Data Storage Inductor Or Core Patents (Class 29/604)
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Patent number: 11808725Abstract: The invention relates to an apparatus for measuring pressure and/or humidity, and to a method for measuring pressure and/or humidity. The apparatus comprises at least one sensor for measuring pressure and/or humidity, wherein the sensor comprises at least one capacitor comprising at least two electrodes that are arranged, in particular, in a horizontal direction along and on an, in particular, flexible support material relative to one another. At least one dielectric layer is arranged between the electrodes. The invention is characterised in that at least one at least partially liquid-permeable and/or liquid-absorbing moisture layer is arranged at least in some places on a side, facing away from a support material, of at least one electrode and/or the dielectric layer. The at least one electrode and/or the dielectric layer are thus then arranged between the support material and the moisture layer in a transverse direction.Type: GrantFiled: June 7, 2019Date of Patent: November 7, 2023Inventor: Mohammad Kabany
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Patent number: 11749430Abstract: A method for manufacturing a wound magnetic core of a nanocrystalline soft magnetic alloy ribbon, the method including: a first heat treatment step of subjecting a wound magnetic core, which is formed by winding an amorphous soft magnetic alloy ribbon capable of nanocrystallization, to a heat treatment at a temperature that is 300° C.Type: GrantFiled: February 5, 2020Date of Patent: September 5, 2023Assignee: PROTERIAL, LTD.Inventor: Kazuhiro Hagiwara
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Patent number: 11476040Abstract: An electromagnetic component such as a power inductor includes first and second magnetic core pieces and a preformed coil winding therebetween. The preformed coil winding includes a top winding section and a pair of coplanar winding legs defining a U-shaped winding section therewith. The pair of winding legs are oriented perpendicular to a circuit board in use. First and second surface mount terminals respectively extend perpendicular to the pair of winding legs in opposing directions to each other, such that each of them extends only on one of the first and second magnetic core pieces but not the other.Type: GrantFiled: October 28, 2019Date of Patent: October 18, 2022Assignee: Eaton Intelligent Power LimitedInventors: Yipeng Yan, Yazhou Wang, Dengyan Zhou
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Patent number: 11222742Abstract: Embodiments are directed to a method of forming a laminated magnetic inductor and resulting structures having anisotropic magnetic layers. A first magnetic stack is formed having one or more magnetic layers alternating with one or more insulating layers. A trench is formed in the first magnetic stack oriented such that an axis of the trench is perpendicular to a hard axis of the magnetic inductor. The trench is filled with a dielectric material.Type: GrantFiled: October 3, 2019Date of Patent: January 11, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hariklia Deligianni, Bruce B. Doris, Eugene J. O'Sullivan, Naigang Wang
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Patent number: 11037992Abstract: A variable resistance memory device including insulating patterns sequentially stacked on a substrate; first conductive lines between adjacent ones of the insulating patterns and spaced apart from each other in a first direction; a second conductive line between the first conductive lines and penetrating the insulating patterns in a third direction perpendicular to a top surface of the substrate; a phase-change pattern between the second conductive line and each of the first conductive lines and between the adjacent ones of the insulating patterns to cover a top surface of a first adjacent insulating pattern and a bottom surface of a second adjacent insulating pattern; and a selection element between the phase-change pattern and the second conductive line and between the adjacent ones of the insulating patterns to cover the top surface of the first adjacent insulating pattern and the bottom surface of the second adjacent insulating pattern.Type: GrantFiled: September 11, 2019Date of Patent: June 15, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jeonghee Park, Dongho Ahn, Changyup Park, Zhe Wu
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Patent number: 10978239Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.Type: GrantFiled: June 27, 2017Date of Patent: April 13, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Haiying Li, Benjamin Michael Sutton, Ming Li
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Patent number: 10971684Abstract: Some embodiments relate to an integrated chip including a memory device. The memory device includes a bottom electrode disposed over a semiconductor substrate. An upper electrode is disposed over the bottom electrode. An intercalated metal/dielectric structure is sandwiched between the bottom electrode and the upper electrode. The intercalated metal/dielectric structure comprises a lower dielectric layer over the bottom electrode, an upper dielectric layer over the lower dielectric layer, and a first metal layer separating the upper dielectric layer from the lower dielectric layer.Type: GrantFiled: May 15, 2019Date of Patent: April 6, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Mauricio Manfrini, Chung-Te Lin, Gerben Doornbos, Marcus Johannes Henricus van Dal
