Abstract: In a device for measuring the filling level, thermoelements (20) are used which are disposed on a sheet-shaped support (25). The thermoelements (20) consist of two different materials and are disposed in two rows (71, 72) placed side by side. Two adjacent thermoelements (20) of said rows (71, 72) have a common junction point (23) that is heated. Both rows (71, 72) of thermoelements also have two additional junction points that are cold. A first group of thermoelements (20) is disposed with their supports (25) in the interior of the container and operate as measuring detectors. A second group of thermoelements (20) serves as reference sensors since they regulate the heat flow impinging upon the junctions points (23) relative to a defined reference voltage.

Abstract: A method of manufacturing an ink jet print head with a substrate defining an ink aperture. A number of ink energizing elements are located on the major surface of the substrate. A barrier layer is connected to the upper surface, and peripherally encloses an ink manifold. The barrier encompasses the ink aperture. An orifice plate is connected to the barrier layer, spaced apart from the substrate's major surface, enclosing the ink manifold. The plate defines a number of orifices, each associated with a respective ink energizing element. The ink manifold is an elongated chamber having opposed ends defined by end wall portions of the barrier layer. The barrier end wall portions each have an intermediate end wall portion protruding into the manifold.

Abstract: An ink-jet print head preventing thermal accumulation on a nozzle plate includes a substrate, a channel formed in the substrate to supply ink, a nozzle plate connected to the substrate and including a nozzle corresponding to the channel, a heat element formed in the nozzle plate to surround the nozzle, a thermal conduction layer formed on an upper side of the heat element formed between the thermal conduction layer and the heat element, and a thermal shunt spaced-apart from the heat element by a predetermined distance not to overlap the heat element in a direction parallel to the nozzle plate and connecting the thermal conduction layer to the substrate. Redundant heat generated from the heat element is not accumulated on a membrane of the nozzle plate but is rapidly absorbed into an inorganic thermal conduction layer formed in the membrane and is transferred to the bulk silicon substrate through a metallic thermal bridge, such as the thermal shunt.

Abstract: A method for forming an electrically isolated via in a multilayer ceramic package and an electrical connection formed within the via are disclosed. The method includes punching a first via in a first layer, filling the first via with a cross-linkable paste, curing the paste to form an electrical insulator precursor and forming the via in the insulator precursor. The electrical connection formed includes an insulator made from a cross-linked paste supported by a substrate of a multilayer ceramic package and a conductive connection supported by the insulator.

Abstract: A method of making a heated injection molding nozzle with an integral tip insert. First, an inner portion, an outer collar portion, and an electrical heating element are made and integrally brazed together in a vacuum furnace using a first nickel alloy brazing material. Then a tip insert is made having a desired configuration and seated in the front end of the inner portion and a second nickel alloy brazing material is applied around it. The second brazing material has a melting temperature which is substantially below that of the first brazing material. The tip insert is then integrally brazed in place by heating them to a temperature above the melting temperature of the second brazing material and below the melting temperature of the first brazing material. In addition to not affecting the metallurgical bonding between the other components, this allows the tip insert to be easily removed for replacement by again heating the nozzle to this same temperature.

Abstract: A method of forming a thermal bend actuator (6) is provided with upper arms (23, 25, 26) and lower arms (27, 28) which are non planar, so increasing the stiffness of the arms. The arms (23, 25, 26, 27, 28) may be spaced transversely of each other and do not overly each other in plan view, so enabling all arms to be formed by depositing a single layer of arm forming material.

Abstract: A heatable vehicle window (e.g., windshield, sidelite or backlite) includes a multi-layer coating formed on a substrate. The multi-layer coating includes at least one dielectric layer and at least one conductive layer. A pair of bus bars are deposited on the substrate over the coating, so that at least the dielectric layer is provided between the bus bars and the conductive layer(s). In order to create an electrical connection between the bus bars and the conductive layer(s) of the coating, the bus bars and/or coating is/are heated to a temperature sufficient to permit the bus bars to reach molten or semi-molten form. Portions of bus bar material then flow down through at least the dielectric layer of the coating (i.e., forming a contact hole in the coating) so as to contact the coating's conductive layer(s). After cooling of the newly formed bus bars, the window may be selectively heated by passing current through the conductive layer(s) via the bus bars.

