Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.

Abstract: Compliant monopolar and bipolar micro device transfer head arrays and methods of formation from SOI substrates are described. In an embodiment, an array of compliant transfer heads are formed over a base substrate and deflectable toward the base substrate, and a patterned metal layer includes a metal interconnect layer electrically connected with an array of the metal electrodes in the array of compliant transfer heads.

Abstract: A substrate support assembly comprises a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further comprises a protective layer metal bonded to an upper surface of the ceramic body, wherein the protective layer is a bulk sintered ceramic article.

Abstract: An electrostatic chuck is provided which is arranged that, at the time of performing processing treatments of irradiating light to a to-be-processed substrate while holding the translucent to-be-processed substrate, the to-be-processed substrate can surely be held even in case the attraction force lowers due to photoelectric effect. An electrostatic chuck has a chuck plate made of a dielectric material, and a first electrode and a second electrode, both electrodes being disposed in the chuck plate. A voltage is applied between the first and the second electrodes to thereby attract the to-be-processed substrate S to the surface of the chuck plate. The electrostatic chuck has, on part of the surface of the chuck plate, a substrate holding section 64 which is made of an adhesive sheet and the like having an adhesive force with respect to the to-be-processed substrate.

Abstract: A quick-release bit adapter includes a body having first and second ends spaced along a longitudinal axis. The body includes a driving hole extending from the first end towards the second end along the longitudinal axis. The body further includes a sliding groove in communication with the driving hole and intermediate the driving hole and the second end along the longitudinal axis. A through-hole extends from an outer periphery of the first end through the sliding groove. A bit received in the driving hole abuts and is stopped by at least one protrusion extending inward from an inner periphery of the driving hole towards the longitudinal axis. A magnetic device is slideably received in the sliding groove and controllable by a user through the through-hole to slide along the longitudinal axis between two positions to engage with or disengage from the bit.

Abstract: A dielectric layer for an electrostatic chuck is formed of a ceramic material having a first phase including aluminum oxide and a second phase including composite carbonitride (Ti, Me)(C, N) that contains titanium as fine grains. The Me represents a transition element and metals of Group 4 to Group 6 such as Mo and W. The ceramic material that includes the second phase by 0.05 vol % to 2.5 vol % has a volume resistivity value of about 108 to 1013 (?·cm) necessary for a Johnsen-Rahbek type electrostatic chuck.

Abstract: Methods for bonding substrates, forming assemblies using the same, along with improved methods for refurbishing said assemblies are disclosed that take advantage of at least one channel formed in an adhesive utilized to join two substrates to improve fabrication, performance and refurbishment of the assemblies. In one embodiment an assembly includes a first substrate secured to a second substrate by an adhesive layer. The assembly includes a channel having at least one side bounded by the adhesive layer and having an outlet exposed to an exterior of the assembly.

Abstract: In a plasma processing apparatus, thrust-up pins are elevated and a thrust-up force is detected when electrostatic attraction for a substrate by a substrate holding device is ceased after completion of plasma processing, the elevation of the thrust-up pins is ceased upon detection of a detection threshold, and a stepped elevating operation in which the elevation and stoppage of the thrust-up pins are repeated a plurality of times are thereafter commenced on condition that the detected thrust-up force falls to or below the detection threshold and that release of the substrate from a placement surface has not been completed. In the stepped elevating operation, operation timing of the thrust-up device is controlled so that the completion of the release of the substrate from the placement surface is detected when the thrust-up pins are stopped after being elevated and so that the stepped elevating operation is continued on condition that the release has not been completed.

Abstract: A wafer support device is provided. The wafer support device includes a plurality of support portions; and a bottom area located among the support portions, wherein the bottom area has a protective layer formed thereon. A method for processing a working surface of a wafer support device is also provided.

Abstract: An electrostatic chuck device includes an electrostatic chuck section (2), which has a principal surface that is a mounting surface on which a plate-like sample (W) is placed, and has an internal electrode for electrostatic adsorption (13) incorporated in the section, and a temperature adjustment base section (3) which adjusts the temperature of the electrostatic chuck section (2); wherein a part or all of a surface of the temperature adjustment base section (3) is covered by a sheet-like or film-like insulating material (4) wherein the surface faces the side where the electrostatic chuck section is located; a thin plate-like heater element (5) is bonded on the insulating material (4); and the electrostatic chuck section (2) and the temperature adjustment base section (3) are integrated with each other via an organic insulating adhesive layer (6) formed by curing a liquid adhesive.