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Patent number: 10878997Abstract: An integrated circuit includes a substrate, a first conductive path over the substrate, a coil structure over the substrate, and a voltage sensing circuit electrically coupled with the coil structure. The first conductive path is configured to carry a first time-varying current and to generate a first time-varying magnetic field based on the first time-varying current. The coil structure is magnetically coupled with the first conductive path through the first time-varying magnetic field and is configured to generate an induced electrical potential responsive to the first time-varying magnetic field. The voltage sensing circuit is configured to measure a voltage level of the induced electrical potential.Type: GrantFiled: February 25, 2016Date of Patent: December 29, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Alan Roth, Eric Soenen
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Patent number: 10811181Abstract: In a method of manufacturing a plurality of embedded magnetic component devices, a row of cavities for respective magnetic cores is formed in an insulating substrate. Neighboring cavities are connected to each other by channels formed in the substrate. Adhesive is applied to a cavity floor throughout the row of cavities, and magnetic cores are inserted into the cavities. The cavities and magnetic cores are covered with a first insulating layer. Through holes are formed through the first insulating layer and the insulating substrate, and plated up to form conductive vias. Metallic traces are added to the exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and conductive vias form the windings for an embedded magnetic component, such as transformer or inductor.Type: GrantFiled: February 26, 2016Date of Patent: October 20, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Scott Andrew Parish, Christopher Featherstone
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Patent number: 10553344Abstract: A method of manufacturing a coil device and the coil device includes a base layer and a coil pattern formed on a surface of the base layer. The method of manufacturing a coil device includes forming a seed layer of a coil by bonding a copper foil to a base layer, etching to remove a portion of the copper foil, and plating a plating layer on the seed layer.Type: GrantFiled: October 5, 2016Date of Patent: February 4, 2020Assignee: WITS Co., Ltd.Inventors: Han Kim, Kang Heon Hur, Sang Jong Lee, Jung Wook Seo
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Patent number: 10526731Abstract: Weaving equipment may include strand positioning equipment that positions warp strands and that inserts weft strands among the warp strands to form fabric. The weaving equipment may include one or more guide arms that pushes warp strands in the weft direction during weaving. Fabrics having warp strands that extend in both the warp direction and the weft direction may be used in forming circuitry in fabrics such as touch sensor circuitry. For example, a touch sensor in a fabric may be formed using first conductive warp strands that form first touch sensor electrodes and second conductive warp strands that form second touch sensor electrodes that overlap with the first touch sensor electrodes. The second conductive warp strands may each have a first portion that extends in the warp direction and a second portion that extends in the weft direction across the first touch sensor electrodes.Type: GrantFiled: December 1, 2015Date of Patent: January 7, 2020Assignee: Apple, Inc.Inventors: Daniel A. Podhajny, Yohji Hamada, Kathryn P. Crews, Joseph B. Walker, Daniel D. Sunshine
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Patent number: 10276291Abstract: A choke coil module of a high power density DC-AC power inverter includes a retainer. The retainer includes a lower plate and an upper plate. The upper and lower plates are spaced from each other and have two slots, respectively. An accommodation space of the retainer is provided with two choke coils which are disposed obliquely in a stagger manner. Top portions and bottom portions of the choke coils protrude out of and lean against the slots of the upper plate and the lower plate, respectively. The outside air is guided by a fan unit to enter a casing through air inlets, and the heat generated by the choke coils is expelled to the outside through air outlets. The choke coil module can be mounted in a smaller casing, such as a casing with a height of 2 U, to achieve excellent heat dissipation.Type: GrantFiled: April 7, 2017Date of Patent: April 30, 2019Assignee: CHYNG HONG ELECTRONIC CO., LTD.Inventor: Mu-Chun Lin
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Patent number: 10262249Abstract: Provided is a contactless information medium that achieves reduction in initial failure at the time of manufacture and obtains stable quality. A contactless information medium 1 includes a plurality of substrates 2a to 2d in a stacked state, an electric conductor 4, and an IC chip 5. The electric conductor 4 is integrally provided on each of the substrates 2a to 2d, and has a pre-formed conductive pattern 3. The IC chip 5 is mounted on any one of the substrates 2a to 2d, and is connected to the electric conductor 4. The conductive pattern 3 partially includes spiral patterns 31a to 31d formed in a spiral shape. The spiral patterns 31a to 31d are arranged at different positions among the substrates 2a to 2d.Type: GrantFiled: June 26, 2018Date of Patent: April 16, 2019Assignee: UNIVERSAL ENTERTAINMENT CORPORATIONInventor: Kazuki Emori
