Abstract: A moil guide having a sleeve that has an opening adapted to receive at least a portion of a linerbolt. The moil guide also has a magnetic attachment device attached to the sleeve. The magnetic attachment device is operable to selectively generate a magnetic field. The magnetic attachment device is operable to selectively generate the magnetic field to removably attach the moil guide to a metal surface.

Abstract: Embodiments of electrostatic chucks are provided herein. In some embodiments, an electrostatic chuck may include a body having a notched upper peripheral edge, defined by a first surface perpendicular to a body sidewall and a stepped second surface disposed between the first surface and a body upper surface, and a plurality of holes disposed through the body along the first surface; a plurality of fasteners disposed through the plurality of holes to couple the body to a base disposed beneath the body; a dielectric member disposed above the body upper surface to electrostatically retain a substrate; an insulator ring disposed about the body within the notched upper peripheral edge and having a stepped inner sidewall that mates with the stepped second surface to define a non-linear interface therebetween; and an edge ring disposed over the insulator ring, the non-linear interface limiting arcing between the edge ring and the fastener.

Abstract: A portable electrostatic chuck carrier includes a holder having a dielectric top surface, and bipolar electrodes under the dielectric top surface. The bipolar electrodes includes positive electrodes and negative electrodes electrically insulated from the positive electrodes. The positive electrodes and the negative electrodes are allocated in an alternating pattern in a plane substantially parallel to the dielectric top surface.

Abstract: An electrostatic chuck device which enables to perform a plasma process having high in-plane uniformity to a plane-like sample by improving the in-plane uniformity of the electric field intensity in a plasma when applied to a plasma processing apparatus. Specifically disclosed is an electrostatic chuck device (21) including an electrostatic chuck section (22), a metal base section (23) serving as a high-frequency generating electrode, and an insulating plate (24). The electrostatic chuck section (22) is composed of a dielectric plate (31) whose top surface (31a) serves as a mounting surface on which a plate-like sample (W) is placed, a supporting plate (32), an electrostatic-adsorption inner electrode (25), and an insulating layer (33). The electrostatic-adsorption inner electrode (25) is made of a composite sintered body containing an insulating ceramic and silicon carbide, while having a volumetric resistance of not less than 1.0×10?1 ?cm but not more than 1.0×108 ?cm.

Abstract: There is provided a substrate support device capable of preventing powder dust from being produced. A thermoconductive intermediate member is interposed between a base table and a substrate support table and has a communication aperture path for communicating the aperture path of the base table with the aperture path of the substrate support table. An elastic member such as bellows tube is disposed in the communication aperture path of the thermoconductive intermediate member, for insulating the thermoconductive intermediate member from the inert gas which flows through the communication aperture path.

Abstract: A coating method for an internal member of a vacuum processing apparatus is provided. The method includes a process (A) of filling small holes 78 of the internal member 81 with padding plugs 20 each of which has a core member 22 made from a metal material and a metal-resin composite layer 24 covering the circumferential surface of the core member 22, a process (B) of forming the ceramic coating film 80 on the surface of the internal member 81 by plasma spraying after the process (A), and a process (C) of extracting the padding plugs 20 after the process (B). This coating method solves various problems in filling the holes with the pudding plugs, so that a coating film superior in quality and performance can be produced effectively.

Abstract: An electrostatic chuck for receiving a substrate in a substrate processing chamber comprises a ceramic puck having a substrate receiving surface and an opposing backside surface with a plurality of spaced apart mesas. An electrode is embedded in the ceramic puck to generate an electrostatic force to hold a substrate. Heater coils located at peripheral and central portions of the ceramic puck allow independent control of temperatures of the central and peripheral portions of the ceramic puck. The chuck is supported by a base having a groove with retained air. The chuck and base can also have an overlying edge ring and clamp ring.

Abstract: An apparatus for increasing electric conductivity to a wafer substrate when exposures to electron beam irradiation is disclosed. More specifically, a more free mechanical contact between a wafer and electric contact pins (within an electrostatic chuck) is provided to significantly reduce the scratch and damage on the wafer backside.

