Abstract: A monolithic ink-jet printhead includes a substrate having a lower ink chamber formed on an upper surface thereof, a manifold for supplying ink to the lower ink chamber formed on a bottom surface thereof, and an ink channel providing communication therebetween; a nozzle plate having a plurality of passivation layers and a metal layer sequentially stacked on the substrate, the nozzle plate having an upper ink chamber formed therein on a bottom surface of the metal layer, a nozzle in communication with the upper ink chamber formed on an upper surface of the metal layer, and a connection hole providing communication between the upper ink chamber and the lower ink chamber; a heater located between the upper ink chamber and the lower ink chamber for heating ink contained in the lower and upper ink chambers; and a conductor electrically connected to the heater to apply a current to the heater.

Abstract: A method of applying a physical barrier to suppress thermal decomposition near a surface of a thermoelectric material including applying a continuous metal foil to a predetermined portion of the surface of the thermoelectric material, physically binding the continuous metal foil to the surface of the thermoelectric material using a binding member, and heating in a predetermined atmosphere the applied and physically bound continuous metal foil and the thermoelectric material to a sufficient temperature in order to promote bonding between the continuous metal foil and the surface of the thermoelectric material. The continuous metal foil forms a physical barrier to enclose a predetermined portion of the surface. Thermal decomposition is suppressed at the surface of the thermoelectric material enclosed by the physical barrier when the thermoelectric element is in operation.

Abstract: Inkjet printheads capable of printing smaller and larger drop-weight quantities of ink, and methods of manufacturing the inkjet printheads, are disclosed. The inkjet printhead includes a substrate. One or more portions of the substrate may be etched such that the substrate might have different thicknesses. In one example embodiment, an orifice layer can by applied to the substrate that has orifice areas with different orifice thicknesses.

Abstract: Disclosed is a liquid ejecting recording head with improved operational reliability. A first coating resin layer of a liquid ejecting recording head, having a liquid flow duct and a liquid ejecting orifice, is formed of an oxetane resin composition that contains, as necessary components, an oxetane compound having at least one oxetanyl group in a molecule, and a cationic photopolymerization initiator.

Abstract: An underfloor heater for a liquid heating vessel comprises a base plate, a heat diffuser portion in good thermal contact with the base plate, a heating element in good thermal contact with the diffuser portion and a sensing region for receiving a thermal sensor. The sensing region is not directly connected to the diffuser portion and is at least partly surrounded by a wall. The sensing region may be provided with a second separate diffuser portion comprising a disc of aluminum brazed to the underside of the base plate.

Abstract: The present invention discloses a method of manufacturing a resistance film heating apparatus and a resistance film heating apparatus formed by the same.

Abstract: A glow plug and related manufacturing method are disclosed. The glow plug includes a heating section for heating a combustion chamber of an engine for promoting an ignition. The heating section includes a ceramic heating element developing a heat when applied with electric power, a ceramic insulating support body embedded with the heating element, and a pair of lead wires connected to the heating element and having terminal portions exposed to a surface of the insulating body. The heating element has a positive temperature coefficient of resistance and includes: (a) initial resistance R20 equal to or greater than 0.3? and equal to or less than 0.65?; (b) heating resistance R1200 equal to or greater than 0.7? and equal to or less than 1.3?; and (c) temperature coefficient of resistance R1200/R20 equal to or greater than 2.0 and equal to or less than 4.0.

Abstract: The protrusion 16 is formed on one end face of the ceramic member 11, and the positive electrode lead-out section 13a which is electrically connected to the heat generating member 12 is drawn out and exposed on the side face of the protrusion 16 at several positions, while the terminal 14 of the positive electrode lead-out fixture can be connected to each of the exposed portions.

Abstract: The present invention fixes a nozzle sheet on a substrate with a predetermined material (5,6), which has an excellent chemical resistance and sufficient adhesiveness, or more specifically, fixes the nozzle sheet on the substrate with cyclized rubber or with patternable, adhesive elastic material. Moreover, the present invention forms walls for liquid chambers and liquid channels with polyimide.

Abstract: A manufacturing method of an ink jet recording head including a discharge port for discharging ink includes the step of forming the discharge port by performing dry etching of a discharge port forming member for forming the discharge port, wherein the discharge port forming member is formed of a Si including resin, and the step of dry etching is performed by using an etching gas including oxygen and chlorine as necessary components.

Abstract: The object of the present invention is to reduce a frictional resistance which is generated between a support member and a heating resistor when the heating resistor is thermally expanded and thermally shrunk, whereby generation of a permanent deformation of the heating resistor caused by a residual stress thereof can be restrained, to thereby improve the durability.