Abstract: A method for manufacturing a thermal ink jet print head with high efficiency of heat transfer is disclosed. The heating resistors of the head are made of doped single crystalline silicon. Each resistor is disposed in a silicon stripe that is surrounded by a thermal insulating material filled trench and forms a top cover of a corresponding microchannel. The head generated by the resistor can only flow into the ink disposed in the microchannel. The microchannels and nozzles of the head are constructed in a single crystalline silicon substrate. The head is fabricated based on a porous silicon process including: (1) converting heavily doped single crystal silicon into porous silicon; (2) turning porous silicon into oxidized porous silicon; (3) using oxidized porous silicon as a stop barrier for anisotropic etching of single crystal silicon; and (4) selective etching of oxidized porous silicon.

Abstract: Method for producing a resistive heating element by coating a substrate with an electrically insulating material from the gaseous phase, depositing an electrically conducting material from the gaseous phase onto the layer of insulating material deposited onto the substrate, wherein the layer of conducting material deposited onto the layer of insulating material is subsequently partially mechanically removed thereby forming at least one conductor path. The substrate is machined before depositing the insulating material thereby forming at least one recess provided for receiving the conductor path. The layers of insulating material and conducting material are deposited onto the mechanically processed substrate. Finally, the layer of conducting material is evenly removed until at least the conducting material has been completely removed from the elevated regions of the substrate delimiting the recess of the conductor path, thereby forming the conductor path.

Abstract: The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.

Abstract: An inkjet printing device employs an inkjet printhead with a plurality of drop generators to eject drops of ink. Each drop generator includes a planar heater resistor, a protection layer having a first heating surface on the heater resistor and a second heating surface entirely surrounding the first heater surface on the heater resistor, and an ink ejection nozzle. The drop generator vaporizes ink at the first heating surface and ejects a drop of ink of a first mass from the nozzle when a first range of energies is applied to the heater resistor. The drop generator vaporizes ink at the first heating surface and the second heating surface and ejects a drop of ink of a second mass from the nozzle when a second range of energies is applied to the heater resistor.

Abstract: A method of manufacturing a liquid discharge head having an opening for discharging liquid droplets, a wall member constituting a liquid flow path to the opening, a substrate provided with and for creating a bubble in the liquid, and a movable member supported by and fixed to the substrate with the discharge opening side thereof as a free end displaced away from the substrate by pressure produced by creating the bubble to thereby direct the pressure to the discharge opening side including the steps of preparing the substrate and movable member, filling the gap between the movable member and the substrate with a liquid photo-curing resin, spin coating the resin until the resin covers the movable member, exposing an area of the resin to light to harden a portion corresponding to the wall member, and removing the unexposed portion of the photo-curing resin.

Abstract: A green ceramic heater including a green heating resistor formed of an electrically conductive ceramic (e.g., suicide or carbide of a metal element such as W, Ta, or Nb) and an insulative ceramic (e.g., silicon nitride) and power supply leads (e.g., made of W), a first end of each power supply lead being connected to a corresponding end of the green heating resistor, the green heating resistor and the power supply leads buried in a green substrate formed of a material (e.g., silicon nitride) is fired, and subsequently, the resultant ceramic heater is heat-treated at 900 to 1,600° C., to thereby enhance flexural strength of the ceramic heater. The heat treatment is preferably carried out prior to forming a glass layer on an outer circumferential surface of the ceramic heater.

Abstract: Thermistor chips are produced by preparing ceramic green sheets, applying an inorganic material such as a glass paste on these green sheets in areas including lines along which they are to be later cut, stacking a plurality of these green sheets one on top of another to obtain a stacked body, obtaining chips by cutting this stacked body along those pre-specified lines and subjecting these chips to a firing process to obtain sintered bodies, and forming outer electrodes on mutually opposite end surfaces of these sintered bodies. A thermistor chip thus produced has a thermistor element having outer electrodes on its mutually opposite end surfaces, and diffused layers of an inorganic material having a higher specific resistance than material of the thermistor element. These diffused layers are formed proximally to externally exposed surfaces of the thermistor element.