Abstract: Wafer contamination is prevented, while preventing damage to a high-frequency electrode and a susceptor. A main body 41 of the susceptor 40 of an MMT apparatus is composed of a heater arranging plate 42, an electrode arranging plate 48, and a supporting plate 56 all made from quartz. A circular electrode arranging hole 49 with a fixed depth is concentrically formed on the upper surface of the electrode arranging plate 48, and quadrangular pillars 50 are formed protruding in a matrix on the bottom of the electrode arranging hole 49. Multiple insertion holes 52 are formed in a disk-shaped high-frequency electrode 51, and the high-frequency electrode 51 is installed in the electrode arranging hole 49 by inserting each pillar 50 into each insertion hole 52. The gaps Sa and Sb are provided between the high-frequency electrode 51 and the electrode arranging plate 48. The pillar 50 boosts the strength of the electrode arranging plate 48.

Abstract: A thin film deposition apparatus and an organic light-emitting display device by using the same. The thin film deposition apparatus includes an electrostatic chuck, a plurality of chambers; at least one thin film deposition assembly; a carrier; a first power source plug; and a second power source plug. The electrostatic chuck includes a body having a supporting surface that contacts a substrate to support the substrate, wherein the substrate is a deposition target; an electrode embedded into the body and applying an electrostatic force to the supporting surface; and a plurality of power source holes formed to expose the electrode and formed at different locations on the body.

Abstract: A corrosion-resistant member includes a ceramic member containing yttrium oxide as a main component, containing cerium element, and obtained by firing under a nonoxidizing atmosphere. The corrosion-resistant member that has high corrosion-resistant characteristics and includes a ceramic member having a low volume resistivity can be provided.

Abstract: A bit mounting device includes a holder that may be mounted to a spindle of the power tool or may be a part of the spindle. A bit push member is disposed within a bit receiving hole that is formed in the holder for receiving a tool bit. The movement of the operation member is transmitted to the bit push member via a transmission mechanism, so that the tool bit is pushed in a removing direction from the bit receiving hole by the bit push member.

Abstract: A quick-release bit adapter includes a body having first and second ends spaced along a longitudinal axis. The body includes a driving hole extending from the first end towards the second end along the longitudinal axis. The body further includes a sliding groove in communication with the driving hole and intermediate the driving hole and the second end along the longitudinal axis. A through-hole extends from an outer periphery of the first end through the sliding groove. A bit received in the driving hole abuts and is stopped by at least one protrusion extending inward from an inner periphery of the driving hole towards the longitudinal axis. A magnetic device is slideably received in the sliding groove and controllable by a user through the through-hole to slide along the longitudinal axis between two positions to engage with or disengage from the bit.

Abstract: Embodiments of the present invention generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present invention provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components.

Abstract: A detection circuit is provided for a power supply for an electrostatic chuck generating a trapezoidal waveform with approximately flat tops and minimal dead-time between phase reversals. The detection circuit includes an amplifying circuit which receives inputs from a secondary winding of a transformer of the power supply and produces an amplified buffered signal. A chucking detect circuit receives the signal from the amplifying circuit and is configured to produce a first signal indicative of a substrate on the electrostatic chuck and a second signal indicative of an electrostatic chuck without a substrate. A chucking quality circuit receives the signal from the amplifying circuit and produces a signal indicative of a quality of the chucking of the substrate. A movement detection circuit receives the signal from the amplifying circuit and produces a signal indicative of movement of the substrate on the electrostatic chuck.

Abstract: An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.

Abstract: A reconfigurable system is described that can optimize the performance of the system. Substrates can be detached, levitated, moved, dropped and reattached as desired by the use of Coulomb forces generate between Coulomb islands. Thus, a system using a first set of substrates for a given frequency range can be exchanged with a second set of substrates operable at a different frequency range by the use of Coulomb forces. Making this exchange in an RF system can improve the selectivity and decrease the power dissipation of the system. One of the exchanges can involve inductor to shift the frequency of oscillation, for example. A control unit can be used to control the movement and replacement of all substrates. The formation of minimal energy potentials of Coulomb forces are determined to move a substrate over an underlying substrate.

