Abstract: A method for manufacturing a sensor for a motor vehicle. The method includes placing a sensor core in a lower indentation of a mold; the sensor core having a metal lead frame, including connection pins and lateral retention members, and an integrated circuit, including at least one measurement cell and being overmolded on a support zone of the metal lead frame so the lateral retention members and the connection pins are exposed, and an electrically conductive terminal on each connection pin; placing a magnet in line with the overmolded integrated circuit; placing two lateral indentations of the mold on either side of the magnet and the integrated circuit so the lateral indentations retain the lead frame in the vicinity of the lateral retention members; overmolding the integrated circuit, the magnet and part of the lead frame to allow the free end of the terminals to project; and removing the mold.

Abstract: A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.

Abstract: A preparation method for a metal soft magnetic composite material inductor includes: smelting Fe, Si and Cr and then employing a water atomization or gas atomization means to fabricate an alloy powder; after sifting by particle size, mixing powders of different particle size levels and performing coating insulation, and performing post-granulation to obtain a metal soft composite material granulation powder; adopting the granulation powder to press a material cake, and transferring and molding same; adopting a hollow coil in a liquid-phase coating mold cavity, curing and demolding to obtain a semi-finished product, then continuously heating and curing the semi-finished product, and preparing an end electrode to obtain a finished inductor.

Abstract: A mold for encapsulating an electrical component. The mold includes an encapsulation chamber and an air inlet. The encapsulation chamber is defined by a housing, an open top, and a solid bottom. The housing includes a solid outer wall, a permeable inner wall, and an air chamber between the solid outer wall and the inner wall. The air inlet is configured to introduce a gas into the air chamber. The encapsulation chamber is sized and shaped to receive the electrical component while leaving a gap for the introduction of encapsulant around the electrical component. The encapsulant may be silicone rubber. To remove an encapsulated electrical component, pressurized air may be introduced through the air inlet into the air chamber, passing through the permeable inner wall, separating the outer surface of the encapsulant from the housing, and allowing the combination casting to be removed from the mold.

Abstract: A method of forming a magnetic core on a substrate having a stacked inductor coil includes etching a plurality of polymer layers to form at least one feature through the plurality of polymer layers, wherein the at least one feature is disposed within a central region of a stacked inductor coil formed on the substrate; and depositing a magnetic material within the at least one feature.

Abstract: A method includes: providing a package body including a mounting part having a chip mounting region for mounting a semiconductor chip, a side wall part having a first sealing surface continuously provided over an entire perimeter of the mounting part, surrounding the chip mounting region and provided on the mounting part, a first recess provided on the first sealing surface, and a first solder outflow prevention part continuously provided on the first sealing surface and positioned closer to the chip mounting region side than the first recess; providing a cap having a second sealing surface facing the first sealing surface; providing a ball solder made of an alloy of gold and tin as principal ingredients; placing the ball solder in the first recess; placing the cap on the ball solder; and melting once and then solidifying the ball solder to bond the first sealing surface and the second sealing surface.

Abstract: A method for producing an electronic device, the method including: encasing an electronic assembly with a first casing material; holding the first electronic assembly encased by the first casing material over a holding element such that the holding element is spaced apart from the electronic assembly above the first casing material, and encasing the assembly retained on the holding element with a second casing material.

Abstract: A method for packaging an integrated circuit including a first semiconductor device and a second semiconductor device arranged on a substrate includes calculating parameters of a forming gas based on each of a curing temperature and an estimate of a surface trap density associated with the integrated circuit, dispensing a molding compound over the first semiconductor device, the second semiconductor device, and the substrate, and curing the molding compound in accordance with the curing temperature while flowing the forming gas in accordance with the calculated parameters.

Abstract: A mold assembly includes a mold body configured to mold an insert molded article, and a support member including at least two support pieces configured to support an insert part in a direction substantially orthogonal to a mold opening and closing direction. The insert part is disposable within the mold body, the support pieces are each configured to be movable between a supporting position and a non-supporting position, and the support pieces are each configured to support the insert part at the supporting position, and not to support the insert part at the non-supporting position.

Abstract: Methods of forming semiconductor device packages comprising stacking multiple dice, the die stack exhibiting thin bond lines and having an outer environmental coating, the bond lines and environmental coating comprising an in situ formed compound. Semiconductor device packages so formed and electronic systems incorporating such packages are also disclosed.

Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

Abstract: Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demolding and avoiding stray lights.

Abstract: A method for packaging semiconductor devices in a chamber includes arranging a carrier substrate including a first semiconductor device and a second semiconductor device within the chamber, flowing a molding compound into the chamber to cover surfaces of the first semiconductor device, the second semiconductor device, and the carrier substrate, and flowing a forming gas into the chamber while curing the molding compound. The forming gas includes a reactive gas configured to react with the first semiconductor device and the second semiconductor device during curing.

Abstract: A process for the drying, and subsequent imidization, of polyimide precursors which minimizes or eliminates voids and which minimizes or eliminates discoloration. The process uses a sequential set of descending pressure operations that allow for time efficient processing of wafers. The set of descending pressure operations are interspersed with evacuation processes using heated gasses, which combine heating and byproduct evacuation. The process results in layers with reduced or eliminated voiding, discoloration, and solvent retention.

Abstract: A method for manufacturing a detecting sensor is disclosed. The method includes the steps of: positioning a magnet in a mold having a plurality of terminal receiving holes; positioning in the mold a plurality of magnetic field detecting sensor elements, each having a body and a terminal projecting from body; inserting the terminals into the terminal receiving holes; injecting molten resin into the mold; and curing the molten resin to form a housing having the magnet and the sensor elements embedded.

Abstract: A chip inductor comprises a laminate including a plurality of sheets stacked therein; a coil disposed in the laminate and including an exposed portion, in which a portion of the coil is exposed outwardly of at least one surface of the laminate; and a non-magnetic insulating layer disposed on an external surface of the laminate to cover the exposed portion of the coil.

Abstract: One aspect is for a method of manufacturing a magnetic coil for a magnetic actuator. A coil carrier is provided which comprises a tubular section and a collar which adjoins the tubular section, wherein the coil carrier is arranged for accommodating a coil winding. A die comprising a defined inner contour is provided which is adapted to the coil carrier. The coil carrier is inserted into the die, wherein the collar of the coil carrier rests on a seating surface of the die. The collar is punched with a punch, wherein a flange contour is formed at the collar the outline of which is defined by an inner contour of the die. The coil carrier is also at least sectionally potted or overmolded with a filler material, wherein the flange contour provides a barrier for the filler material. The disclosure further relates to a corresponding magnetic coil.

Abstract: A process for the drying, and subsequent imidization, of polyimide precursors which minimizes or eliminates voids and which minimizes or eliminates discoloration. The process uses a sequential set of descending pressure operations that allow for time efficient processing of wafers. The set of descending pressure operations are interspersed with evacuation processes using heated gasses, which combine heating and byproduct evacuation. The process results in layers with reduced or eliminated voiding, discoloration, and solvent retention.

Abstract: A coil is formed by winding an electrically-conductive wire, and is buried in a molded body formed from a composite magnetic material containing a magnetic powder and a resin. Each of led-out ends of the coil has a cut surface formed by obliquely cutting an electrically-conductive wire with respect to a surface thereof. The cut surface of each led-out end of the coil is exposed on a surface of the molded body, and each led-out end is connected to an external terminal electrode formed in the surface of the molded body at the cut surface.

Abstract: The invention discloses, pickup method, equipment and EMI electromagnetic shielding layer manufacturing method of SiP module. The method for picking up the SiP module comprises the following steps: A nozzle descends to touch the upper surface of the SiP module; the nozzle sucks the SiP module; an air thimble ascends to touch the lower surface of the carrier; the air thimble covers the through hole of the carrier, so as to form the enclosed space for the lower surface of the SiP module, the through hole and the air thimble; compressed air is sprayed into the enclosed space from the hollow structure of the air thimble and acts on the lower surface of the SiP module, so that the bonding between the SiP module and the doubled-sided adhesive tape is loosened; the nozzle ascends and picks up the SiP module.

Abstract: Disclosed are a magnetic sheet, a method of manufacturing the same and an antenna including the magnetic sheet. In the magnetic sheet manufactured by stacking a plurality of green sheets on top of each other and calcining the stacked plurality of green sheets, the plurality of green sheets are stacked after a different material layer is formed on a certain portion of both surfaces or one surface of at least one of the plurality of green sheets.