Abstract: A substantially planar fluid ejection actuator and methods for manufacturing substantially planar fluid ejection actuators for micro-fluid ejection heads. One such fluid ejection actuator includes a conductive layer adjacent to a substrate that is configured to define an anode segment spaced apart from a cathode segment. A thermal barrier segment is disposed between the anode and cathode segments. A substantially planar surface is defined by the anode segment, and the thermal barrier segment. A resistive layer is applied adjacent to the substantially planar surface.

Abstract: Method for fabricating a microscale anemometer on a substrate. A sacrificial layer is formed on the substrate, and a metal thin film is patterned to form a sensing element. At least one support for the sensing element is patterned. The sacrificial layer is removed, and the sensing element is lifted away from the substrate by raising the supports, thus creating a clearance between the sensing element and the substrate to allow fluid flow between the sensing element and the substrate. The supports are raised preferably by use of a magnetic field applied to magnetic material patterned on the supports.

Abstract: A method and apparatus for forming a substrate support is provided herein. In one embodiment, the substrate support includes a body having a support surface and at least one groove. A heater element clad with a malleable heat sink is disposed in the groove. Substantially no air is trapped between the clad heater element and the groove. An insert is disposed in the groove above the heater. The insert substantially completely covers and contacts the clad heater element and the sides of the groove. A cap is disposed in the groove above the insert. The cap covers and contacts the insert and has an upper surface disposed substantially flush with the support surface.

Abstract: A resistive element in the form of a bent metal plate is placed in a box-shaped case and has electrodes exposed out of the box-shaped case. A heat radiator in the form of a bent metal plate is also placed in the box-shaped case and has heat radiating electrodes exposed out of the box-shaped case. The resistive element and the heat radiator are held out of contact with each other and disposed in criss-cross relation to each other. The box-shaped case is filled with a cement material in surrounding relation to the resistive element and the heat radiator.

Abstract: A graphite heater and method of forming a graphite heater comprising a graphite body configured to form an electrical heating circuit for at least one heating zone through the graphite encapsulated in a continuous overcoat layer comprising at least one of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and rare earth metals, or complexes and/or combinations thereof, wherein prior to being configured to form the electrical heating circuit path, the graphite body is coated with a layer comprising at least one of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and rare earth metals, or complexes and/or combinations thereof.

Abstract: The heating plate for hair straightening iron and its manufacturing process consists of a case comprising two laminates made of insulating ceramic material; one of them holds a band made of electrical conductor material with outer connections, while one of the laminates has a surface coated with a polished layer of material; the case of the heating plate has features to adapt to the base structure of the iron.

Abstract: A manufacturing method for a substrate heating device comprises forming a base plate having a substrate heating surface in which a resistance heating element is buried, forming a tubular member, joining the tubular member to the base plate, measuring temperature distribution in the substrate heating surface by supplying power to the resistance heating element, and grinding the tubular member according to a grinding condition based on a measurement result of the temperature distribution.

Abstract: The present invention is directed to a heating resistor comprising a conducting oxide having an electric conductivity and a nonconducting oxide having insulation or nonconductivity, liquid ejecting heads and apparatus comprising the heating resistors.

Abstract: A thermally regulating heater and a heated seat made using these heaters wherein the resulting heated seat provides enhanced temperature control without the need of any temperature control system. The heaters include the use of a polymeric positive temperature coefficient composition that operates at lower trip temperatures than previous polymeric positive temperature coefficient compositions. The polymeric positive temperature coefficient composition have a trip temperature below the heat deflection temperature of the composition such that the polymeric positive temperature coefficient composition heats the heated seat to a temperature closer to the comfort level of an individual using the heated seat. Since the polymeric positive temperature coefficient composition uses plastic materials, the polymeric positive temperature coefficient composition can be formed into different shapes as needed using a molding process, such as injection molding.

Abstract: A method of fabricating an inkjet printhead with a wafer substrate that has an ink ejection side and an opposing ink inlet side. The printhead has an array of nozzles formed on the ink ejection side, and an array of ink inlets formed in the ink inlet side. Each nozzle is individually associated with a respective ink inlet. The method comprises the steps of forming the array of nozzles using lithographically masked etching and deposition techniques, and, etching individual feed paths through the wafer substrate between each of the nozzles and its associated ink inlet. Feeding the ink to the nozzles by individual feed paths through the wafer, increases the nozzle packing density and the resolution.

