Heater Type Patents (Class 29/611)
-
Patent number: 7275308Abstract: A method for manufacturing the same, wherein the monolithic ink-jet printhead includes a manifold for supplying ink, an ink chamber having a hemispheric shape, and an ink channel formed monolithically on a substrate; a silicon oxide layer, in which a nozzle for ejecting ink is centrally formed in the ink chamber, is deposited on the substrate; a heater having a ring shape is formed on the silicon oxide layer to surround the nozzle; a MOS integrated circuit is mounted on the substrate to drive the heater and includes a MOSFET and electrodes connected to the heater. The silicon oxide layer, the heater, and the MOS integrated circuit are formed monolithically on the substrate. Additionally, a DLC coating layer having a high hydrophobic property and high durability is formed on an external surface of the printhead.Type: GrantFiled: December 22, 2003Date of Patent: October 2, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Hyeon-cheol Kim, Yong-soo Oh, Keon Kuk, Kwang-joon Yoon, Jae-sik Min, Sang-hyun Lee, Chang-seung Lee, Seog Soon Baek, Sang-wook Lee, Jong-cheol Shin
-
Patent number: 7275310Abstract: A method for manufacturing an ink-jet recording head. The method includes forming a photosensitive resin layer on a support component and forming through holes in the resin layer. Since the diameters of the through hole on both sides of the photosensitive resin layer are made equal, the bonding area of a filter to a substrate is ensured, and the aperture area of the through hole per unit area is increased. A maximum aperture diameter is made to be smaller than or equal to a maximum linear distance between intersection points of a straight line passing through the geometric center of the ejection nozzle and an edge of the ejection nozzle. The head substrate and the filter are press-contacted. The support component is removed. The resulting recording head can prevent a reduction of the yield due to non-ejection of ink.Type: GrantFiled: December 16, 2004Date of Patent: October 2, 2007Assignee: Canon Kabushiki KaishaInventor: Takumi Suzuki
-
Publication number: 20070209605Abstract: The present invention involves a water heater and method of manufacturing the same. The water heater includes a tank assembly and a base assembly. The base assembly includes a heater assembly, a control unit, a control circuit and at least one temperature sensor. The base assembly is a separate module that has at least the heater assembly and control unit mounted thereto.Type: ApplicationFiled: February 3, 2006Publication date: September 13, 2007Applicant: Robertshaw Controls CompanyInventor: Raymond Joubran
-
Patent number: 7263773Abstract: A method of manufacturing a bubble-jet type ink jet printhead. The method includes forming resistive heater elements on a substrate, forming a patterned electrode layer on the resultant structure, forming an insulating layer over the resultant structure, forming barrier walls on the resultant structure and attaching a nozzle plate on the resultant structure. The method may further include etching a hole in the insulating layer, forming a second electrode layer over the etched insulating layer to contact the resistive heater elements and forming a second insulating layer thereon, where the barrier walls and then the nozzle plate are formed on top of the second insulating layer. The barrier walls group together resistive heater elements in pairs and form barriers between different pairs of resistive heater elements.Type: GrantFiled: March 12, 2004Date of Patent: September 4, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Chung-jeon Lee, Jae-ho Moon, O-keun Kwon
-
Patent number: 7257883Abstract: In the manufacture of an electric heater, means (24, 26) is provided for feeding and guiding a ribbon heating element (14) progressively into overlying edgewise relationship with a base (2). Means (6, 8) is provided for supporting the base (2) and for effecting relative motion between the base (2) and the feeding and guiding means (24, 26), such that motion of the base (2) is synchronised with feeding of the element (14) as it is fed and guided into the relationship with the base (2), to urge the heating element (14) towards the base (2) and cause an edge portion (22) of the heating element (14) to become embedded in the base (2).Type: GrantFiled: January 27, 2003Date of Patent: August 21, 2007Assignee: Ceramaspeed LimitedInventor: Kevin Ronald McWilliams
-
Patent number: 7241975Abstract: Resistive igniter systems are provided that comprise a metal substrate with an associated resistive igniter element in electrical connection through braze applied to the metal substrate. Igniter systems of the invention can enable significantly simplified manufacturing as well as notably higher yield production of more robust igniters. In preferred systems, the braze material is applied to the metal substrate prior to adjoining the igniter and metal substrate, which can enable application of a relatively precise amount of braze in a defined area of the metal substrate.Type: GrantFiled: May 25, 2005Date of Patent: July 10, 2007Assignee: Saint-Gobain Ceramics and Plastics, Inc.Inventors: Scott M. Hamel, Taehwan Yu, Louis Castriotta, III, Jack F. Eckalbar, Jr.
