Abstract: An electrical component is specified with a sensor element, which is embedded in a plate arrangement. The plate arrangement includes at least three plates and conductor tracks, which are located between them and are conductively connected with the sensor element. At least two of the conductor tracks have exposed areas. Furthermore, a method for the encapsulation of a sensor element and a method for the production of a plate arrangement are specified.

Abstract: An electrical module assembly used in a surge arrester is manufactured by wrapping an electrical module assembly including at least one metal oxide varistor (MOV) disk to which a reinforcing structure including a pre-impregnated epoxy/glass-fiber composite has been applied with shrink film and compacting the wrapped electrical module assembly by heating the shrink film such that the shrink film shrinks and applies a radially compressive force to the electrical module assembly. The wrapped electrical module assembly then is cured at a temperature at which the shrink film no longer applies a compressive force.

Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.

Abstract: A resistance thermometer is provided having a measuring resistor in a form of a 0.1 to 10 ?m thick structured platinum layer applied to an electrically insulated surface of a substrate and an electrically insulating coating layer covering the platinum layer. The substrate or its surface contains zirconium dioxide, which is stabilized with oxides of a trivalent and a pentavalent metal. Preferably, the trivalent metal is yttrium and the pentavalent metal is tantalum or niobium. The characteristic curve of the measuring resistor preferably conforms to DIN-IEC 751. For mass production of resistance thermometers having high and reproducible measurement accuracy, a structured platinum layer having a thickness of 0.1 to 10 ?m is applied to an electrically insulating substrate having a thermal expansion coefficient in the range of 8.5 to 10.5×10?6/° K and a roughness less than 1 ?m, and the structured platinum layer is covered by an electrical insulator.

Abstract: A laminated SMD-type thermistor has a conductive module, a left and a right conductive metal layer. The conductive module includes a core conductive module coated with an insulating layer on the upper and lower surface, and the left and right side. The core conductive module includes at least one conductive unit piled up in sequence, two conductive units are separated by an insulating material layer. The conductive unit includes an upper metal foil, a conductive polymer chip and a lower metal foil which are laminated in sequence from top to bottom. A left and right conductive metal layer are coated on the left and right part of the conductive module respectively, and penetrate the insulating layer partially, to connect with two metal foils of the conductive unit respectively. The laminated SMD-type thermistor can further comprise two plating resistant films coated on the upper and lower surface of the conductive module.

Abstract: A ceramic component element is provided. The ceramic component element includes: an insulating ceramic base with pores formed on its surface and previously fired; and a functional ceramic sheet bonded to the insulating ceramic base and having electrical characteristics. The functional ceramic sheet is physically bonded to the insulating ceramic base by forming pressing a green sheet for the functional ceramic sheet on the insulating ceramic base at constant temperature and pressure so that parts of the green sheet are forced to put into the pores and anchored, and the functional ceramic sheet is chemically bonded to the insulating ceramic base by firing the anchored green sheet in such a manner that functional oxides of the green sheet penetrate the insulating ceramic base by solid diffusion to form a diffusion bonding layer.

Abstract: A method for fabricating a negative temperature coefficient thermistor is provided, including the steps of: (A) combining ceramic powders having a negative temperature coefficient of resistance, a polymer binder and a solvent to form a mixture; (B) removing the solvent and granulating the mixture to form granulous powders; (C) compressing the granulous powders to obtain a thermistor material with a specific shape; (D) curing the thermistor material at 80° C. to 350° C.; and (E) mounting an electrode to the thermistor material to form the negative temperature coefficient thermistor. The method can be performed in a low temperature without the problem of interface diffusion. Further, the desired resistance value and thermistor constant (B) can be easily adjusted and obtained by mixing ceramic powders with different characteristics of temperature coefficient of resistance and/or the addition of conductive metal powder.

Abstract: A temperature sensor capable of operation in high vibration environment includes a sensor sheath mounted at the distal end of a mineral insulated cable. A resistance temperature detector (RTD) sensing element is connected to leads of the cable within the sheath. The sheath is filled at least partially with a ceramic thermal adhesive.

