Thermally Variable Patents (Class 29/612)
  • Patent number: 11054311
    Abstract: A thermal radiation detector is disclosed that includes a substrate, a platform suspended above the substrate, a support structure holding the platform, and a temperature sensor disposed on the platform and having an electrical parameter that varies in accordance with the temperature of the temperature sensor. The detector also includes a carbon-nanotube-based optical absorber in thermal contact with the temperature sensor and configured to absorb electromagnetic radiation to generate heat to change the temperature of the temperature sensor. The optical absorber may include a carbon nanotube film, for example, obtained by spray coating. The detector further includes a passivation layer structure disposed over the optical absorber, which may be made of a metal compound, for example, titanium or aluminum oxide. The thermal radiation detector may be a microbolometer detector, a thermocouple/thermopile detector, or a pyroelectric detector.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: July 6, 2021
    Assignee: INSTITUT NATIONAL D'OPTIQUE
    Inventors: Hassane Oulachgar, Francis Genereux, Francis Provencal
  • Patent number: 10984925
    Abstract: An electric wire twisting device is provided, which is capable of producing a preferable twisted electric wire from a plurality of electric wires of which both ends are cut. An electric wire twisting device 1 includes a first gripping device 11 including a first clamp 2a that grips a first end of a first electric wire CT, a second clamp 2b that grips a first end of a second electric wire C2, and a first holder 15A that holds the first clamp 2a and the second clamp 2b. The electric wire twisting device 1 includes a second gripping device 12 that grips a second end of the first electric wire CT and a second end of the second electric wire CT, a first revolving actuator 3b that causes the first holder 15A to rotate around a center line of revolution CL, and a first rotating actuator 3a that causes the first clamp 2a and the second clamp 2b to rotate around a center line of rotation that is parallel to the center line of revolution CL or is inclined with respect to the center line of revolution CL.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: April 20, 2021
    Assignee: SHINMAYWA INDUSTRIES, LTD.
    Inventors: Hiroaki Shirai, Junya Enomoto, Takayuki Mononobe, Naoki Fujisawa, Tatsuya Yamada
  • Patent number: 10768054
    Abstract: A sensor assembly includes an upper shell and a lower shell and is configured to mate together. The upper and lower shells form a cavity therebetween that extends along a length of the shells. The cavity is configured to receive a wire having an insulated jacket and a conductor. A contact member is positioned within the cavity and configured to pierce the insulated jacket and engage the conductor to establish a direct thermally conductive path to a discrete location of a main circuit. A sensor operatively connects with the contact member and is configured for detecting a temperature of the discrete location through the direct thermally conductive path.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: September 8, 2020
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Zachary Wood Lyon
  • Patent number: 10636548
    Abstract: A housing structure of a planar resistor is provided, wherein electrode extraction ends of the planar resistor are on the same side of the resistor. A housing structure body is made of an insulating material covering the surface of the resistor. An insulating structure having a groove opening facing toward or away from the resistor is provided around each electrode extraction end of the resistor. The insulating structure is configured to be a multi-tooth or multi-groove insulating structure.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: April 28, 2020
    Assignees: NR ENGINEERING CO., LTD, NR ELECTRIC CO., LTD, NR ELECTRIC POWER ELECTRONICS CO., LTD
    Inventors: Xiang Zhang, Chihan Chen, Zhao Li, Ge Song, Li Zheng, Fan Yang
  • Patent number: 10242773
    Abstract: The invention relates to a separating device for an overvoltage protection element, wherein the separating device is to be arranged between the overvoltage protection element and a thermal disconnector, wherein the separating device has a first insulating layer and a second insulating layer, wherein a conductive layer is arranged between the first insulating layer and the second insulating layer, wherein the first insulating layer has a first cutout for a contact with the disconnector, and wherein the second insulating layer has a second cutout for a contact with the overvoltage protection element, wherein the cutouts provide a possibility for contacting the conductive layer and the conductive layer provides a thermal bridge between the overvoltage protection element and the thermal disconnector, with the insulating layers making both a thermal and an electrical insulation available, so that heat of the overvoltage protection element can be conducted in a focused manner to the thermal disconnector.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: March 26, 2019
    Assignee: PHOENIX CONTACT GMBH & CO. KG
    Inventors: Maik Dittert, Jan Hegerfeld, Herr Jan-Erik Schmutz
  • Patent number: 10088369
    Abstract: A sensor arrangement for measuring the temperature of a medium in a motor vehicle. The sensor has a sensor body and two connecting wires and is completely insulated from the medium. The sensor body is electrically insulated by the medium by way of a covering completely surrounding the sensor body, and is in heat-conducting contact with the medium by way of the connecting wires and the surrounding covering.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: October 2, 2018
    Assignee: Conti Temic microelectronic GmbH
    Inventors: Matthias Keuten, Andreas Voegerl, Juergen Henniger, Matthias Wieczorek, Lisa-Maria Wittmann
  • Patent number: 9989421
    Abstract: A surface temperature sensor, including: an NTC or PTC thermistor; and a flexible printed circuit (FPC) or flexible flat cable (FFC) or conducting wire including at least two rows of single calendaring copper wires. The NTC or PTC thermistor and the FPC or FFC or conducting wire are welded together to form welding points. The thermistor and the welding points are packed inside a thin film by hot pressing. The thin film is a polyimide, a polyethylene terephthalate (PET) plastic, an aramid fiber, an aromatic polyamide, a polyether ether ketone, or a silicone rubber.