Abstract: An electrostatic chuck device (1) according to the invention includes an electrostatic chuck section (2) that has a principal surface as a placement surface on which a plate-shaped sample is placed, and is made to have an internal electrode for electrostatic adsorption built-in, and a cooling plate section (3) that cools the electrostatic chuck section (2), wherein a heating member (5) is bonded to a principal surface on the opposite side to the placement surface of the electrostatic chuck section (2) through a first adhesive material layer (4), and the electrostatic chuck section (2) and the heating member (5) are bonded to and integrated with the cooling plate section (3) through an acrylic adhesive layer (9) having flexibility and insulation properties.

Abstract: An alumina sintered body contains alumina as a main component and titanium. The alumina sintered body further contains at least one element selected from the group consisting of lanthanum, neodymium, and cerium. Aluminum is contained in the alumina sintered body in an amount such that a ratio of aluminum oxide to total oxides in the alumina sintered body becomes 93.00 to 99.85% by weight where the total oxides are defined as a total amount of all oxides contained in the alumina sintered body. Titanium is contained in an amount such that a ratio of titanium oxide to the total oxides becomes 0.10 to 2.00% by weight. Lanthanum, neodymium, and cerium are contained in a combined amount such that a ratio of the combined amount to the total oxides becomes 0.05 to 5.00% by weight. Volume resistivity is 1×105 to 1×1012 ?·cm at room temperature.

Abstract: Provided is a positioning apparatus including: a reference member that is serving as a reference for positioning; a support part that supports the reference member; and a first fixing member provided on the support part that fixes the reference member and the support part or releases the fixing. The reference member is connected to the support part in a movable state and fixed to the support part by the first fixing member after a position is determined. The reference member of the positioning apparatus is precisely installed to a reference position.

Abstract: An electrostatic chuck has a structure in which a heater is sandwiched between a base member and an electrostatic chuck substrate, the heater being bonded to the base member with an adhesive layer interposing therebetween. The adhesive layer interposing between the heater and the base member has a structure in which a first adhesive layer and a second adhesive layer are stacked, the first adhesive layer being formed by curing an adhesive having high thermal conductivity, the second adhesive layer being formed as gel by curing an adhesive having lower viscosity than the adhesive of the first adhesive layer. Preferably, the first and second adhesive layers are both made of a silicone-based resin.

Abstract: A substrate mounting table and a plasma etching apparatus can supply a power to a temperature controlling heater electrode effectively while preventing atmosphere from being leaked and preventing processing uniformity in a surface of a substrate from being deteriorated. The substrate mounting table and the plasma etching apparatus include an insulating member having therein an electrostatic chuck electrode and a temperature controlling heater electrode; a plate-shaped temperature controlling member having therein a temperature controlling medium path through which a temperature controlling medium is circulated; a cylindrical member made of an insulating material and provided within a through hole formed in the plate-shaped temperature controlling member; and a lead line, provided within the cylindrical member, having one end connected to the temperature controlling heater electrode and the other end connected to a connecting terminal provided at a bottom surface side of the cylindrical member.

Abstract: An electrostatic chuck of a stack structure includes a metal layer interposed between insulating layers and a groove formed at a peripheral portion of the electrostatic chuck to have a thickness gradually increasing toward an outside, the groove being covered with a thermally sprayed insulating film. The thermally sprayed film covers at least a portion of the metal layer exposed at an inside of the groove such that the thermally sprayed film does not protrude from the groove.

Abstract: A substrate temperature control fixing apparatus comprises an electrostatic chuck which includes a base body and adsorbs and holds an adsorbing target mounted on one of surfaces of the base body, a base plate which supports the electrostatic chuck, and a bank portion provided on an outer periphery of one of surfaces of the base plate which is opposed to the other of the surfaces of the base body.

Abstract: A scan head assembled to a scan arm for an ion implanter and a scan arm using the same are provided, wherein the scan head is capable of micro tilting a work piece and comprises a case, a shaft assembly, an electrostatic chuck, a first driving mechanism and a micro-tilt mechanism. The shaft assembly passes through a first side of the case and has a twist axis. The electrostatic chuck is fastened on a first end of the shaft assembly outside the case for holding the work piece. The first driving mechanism is disposed within the case and capable of driving the shaft assembly and the ESC to rotate about the twist axis. The micro-tilt mechanism is disposed within the case and capable of driving the shaft assembly and the ESC to tilt relative to the case.