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Patent number: 10118212Abstract: A method for forming a blanked piece from a material, where the blanked piece includes a production area having a through hole and at least one caulking and connection area protruding inside the through hole. The method includes forming a blanking hole in the material in a prescribed outline, placing a guide member in the through hole, where the guide member has an abutting part contacting a protrusion of the material formed along the outline of the blanking hole. The method further includes cutting and separating the material to blank or stamp out downward the caulking and connection area, pushing back the caulking and connection area, and temporarily connecting the caulking and connection area to the material; and blanking or stamping an outer configuration of the product area from the material to which the caulking and connection area is temporarily connected.Type: GrantFiled: March 2, 2016Date of Patent: November 6, 2018Assignee: MITSUI HIGH-TEC, INC.Inventors: Shinichiro Ono, Masahiro Izumi, Shigetoshi Yamato
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Patent number: 10037843Abstract: The invention relates to an electrical device comprising a stack of electrical elements, wherein: a central axis is defined in the stack; each element comprises an electrically insulating carrier; the carrier carries an electrically conductive loop-shaped track; both end zones of the track are located in the edge zone of the carrier; the loop-shaped tracks each form a turn and are arranged around the central axis in the stack; the end zones are connected to each other in electrically conductive manner such that the turns form one winding in at least groupwise manner; the carriers are congruent and each have a form such that they can be rotated from a starting position through an angle a around the central axis to a rotated position in which they take up the same space as in the starting position; adjacent elements with tracks which together form a winding are disposed rotated through an angle a relative to each other, and the mutually registered end zones are mutually connected by an electrical conductor exteType: GrantFiled: July 28, 2015Date of Patent: July 31, 2018Assignees: Compact Electro-Magnetic Technology, Eco-Logical Enterprises B.V.Inventor: Augustinus Wilhelmus Maria Bertels
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Patent number: 9935497Abstract: An arrangement for providing a vehicle with electric energy includes a receiving device adapted to receive the magnetic component of an alternating electromagnetic field and to produce an alternating electric current by magnetic induction. The receiving device includes at least one phase line, each phase line being adapted to carry a phase of the alternating electric current. The at least one phase line forms a line arrangement which extends in a longitudinal direction transversely to a flux line direction, in which magnetic flux lines of the electromagnetic field penetrate the line arrangement, so that the line arrangement has a first end and a second end, the ends being located at opposite ends of the line arrangement in the longitudinal direction. The width of the line arrangement, gradually decreases along the extension of the line arrangement towards the first end and/or towards the second end.Type: GrantFiled: April 23, 2013Date of Patent: April 3, 2018Assignee: Bombardier Transportation GmbHInventors: Robert Czainski, Konrad Woronowicz
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Patent number: 9634633Abstract: An electronic component includes a device body and first through n-th LC parallel resonators connected in series with each other. The first through n-th LC parallel resonators respectively include first through n-th inductors and first through n-th capacitors. The first through n-th inductors are disposed in the device body such that they are arranged in a first direction in this order. The first and n-th inductors are provided with a spiral shape such that they turn around respective winding axes extending along the first direction. At least one of the second through (n?1)-th inductors is provided with a helical shape such that it turns around a winding axis extending along the first direction.Type: GrantFiled: April 18, 2016Date of Patent: April 25, 2017Assignee: Murata Manufacturing Co., Ltd.Inventor: Hiroshi Masuda
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Patent number: 9015925Abstract: An armature assembly apparatus for assembling an armature of an electrical machine is provided. The armature assembly apparatus has an armature holding apparatus to hold a partially assembled armature such that a rotation axis of the armature is horizontal. The armature assembly apparatus has a rotating device for rotating the partially assembled armature about a rotation axis. The armature assembly apparatus also has a ring segment conveyance for conveying an armature ring segment to a mounting position relative to a free ring segment portion of the partially assembled armature.Type: GrantFiled: January 11, 2013Date of Patent: April 28, 2015Assignee: Siemens AktiengesellschaftInventors: Kenneth Damgaard Hoell, Jakob Mikkelsen, John Krath Pedersen, Martin Bach Soerensen
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Publication number: 20150063024Abstract: In an embodiment, a memory device includes a stack of tiers of memory cells, a tier of local devices at a level above the stack of tiers of memory cells, and a tier of global devices at substantially a same level as the tier of local devices. A local device may provide selective access to a data line. A global device may provide selective access to a global access line. A tier of memory cells may be selectively coupled to a global access line by the global device of the tier of global devices.Type: ApplicationFiled: August 29, 2013Publication date: March 5, 2015Applicant: Micron Technology, Inc.Inventors: Aaron S. YIP, Mark A. HELM, Ramin GHODSI