Abstract: A hand-held power tool with a quick-clamping device for a working element includes a working mandrel for driving the working element, a fastening member for fastening the working element onto the end of the working mandrel, and a locking assembly. The fastening member includes a clamping shaft insertable into the working mandrel and a moving assembly for making the fastening member moveable between a releasing position and a clamping position. The locking assembly includes a floatable clamping component and the clamping component and the clamping shaft are provided with corresponding toothed portions such that engagement and disengagement therebetween is selectively achieved by the relative rotation of the toothed portions.

Abstract: A plasma processing apparatus including a mounting table that includes a mounting table body having a temperature adjusted to be a predetermined level, and an electrostatic chuck disposed on an upper portion of the mounting table body, joined thereto with an acrylic adhesive having a thickness of 60 ?m or more, to adsorb the substrate thereon. The apparatus further including first and second heat transfer gas diffusion regions formed at a center and a circumferential edge, respectively, of an upper surface of the electrostatic chuck, and first and second heat transfer gas supply units to supply heat transfer gas to the first and second heat transfer gas diffusion regions, respectively. A volume ratio of the second heat transfer gas diffusion region to the first heat transfer gas diffusion region is equal to or less than 0.

Abstract: A thin film deposition apparatus and an organic light-emitting display device by using the same. The thin film deposition apparatus includes an electrostatic chuck, an a plurality of chambers; at least one thin film deposition assembly; a carrier; a first power source plug; and a second power source plug. The electrostatic chuck includes a body having a supporting surface that contacts a substrate to support the substrate, wherein the substrate is a deposition target; an electrode embedded into the body and applying an electrostatic force to the supporting surface; and a plurality of power source holes formed to expose the electrode and formed at different locations on the body. The plurality of chambers are maintained in a vacuum state. The at least one thin film deposition assembly is located in at least one of the plurality of chambers, is separated from the substrate by a predetermined distance, and is used to form a thin film on the substrate supported by the electrostatic chuck.

Abstract: An electrostatic chuck with a heater includes: a base formed of a sintered body containing alumina; an ESC electrode provided in an upper portion side in the base; and a resistance heating body embedded in a lower portion side in the base. The base is composed of a dielectric layer from the ESC electrode to an upper surface of the base, and of a support member from the ESC electrode to a lower surface of the base. In the support member, a carbon content differs between an ESC electrode neighborhood in contact with the dielectric layer and a lower region below the ESC electrode neighborhood, a carbon content in the dielectric layer is 100 wt ppm or less, the carbon content in the ESC electrode neighborhood is 0.13 wt % or less, the carbon content in the lower region is 0.03 wt % or more and 0.5 wt % or less, and the carbon content in the ESC electrode neighborhood is smaller than the carbon content in the lower region. The resistance heating body contains niobium or platinum.

Abstract: An electrostatic holding apparatus is configured to electrostatically hold objects (W1, W2) to be held by applying a predetermined high voltage to a plurality of electrode groups (112a, 112b) as a holding part. A high-voltage generating part or high voltage generating source (114) to convert from a low voltage to a predetermined high voltage necessary to hold the objects electrostatically is disposed on each of electrode modules (110). The high-voltage generating part (114) is hermetically closed or sealed. The high-voltage generating part may include a voltage amplifying circuit. The high-voltage generating part may include a battery and a voltage amplifying circuit.

Abstract: A plasma processing apparatus and a focus ring enables to perform uniform plasma processing over the entire surface of a substrate to be processed to thereby improve in-surface uniformity of plasma processing compared with conventional cases. The focus ring is disposed on a susceptor 2, which serves to mount thereon a semiconductor wafer W and further functions as a lower electrode, to surround a periphery of the semiconductor wafer W. The focus ring 6 includes a ring member of a thin plate shape disposed to surround the periphery of the wafer W while maintaining a gap therebetween and a lower ring body installed below the semiconductor wafer and the ring member of the thin plate shape.

Abstract: An adapter (9) for a motor-driven machine tool with a tool to be rotatably driven has positive-fit counterpart pieces (10) on one face (16) which are adapted to positive-fit elements (3) of the tool shaft (1). Multiple axially protruding mandrels (11) are arranged along the circumference on the opposite face (13).

