groove, and the conductive contact is received in the second receiving groove. The main portion is embedded in the housing, and the conductive contact is exposed from the housing.

Abstract: In a method for manufacturing an electrochemical cell (1), having an electrode stack (5) with at least two electrodes, which are separated from ech other by a separator, a cover (2), realized of at least two parts (4), which is closed liquid-tight, and at least two conductors (3), which are electrically connected to said electrodes and which protrude through the cover (2) to the outside, initially, in a first process step, the conductors (3) are connected to a molded part (6, 7, 8) by a molding process and in a second process step said molded part (6, 7, 8) will be connected to the cover (2).

Abstract: An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.

Abstract: A coupling part for electrical lines, where, in an injection-molded protective or plug body, in whose first end a cable is guided, a sealing element is contained which rests circumferentially tight against the cable. The sealing element is surrounded by a capsule part and is biased by the capsule part at least proportionately against the cable, wherein the capsule part is surrounded at least proportionately by the injection-molding protective or plug body.

Abstract: A contacting-type conductivity sensor includes an electrically-insulative plastic body and a plurality of electrodes. The plurality of conductive electrodes is disposed in the plastic body. Each electrode is constructed of plastic and fused with the electrically-insulative plastic body. A method of manufacturing the conductivity sensor is provided along with a single-use bioreactor employing the sensor.

Abstract: A method and apparatus for simplifying battery pack encapsulation is provided. The battery pack includes a pair of complementary housing members with each housing member including a plurality of cell constraints into which the ends of corresponding battery cells are inserted during assembly. One or both housing members also include at least one, and preferably a plurality, of raised encapsulant injection ports. The raised encapsulant injection ports are designed to extend above the surface of the respective housing members and beyond the injected encapsulation material, thus ensuring that the ports remain open after encapsulation material injection.

Abstract: An integral lamp assembly and method of construction thereof is provided. The integral lamp assembly includes a bulb and a plurality of terminals fixed to the bulb. The assembly further includes a socket having at least one through passage wherein the terminals extend through the at least one through passage. The assembly also includes a housing overmolded in bonded relation to at least one of the socket and the terminals such that the housing prevents the bulb from being removed from the socket and prevents the socket from being removed from the housing.

Abstract: A method for producing an electronic component includes: providing at least one carrier element having a microcomponent receptacle configured for contacting at least one microcomponent, injection molding a housing around the carrier element, the microcomponent receptacle being situated in a cavity of the housing that is open on at least one side, introducing the microcomponent into the microcomponent receptacle in the cavity to contact the microcomponent to the carrier element, and injecting the cavity using a filler material to fix the microcomponent in the housing and in the microcomponent receptacle.

Abstract: A photovoltaic tile for a roof includes a plurality of tiles, at least two adjacent tiles of which at least partially overlap each other, including a body (12) having overlapping edges constituting a top edge (20) and a bottom edge (22), the top edge (20) being formed so as to cover the bottom edge (22) of at least one of the adjacent tiles, a photovoltaic layer (40), and electrical connectors (52) which are connected to the photovoltaic layer (40) through electrical conductors (54). The electrical connectors (52) are provided in assembly elements (57, 58) by nesting, the assembly elements being provided on the overlapping edges (20, 22) to enable the overlapping edges to be mutually positioned during the placement of two of the adjacent tiles (10) and the electrical contact of the electrical connectors (52) with each other. The invention also relates a method for manufacturing such tile.

Abstract: The present invention relates to a process for manufacturing composite structures formed by two subcomponents of the same material, characterized in that it comprises the following steps: providing a first subcomponent (13), particularly a skin; providing a tool (15) made of a composite and precured for the manufacture of the second subcomponent (17), particularly a stiffener; positioning said tool (15) on said first subcomponent (13); applying preimpregnated composite (21) on said tool (15) so as to form the second subcomponent (17); consolidating the composite structure by means of a process of curing the assembly resulting from the previous steps under suitable pressure and/or temperature conditions.

Abstract: A single cell having a casing formed from a first casing side part, a second casing side part and a casing frame, in which casing an electrolyte and an electrochemically active electrode foil unit are arranged, wherein the casing comprises an overpressure protection. The first casing side part includes a casing side part segment going at least sectionally over a length of the single cell, which casing side part segment is angled down in relation to the first casing side part in the direction of the cell interior and in which the overpressure protection is arranged and a venting opening is incorporated into the casing frame in a region of the overpressure protection.

Abstract: The object of the present invention is to provide lighting appliances of various shapes, which use light emitting diodes as a light source, having excellent light directivity, light-diffusing property, durability and shock-proof property. The lighting appliance 1 according to the present invention is constituted by including a light illuminating member 13 formed by sealing off a substrate 8 mounted with light emitting diodes 81 therein with a synthetic resin material 9 prepared by mixing particulates 92 capable of diffusing light irradiated from the light emitting diodes 81 to the matrix substance 91.

Abstract: A method of fabricating an electronic entity includes the steps of: forming at least part of the entity by hardening a material (28) in a mold, and (26); personalizing the entity while in the mould (26). A corresponding device is also described.

Abstract: A terminal assembly is provided for accommodating stripped wires and ring lugs. The assembly includes a fastener and clamp plate, the fastener being secured to a base by threaded engagement. A wire to be terminated may be inserted through an access window and secured between the clamp plate and base, with the threaded fastener serving to urge the clamp plate downwardly on the wire. For terminating ring lugs, the fastener may be raised to upper position where it is retained by elastic deformation of retaining elements within the assembly housing. Once the ring lug is inserted the fastener and clamp plate may be released and the termination completed.