Abstract: A method of making a microelectronic assembly can include molding a dielectric material around at least two conductive elements which project above a height of a substrate having a microelectronic element mounted thereon, so that remote surfaces of the conductive elements remain accessible and exposed within openings extending from an exterior surface of the molded dielectric material. The remote surfaces can be disposed at heights from said surface of said substrate which are lower or higher than a height of the exterior surface of the molded dielectric material from the substrate surface. The conductive elements can be arranged to simultaneously carry first and second different electric potentials: e.g., power, ground or signal potentials.

Abstract: A fuse-equipped connector (1) is configured in combination of a first connector (10) and a second connector (30) which can be assembled to each other in an attachable and detachable state. The first connector (10) includes a first terminal (13) electrically connected to an external apparatus (50) and a connection portion (12a) mechanically connectable to the external apparatus (50). The second connector (30) includes a second terminal (33) electrically connected to the first terminal (13) and a fuse (35) being electrically connected to the second terminal (33). In a state where the first connector (10) and the second connector (30) are assembled with each other, the first terminal (13) and the second terminal (33) are electrically connected to each other.

Abstract: A sensor arrangement for a vehicle includes a sensor unit, a cable arrangement, and an elastic cap. The sensor unit has a main support, an electronics part connected to the main support, and a sensor element. The cable arrangement has at least one individual wire, and is configured to electrically contact the electronics part via at least one contact-making member. The main support is an open housing defining at least one insertion opening configured to accommodate the at least one contact-making member and an accommodation pocket configured to at least partially accommodate the electronics part. The elastic cap has a member configured to fasten the sensor unit in the vehicle, is configured to be pushed at least partially over the main support, and closes off the accommodation pocket in a sealed manner.

Abstract: An assembly for a medical lead includes an elongated lead body, and a conductive element located at a distal portion of the lead body. The conductive element substantial!)? encircles a longitudinal axis of the lead body. The assembly further includes a plurality of insulated conductors extending within the lead body, each of the insulated conductors being in electrical contact with the conductive element and extending to a proximal end of the lead body. Each of the insulated conductors contacts a different circumferential portion of the conductive element. The conductive element is configured to facilitate mechanical and electrical separation of different circumferential portions of the conductive element to form two or more electrode segments for the medical lead from the conductive element.

Abstract: Provided is a technology with which, when producing a resin molded article, the inside of which is provided with an insert component such as a terminal fitting, it is possible to prevent the insert component from being exposed at an inappropriate position, and to ensure the desired positional accuracy. In an injection molding device, the accuracy of the position of a terminal is improved by allowing a core-back mold to move after a terminal, which is an insert component, has been inserted in a terminal tip holding section of a slide mold. By allowing the core-back mold to move by only a prescribed amount prior to injection molding, a resin wall is formed between the core-back mold and the terminal. The inappropriate exposure and shorting of and the adhesion of foreign substances to, and the like, the terminal can thus be prevented.

Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.

Abstract: A system and method for a semiconductor molding chamber is disclosed. An embodiment comprises a top molding portion and a bottom molding portion that form a cavity between them into which a semiconductor wafer is placed. The semiconductor molding chamber has a first set of vacuum tubes which hold and fix the position of the semiconductor wafer and a second set of vacuum tubes which evacuate the cavity of extraneous ambient gasses. The encapsulant may then be placed over the semiconductor wafer in order to encapsulate the semiconductor wafer.

Abstract: A device and method for manufacturing integrated circuit packaging using a mold plunger with position compensation in a manufacturing setting. In an embodiment, a compensating mold plunger, which may be used during the manufacture of an integrated circuit package, engages a die set on a carrier and within a bushing. This may be done to inject a mold compound on top of the die/carrier. If the bushing that is housing the die/carrier tandem is misaligned with the plunger in any lateral direction, the amount of pressure may be compromised. A compensating mold plunger includes a flexible portion that allows for the head of the plunger to properly engage the die/carrier despite any possible misalignments. Further, different die/carrier combinations may also be used with a compensating mold plunger because the pressure and force applied may be uniform inside a bushing despite the contents of the bushing.