Abstract: A pedestal assembly and method for controlling temperature of a substrate during processing is provided. In one embodiment, the pedestal assembly includes an electrostatic chuck coupled to a metallic base. The electrostatic chuck includes at least one chucking electrode and metallic base includes at least two fluidly isolated conduit loops disposed therein. In another embodiment, the pedestal assembly includes a support member that is coupled to a base by a material layer. The material layer has at least two regions having different coefficients of thermal conductivity. In another embodiment, the support member is an electrostatic chuck. In further embodiments, a pedestal assembly has channels formed between the base and support member for providing cooling gas in proximity to the material layer to further control heat transfer between the support member and the base, thereby controlling the temperature profile of a substrate disposed on the support member.

Abstract: A triaxial rod assembly for providing both RF power and DC voltage to a chuck assembly that supports a workpiece in a processing chamber during a manufacturing operation. In embodiments, a rod assembly includes a center conductor to be coupled to a chuck electrode for providing DC voltage to clamp a workpiece. Concentrically surrounding the center conductor is an annular RF transmission line to be coupled to an RF powered base to provide RF power to the chuck assembly. An insulator is disposed between the center conductor and RF transmission line. Concentrically surrounding the RF transmission line is a ground plane conductor coupled to a grounded base of the chuck to provide a reference voltage relative to the DC voltage. An insulator is disposed between the RF transmission line and the ground plane conductor.

Abstract: The present invention includes methods and apparatus for repairing an electrical connection between bipolar electrodes contained within an electrostatic chuck and a conductive mask disposed atop the electrostatic chuck, known as a balancing circuit. Embodiments of the invention are particularly useful after removal of an electrostatic chuck for refurbishment.

Abstract: An adhesive layer 30 that bonds the back surface of the plate 12 capable of attracting a wafer W and the front surface of a cooling plate 20 together includes a main adhesive portion 31, which is made of a hardened matter of a fluid adhesive, and an outer peripheral adhesive portion 32, gas-supply-hole adhesive portions 33, lift-pin-hole adhesive portions 34, and terminal-hole adhesive portions 35 and 36 made of a double-faced tape. The portion 32 bonds the outer peripheral edge on the back surface of the plate 12 and the outer peripheral edge on the front surface of the cooling plate 20 together. The portions 33, 34, 35 and 36 bond the outer peripheral edges of the holes 23, 24, 25 and 26 on the back surface of the plate 12 and the outer peripheral edges of these holes on the front surface of the cooling plate 20 together.

Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.

Abstract: The present invention generally provides a high efficiency electrostatic chuck for holding a substrate in a processing volume. The high efficiency electrostatic chuck includes an electrode embedded within a high-purity, thermoplastic member. In particular, the high-purity, thermoplastic member may include a high-purity, polyaryletherketone having an extremely low level of metallic ions present therein. The high-purity, polyaryletherketone has excellent wear resistance, high temperature resistance, plasma resistance, corrosive chemical resistance, electrical stability, and strength as compared to polyimide films used in electrostatic chucks. The present invention also provides a simplified method of manufacturing the high efficiency electrostatic chuck.

Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.

Abstract: The fluid delivery mechanism of the present disclosure provides a solution for use in a single axis of motion that allows the connection of one or more fluid flow paths over a wide range of temperatures into a vacuum environment. The mechanism does not employ flexible tubing that is prone to fatigue, especially at very low temperatures. In one embodiment, a tube is axially moved within a sealed piston to allow for fluid delivery. In a second embodiment, bellows are used to provide the required functionality. In another embodiment, it is possible to achieve movement in two or more axis of motion by utilizing two or more appropriately configured mechanisms.

Abstract: An electrostatic chuck featuring a chuck support structure, and a plurality of discrete electrostatic components. Each of the electrostatic components features at least one termination attached to an electrode on an electrically insulating material. At least some of the discrete electrostatic components are removably attached to the chuck support structure or to a substrate that is interposed between said chuck support structure and the electrostatic components.

Abstract: A tool connector generally includes a tool receiving portion configured for reciprocating between first and second work tool seating positions, wherein the tool receiving portion is normally biased to the first work tool seating position, and actuatable to the second work tool seating position. The tool connector further includes a magnetic mechanism in the tool receiving portion for providing magnetic force to engage a work tool in either of the first and second work tool seating positions, and a locking mechanism for lockingly engaging a work tool in the second work tool seating position.

