Abstract: A tuning-fork type quartz vibrator is disclosed that includes excitation electrodes and a tuning-fork type vibrating reed that is made of quartz and in which first and second vibrating arm sections are integrally joined to a base section. In each of the first and second vibrating sections, a plurality of through-holes and two or more crosspieces are provided. Further, an effective excitation electrode ratio is no more than 0.97, the effective excitation electrode ratio being expressed by (a total area of the excitation electrodes in a cross-section orthogonal to a second direction as a width direction of each of the first and second vibrating arm sections)/(an area of a region where the plurality of through-holes are provided in the cross-section orthogonal to the second direction as the width direction of each of the first and second vibrating arm sections).

Abstract: Provided is a method of manufacturing an ultrasound probe. The method includes: preparing a backing layer having first and second surfaces with different heights due to forming a groove in the backing layer, wherein first and second electrodes are exposed on the first and second surfaces, respectively; forming a third electrode that is in contact with the first electrode; forming a base piezoelectric unit on the third electrode, the base piezoelectric unit including a piezoelectric layer; forming a piezoelectric unit by removing an upper region of the base piezoelectric unit; and forming a fourth electrode on the backing layer and the piezoelectric unit.

Abstract: There is provided an acoustic resonator including: a resonance part including a first electrode, a second electrode, and a piezoelectric layer interposed between the first and second electrodes; and a substrate provided below the resonance part, wherein the substrate includes at least one via hole penetrating through the substrate and a connective conductor formed in the via hole and connected to at least one of the first and second electrodes. Therefore, reliability of the connective conductor formed in the substrate may be secured.

Abstract: A self-charging power pack (300) includes a cathode (312) and an anode (310) that is spaced apart from the cathode (312). An electrolyte (318) is disposed between the anode (310) and the cathode (312). A piezoelectric ion transport layer (322) is disposed between the anode (310) and the cathode (312). The piezoelectric ion transport layer (322) has a piezoelectric property that generates a piezoelectric field when a mechanical force is applied thereto. The piezoelectric field causes transportation of ions in the electrolyte (318) through the piezoelectric ion transport layer (322) towards the anode (310).

Abstract: An ultrasonic probe for contact measurement of an object and its manufacturing process. The ultrasonic probe has ultrasonic sensors securely fastened to a first face of a substrate. The opposite face of the substrate defines a measurement surface having a shape that is the imprint of the surface of the object to be measured to closely follow the latter when the surface of the object is brought into contact with the measurement surface.

Abstract: An acoustic resonator device includes an annular acoustic resonator, a heater coil and a heat sensor. The annular acoustic resonator is positioned over a trench formed in a substrate of the acoustic resonator device. The heater coil is disposed around a perimeter of the annular acoustic resonator, the heater coil including a resistor configured to receive a heater current. The heat sensor is configured to adjust the heater current in response to a temperature of the heater coil.

Abstract: An acoustic wave device includes: a support substrate; a piezoelectric substrate; and a cap substrate, wherein the cap substrate includes a first region located along an outer peripheral portion of the cap substrate, a second region located along an inside of the first region and having a thickness less than a thickness of the first region, and a third region located inside the second region and having a thickness less than a thickness of the second region, and a surface of the first region is bonded to the surface of the outer peripheral portion of the support substrate, a surface of the second region is bonded to a surface of an outer peripheral portion of the piezoelectric substrate, and a surface of the third region is located away from a surface of the piezoelectric substrate to form a space for the excitation electrode to vibrate.

Abstract: A piezoelectric vibration component that includes a sealed space formed between first and second package members, and a piezoelectric vibrator is bonded to the first package member with first and second conductive adhesive portions. In the piezoelectric vibrator, a first vibration electrode and a first extended electrode are formed on a first surface of a piezoelectric substrate, and a second vibration electrode and a second extended electrode are formed on a second surface of the piezoelectric substrate. At least the second extended electrode provided on the second principal surface has a higher bonding strength with respect to the conductive adhesive than that of the electrodes on the first principal surface. The electrode patterns on the first and second principal surfaces differ from each other so that the first surface and the second surface can be distinguished from each other.

