Abstract: A piezoelectric actuator includes a substrate, a first electrode arranged on the substrate, a piezoelectric body stacked on the first electrode, a second electrode superimposed on a surface of the piezoelectric body on a side opposite to the first electrode, and a wiring connected to the first electrode. The first electrode has a connecting portion which is arranged to protrude from an end portion of the piezoelectric body and to which the wiring is connected, and a first conductive portion is provided so that the first conductive portion overlaps with the first electrode while extending over from an area overlapped with the end portion of the piezoelectric body up to the connecting portion of the first electrode.

Abstract: A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.

Abstract: A method of measuring the amount of corrosion of a target material caused exposure to a fluid, over a period of time, utilizing a corrosion measuring device, including a resonator having a first surface area made of a material having a corrosion profile like that of the target material and having a second surface area made of material having a corrosion profile unlike that of the target material; and a transducer assembly, positioned to drive the resonator and sense resultant resonator motion, thereby producing a sense signal. In the method, the resonator is exposed to the target fluid over the period of time and the sense signal is analyzed over the period of time to determine changes in how the resonator responds to being driven by the transducer assembly, over time.

Abstract: An improved electroacoustic transducer with an improved mode profile is provided. The transducer comprises a velocity profile with a periodic structure and an edge structure flanking the periodic structure. The velocity profile also allows to suppress the SH wave mode.

Abstract: A filter package comprising an array of piezoelectric films sandwiched between lower electrodes and an array of upper electrodes covered by an array of silicon membranes with cavities thereover: the lower electrode being coupled to an interposer with a first cavity between the lower electrodes and the interposer; the array of silicon membranes having a known thickness and attached over the upper electrodes with an array of upper cavities, each upper cavity between a silicon membrane of the array and a common silicon cover; each upper cavity aligned with a piezoelectric film, an upper electrode and silicon membrane, the upper cavities having side walls comprising SiO2; the individual piezoelectric films, their upper electrodes and silicon membranes thereover being separated from adjacent piezoelectric films, upper electrodes and silicon membranes by a passivation material.

Abstract: A method of fabricating a micro electrical-mechanical system (MEMS) microphone on a substrate includes forming a sacrificial layer on a front surface of the substrate, forming a membrane within the sacrificial layer, forming a fixed plate on the sacrificial layer at a location corresponding to a location of the membrane, performing a laser cutting on the back surface of the substrate at a location corresponding to an edge region of the fixed plate until a surface of the sacrificial layer is expose to form an opening, forming a patterned photoresist layer on the back surface exposing a region within the boundary of the opening, removing a portion of the back surface using the patterned photoresist layer as a mask to form a cavity, and removing a portion of the sacrificial layer above and below the membrane to form an air gap between the membrane and the fixed plate.

Abstract: A filter package comprising an array of piezoelectric films sandwiched between an array of upper electrodes and lower electrodes: the individual piezoelectric films and the upper electrodes being separated by a passivation material; the lower electrode being coupled to an interposer with a first cavity between the lower electrodes and the interposer; the filter package further comprising a silicon wafer of known thickness attached over the upper electrodes with an array of upper cavities between the silicon wafer and a silicon cover; each upper cavity aligned with a piezoelectric film in the array of piezoelectric films, the upper cavities having side walls comprising the passivation material.

Abstract: A method include forming a plurality of layers of an oxide and a metal on a substrate. For example, the layers may include a metal layer sandwiched between silicon oxide layers. A non-conductive structure such as glass is then bonded to one of the oxide layers. An antenna can then be patterned on the non-conductive structure, and a cavity can be created in the substrate. Another metal layer is deposited on the surface of the cavity, and an iris is patterned in the metal layer to expose the one of the oxide layers. Another metal layer is formed on a second substrate and the two substrates are bonded together to thereby seal the cavity.

