Abstract: An electrostatic clamp (12) comprising an electrode (2), a layer of resistive material (6) located on the electrode, and a layer of dielectric (8) located on the resistive material, wherein the electrostatic clamp further comprises burls (10) which project from the layer of dielectric.

Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

Abstract: A tool gripping mechanism includes a tool holder and a shaft to which the tool holder is attached. The shaft is fixed to a rotary shaft of a spindle device. A plurality of magnets are disposed in pairs on concentric circles on surfaces of the tool holder and the shaft which face each other. When the tool holder is in a specific phase with respect to the shaft, the magnets of the tool holder and the magnets of the shaft attract each other, and the tool holder is aligned with respect to the shaft in that phase.

Abstract: A plenoptic camera captures a plenoptic image of an object illuminated by a point source (preferably, collimated illumination). The plenoptic image is a sampling of the four-dimensional light field reflected from the object. The plenoptic image is made up of superpixels, each of which is made up of subpixels. Each superpixel captures light from a certain region of the object (i.e., a range of x,y spatial locations) and the subpixels within a superpixel capture light propagating within a certain range of directions (i.e., a range of u,v spatial directions). Accordingly, optical properties estimation, surface normal reconstruction, depth estimation, and three-dimensional rendering can be provided by processing only a single plenoptic image. In one approach, the plenoptic image is used to estimate the bidirectional reflectance distribution function (BRDF) of the object surface.

Abstract: A method of electrostatically clamping a dielectric wafer to a processing table during plasma processing is described. The table has interdigitated electrodes embedded therein. The method comprises applying respective voltages of opposite first and second polarities to adjacent electrodes wherein polarization charges are induced in the wafer with opposite polarity to the respective underlying electrodes thereby electrostatically clamping the wafer to the table; and, after a predetermined time (ton), reversing the polarities of the voltages so that the polarization charges and electrostatic clamping continues.

Abstract: Imprint lithography template chucks and related systems and methods are provided that substantially maintain structural support functions while significantly enhancing imprint quality functions. The chucks incorporate dynamic vacuum seals to substantially reduce template contact during alignment and distortion correction while still providing good structural support upon separation.

Abstract: A method for wafer etching in a deep silicon trench etching process includes the following steps: a. electrostatically absorbing a wafer using an electrostatic chuck, and stabilizing the atmosphere required by the process (S110); b. performing the sub-steps of a main process for the wafer, and the time for the sub-steps of the main process being shorter than the time required by the wafer main process; c. releasing the electrostatic adsorption of the electrostatic chuck on the wafer; d. determining whether the cumulative time of the sub-steps of the main process reaches a predetermined threshold or not, if so, performing the step e (S150), and if not, repeating the operations in the steps a to c (S140); and e. ending a wafer manufacturing process. The etching method avoids the wafer from continuous contact with the electrostatic chuck, reduces electrostatic accumulation on the surface of the wafer, and therefore solves the problem of resist reticulation on the surface of the wafer in the DSIE process.

Abstract: A deposition apparatus and a deposition method are disclosed. In one aspect, the deposition apparatus includes an electrostatic chuck and a tensile plate attached to and formed over the electrostatic chuck. The deposition apparatus further includes an elevation unit configured to move the tensile plate towards the substrate and a tensile unit configured to apply a tensile force to the tensile plate to expand the tensile plate.

Abstract: An electrostatic clamp (ESC) has a clamping surface, and first and second pairs of electrodes. Each of the first pair of electrodes are associated with a respective third of the clamping surface, and each of the second pair of electrodes are associated with a respective sixth of the clamping surface. A peripheral region of each of the first and second pairs of electrodes spirals toward the periphery of the clamping surface. A DC mode connects one of each of the first and second pair of electrodes to a positive and the other one of the respective first and second pair of electrodes to a negative of a power supply. An AC mode electrically connects first, second, and third phase terminals of the power supply to one of the first pair of electrodes, the other one of the first pair of electrodes, and both of the second pair of electrodes, respectively.