Abstract: A printhead manufacturing method includes preparing a printing element substrate including a receiver, first and second input pads, and plural selection pads, and preparing a head substrate including first and second transmission lines. The receiver includes first and second terminals for receiving signals, and the first and second input pads are connected to the first and second terminals, respectively, and the plural selection pads connected to the second terminal via at least two from among plural resistive elements to selectively obtain one of plural combined resistances. At least one of the plural selection pads is selected to be connected to the first transmission line to obtain a value of the one of the plural combined resistances. The selected selection pad is connected to the first transmission line, the first input pad is connected to the first transmission line, and the second input pad is connected to the second transmission line.

Abstract: The invention is a fill-level measuring device having the following features: a housing, a membrane, a first drive unit have a first bolt, the bolt being coupled to the membrane, a second drive unit having a second bolt, the second bolt being operatively connected to the membrane and being connected to the housing at an end of the second bolt facing the membrane by means of an intermediate bottom, and the first drive unit and the second drive unit are mechanically connected to each other in series.

Abstract: A resonator element includes a quartz crystal substrate in which a plane including X and Z? axes is set as a main plane and a direction oriented along Y? axis is a thickness direction. The quartz crystal substrate includes a first region that includes a side along the X axis and a side along the Z? axis, a second region that has a thickness thinner than the first region. When Mx is a length of the first region along the X axis, Mz is a length of the first region along the Z? axis, Z is a length of the quartz crystal substrate along the Z? axis, and lz is a length of the second region along the Z? axis interposed between the first region and an outer frame of the quartz crystal substrate, relations of 0.9<Mz/Mx<1.175 and 0.085<lz/Z<0.18 are satisfied.

Abstract: A method of forming an energy harvesting device comprises supporting an outer peripheral edge of a disc spring using a support element that allows oscillations of the disc spring. A first preload force is applied to the disc spring and directed along its axial center. During application of the first preload force, a piezoelectric material is fixedly secured with a surface of the disc spring. A second preload force is applied to the disc spring to thereby provide a predetermined reduction of a stiffness of the disc spring. The reduction of the stiffness corresponds to an increased sensitivity to low-frequency components of vibrational energy received by the energy harvesting device.

Abstract: A composite substrate 10 includes a piezoelectric substrate 12 and a support layer 14 bonded to the piezoelectric substrate 12. The support layer 14 is made of a material having no crystalline anisotropy in a bonded surface thereof and has a smaller thickness than the piezoelectric substrate 12. The piezoelectric substrate 12 and the support layer 14 are bonded together with an adhesive layer 16 therebetween. The composite substrate 10 has a total thickness of 180 ?m or less. The base thickness ratio Tr=t2/(t1+t2) is 0.1 to 0.4, where t1 is the thickness of the piezoelectric substrate 12, and t2 is the thickness of the support layer 14. The thickness t1 is 100 ?m or less. The thickness t2 is 50 ?m or less.

Abstract: A bulk acoustic wave (BAW) resonator device comprises a heating coil disposed over a first side of the piezoelectric layer and substantially around a perimeter adjacent to the active area of the acoustic resonator, the heating coil comprising a resistor configured to receive a heater current; and a heat sensor disposed over a second side of the piezoelectric layer and opposing the first side, the heat sensor configured to adjust the heater current in response to a temperature of the heating coil.

Abstract: A method for manufacturing a liquid jetting apparatus includes: a wire formation step of forming a wire so that a part of the wire covers a piezoelectric film; and an electrode formation step of forming a second electrode, after the wire formation step, on a surface of the piezoelectric film on a side far from a vibration film so as to be in electrical conduction with the wire. The liquid jetting apparatus includes: a flow passage formation portion; and a piezoelectric actuator having the vibration film provided on the flow passage formation portion, the piezoelectric film arranged on the vibration film, a first electrode arranged on a surface of the piezoelectric film on a side near to the vibration film, the second electrode arranged on the surface of the piezoelectric film on the side far from the vibration film, and the wire connected to the second electrode.

Abstract: Provided is a thin-film thermistor element including a Si substrate 2, a thermistor thin film 5 formed on the Si substrate 2, and an electrode 3 made of platinum, an alloy thereof or the like and formed on, under or inside the thermistor thin film 5. The electrode 3 is formed from a film deposited containing oxygen and nitrogen and then crystallized by heat treatment.