Abstract: An ablating device is used to form a pattern into a sensing element pad of a soot sensor, with the pattern establishing two finger paths without electrical connection between them. The pattern can be formed through a protective layer on the sensing element pad before the sensing element pad is fired.

Abstract: Disclosed are a method for manufacturing a positive temperature coefficient (PTC) device and a system for preventing overheating of a planar heater using the same. The manufacturing of the positive temperature coefficient (PTC) device is performed by mixing one or more polymer resins selected from ethylene butyl acrylate copolymers, ethylene vinyl acetate copolymers and polyethylene oxide, carbon black and an additive to prepare a compounding composition, adhering an electrode to both surfaces of the compounding composition, compressing the resulting electrode structure into a sheet, and irradiating electron beams to the sheet to perform cross-linking. Also, disclosed is a planar heater overheating prevention sensor cable obtained by connecting a plurality of PTC devices in series and adhering the devices to the surface of a planar heater by a predetermined distance.

Abstract: This invention relates to a method for thin film device. The method for manufacturing a thin film negative temperature coefficient thermistor is disclosed. It includes selecting a substrate, a temperature-sensitive layer, inner electrodes, a protective layer and end electrodes. The temperature-sensitive layer is an NTC thin film, the inner electrodes have a comb-shaped structure. The resistance value of the present invention can be regulated by changing material composition and the width, gap, length of comb-shaped electrodes, which are not influenced by the error of the thermistor physical size. In present invention, a high temperature glaze is engaged to smooth the surface of cheaper ceramic substrates. This process reduces the manufacturing cost, improves the structure, enhances the reliability and the yield and thus expands the application scope of the NTC thin film thermistor chips. The invention has an industrial practicability.

Abstract: Thermal flow measuring device and method for the manufacture of a thermal flow measuring device with a spacer having a first cavity for accommodating a resistance thermometer, wherein the spacer has at least a first planar area, which faces the first cavity, and a second cavity, through which the resistance thermometer can be pressed by means of a hold-down onto the first planar area of the spacer.

Abstract: A thermocouple shield assembly comprising a first tube having an upper portion and a lower portion with a lower end, the first tube including a first elongated cavity closed at the lower end and receiving the thermocouple, a second tube having a second elongated cavity with at least one open end and receiving the upper portion while a part of the lower portion containing the thermocouple extends out of the open end, and a gap between adjacent walls of the second elongated cavity and of the first tube such as to allow independent thermal deformations of the first and second tubes. In use, at least a portion of the part of the lower portion of the first tube is subjected to a given temperature while the second tube is subjected to a different temperature. Methods of manufacturing and of assembling such a thermocouple shield assembly are also presented.

Abstract: According to a first preferred embodiment, a resistor arrangement with resistor elements is specified whose first electrodes are conductively connected to each other by means of a flexible, conductive connection element that is curved. The connection element has changes in curvature in the regions arranged between two adjacent resistor elements. According to a second preferred embodiment, a resistor arrangement with resistor elements is specified that are connected to each other by a flexible connection element. The resistor elements each have an arrangement of slot-like recesses.

Abstract: A temperature probe includes a substrate, a cantilever body portion formed on the substrate, having an anchor portion held in contact to the substrate and a free end portion extending out of the surface of the substrate, and a sputter-deposited thermistor sensor portion located at the free end portion of the cantilever body portion.

Abstract: Disclosed herein are a highly dense and nano-grained NTC thermistor thick film and a method for preparing the same, and specifically, an NTC thermistor thick film vacuum deposited by spraying a spinel grained ceramic powder containing Ni and Mn on one side of the surface of a substrate using a room temperature powder spray in vacuum (AD) and a method for preparing the same. According to the present invention, a room temperature powder spray in vacuum (AD) may be used to perform a rapid deposition of NTC thermistor thick films and prepare a highly dense ceramic thick film, the NTC characteristic constant B which would be obtained by doping may be maximized without doping, demagnetization may be obtained without any additional heat treatment, and thus limitations on substrate that the conventional art has may be completely overcome.