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: June 5, 2018
    Assignee: Shenzhen Minjie Electronic Technology Co., LTD.
    Inventor: Guoliang Hua
  • Patent number: 9959958
    Abstract: A PTC circuit protection device, includes: two PTC units, each of the PTC units including a first insulating layer, a first electrically conductive layer, a PTC polymeric layer, a second electrically conductive layer, a second insulating layer, a first electrode, a second electrode; an insulating bridge layer interconnecting the first insulating layers of the PTC units; and first and second gaps formed between the PTC units and located at two opposite sides of the insulating bridge layer.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: May 1, 2018
    Assignee: FUZETEC TECHNOLOGY CO., LTD.
    Inventors: Jack Jih-Sang Chen, Chang-Hung Jiang
  • Patent number: 9927303
    Abstract: In order to solve a technical problem of a temperature sensor for high temperature, in which platinum lead wires may be broken when used at a high temperature, an inner frame (8) made of ceramic is provided inside an outer frame (7) made of metal, the inner frame (8) is fixed, only at the upper end portion thereof, to the outer frame (7), and an insulating filler (9) made of a ceramic adhesive or a ceramic powder tightly filled at a high density is filled inside the inner frame (8) and a portion inside the outer frame (7) where the inner frame (8) is not present. According to this configuration, the occurrence of a break in platinum lead wires (6) can be significantly lowered compared with that of conventional examples.
    Type: Grant
    Filed: January 21, 2014
    Date of Patent: March 27, 2018
    Assignee: OKAZAKI MANUFACTURING COMPANY
    Inventors: Mitsuaki Mochizuki, Takashi Mihara
  • Patent number: 9829391
    Abstract: A temperature sensor element consists of a temperature sensing unit including: a temperature-sensing ceramic unit; first and second electrodes respectively positioned on first and second surface of the temperature-sensing ceramic unit, the second surface opposing the first surface; first and second intermediate electrodes respectively connecting to the first and second electrodes; and first and second lead lines connected to the first and second electrodes via the first and intermediate electrodes, respectively; and a protective unit surrounding the temperature sensing unit, wherein each of the first lead line and the second lead line includes a lead line core coated with a second layer, the lead line core and the second layer being different materials. The lead lines consist of the lead line cores of a metallic material cheaper than the platinum-based metal, which reduces the production cost of the lead lines.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: November 28, 2017
    Assignee: Lattron Co., Ltd.
    Inventors: Jae Cheon Sohn, Chung Kook Lee
  • Patent number: 9552909
    Abstract: Surface-mountable devices include a conductive polymer layer between first and second electrodes, on which are disposed first and second insulation layers, respectively, with first and second planar terminals on the second insulation layer. A first cross-conductor connects the second electrode to the first terminal, and is separated from the first electrode by a portion of the first insulation layer. A second cross-conductor connects the first electrode to the second terminal, and is separated from the second electrode by a portion of the second insulation layer. At least one cross-conductor may include a beveled portion through the first insulation layer. Alternatively, at least one cross-conductor may contact an anchor pad on the first insulation layer, the anchor pad having a small area relative to the areas of the terminals. Enhanced adhesion between the cross-conductor(s) and the first insulation layer is provided, while allowing thermal expansion without excessive stress.
    Type: Grant
    Filed: September 23, 2013
    Date of Patent: January 24, 2017
    Assignee: BOURNS, INC.