Abstract: An inkjet printing head 1 includes a pressure chamber (cavity) 5, a movable film 10A defining a top surface portion of the pressure chamber 5, and a piezoelectric element 9 disposed above the movable film 10A. The piezoelectric element 9 includes a lower electrode 11 formed above the movable film 10A, a piezoelectric film 12 formed above the lower electrode 11, and an upper electrode 13 formed above the piezoelectric film 12. One end portion of an upper wiring 17 is connected to an upper surface of the upper electrode 13. The upper wiring 17 extends from above the upper electrode 13, crosses an outer edge of the pressure chamber 5, and extends outside the pressure chamber 5. The piezoelectric film 12 has an active portion 12A with an upper surface in contact with a lower surface of the upper electrode 13 and an inactive portion 12B extending along a lower surface of the upper wiring 17 from one end portion of the active portion 12A to outside the pressure chamber 5.

Abstract: A bulk acoustic wave resonator and a filter in which partial thicknesses of protection layers or reflection layers thereof are differently formed are provided. The bulk acoustic wave resonator includes a bulk acoustic wave resonating part comprising a piezoelectric layer, and a reflection layer configured to reflect waves of a resonance frequency generated by the piezoelectric layer based on a signal applied to the bulk acoustic wave resonating part. A thickness of a portion of the reflection layer is different from a thickness of a remaining portion thereof.

Abstract: A surface acoustic wave (SAW) resonator includes a piezoelectric layer disposed over a substrate, and a plurality of electrodes disposed over the first surface of the piezoelectric layer. A layer is disposed between the substrate and the piezoelectric layer. A surface of the layer has a smoothness sufficient to foster atomic bonding between layer and the piezoelectric layer. A plurality of features provided on a surface of the substrate reflects acoustic waves and reduce the incidence of spurious modes in the piezoelectric layer.

Abstract: A resin film, in which at least one of polyimide layers is a non-thermoplastic polyimide layer having a linear thermal expansion coefficient of 1×10?6 to 30×10?6 (1/K), is shown. The non-thermoplastic polyimide layer is composed of a polyimide which is produced by reacting an anhydride component containing an aromatic tetracarboxylic anhydride with a diamine component, wherein the diamine component contains both a dimer acid-type diamine produced by replacing each of two terminal carboxyl groups in a dimer acid with a primary aminomethyl or amino group and an aromatic diamine, and the dimer acid-type diamine is contained in an amount of 1 to 15 mol % relative to the whole diamine component.

Abstract: A method is provided for fabricating piezoelectric plates. A sacrificial layer is formed overlying a growth substrate. A template layer, with openings exposing sacrificial layer surfaces, is formed over the sacrificial layer. An adhesion layer/first electrode stack is selectively deposited in the openings overlying the sacrificial layer surfaces, and a piezoelectric material formed in the openings overlying the stack. Then, a second electrode is formed overlying the piezoelectric material. Using the second electrode as a hardmask, the piezoelectric material is etched to form polygon-shaped structures, such as disks, attached to the sacrificial layer surfaces. After removing the template layer and annealing, the polygon-shaped structures are separated from the sacrificial layer. With the proper choice of growth substrate material, the annealing can be performed at a relatively high temperature.

Abstract: A method of treating fluids, including for recovery of water apart from impurities or undesired matter, utilizes application of shock waves to the fluids.

Abstract: A BAW device includes a substrate and a piezoelectric element formed on a surface of the substrate. The substrate has a plurality of elastic wave diffusing regions disposed therein for diffusing an elastic wave, the elastic wave diffusing regions being formed by modifying the inside of the substrate with a laser beam.

Abstract: A SAW device (1) comprises a substrate (3); SAW elements (10) on a first main surface (3a) of the substrate (3); first lines (intermediate lines (29) and output side lines (31)) that are disposed upon the first main face (3a) and connected to the SAW elements (10); an insulator (21) that is layered upon the first lines; second lines (a second ground line (33b) and a third ground line (33c)) that are layered upon the insulator (21) and configure three-dimensional wiring parts (39) with the first lines; and a cover (5) that seals the SAW elements (10) and the three-dimensional wiring parts (39). Wiring spaces (53), formed between the first main face (3a) and the cover (5), houses the three-dimensional wiring parts (39), without housing the SAW elements (10).

Abstract: A ladder-type elastic wave filter includes an input terminal, an output terminal, and a ground terminal, a first series resonator and a second series resonator connected in series between the input terminal and the output terminal, and a first parallel resonator having a first terminal electrically connected to the series connection between the first series resonator and the second series resonator and a second terminal electrically connected to the ground terminal. A resonance frequency of the first parallel resonator is higher than a resonance frequency of both of the first series resonator and the second series resonator and lower than an antiresonance frequency of both of the first series resonator and the second series resonator.