Abstract: In a method for producing an ink-jet recording head, a plurality of through-holes is formed in a heat storage layer formed on one surface of a silicon substrate, subsequently, heating elements are formed, and a protective layer is formed on the substrate. A passage-forming member forming discharge ports and ink passages is formed on the protective layer and an ink supply port is then formed by anisotropic etching from the other surface of the silicon substrate. In this step, since the protective layer serves as an etching stop layer, the passage-forming member is not in contact with an etchant. Subsequently, the protective layer formed in the through-holes is removed so that the ink supply port includes a filter.

Abstract: The invention provides new methods for manufacture ceramic resistive heating elements that include forming a heating element body comprising comprises two or more regions of differing resistivity, and processing a portion of the element body to form a heating element. Heating elements such as igniters and glow plugs also are provided obtainable from fabrication methods of the invention.

Abstract: An encapsulated heat pipe is made by placing a removable elongated solid partially within a mold, filling the mold with a solid dielectric material, and removing the elongated solid from the dielectric material defining an elongated cavity that extends within the solid dielectric material. Next, a wick material is inserted into the periphery of the elongated cavity, then a coolant liquid is inserted into the elongated cavity and the open end of the elongated cavity is sealed.

Abstract: A temperature sensor temperature sensing tube and its fabrication method comprised of a step that provides for a tubular blank of an appropriate length, a step in which a curvilinear semifinished product of the tube member bottom section aperture is formed, a step in which a semifinished product of the neck base and the neck body is formed, a step in which a semifinished product of the neck base and the neck body is further formed, and a step in which a finished product having an outer conoidal hem and an inner conoidal hem is formed. Executing each step completes the fabrication of the temperature sensing tube.

Abstract: A heated glass panel assembly according to one embodiment of the invention may include a substrate having an electro-conductive film provided thereon. A conductor is positioned in contact with the electro-conductive film. A resilient material is positioned in contact with the conductor so that at least a portion of the conductor is located between the resilient material and the electro-conductive film. A retainer is positioned in contact with the resilient material so that at least a portion of the resilient material and at least a portion of the conductor are located between the retainer and the electro-conductive film. The retainer applies a compressive pressure to the resilient material which transfers at least a portion of the compressive pressure to the conductor to hold the conductor in contact with the electro-conductive film.

Abstract: The present invention is directed towards a method of forming a ventilated seat. More specifically, in one aspect, the present invention is directed towards providing an insert in fluid communications with an air mover and a seating surface, wherein the system optionally includes a thermoelectric device for providing heating or cooling of air flowing through the insert.

Abstract: A ceramic heater for heating a semiconductor wafer under processing and has a layered structure wherein on one surface of a supporting substrate made of carbon or a carbon-based composite material, successively formed layers including an insulating layer, and electroconductive layer as an electric heating element and a dielectric layer. A first step for partly or completely removing the layer or layers having degraded properties by means of a suitable method such as sandblasting and a second step of re-forming the layer or layers having been removed in the first step. The invention allows for a substantial cost decrease as compared with the conventional way by replacing the worn-out ceramic heater with a newly manufactured one.

Abstract: A method for producing a ceramic heater. Firing is conducted such that an element green body in which at least a portion containing a conductive ceramic that is to become a heating element after firing is held on a powder or green body of an insulating ceramic that is to become a substrate after firing. The ceramic heater includes the substrate and the heating element. The method includes a molding step, a holding step, and a firing step as defined herein.

Abstract: A heat-processing furnace comprises: a processing vessel for housing an object to be processed to thermally heat the object to be processed; a cylindrical heat insulating member surrounding the processing vessel; a helical heating resistor disposed along an inner circumferential surface of the heat insulating member; and support members axially disposed on the inner circumferential surface of the heat insulating member, for supporting the heating resistor at predetermined pitches. A plurality of terminal plates are disposed outside the heating resistor at suitable intervals therebetween and attached to the heating resistor, the terminal plates radially passing through the heat insulating member to be extended outside. A plurality of fixing plates are disposed outside the heating resistor at suitable intervals therebetween and attached to the heating resistor, the fixing plates being fixed in the heat insulating member.

Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.

Abstract: A thermal head having electrode wiring lines in a narrow wiring region, in which a line and a space are narrow, with good pattern accuracy and a method of manufacturing the same are provided. A thermal head includes: a plurality of heating resistors arranged in a line at predetermined pitches there between on a protruding level difference part of a glazed substrate; bent wiring lines each of which serves to electrically connect a pair of adjacent heating resistors to each other; a common wiring line and individual wiring lines used to cause the pair of adjacent heating resistors to be electrically conducted through each of the bent wiring lines; and bonding pads formed on one ends of the individual wiring lines. The common wiring line has a narrow wiring region located between the bonding pads arranged in a line and a wide wiring region wider than the narrow wiring region.