    Inventors: Gordon L. Bourns, Stelar Chu, Daniel E. Grindell, David Huang, John Kelly, Erik Meijer
  • Patent number: 9343253
    Abstract: A reflowable thermal fuse includes a positive-temperature-coefficient (PTC) device that defines a first end and a second end, a conduction element that defines a first end and a second end in electrical communication with the second end of the PTC device, and a restraining element that defines a first end in electrical communication with the first end of the PTC device and a second end, in electrical communication with a second end of the conduction element. The restraining element is adapted to prevent the conduction element from coming out of electrical communication with the PTC device in an installation state of the thermal fuse. During a fault condition, heat applied to the thermal fuse diverts current flowing between the first end of the PTC device and the second end of the conduction element to the restraining element, causing the restraining element to release the conduction element and activate the fuse.
    Type: Grant
    Filed: October 15, 2012
    Date of Patent: May 17, 2016
    Inventors: Martyn A. Matthiesen, Jianhua Chen, Anthony Vranicar
  • Patent number: 9320145
    Abstract: An electronic component assembly comprises a printed component structure comprising at least one of a semiconducting ink, an insulating ink and a conducting ink deposited onto a substrate. The component structure defining at least one contact area, with a connecting lead disposed against or adjacent to the contact area. At least one layer of electrically insulating material encloses the component structure. At least one of the substrate and the layer of electrically insulating material comprises packaging material. The component structure can be printed on a substrate such as paper or another soft material, which is secured to a layer of insulating packaging material such as polyethylene. Instead, the substrate can be the insulating packaging material itself. Variations using hard and soft substrates are possible, and various examples of electronic component assembly are disclosed.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: April 19, 2016
    Assignee: PST Sensors (Proprietary) Limited
    Inventors: David Thomas Britton, Margit Harting
  • Publication number: 20150145639
    Abstract: Provided are a laminated chip composite resistor combining a thermistor and a varistor, and a preparation method thereof. The composite resistor comprises a varistor part, a transition layer part and a thermistor part overlapped sequentially, wherein the varistor part is formed by alternately laminating a ceramic layer of a varistor, a first electrode layer, another ceramic layer of a varistor and a second electrode layer; the thermistor part is formed by alternately laminating a ceramic layer of a thermistor, a third electrode layer, another ceramic layer of a thermistor and a fourth electrode layer; and the transition layer part is located between the thermistor part and the varistor part. Co-firing is employed and the base metal Ni is the main material of inner electrodes, which can reduce costs, simplify the preparation process, and improve the reliability.
    Type: Application
    Filed: June 30, 2014
    Publication date: May 28, 2015
    Inventors: Qiuyun Fu, Dongxiang Zhou, Yunxiang Hu, Zhiping Zheng, Wei Luo, Tao Chen
  • Patent number: 9027230
    Abstract: In accordance with the invention, there are temperature sensing and temperature control devices and methods of making them. The temperature sensing and control devices can include a composite member, the composite member including a non-metallic binder material, and one or more non-metallic, electrically conductive fibers disposed in the non-metallic binder material. The temperature sensing and control devices can also include a plurality of contacts disposed on the one or more non-metallic, electrically conductive fibers, wherein the composite member has a substantially continuous decrease in electrical resistance with an increase in temperature.
    Type: Grant
    Filed: March 2, 2009
    Date of Patent: May 12, 2015
    Assignee: Xerox Corporation
    Inventors: Joseph A. Swift, Stanley J. Wallace, Roger Bullock
  • Publication number: 20150075280
    Abstract: A water content sensor is disclosed. The sensor includes a wire filament configured with a Péclet number of 1 or less. The wire filament has an electrically conductive material with an electrical resistance that varies as a function of temperature. The sensor includes a pair of electrically conductive prongs coupled to opposite ends of the wire filament. Electrically conductive stubs may be coupled to the prongs. A structural support may be coupled to the prongs. The structural support structure may be comprised of silicon. The wire filament may be coupled to driving circuitry configured to supply an electric current to the wire filament to maintain the wire filament at one of an approximately constant current, an approximately constant voltage and an approximately constant temperature. The wire filament may be platinum or titanium.
    Type: Application
    Filed: August 11, 2014
    Publication date: March 19, 2015
    Applicant: THE TRUSTEES OF PRINCETON UNIVERSITY
    Inventors: Marcus Hultmark, Gilad Arwatz, Yuyang Fan, Margit Vallikivi
  • Publication number: 20150070127
    Abstract: A NTC thermistor element that includes a substrate composed of a ceramic material containing Mn, Ni, Fe and Ti; and a pair of external electrodes on the substrate. When the molar amount of Mn in the substrate is a [mol %] and the molar amount of Ni in the substrate is b [mol %], a and b satisfy a+b=100, 44.90?a?65.27 and 34.73?b?55.10. When the molar amount of Fe is c [mol %] and the molar amount of Ti is d [mol %], c and d satisfy 24.22?c?39.57 and 5.04?d?10.18 based on a+b=100.