Abstract: It is an object to provide processes for the production of thin-film sensors whereby crystals are strongly oriented without cost-adding steps such as heating and variations in electrical properties are small among the obtainable products. A process of producing a thin-film sensor is a process of producing a thin-film sensor that include an insulating substrate and an electrical resistor which is made of a metal and is provided on the insulating substrate, the process including a step of forming the electrical resistor by sputtering the metal while applying a negative direct-current voltage to the insulating substrate.

Abstract: A method and apparatus for an irreversible temperature sensor for measuring a peak exposure temperature. The apparatus is fabricated by printing an admixture of conductive nanoparticles on a dielectric substrate to form a film. The film has an electrical resistance that is inversely proportional to the exposure temperature. The electrical resistance also irreversibly decreases as the exposure temperature of the film increases. A portion of the film is exposed to a pulse of electromagnetic energy sufficient to render it substantially more electrically conductive than the portion that was not exposed. In use, the peak exposure temperature is determined by measuring the electrical resistance of the non-altered portion of the film and the electrical resistance of the portion that was exposed to the pulse of electromagnetic energy, and subtracting the electrical resistance of the altered portion from the electrical resistance of the portion that was not altered, to provide a difference value.

Abstract: An embodiment of a resistor formed by at least one first portion and one second portion, electrically connected to one another and with different crystalline phases. The first portion has a positive temperature coefficient, and the second portion has a negative temperature coefficient. The first portion has a first resistivity, and the second portion has a second resistivity, and the portions are connected so that the resistor has an overall temperature coefficient that is approximately zero.

Abstract: A temperature probe assembly is provided. The temperature probe assembly may comprise a housing formed of a first thermally conductive material and having an inner diameter defined by an inner bore, an insert formed of a second thermally conductive material disposed in the inner bore and having an outer diameter that is substantially equal to the inner diameter of the housing at a first temperature and a temperature sensor mounted within the insert. The second thermally conductive material has a thermal coefficient of expansion that is greater than the first thermally conductive material, such that the insert is insertable into the inner bore at the first temperature and is tightly locked in the inner bore at a second temperature that is greater than the first temperature.

Abstract: A high-temperature sensor element includes at least one thermistor element having at least two contact areas and one contacting element including an isolating ceramic base body and at least two conductor lines. The contact areas of the thermistor element are connected to the conductor lines of the contacting element by an electro conductive bridge. A process for assembling a sensor element is also described in which an thermistor element is connected by a temperature resistant junction to a contacting element, and in which the thermistor element and part of the contacting element adjacent to the thermistor element are sealed by a encapsulation compound.

Abstract: A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.

Abstract: An electrical device includes a thermistor and at least two electrodes electrically connected to the thermistor and to which a source of electrical power is applied to cause current to flow through the thermistor. The thermistor may be a composite and includes a polymer material; and a plurality of conductive carbon nanotubes distributed in the polymer material. The electrical device employed with the thermistor performs not only PTC property, but also NTC property. Moreover, the method for fabricating the electrical device is also simple and easy to carry out because of the simple process.

Abstract: There are described various methods and circuits for trimming the parameter value of a thermally mutable electrical component in two directions. A sequence of heat pulses is selected as a function of thermal history using an adaptive trimming algorithm, where parameters of the sequence of heat pulses are based on a resulting impact of previous heating pulses. Direction of trimming, trimming increment, and remaining trimming distance can all be used to determine the parameters of succeeding heat pulses, wherein the parameters of the pulses can be, for example, amplitude, duration, and time interval between pulses.

Abstract: A temperature sensor capable of operation in high vibration environment includes a sensor sheath mounted at the distal end of a mineral insulated cable. A resistance temperature detector (RTD) sensing element is connected to leads of the cable within the sheath. The sheath is filled at least partially with a ceramic thermal adhesive.