Abstract: A circuit interconnect generally comprises an electrical connection pad, a shape memory material, and a flowable conductor. The electrical connection pad has an upper surface, a portion of which is covered by the shape memory material. The flowable conductor extends through the shape memory material and is electrically coupled to the electrical connection pad. The shape memory material has a first configuration at a first temperature and a second configuration at a second temperature. In the instance of the second temperature being greater than the first, the shape memory material has a first configuration that is substantially planar and a second configuration that is cupped.

Abstract: A control panel for a vehicle includes a flexible trim element, a rigid supporting member, a piezoelectric sensor arranged between the trim element and the supporting member, and a flexible element arranged between the piezoelectric sensor and the rigid supporting member.

Abstract: Preparation of a slip including more than 4% and less than 50% of ceramic particles and including more than 1% of orientable ceramic particles made of a material including an oriented function, as volume percentage on the basis of the set of ceramic particles, wherein the fraction of non-orientable ceramic particles has a median length less than ten times the median length of the orientable ceramic particles if the set of ceramic particles includes less than 80%, as volume percentage, of orientable ceramic particles, oriented freezing of the slip by movement of a solidification front at a speed less than the speed of encapsulation of the ceramic particles; elimination of the crystals of solidified liquid phase of said block, optionally, sintering.

Abstract: A surface acoustic wave (SAW) resonator includes a piezoelectric layer disposed over a substrate, and a plurality of electrodes disposed over the first surface of the piezoelectric layer. A layer is disposed between the substrate and the piezoelectric layer. A surface of the layer has a smoothness sufficient to foster atomic bonding between layer and the piezoelectric layer. A plurality of features provided on a surface of the substrate reflects acoustic waves and reduce the incidence of spurious modes in the piezoelectric layer.

Abstract: This touch-sensitive sensor includes a layer of piezoelectric material interposed between, on the one hand, first and second electrically-conductive elements and, on the other hand, at least one third conductive element including a surface opposite at least one of the first and second conductors.

Abstract: A semiconductor device connection structure includes: a semiconductor element having a plate shape and including an external connection electrode on a surface of the semiconductor element; a support member which is stacked on the semiconductor element to be adhered to the semiconductor element and of which adhesion surface has a column shape that is substantially same as that of the semiconductor element, a thickness of the support member in a stacking direction being larger than that of the semiconductor element; and a flexible board configured to be electrically connected to the external connection electrode. The flexible board is arranged on a side surface of the semiconductor element and on a side surface of the support member and is adhered only to the side surface of the support member with an adhesive.

Abstract: There are provided an acoustic generator, an acoustic generation apparatus, a portable terminal and an electronic apparatus, which have an improved sound quality. An acoustic generator includes a piezoelectric element having a piezoelectric body; and a vibration plate joined to the piezoelectric body via a joining material, distances between the vibration plate and the piezoelectric body being different. Since this configuration achieves a clear and sharp sound quality, and has an effect of increasing sound pressure, the acoustic generator having an improved sound quality can be achieved.

Abstract: An electromechanical transducer element includes an electromechanical transducer film formed of PZT, wherein Ti/(Zr+Ti) in the electromechanical transducer film is greater than or equal to 45% and less than or equal to 55%, and wherein, when a total of peak intensity values obtained by ?-2? measurement is set to be 1, for an orientation ratio of a (100) plane orientation calculated based on a ratio of the peak intensity value of each orientation, ??(100) is less than or equal to 5%, wherein ??(100) is a gradient with respect to the (100) plane orientation in an array direction, and the ratio of each peak intensity value of each orientation is represented by ?(hkl)=I(hkl)/?I(hkl), where ?(hkl) is a degree of orientation in an (hkl) plane orientation, I(hkl) is the peak intensity value of the orientation, and ?I(hkl) is the total of the peak intensity values.