    Type: Application
    Filed: October 21, 2014
    Publication date: March 12, 2015
    Inventors: Hiroshi Ikeda, Tadamasa Miura
  • Publication number: 20150043166
    Abstract: The optical transmitter module may include a thermal-electric cooler comprising at least one metal pattern formed on a side of a cooling plate temperature of which is controlled by thermo-electric cooling elements, a laser diode installed in one of the at least one metal pattern, and a monitor photo diode which is installed in another one of the at least one metal pattern and monitors change of light signals emitted from the laser diode. Therefore, since elements are located on the same side of the cooling plate, the optical transmitter module may have a simple structure and an advantage that light signals emitted from the laser diode can be directly coupled to the optical fiber without optical path conversions. Also, since the laser diode is installed with a small gap from thermal-electric elements, the temperature control characteristics of the thermal-electric cooler can be enhanced.
    Type: Application
    Filed: August 12, 2014
    Publication date: February 12, 2015
    Inventors: Young Soon HEO, Hyun Seo KANG, Keo-Sik KIM, Young Sun KIM, Jeong Eun KIM, Hyoung Jun PARK, Kwon Seob LIM, Eun Kyoung JEON
  • Publication number: 20150028992
    Abstract: A chip thermistor 1 has a thermistor portion 7 comprised of a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions 9, 9 comprised of a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion 7 so as to sandwich in the thermistor portion 7 between the composite portions 9, 9; and external electrodes 5, 5 connected to the pair of composite portions 9, 9, respectively. In this manner, the pair of composite portions 9, 9 are used as bulk electrodes and, for this reason, the resistance of the chip thermistor 1 can be adjusted mainly with consideration to the resistance in the thermistor portion 7, without need for much consideration to the distance between the external electrodes 5, 5 and other factors.
    Type: Application
    Filed: October 15, 2014
    Publication date: January 29, 2015
    Applicant: TDK CORPORATION
    Inventors: Yo SAITO, Kouki YAMADA, Daisuke TSUCHIDA
  • Publication number: 20140375173
    Abstract: A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped shaped laminate in which a ceramic layer and an internal electrode are alternately laminated and an external electrode provided on a portion of a surface of the laminate and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the laminate and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component.
    Type: Application
    Filed: June 16, 2014
    Publication date: December 25, 2014
    Inventors: Kenichi HAMANAKA, Kota ZENZAI, Taku DEKURA, Kiyotaka MAEKAWA
  • Publication number: 20140375175
    Abstract: A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the stack and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component. A volume occupied by the resin component in the inner external electrode is within a prescribed range.
    Type: Application
    Filed: June 16, 2014
    Publication date: December 25, 2014
    Inventors: Kenichi HAMANAKA, Kota ZENZAI, Taku DEKURA, Kiyotaka MAEKAWA
  • Patent number: 8881379
    Abstract: A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator is interposed between the thermal conductor and the body of the resistor. Accordingly, a resistor can carry large amounts of current because the high conductivity thermal conductor will conduct heat away from the resistor to a heat sink. Various configurations of thermal conductors and heat sinks are provided offering good thermal conductive properties in addition to reduced parasitic capacitances and other parasitic electrical effects, which would reduce the high frequency response of the electrical resistor.
    Type: Grant
    Filed: May 1, 2012
    Date of Patent: November 11, 2014
    Assignee: International Business Machines Corporation
    Inventors: Douglas D. Coolbaugh, Ebenezer E. Eshun, Terence B. Hook, Robert M. Rassel, Edmund J. Sprogis, Anthony K. Stamper, William J. Murphy
  • Publication number: 20140328373
    Abstract: Techniques described herein generally relate to methods of manufacturing devices and systems including devices including a substrate with a surface, a conductive polymer film arranged on the surface of the substrate, wherein the conductive polymer film has one or more temperature reactive characteristics, and a pair of electrodes coupled to the polymer film, wherein the pair of electrodes are configured to communicate electrical signals to the conductive polymer film effective to measure the one or more temperature reactive characteristics. The conductive polymer film may be arranged on the surface of the substrate such that a thickness and dopant ratio of the conductive polymer film on the substrate is configurable.
