Abstract: A process can manufacture an ornamental design molded onto an earphone cord. The process involves the following steps. First, designing a top and bottom mold with mold earphone channels immediately adjacent to mold ornament channels. Then, boring a mold injection port into the top mold. After that, boring a material, injection channel into the bottom mold. Subsequently, inserting the earphone cord into the bottom mold earphone channel and the top mold earphone channel, Then, allowing melted material to flow from the top mold into the bottom mold and through the mold earphone channels and the mold ornament channels covering the earphone cord with material without damaging the earphone cord. Next, permitting the material to harden around the earphone cord forming a molded decorative symbol around the earphone cord. Then, removing the molded decorative symbol from the top mold and the bottom mold.

Abstract: A one piece integrally formed non-metallic electrical box assembly is produced by molding an electrical box onto a metallic ground strap so that the ground strap is fixed to the electrical box. The electrical box is molded with retaining members surrounding selected portions of the metallic ground strap so that the electrical box can be molded onto the metallic ground strap without buckling or deforming the electrical box and the ground strap during the molding process by compensating for the differences in expansion between the non-metallic electrical box and the metallic ground strap.

Abstract: A method for producing a magnetic field sensor for use in drive train of a motor vehicle includes encapsulating an electrical assembly and an end of a connecting cable via injection molding and integrally extruding a fastening tab. After a first injection step in which the electrical assembly and the connecting cable are encapsulated in a core-type first molded part, a second injection molding step in implemented in which a fastening tab is integrally formed via injection molding on the core-type insertion part in a specifiable longitudinal and/or angular position. The core-like insertion part is held in the injection mold in a longitudinally displaceable and/or rotatable manner.

Abstract: A process for curing a porous muffler preform defined by a plurality of glass fibers and a heat-curing thermoset or thermoplastic materials applied to the plurality of glass fibers is disclosed herein. The process includes the step of enclosing the muffler preform in a chamber. The process also includes the step of surrounding the muffler preform with steam. The process also includes the step of causing steam to enter the muffler preform from multiple directions.

Abstract: A device for providing the edge of a starting sheet of an electrode used in the electrolytic refining or recovery of metals with a dielectric part comprises a die space, in which the edge of the starting sheet of the electrode can at least partly be fitted, and a feeding device of the dielectric material for feeding the dielectric material into the die space. The device comprises changing members of the volume of the die space for pressing the dielectric material in the die space to that edge of the starting sheet of the electrode, which is at least partly fitted in the die space.

Abstract: A method for forming a wire construct includes forming a groove in a polymer having a mouth that is narrower than a width of a deeper portion of the groove and placing a substantial length of wire in the groove, the wire having a larger cross-sectional dimension than the mouth of the groove. Encapsulant is placed over the polymer. The wire construct is to be used for implantable stimulation leads, such as a cochlear stimulation lead or a neurostimulation lead. Two wire constructs can be assembled to form a multilayer wire construct.

Abstract: A sealed connector assembly connects a first cable to a second cable and includes female and male terminal assembly components each having molded in place a weather resistant sleeve that both covers the respective terminal assembly components, and defines openings or gaps which enable female and male contacts to be electrically connected and the sleeves to mechanically contact, thereby providing weather and element resistance. In a method for insulating the respective female and male terminals in a mold assembly, an O-ring applied to the terminal components to prevent liquid mold material from flowing over the electrical contacts.

Abstract: A method for manufacturing a card member includes: preparing a substrate having a card edge section with card edge terminals to be connected to an opposing connector; preparing a fist mold and a second mold that have molding spaces for molding a resin molded section having a fitting section to be fitted with the opposing connector formed around the substrate; placing the substrate inside the molding spaces between the first mold and the second mold in such a way that the joining portion of the first mold and the second mold are disposed so as not to be overlapped with the portion where the fitting section is to be formed; injecting a synthetic resin material into the molding space to integrally form the resin molded section around the substrate. The method can provide a card member having an excellent watertightness.

Abstract: A headset can include a cable structure connecting non-cable components such as jacks and headphones. The cable structure can be constructed using a molding process. Different approaches can be used to ensure that a conductor bundle extending through the cable structure remains centered within the cable structure during the molding process. In some cases, a movable tube can be placed in the mold such that the conductor bundle is retained within the tube. As material is injected into the mold and reaches the tube, the tube can be displaced and progressively removed from the mold. Alternatively, the movable tube can be constructed such that the tube may combine with injected material to form a shell of the cable structure. In some cases, gates from which material is provided in the mold can be positioned and controlled to facilitate the injection of material in the mold while maintaining the centered position of the conductor bundle.