Abstract: A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. Compared with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the capacitive reactance effect caused by two connectors of the conventional resistors is avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.

Abstract: There is provided a polymer PTC device including a polymer PTC element having a lower resistance. The production process of a PTC device which includes a PTC element (102) having a polymer PTC component (110) and metal electrodes (104) placed on both sides thereto; and a lead (106) connected electrically to at least one of the metal electrodes, is characterized in that the polymer PTC component is formed of an electrically conductive polymer composition which comprises a polymer material and conductive fillers dispersed therein, and the connection of the lead to the metal electrode is performed at a temperature which is lower than the melting point of the polymer material.

Abstract: The thermal isolation of a thermally-trimmable resistor has a direct impact on temperature rise. It is possible to design the thermal isolation of the portions of a compound resistor to minimize or optimize the resistance variation of the overall compound resistor. The resistance variation of the overall compound resistor due to self-heating of its portions can be reduced or optimized, by designing different thermal isolation for each of the portions, such that compensation and/or optimization can occur. Furthermore, one can also design such different thermal isolation of the portions of a compound resistor to minimize resistance variation over a trim range of a compound resistor due to self-heating.

Abstract: Provided is a thermistor that exhibits small changes in resistance before and after tripping. In a preferred embodiment, the thermistor comprises a pair of electrodes, and a thermistor layer disposed between the pair of electrodes. The thermistor layer is a cured layer of a thermistor composition that comprises a resin, conductive particles, and a cross-linking agent comprising an isocyanurate having allyl groups and glycidyl groups.

Abstract: The presently described embodiments are directed to a calibration method and system for thin film thermistors that are locally heated with integrated thin film heaters. Initially, print head temperature is either measured or referenced. Then, transient thermistor resistances are measured and used to determine the thermistor resistance at a higher temperature. Notably, this calibration method is advantageously implemented as a step of an existing process without having to expose the print heads to operating temperatures. In some implementations of the presently described embodiments, trimming of the thermistors may be required once calibrated.

Abstract: Electro-thermal trimming of thermally-trimmable resistors is used to trim one or more of the plurality of resistors in or associated with an analog electric circuit. The TCR of each of a subset of a plurality of electro-thermally-trimmable resistors can be trimmed independently from the resistance in order to adjust the output parameter of an analog electric circuit without changing other parameters that would be affected by a change in resistance.

Abstract: An electrical PTC thermistor component includes a base that includes a peripheral surface, first and second faces on different sides of the component, and first and second conductive layers, each of which is on at least one of the first and second faces. The first conductive layer is not on the peripheral surface. The second conductive layer includes a cap that covers, and overlaps edges of, the at least one of the first and second faces.

Abstract: A temperature sensor is provided. The temperature sensor includes: a temperature sensitive element having a temperature sensitive body and an element electrode wire; a sheath member having an external cylinder, the sheath member encompassing a sheath core wire to be bonded to the element electrode wire in the external cylinder; an enclosing member having a bottom-closed cylindrical shape extending in an axial direction, at least the temperature sensitive element and a bond portion of the element electrode wire and the sheath core wire being accommodated in an internal space of the bottom-closed cylindrical shape, and a holding member that is filled in the internal space, wherein an air gap is provided at least between an outer surface of the temperature sensitive body and the holding member so as to permit displacement of the temperature sensitive body in a direction intersecting the axial direction of the enclosing member.

Abstract: A method for fabricating a negative temperature coefficient thermistor is provided, including the steps of: (A) combining ceramic powders having a negative temperature coefficient of resistance, a polymer binder and a solvent to form a mixture; (B) removing the solvent and granulating the mixture to form granulous powders; (C) compressing the granulous powders to obtain a thermistor material with a specific shape; (D) curing the thermistor material at 80° C. to 350° C.; and (E) mounting an electrode to the thermistor material to form the negative temperature coefficient thermistor. The method can be performed in a low temperature without the problem of interface diffusion. Further, the desired resistance value and thermistor constant (B) can be easily adjusted and obtained by mixing ceramic powders with different characteristics of temperature coefficient of resistance and/or the addition of conductive metal powder.