Abstract: A method, and structure formed thereof, for processing an exposed conductive connection between an thermal inkjet head device and a flexible tape circuit connectable to control signals for driving the inkjet device. According to the method of processing, the exposed conductive connection is electrophoretically plated with a polymer to protect it against corrosive damage by coupling the exposed conductive connection to a first voltage potential and immersing it into an electrophoretic polymer solution in contact with an electrode at a second voltage potential thereby establishing a current between the electrode and the exposed connection such that the exposed connection is coated with a thin film of polymer of uniform thickness.

Abstract: A semi-rigid heated element assembly and method of manufacturing semi-rigid heated element assemblies is provided. A heated element assembly includes a first thermoplastic sheet, a second thermoplastic sheet, and a resistance heating element laminated between the first and second thermoplastic sheets. The resistance heating element includes a supporting substrate having a first surface thereon and an electrical resistance heating material forming a predetermined circuit path having a pair of terminal end portions. The circuit path continues onto at least one flap portion that is capable of rotating about a first axis of rotation. The reformable continuous element structure may be formed into a final element assembly configuration whereby at least the flap portion is rotated along its axis of rotation to provide resistance heating in at least two planes. Semi-rigid heating elements may be formed into heated containers, heated bags, and other objects with complex heat planes.

Abstract: An ink-jet printhead having a hemispherical ink chamber and a method for manufacturing the same, wherein the ink-jet printhead includes a substrate, in which a manifold for supplying ink, an ink chamber having a substantially hemispherical shape, and an ink channel for supplying ink from the manifold to the ink chamber are integrally formed; a nozzle plate having a multi-layered structure, in which a first insulating layer, a thermally conductive layer formed of a thermally conductive material, and a second insulating layer are sequentially stacked, and having a nozzle, formed at a location corresponding to the center of the ink chamber; a nozzle guide having a multi-layered structure and extending from the edge of the nozzle to the inside of the ink chamber; a heater formed on the nozzle plate to surround the nozzle, and an electrode formed on the nozzle plate to be electrically connected to the heater.

Abstract: A method of manufacturing a head of an inkjet printer includes forming a heater on a substrate and also forming an ink feeding passage through the substrate in a vertical relation to a surface where the heater is formed, forming an ink chamber communicating with the ink feeding passage of the substrate; attaching the substrate to the nozzle plate, and forming a tapered nozzle in the nozzle plate, the tapered nozzle being narrower in diameter in an inside of the nozzle plate than an outside of the nozzle plate, by radiating a laser beam from inside toward the outside of the nozzle plate, wherein the substrate is used as a mask. Since the nozzle is formed by radiating the laser beam to the nozzle plate through the ink feeding passage of the substrate after attaching the nozzle plate to the substrate, the accuracy of the nozzle in form and position improves, and the nozzle of desirable structure of the improved ink discharge efficiency can be obtained by radiating the laser beam only once.

Abstract: A method and system for fabricating electrical heating devices employing positive temperature coefficient (PTC) thermistor as heating elements which includes: assembling the heating devices with PTC thermistor heating elements preselected according to electrical resistance, applying pressure across the interface between the PTC heating elements and the radiator plates of the heating devices during their assembly, and exposing the heating devices for extended periods of time to both ambient and operational temperatures. The method of fabrication further includes continuously monitoring the electrical resistance of the heating devices and holding their electrical resistance stable by adjusting the pressure applied across the interface between the PTC heating elements and the radiator plates.

Abstract: A method of manufacturing a thermal head comprises forming a heating resistor on an insulating substrate and forming a wiring electrode on the heating resistor so that a heating portion of the wiring electrode is disposed around the heating resistor. An inorganic masking agent is disposed on a given portion of the wiring electrode, and a protective film is formed over the heating resistor, the wiring electrode and the inorganic masking agent. The protective film is then removed from the given portion of the wiring electrode together with the inorganic masking agent to selectively form the protective film on the heating resistor and on the heating portion of the wiring electrode.