Abstract: A retaining frame (2) having at least one optical element (3) secured thereto by injection molding, with the at least one optical element (3) being embodied for beam shaping at least by means of total internal reflection and/or diffraction.

Abstract: An insert molding method includes holding a plurality of insert members in a molding die to be separated from one another, and subsequently filling a resin into the molding die to fill a gap between the insert members and a periphery thereof with the resin to form an insert molded product such that the insert members are separated at a preset interval from one another. The molding die includes a space-maintaining projection for maintaining a separation interval between the insert members at the preset interval or more, the projection being formed on an inner wall surface of the molding die opposite to a longitudinal end of the insert members, and a gate for filling the resin therethrough into the molding die, the gate being formed on an inner wall surface of the molding die opposite to a side of the insert members in a width direction thereof.

Abstract: A manufacturing method of housing of electronic device comprises following steps: providing a metal member; forming a plurality of micro anchored apertures on a surface of the metal member; placing the metal member in a plastic injection mold, wherein the plastic injection mold is set at a first temperature; and providing a molten plastic material in the plastic injection mold for integrating with the surface of the metal member with an injection molding manner, wherein the plastic injection mold is set at a second temperature, and the second temperature is higher than the first temperature.

Abstract: The present disclosure provides a method of simply manufacturing a header for lithium batteries using a polymer, and a header for lithium batteries manufactured by the same. The method includes securing a body having a hole inside dies and securing a cathode pin in the hole so as not to contact the body, filling the hole with polymer powder, and heating the dies to melt the polymer powder, followed by cooling and curing the melted polymer.

Abstract: A wireless IC tag is manufactured by embedding a tag substrate in a columnar outer shell body, in which circumferential protrusions are formed on the peripheries of both end portions of the columnar outer shell body. The wireless IC tag is manufactured by implementing injection molding, while supporting the upper and under surfaces of the tag substrate by supporting members so that the tag substrate is held in the central position in a die and positioning both the lateral sides of the tag substrate by positioning members, subsequently moving the supporting members and the positioning members backward from the die on the way of the molding, and then continuing the injection molding.

Abstract: A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.

Abstract: A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode.

Abstract: An injection mold for molding an electronic product which has a terminal includes a movable mold, a first sliding block levelly defining a through-hole, a second sliding block, a supporting pole and a stationary mold. A top of the movable mold defines an opening of which a bottom defines a fastening hole for fastening a bottom of the terminal therein. An inner sidewall of the second sliding block defines a groove for restraining a top of the terminal. The first and second sliding blocks are located at two opposite sides of the opening to together define a cavity for molding the electronic product. The supporting pole is movably inserted in the through-hole and stretches into the cavity to resist against the top of the terminal. The stationary mold is positioned on the first and second sliding blocks, and defines a sprue channel connected with the cavity.

Abstract: A rotational intravascular ultrasound probe for insertion into a vasculature and a method of manufacturing the same. The rotational intravascular ultrasound probe comprises an elongate catheter having a flexible body and an elongate transducer shaft disposed within the flexible body. The transducer shaft comprises a proximal end portion, a distal end portion, a drive shaft extending from the proximal end portion to the distal end portion, an ultrasonic transducer disposed near the distal end portion for obtaining a circumferential image through rotation, and a transducer housing molded to the drive shaft and the ultrasonic transducer.

Abstract: A transfer mold assembly including a first mold chase; a second mold chase; a first lead frame; at least one first lead frame die mounted on the first lead frame; a second lead frame substantially identical to the first lead frame; at least one second lead frame die mounted on the second lead frame; and wherein the first and second mold chases define a transfer mold cavity and wherein the first and second lead frames are positioned in stacked relationship inside the transfer mold cavity. Also disclosed is a method of integrated circuit packaging.

Abstract: An article for use in various industries including for manufacturing toys, promotional articles, and decorative articles using plastic includes a body (1), a built-in magnet (3) and a receptacle (2) with side arms (21) embedded in the body (1). The receptacle (2) has a base (23), an opening (25) for introducing the magnet (3), and a closure lid (4) for closing the opening (25).

Abstract: Provided is a technology with which, when producing a resin molded article, the inside of which is provided with an insert component such as a terminal fitting, it is possible to prevent the insert component from being exposed at an inappropriate position, and to ensure the desired positional accuracy. In an injection molding device, the accuracy of the position of a terminal is improved by allowing a core-back mold to move after a terminal, which is an insert component, has been inserted in a terminal tip holding section of a slide mold. By allowing the core-back mold to move by only a prescribed amount prior to injection molding, a resin wall is formed between the core-back mold and the terminal. The inappropriate exposure and shorting of and the adhesion of foreign substances to, and the like, the terminal can thus be prevented.