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Patent number: 8959752Abstract: A transformer core manufacturing apparatus for manufacturing an annular transformer core having thin plates formed of magnetic materials laminated includes an uncoiler unit which allows a plurality of uncoilers each having a thin plate magnetic material coiled hoop-like to uncoil the magnetic material, a carrier unit for guiding a plurality of the magnetic materials uncoiled from the plurality of the uncoilers as a single group of magnetic body, a first alignment unit for aligning the carried group of the single magnetic body in a width direction, a cut-off unit for cutting the magnetic body aligned by the first alignment unit in a predetermined dimension, a laminating unit for laminating a plurality of the groups of the magnetic body cut by the cut-off unit, a second alignment unit for aligning the magnetic body laminated on the laminating unit, and a control unit for controlling operations of the above cited units.Type: GrantFiled: July 20, 2011Date of Patent: February 24, 2015Assignee: Hitachi Industrial Equipment Systems Co., Ltd.Inventors: Shunsuke Ikeda, Junichi Ishizuki, Takashi Kurata, Eisuke Maruyama
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Publication number: 20150003003Abstract: A storage apparatus including a storage element and a fitting member is provided. The storage element includes a body, a first pad set and a second pad set. The first and the second pad sets are exposed out of the body and located at opposite sides of the body. The fitting member comprises a first terminal set and a second terminal set electrically connected to each other. The storage element is detachably assembled to the fitting member. The first terminal set electrically connected to the first pad set and the second terminal set located between the first pad set and the second pad set, the second terminal set and the second pad set form a connecting interface of the storage apparatus that the storage apparatus is used for being electrically connected to an external apparatus. A production method of the storage apparatus is further provided.Type: ApplicationFiled: September 2, 2013Publication date: January 1, 2015Applicant: PHISON ELECTRONICS CORP.Inventors: Hung-I Chung, Chang-Chih Chen
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Patent number: 8904628Abstract: Disclosed herein is a method of manufacturing a noise removing filter, including preparing at least one conductive pattern, an insulating layer for covering the at least one conductive pattern, and a lower magnetic body including input/output stud terminals for electrically inputting and outputting electricity to and from the at least one conductive pattern; disposing a recognizable portion on upper surfaces of the input/output stud terminals; disposing an upper magnetic body on the recognizable portion and the insulating layer; polishing the upper magnetic body; and removing the recognizable portion such that a level of an upper surface of the upper magnetic body is higher than levels of the upper surfaces of the input/output stud terminals.Type: GrantFiled: December 17, 2012Date of Patent: December 9, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sang Moon Lee, Sung Kwon Wi, Jeong Bok Kwak, Won Chul Sim, Young Seuck Yoo, Yong Suk Kim
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Patent number: 8869383Abstract: A magnetics assembly (100) including a transformer (1) made of litz wire. The transformer includes a toroid core (2) and a bundle of wires (3) winding around the toroid core. The bundle of wires includes first to eighth wires, and has a central portion with all eight wires twisted together and winding around the toroid core. First and second ends of the bundle of wires oppositely extend out from the toroidal core. The ends of the first to eighth wires are connected to form a primary and a secondary coils of the transformer, wherein the second ends of the first wire and the second wire, and the first ends of the third wire and the fourth wire are sorted out to form central taps (35, 36) of the primary and secondary coils, respectively.Type: GrantFiled: June 14, 2012Date of Patent: October 28, 2014Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Yong-Chun Xu, Jie Zhang
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Patent number: 8813346Abstract: A coil-type electronic component has a coil inside or on the surface of its base material and is characterized in that: the base material is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of each soft magnetic alloy grain has an oxide layer formed on its surface as a result of oxidization of the grain; this oxide layer contains the other element that oxidizes more easily than iron by a quantity larger than that in the soft magnetic alloy grain; and grains are bonded with one another via this oxide layer.Type: GrantFiled: April 22, 2011Date of Patent: August 26, 2014Assignee: Taiyo Yuden Co., Ltd.Inventors: Hideki Ogawa, Atsushi Tanada, Hitoshi Matsuura, Kiyoshi Tanaka, Hiroshi Kishi, Kenji Kawano
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Publication number: 20140211343Abstract: A disk drive device includes a stationary body, a rotating body on which a recording disk is to be mounted, and a fluid bearing unit that supports the rotating body in a freely rotatable manner relative to the stationary body. The fluid bearing unit includes a lubricant that is fluorescent.Type: ApplicationFiled: January 7, 2014Publication date: July 31, 2014Applicant: SAMSUNG ELECTRO-MECHANICS JAPAN ADVANCED TECHNOLOGY CO., LTD.Inventor: Mitsuo KODAMA