Abstract: A ceramic heating element arrangement in which a ceramic heating element made of SiC having electrical NTC (negative temperature coefficient) properties is provided for a circuit. At least one segment is provided in the circuit, whose resistance saturates at least quasi-asymptotically at the current flow required for a desired heat development.

Abstract: Provided is technology capable of avoiding complex processes and high costs while securing the protection of the functional unit upon forming a device including a glass substrate. A manufacturing method of a structural body structured with a bonding body formed from a glass substrate and a semiconductor substrate, including a first step of forming a first functional unit as a structural element of the structural body on one face of the glass substrate; a second step of bonding the semiconductor substrate to one face of the glass substrate so as to cover the first functional unit; a third step of forming an affected zone extending in the thickness direction of the glass substrate by irradiating a laser beam from the other face side of the glass substrate and scanning the focal point of the laser beam in the thickness direction of the glass substrate; and a fourth step of forming a hole in the glass substrate by etching the glass substrate and removing the portion along the affected zone.

Abstract: A method of manufacturing a micro-electromechanical device is provided. The method comprises providing a substrate incorporating drive circuitry, and forming a drive member, a motion-transmitting member and a working member on the substrate as discrete components. The drive member is formed to have an electrical circuit in electrical contact with the drive circuitry for receiving an electrical signal therefrom, a fixed end fast with the substrate and a free end arranged to be displaced relative to the substrate on receipt of the electrical signal by the electrical circuit. The motion-transmitting member is formed to be fast with the free end of the drive member so that the motion-transmitting member is displaced together with the free end. The working member is formed to be fast with the motion-transmitting member so that the working member is displaced with the motion-transmitting member to perform work.

Abstract: A heater includes an electrically conducting heating element, an insulator and a spring urging the insulator into contact with the heating element. The spring is formed from a superalloy and is operable to output a substantially constant force at a predetermined deflection up to approximately 650° C.

Abstract: A monolithic ink-jet printhead, and a method of manufacturing the same, includes a substrate having an ink chamber, an ink channel, and a manifold, a nozzle plate formed on the substrate, a nozzle, a heater, and a conductor. The ink chamber includes sidewalls formed to a predetermined depth from the front surface of the substrate for defining side surfaces of the ink chamber and a bottom wall formed parallel to the front surface of the substrate at the predetermined depth from the front surface of the substrate for defining a bottom surface of the ink chamber. The nozzle plate includes a plurality of passivation layers, a heat dissipating layer being stacked on the passivation layers, and the nozzle for ejecting ink out of the printhead. The heater is positioned above the ink chamber and heats ink in the ink chamber and the conductor delivers a current to the heater.

Abstract: A rod-shaped heating element with a tubular carrier element attached to a cylindrical carrier ring and to the rod-shaped heating element using a magnetic forming process, the carrier ring and the rod-shaped heating element being within the tubular carrier element with the outer circumferential surface of the carrier ring contacting the inner circumferential surface of the tubular carrier element. As a result of the parts having been joined by magnetic forming, they are in a plastically deformed state which is free of thermal treatment effects and scuffing.

Abstract: A method of fabricating a micro-electromechanical actuating mechanism on a wafer substrate includes the step of carrying out a CMOS fabrication process on the wafer to form transistor control and drive circuitry. Sacrificial material is deposited on the transistor control and drive circuitry. The sacrificial material is etched to provide connection access to the drive circuitry. A MEMS fabrication process is carried out on the layer of sacrificial material to form a micro-electromechanical actuator connected to the drive circuitry and responsive to electrical signals from the drive circuitry. The sacrificial material is removed to free the actuator. The steps of carrying out the CMOS and MEMS fabrication processes are such that the transistor circuitry is interposed between the actuator and the wafer substrate.

Abstract: A method for manufacturing an ink-jet printhead by coating a first photosensitive photoresist on the substrate and forming a passage plate, forming an ink chamber and an ink passage on the passage plate, burying the ink chamber and the ink passage using a second photoresist and forming a mold layer, forming a chamber cover layer on a top surface of the passage plate and the mold layer, forming a plurality of slots corresponding to the ink chamber and/or the ink passage in the chamber cover layer, supplying an etchant to the second photoresist through the slots and removing the second photoresist remaining in the ink chamber and the ink passage, and coating a third photoresist and forming a nozzle plate on the chamber cover layer.