-
Patent number: 7216420Abstract: A print head manufacturing method in which satisfactory precision can be obtained by simple processes are provided. Projecting objects having a predetermined shape are formed on a substrate, and a setting resin is applied on the substrate and is set. Then, the projecting objects are removed so that ink cells and nozzles are formed. The thickness of the setting resin is determined such that tip portions of the projecting objects project above the setting resin and ink cells can be formed.Type: GrantFiled: March 20, 2003Date of Patent: May 15, 2007Assignee: Sony CorporationInventors: Manabu Tomita, Koichi Igarashi
-
Patent number: 7207109Abstract: A method for producing an ink jet head including, on a substrate, a piezoelectric element for discharging an ink from a discharge port, and an ink flow path communicating with the discharge port so as to correspond to the piezoelectric element, the method comprising in this order a step of providing, on the substrate, a mold material corresponding to the ink flow path, a step of providing a wall material of the ink flow path so as to cover the mold material, a step of eliminating a portion of the substrate corresponding to the piezoelectric element thereby forming a space in the substrate, and a step of eliminating the mold material thereby forming the ink flow path.Type: GrantFiled: February 5, 2004Date of Patent: April 24, 2007Assignee: Canon Kabushiki KaishaInventors: Hiroyuki Tokunaga, Osamu Kanome, Takehito Nishida
-
Patent number: 7204015Abstract: A method for producing a uniformly heated electric heating cloth comprising the steps of forming heating threads by dissolving a thermoplastic polymer in an organic solvent, adding an industrial carbon which is produced from acetylene to form a first mixture, grinding the mixture of industrial carbon and thermoplastic polymer, adding a colloidal graphite to form a second mixture, grinding the second mixture, coating threads with the second mixture in a spinneret, heating the coated threads to remove the organic solvent; and interweaving the coated heating threads with non-conducting threads in a perpendicular direction.Type: GrantFiled: November 14, 2003Date of Patent: April 17, 2007Inventor: David Kleshchik
-
Patent number: 7200921Abstract: A method of making a windshield having first and second outer layers and a conductive bar, an electrical connector, and an intermediate layer positioned between the outer layers. The method includes the step of sinking the conductive bar and the electrical connector into a surface of the intermediate layer so as to be at least substantially flush with the surface. After sinking the conductive bar and the electrical connector into the surface, the first outer layer is engaged with the surface of the intermediate layer. Additionally, the second outer layer is engaged with a second surface of the intermediate layer.Type: GrantFiled: February 4, 2005Date of Patent: April 10, 2007Assignee: Automotive Components Holdings, LLCInventor: Joseph M. Loibl
-
Patent number: 7198358Abstract: According to an embodiment of the invention, there is provided a heating element including a substrate, a conductive layer disposed over the substrate to define a first conductive trace and a second conductive trace with a spacer therebetween and a resistive layer covering the first conductive trace, the second conductive trace and the spacer wherein the resistive layer at least partially electrically connects the first and the second conductive traces.Type: GrantFiled: February 5, 2004Date of Patent: April 3, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: Jiansan Sun, Vineet Sharma, Hong Choon Lee
-
Patent number: 7188419Abstract: A method of producing an ink jet printhead with a plurality of nozzles and one or more heater elements corresponding to each nozzle. Each heater element is configured to heat a bubble forming liquid in the printhead to a temperature above its boiling point to form a gas bubble therein. The generation of the bubble causes the ejection of a drop of an ejectable liquid (such as ink) through the respective corresponding nozzle, to effect printing. Conveniently, a thin nozzle plate is formed in-situ on the wafer substrate. Depositing a nozzle plate by chemical vapor deposition (CVD) allows the nozzle plate to be included in the printhead at the scale of normal silicon wafer production, using processes normally used for semi-conductor manufacture. Standard lithographic equipment used in the modern semiconductor industry provides a high throughput as well as a high degree of accuracy.Type: GrantFiled: February 17, 2004Date of Patent: March 13, 2007Inventor: Kia Silverbrook
-
Patent number: 7178904Abstract: A micro-fluid ejection device for ultra-small droplet ejection and method of making a micro-fluid ejection device. The micro-fluid ejection device includes a semiconductor substrate containing a plurality of thermal ejection actuators disposed thereon. Each of the thermal ejection actuators includes a resistive layer and a protective layer for protecting a surface of the resistive layer. The resistive layer and the protective layer together define an actuator stack thickness. The actuator stack thickness ranges from about 500 to about 2000 Angstroms and provides an ejection energy per unit volume of from about 10 to about 20 gigajoules per cubic meter. A nozzle plate is attached to the semiconductor substrate to provide the micro-fluid ejection device.Type: GrantFiled: November 11, 2004Date of Patent: February 20, 2007Assignee: Lexmark International, Inc.Inventors: Frank E. Anderson, Robert W. Cornell, Daniel L. Huber