Abstract: An electrostatic capacitance transducer includes: multiple elements each having a cell including a first electrode, and a vibrating film including a second electrode, formed across a gap from the first electrode; a first flexible printed circuit having multiple first lines; and a second flexible printed circuit having multiple second lines. Part of the multiple elements are grouped into a first element group, each one thereof being electrically connected to a different one of the first lines. Part of the multiple elements other than the first element group are grouped into a second element group, each one thereof being electrically connected to a different one of the second lines. The intervals between adjacent lines in at least part of the plurality of first and second lines are wider at an opposite side from a connection side where the lines have been connected to the multiple elements, than at the connection side.

Abstract: A new connector with effective shielding function. The new connector includes conductive shielding, a connector body and a set of terminals. The connector body is provided with a cavity within which the set of terminals can be accommodated and is made from plastic cement; the set of terminals are located within the cavity of the connector body. The conductive shielding can be inserted between the connector body and the set of terminals, and specifically includes several shielding bars and conductive areas; the shielding bars are made from metal, and the conductive areas, which are embedded in the shielding bars and connected with the ends of the set of terminals, are made from conductive plastic cement.

Abstract: Flextensional transducers and methods of using flextensional transducers. The transducer includes a piezoelectric element and may include at least one endcap coupled with the piezoelectric element. The endcap may have an outer portion formed of a first material and an inner portion formed of a second material having a greater flexibility than the first material. The endcap may be coupled with an annular piezoelectric element near either its outer circumference or its inner circumference. The piezoelectric element may be a planar disk or have a curved bowl-shape. The transducer may be coupled with, and at least partially restrained by, a support structure. The transducer may also be configured to permit light to pass therethrough.

Abstract: A crystal unit includes: a crystal blank; an excitation electrode formed on the crystal blank and excites a main vibration of the crystal blank; a housing that accommodates the crystal blank; and a sub-vibration electrode formed on the housing and excites a sub-vibration of the crystal blank. And a method for inspecting a crystal unit, the method includes: generating a sub-vibration in a crystal blank by applying an input signal to a sub-vibration electrode formed on a housing, which accommodates the crystal blank, via external electrodes which are electrically coupled to the sub-vibration electrode and formed on the outer surface of the housing; obtaining an output of the crystal unit via the external electrodes; obtaining frequency characteristics of impedance between the external electrodes based on the output; and comparing the obtained frequency characteristics with the reference frequency characteristics indicating the quality of the crystal unit.

Abstract: A temperature-controlled integrated circuit configured with a secure data processing element, and method of manufacture of same, is disclosed. Specifically, the temperature-controlled integrated circuit, comprising a secure data processing element operable within a nominal operating range, is configured with a heat-transfer element which allows the secure data processing element to operate in an extended operating range.

Abstract: An element is arranged to cooperate with another part so as to form an encapsulation device for a component including the element at least partially coated with a metallization. The metallization includes at least one metal layer protected by an intermetallic compound which is coated by a non-diffused portion of a material whose melting point is lower than 250° C. A method of fabricating the encapsulation device is also disclosed.

Abstract: A piezoelectric film element includes a substrate, and a piezoelectric film including an alkali niobate-based perovskite structure expressed in a composition formula (K1-xNax)NbO3 (0.4?x?0.7) formed on the substrate, the piezoelectric film including an etching cross section including a tapered inclined portion which is enlarged toward an outside. The inclined portion includes a slope angle made by a slope connecting an upper surface edge and a bottom surface edge of the piezoelectric film and a bottom surface of the piezoelectric film, and the slope angle is not greater than 70°.

Abstract: The invention relates to a measuring device for measuring mechanical stresses or vibrations occurring in a component, wherein the measuring device comprises at least one electromechanical transducer, which can be integrated in a force-locked manner into the component, and at least one electronic unit, which is connected to the transducer via signal lines and is used to record and process the signals delivered by the transducer. In order to improve the robustness of the arrangement, it is provided according to the invention that the electronic unit is at least partially surrounded by a housing, and wherein a compensation zone for absorbing relative movements between the housing and the electronic unit is provided between the housing and the electronic unit.

Abstract: Provided is a method for manufacturing a surface acoustic wave apparatus that can reduce degradation of electric characteristics and also reduce the number of manufacturing processes. The method for manufacturing a surface acoustic wave apparatus includes the steps of: forming an IDT electrode on an upper surface of a piezoelectric substrate, forming a frame member surrounding a formation area in which the IDT electrode is formed on the piezoelectric substrate, and mounting a film-shaped lid member on the upper surface of the frame member so as to be joined to the frame member so that a protective cover, used for covering the formation area and for providing a tightly-closed space between it and the formation area, is formed.