Abstract: A driving device includes a driving shank, a magnetic member mounted in the driving shank, a stop ring secured in the driving shank to stop the magnetic member, and an elastic member biased between the driving shank and the magnetic member. The driving shank has a first end provided with a mounting post and a second end formed with a mounting hole and a receiving chamber. The stop ring has an inner wall formed with a through hole and an outer wall provided with a toothed portion engaging a peripheral wall of the receiving chamber. The magnetic member has a peripheral wall formed with a stop flange that is movable to abut the stop ring. Thus, the elastic member provides a buffering effect to the magnetic member to reduce the pressure applied on the magnetic member.

Abstract: A bonding structure according to the present invention includes: a ceramic member including a hole; a terminal embedded in the ceramic member and including an exposed surface exposed to a bottom portion of the hole; a brazed bond layer formed in contact with the exposed surface of the terminal; and a connecting member inserted in the hole, and bonded to the terminal via the brazed bond layer. An inner diameter of the hole is larger than an outer diameter of the connecting member. A clearance is formed between the hole and the connecting member when the connecting member is inserted in the hole. A braze pool space is formed in a surface of the hole and has a substantially semicircular shape in a cross-sectional plane. The braze pool space is partially filled with a braze material.

Abstract: A disclosed device for use with an electrostatic chuck configured to hold a substrate in a plasma environment comprises an edge ring configured to be placed either in contact with portions of only a ceramic top piece, a base plate, or coupled to the base plate through a plurality of pins and pin slots. The edge ring is further configured to be concentric with the ceramic top piece. In one embodiment, the edge ring includes an inner edge having an edge step arranged to provide mechanical coupling between the edge ring and the outer periphery of the ceramic top piece. The edge ring further includes an outer edge and a flat portion located between the inner edge and the outer edge. The flat portion is arranged to be both horizontal when the edge ring is placed around the outer periphery of the ceramic top piece and parallel to the substrate.

Abstract: Apparatus for processing substrates are provided herein. In some embodiments, an apparatus for processing a substrate may include a substrate support comprising a first electrode disposed within the substrate support and having a peripheral edge and a first surface; a substrate support surface disposed above the first surface of the first electrode; and a second electrode disposed within the substrate support and extending radially beyond the peripheral edge of the first electrode, wherein the second electrode has a second surface disposed about and above the first surface of the first electrode.

Abstract: A right angle attachment for use with a power tool that includes a housing having a handle portion and a gear case attached to the handle portion and supporting first and second right angle gears wherein the first right angle gear is driven by an input shaft that is connected to the drill and the second right angle gear has an opening therein for receiving a hex bit directly therein. A floating magnet head can surround the hex bit to aid in fastener retention and can be movable out of proximity of the hex bit to facilitate easy removal of the hex bit for replacement. An additional magnet can be disposed within the gear case at the base of the hex bit in order to magnetize the hex bit and further enhance the retention of the fastener therein.

Abstract: A wafer supporting structure for improving the critical dimension uniformity of a wafer, including: a chuck, a plurality of pin holes, and a platform positioned under the chuck. The chick has a surface and configured to receive a wafer thereon, the plurality of pin holes form through the chuck, and the platform comprises a plurality of movable pieces which support corresponding pins, wherein the pins are configured to move in a direction perpendicularly protruding from or sinking into the surface of the chuck. The movable piece has one end supporting the bottom of the pin and the other end subjected to an pneumatic pressure, hydraulic pressure, or piezoelectricity.

Abstract: A clockable device for use with an electrostatic chuck configured to hold a substrate in a plasma environment is disclosed. The clockable device comprises a first portion of the electrostatic chuck having at least one face with variable thermal contact areas located thereon. A second portion of the electrostatic chuck has at least one face with variable thermal contact areas located thereon. The at least one face of the second portion is configured to be placed in thermal contact with the at least one face of the first portion to control a thermal gradient across a face of the substrate.

Abstract: Systems and methods are presented for a peripheral RF feed and symmetric RF return for symmetric RF delivery. According to one embodiment, a chuck assembly for plasma processing is provided. The chuck assembly includes an electrostatic chuck having a substrate support surface on a first side, a facility plate coupled to the electrostatic chuck on a second side that is opposite the substrate support surface, a peripheral RF feed configured to deliver RF power, the peripheral RF feed having a first portion contacting a periphery of the facility plate and an RF strap coupling the peripheral RF feed to an RF source.