    Type: Application
    Filed: July 18, 2014
    Publication date: November 6, 2014
    Inventors: SIDDHARTHA PANDA, HAKEEM ABRAR AHMED
  • Patent number: 8847117
    Abstract: There is described a method for stabilizing a post-trimming resistance of a thermally isolated electrical component made from a thermally mutable material, the method comprising: generating at least one heating pulse, the at least one heating pulse having an initial amplitude corresponding to a trimming temperature, a slope corresponding to a given cooling rate and a duration corresponding to a given cooling time; and applying the at least one heating pulse to one of the thermally isolated electrical component and a heating device in heat transfer communication with the thermally isolated electrical component, after a trimming process, in order to cause the electrical component to cool in accordance with the given cooling rate, the given cooling rate being slower than a passive cooling rate determined by the thermal isolation of the electrical component.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: September 30, 2014
    Assignee: Sensortechnics GmbH
    Inventors: Oleg Grudin, Yougui Liao, Leslie M. Landsberger, Gennadiy Frolov, Lyudmila Grudina, Gerald Arzoumanian, Saed Salman, Tommy Tsang, Bowei Zhang
  • Publication number: 20140266567
    Abstract: A thermistor element includes a thermistor main body having a rectangular parallelepiped shape, and a first covering layer having reduction resistance and covering the periphery of the thermistor main body. At least a portion (exposed outer surface) of the outer surface of the first covering layer is exposed to the outside. When the shortest distance in a straight line in the first covering layer extending from a starting point on the thermistor main body to the exposed outer surface is defined as an exposed layer thickness at the starting point, the first covering layer is formed such that an exposed layer thickness measured by using any vertex of the rectangular parallelepiped thermistor main body as a starting point is equal to or greater than the smallest one of exposed layer thicknesses measured by using points on three sides and three flat surfaces which form the vertex.
    Type: Application
    Filed: March 6, 2014
    Publication date: September 18, 2014
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Hiroshi WATANABE, Yasuyuki OKIMURA
  • Publication number: 20140225710
    Abstract: A method for producing an electrical component, comprises providing a ceramic semiconducting base body (10) having a surface (O10) and a first side area (S10a) lying opposite the surface (O10), wherein a metallic layer (40) is contained within the base body. After at least two further metallic layers (210) have been arranged separately from one another on the side area (S10a) of the base body, the arrangement is sintered. An electrically insulating layer (30) is arranged between the at least two further metallic layers (210). A respective contact layer (220) is arranged on the metallic layers (210) by means of a chemical process. In this case, the material of the base body (10) is removed proceeding from the surface (O10) of the base body (10) at most as far as the metallic layer (40) arranged within the base body.
    Type: Application
    Filed: July 26, 2012
    Publication date: August 14, 2014
    Applicant: EPCOS AG
    Inventors: Thomas Feichtinger, Sebastian Brunner
  • Publication number: 20140198826
    Abstract: A paired temperature sensor includes two temperature sensors having electrical characteristics substantially equivalent at the same temperature range, each of the temperature sensor having a thermosensitive element therein that changes its electrical characteristics according to temperature, and a pair of lead wires, and a single connector 3 to which the two temperature sensors are connected via the lead wires. The two temperature sensors have electrical characteristics substantially equivalent at the same temperature range. The connector has positioning portions for allowing the connector to be connected in a predetermined orientation relative to a counterpart connector. There is provided at least one distinguishing difference between the two temperature sensors.
    Type: Application
    Filed: January 9, 2014
    Publication date: July 17, 2014
    Applicant: DENSO CORPORATION
    Inventors: Tomohiro ADACHI, Tsunenobu HORI, Kazuhiro INOGUCHI
  • Publication number: 20140169405
    Abstract: A resistive temperature sensor (thermistor) for a microelectromechanical system (MEMS) device provides local temperatures of MEMS sensors and other MEMS devices for temperature compensation. Local accurate temperatures of the sensors and other devices provide for temperature compensation of such sensors or devices. By incorporating the thermistor structure into a MEMS device, an accurate temperature is sensed and measured adjacent to or within the structural layers of the device. In one embodiment, the thermistor is located within a few micrometers of the primary device.
    Type: Application
    Filed: December 4, 2013
    Publication date: June 19, 2014
    Applicant: Robert Bosch GmbH
    Inventors: Andrew Graham, Ando Feyh, Gary O'Brien
  • Publication number: 20140035719
    Abstract: An over-current protection device has a PTC device, first and second electrodes and an insulation layer. The PTC device comprises first and second electrically conductive members and a PTC layer laminated between the first and second electrically conductive members. The first and second electrodes are electrically connected to the first and second electrically conductive members, respectively. The insulation layer is disposed on a surface of the first electrically conductive member. The device is a stack structure extending along a first direction, and comprises at least one hole extending along a second direction substantially perpendicular to the first direction. The value of the covered area of the hole divided by the area of the form factor of the over-current protection device is not less than 2%, and the value of the thickness of the device divided by the number of the PIC devices is less than 0.7 mm.