Abstract: An advanced coating for electrostatic chuck used in plasma processing chamber is provided. The advanced coating is formed using plasma enhanced physical vapor deposition. The coating is generally of Y2O3/Al2O3, although other material combinations can be used. Also, a multi-layered coating can be formed, such that an intermediate coating layer can be formed using standard plasma spray, and a top coating can be formed using PEPVD. The entire ESC assembly can be “packaged” by the coating.

Abstract: A method for manufacturing an alumina sintered body, according to the present invention, includes the steps of (a) obtaining a compact by putting a slurry containing an Al2O3 powder, a MgO powder, a MgF2 powder, a solvent, a dispersing agent, and a gelatinizer into a mold, gelatinizing the slurry by a chemical reaction of the gelatinizer in the mold, and causing mold release, (b) obtaining a calcined body by drying the compact, performing degreasing, and further performing calcination, and (c) obtaining a ceramic sintered body by subjecting the calcined body to hot-press firing at 1,150° C. to 1,350° C. In the step (a), the Al2O3 powder having a purity of 99.9 percent by mass or more is used and 0.1 to 0.2 parts by mass of MgO powder and 0.13 parts by mass or less of MgF2 powder relative to 100 parts by mass of Al2O3 powder are used.

Abstract: In accordance with an embodiment of the invention, there is provided an electrostatic chuck comprising an electrode, and a surface layer activated by a voltage in the electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck. The surface layer includes a plurality of protrusions extending to a height above portions of the surface layer surrounding the protrusions to support the substrate upon the protrusions during electrostatic clamping of the substrate. The protrusions are substantially equally spaced across the surface layer as measured by a center to center distance between pairs of neighboring protrusions.

Abstract: An electrostatic chuck 10 includes a disc-shaped alumina ceramic base 12, and a heater electrode 14 and an electrostatic electrode 16 that are embedded in the alumina ceramic base 12. An upper surface of the alumina ceramic base 12 functions as a wafer-receiving surface 12a. The heater electrode 14 is formed in a pattern shape, for example, in the manner of a single brush stroke so as to be arranged over the entire surface of the alumina ceramic base 12. When a voltage is applied to the heater electrode 14, the heater electrode 14 generates heat, and heats a wafer W. This heater electrode 14 contains TiSi2 as a main component.

Abstract: A method of processing a substrate using a substrate processing apparatus that has an electrostatic chuck including an insulating member inside which an electrode is included and provides a plasma process to a substrate mounted on the electrostatic chuck includes a first process of supplying a heat transfer gas having a second gas pressure to a back surface of the substrate while eliminating electric charges in the substrate using plasma of a process gas having a first gas pressure.

Abstract: Systems and methods for determining wafer bias are described. One of the methods includes detecting output of a generator to identify a generator output complex voltage and current (V&I). The generator is coupled to an impedance matching circuit and the impedance matching circuit is coupled to an electrostatic chuck (ESC). The method further includes determining from the generator output complex V&I a projected complex V&I at a point along a path between an output of a model of the impedance matching circuit and a model of the ESC. The operation of determining of the projected complex V&I is performed using a model for at least part of the path. The method includes applying the projected complex V&I as an input to a function to map the projected complex V&I to a wafer bias value at the ESC model.

Abstract: An electrostatic clamp configured to, in use, hold an article, such as a reticle or a wafer in a lithographic apparatus. The clamp includes a lower portion; an upper portion formed of a dielectric material, and a plurality of electrodes disposed between the lower portion and the upper portion. The electrodes include a first electrode configured in use to be held at a first voltage, at least one intermediate electrode configured in use to be held at a second voltage, and a ground electrode. The at least one intermediate electrode is located between the first electrode and the ground electrode and the second voltage is between the first voltage and ground to reduce the voltage across a barrier between the electrodes and so reduce the risk of high-voltage breakdown.