Abstract: A ceramic micro-glow plug made from three primary constituents, silicon, carbon and nitrogen by forming a precursor liquid polymer in a mold or by photolithograpy, drying, pyrolizing and annealing. A U-shaped design with two arms joined at thin tip, and the composition of the silicon carbon-nitride ceramic allow the tip to reach a high operating temperature with a minimum power applied across the electrical contacts. When the tip is at the highest operating temperature, the remainder of the structure remains relatively cool. In an embodiment, an additional component such as boron is added to the silicon carbon-nitride to increase the electrical conductivity of the micro-glow plug. In another embodiment, a plurality of micro-glow plugs are attached to a body wherein when the operational micro-glow plug fails, the next successive micro-glow plug receives power across its electrical contacts.

Abstract: A method to repair a permanently sealed air data tube by identifying at least one area of a strut component of said air data tube wherein said strut component may be broached to provide access to internal components accommodated generally within the interior portion of said tube; broaching said strut component and a probe component in areas generally consistent with those portions identified as providing manipulative access to internally accommodated components; removing said internally accommodated components; refurbishing the internal surface areas of the vacated air data tube; inspecting exterior surfaces and said internally accommodated components; determining air data tube components requiring replacement wherein said determination is made by choosing from a group of some or all of the used air data tube components including, but not limited to, a strut component, one or more heating element component(s), a probe component, one or more static line component(s), one or more static line fitting component(s

Abstract: An assembly method for a vehicle anti-theft key having an embedded resistor pellet is provided. The resistor pellet includes a flange at one end which abuts one side of the key blade when the opposed end of the pellet is inserted into a through opening formed in the shank portion of the key blade. With the resistor pellet loosely positioned within the through opening, a second flange is attached to the end of the pellet that was inserted through the through opening, thereby capturing the pellet within the through opening by the two opposed flanges. In one embodiment, the second flange is formed in place by employing a polymeric molding process, such as a thermoforming injection molding process. A handle for the key is efficiently formed substantially simultaneously with the second flange using the same polymeric molding process.

Abstract: The present invention provides a manufacturing method of an ink-jet recording head which does not form stagnant ink even at a high density and high speed recording and does not bear stagnant ink due to a heat influence during radiation of excima laser beam on ejecting ports(orifice) 706 and due to defects or deposited foreign particles during connecting the orifice 706 with a top board 102. In order to obtain such recording heads, before fabricating the ejecting ports 706 a by-product removing tape 101 is pasted capable of being peeled off, on eject port forming plate which is fabricated to an orifice plate 102, so as to increase adhesive property between the by-product removing tape and removed portion by the laser beam.

Abstract: A tool for removing ball grid array (BGA) packaged integrated circuit or multi-chip modules from printed circuit boards is comprised of a two-tined fork with a heated wire stretched between the tips of the tines and a thin sheet of material filling the area between the tines.

Abstract: An automotive instrument panel (IP) has a thermostatically controlled electric heating element for maintaining the plastic material of the IP at a temperature warm enough to inhibit brittle fracture during deployment of an airbag mounted within the IP. The heating element is formed by depositing a layer of electrically conductive material on an inner surface of the outermost layer of the IP along the perimeter of an airbag deployment path, bonding the outermost layer to a substrate, and using a laser to simultaneously score the IP around the deployment path and cut the conductive layer so that it forms a circuit through which electric current may be passed for resistance heating.

Abstract: A wirelaying apparatus and method using a tool (30) having a cutter (31) operatively opening a cut in the interior bore surface (11) of a cylindrical pipe fitting (10), laying wire (12) into the cut and closing the cut using a flange closer (33). The wire (12) is delivered into the cut via an aperture (32) through the cutting means (31). Delivery of the wire (12) into the cut is thereby improved, overcoming the problem of wire running free within the fitting. In a second embodiment (see FIG. 12) the cutter (31) is rotatably mounted allowing a double helical coil to be formed without removing the cutter from the bore surface.

Abstract: Opposing substrates of a vehicle window are laminated to one another using a polymer inclusive interlayer which has a notch or cut-out portion defined therein. Following lamination, at least one bus bar(s) supported by one of the substrates is exposed in this notch or cut-out portion of the interlayer. Then, an external connector may be electrically connected to the bus bar(s) at a location between the opposed substrates, by sliding a portion of the connector into a gap between the two laminated substrates at a location where the bus bar(s) is exposed due to the notch or cut-out in the interlayer. Because the connector can be electrically connected to the bus bar(s) after the lamination process, various techniques (e.g., nipper rolls, vacuum apparatus, etc.) may be used to laminate the substrates to one another prior to this electrical connection.