Abstract: Device for identifying articles such as animals, comprising a male part and a female part, which male part comprises an arrow-shaped element and which female part is provided with a passage with a front end and a rear end, wherein the arrow-shaped element can be inserted into the passage along the front end, wherein the passage is provided close to the front end with at least one protruding element, and wherein the passage is partly closed close to the rear end by a closing part, wherein the partly closed passage, including the protruding element, are manufactured integrally from a hard material; method for manufacturing such a device.

Abstract: A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold.

Abstract: A method for manufacturing a resin molded stator may include: preparing a straight winding core in which neighboring partial core backs are coupled by a joint; bending the core at joints and causing distal ends of teeth to face an outer peripheral surface of a core metal to obtain a core metal assembly including a stator mounted on the core metal, arranging the core metal assembly in a mold; injecting resin into the mold, covering windings with resin, curing the resin; and removing the stator from the mold and the core metal. The core metal may include a plurality of ribs projecting outward from the outer peripheral surface, the number of the ribs being between three and the number of the teeth. Each rib may extend parallel to a center axis, and each rib may be located in a gap between the distal ends of adjacent teeth.

Abstract: Method and apparatus for overmolding delicate parts are disclosed. A mold unit for an injection molding apparatus can be provided. The mold unit can include a clamping mechanism and a locking mechanism. The clamping mechanism can be positioned in contact with the delicate part. The position of the clamping mechanism can be selected such that the clamping mechanism does not exert a force that damages the delicate part. The delicate part can vary in size from part to part. Thus, as the overmolding process is repeated, the position that is selected each time for the clamping mechanism can vary depending on the size of a part that is used. The locking mechanism can be configured to lock the clamping mechanism into the position selected for the part.

Abstract: The invention relates to a method for displacing an object in a solid system involving the following steps: placing the object in a matrix which is solid at a first temperature and capable of softening due to the effect of a temperature increase; if necessary, increasing the temperature until the matrix softens; applying an external action to the object so as to move it inside the matrix; lowering the temperature until the matrix solidifies.

Abstract: A method of sealing coil leads during encapsulation by placing a lead of a coil in a tube, such that there remains a gap between the lead and the tube; placing the coil in a mold such that the gap remains open to an environment surrounding the mold; and injecting encapsulation material into the closed mold in a liquid state under pressure, thereby causing the material to flow through the gap toward the environment. Injecting encapsulation material into the mold may be done at a rate, temperature, and/or environmental temperature to cause the material to solidify before passing through the gap into the environment. In any case, there is no need to seal the mold to the leads. Each lead of the coil may be placed into an individual tube and/or the tubes may be is formed within a single sleeve.

Abstract: A method for forming a cover assembly on an electrical power transmission cable includes: mounting a tubular cover member around the cable such that a portion of the cover member defines a cavity surrounding the cable; providing a flowable electrical stress grading material in the cavity; and applying a vacuum to the cavity to evacuate air from the cavity and compact the electrical stress grading material in the cavity.

Abstract: A method of manufacturing a coil support member in which a thermosetting or thermoplastic material is introduced into a mould cavity and hardened, wherein one or more components are positioned within the mould cavity during the manufacturing process before the thermosetting or thermoplastic material is introduced, the components are then embedded in the thermosetting or thermoplastic material and form an integral part of the coil support member, and one or more functional filler materials are added to the thermosetting or thermoplastic material to improve the thermal matching between the integral components and the thermosetting or thermoplastic material.

Abstract: The invention relates to a method for encapsulating electrical and/or electronic components in a housing, the components being arranged on a printed circuit or a strip conductor in an assembly. Said assembly is positioned in the housing and is encapsulated with a curing, electrically insulating molding compound. The method according to the invention is characterized by encapsulating preferably in a molding chamber at a pressure below atmospheric pressure and by removing the negative pressure after encapsulation and before curing.

Abstract: Disclosed herein, among other things, is a system for constrained layer damping for hearing assistance devices. According to various embodiments, a hollow in-the-ear (ITE) hearing instrument shell is formed. The shell has an air space within a wall of the shell, in various embodiments. A port is created in the wall of the shell. The port is adapted to interface the air space to an area outside the shell, in an embodiment. A viscous fluid is dispensed into the air space via the port, and the viscous fluid is cured within the air space. The cured fluid acts as a constrained layer of mechanical damping within the wall of the ITE shell, reducing audible feedback to a wearer of the ITE.