Abstract: A protective chuck is magnetically levitated on a substrate with a gas layer between the bottom surface of the protective chuck and the substrate surface. The gas layer protects a surface region of the substrate against a fluid layer covering the remaining of the substrate surface without contacting the substrate, reducing or eliminating potential damage to the substrate surface. The magnetically levitated protective chuck can enable combinatorial processing of a substrate, providing multiple isolated processing regions on a single substrate with different material and processing conditions.

Abstract: A power input mechanism includes a first stationary conductive member, a second stationary conductive member, a stationary insulating member which is fixed to a housing and insulates the first stationary conductive member and the second stationary conductive member from each other, a first rotary conductive member, a second rotary conductive member, a rotary insulating member which is fixed to a support column and insulates the first rotary conductive member and the second rotary conductive member from each other, a first power input member which supplies a first voltage to a substrate holder via the first rotary conductive member and the first stationary conductive member, and a second power input member which supplies a second voltage to the substrate holder via the second rotary conductive member and the second stationary conductive member.

Abstract: An electrostatic chuck comprises a ceramic dielectric body having an electrode formed on a surface of the ceramic dielectric body; a ceramic substrate supporting the ceramic dielectric body; and a first bonding agent bonding the ceramic dielectric body to the ceramic substrate. The first bonding agent has a first major agent including an organic material, a first amorphous filler including an inorganic material, and a first spherical filler including an inorganic material. The first amorphous filler and the first spherical filler are dispersion-compounded in the first major agent. The first major agent, the first amorphous filler, and the first spherical filler are made of an electrically insulating material. An average diameter of the first spherical filler is greater than a maximum value of a minor axis of all of the first amorphous filler. A thickness of the first bonding agent is equal to or greater than the average diameter of the first spherical filler.

Abstract: To form an electrostatic chuck, a bonding sheet is applied onto the upper surface of a cooling plate and then the cooling plate is placed in a vacuum dryer at a pressure of 2,000 Pa or less for a pre-bake treatment at 120° C. to 130° C. for 15 to 40 hours, followed by natural cooling. A plate is then stacked on the bonding sheet so that the lower surface of the plate is aligned with the upper surface of the bonding sheet, which is applied onto the cooling plate. The resulting stacked body is placed in a heat-resistant resin bag, and is then placed in an autoclave and treated together for several hours under pressure and heat.

Abstract: The present invention relates to a bonding structure, including: a ceramic member including a hole; a terminal embedded in the ceramic member, an exposed surface exposed to a bottom portion of the hole, and made of a refractory metal having a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the ceramic member; a brazed bond layer including a first tantalum layer in contact with the exposed surface of the terminal, a gold layer formed on the first tantalum layer, and a second tantalum layer formed on the gold layer; and a connecting member inserted in the hole, bonded to the terminal via the brazed bond layer, and made of a refractory metal having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the ceramic member.

Abstract: An adapter is provided for a motor-driven machine tool which includes a tool driven in an oscillating rotational pendulum motion. The machine tool includes a driveable tool shaft (1), the end face of which is designed as a locating flange (2) having at least one form-fit element (3) for receiving and fastening the tool (5). The adapter (9) includes, on an end face (16), form-fit counter elements (10) which are matched to the form-fit elements (3) of the tool shaft (1). A plurality of axially projecting mandrels (11) is distributed around the circumference on the opposite end face (13) of the adapter (9).

Abstract: A system is disclosed for the rapid change of heads in operating machines, such as equipment for the cut and/or decoration of passe-partout, or of items made of cardboard, glass, ceramic or the like. A system according to the present invention couples the head of the machine with a machine arm through a connecting element that contains one or more magnets. Said magnets retain the head connected to the connecting device by attraction, but also allow the head to be easily removed with just one hand.

Abstract: A chuck includes a body having an engaging groove for releasably receiving a bit. A sleeve is mounted around and movable relative to the body along a longitudinal axis of the body between a coupling position in which the bit is retained in the engaging groove and a releasing position allowing removal or insertion of the bit. The sleeve further includes an engaging section that slideably abuts a coupling section of the body. The engaging section is engaged with the coupling section to allow joint rotation of the body and the sleeve about the longitudinal axis. The sleeve further includes a flange with a frictional outer periphery to provide friction when the sleeve is manually rotated about the longitudinal axis by rotating the frictional outer periphery. Furthermore, the flange can be gripped by a user to move the sleeve to the releasing position.