Abstract: A heating apparatus includes a susceptor having a heating face of heating a semiconductor and a supporting part joined with a back face of the susceptor. The susceptor comprises a ceramic material comprising magnesium, aluminum, oxygen and nitrogen as main components. The material comprises a main phase comprising magnesium-aluminum oxynitride phase exhibiting an XRD peak at least in 2?=47 to 50° by CuK? X-ray.

Abstract: An electrostatic chuck device includes an electrostatic chuck part that has an upper surface as a placement surface for placing a plate-shaped sample and has an internal electrode for electrostatic attraction built therein; and a cooling base part that cools the electrostatic chuck part. The electrostatic chuck part and the cooling base part are integrally adhered to each other via an adhesive layer. An insulator having a double pipe structure including an insulator and an insulator provided coaxially with an outer peripheral portion of the insulator is provided in a cooling gas hole, formed in the electrostatic chuck part and the cooling base part, so as to cover an exposed surface of the adhesive layer on the cooling gas hole side.

Abstract: An unseasoned substrate support assembly includes a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further includes an upper surface of the ceramic body having a first portion proximate to a center of the upper surface of the ceramic body and having a first roughness profile and a second portion distal from the center of the upper surface of the ceramic body and having a second roughness profile with a lower roughness than the first roughness profile, wherein areas of the first and second portions are based on radial distances from the center of the ceramic body.

Abstract: In a plasma processing apparatus including a processing room disposed in a vacuum vessel, a sample stage located in the processing room, a dielectric film disposed on the top surface of the sample stage and serving as the sample mounting surface of the sample stage, and a plurality of electrodes embedded in the dielectric film for chucking the sample to the dielectric film when supplied with electric power, a part of the sample is chucked by supplying electric power to at least one of the electrodes while the sample is mounted on the sample stage; the sample is heated up to a predetermined temperature; a larger part of the sample is chucked by supplying electric power to the other of the electrodes; and the processing of the sample using the plasma is initiated.

Abstract: A plasma processing method of the present disclosure includes attaching a Si-containing material or a N-containing material to an electrostatic chuck that is provided in a processing container and attached with a reaction product containing C and F, in a state where a workpiece is not mounted on the electrostatic chuck; adsorbing the workpiece by the electrostatic chuck attached with the Si-containing material or the N-containing material when the workpiece is carried into the processing container; processing the workpiece with plasma; and separating the workpiece processed with plasma from the electrostatic chuck attached with the Si-containing material or the N-containing material.

Abstract: A mask cover according to one embodiment of the present invention comprises a frame body having an opening at the center, a conductive earth plate installed on the frame body such that its end protrudes into the opening of the frame body, an earth pin provided on the end of the earth plate and electrically connected to the earth plate, and a conductive cover part surrounding the earth pin such that the tip end of the earth pin protrudes and a gap is present between the cover part and the earth pin.

Abstract: A Johnsen-Rahbek (J-R) electrostatic clamp is provided for clamping a workpiece, wherein the J-R clamp has a dielectric layer having a clamping surface associated with the workpiece and a backside surface generally opposing the clamping surface. The dielectric layer has a plurality of regions, wherein each of the plurality of regions comprises one of a plurality of dielectric materials. Each of the plurality of dielectric materials has a baseline resistivity that is different from the remainder of the plurality of dielectric materials, and each of the plurality of regions of the dielectric layer has a baseline resistivity that is different from the remainder of the plurality of regions of the dielectric layer. A plurality of electrically conductive electrodes are associated with the backside surface of the dielectric layer, wherein each of the plurality of electrically conductive electrodes are associated with one or more of the plurality of regions of the dielectric layer.