Abstract: Fault detection optimized electronic circuit includes a circuit substrate on which components of the electronic circuit are respectively disposed. Each of the components has a component body which includes at least a first and second contacts. A component trace formed of conductive material is disposed on a first exterior surface of each component body facing the substrate. The component trace is electrically insulated from the first and second contact. Each of the components contains a network consisting of at least two capacitors connected in series between the first and second contact. A test point is formed of conductive material disposed on a second exterior surface of each body. The test point is electrically isolated from the first and second contacts and electrically connected to at least the component trace.

Abstract: An integrated optical circuit comprises a first waveguide section of a first material having a first index of refraction, a second waveguide section diffused with a second material, different from the first material, the second waveguide section having a second index of refraction; and a third waveguide section of the first material. A portion of the first waveguide section at a first interface is angled at a first angle and a portion of the second waveguide section is angled at the first angle. A portion of the first waveguide section at a second interface is angled at a second angle and a portion of the third waveguide section is angled at the second angle. The first angle and second angle are selected such that the angle of incidence of light at the first and second interfaces is greater than the Brewster's angle.

Abstract: An acoustic wave element according to certain examples includes a piezoelectric body, an interdigital transducer (IDT) electrode disposed above the piezoelectric body, and a connection electrode disposed above the piezoelectric body and connected to the IDT electrode. A first insulation layer covers the connection electrode, and a second insulation layer covers the IDT electrode. The first insulation layer disposed above the connection electrode has a first thickness T in a direction perpendicular to an upper surface of the piezoelectric body and the second insulation layer disposed above the IDT electrode has a second thickness K in the direction perpendicular to the upper surface of the piezoelectric body. The first thickness T is less than the second thickness K.

Abstract: An elastic wave device including a substrate, an interdigital transducer (IDT) electrode provided on an upper surface of the substrate, a first wiring electrode provided on the upper surface of the substrate and connected to the IDT electrode, a dielectric film that does not cover a first region of the first wiring electrode but covers a second region of the first wiring electrode above the substrate, the first wiring electrode including a cutout in the second region, and a second wiring electrode that covers an upper surface of the first wiring electrode in the first region and an upper surface of the dielectric film in the second region above the substrate.

Abstract: Methods and apparatus for reducing electric loss in an elastic wave element. In one example, the elastic wave element includes a piezoelectric body having a upper surface, an interdigital transducer (IDT) electrode disposed on the piezoelectric body, a connection wiring disposed on the piezoelectric body and electrically connected to the IDT electrode, the connection wiring having a lower connection wiring and an upper connection wiring provided above the lower connection wiring, and a reinforcement electrode provided above the connection wiring, the reinforcement electrode being in contact with and electrically connected to the lower connection wiring.

Abstract: A piezoelectric device is provided with a piezoelectric element including a piezoelectric layer exhibiting a polarizability ? smaller than 1×10?9 (C/(V·m)) in the case where an electric field is applied until polarization is saturated and a circuit having a means to set a minimum value of a drive electric field to become larger than a positive coercive electric field of the above-described piezoelectric layer and a means to set a maximum value of the above-described drive electric field to become smaller than (Pm?(maximum value of polarization)?Pr?(quasi-remanent polarization))/(1×10?9) and, therefore, an object is to drive the piezoelectric element in an electric field range in which maximum piezoelectric characteristics are obtained, improve the characteristics of the piezoelectric device, and enhance the reliability.

Abstract: A method for producing a liquid-ejection-head substrate includes providing a substrate having an energy-generating element and a pad, the pad including a wiring layer, the wiring layer in the pad having a relatively thick portion and a relatively thin portion and performing electrical inspection by applying a contact probe to the relatively thin portion of the wiring layer in the pad.

Abstract: A semiconductor laser element is provided with: a substrate formed of a semiconductor; a semiconductor laminated film, which is laminated on the substrate, and which includes an active layer; a first electrode and a second electrode, which are provided on surfaces parallel to the active layer on the side where the semiconductor laminated film is formed on the substrate; and a facet protection film that is provided on both the facets, which are perpendicular to the active layer, and which face each other. In the semiconductor laser element, the facet is used as a fixing surface for the semiconductor laser element, said facet having the facet protection film formed thereon.