-
Patent number: 7168157Abstract: A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.Type: GrantFiled: April 29, 2003Date of Patent: January 30, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: Richard Todd Miller, Susanne L Kumpf
-
Patent number: 7168166Abstract: A method of producing an ink jet printhead with a plurality of nozzles and one or more heater elements corresponding to each nozzle. Each heater element is configured to heat a bubble forming liquid in the printhead to a temperature above its boiling point to form a gas bubble therein. The generation of the bubble causes the ejection of a drop of an ejectable liquid (such as ink) through the respective corresponding nozzle, to effect printing. Conveniently, a thin nozzle plate is formed in-situ on the wafer substrate. Depositing a nozzle plate by chemical vapor deposition (CVD) allows the nozzle plate to be included in the printhead at the scale of normal silicon wafer production, using processes normally used for semi-conductor manufacture. Standard lithographic equipment used in the modern semiconductor industry provides a high throughput as well as a high degree of accuracy.Type: GrantFiled: February 17, 2004Date of Patent: January 30, 2007Assignee: Silverbrook Research Pty LtdInventor: Kia Silverbrook
-
Patent number: 7166823Abstract: A method for the production of a heating element that is composed essentially of molybdenum silicide and alloys of that basic material, and a heating element formed from such material. A material is produced that contains substantially Mo(Si1-xAlx)2 and Al2O3 by mixing a molybdenum aluminum silicide Mo(Si1-yAly)2 with bentonite clay in a known manner. The bentonite clay contains impure or contaminating substances with which molybdenum silicide cannot be alloyed and with which the symmetry of the crystal lattice of the molybdenum silicide is retained with a combined content of less than 2000 ppm.Type: GrantFiled: March 6, 2003Date of Patent: January 23, 2007Assignee: Sandvik Intellectual Property AktiebolagInventors: Mats Sundberg, Hans Pettersson
-
Patent number: 7155808Abstract: A thin-film magnetic head comprises at least one of a magnetoresistive device and an electromagnetic transducer, and a heater adapted to generate heat upon energization. A method of making this thin-film magnetic head comprises a heater forming step of forming the heater, and an annealing step of annealing the heater formed by the heater forming step.Type: GrantFiled: June 15, 2004Date of Patent: January 2, 2007Assignee: TDK CorporationInventors: Tetsuro Sasaki, Soji Koide, Eiichi Omata, Masashi Sano, Nobuya Oyama
-
Patent number: 7155803Abstract: A pressure sensor includes a pressure sensor house assembly which contains a reference cavity, in which a vacuum exists, and a getter capable of being thermally activated. The getter is activated by directly contacting the getter with an exterior heated body, conducting heat from the exterior heated body, maintaining the exterior heated body in direct contact with the getter for a predetermined period of time, and removing the exterior heated body.Type: GrantFiled: February 10, 2004Date of Patent: January 2, 2007Assignee: MKS Instruments Inc.Inventor: Staffan Jonsson
-
Patent number: 7140097Abstract: A method of manufacturing a chip-type ceramic electronic component having stable electrical properties and excellent mechanical strength includes the steps of providing a plurality of green sheets having predetermined cutting positions, coating inorganic paste including the same ceramic material as that included in ceramic green sheets, and an inorganic material having higher resistivity than that of the ceramic material, on a region of each ceramic green sheet, and laminating a predetermined number of the ceramic green sheets to form a ceramic laminated product. Then, the ceramic laminated product is cut into a chip at the predetermined cutting positions and sintered to form a ceramic sintered compact, and external electrodes are formed at both ends of the ceramic sintered compact.Type: GrantFiled: August 5, 2003Date of Patent: November 28, 2006Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Furukawa, Masahiko Kawase
-