Abstract: The present invention discloses a method of providing an integral thermal interface on an interface surface of a heat dissipation device, such as a heat sink. In accordance with the present invention, the phase change material is applied directly onto the interface surface of the heat sink to form an integral interface layer directly on the heat sink during the manufacturing process. This process includes the steps of providing a heat dissipating device having an interface surface, liquefying the phase change material at a controlled temperature so as to decrease the material viscosity to a flowable form, applying the liquefied phase change material directly onto the mating surface of the heat dissipating device either by directly dispensing the material, screen printing or stencil printing and cooling the material causing it to cure on the surface of the heat dissipating device.

Abstract: A semi-rigid heated element assembly and method of manufacturing semi-rigid heated element assemblies is provided. A heated element assembly includes a first thermoplastic sheet, a second thermoplastic sheet, and a resistance heating element laminated between the first and second thermoplastic sheets. The resistance heating element includes a supporting substrate having a first surface thereon and an electrical resistance heating material forming a predetermined circuit path having a pair of terminal end portions. The circuit path continues onto at least one flap portion that is capable of rotating about a first axis of rotation. The reformable continuous element structure may be formed into a final element assembly configuration whereby at least the flap portion is rotated along its axis of rotation to provide resistance heating in at least two planes. Semi-rigid heating elements may be formed into heated containers, heated bags, and other objects with complex heat planes.

Abstract: A method for manufacturing a component provided with a number of liquid paths having movable members for use of liquid discharging comprises the steps of displacing the movable members provided for thin film material by use of such thin film material having the movable members on it, and a component provided with a plurality of recessed portions, and of placing the movable members, which are in the state of being displaced with respect to the recessed portions of the component correspondingly, hence making it possible to fabricate a liquid jet head without damaging or deforming such thin film material constituting the movable members. With the provision of the movable members, the discharging power and efficiency of the liquid jet head are significantly enhanced to obtain recorded images of high quality at higher speeds.

Abstract: An automotive instrument panel (IP) has a thermostatically controlled electric heating element for maintaining the plastic material of the IP at a temperature warm enough to inhibit brittle fracture during deployment of an airbag mounted within the IP. The heating element is formed by depositing a layer of electrically conductive material on an inner surface of the outermost layer of the IP along the perimeter of an airbag deployment path, bonding the outermost layer to a substrate, and using a laser to simultaneously score the IP around the deployment path and cut the conductive layer so that it forms a circuit through which electric current may be passed for resistance heating.

Abstract: A ceramic heater having an alumina rod, an alumina based ribbon sintered to the rod, and a platinum resistor element bonded to the ribbon. Additionally, a method of making a ceramic heater having the steps of making a ceramic slurry; combining the ceramic slurry with a binder component to form a slip; depositing the slip onto a carrier film at a controlled thickness such that a deposited slip is formed; heat curing the deposited slip to form a cured slip ribbon; applying a platinum paste onto the ribbon in a specific pattern, the paste forming a platinum resistor element on the ribbon; applying the ribbon with the platinum resistor element onto an alumina rod; and, heating the rod with the ribbon and the platinum resistor element thereon, whereby the ribbon is sintered to the rod and the platinum resistor element is sintered and bonded to the ribbon.

Abstract: A method for producing an ink jet recording head comprising the following steps, a step which forms the photosensitive water-repellent processing layer in the ink discharge port face, a step which irradiates light onto the water-repellent forming region and hydrophilic forming region in the water-repellent processing layer, to cure the layer, a step which irradiates light selectively onto the hydrophilic forming region to reduce water repellency of the water-repellent processing layer and to impart hydrophilicity to the hydrophilic forming region, and a step which forms an opening, which constitutes part of the ink discharge port, in the water-repellent processing layer.