Abstract: The present invention is directed to a magnetic indexing device that can be connected to a conveyor, the device firmly holding a golf ball in a particular orientation for the purposes of printing of indicia and logo on the ball when device and ball move along the conveyor. The device includes a stationary base portion and a rotating cup portion which are magnetically coupled to each other. Each portion has recesses for housing magnets to create a magnetic field of attraction which firmly locks the two portions together. When rotation of the cup portion to the base portion is required, the rotation is substantially friction-free because of a thrust bearing ring set in the base portion. The cup portion is caused to rotate 45° or 90° upon being biasly urged by station locks located on the conveyor.

Abstract: A Coulombic electrostatic chuck is disclosed which includes a substrate, a conductive layer overlying the substrate, and an arc elimination layer overlying the conductive layer. The electrostatic chuck further includes a high-k dielectric layer overlying the arc elimination layer, wherein the high-k dielectric layer has a dielectric constant of not less than about 10 and a resistivity of not less than about 1011 Ohm-cm.

Abstract: Provided is a two-sided attraction structure that can be used repeatedly with remarkable ease, thereby being free from the problem of material wasting or the like, is free from the problem of energy, and can be employed for various uses including an exhibition/information apparatus and a dust collecting apparatus.

Abstract: A coupling device includes a body having an end for coupling with a handle. The body includes a compartment having a receiving space for receiving an object such as a bit. The receiving space includes a slanted face extending longitudinally outward and radially inward. A follower is slidably mounted in the compartment and includes an outer end having a restraining hole. A positioning member extends from a radially outer side through the restraining hole to a radially inner side of the follower and is slidable along the slanted face. The follower is biased outward by an elastic element toward the receiving space when the object is inserted into the receiving space and moves the follower longitudinally inward. A radial clamping force is imparted from the slanted face through the positioning member to securely clamp the object in the receiving space.

Abstract: A power supply is provided for an electrostatic chuck. A signal generating circuit of the power supply is configured to generate a square wave signal. An amplifying circuit is electrically connected to the square wave circuit and configured to amplify the square wave signal. A transformer has a primary and a secondary winding. The primary winding is electrically connected to the amplifying circuit and the secondary winding is configured to be electrically connected to the electrostatic chuck. The secondary winding produces a signal for the electrostatic chuck. A voltage divider circuit is electrically connected to the secondary winding and to the amplifying circuit. The voltage divider circuit is configured to reduce the voltage of the signal for the electrostatic chuck and feed back the reduced voltage signal to the amplifying circuit. The signal from the secondary winding is a trapezoidal waveform with approximately flat tops and minimal dead-time between phase reversals.

Abstract: The electrostatic chuck includes a base including an aluminum nitride-containing member; a dielectric layer formed on the base including a member having a volume resistivity of at least 1×1015 ?·cm at a temperature range of about 25° C. to about 300° C. and including 2 to 5% by mass of yttrium oxide, 2 to 5% by mass of ytterbium oxide, and a balance of aluminum nitride based on the total mass of the dielectric layer; and an electrode embedded under the dielectric layer so as to be positioned between the dielectric layer and the base, configured to generate an electrostatic absorption force.

Abstract: A method of tuning the thermal conductivity of an electrostatic chuck (ESC) support assembly comprises measuring the temperature at a plurality of sites on a support assembly surface in which each site is associated with a given cell, determining from the measurements any fractional reduction in area suggested for each cell, and removing material from the support assembly surface within each cell in accordance with the suggested fractional reduction in order to decrease thermal conductivity in that cell. The material removal can result in an improvement to the equilibrium temperature uniformity of the electrostatic chuck support assembly at the chuck surface of an electrostatic chuck bonded to the support assembly surface, or can result in an equilibrium temperature profile of the ESC support assembly which approaches or achieves a target equilibrium temperature profile.

Abstract: An electrostatic chuck electrode sheet which allows the difference in capacitance between electrodes due to the presence or absence of a substrate to be increased to a level which can be accurately detected using a known substrate detection device, and allows an electrostatic chuck to exhibit an excellent attraction force, and an electrostatic chuck using the electrode sheet, are disclosed.