Abstract: A potting method for a lamp chain includes a) providing a mold having a potting groove; b) providing a fixing support which is fixedly kept in the potting groove; c) fixedly keeping a printed circuit board provided with a light emitting assembly in the fixed support; d) potting a potting material into the potting groove and curing the potting material; and e) removing the mold.

Abstract: Methods and apparatus for providing conformal shielding are disclosed to provide electromagnetic interference shielding of circuit components mounted on a circuit board. A print mold stencil is provided with one or more conductive shielding walls disposed within the stencil before its application to the circuit board and detachable therefrom, and also configured to encompass the circuit components. In this manner a shielded compartment volume is defined by walls of the print mold stencil and one or more of the conductive shielding walls, and may be easily and quickly applied to the circuit board to encompass the components for shielding. A conformal shielding layer is then formed from a molding material disposed in the shielded compartment volume that encompasses the components, as well as a conductive layer disposed on the outer surface of the material, and coupling of the shielding walls with a ground plane in the circuit board.

Abstract: In one embodiment, a method of fabricating stimulation leads, the method comprises: providing a spool of polymer film; providing a plurality of payout carriers of wires; drawing the polymer film from the spool and the wires from the plurality of payout carriers over a rotating drum, wherein the drum comprises a plurality of grooves over an outer circumferential surface of the drum for directing the wires from the plurality of payout carriers, wherein a distance of each groove from an edge of the drum is varied about the circumference of the drum; bonding the wires to the polymer film while performing the drawing to form an intermediate assembly comprising the polymer film as a carrier with the bonded wires in a repeating pattern along a length of the intermediate assembly.

Abstract: A method of manufacturing an edge protector for a cathode plate includes inserting a first retention plate into a slit in a first edge strip, proximate an end of the first edge strip. The first retention plate is also inserted into a slit in a second edge strip, proximate a first end of the second edge strip. Additionally, the first retention plate is inserted into a gap of a first plug, such that the first plug abuts both the end of the first edge strip and the first end of the second edge strip. A corner cap is then overmolded on the end of the first edge strip, the first plug, and the first end of the second edge strip.

Abstract: An ultrasonic transmission/reception unit includes a metal plate, an acoustic matching member, a piezoelectric substrate, a first lead wire, a second lead wire, and a vibration suppression member containing a thermoplastic resin as a major component, the vibration suppression member being configured to cover, in a unitary manner, the other main surface of the metal plate, which is other than a portion of the other main surface to which the piezoelectric substrate is fastened, a surface of the piezoelectric substrate, an end surface of the metal plate, an outer peripheral portion of the one main surface of the metal plate, the first lead wire, and the second lead wire.

Abstract: A structure (10) including (i) a casing (1) made of a dielectric and (ii) a conducting member (2) embedded in the casing (1) so as to be through the casing (1) is manufactured by insert molding. The conducting member (2) is provided with a recess (2c), and an upper mold (40) is provided with a protrusion (40a) corresponding to the recess (2c). The conducting member (2) is positioned to be fixed in the mold by fitting the protrusion (40a) in the recess (2c).

Abstract: A connector assembly for an implantable medical device with hardware components placed in established physical locations within the polymer of the connector, and a method of making the assembly. One embodiment includes a method that involves forming a first shot, coupling at least one hardware component to the first shot to form a subassembly, placing the subassembly between a set of opposing areas of a mold, moving at least one of the areas of the set of opposed areas of the mold to constrain the subassembly within the mold, and introducing a second shot over at least a portion of the subassembly to form the connector.

Abstract: An apparatus for molding a semiconductor device includes an upper mold chase and a lower mold chase. The mold chases are capable of being aligned with each other, forming spaced cavities for receiving a lead frame array that includes semiconductor dies for encapsulation. The cavities are aligned in spaced, vertical columns and gates are provided at the opening of each column of cavities. A molding compound is passed through the gates and flows uninterrupted through each cavity and encapsulates the semiconductor dies.

Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.

Abstract: A process for the drying, and subsequent imidization, of polyimide precursors which minimizes or eliminates voids and which minimizes or eliminates discoloration. The process uses a sequential set of descending pressure operations that allow for time efficient processing of wafers. The set of descending pressure operations are interspersed with evacuation processes using heated gasses, which combine heating and byproduct evacuation. The process results in layers with reduced or eliminated voiding, discoloration, and solvent retention.