Abstract: A printer head substrate having a silicon substrate on which heat generating elements and partitions are formed and an orifice plate which adhered to the partitions is placed on a stage of a helicon-wave dry etching system. Helicon-wave dry etching is performed while cooling the printer head substrate by allowing a coolant gas to be intervened between the substrate and the stage. This allows multiple orifices of a desired and adequate shape to be simultaneously and quickly bored in the orifice plate even if a thin film sheet having adhesive layers adhered to both sides thereof is used as the orifice plate, thereby improving the working efficiency.

Abstract: A process is provided for forming a heater chip module comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base s coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.

Abstract: An electrode for a plasma arc torch and method of fabricating the same are disclosed, and wherein the electrode comprises a copper holder defining a cavity in a forward end. An emissive element and separator assembly is positioned in the cavity, and no brazing materials are used to secure the components of the electrode. The emissive element, separator, and metallic holder are heated to accelerate diffusion bonding between the emissive element and separator, and between the separator and metallic holder. A crimping process is also disclosed for further strengthening the electrode and increasing the operational life span thereof.

Abstract: A process is provided for forming a heater chip module comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.

Abstract: Electric heating/warming composite fabric articles have at least a fabric layer having inner and outer surfaces, and an electric heating/warming element in the form of a flexible, preferably stretchable, electricity-conducting film disposed at the inner surface of the fabric layer and adapted to generate heating/warning when connected to a power source. A barrier layer may be positioned, for example, adjacent to the inner surface of the fabric layer; e.g., with the electric heating/warming element formed thereupon, including to protect the electric circuit, e.g. against abrasion. Methods of forming electric heating/warming composite fabric articles are also described.

Abstract: A heater pattern for a heater of a gas sensor in which a temperature profile is manipulated utilizes a thermistor element arranged in an electrically serial configuration and disposed on a substrate. The thermistor element is arranged so as to define an edge pattern extending about a perimeter of the substrate and a center pattern serially connected to the edge pattern. The center pattern extends over a portion of the substrate that is intermediate the perimeter of the substrate. In a preferred embodiment, the thermistor element is screen printed onto the substrate to a thickness of about 5 microns to about 50 microns, and preferably to a thickness of about 10 microns to about 40 microns. The edge and center patterns are furthermore preferably formed of materials having differing coefficients of thermal resistivity, e.g., platinum and platinum/palladium blends.

Abstract: A method for manufacturing liquid discharge heads is provided with discharge ports for discharging liquid, liquid flow paths communicated with the discharge ports for supplying liquid to the discharge ports, a substrate having heat generating members for creating bubbles in liquid, and movable members facing the heat generating members, each being arranged in each liquid flow path, having the free end on the discharge port side with a specific gap with the heat generating member. This method comprises the steps of forming the boundary layer used for providing a gap between the movable member and the substrate above the heat generating member on the substrate, of laminating the movable member on the boundary layer so as to position the free end above the heat generating member, at the same time fixing the movable member on the substrate, and of forming the gap between the movable member and the heat generating member by use of the boundary layer.

Abstract: A heated element assembly and method of manufacturing heated element assemblies is provided. The heated element assembly including a first and second molded sections shaped to mate with each other is provided. A resistance heating element is secured between the first and second molded sections by an interference fit. The resistance heating element includes a piercable supporting substrate and a resistance wire sewn thereon. The resistance wire is disposed in a predetermined circuit path which is substantially encompassed by the first and second molded sections. The resistance heating element is easily fixed in a position between the first and second molded sections and is capable of providing heat on vertical, horizontal and contoured surfaces.

Abstract: Heating elements, electrical devices and processes for manufacturing these components are provided. The heating elements and electrical components employ a resistance heating material, such as Ni-Cr wire, sewn with a thread to a supporting substrate, such as a non-woven glass mat. The sewn thread supports the relatively thin cross-section of the resistance material when a fusible layer is applied, such as by molding a polymer under pressure.

Abstract: A manufacturing process of a plurality of fluid jetting apparatuses in a print head adapted to an output unit. The process forms a heat driving part, a membrane and a nozzle part, respectively, and then adheres them sequentially. The fluid jetting apparatuses are completed as a wafer unit by forming the nozzle part using a spinning process. The manufacturing process of the nozzle part includes a first step of forming a nozzle plate on a substrate of a wafer by the spinning process; a second step of forming jetting fluid barriers on the nozzle plate by the spinning process; a third step of forming jetting fluid chambers in the jetting fluid barriers; a fourth step of forming nozzles in the nozzle plate; and a fifth step of separating the substrate from the nozzle plate. The fifth step is accomplished after the nozzle part and the membrane are adhered to each other.