Abstract: An ink jet head includes a substrate having a flow path construction member constructing a plurality of discharge ports for discharging ink and a plurality of ink flow paths corresponding thereto, and a plurality of energy generating elements corresponding to the plurality of discharge ports. The substrate has an ink supply port for supplying ink to the ink flow paths. The ink supply port includes a first liquid chamber disposed on a plane on which the energy generating elements are formed, and having a grooves with island-shaped columns left, and a second liquid chamber disposed on the opposed plane, and having a plurality of through holes partitioned at positions corresponding to the island-shaped columns. In the ink jet head, the island-shaped columns and a partition wall for the through holes are left as a beam construction section, thereby improving a mechanical strength of a semiconductor substrate.

Abstract: Methods for producing micromachined layered devices having a membrane layer and a first and second layer on both sides of the membrane layer are disclosed. The method includes applying a membrane layer to a substrate, opening a window in the substrate so as to enable the addition of layers from both sides of the membrane layer while the substrate is made into a frame that supports the membrane layer during processing, adding at least one layer on each side of the membrane either simultaneously or on one side at a time, and removing the device from the substrate frame.

Abstract: A method for producing components for injection moulding comprising a body made of thermally conducting material with expansion coefficient matching that of the insulating layers and provided with a passage for the material to be injected. At least one strip of electrically conducting material with high change of resistance with temperature, forming a heating resistor or inductor is applied on a electrically insulating base layer previously directly applied on the body. At least one final insulating layer with low thermal emissivity is then applied to optimise electrical efficiency. The method utilises thermal spray techniques and can be applied also for production of other heating equipment.

Abstract: There is described a heating tape structure and a method of forming the same. The heating tape structure includes a base film strip that is typically elongated and includes strips of conductive material extending adjacent sides of the base film strip. The heating tape can be formed by providing the base film strip to an automated system and layering the strips of conductive material thereon.

Abstract: In manufacturing a chip resistor by dividing a chip resistance substrate which includes an insulator, resistance film formed on a surface of the insulator, and a plurality of conductive strips disposed on the resistance film at fixed intervals, grooves are formed by removing a predetermined width of the resistance film including at least second prescribed severing lines. After forming the grooves, the chip resistance substrate is severed in longitudinal and lateral directions along first prescribed severing lines for dividing the conductive strips into two parts and the second prescribed severing lines perpendicular to the first prescribed severing lines so as to produce discrete chip resistors.

Abstract: According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible filler material is disclosed. The TIM may also have a non-fusible filler material and a percentage of a non-phase change polymer added to the phase change polymer matrix. The TIM, used to mate and conduct heat between two or more components, can be highly filled systems in a polymeric matrix where the fillers are thermally more conductive than the polymer matrix.

Abstract: The invention discloses a fabrication method of semiconductor electric heating film at least comprising the steps of: preparing an elementary material from one of the metallic (Sn, V) chlorides or silicides, into which one of the compounds of Fe, Sb, In, Zn or Zr is further added as an anti-oxidation additive, above resultant is used as basic semiconductor electric heating film material having anti-oxidation property; uniformly mixing the aforesaid material, and taking a predetermined ratio of it to solve in a solvent; uniformly churning the resultant prepared in the above step, and adding a small amount of HF non-organic acid as an modifier so as to improve film's stability and causing oxidation or reduction between the solvent and the film material; and cleaning a substrate with supersonic wave and then washing it with pure water in order, after that setting the washed substrate in a furnace and heating the substrate with in-line heating process gradually, and as soon as the substrate's surface has reached

Abstract: A magnetic head including a media heating device. Following the fabrication of the heating device, a sacrificial layer of material is deposited to protect the heating device during subsequent process steps. Thereafter, write head components, such as write head induction coils and/or a P1 pole pedestal are fabricated above the heating device, and the sacrificial layer is substantially consumed in protecting the heating device during the aggressive etching and milling steps used to create those components. Further components, including a second magnetic pole are thereafter fabricated to complete the fabrication of the write head portion of the magnetic head. The sacrificial layer may be comprised of alumina, or a material such as NiFe that can act as a seed layer for a subsequent head components such as the P1 pole pedestal.

Abstract: A method of manufacturing a composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially between the layers with an intermediate layer of the structural reinforcement material disposed between the electrical devices. At least one electrical bus is disposed in the structural member, and each electrical device is connected to the bus by a conductive electrode. Thus, the electrodes can extend through the intermediate layer of the structural reinforcement material to connect each of the electrical devices to one or more of the buses.

Abstract: A method of manufacturing an electrical-resistance heating element includes forming sintered ceramics or calcined ceramics, forming an electrode on the sintered ceramics or the calcined ceramics, and forming a ceramic base material having mainly a high melting point metal on the electrode embedded therein, thereby forming a heating element with built-in electrode.