Abstract: A process and apparatus for centering accurately and speedy a workpiece on a magnet chuck mounted on a work spindle. A pair of action pads spaced away from one another comes into engagement with the workpiece attracted to the work spindle, thereby performing the centering operation. The action pads are mounted on a support plate that can freely turn on a fulcrum. As the fulcrum makes head towards a rotational center of the magnet chuck, the action pads comes into abutment in a rocking manner against the workpiece that is held at off-center relation in the chuck, thereby compensating the off-center relation to keep a center of the workpiece in alignment with the rotational center of the chuck.

Abstract: A substrate processing apparatus includes a heat transfer gas supply mechanism to supply a heat transfer gas through a supply passage into a portion between a worktable and a substrate to improve thermal conductivity between therebetween. Under the control of a control section, the pressure inside the supply passage is measured to obtain a pressure measurement value while the substrate is placed on the worktable. Then, a preparatory flow rate of the heat transfer gas to be supplied through the supply passage into the portion between the worktable and substrate is determined, in accordance with the pressure difference between the pressure measurement value and a pressure reference value, prior to a main process to be performed on the substrate. Then, the heat transfer gas is supplied through the supply passage into the portion between the worktable and substrate at the preparatory flow rate, prior to the main process.

Abstract: A plasma processing apparatus and a focus ring enables to perform uniform plasma processing over the entire surface of a substrate to be processed to thereby improve in-surface uniformity of plasma processing compared with conventional cases. The focus ring is disposed on a susceptor 2, which serves to mount thereon a semiconductor wafer W and further functions as a lower electrode, to surround a periphery of the semiconductor wafer W. The focus ring 6 includes a ring member of a thin plate shape disposed to surround the periphery of the wafer W while maintaining a gap therebetween and a lower ring body installed below the semiconductor wafer and the ring member of the thin plate shape.

Abstract: Processing equipment for an object to be processed is provided with a process container, the internal of which can be evacuated, a gas introducing means for introducing a prescribed gas into the process container, a supporting table provided in the process container, a ring-shaped supporting part provided on the supporting table for supporting the object to be processed, a plurality of thermoelectric conversion elements provided on an upper plane of the supporting table on an inner side of the supporting part, an element storing space evacuating means for evacuating inside the element storing space formed by a lower plane of the object to be treated, which is supported by the supporting part, an upper plane of the supporting table and the supporting part.

Abstract: A tubular electrode (215) and a tubular magnet (216) are installed on an external section of a processing furnace (202) for an MMT device. A susceptor (217) for holding a wafer (200) is installed inside a processing chamber (201) of the processing furnace. A gate valve (244) for conveying the wafer into and out of the processing chamber; and a shower head (236) for spraying processing gas in a shower onto the wafer, are installed inside the processing furnace. A high frequency electrode (2) and a heater (3) are installed inside the susceptor (217) with a clearance between them and the walls forming the space. The clearances formed between the walls forming the space in the susceptor and the high frequency electrode and the heater prevent damage to the high frequency electrode and the heater even if a thermal expansion differential occurs between the high frequency electrode, the heater and the susceptor.

Abstract: Substrate support apparatus and methods are disclosed. Motion of a substrate chuck relative to a stage mirror may be dynamically compensated by sensing a displacement of the substrate chuck relative to the stage mirror and coupling a signal proportional to the displacement in one or more feedback loops with Z stage actuators and/or XY stage actuators coupled to the stage mirror. Alternatively, a substrate support apparatus may include a Z stage plate a stage mirror, one or more actuators attached to the Z stage plate, and a substrate chuck mounted to the stage mirror with constraints on six degrees of freedom of movement of the substrate chuck. The actuators impart movement to the Z stage in a Z direction as the Z stage plate is scanned in a plane perpendicular to the Z direction. The actuators may include force flexures having a base portion attached to the Z stage plate and a cantilever portion extending in a lateral direction from the base portion.

Abstract: A substrate supportingstructure (50) for semiconductor processing, comprising a mounting table (51) for placing a processed substrate (W) disposed in a processing chamber (20), wherein temperature control spaces (507) for storing the fluid used as a heat exchange medium are formed in the mounting table (51), a conductive transmission path (502) is disposed to lead a high frequency power to the mounting table (51), and flow channels (505, 506) feeding or discharging the heat exchange medium fluid to or from the temperature control spaces (507) are formed in the transmission path (502).

Abstract: This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.