Abstract: An LED packaging method includes: providing a mold with two isolated receiving spaces and a substrate with a die supporting portion and an electrode portion respectively received in the two receiving spaces; disposing an LED die on the die supporting portion and electrically connecting the LED die to the electrode portion of the substrate by metal wires; injecting a light wavelength converting material into the first receiving space and covering the LED die with the light wavelength converting material; communicating the first receiving space to the second receiving space, injecting a first light transmissive material into the communicated first and second spaces, and covering the light wavelength converting material and the metal wires with the first light transmissive material; and removing the mold to obtain a packaged LED.

Abstract: A radiation-proof laminate for electronic devices has: a substrate layer consisting of an electrically conductive material, and a first radiation barrier layer formed on the substrate layer, wherein the first radiation barrier layer comprises 50 wt % to 70 wt % of rubber-based heat-bonding adhesive compound in the form of powder or liquid, 5 wt % to 20 wt % of aluminum powder, 5 wt % to 20 wt % of copper powder, and 5 wt % to 20 wt % of silver powder; wherein the aluminum, copper, and silver powder are mediated by the rubber-based heat-bonding adhesive compound to disperse and form a mesh-like distribution. The radiation-proof laminate can absorb electromagnetic radiation from the electronic device and redirect RF radiation while maintaining the RF signal strength not to be substantially affected or attenuated by the radiation-proof laminate, to maintain the network connection performance of the electronic device.

Abstract: A horizontal injection mold system includes a horizontal injection mold which is opened or closed in a direction perpendicular to a direction of gravity; and an insert member feeder which feeds an insert member into the horizontal injection mold, such that a resin coupling surface of the insert member faces a gate disposed in the horizontal injection mold.

Abstract: A rotary knob assembly and methods for forming and controlling friction effecting features of the knob assembly are disclosed. The knob assembly includes a mounting structure and a knob. The knob is rotatably coupled to a bezel of the mounting structure. The knob includes a stabilizer, a guide member, and a retainer having a patterned surface. At least a portion of the stabilizer is disposed between the bezel and the retainer to maintain an axial position and a radial position of the knob. A detent formed on the guide member cooperates with a patterned surface of the retainer to provide a haptic feedback to a user.

Abstract: A robust media sealing temperature probe is provided and includes a tubular member having a closed end and an open end opposite the closed end, an annular seal formed about the tubular member, a probe having a temperature sensing element and a signal conductive assembly coupled to the temperature sensing element, the probe being secured within the tubular member with the temperature sensing element proximate to the closed end and the signal conductive assembly extending through the open end and a housing formed to encapsulate the seal about the tubular member with the closed end and a portion of the signal conductive assembly exposed at an exterior of the housing.

Abstract: A method of manufacturing includes arranging an integral resin sleeve formed by integrating a plurality of sleeve parts so that the sleeve parts are respectively fitted with a plurality of electrode terminals. There is a press-fitting of the sleeve parts to the electrode terminals by performing mold clamping on molds to apply a force downward on the integral resin sleeve. Further, there is a filling of a molding resin into a hollow cavity of the molds.

Abstract: A method for manufacturing sintered magnet poles is described. The mold is filled with a vitrifiable base material powder and closed with a plate. A magnetic field aligns the powder and a plate pressed onto the powder establishes a compact that holds the alignment in place. The compact is sintered to form a sintered magnet pole. The mold forms a protective cover of the sintered magnet pole and the plate forms a base plate of a magnet pole piece. Furthermore, a magnet pole piece is provided which has a magnet pole and a base plate which is fixed to a protective cover so that the base plate and the protective cover surround the magnet pole. The base plate and/or the protective cover of the magnet pole piece has at least one element that provides a geometrical locking of the magnet pole to the base plate and/or the protective cover.

Abstract: A method for injection moulding an external housing of an object including an electronic assembly, includes interposing the assembly between a first half-mould and a second half-mould of an open injection mould and closing the first half-mould and the second half-mould to define an injection cavity containing the assembly. Plastic is injected in the cavity to mould said external housing. The step of interposing includes positioning, before the injection of plastics, the assembly on movable support means associated with the mould, the support means being arranged on an extended position, and disengaging the support means from the assembly before the plastic is cured such as to manufacture the external housing in an only one shot manufacturing process. This way, plastic of the external housing is integrally moulded and devoid of discontinuity points.