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Patent number: 8752276Abstract: A method of manufacturing a rotating electrical machine has steps of a preparation step that accommodates the cap in a jig space while bringing the jig and the pulley in contact in an up-and-down direction so that an operation space is sealed, and a main step that decompresses the operation space to pressure lower than atmospheric pressure, moves the cap to an upper side in the decompressed operation space, and press-fits the cap into the pulley. By this, an inclination and a misalignment in the axial direction of the cap by the action of the reaction force can be suppressed since the reaction force acting downwardly on the cap can be weakened compared with the case where the cap is press-fit under atmospheric pressure. Therefore, the press-fit-state of the cap can be stabilized.Type: GrantFiled: January 23, 2012Date of Patent: June 17, 2014Assignee: Denso CorporationInventors: Toshiyuki Yoshikawa, Satoru Hara
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Publication number: 20140157582Abstract: A storage system for a pharmacy that has a frame containing a rack-like structure with a plurality of storage carriers detachably suspended therefrom. The carriers are sized to receive filled prescription orders and the like and include individual identifiers that facilitate locating the carriers at a specific location on the rack-like structure. Preferably, the storage system includes a tracking system that detects, monitors, and displays to a worker the location of the storage carrier containing a particular customer's prescription order, thereby providing easy retrieval of the customer's prescription order.Type: ApplicationFiled: June 28, 2013Publication date: June 12, 2014Inventors: Shelton Louie, Stephen A. Garrett
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Patent number: 8707547Abstract: A lead-frameless power inductor and its fabrication method are disclosed. The power inductor comprises a lower substrate, a coil provided on the lower substrate, and an intermediate layer which encloses the coil, wherein the lower substrate can be a soft magnetic entrainer or a non-magnetic entrainer. The coil is made of an insulated wire, and the intermediate layer is a colloid consisting of magnetic powder. A method for fabricating the lead-frameless power inductor includes steps of preparing a lower substrate; forming a plurality of conducting metal layers on the lower substrate; forming a wire package on an upper surface of said lower substrate; coating a surface of said wire package with a magnetic powder; dividing the substrate into a plurality of granulated elements by cutting process; and forming the conducting metal layer on both sides of the element to form a surface mounting device.Type: GrantFiled: July 12, 2012Date of Patent: April 29, 2014Assignee: Inpaq Technology Co., Ltd.Inventor: Wei Chih Lee
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Patent number: 8695209Abstract: A method of producing a surface-mount inductor by encapsulating a coil with an encapsulation material containing a resin and a filler using a mold die assembly is provided. In the method, a tablet and a coil are used. The tablet is prepared by preforming the encapsulation material into a shape having a flat plate-shaped portion and a pillar-shaped convex portion on a peripheral thereof. The coil is a wound conductive wire having a cross-section of rectangular-shape. The coil is placed on the tablet to allow both ends of the coil to extend along an outer side surface of the pillar-shaped convex portion of the tablet. The coil and the encapsulation material are integrated together while clamping the both ends of the coil between an inner wall surface of the mold die assembly and the outer side surface of the pillar-shaped convex portion of the tablet, to form a molded body.Type: GrantFiled: April 9, 2010Date of Patent: April 15, 2014Assignee: TOKO, Inc.Inventors: Koichi Saito, Chitoshi Sakai
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Patent number: 8677608Abstract: An annular core member having an opening portion located at a position rotated by 90 degrees from a reference position, where the opening portion is oriented in the counterclockwise direction, and an annular core member having the opening portion located at the reference position, where the opening portion is oriented in the clockwise direction, are prepared to form an iron core by a rotary lamination apparatus by rotating the annular core members and by a predetermined angle (90 degrees) such that a first end, in the annular core member, which is at the position rotated by 90 degrees from the reference position and has no rotation uneven part, is circumference-positionally identical in the laminating direction with that of a fourth end, in an annular core member, which is at the reference position and has no rotation uneven part.Type: GrantFiled: July 24, 2008Date of Patent: March 25, 2014Assignee: Mitsubishi Electric CorporationInventors: Hiroyuki Akita, Kimiyasu Furusawa
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Publication number: 20140049353Abstract: The present invention relates to an inductor and a method of manufacturing an inductor and provides an inductor which can minimize the area required for mounting, reduce parasitic capacitance generated between a circuit pattern of a substrate and a coil pattern of the inductor, and be efficiently manufactured by providing both of a first external electrode portion and a second external electrode portion on one of six surfaces of the inductor while including a coil pattern portion; an insulating portion; the first external electrode portion; and the second external electrode portion.Type: ApplicationFiled: August 16, 2013Publication date: February 20, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan YOON, Sung Kwon WI, Young Ghyu AHN, Young Seuck YOO