Abstract: A method of adsorbing a target object on a mounting table is provided. The mounting table is provided within a processing vessel that partitions a depressurizable space in a processing apparatus which processes a processing target object within the space. Further, the processing apparatus serves as a plasma processing apparatus. The method includes mounting the target object on an electrostatic chuck of the mounting table; and applying three AC voltages having different phases to three electrodes of the electrostatic chuck, respectively.

Abstract: An interchangeable tool for use with a hexagonal key having at least a first male end with six facets which form a hexagonal profile includes a first interchangeable tip comprising a body and a head extending from the body. The body includes a female receptacle having an opening open to an exterior of the first interchangeable tip, with the female receptacle having six facets that form a hexagonal profile. The hexagonal profile is sized and dimensioned to matingly receive the first male end of the hexagonal key, with the head having at least one tool element. Related interchangeable tool sets are also provided.

Abstract: An electrostatic chuck comprises: a dielectric substrate having a protrusion and a planar surface part. The protrusion is formed on a major surface of the dielectric substrate. An adsorption target material is mounted on the major surface. The planar surface part is formed in a periphery of the protrusion. The dielectric substrate is formed from a polycrystalline ceramics sintered body. A top face of the protrusion is a curved surface, and a first recess is formed in the top face to correspond to crystal grains that appear on the surface. The planar surface part has a flat part, and a second recess is formed in the flat part. A depth dimension of the first recess is greater than a depth dimension of the second recess. The electrostatic chuck can suppress the generation of particles and can easily recover a clean state of the electrostatic chuck surface.

Abstract: A method for assembling parts. A sealant is placed between a plurality of parts in a stack up to form a workpiece. The workpiece is clamped using a permanent magnet unit and an electromagnetic clamping device in an activated state such that a number of forces caused by a magnetic field clamps the workpiece between the electromagnetic clamping device and the permanent magnet unit. A number of holes are drilled in the workpiece. A number of fasteners are installed in the number of holes.

Abstract: A magnetic chuck comprising: a lower plate to which a conductive magnetic body for fixing one side of a warped workpiece by magnetic force is coupled; a main body made of a magnetic material and an open side of which has an accommodation groove for insertion of insulating means, the main body being fixed at the lower plate; insulating means inserted into the accommodation groove of the main body and embedded with an insulating coil and an Alnico magnet on the interior thereof, the insulating means being configured to induce a magnetic line of force to flow only through the Alnico magnet to thus provide strong fixing force for the workpiece through the magnetic chuck; and a support member arranged on an upper portion of the main body to be attached to the other side of the workpiece through the magnetic field of the Alnico magnet.

Abstract: Embodiments of the present disclosure generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present disclosure provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components.

Abstract: An adhesive layer that bonds the back surface of a plate capable of attracting a wafer and the front surface of a cooling plate together that includes a main adhesive portion, which is made of a hardened matter of a fluid adhesive, and an outer peripheral adhesive portion, gas-supply-hole adhesive portions, lift-pin-hole adhesive portions, and terminal-hole adhesive portions made of a double-faced tape. The tape portions bond the outer peripheral edge on the back surface of the plate and the outer peripheral edge on the front surface of the cooling plate together, and the outer peripheral edges of the holes on the back surface of the plate and the outer peripheral edges of these holes on the front surface of the cooling plate together.

Abstract: A thermally zoned substrate holder including a substantially cylindrical base having top and bottom surfaces configured to support a substrate. A plurality of temperature control elements are disposed within the base. An insulator thermally separates the temperature control elements. The insulator is made from an insulting material having a lower coefficient of thermal conductivity than the base (e.g., a gas- or vacuum-filled chamber).

Abstract: A support assembly includes a first functional element, a second functional element adjacent to the cooling plate, and an adhesive layer disposed between the cooling plate and the substrate. An intermediate layer is disposed between the cooling plate and the substrate. The intermediate layer has a melting temperature less than a temperature that the adhesive layer melts or decomposes at in order to provide for recycling of the support assemblycar.

Abstract: Embodiments of the present invention generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present invention provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components.