Abstract: A circuit board element (11) and production thereof are disclosed, whereby a noble metal (16) is applied to a structured conductor layer (13) on a circuit board substrate (12), comprising said conductor layer (13). The conductor layer (13) is roughened on the surface, preferably after the structuring thereof and the noble metal applied as a layer (16), essentially on all of the structured roughened conductor layer (13), whereupon the noble metal layer surface is given a corresponding roughness (8?).

Abstract: A method and apparatus for an irreversible temperature sensor for measuring a peak exposure temperature. The apparatus is fabricated by printing an admixture of conductive nanoparticles on a dielectric substrate to form a film. The film has an electrical resistance that is inversely proportional to the exposure temperature. The electrical resistance also irreversibly decreases as the exposure temperature of the film increases. A portion of the film is exposed to a pulse of electromagnetic energy sufficient to render it substantially more electrically conductive than the portion that was not exposed. In use, the peak exposure temperature is determined by measuring the electrical resistance of the non-altered portion of the film and the electrical resistance of the portion that was exposed to the pulse of electromagnetic energy, and subtracting the electrical resistance of the altered portion from the electrical resistance of the portion that was not altered, to provide a difference value.

Abstract: A thermistor device configures part of an electrical path from a motor feeder section to an armature. A recess defining wall defines an accommodating recess, which accommodates the thermistor device. The thermistor device includes a plate-like thermistor element. A first conductive plate and a second conductive plate sandwich the thermistor element. A pair of first projections 22b are provided at the distal end of the first conductive plate in the insertion direction. A pair of second projections 23b are provided at the distal end of the second conductive plate in the insertion direction. The first projections and the second projections abut against the recess bottom wall in a range that corresponds to the thermistor device except the thermistor element.

Abstract: A temperature probe, such as for a respiratory system in which breathable gases are supplied to a patient, includes a housing having a cavity sized to snugly receive therein a generally cylindrical container within which is secured a thermistor, with the container adapted to provide a barrier to moisture. The probe provides a quick temperature response but minimizes migration of moisture to the thermistor notwithstanding the high temperature and heat levels encountered in normal operation of the respiratory system.

Abstract: Provided are a ceramic component and a method of manufacturing the ceramic component. The ceramic component includes a previously fired insulation ceramic base, a functional ceramic sheet bonded to the insulation ceramic base by a diffusion bonding layer having an anchoring structure, internal electrodes embedded into the functional ceramic sheet, and external electrodes connected to the internal electrodes. A functional ceramic paste corresponding to the functional ceramic sheet is applied to the insulation ceramic base and is dried to form a functional ceramic film. The functional ceramic film is pressed against the insulation ceramic base to anchor functional ceramic film into the insulation ceramic base for sure attachment. The functional ceramic film is fired to allow functional oxide materials included in the functional ceramic film to permeate the insulation ceramic base by solid diffusion to form the diffusion bonding layer and to change the functional ceramic film into the functional ceramic sheet.

Abstract: Provided are a stacked electronic part that can sufficiently suppress plating deposition on the surface of a porous green body when a terminal electrode is formed on an external electrode, thereby enabling a decrease in the reliability of products to be prevented, and a method of manufacturing the stacked electronic part. The stacked electronic part 1 is a PTC thermistor having a stacked body 4 containing a porous green body 2 made of ceramics and having a plurality of vacancies and a plurality of internal electrodes 3 formed within the porous green body 2, and is provided with at least one unit structure 10 in which the porous green body 2 and the internal electrode 3 are stacked. External electrodes 5, 5 are connected to the internal electrode 2, and upon the external electrodes 5, 5 are formed terminal electrodes 7, 7 by plating. Resin is filled in the plurality of vacancies of the porous green body 2 at a filling ratio of not less than 60%.