Abstract: A method of forming an acoustic resonator includes forming a seed layer on a first electrode layer, forming a piezoelectric layer directly on a surface of the seed layer, and forming a second electrode layer on the piezoelectric layer. The piezoelectric layer includes multiple crystals of piezoelectric material, and the seed layer causes crystal axis orientations of the crystals to be substantially perpendicular to the surface of the seed layer.

Abstract: Embodiments provide a solidly-mounted bulk acoustic wave (BAW) resonator and method of making same. In embodiments, the BAW resonator may include a first resonator and a second resonator that are coupled with one another via a top electrode layer. A capacitive element may be included in the BAW resonator in parallel with the first resonator. Other embodiments may be described and claimed.

Abstract: An acoustic resonator structure comprises a first electrode disposed on a substrate, a piezoelectric layer disposed on the first electrode and comprising aluminum scandium nitride, a second electrode disposed on the piezoelectric layer, and a temperature compensation feature having a temperature coefficient offsetting at least a portion of a temperature coefficient of the piezoelectric layer, the first electrode, and the second electrode.

Abstract: A method for manufacturing a capacitive storage element having a layer system on one side of a porous substrate, which is designed as a conductive substrate or has a conductive surface layer at least on the one side, the layer system having a layer sequence of a dielectric titanate layer and an electrically conductive layer. It is provided that to form a closed titanate layer having an adjustable minimum layer thickness, an external electrical field is applied in the direction of the layer sequence, and when the field is applied, a fluid containing titanate particles is applied to the substrate. A corresponding capacitive storage element and the use of a capacitive storage element as a storage element of an electrical energy storage unit for supplying energy to an electric drive or hybrid drive of a motor vehicle are also described.

Abstract: A configurable single crystal acoustic resonator (SCAR) device integrated circuit. The circuit comprises a plurality of SCAR devices numbered from 1 through N, where N is an integer of 2 and greater. Each of the SCAR device has a thickness of single crystal piezo material formed overlying a surface region of a substrate member. The single crystal piezo material is characterized by a dislocation density of less than 1012 defects/cm2.

Abstract: A crystal resonator includes a blank and a supporting portion. The blank is cut out from a crystal parallel to a surface that includes a X?-axis and a Z?-axis respectively obtained by rotating an X?-axis and a Z?-axis by 45° around a Y?-axis in a direction from the Z?-axis toward the X?-axis. The X?-axis, the Y?-axis, and the Z?-axis are respectively obtained by rotating a crystallographic X-axis, Y-axis, and Z-axis of the crystal by equal to or more than +37° and equal to or less than 51.5° around the X-axis. The supporting portion is connected to an outer periphery of the blank at a position near an apex of the reference rectangle and where a displacement of vibration in the X?-axial direction or the Z?-axial direction becomes a local minimum when two longitudinal modes of vibration are coupled.

Abstract: A method of manufacturing a composite module prevents a connection electrode electrically coupled to a functional element from separating from a first principal surface of an element substrate. A transmission filter element, a reception filter element, connection electrodes electrically coupled to the transmission filter element and the reception filter element, and an insulating layer surrounding the transmission filter element, the reception filter element, and the connection electrodes are disposed on a first principal surface of an element substrate. The insulating layer covers at least a portion of the surface of each of the connection electrodes. Because the portion of the surface of each of the connection electrodes in an exposed state is covered with the insulating layer, the connection electrodes electrically coupled to the transmission filter element and the reception filter element are prevented from separating from the first principal surface of the element substrate.

Abstract: A vibration sensor includes at least one piezoelectric crystal having an upper surface and a lower surface; a base having an attachment section defining an attachment surface and an at least one calibration mass; wherein a one of the at least one piezoelectric crystal upper surface and lower surface attaches to the attachment surface of the base; and wherein the at least one calibration mass is external to the piezoelectric crystal.

Abstract: The present invention relates to a single crystal micromechanical resonator. In particular, the resonator includes a lithium niobate or lithium tantalate suspended plate. Also provided are improved microfabrication methods of making resonators, which does not rely on complicated wafer bonding, layer fracturing, and mechanical polishing steps. Rather, the methods allow the resonator and its components to be formed from a single crystal.