Abstract: A pressure sensor includes a socket portion and a nut portion which are integrally molded with resin, a screw portion which is tightly fixed to a side wall of an opening in a concave part of the nut portion by adhesive, and a sense element which is fixed to the screw portion and is disposed in the concave part of the nut portion. The socket portion, the nut portion and the screw portion constitute a package. A through hole introducing the pressure measurement target liquid is formed in the screw portion. An external lead-out terminal is fixed to the sense element. The external lead-out terminal passes through the through hole on a base of the concave part of the nut portion, and is tightly fixed to the socket portion with adhesive. The external lead-out terminal is a connection terminal to be connected with external wiring.

Abstract: A method of producing a ceramic component includes a) providing a main body having internal electrodes, outer edges of which are located on at least one first outer surface of the main body, b) contacting the first outer surface of the main body with a composition including an electrophoretically mobile insulating material and electrophoretically depositing the insulating material on outer edges of the internal electrodes on the first outer surface of the main body, and c) producing an insulating layer from the insulating material on the outer edges of the internal electrodes.

Abstract: A spectral camera includes a wavelength variable interference filter, an imaging unit having a plurality of light receiving elements arranged in a two-dimensional array configuration, and a wavelength acquisition unit which acquires center wavelengths of light beams received by the light receiving elements in accordance with signal values output from the light receiving elements when reference light is received by the imaging unit. Light amounts of the reference light corresponding to different wavelength components in a certain wavelength range are uniform in a plane, and different signal values are acquired when light beams of the different wavelength components are received by the light receiving elements.

Abstract: An acoustic resonator comprises a first electrode, a second electrode and a piezoelectric layer disposed between the first electrode and the second electrode, and comprising a C-axis having an orientation. A polarization-determining seed layer (PDSL) is disposed beneath the piezoelectric layer, the seed layer comprising a metal-nonmetal compound. A method of fabricating a piezoelectric layer over a substrate comprises forming a first layer of a polarization determining seed layer (PDSL) over the substrate. The method further comprises forming a second layer of the PDSL over the first layer. The method further comprises forming a first layer of a piezoelectric material over the second layer of the PDSL; and forming a second layer of the piezoelectric material over the first layer of the piezoelectric material. The piezoelectric material comprises a compression axis (C-axis) oriented along a first direction.

Abstract: Electrical and mechanical noise in a microelectromechanical system (MEMS) pressure sensor are reduced by the symmetrical distribution of bond pads, conductive vias and interconnects and by the elimination of bond wires used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC). The bond wires are eliminated by using conductive vias to connect an ASIC to a MEMS pressure sensing element. Extraneous electrical noise is suppressed by conductive rings that surround output signal bond pads and a conductive loop that surrounds the conductive rings and bond pads. The conductive rings and loop are connected to a fixed voltage or ground potential.

Abstract: A resonance apparatus that processes an electrical loss using a conductive material and a method of manufacturing the resonance apparatus are provided. The resonance apparatus includes a lower electrode formed at a predetermined distance from a substrate, and a piezoelectric layer formed on the lower electrode. The resonance apparatus further includes an upper electrode formed on the piezoelectric layer, and a conductive layer formed on the upper electrode or the lower electrode.

Abstract: A package for an optical semiconductor device includes an eyelet, a signal lead inserted in a through hole formed in the eyelet, and sealing glass sealing the signal lead in the through hole. The signal lead includes a first portion, a second portion and a third portion that are greater in diameter than the first portion and on opposite sides of the first portion, a first tapered portion extending from the second portion to the first portion, and a second tapered portion extending from the third portion to the first portion. The first portion and the first and second tapered portions are buried in the sealing glass. The total length of a part of the second portion in the sealing glass and a part of the third portion in the sealing glass is 0.2 mm or less.