Abstract: A stacked PTC thermistor 1 comprises a body 4 obtained by alternating lamination of a semiconductor ceramic layer 2 and an internal electrode 3, and a pair of external electrodes 5a, 5b provided at the edge faces 4a, 4b of the body 4 and electrically connected with the internal electrode 3. The semiconductor ceramic layer 2 is composed of a porous sintered compact containing crystal grains of a barium titanate-based compound, and an alkali metal element is preferentially distributed in at least one of the grain boundaries and voids of the sintered compact.

Abstract: An method for manufacturing an electrical component comprises providing a base body of a ceramic material with at least two contact regions with terminal elements secured thereto. The base body is immersed into a solution that contains a fluid that wets the base body and a hydrophobic and lipophobic intermediate layer material dissolved in the fluid. The base body is removed from the solution so that a part of the solution remains adhering thereto as a film that completely envelopes the base body. An intermediate layer is produced by evaporating the fluid contained in the film, and a protective layer is applied onto the intermediate layer.

Abstract: A method for fabricating a thermocouple capable of long-term operation in high temperature, hostile environments without significant signal degradation or shortened thermocouple lifetime due to heat induced brittleness.

Abstract: The present invention provides a polymeric positive temperature coefficient thermistor, which comprises a first electrode, a second electrode, and a polyimide film sandwiched in between, which comprises (A) a polyimide resin, and (B) nickel powder used to blend with the polyimide resin, wherein the polyimide film has a thickness from 10 to 100 ?m, and the filling proportion of the nickel powder within the polyimide resin reaches a critical volume fraction or above. A process for preparing the above mentioned thermistor is also provided.

Abstract: A manufacturing method for a substrate heating device comprises forming a base plate having a substrate heating surface in which a resistance heating element is buried, forming a tubular member, joining the tubular member to the base plate, measuring temperature distribution in the substrate heating surface by supplying power to the resistance heating element, and grinding the tubular member according to a grinding condition based on a measurement result of the temperature distribution.

Abstract: A thermal-type fluid flow sensor technology for measuring more precisely the temperature of the heater for an improved sensibility of detecting flow measurements. The thermal-type fluid flow sensor for measuring the air flow rate includes a heating resistive element formed on the semiconductor substrate through a first insulating layer, temperature-measuring resistive elements for heating resistive element for measuring the temperature of the heating resistive element, upstream and downstream temperature-measuring resistive elements for detecting the temperature of air on the upstream side and the downstream side of the air heated by the heating resistive element, and an air temperature measuring resistive element for measuring the temperature of the air heated by the heating resistive element, and at least the temperature-measuring resistive element for the heating resistive element is disposed in the upper layer or lower layer of the heating resistive element.

Abstract: An encapsulated heat pipe is made by placing a removable elongated solid partially within a mold, filling the mold with a solid dielectric material, and removing the elongated solid from the dielectric material defining an elongated cavity that extends within the solid dielectric material. Next, a wick material is inserted into the periphery of the elongated cavity, then a coolant liquid is inserted into the elongated cavity and the open end of the elongated cavity is sealed.

Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.

Abstract: A method for producing components for injection moulding comprising a body made of thermally conducting material with expansion coefficient matching that of the insulating layers and provided with a passage for the material to be injected. At least one strip of electrically conducting material with high change of resistance with temperature, forming a heating resistor or inductor is applied on a electrically insulating base layer previously directly applied on the body. At least one final insulating layer with low thermal emissivity is then applied to optimise electrical efficiency. The method utilises thermal spray techniques and can be applied also for production of other heating equipment.

Abstract: A method of manufacturing a composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially between the layers with an intermediate layer of the structural reinforcement material disposed between the electrical devices. At least one electrical bus is disposed in the structural member, and each electrical device is connected to the bus by a conductive electrode. Thus, the electrodes can extend through the intermediate layer of the structural reinforcement material to connect each of the electrical devices to one or more of the buses.