Abstract: Circuit modules and methods of construction thereof that contain composite meta-material dielectric bodies that have high effective values of real permittivity but which minimize reflective losses, through the use of host dielectric (organic or ceramic), materials having relative permittivities substantially less than ceramic dielectric inclusions embedded therein. The composite meta-material bodies permit reductions in physical lengths of electrically conducting elements such as antenna element(s) without adversely impacting radiation efficiency. The meta-material structure may additionally provide frequency band filtering functions that would normally be provided by other components typically found in an RF front-end.

Abstract: A monolithic matching structure for use in an ultrasonic transducer. The matching structure includes a mini-horn array. The mini-horn array includes a back plate, a plurality of horns, and a front plate. The plurality of horns extend from the back plate. Each of the horns includes a base and a neck. The base is adjacent the back plate. The neck extends from the base. Transverse area of the base is larger than transverse area of the neck. The front plate is adjacent the neck of each of the horns.

Abstract: An elastic wave device that can be downsized. Certain examples of the elastic wave device include a substrate, an IDT electrode provided above the substrate, a wiring electrode provided above the substrate and connected to the IDT electrode, a sealing body sealing an excitation space in which the IDT electrode excites an elastic wave, and a sealing wall provided above the wiring electrode and forming a part of the sealing body. An outer periphery of the wiring electrode includes a protrusion. In one example, the wiring electrode includes a first wiring electrode provided on an upper surface of the substrate and a second wiring electrode provided on an upper surface of the first wiring electrode, an outer periphery of the second wiring electrode being provided with the protrusion.

Abstract: The present invention provides a method for forming a touch panel, at least comprising the following steps. Step S1: a patterned first electrode layer is formed on a cover lens. A display region and a non-display region are defined on the cover lens, and the patterned first electrode layer is formed within the display region; step S2: a shielding layer is formed on the cover lens and disposed within the non-display region; step S3: an insulating layer is then formed on the shielding layer and on the patterned first electrode layer, a plurality of via holes are formed on the insulating layer, thereby exposing parts of the patterned first electrode layer; and step S4: a patterned second electrode layer is formed on the insulating layer within the non-display region, and the patterned second electrode layer is electrically connected to the patterned first electrode layer through the via holes.

Abstract: An acoustic resonator structure includes an acoustic reflector over a cavity formed in a substrate, the acoustic reflector including a layer of low acoustic impedance material stacked on a layer of high acoustic impedance material. The acoustic resonator further includes a bottom electrode on the layer of low acoustic impedance material, a piezoelectric layer on the bottom electrode, a top electrode on the piezoelectric layer, and a collar formed outside a main membrane region defined by an overlap between the top electrode, the piezoelectric layer and the bottom electrode. The collar has an inner edge substantially aligned with a boundary of or overlapping the main membrane region. The layer of the low acoustic impedance material includes a temperature compensating material having a positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric layer, the bottom electrode and the top electrode.

Abstract: An acoustic resonator structure includes a bottom electrode disposed on a substrate, a piezoelectric layer disposed on the bottom electrode, a top electrode disposed on the piezoelectric layer, a cavity disposed beneath the bottom electrode, and a temperature compensating feature. The temperature compensating feature has a positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric and electrode layers. The acoustic resonator structure further includes an acoustic reflector disposed over the substrate around a perimeter of the cavity. The acoustic reflector includes a layer of low acoustic impedance material stacked on a layer of high acoustic impedance material.

Abstract: A liquid ejecting head which ejects a liquid from a nozzle of a nozzle plate by means of pressure change in a pressure chamber includes a first member made of ceramics and including the pressure chamber, a second member located between the first member and the nozzle plate, the second member being made of a metal and including a first flow path at a position upstream to the pressure chamber so as to regulate the amount of liquid which flows into the pressure chamber, and a ground wire that grounds the second member.

Abstract: A piezoelectric component (1), which serves in particular as a piezoelectric sensor or a piezoelectric actuator, comprises a main body (2). The main body (2) has a first ceramic layer (15), a second ceramic layer (16) and an inner electrode layer (17). An outer metallization (5) is provided here, applied to an outer side (3) of the main body (2) and contacting the inner electrode layer (17). The main body (2) has a removal of material (4), the removal of material (4) separating the outer metallization (5) from an end-face outer electrode (7), which is formed by a metallization (7) of an end face (6) of the main body (2). A method for producing a piezoelectric component (1) is also provided.