    Type: Application
    Filed: April 19, 2013
    Publication date: February 6, 2014
    Applicant: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Wen Feng LEE, Kuo Hsun Chen, Chun Teng Tseng, Yi An Sha, Ming Hsun Lu
  • Patent number: 8607440
    Abstract: Disclosed is a manufacturing method for a thermistor element having a step wherein a thermistor raw material powder formed from a metal oxide, an organic binder powder, and a solvent are mixed and kneaded to form a clay, a step wherein the clay is extrusion-molded by means of a molding die to form a rod-shaped, green molded body having multiple through-holes, a step wherein the rod-shaped green molded body is dried to form a rod-shaped dried molded body, a step wherein the rod-shaped dried formed body is cut to a prescribed length to form a cut molded body having through-holes, and a step wherein lead wires are introduced into the through-holes of the cut molded body and firing is then performed to form a metal oxide sintered body for thermistor use from the cut molded body.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: December 17, 2013
    Assignee: Mitsubishi Materials Corporation
    Inventors: Toshiaki Fujita, Kazutaka Fujiwara, Takashi Yamaguchi
  • Patent number: 8592732
    Abstract: Apparatuses and techniques relating to a resistive heating device are provided.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: November 26, 2013
    Assignee: Korea University Research and Business Foundation
    Inventor: Kwangyeol Lee
  • Publication number: 20130300533
    Abstract: A ceramic multilayered component which includes a layer stack having a plurality of ceramic layers. The multilayered component includes a first and a second connecting contact as well as a first and a second inner electrode, which are each arranged between two layers of the layer stack. The multilayered component includes a first and a second via electrode for electrically coupling the first connecting contact to the first inner electrode and for electrically coupling the second connecting contact to the second inner electrode.
    Type: Application
    Filed: October 27, 2011
    Publication date: November 14, 2013
    Applicant: EPCOS AG
    Inventors: Gerhard Bisplinghoff, Christian Hesse, Gerald Kloiber
  • Publication number: 20130243035
    Abstract: The invention provides a thermocouple assembly for use with a thermocouple harness in a gas turbine engine, comprising a thermocouple connected to a resistor, the resistor comprising a conductor, a mineral insulating material surrounding the conductor, and a metal sheath surrounding the conductor.
    Type: Application
    Filed: July 31, 2012
    Publication date: September 19, 2013
    Applicant: WESTON AEROSPACE LIMITED
    Inventor: Paul Walling
  • Patent number: 8514050
    Abstract: An NTC thermistor having a metal base material, a thermistor film layer formed on the metal base material, and a pair of split electrodes formed on the thermistor film layer. A ceramic slurry is applied onto a carrier film to form the thermistor film layer, a metal powder containing paste is applied onto the thermistor film layer to form the metal base material, and further an electrode paste is applied onto the metal base material to form the split electrodes. Thereafter, the three substances are integrally fired.
    Type: Grant
    Filed: April 8, 2013
    Date of Patent: August 20, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tadamasa Miura
  • Patent number: 8458894
    Abstract: A method for making a positive temperature coefficient device includes: (a) forming a crosslinkable preform of a positive temperature coefficient polymer composition containing a polymer system and a conductive filler; (b) attaching a pair of electrodes to the preform; (c) soldering a pair of conductive leads to the electrodes using a lead-free solder paste having a melting point greater than 210° C.; and (d) crosslinking the crosslinkable preform after step (c).
    Type: Grant
    Filed: May 26, 2009
    Date of Patent: June 11, 2013
    Assignee: Fuzetec Technology Co., Ltd.
    Inventors: Jack Jih-Sang Chen, Chi-Hao Gu
  • Publication number: 20130140499
    Abstract: The present invention relates to a conductive polymer composition for a PTC element with decreased NTC characteristics, using carbon nanotubes, a PTC binder resin, and a cellulose-based or polyester-based resin for fixing the carbon nanotubes and the PTC binder, and to a PTC element, a circuit and a sheet heating element using the same.
    Type: Application
    Filed: September 19, 2011
    Publication date: June 6, 2013
    Applicant: LG HAUSYS, LTD.
    Inventors: Seong-Hoon Yue, Yong-Bae Jung, Min-Hee Lee, Won-Kook Kim, Dong-Joo Kwon
  • Publication number: 20130133183
    Abstract: A process for producing zinc oxide varistor is disclosed to allow that one step of having zinc oxide grains doped with non-equivalent ions and sufficiently semiconductorized and the other one step of preparing sintered powders having property of high-impedance are prepared by two separate procedures respectively, resulted in that the zinc oxide varistor produced by the process features both a high potential gradient and a high non-linearity coefficient; and more particularly the disclosed process is suited for producing a specific zinc oxide varistor whose potential gradient ranges from 2,000 to 9000 V/mm as well as non-linearity coefficient (?) ranges from 21.5 to 55.