Abstract: A lamella for observation on a transmission electron microscope and other analytical instruments includes multiple thin regions separated by thicker regions or ribs. In some embodiments, the lamella can be wider than 50 ?m with more than 10 multiple thin regions, with each thin region may being as thin as 10 nm or even thinner. The process for making such lamellae lends itself to automation. The process is fault tolerant in that not all of the multiple thin regions need to be useable as long as one region provides a useful image. Redeposition is reduced because ion beam imaging is reduced in the automated process and because the ribs reduce redeposition between regions.

Abstract: An imaging device for imaging a portion of a patient's vasculature with an imaging element may include a proximal portion having a relatively higher stiffness that provides rigidity for pushing the imaging device through a patient's vasculature, and may include a distal portion having a relatively lower stiffness that enables threading through a curved vasculature of the patient. The imaging device also may include a transition region disposed between the proximal portion and the distal portion.

Abstract: The present invention relates to a surface acoustic wave element and a method of manufacturing the same, and more specifically, to a surface acoustic wave element and a method of manufacturing the same, the element including a piezoelectric substrate; a plurality of IDT electrodes formed on the piezoelectric substrate; a plurality of resonator electrodes formed on the piezoelectric substrate; a wiring metal layer formed as a wiring area to electrically connect the plurality of IDT electrodes and the plurality of resonator electrodes; and an insulation layer formed on the piezoelectric substrate, the plurality of IDT electrodes, the plurality of resonator electrodes and the wiring metal layer.

Abstract: A body-cavity-insertion-type probe wherein an internal unit (internal assembly) has an oscillator unit, a relay board, and electronic circuit board, and a backing member. The backing member is retained in a state of being housed inside a backing case, and the backing case is retained by two recesses formed in an inside surface of a heat dissipation shell as a probe head case. An exhaust heat sheet is joined to a peripheral region of a back surface of the electronic circuit board. A rear wing and a front wing of the exhaust heat sheet are joined to the backing case.

Abstract: A conduction structure includes a device substrate (third substrate) including a conductive portion, an IC (second substrate) including an upper surface, an end surface inclined toward the upper surface, and a conductive portion (second conductive portion), a sealing plate (first substrate) including an upper surface, an end surface (first side wall portion) inclined toward the upper surface, and a conductive portion (first conductive portion), and plating layers that respectively form electrical connections between a conductive portion and a conductive portion and between a conductive portion and the conductive portion.

Abstract: A laterally coupled multi-mode monolithic filter includes: a substrate; a piezoelectric film formed on the substrate; a ground electrode formed on a first surface of the piezoelectric film; and signal electrodes formed on a second surface of the piezoelectric film and arranged in parallel to each other, the second surface being opposite to the first surface, each of the signal electrodes including a first electrode finger and a second electrode finger, wherein the first electrode finger and the second electrode finger have different electric potentials; adjacent signal electrodes of the signal electrodes are at a distance from each other, the distance being greater than a pitch of the first electrode finger and the second electrode finger.

Abstract: The present disclosure provides an impulse generator and a generator set. The impulse generator comprises: a first substrate; a first conductive film layer on the first substrate; an insulation film layer on the first conductive film layer; a second substrate; a second conductive film layer on the second substrate; and an elastic connection body for connecting the first substrate with the second substrate such that the insulation film layer and the second conductive film layer face each other; wherein, when no external force is applied on the first substrate or the second substrate, the insulation film layer is separated from the second conductive film layer; and, when an external force is applied on the first substrate or the second substrate, the insulation film layer is contacted with the second conductive film layer such that, a surface charge transfer is generated by the contact between the insulation film and the second conductive film layer, owing to their difference in triboelectric series.

Abstract: A piezoelectric element having an improved piezoelectric constant is provided, and a liquid discharge head, an ultrasonic motor, and a dust removing device, each of which uses the above piezoelectric element, are also provided. A piezoelectric element at least includes a pair of electrodes and a piezoelectric material provided in contact with the pair of electrodes, the piezoelectric material is formed of an aggregate of crystal grains containing barium titanate as a primary component, and among the crystal grains of the aggregate, crystal grains at least in contact with the electrodes have dislocation layers in the grains. A liquid discharge head, an ultrasonic motor, and a dust removing device each use the above piezoelectric element.

Abstract: A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidly isolated from the first empty space, is provided over the respective membrane of the further integrated device.