Patent number: 7141762Abstract: Information handling system peripherals that use a heating element are protected from catastrophic failure due to overheating by a thermal failsafe associated with the heating element that fails the heating element if excessive temperatures are reached. For instance, the failsafe releases the vacuum from a heating element bulb so that the application of power to the filament of the heating element bulb oxidizes the filament resulting in failure of the filament and ceasing of generation of heat. The failsafe includes a melting agent, such as wax or solder, which seals an opening in the bulb unless a thermal runaway temperature is reached in excess of a desired operating temperature. Alternatively, the failsafe includes an expanding agent, such as a ceramic or a liquid-filled bubble, which releases the vacuum by fracturing an opening in the bulb at the thermal runaway temperature. The thermal runaway temperature is selected to induce failure before catastrophic overheating of the peripheral.Type: GrantFiled: September 13, 2005Date of Patent: November 28, 2006Assignee: Dell Products L.P.Inventors: Wayne Iltis, Donald Guthan
-
Patent number: 7134187Abstract: A structure of inkjet-head chip and a method for making the same are disclosed. Driven by the need of making a thin insulator layer to lower the working power of the inkjet-head chip, we separately manufacture a passivation layer and a second conductive layer. The passivation layer and the second conductive layer have to be formed from different materials. The defining means for the passivation layer and the second conductive layer have high selectivity and do not overetch or damage the structure of inkjet-head chip.Type: GrantFiled: June 3, 2004Date of Patent: November 14, 2006Assignee: Industrial Technology Research InstituteInventors: Chien-Hung Liu, Jian-Chiun Liou, Chi-Ming Huang, Chia-Cheng Chiao, Chun-Jung Chen
-
Patent number: 7131187Abstract: A heating element that can be incorporated into a molded foam article closely adjacent to the outer cover sheet without showing any evidence that a heating element is encapsulated within the foam portion of the article and provides essentially the same relatively softness and “feel” that would be obtained if the heating element was not part of the article.Type: GrantFiled: June 19, 2002Date of Patent: November 7, 2006Assignee: Check CorporationInventors: Robert Check, William R. Parnis, Thomas A. Stuef
-
Patent number: 7126090Abstract: A ceramic heater is provided including a ceramic sintered body and a heat resistor embedded in the substrate, wherein a change in the temperature uniformity on the heating face is reduced. The heat resistor contains a metal comprising one or more metal elements selected from the group consisting of Group IVa, Group Va and Group VIa elements of the Periodic Table and a carbide of the metal. A ratio (Ic/Im) of a total strength (Ic) of main peak of the metal carbide to a total strength (Im) of main peak strength of the metal is not larger than 0.2. Alternatively, the ratio (Rb?Ra)/Ra is not larger than 30 percent, where “Ra” is the resistance of the heat resistor before sintering and “Rb” is the resistance of the heat resistor after sintering.Type: GrantFiled: March 13, 2003Date of Patent: October 24, 2006Assignee: NGK Insulators, Ltd.Inventors: Shinji Yamaguchi, Kazuhiro Nobori
-
Patent number: 7118704Abstract: A system and method including an injection molding system (e.g., nozzle) having a nozzle body with a heater holding portion that receives a heating device that is releasably secured in the heater holding portion. The nozzle has at least one flat or planar outer surface and can be made from a high wear and high pressure resistant material (e.g., Aermet). A slot of the heater holding portion and the heating device can be of complimentary geometries, such as rectangular shaped, wedge shaped, or any other shape. The heating device can include a holding device having receiving areas. Each receiving area can receive a respective heater that can be removed from the nozzle body. The nozzle body is provided with a clamping mechanism to insure an intimate contact between the heater holding portion and the heater device.Type: GrantFiled: December 11, 2003Date of Patent: October 10, 2006Assignee: Mold-Masters LimitedInventor: George Olaru
-
Patent number: 7096568Abstract: A new process and structure for microcomponent interconnection utilizing a post-assembly activated junction compound. In one embodiment, first and second microcomponents having respective first and second contact areas are provided. A junction compound is formed on one of the first and second contact areas, and the first and second contact areas are positioned adjacent each other on opposing sides of the junction compound. The junction compound is then activated to couple the first and second microcomponents.Type: GrantFiled: July 10, 2003Date of Patent: August 29, 2006Assignee: Zyvex CorporationInventors: Erik Nilsen, Matthew D. Ellis, Charles L. Goldsmith, Jeong Bong Lee, Xiaojun Huang, Arun Kumar Nallani, Kabseog Kim, George D. Skidmore
-
Patent number: 7086135Abstract: A method for manufacturing a glow plug, the glow plug comprising a cylindrical metal shell having an internal bore formed in an axial direction, and a heater tube adapted to be press-fitted from its rear end side into the internal bore and having a leading end closed, the method comprising the steps of: place a stopper abutting on the leading end; and applying an axial load between the stopper and the metal shell so as to start a clamping of a side of the heater tube through a support member and to start a press-fit of the heater tube in the metal shell and an apparatus for manufacturing the glow plug.Type: GrantFiled: July 21, 2003Date of Patent: August 8, 2006Assignee: NGK Spark Plug Co., Ltd.Inventor: Hiroshi Kato