Abstract: The present invention is directed to a tool holder for use with a surgical robot. The tool holder includes, a rotor fixed to the tool shaft, and a stator fixed to the robot. The stator includes a magnet, and a bearing surface. The rotor includes a magnetic material that attaches securely to the tool shaft, such that the tool is in the center of the rotor. The rotor rotates against the bearing surface on the stator, allowing the tool to rotate about its axis. To exchange tools, the user exerts force on the tool until the holding force of the magnet is exceeded and the tool detaches from the stator. A new tool is introduced into the vicinity of the stator such that the magnet attracts the magnetic material on the rotor. The present invention eliminates the need to slide the tool through a shaft of the tool holder.

Abstract: An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.

Abstract: A scan head assembled to a scan arm for an ion implanter and a scan arm using the same are provided, wherein the scan head is capable of micro tilting a work piece and comprises a case, a shaft assembly, an electrostatic chuck, a first driving mechanism and a micro-tilt mechanism. The shaft assembly passes through a first side of the case and has a twist axis. The electrostatic chuck is fastened on a first end of the shaft assembly outside the case for holding the work piece. The first driving mechanism is disposed within the case and capable of driving the shaft assembly and the ESC to rotate about the twist axis. The micro-tilt mechanism is disposed within the case and capable of driving the shaft assembly and the ESC to tilt relative to the case.

Abstract: A connecting rod assembly is capable of pushing the work head outward to allow more of the part of the work head to be exposed out of the connecting rod assembly, making it easier for the user to pull out the work head, thus solving the problem that it is difficult to pull the work head out of the conventional connecting rod structure since the conventional connecting rod structure doesn't have any function or devices to move the work head outwards.

Abstract: A substrate mounting table includes a plate shaped member provided with a mounting surface for mounting a substrate thereon, a plurality of gas injection openings opened on the mounting surface to supply a gas toward the mounting surface, and a gas supply channel for supplying the gas through the gas injection openings; and a thermally sprayed ceramic layer covering the mounting surface. At least inner wall portions of the gas supply channel are formed in curved surface shapes, the inner wall portions facing the gas injection openings.

Abstract: A substrate holder assembly for use in a controlled spalling process is provided. The substrate holder assembly includes a base structure having a surface in which a base substrate or other work piece can be placed thereupon. A framing element is located above and spaced apart from the surface of the base structure. The framing element has a window which exposes an upper surface of the base substrate and defines an area of the upper surface of the base substrate in which another material can be applied thereto. A support structure containing at least one mechanical securing element is located on the framing element. The support structure mechanically constrains the base substrate within the substrate holder assembly. Each mechanical securing element contacts at least one surface of the support structure and, optionally, one surface of the base substrate.

Abstract: A substrate holder assembly for use in a controlled spalling process is provided. The substrate holder assembly includes a base structure having a surface in which a base substrate or other work piece can be placed thereupon. A framing element is located above and spaced apart from the surface of the base structure. The framing element has a window which exposes an upper surface of the base substrate and defines an area of the upper surface of the base substrate in which another material can be applied thereto. A support structure containing at least one mechanical securing element is located on the framing element. The support structure mechanically constrains the base substrate within the substrate holder assembly. Each mechanical securing element contacts at least one surface of the support structure and, optionally, one surface of the base substrate.

Abstract: A small outer diameter quick release extension rod is provided with elongated sheet-shaped elastic elements therein for realizing the effect of engaging with a screwdriver head. A second positioning ring in the operating element is used to press against the elastic elements to control them to be engaged in or disengaged from the screwdriver head. The small outer diameter quick release extension rod is easy to operate and has a relatively small outer diameter, not only reducing the structure weight and energy loss, but also enhancing the flexibility of use.

Abstract: A tool connecting rod of the present invention includes a barrel and a rod. A resilient unit and a retainer are disposed between the barrel and the rod. Both of an inner wall of the barrel and a body portion of a pushing member are formed with at least two stepped recesses respectively. As such, the structure of the tool connecting rod is simple so that a tool bit assembles on and detaches from the present invention rapidly.