Abstract: An electrostatic chuck comprises: a ceramic plate provided with recesses on a major surface and provided with an electrode in an inner part of the ceramic plate; a temperature regulating plate bonded to the major surface of the ceramic plate; a first bonding agent provided between the ceramic plate and the temperature regulating plate; and a heater provided in the each of the recesses of the ceramic plate. The first bonding agent has a first major agent including an organic material, a first amorphous filler including an inorganic material, and a first spherical filler including an inorganic material. The first amorphous filler and the first spherical filler are dispersion-compounded into the first major agent. The first major agent, the first amorphous filler, and the first spherical filler are made of an electrically insulating material. An average diameter of the first spherical filler is greater than a maximum value of a minor axis of the first amorphous filler.

Abstract: An electrostatic chuck includes: a ceramic substrate; a ceramic dielectric body provided on a top side of the ceramic substrate and having a first major surface where a processing target substrate is to be mounted; and an electrode provided between the ceramic substrate and the ceramic dielectric body. A material of the ceramic dielectric body is a ceramic sintered body. A plurality of protrusions and a groove for supplying a gas are provided on the first major surface of the ceramic dielectric body. A through hole is provided in a bottom face of the groove, the through hole penetrating to a second major surface of the ceramic substrate on a side opposite to the first major surface. A distance between the electrode and the groove is greater than or equal to a distance between the electrode and the first major surface.

Abstract: To provide a technique which cleans an attracting face of a mechanism for electrostatically attracting an object to be processed inside a vacuum processing apparatus and keeps its attracting force constant. The method of the present invention is for cleaning an attracting face of a hot plate which holds the object to be processed inside a vacuum processing chamber through electrostatic attraction. The invention method includes a step of cleaning the attracting face of the hot plate by applying a high-frequency electric power of 13.56 MHz to a metallic base arranged under and near the hot plate in a state in which a cleaning gas is introduced into the vacuum processing chamber.

Abstract: Embodiments of electrostatic chucks for substrate processing are provided herein. In some embodiments, an electrostatic chuck may include a puck for supporting a substrate, the puck formed from a dielectric material and having a chucking electrode disposed within the puck proximate a support surface of the puck to electrostatically retain the substrate when disposed on the puck; a base having a ring extending from the base to support the puck; and a spacer disposed between the base and the puck to support the puck above the base such that a gap is formed between the puck and the base, wherein the spacer supports the puck proximate a peripheral edge of the puck.

Abstract: An electrostatic chuck includes (a) a cooling device serving as an RF electrode, including a gas supply port penetrating through the cooling device, the gas supply port extending from one main surface to the other main surface, and a main counter bore portion having a diameter larger than that of the gas supply port, the main counter bore portion provided in an opening of the gas supply port; (b) an arc prevention member buried in the main counter bore portion and made of an insulating member, wherein a gas path is provided, the gas path is configured to communicate with the gas supply port; and (c) an electrostatic chuck body arranged on the cooling device, defining a work mounting surface on a top surface of the electrostatic chuck body, provided with a pore in communication with the gas supply port via the gas path.

Abstract: A wafer pedestal of a semiconductor apparatus is provided. The wafer pedestal is capable of supporting a substrate. The wafer pedestal includes a pedestal having at least one purge opening configured to flow a purge gas and at least one chucking opening configured to chuck the substrate over the pedestal. The pedestal includes a sealing band disposed between the at least one purge opening and the at least one chucking opening. The sealing band is configured to support the substrate.

Abstract: The present invention provides an electrostatic chuck apparatus including: an electrostatic chuck section having one main surface that is a mounting surface on which a plate specimen is mounted, and being equipped with an electrostatic adsorbing internal electrode; and a temperature adjusting base section that adjusts the electrostatic chuck section to a desired temperature, wherein a heating member is bonded to a main surface of the electrostatic chuck section, which is opposite to the mounting surface, via an adhesive material, the whole or a part of the main surface of the temperature adjusting base section, which is on the side of the electrostatic chuck section, is covered with a sheet-like or film-like insulating material, and the electrostatic chuck section bonded with the heating member and the temperature adjusting base section covered with the sheet-like or the film-like insulating material are bonded and integrated via an insulating organic adhesive layer formed by curing a liquid adhesive.

Abstract: The present invention includes methods and apparatus for repairing an electrical connection between bipolar electrodes contained within an electrostatic chuck and a conductive mask disposed atop the electrostatic chuck, known as a balancing circuit. Embodiments of the invention are particularly useful after removal of an electrostatic chuck for refurbishment.