-
Patent number: 7086142Abstract: A method of manufacturing an ink-jet printhead, including forming an insulation film on a substrate, depositing a metal layer onto said insulation film and patterning said metal layer to form a heater, forming an electrical wire on said substrate, etching said substrate at a predetermined depth from a top surface of said substrate in a direction perpendicular to a major surface of said heater to form a narrow passage, depositing an ink chamber barrier layer on said top surface of said substrate and patterning said ink chamber barrier layer to form an ink chamber, stacking a nozzle plate having a nozzle on said ink chamber barrier layer and disposed on an upper portion of said ink chamber barrier layer, and applying predetermined pressure and temperature onto said nozzle plate to bond said nozzle plate and said substrate, and etching said substrate from a bottom surface thereof to form a wide passage communicating with said narrow passage.Type: GrantFiled: July 19, 2002Date of Patent: August 8, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Il Kim, Seo-hyun Cho
-
Patent number: 7069641Abstract: The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated material comprising a top metal layer and a bottom metal layer, an insulating layer between the top and the bottom metal layer, and a conducting through hole disposed between the top metal layer and the bottom metal layer. A composite electroplating process is then performed to form an composite electroplating layer on the surface of the top metal layer, wherein the composite electroplating layer is a continuous porous structure with a secondary aggregation of carbon black and electroplated metal.Type: GrantFiled: April 25, 2003Date of Patent: July 4, 2006Assignee: Protectronics Technology CorporationInventors: Ren-Haur Hwang, Der-Yang Liu, Chen-Ron Lin
-
Patent number: 7069656Abstract: A monolithic ink-jet printhead includes a substrate having an ink chamber to be filled with ink to be ejected on a front surface, a manifold for supplying ink to the ink chamber on a rear surface, and an ink channel communicating between the ink chamber and the manifold, a barrier wall formed on the front surface of the substrate to a predetermined depth and defining at least a portion of the ink chamber in a width-wise direction, a nozzle plate including a plurality of material layers stacked on the substrate and having a nozzle penetrating the nozzle plate, so that ink ejected from the ink chamber is ejected through the nozzle, a heater formed between adjacent material layers and located above the ink chamber for heating ink to be supplied within the ink chamber; and a conductor for providing current across the heater being provided between adjacent material layers.Type: GrantFiled: April 11, 2005Date of Patent: July 4, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Su-ho Shin, Seog-soon Baek, Yong-soo Oh, Seung-ju Shin
-
Patent number: 7067774Abstract: A heating element for placing on a pipe or nozzle comprises a current-carrying conductor connectable by means of connecting leads to a power supply. Each of the connecting leads has a terminal contact piece which can be engaged with a contact surface of the heating element. The contact piece can be clamped against the heating element by means of a clamping device. The contact piece rests loosely on the contact surface and the clamping force of the clamping device acts in a substantially normal manner to the contact surface and clamps the contact piece against said contact surface.Type: GrantFiled: May 12, 2005Date of Patent: June 27, 2006Assignee: Watlow GmbHInventor: Michael Hoffmann
-
Patent number: 7053343Abstract: Methods for forming electrically conductive heated dielectric panels are provided. The panels are utilized for warming objects and/or insuring unobstructed viewing through the panels by removing moisture. The methods include depositing electrically conductive metal bus bars onto the dielectric panel, onto which panel a conductive coating has previously been disposed. The conductive metal bus bars are deposited onto the coated dielectric panel through the use of a circularly rotating or an inline heating head and mask apparatus, in combination with an oxyacetylene or a plasma device. A metallic tab, which extends from the panel peripheral edge, is brought into electrical contact with each conductive metal bus bar for external electrical connectivity.Type: GrantFiled: December 22, 2004Date of Patent: May 30, 2006Assignee: Engineered Glass Products, LLC.Inventors: Peter F. Gerhardinger, Randall L. Bauman, Dillon R. Ashton
-
Patent number: 7051426Abstract: The described embodiments relate to methods and systems of forming slots in a substrate. One exemplary embodiment forms a feature into a substrate having a first substrate surface and a second substrate surface, and moves a sand drill nozzle along the substrate to remove substrate material sufficient to form, in combination with said forming, a slot through the substrate.Type: GrantFiled: September 12, 2003Date of Patent: May 30, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventor: Shen Buswell