Abstract: The present disclosure provides a method of manufacturing a current terminal for an embedded pole part, in which a vacuum interrupter is molded by an isolating coverage in a hot and pressure injection process, and such a pole part. At the position of the upper electric terminal at the fixed contact side of the vacuum interrupter, a pressure protecting element is placed into the mould, at least close to the upper part the fixed contact side of the vacuum interrupter and/or together with it, and the protecting element, the terminal and the vacuum interrupter are embedded by injection molding.

Abstract: Disclosed are a method and an apparatus of compression molding to reduce voids in molding compounds of semiconductor packages. A compression mold jig set including a top mold and a bottom mold is provided and disposed inside a pressure chamber. A substrate disposed with chips is loaded on the top mold. An encapsulating material is filled in the cavity of the bottom mold. When heating the bottom mold to melt the encapsulating material, a positive air pressure more than 1 atm is provided in the pressure chamber in order to expel or reduce any bubbles trapped inside the encapsulating material. Then, the top mold is pressed downward to clamp with the bottom mold under the heating and high-pressure condition until the encapsulating material is pre-cured to transform a molding compound adhered to the substrate. Therefore, potential bubble trapped inside the molding compound can be eliminated or reduced to improve production yield, reliability and life time.

Abstract: A process for making a protective assembly for an article, such as a circuit, includes forming a flexible layer of the protective assembly over the circuit to be protected during circuit operation, wherein said protective assembly is non-adhesive to the circuit and wherein the flexible layer is conformed to the topography of the circuit and non-adhesive to the circuit.

Abstract: A method and apparatus for simplifying battery pack encapsulation is provided. The battery pack includes a pair of complementary housing members with each housing member including a plurality of cell constraints into which the ends of corresponding battery cells are inserted during assembly. One or both housing members also include at least one, and preferably a plurality, of raised encapsulant injection ports. The raised encapsulant injection ports are designed to extend above the surface of the respective housing members and beyond the injected encapsulation material, thus ensuring that the ports remain open after encapsulation material injection.

Abstract: Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin.

Abstract: A tapping tee assembly (10) comprises an integrally moulded saddle (12), body (14) and socket (16). The tapping tee assembly can be mounted on a pipeline thereby enabling a cutter to travel through the body of the fitting in order to cut a hole in the pipeline. The saddle (12) is provided with a saddle-shaped electrofusion element mat (18) and the socket (16), which is integral with the body (14) and in fluid connection with the axial bore (20) of the body, is provided with a second electrofusion element (22). The electrofusion elements (22,30) are connected by an integrated anvil-shaped connector (26) and connecting pin (28) such that both electrofusion elements (22,30) can be energized simultaneously using two electrical terminals (24,38), and the device can be manufactured with relative ease.

Abstract: The present invention relates to a process for manufacturing composite structures formed by two subcomponents of the same material, characterized in that it comprises the following steps: providing a first subcomponent (13), particularly a skin; providing a tool (15) made of a composite and precured for the manufacture of the second subcomponent (17), particularly a stiffener; positioning said tool (15) on said first subcomponent (13); applying preimpregnated composite (21) on said tool (15) so as to form the second subcomponent (17); consolidating the composite structure by means of a process of curing the assembly resulting from the previous steps under suitable pressure and/or temperature conditions.

Abstract: A battery pack includes a formed portion coating at least a portion of the outer surface of a battery or a plurality of battery packs with reaction-curable resin; and spacers having dimension-absorbing ability and attached to the rear surface of the formed portion.

Abstract: A method and appertaining assembly are provided for CIC hearing aid manufacture for the placement of floating components. A hearing aid shell fixture is formed that comprises an interior region identical in shape and size to an interior region of an actual hearing aid shell, and a replica of one or more shell components that is positioned so as to replicate a position and size of one or more real shell components in the actual hearing aid shell. The hearing aid shell fixture is placed onto a faceplate assembly that comprises a floating component, and a position of the floating component is adjusted to avoid contact with the replica of one or more shell components. The hearing aid shell fixture on the faceplate is subsequently replaced with the actual hearing aid shell.

Abstract: A method of fabricating an electronic entity includes the steps of: forming at least part of the entity by hardening a material (28) in a mold, and (26); personalizing the entity while in the mould (26). A corresponding device is also described.

Abstract: There is provided an antenna integrally formed with a case and a method of manufacturing the same. An antenna integrally formed with a case according to an aspect of the invention includes: a case unit formed of a dielectric material; a radiator including a radiation unit tightly fixed to an outer surface of the case unit and terminal units each extending from an end portion of the radiation unit, passing through the case unit, and exposed on the inside of the case unit; and contact pins provided on a board disposed adjacent to the case unit and electrically connected to the individual terminal units.