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Patent number: 8601673Abstract: A method of producing an inductor with high inductance includes forming a removable polymer layer on a temporary carrier; forming a structure including a first coil, a second coil, and a dielectric layer on the removable polymer layer; forming a first magnetic glue layer on the removable polymer layer and the structure; removing the temporary carrier; and forming a second magnetic glue layer below the structure and the first magnetic glue layer.Type: GrantFiled: November 22, 2011Date of Patent: December 10, 2013Assignee: Cyntec Co., Ltd.Inventor: Shih-Hsien Tseng
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Patent number: 8567040Abstract: An iron core includes an electromagnetic steel plate having a first region on the surface of which an insulating film is formed and a second region which is not covered with the insulating film and exposed, and a coating member which coats at least the second region. The second region is formed by removing the insulating film by machining.Type: GrantFiled: September 24, 2008Date of Patent: October 29, 2013Assignee: Canon Kabushiki KaishaInventor: Hiroyoshi Kubo
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Patent number: 8528190Abstract: A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure with a baffle over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber and the baffle directs the encapsulant away from the magnetic core thereby limiting an amount of the encapsulant that contacts the magnetic core within the chamber.Type: GrantFiled: August 21, 2008Date of Patent: September 10, 2013Assignee: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Mathew Wilkowski, John D. Weld
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Publication number: 20130180101Abstract: A data storage device serving as a portable card, magnetically encodeable card, or a magnetic credit card is shown. The data storage device includes a substrate having at least one surface. A high density, magnetically coercive material layer is disposed on or is deposited on the substrate for storing magnetic signals. The magnetically coercive material may have an axis of magnetization that is oriented in a predetermined direction relative to the at least one surface of the substrate. A layer of non-magnetically material is disposed on the substrate for defining an exchange break layer. A relatively hard, abradeable protective coating is formed on the magnetic material layer and has a thickness between a maximum thickness that materially attenuates magnetic signals passing between the magnetic material layer and a transducer and a minimum thickness enabling the protective coating to be abraded by usage in an ambient natural atmosphere operating environment.Type: ApplicationFiled: February 12, 2013Publication date: July 18, 2013Applicant: ULTRACARD, INC.Inventor: ULTRACARD, INC.
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Patent number: 8453318Abstract: A method of making a planar coil is disclosed in the present invention. First, a substrate having a trench is provided. Then, a barrier and a seed layer are formed on the substrate in sequence. An isolative layer is used for guiding a conductive material to flow into a lower portion of the trench such that accumulation of the conductive material at opening of the trench is prevented before the lower portion of the trench is completely filled up, thereby avoiding gap formation in the trench.Type: GrantFiled: October 15, 2012Date of Patent: June 4, 2013Assignee: Touch Micro-System Technology Corp.Inventors: Hung Yi Lin, Ming Fa Chen
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Patent number: 8407883Abstract: A damascene process is utilized to fabricate the segmented magnetic core elements of an integrated circuit inductor structure. The magnetic core is electroplated from a seed layer that is conformal with a permanent dielectric mold that results in sidewall plating defining an easy magnetic axis. The hard axis runs parallel to the longitudinal axis of the core and the inductor coils are orthogonal to the core's longitudinal axis. The magnetic field generated by the inductor coils is, therefore, parallel and self-aligned to the hard magnetic axis. The easy axis is enhanced by electroplating in an applied magnetic field parallel to the easy axis.Type: GrantFiled: June 1, 2012Date of Patent: April 2, 2013Assignee: National Semiconductor CorporationInventors: Peter Smeys, Peter Johnson, Andrei Papou
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Patent number: 8402636Abstract: A manufacturing method of ground-buried-type solid insulation transformer includes producing a coil form into which an inner window is formed; winding a low voltage coil and a high voltage coil on the coil form to produce a first coil part; winding glass fiber on the first coil part to produce a second coil part and assembling a first mold into the inner window and then pre-heating the second coil part; putting the second coil part into a second mold and injecting epoxy resin and hardener between the second coil part and the second mold, and automatically molding and curing thereof under predetermined speed, vacuum, pressure and temperature to produce a third coil part on outer circumference of which an epoxy layer is formed; separating the first mold from the inner window of the third coil part and then after-treating and curing the third coil part; cooling the after-treated and cured third coil part and sanding and washing the epoxy layer, and applying semi-conductive coating material to the sanded part toType: GrantFiled: August 28, 2009Date of Patent: March 26, 2013Assignee: Cheryong Industrial Co., Ltd.Inventors: Jong Tae Park, Byung Kwon Song, Kee Ha Hwang, Tae Ho Kim, Ki Hak Yi