-
Patent number: 7047626Abstract: Electrically resistive heating element, with metal strip electrodes secured thereto, and with electrical wires secured to said metal strip electrodes, is encapsulated with thermoset-molding compound.Type: GrantFiled: July 15, 2004Date of Patent: May 23, 2006Assignee: Bulk Molding Compounds, Inc.Inventor: John Clulow
-
Patent number: 7028402Abstract: A liquid dispenser includes a substrate and a plurality of liquid-dispensing portions, arranged on the substrate, including at least one liquid chamber for storing liquid, one nozzle, and one heating element, wherein the heating elements are energized to heat liquid stored in the corresponding liquid chambers to eject a droplet of the liquid from the corresponding nozzles; the heating elements and the liquid chambers have a protective layer and an insulating layer therebetween; each heating element, the insulating layer, the protective layer, and each liquid chamber are arranged in that order; the insulating layer isolates the protective layer from the heating elements; and the protective layer comprises an inorganic material, protects the heating elements, has a strip shape so as to cover some of the plurality of heating elements adjacent to each other, and has slits each disposed between the heating elements. A printer includes such a liquid dispenser.Type: GrantFiled: October 28, 2004Date of Patent: April 18, 2006Assignee: Sony CorporationInventors: Takaaki Miyamoto, Manabu Tomita, Shogo Ono, Minoru Kohno, Osamu Tateishi
-
Patent number: 7020952Abstract: A green ceramic heater including a green heating resistor formed of an electrically conductive ceramic (e.g., silicide or carbide of a metal element such as W, Ta, or Nb) and an insulative ceramic (e.g., silicon nitride) and power supply leads (e.g., made of W), a first end of each power supply lead being connected to a corresponding end of the green heating resistor, the green heating resistor and the power supply leads buried in a green substrate formed of a material (e.g., silicon nitride) is fired, and subsequently, the resultant ceramic heater is heat-treated at 900 to 1,600° C., to thereby enhance flexural strength of the ceramic heater. The heat treatment is preferably carried out prior to forming a glass layer on an outer circumferential surface of the ceramic heater.Type: GrantFiled: November 27, 2002Date of Patent: April 4, 2006Assignee: NGK Spark Plug Co., Ltd.Inventors: Shindo Watanabe, Masahiro Konishi, Katsuhisa Yabuta
-
Patent number: 7013555Abstract: The present invention discloses a method of providing an integral thermal interface on an interface surface of a heat dissipation device, such as a heat sink. In accordance with the present invention, the phase change material is applied directly onto the interface surface of the heat sink to form an integral interface layer directly on the heat sink during the manufacturing process. This process includes the steps of providing a heat dissipating device having an interface surface, liquefying the phase change material at a controlled temperature so as to decrease the material viscosity to a flowable form, applying the liquefied phase change material directly onto the mating surface of the heat dissipating device either by directly dispensing the material, screen printing or stencil printing and cooling the material causing it to cure on the surface of the heat dissipating device.Type: GrantFiled: August 20, 2002Date of Patent: March 21, 2006Assignee: Cool Shield, Inc.Inventor: Kevin A. McCullough
-
Patent number: 7002115Abstract: An electrically conductive heated glass panel assembly, control system, and method for producing panels are provided to warm objects and to insure unobstructed viewing through glass by removing moisture. An integrated connection circuit interconnects glass sheets, which have a low emissivity conductive coating deposited thereon. The circuit includes copper bus bars that are disposed onto the conductive coating through the use of a circularly rotating or an inline heating head and mask apparatus. A metallic tab, which extends from the glass sheet's peripheral edge, is disposed onto each conductive metal bus bar for external electrical connectivity. Two types of glazing channels are offered to interconnect multiple panels to external circuits and controls. A solid-state controller may be provided to obtain sensor control signals so as to drive a triac circuit that provides current flow through the panel for the desired heating.Type: GrantFiled: April 28, 2004Date of Patent: February 21, 2006Assignee: Engineered Glass Products, LLC.Inventors: Peter F. Gerhardinger, Randall L. Bauman, Dillon R. Ashton
-
Patent number: 6988316Abstract: A manufacturing method of a fluid jetting apparatus, including: forming a heat driving part, a membrane, and a nozzle part; and forming a nozzle and jetting fluid chambers sequentially by using one nozzle plate, and assembling the heat driving part, the membrane, and the nozzle part, sequentially.Type: GrantFiled: December 6, 1999Date of Patent: January 24, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Soon-cheol Kweon, Byoung-chan Lee, Kyoung-jin Park
-