Abstract: A method of making a heater element has the steps of inserting into a smooth tubular casing a heating wire, filling a space between the wire and the casing with a compressible insulating mass, and closing ends of the space to confine the mass in the casing. Then the casing is radially inwardly compressed to form therein a successive of radially outwardly open annular grooves extending circumferentially fully around the casing and thereby radially compressing the insulating mass. The casing is formed with a succession of such grooves, which can be of V-shape and which are each endless so that the casing is corrugated. Alternately the grooves are interconnected helically. Either way in accordance with the invention the grooves form axially relatively long and radially relatively thick outer rings and axially relatively short and radially relatively thin inner rings.

Abstract: An electrical resistive heating system having a Nitinol heater element in the form of wire, rod strip or tube, is flexible, ductile, tough aid chemically non-reactive. The element has connectors at each end for leads from a controller that controls the flow of current through the heater element from a source of electrical power. The Nitinol heater element is treated to have an electrically insulating surface that is also hard and chemically non-reactive, so the heater element can be put in intimate contact with the materials or substrate to be heated without shorting or electrical shock to people or equipment. The controller uses temperature data feedback from a separate temperature sensor such as a thermocouple, or uses the resistance of heater element itself as a temperature sensor, since the resistance of the Nitinol changes with temperature in a predictable way.

Abstract: An wear-resistant layer 50 constituting a printing surface which is brought into contact with a thermal record medium is formed on a provisional substrate 70 having a groove formed in its surface, said groove having a substantially semicircular cross section, and a heat generating layer 51, electrically conductive layers 52a and 52b electrically connected to the heat generating layer, a protection layer 54a and a heat storage layer 58 are stacked in turn to form a printing section. Next, a driving IC 55 for controlling a heating electric power to be supplied to the printing section is connected to the electrically conductive layer and a wiring section 53 for connecting the driving IC to an external circuit is provided. Thereafter, the printing section is secured to a heat dissipating member 59 by means of a resin 62, and a common electrode 84 and wires 56 are secured to the heat dissipating member by means of both-sided adhesive tapes 82 and 83.

Abstract: The scribe line 4 is constituted by a large number of depressed portions of desired depth formed by radiation of a laser beam in a surface of the raw substrate correspondingly to a boundary line between adjacent insulating substrates so that the depressed portions are arranged in a line at fixed pitch intervals along the boundary line, and a portion where the pitch intervals of the depressed portions are reduced is provided over a desired length on the way of the scribe line, or a portion where the depth of the depressed portions is increased is provided over a desired length on the way of each of the scribe lines.

Abstract: A method is provided for the solderless electrical connection of two contact elements by using a laser light beam attached to a fiber optic system which directs the light to the spot to be bonded. By using a fiber optic system the laser beam is optimally converted into thermal energy and bad connections due to underheating or destruction of the contacts due to overheating does not occur. The method and apparatus provides rapid, reproducible bonding even for the smallest of contact geometries. For example, the method of the invention results in solderless gold to gold compression bonding of conductive leads contained in a polymer flex circuit tape, such as a polyimide, without damaging the tape. A strong solderless gold to gold bond can be formed between the gold plated copper lead on the flex circuit tape and a gold plated pad on a semiconductor chip without the need for a window in the flex circuit and without any damage to the tape.

Abstract: Methods of forming an electric heating/warming composite fabric article include the steps of applying an electricity-conducting paste upon a surface in a predetermined pattern of an electric circuit, and curing the electricity-conducting paste to form an electric heating/warming element in the form of a flexible, electricity-conducting film defining an electric circuit, the electric heating/warming element being adapted for connection to a power source, thereby to generate heating/warming. The fabric article includes a fabric layer, and may include a barrier layer joined to or associated with a surface of the fabric layer. The electric circuit may be formed directly upon a surface of the fabric layer or upon a surface of the barrier layer. The circuit may be formed and cured upon the barrier layer before or after it is joined to the fabric layer.