Abstract: In accordance with a representative embodiment, a bulk acoustic wave (BAW) resonator comprises: a first electrode having a first electrode thickness; a second electrode having a second electrode thickness; and a piezoelectric layer having a piezoelectric layer thickness and being disposed between the first and second electrodes, the piezoelectric layer comprising a piezoelectric material doped with at least one rare earth element. For a particular acoustic coupling coefficient (kt2) value and a series resonance frequency (Fs) of the BAW resonator, the first electrode thickness and the second electrode thickness are each greater than a thickness of a first electrode and a thickness of a second electrode of a BAW resonator comprising an undoped piezoelectric layer.

Abstract: An film bulk acoustic wave resonator (FBAR) structure has an FBAR and a via disposed substantially directly beneath the FBAR. The via is in thermal contact with the FBAR. A plurality of vias may be included. The via(s) serve to dissipate heat generated by the FBAR structure during operation.

Abstract: A method of manufacturing an ultrasound transducer is provided. The ultrasound transducer is activated and the activity across the transducer is measured to determine whether the activity at any area does not meet an acceptance criteria. The transducer is then modified so that the area meets the acceptance criteria. The transducer may be modified with a laser which removes material from the area which does not meet the acceptance criteria.

Abstract: A composite substrate for an acoustic wave element includes a support substrate 1 and a propagation substrate 3 for propagating an acoustic wave. The propagation substrate is bonded to the support substrate 1 and composed of a piezoelectric single crystal. The propagation substrate 3 includes a surface lattice distortion layer 11 in which crystal lattices of the piezoelectric single crystal are distorted.

Abstract: An ink jet recording apparatus according to the invention includes an ink, and a discharge head that discharges the ink, in which the discharge head includes a plurality of pressure chambers respectively communicating with a plurality of nozzle holes formed in a nozzle plate, a vibration plate changing the capacity of each of the plurality of pressure chambers, and an ink supply chamber for supplying the ink to the plurality of pressure chambers, the capacity of the pressure chamber is 10.0×106 ?m3 or less, the density in which the plurality of nozzle holes are arranged in the nozzle plate is 200 dpi or more, the ink includes a pigment, water, an organic solvent, and a resin component, a ratio (organic solvent/water) of a mass of the organic solvent to a mass of the water in the ink is 0.2 to 0.5, and a solid content of the resin component in the ink is 1.5 mass % or more.

Abstract: The present invention discloses an apparatus and a process of using the apparatus to generate an electric energy in a crowded place. The apparatus comprises of an array of nanogenerators with a novel composition in a mesh of nanowires specifically piezoelectric nanowires embedded in a thin and transparent tape that may be paste/stick on a floor in a crowded place or a place with heavy traffic. The apparatus generates an electric field by using variations in pressure and surface temperature which is then transferred to a charging/discharging board in the form of an electric energy for later use.

Abstract: An elastic wave device includes a piezoelectric substrate including a primary surface and a first electrode which is provided on the primary surface of the piezoelectric substrate, which includes a first multilayer metal film including at least three metal films laminated in a bottom-to-top direction, and which includes at least an IDT film. The first multilayer metal film includes a Ti film as the topmost film and has a crystal orientation oriented in a predetermined direction so that the normal line direction of the plane of a Ti crystal of the Ti film coincides with the Z axis of a crystal of a piezoelectric body defining the piezoelectric substrate.

Abstract: A method of manufacturing a piezoelectric film using a piezoelectric film-forming composition. The piezoelectric film-forming composition contains Bi, Fe, Mn, Ba, and Ti and the mole ratio of Bi to the total amount of Fe and Mn is 1.02 or more 1.08 or less.

Abstract: A method of manufacturing a liquid jet head includes a through hole forming step of forming through holes on a base plate, an actuator plate bonding step of bonding actuator plates to opposite sides of the base plate, and an electrode forming step of forming electrodes on the bonded base plate and the actuator plates. In the through hole forming step, the through holes are formed on the base plate and the inner surfaces of the through holes are roughened. In the electrode forming step, second extraction electrodes are routed to a principal surface of the base plate through the through holes.