Patent number: 6986202Abstract: A method of fabricating a micro-electromechanical fluid ejection device includes the step of forming a first layer of a sacrificial material on a substrate incorporating a drive circuitry layer. A first electrically conducting layer, a first structural layer and a second electrically conducting layer are formed on the sacrificial material with the first structural layer interposed between the electrically conducting layers. The sacrificial material is formed so that the first electrically conducting layer defines a heating circuit connected to the drive circuitry, and the electrically conducting layers and the first structural layer define a fluid ejecting member connected to an actuator arm that is displaceable on heating and subsequent expansion of the first electrically conducting layer. A second layer of sacrificial material is formed on the second conducting layer layer. A second structural layer is formed on the second layer of sacrificial material.Type: GrantFiled: October 21, 2004Date of Patent: January 17, 2006Assignee: Silverbrook Research Pty Ltd.Inventor: Kia Silverbrook
-
Patent number: 6976308Abstract: A method for conductively connecting first and second electrical conductors is described which consist of different materials. In carrying out the method the ends of the first and second conductors are brought into mechanical contact with each other in an overlapping position. The first and second conductors then are connected to each other by welding without feeding of additional welding material. Finally the overlapping area is formed mechanically to achieve a smooth width transition between the first and second conductors.Type: GrantFiled: November 18, 2003Date of Patent: December 20, 2005Assignee: NEXANSInventor: Odd Magne Jonli
-
Patent number: 6971171Abstract: The present invention provides a method for manufacturing an ink jet recording head utilizing ink bubbling by heating of an exothermic resistor to thereby eject ink and a method manufacturing the same, including the steps of: preparing a substrate provided with the exothermic resistor; applying such first resin on the substrate as to provide a first mold shape for forming the nozzle channel and the movable member; forming the first mold shape using the first resin; applying, on the substrate, second resin over the first mold shape for forming the nozzle channel and the movable member; and removing the first mold shape. By this method, the movable member is formed in the nozzle channel between the ink inlet and the exothermic resistor to thereby provide a high-density, high-accuracy ink jet recording head which can improve a frequency response while maintaining proper discharge performance.Type: GrantFiled: August 22, 2003Date of Patent: December 6, 2005Assignee: Canon Kabushiki KaishaInventors: Hirokazu Komuro, Masashi Miyagawa, Yoshinori Misumi, Masahiko Kubota, Hiroyuki Sugiyama, Ryoji Inoue
-
Patent number: 6969827Abstract: A heating element used for a heated seat assembly of the present invention comprises a base material made of hotmelt material, and a linear heater disposed at a predetermined pattern on the base material. The linear heater is fixed by adhesion or sewing onto the base material. In one example of the present invention, the linear heater is characterized in that a plurality of conductors and threads are braided into the linear heater. In another example, a number of threads comprising the linear heater is at least the same with a number of conductors. According to the heating element of the present invention and the method of manufacturing the heated seat assembly according to the present invention, a heated seat assembly with excellent seating comfort and even seat temperature can be obtained, and the heating element is durable.Type: GrantFiled: July 28, 2003Date of Patent: November 29, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Mitsuru Yoneyama, Naohito Asami, Akira Shiratake, Norio Abe, Kazumi Nagayama
-
Patent number: 6967312Abstract: A process for producing a ceramic heater includes forming a resistance heating element on a surface of a ceramic substrate. The resistance heating element is divided into plural sections. Resistivities of the plural sections are measured, respectively. Each of the plural sections is trimmed according to a comparison between the resistivities of the plural sections.Type: GrantFiled: July 19, 2001Date of Patent: November 22, 2005Assignee: Ibiden Co., Ltd.Inventors: Yasuiji Hiramatsu, Yasutaka Ito, Satoru Kariya
-
Patent number: 6966112Abstract: Inkjet printheads capable of printing smaller and larger drop-weight quantities of ink, and methods of manufacturing the inkjet printheads, are disclosed. The inkjet printhead includes a substrate. One or more portions of the substrate may be etched such that the substrate might have different thicknesses. A thin-film layer is connected to the substrate and contains independently addressable ink-energizing elements, preferably resistors. An orifice layer having a substantially planar exterior surface is applied directly to the thin-film layer. Consequently, the thickness of the orifice layer varies with the thickness of the substrate. At least one firing chamber is defined in each portion of the orifice layer with a different thickness and, preferably, different-sized resistors. Alternatively, the orifice layer has a substantially uniform thickness. In order to achieve the multiple drop-weight capability of the present invention, firing chambers of different volumes are provided.Type: GrantFiled: December 10, 2002Date of Patent: November 22, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventor: Naoto Kawamura