Abstract: The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.

Abstract: The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

Abstract: An injection-molded case and a manufacturing method thereof having antenna patterns are formed in the injection-molded case by only one insert injection molding process, without a second insert injection molding process as required in the conventional manufacture. The injection-molded case preferably includes: one or more antenna patterns fabricated by a press process; and an injection-molded case part having the antenna patterns provided therewithin, which is fabricated by fixing the antenna patterns on an injection mold and carrying out only one insert injection molding process.

Abstract: A method for producing a sensor with seamless extrusion coating of a sensor element and a sensor produced by said method. The sensor element is enclosed in as sealed a manner as possible by the extrusion mass, thus permanently preventing the ingress of water, acids, oils or other aggressive materials to the region of the sensor. The method includes inserting the sensor element into a mould cavity, mechanically fixing the sensor element in the mould cavity by at least one movable fixing element that engages the sensor with the mould cavity in a second region of the mould cavity, injection of an extrusion mass into the mould cavity, waiting until the extrusion mass has hardened in a first region of the mould cavity to fix the sensor element in position, removal of the moving fixing element, before the extrusion mass in the second region hardens, such that the still liquid extrusion mass at least partly fills the cavity left in the mould cavity by the removed fixing element.

Abstract: Improvement in the yield of a semiconductor device is aimed at. When extruding a molded body with the ejector pin which performs advance-or-retreat movement at the projecting portion which projects from this bottom face in the bottom face of a mold cavity corresponding to the surface and the mounting side of a molded body after forming a molded body, depressed portions being formed in the surface and the mounting side by projecting portions, they can extrude. When accumulating molded bodies themselves in the baking step after a resin molding step and performing bake, by arranging the resin burr which furthermore withdrew from the surface and the mounting side in the depressed portion, bake can be performed in the condition that the accumulated molded bodies are stuck. Therefore, the form of deformation of a warp etc. of each molded body or a lead frame, can be made uniform, and, as a result, improvement in the yield of QFP (semiconductor device) is aimed at.

Abstract: Injection-molding processes and systems are described herein. An exemplary method involves: (a) holding one or more inserts in a desired position within a mold cavity by contacting a retractable core to at least a portion of each insert, wherein the retractable core is a feature of a mold plate; (b) while the one or more inserts are being held in the desired position by the retractable core, initiating an injection of molten plastic into the mold cavity; (c) retracting the retractable core from the one or more inserts while continuing the injection of molten plastic into the mold cavity, wherein retracting the retractable core creates additional cavity space within the mold cavity between the retractable core and the one or more inserts; and (d) continuing the injection of molten plastic into the mold cavity until the mold cavity, including the additional cavity space, is filled.

Abstract: A connector (20) is placed in a first die (50) so that an end of a wall (41) of the connector (20) closely contacts a recess (55) of the first die (50) to define a cutoff (58). The dies then are closed to define a filling space (60C) between a surface (62) of a second die (51) and an outer surface (46) of the wall (41). The outer surface (46) of the wall (41) is inclined moderately upward. Molten resin is directed into the filling space (60C) and presses the inclined outer surface (46) of the wall (41) so that an inner surface (47) of the bottom wall (41) is pressed against the recess (55) of the first die (50) and strongly held in close contact by a component of this pressing force. Thus, molten resin cannot intrude through the cutoff (58).

Abstract: Injection-molding processes and systems are described herein. An exemplary method involves: (a) holding one or more inserts in a desired position within a mold cavity by contacting a retractable core to at least a portion of each insert, wherein the retractable core is a feature of a mold plate; (b) while the one or more inserts are being held in the desired position by the retractable core, initiating an injection of molten plastic into the mold cavity; (c) retracting the retractable core from the one or more inserts while continuing the injection of molten plastic into the mold cavity, wherein retracting the retractable core creates additional cavity space within the mold cavity between the retractable core and the one or more inserts; and (d) continuing the injection of molten plastic into the mold cavity until the mold cavity, including the additional cavity space, is filled.

Abstract: A coil component having an easily discernible orientation, and a method of producing such a coil component that facilitates the injection of resin. A coil component includes a core with a winding portion, first and second flanges disposed on either end of the winding portion, and a winding accommodating region defined by the winding portion and the first and second flanges, terminal electrodes disposed on the second flange and a winding wound about the winding portion and connected to the terminal electrodes. An insulating resin is formed over the winding at the winding accommodating region. A marker made from a material the same as the insulating resin is provided at outer peripheral surface of the flanges.

Abstract: First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.