Abstract: An electrostatic chuck for receiving a substrate in a substrate processing chamber comprises a ceramic puck having a substrate receiving surface having a plurality of spaced apart mesas, an opposing backside surface, and central and peripheral portions. A plurality of heat transfer gas conduits traverse the ceramic puck and terminate in ports on the substrate receiving surface to provide heat transfer gas to the substrate receiving surface. An electrode is embedded in the ceramic puck to generate an electrostatic force to retain a substrate placed on the substrate receiving surface. A plurality of heater coils are also embedded in the ceramic puck, the heaters being radially spaced apart and concentric to one another.

Abstract: A punch down tool, a receiver for a punch down tool, and a work end adapter for a punch down tool, for terminating electrical conductors and turning fasteners, are disclosed. The work end adapter is adapted to receive standard tool bits and standard finned shaft tips. The punch down tool is adapted to receive standard blades and to receive the work end adapter. When installed in the punch down tool, the work end adapter rotates only with the punch down tool, and will not rotate independently of the punch down tool. The punch down tool has an impact mechanism and a lock-out button to prevent the tool's impact mechanism from operating.

Abstract: An adjusting magnetism shelter of a cutter holder has a stationary collar, a sliding assembly and a cap. The stationary collar has a disk and multiple sliding recesses. A first hole is defined in the disk. The sliding recesses are defined in the disk. The sliding assembly has multiple sliding bars. Each sliding bar is mounted in a sliding recess and has a magnetism bar and a moving shaft. The magnetism bar has a reflection surface. The moving shaft protrudes from each sliding bar. The cap covers the stationary collar and has a top board. The top board has multiple arc grooves. Each arc groove has an inner end and an outer end. The inner end of the arc groove is near the first hole. The outer end of the arc groove is far away from the first hole and is inserted into one of the moving shafts.

Abstract: According to one embodiment, an electrostatic chuck includes: a ceramic dielectric substrate, an electrode, and a conductive member. The ceramic dielectric substrate has a first major surface on which a material to be adsorbed is to be mounted and a second major surface on a side opposite the first major surface. The electrode is interposed between the first major surface and the second major surface of the ceramic dielectric substrate. The conductive member is provided in a recess formed in the second major surface of the ceramic dielectric substrate. A tip end of the recess has a curved surface.

Abstract: A method for producing an electrostatic chuck includes the steps of (a) placing a ceramic slurry in a molding die, the ceramic slurry containing a ceramic powder, a solvent, a dispersing agent, and a gelling agent, gelatinizing the ceramic slurry in the molding die, and removing the molding die to obtain first and second ceramic molded bodies; (b) drying, debinding, and calcining the first and second molded bodies to obtain first and second ceramic calcined bodies; (c) printing an electrostatic electrode paste on a surface of one of the first and second ceramic calcined bodies to form an electrostatic electrode while assuming the first ceramic calcined body is to form a dielectric layer of an electrostatic chuck; and (d) superposing the first and second ceramic calcined bodies on each other to sandwich the electrostatic electrode and subjecting the first and second calcined bodies to hot-press firing.

Abstract: An electrode assembly of a plasma processing apparatus that enables damage to an electrode plate to be prevented, and enables an increase in the number of parts to be prevented, so that the ability to carry out maintenance can be easily maintained. An upper electrode assembly has an upper electrode plate, a cooling plate (C/P) and a spacer interposed between the upper electrode plate and the C/P. The upper electrode plate has therein electrode plate gas-passing holes that penetrate through the upper electrode plate. The C/P has therein C/P gas-passing holes that penetrate through the C/P. The spacer has therein spacer gas-passing holes that penetrate through the spacer. The electrode plate gas-passing holes, the C/P gas-passing holes and the spacer gas-passing holes are not disposed collinearly.

Abstract: A ceramic electrostatic chuck according to the present invention includes a dielectric layer with a support layer in contact with the back side of the dielectric layer, and an embedded electrostatic electrode. A wafer is placed on the dielectric layer and the dielectric layer is formed of sintered aluminum nitride containing Sm and has a volume resistivity in the range of 4×109 to 4×1010 ?cm at room temperature. The support layer is formed of sintered aluminum nitride containing Sm and Ce and has a volume resistivity of 1×1013 ?cm or more at room temperature.

Abstract: The invention describes a hand power tool with a drive spindle and an integrated tool holder. The drive spindle can be connected to the tool holder in a rotationally fixed and undetachable manner, and the tool holder has at least one magnet. The drive spindle is connected to the tool holder such that at least one first section of the drive spindle is permanently connected to the tool holder and at least one second section of the drive spindle is present which is at least as long as the first section.