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Publication number: 20130058157Abstract: The present invention proposes an electronic memory device comprising a memory line including a memory domain. The memory line may contain a number of memory domains and a number of fixed domains, wherein each memory domain stores a single binary bit value. A multiferroic element may be disposed proximate to each memory domain allowing the magnetization of the memory domain to be changed using a spin torque current, and ensuring the stability of the magnetization of the domain when it is not being written. The domain boundary between the memory domain and one of its adjacent fixed domains may thereby be moved. An antiferromagnetic element may be disposed proximate to each fixed domain to ensure the stability of the magnetization of these. The value of each memory domain may be read by applying a voltage to a magnetic tunnel junction comprising the memory domain and measuring the current flowing through it.Type: ApplicationFiled: May 11, 2011Publication date: March 7, 2013Applicant: University of Virginia Patent Foundation, d/b/a University of Virginia Licensing & Ventures GroupInventors: Stuart A. Wolf, Jiwei Lu, Mircea R. Stan
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Patent number: 8381994Abstract: A data storage device, a stacking method thereof, and a data storage device assembly are provided. The data storage device assembly includes a first data storage device and a second data storage device respectively having a body, a magnetic element, and a storage device. Each body has a first containing space and a second containing space. Each magnetic element is disposed in the corresponding first containing space. At least one of the magnetic elements of the first and the second data storage device is a magnet. Each storage device is disposed in the corresponding second containing space and includes an electrical connector terminal, a memory chip, and a memory controller with no crystal oscillator. The magnetic elements of the first and the second data storage device attract each other so that the body of the first data storage device is stacked on the body of the second data storage device.Type: GrantFiled: February 11, 2011Date of Patent: February 26, 2013Assignee: Phison Electronics Corp.Inventor: Cheng-Chieh Hsieh
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Patent number: 8375566Abstract: Methods of providing arc resistant switchgear enclosures for dry-type transformers are provided. The enclosures have one or more arc-resistant features, including arc channels, arc fault dampers, and arc fault plenums. In a preferred embodiment, the method comprises providing a base structure with a dry-type transformer seated thereon, providing walls and a roof, wherein at least the front wall contains at least one longitudinal seam covered by an arc channel.Type: GrantFiled: February 28, 2011Date of Patent: February 19, 2013Assignee: ABB Inc.Inventors: Robert C. Ballard, Nathan T. Sigman, Edgar A. Wimmer, Jr., Rafael Gutierrez, Jr.
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Patent number: 8347490Abstract: A method for fabricating a carrier with a three-dimensional inductor comprises the steps of providing a substrate having a protective layer; forming a first photoresist layer on the protective layer; patterning the first photoresist layer to form a second opening and a plurality of disposing slots; forming a first metal layer in second opening and disposing slots; removing the first photoresist layer; forming a first dielectric layer on the protective layer; forming a second photoresist layer on the first dielectric layer; patterning the second photoresist layer to form a plurality of slots; forming a second metal layer in slots to form a plurality of inductive portions; removing the second photoresist layer; forming a second dielectric layer on the first dielectric layer; forming a third photoresist layer on the second dielectric layer; patterning the third photoresist layer to form a plurality of slots; and forming a third metal layer in slots.Type: GrantFiled: June 30, 2011Date of Patent: January 8, 2013Assignee: Chipbond Technology CorporationInventors: Chih-Ming Kuo, You-Ming Hsu
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Patent number: 8327524Abstract: Disclosed herein is an inductive component whose soft magnetic core is produced by pouring a casting resin into a mold filled with a soft magnetic alloy powder and by subsequently hardening the casting resin with the alloy powder in order to form a solid soft magnetic core. This technique prevents the surface insulation of the alloy particles from becoming damaged, thereby largely preventing the formation of bulky eddy currents in the resulting soft magnetic cores. This enables a distinct reduction in the electric loss of the inductive component.Type: GrantFiled: August 31, 2007Date of Patent: December 11, 2012Assignee: Vacuumscmelze GmbH & Co. KGInventor: Markus Brunner