    Type: Application
    Filed: September 11, 2012
    Publication date: May 30, 2013
    Inventors: Ching-Hohn LIEN, Jie-An ZHU
  • Patent number: 8421584
    Abstract: An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: April 16, 2013
    Assignee: Polytronics Technology Corp.
    Inventors: Tong Cheng Tsai, Yi An Sha, David Shau Chew Wang, Fu Hua Chu
  • Publication number: 20130088319
    Abstract: A chip thermistor has a thermistor portion including a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions including a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions; and external electrodes connected to the pair of composite portions, respectively. In this manner, the pair of composite portions are used as bulk electrodes and, for this reason, the resistance of the chip thermistor can be adjusted mainly with consideration to the resistance in the thermistor portion without need for much consideration to the distance between the external electrodes and other factors.
    Type: Application
    Filed: June 21, 2011
    Publication date: April 11, 2013
    Applicant: TDK CORPORATION
    Inventors: Yo Saito, Kouki Yamada, Daisuke Tsuchida
  • Patent number: 8367986
    Abstract: A positive temperature coefficient (PTC) superimposed impedance polymeric (SIP) compound including an electrically insulating matrix essentially consisting of a siloxane polymer in addition to first and second electrically conductive particles having different properties with respect to surface energies and electrical conductivities. A multi-layered, ZPZ, foil including a PTC SIP compound of the invention present between two metal foils, thereby forming a conductive composite body. A multi-layered device, including an essentially flat composite body made up from a PTC SIP compound according to the invention, two electrode layers adhering to the surfaces of the composite body, the electrode layers being metal foils prepared to connect to electrodes.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: February 5, 2013
    Assignee: Conflux AB
    Inventors: Fredrik Von Wachenfeldt, Per-Göran Mikael Mortenson, Gunnar Nyberg, Lars-Ove Nilsson, Joachim Sjöstrand
  • Publication number: 20130021133
    Abstract: A varistor is provided with a varistor element body, a plurality of internal electrodes arranged in the varistor element body so as to sandwich a partial region of the varistor element body between them, and a plurality of external electrodes arranged on the surface of the varistor element body and connected to the corresponding internal electrodes. The external electrode has a sintered electrode layer formed by attaching an electroconductive paste containing an alkali metal to the surface of the varistor element body and sintering it. The varistor element body has a high-resistance region formed by diffusing the alkali metal in the electroconductive paste into the varistor element body from an interface between the surface of the varistor element body and the sintered electrode layer.
    Type: Application
    Filed: July 10, 2012
    Publication date: January 24, 2013
    Applicant: TDK CORPORATION
    Inventors: Hitoshi TANAKA, Katsunari MORIAI, Takahiro ITAMI
  • Publication number: 20120227229
    Abstract: A surface-mountable electrical circuit protection device includes layers defining a first PPTC resistive element, a second PPTC resistive element, and at least one heat-generating electrical component such as a planar zener diode chip positioned between, and in thermal contact with, the first and second PPTC elements, such that an electrical current above a threshold level passing through the component causes the component to heat, the heat being transferred to the PPTC resistive elements and tripping at least one, and preferably both of the first or second PPTC elements to a high resistance state. A series of edge-formed terminal electrodes enable surface-mount connection of the first and second PPTC elements and the electrical component to an electrical circuit substrate, such as a printed circuit board. A method for making the device is also disclosed.
    Type: Application
    Filed: May 22, 2012
    Publication date: September 13, 2012
    Inventors: Wayne Montoya, Luis A. Navarro, Cecilia A. Walsh, Adrian P. Mikolajczak
  • Patent number: 8230586
    Abstract: A method of cooling a resistor is provided. The method includes forming a first electrical insulator having a high thermal conductivity in thermal contact with an electrically resistive pathway and forming a substrate adjacent the electrical insulator. The method further includes forming a first electrical conductor having a high thermal conductivity within the second substrate and in thermal contact with the electrical insulator.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: July 31, 2012
    Assignee: International Business Machines Corporation
    Inventors: Douglas D Coolbaugh, Ebenezer E Eshun, Terence B Hook, Robert M Rassel, Edmund J Sprogis, Anthony K Stamper, William J Murphy
  • Publication number: 20120188051
    Abstract: An NTC thermistor having a metal base material, a thermistor film layer formed on the metal base material, and a pair of split electrodes formed on the thermistor film layer. A ceramic slurry is applied onto a carrier film to form the thermistor film layer, a metal powder containing paste is applied onto the thermistor film layer to form the metal base material, and further an electrode paste is applied onto the metal base material to form the split electrodes. Thereafter, the three substances are integrally fired.