Abstract: Provided is a member for semiconductor manufacturing device which hardly causes component contamination and is capable of sufficiently reducing generation of particles in a semiconductor manufacturing device. A spray coating is formed by spraying a ceramic onto a mounting member of a transfer arm, and laser beam is irradiated to the spray coating to remelt and resolidify the ceramic composition for modification to thereby form a high-strength ceramic layer made from a ceramic recrystallized material and having a net-like crack, whereby particles dropped out from the mounting member due to external factors in a semiconductor manufacturing device are reduced to an extent not affecting a semiconductor manufacturing process.

Abstract: A substrate heat exchange pedestal comprises: (i) a support structure having a contact surface comprising a coating of a diamond-like material, and (ii) a heat exchanger in the support structure, the heat exchanger capable of heating or cooling a substrate.

Abstract: An electromagnetic clamping system contains a housing, numerous permanent magnets, numerous low friction surfaces having a number of wheels, an end effector, an electromagnetic clamping device, first, second, and third coil systems, and a core. The end effector performs operations on a workpiece. The electromagnetic clamping device has an activated state and a deactivated state. The electromagnetic clamping device further includes a first coil system generating a first magnetic field causing normal forces on the permanent magnet unit and the clamping device; a second coil system generating a second magnetic field causing side forces on the permanent magnet unit; and a third coil system generating a third magnetic field causing a rotational force on the permanent magnet unit. The core provides access to the workpiece surface for performing operations thereon; and concentrates forces from a number of magnetic fields on the core surface contacting the workpiece surface.

Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus.

Abstract: A mounting table includes a base and an electrostatic chuck provided on the base. The base has first and second top surface on which the electrostatic chuck and a focus ring are respectively provided. The second top surface is provided below the first top surface. A coolant path in the base has central and peripheral paths extending below the first and second top surfaces, respectively. The peripheral path has a portion extending along a side surface toward the first top surface. The mounting surface has central and peripheral regions. The mounting surface has protrusions formed in a dot shape. The protrusions are formed such that a contact area between the protrusions of the peripheral region and the backside of an object per unit area becomes greater than a contact area between the protrusions of the central region and the backside of the object per unit area.

Abstract: An unseasoned substrate support assembly includes a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further includes an upper surface of the ceramic body having a first portion proximate to a center of the upper surface of the ceramic body and having a first roughness profile and a second portion distal from the center of the upper surface of the ceramic body and having a second roughness profile with a lower roughness than the first roughness profile, wherein areas of the first and second portions are based on radial distances from the center of the ceramic body.

Abstract: A mounting table includes an electrostatic chuck having a mounting surface and a backside opposite to the mounting surface, a first through hole being formed in the mounting table; a base joined to the backside of the electrostatic chuck and having a second through hole in communication with the first through hole; a lifter pin which is received in a pin hole formed by the first through hole and the second through hole, the lifter pin being movable up and down to protrude beyond and retract below the mounting surface. An upper end portion of the lifter pin has a shape in which a diameter decreases toward a lower end of the lifter pin to correspond to a shape of the upper end portion of the pin hole. The upper end portion of the lifter pin is in surface contact with the upper end portion of the pin hole.

Abstract: A coupling module may include an upper portion that defines an aperture, mask contact elements, chuck contact elements and an intermediate element that is connected between the mask contact elements and the upper portion. A shape and a size of the aperture may correspond to a shape and size of a pattern transfer area of an extreme ultra violet (EUVL) mask. The coupling module may be shaped and sized so that once the mask contact elements contact the upper portion of the EUVL mask, the chuck contact elements contact a chuck that supports the mask. The coupling module may further provide at least one conductive path between the upper portion of the EUVL mask and the chuck when the EUVL mask is positioned on the chuck.