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Publication number: 20120304455Abstract: A method and mass storage device that combine multiple solid state drives (SSDs) to a single volume. The device includes a carrier board and at least two solid state drives having power and data connections to the carrier board. The carrier board includes a circuit board functionally connected to a control logic and at least two secondary connectors that are disposed at different edges of the circuit board and functionally connected to the control logic. The solid state drives are connected to the carrier board through the secondary connectors, and each solid state drive has a power and data connector directly connected to one of the secondary connectors of the carrier board. The solid state drives are oriented substantially parallel to the carrier board and to each other.Type: ApplicationFiled: August 16, 2012Publication date: December 6, 2012Applicant: OCZ TECHNOLOGY GROUP INC.Inventor: Franz Michael Schuette
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Patent number: 8307534Abstract: A method of forming an encapsulated coupled coil arrangement. The method includes coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material having the encapsulation process.Type: GrantFiled: January 30, 2012Date of Patent: November 13, 2012Assignee: Siemens PlcInventors: Graham Hutton, M'Hamed Lakrimi, Adrian Mark Thomas
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Patent number: 8302287Abstract: A multilayer inductor includes a bottom magnetic layer having an external conductive pattern formed on a bottom surface thereof for connection to a substrate such as a printed circuit board. The bottom external conductive pattern includes signal/power contacts and first and second inductor electrodes. A top magnetic layer includes a top external conductive pattern having signal/power contacts and inductor electrode contacts. An inductor conductive pattern formed on the top surfaces of intermediate magnetic layers disposed between the top and bottom magnetic layers are electrically coupled to each other by means of through holes to form a spiral inductor element.Type: GrantFiled: September 27, 2010Date of Patent: November 6, 2012Assignee: Alpha and Omega Semiconductor IncorporatedInventors: Jun Lu, François Hébert
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Patent number: 8302286Abstract: A stator winding is manufactured by a forming step, a winding step, and a expanding step. In the forming step, an S-shaped offset shape is formed on a conductor part corresponding to a coil end part. Thereby, in a coil end part, it is possible to provide an expected shape stably at the coil end part. The conductor is wound around a bobbin in the winding step. In the winding step, a twisted shape is given to the conductor parts to be the inclined part of the coil end and the conductor part to be accommodated in a slot. In the expanding step, a preform product removed from the bobbin is expanded into a shape of the stator winding.Type: GrantFiled: September 29, 2009Date of Patent: November 6, 2012Assignee: Denso CorporationInventor: Takashi Tokizawa
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Publication number: 20120233849Abstract: A damascene process is utilized to fabricate the segmented magnetic core elements of an integrated circuit inductor structure. The magnetic core is electroplated from a seed layer that is conformal with a permanent dielectric mold that results in sidewall plating defining an easy magnetic axis. The hard axis runs parallel to the longitudinal axis of the core and the inductor coils are orthogonal to the core's longitudinal axis. The magnetic field generated by the inductor coils is, therefore, parallel and self-aligned to the hard magnetic axis. The easy axis is enhanced by electroplating in an applied magnetic field parallel to the easy axis.Type: ApplicationFiled: June 1, 2012Publication date: September 20, 2012Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Peter Smeys, Peter Johnson, Andrei Papou
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Patent number: 8256097Abstract: A method for manufacturing a coil device comprises a first step of twisting a tip end part of the conductive wire by approximately 90 degrees with respect to a conductive wire portion arranged rearward continuously from the tip end part to form a twist part, and winding the tip end part of the conductive wire around the outer peripheral surface of the core in a lying posture on the outer peripheral surface; a second step of winding the conductive wire arranged rearward continuously from the twist part around the outer periphery surface of the core in a standing posture on the outer peripheral surface; and a third step of transforming the conductive wire on a tip end side with respect to the twist part in a direction apart from the outer periphery surface of the core to form one lead part extending substantially linearly.Type: GrantFiled: September 26, 2008Date of Patent: September 4, 2012Assignee: SHT Corporation LimitedInventor: Hitoshi Yoshimori
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Patent number: 8215003Abstract: A method of fabricating a reactor composed of a coil, a core, and a container, capable of suppressing the core to break when a current flows in the coil to generate magnetic flux. In the method, the coil is formed by spirally winding a conductive wire. The coil is immersed in an insulating film in liquid with electrical insulation. The coil is placed in a furnace. Annealing for the coil and thermosetting for the insulating film are performed at a temperature within 250 to 320° C. for a period of time within 30 minutes to one hour before forming the core in the container. The coil is then disposed in the container. Inside and outside areas of the coil in the container is filled with a resin mixture composed of magnetic powder and resin. The resin mixture in the container is hardened to form the core.Type: GrantFiled: August 4, 2009Date of Patent: July 10, 2012Assignees: Denso Corporation, NEC Tokin CorporationInventors: Kenji Saka, Yousuke Setaka, Hiroyuki Katsuta, Takashi Yanbe