    Type: Application
    Filed: February 24, 2012
    Publication date: July 26, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Tadamasa Miura
  • Publication number: 20120086542
    Abstract: A thermistor includes a multi-layer graphite structure having a basal plane resistivity that increases with increasing temperature; a substrate upon which the graphite structure is mounted; current and voltage electrodes attached to the graphite structure; current and voltage wiring; and a voltage measuring device to measure voltage out when current is applied to the thermistor.
    Type: Application
    Filed: October 7, 2010
    Publication date: April 12, 2012
    Inventors: Alexandre M. Bratkovski, Iakov Veniaminovitch Kopelevitch
  • Patent number: 8134446
    Abstract: An electrical component is specified with a sensor element, which is embedded in a plate arrangement. The plate arrangement includes at least three plates and conductor tracks, which are located between them and are conductively connected with the sensor element. At least two of the conductor tracks have exposed areas. Furthermore, a method for the encapsulation of a sensor element and a method for the production of a plate arrangement are specified.
    Type: Grant
    Filed: January 6, 2009
    Date of Patent: March 13, 2012
    Assignee: Epcos AG
    Inventors: Gerald Kloiber, Adalbert Feltz, Claus Cernoch
  • Patent number: 8117739
    Abstract: An electrical module assembly used in a surge arrester is manufactured by wrapping an electrical module assembly including at least one metal oxide varistor (MOV) disk to which a reinforcing structure including a pre-impregnated epoxy/glass-fiber composite has been applied with shrink film and compacting the wrapped electrical module assembly by heating the shrink film such that the shrink film shrinks and applies a radially compressive force to the electrical module assembly. The wrapped electrical module assembly then is cured at a temperature at which the shrink film no longer applies a compressive force.
    Type: Grant
    Filed: January 23, 2004
    Date of Patent: February 21, 2012
    Assignee: Cooper Technologies Company
    Inventors: Michael M. Ramarge, Alan P. Yerges, David P. Bailey, Roger S. Perkins
  • Publication number: 20120018205
    Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.
    Type: Application
    Filed: July 18, 2011
    Publication date: January 26, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Koji SATO, Yukio SANADA, Yasuhiro NISHISAKA
  • Publication number: 20110305259
    Abstract: A resistance thermometer is provided having a measuring resistor in a form of a 0.1 to 10 ?m thick structured platinum layer applied to an electrically insulated surface of a substrate and an electrically insulating coating layer covering the platinum layer. The substrate or its surface contains zirconium dioxide, which is stabilized with oxides of a trivalent and a pentavalent metal. Preferably, the trivalent metal is yttrium and the pentavalent metal is tantalum or niobium. The characteristic curve of the measuring resistor preferably conforms to DIN-IEC 751. For mass production of resistance thermometers having high and reproducible measurement accuracy, a structured platinum layer having a thickness of 0.1 to 10 ?m is applied to an electrically insulating substrate having a thermal expansion coefficient in the range of 8.5 to 10.5×10?6/° K and a roughness less than 1 ?m, and the structured platinum layer is covered by an electrical insulator.
    Type: Application
    Filed: January 20, 2010
    Publication date: December 15, 2011
    Applicant: HERAEUS SENSOR TECHNOLOGY GMBH
    Inventors: Karlheinz Wienand, Matsvei Zinkevich
  • Publication number: 20110273264
    Abstract: A laminated SMD-type thermistor has a conductive module, a left and a right conductive metal layer. The conductive module includes a core conductive module coated with an insulating layer on the upper and lower surface, and the left and right side. The core conductive module includes at least one conductive unit piled up in sequence, two conductive units are separated by an insulating material layer. The conductive unit includes an upper metal foil, a conductive polymer chip and a lower metal foil which are laminated in sequence from top to bottom. A left and right conductive metal layer are coated on the left and right part of the conductive module respectively, and penetrate the insulating layer partially, to connect with two metal foils of the conductive unit respectively. The laminated SMD-type thermistor can further comprise two plating resistant films coated on the upper and lower surface of the conductive module.
    Type: Application
    Filed: June 29, 2009
    Publication date: November 10, 2011
    Applicant: SHANGHAI KETER POLYMER MATERIAL CO., LTD.
    Inventors: Jinhua Huang, Pengxing Wang, Qingguo Gong, Yuzheng Shi, Jiangquan Liao