-
Patent number: 6961991Abstract: A method of manufacturing a coil unit includes the first step of disposing a coil between a first frame and a second frame, the second step of pouring liquid resin into between the first frame and the second frame with the coil disposed therebetween, and the third step of curing the liquid resin to thereby fix the first frame, the second frame and the coil to one another.Type: GrantFiled: May 20, 2002Date of Patent: November 8, 2005Assignee: Canon Kabushiki KaishaInventors: Atsushi Fuseya, Hajime Sekiguchi
-
Patent number: 6953911Abstract: A composite laminate useable in the manufacture of articles having a member responsive to electrical stimuli, e.g. changes transmission, and/or is heated, as current passes through the member includes a pair of spaced bus bars adhesively secured to a major surface of a plastic sheet in a spaced relationship to one another. Each of the bus bars includes, among other things, an end portion having a protective sleeve and an air barrier to prevent air from moving between the inner surfaces of the protective sleeve and the underlying surface of the end portion of the bus bar. A method of making the composite laminate is also disclosed.Type: GrantFiled: September 1, 2004Date of Patent: October 11, 2005Assignee: PPG Industries Ohio, Inc.Inventors: Bruce A. Bartrug, Allen R. Hawk, Robert N. Pinchok, James H. Schwartz
-
Patent number: 6949724Abstract: An upper heat roller with an external heat source and a lower heat roller with an internal heat source are arranged with a paper transport path therebetween, in such a manner as to be pressed against each other. The lower heat roller is heated sufficiently, thereby supplying a paper sheet with sufficient heat when the paper sheet is transported through a contact region between the upper and lower heat rollers to be heated.Type: GrantFiled: November 8, 2004Date of Patent: September 27, 2005Assignee: Sharp Kabushiki KaishaInventors: Toshiaki Kagawa, Shogo Yokota
-
Patent number: 6949727Abstract: A carbon heating apparatus utilizing a graphite felt and a method of manufacturing thereof are presented comprising: a carbon heater made of a carbon fiber cut having a preset length and width, being performed heat treatment in a hydrogen gas atmosphere, a pair of terminal parts having a flat portion (31) at one end for connecting to outside power supply lines and clamping brackets (32) with protrusions (33) at opposite end for securely attaching to the carbon heater, and a quartz glass tube (10) with melt-jointing potions (15) for sealing both ends of the carbon heater.Type: GrantFiled: October 1, 2003Date of Patent: September 27, 2005Assignee: Star Electronics Co., LTD.Inventor: Jong-Yun Park
-
Patent number: 6944393Abstract: Panel (10) for generating and diffusing heat obtained from a heat-radiating board (30) comprising one or more pieces of electrothermal fabric, with strips of fibreglass laid side by side to form the warp, the weft (50) consisting of a continuous copper wire (51), small in diameter and of considerable length, coated with insulating material, that extends serpentinewise passing alternatively above and below the strips of fibreglass, said board (30) being completed by intermediate and external layers (35, 36) of epoxidic thermoadhesive material and clad on both surfaces with sheets of micanite (31, 32), so that on connecting the ends of the wire (51) forming the weft (50) to a source of electric current, boring holes (65, 66) using means, that may be a laser beam, on the thermoadhesive layer (35, 36) covering the weft (50), this latter converts electric energy into thermal energy.Type: GrantFiled: June 30, 1999Date of Patent: September 13, 2005Assignee: Cadif SrlInventor: Aldo Stabile
-
Patent number: 6938341Abstract: A method for manufacturing an ink discharge port of an ink jet recording head, which is provided with the ink discharge port for discharging an ink liquid droplet for adhesion thereof to a recording medium, a liquid chamber for retaining ink to be supplied to the discharge port, an ink flow path communicating with the discharge port and the liquid chamber, an energy generating element provided for a part of the ink flow path, and an ink supply port for supplying ink from outside to the liquid chamber, includes the step of processing and forming the wall face inside the ink discharge surface of the ink discharge port to a surface condition having irregularities of greater than or equal to 0.3 micrometer and less than or equal to 1 micrometer as the standard deviation value for the surface roughness thereof.Type: GrantFiled: June 20, 2002Date of Patent: September 6, 2005Assignee: Canon Kabushiki KaishaInventors: Jun Koide, Sadayuki Sugama, Masao Mori