Strain Gauge Making Patents (Class 29/621.1)
  • Patent number: 10694999
    Abstract: A sensor apparatus includes at least one substrate layer of an elastically deformable material, the substrate layer extending longitudinally between spaced apart ends thereof. A conductive layer is attached to and extends longitudinally between the spaced apart ends of the at least one substrate layer. The conductive layer includes an electrically conductive material adapted to form a strain gauge having an electrical resistance that varies based on deformation of the conductive layer in at least one direction.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: June 30, 2020
    Assignees: CASE WESTERN RESERVE UNIVERSITY, THE UNITED STATES GOVERNMENT AS REPRESENTED BY THE DEPARTMENT OF VETERANS AFFAIRS
    Inventors: Steve J A Majerus, Jeremy Dunning, Katherine M. Bogie, Joseph A. Potkay
  • Patent number: 10700392
    Abstract: The invention relates to a galvanic cell (2) comprising a housing (4) which is equipped with at least one cell coil or a cell stack and comprising a sensor (16) for detecting the pressure of the galvanic cell (2). The housing (4) has a recess which is formed from a through-opening between an interior and an exterior of the cell (2), and the sensor (16) is arranged outside of the cell (2) so as to be secured directly or indirectly to the cell. The sensor (16), in particular a micro electromechanical system, is in contact with the interior of the galvanic cell (2) via the recess. The invention additionally relates to a method for producing such a galvanic cell (2).
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: June 30, 2020
    Assignee: Robert Bosch GmbH
    Inventors: Daniel Pantel, Fabian Henrici, Nicola Mingirulli
  • Patent number: 10698532
    Abstract: It is disclosed a stretchable touchpad (10) of the capacitive type including a stretchable textile fabric (20) having a plurality of conductive elements incorporated therein. The conductive elements are resistive strain gauges (30, 40) which form electrodes to detect a change of capacitance caused by a touch. It is also disclosed a method for operating a stretchable touchpad (10) comprising the steps of measuring continuously a capacitance analog signal provided by a resistive strain gauge (30, 40) of the stretchable touchpad (10); and comparing the measured capacitance signal with a threshold value in order to determine whether or not a touch has taken place, wherein the threshold value is continuously adjusted as a function of the actual measurement of capacitance and as a function of the resistance of said resistive strain gauges (30, 40) which form the capacitor electrodes of said touchpad (10).
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: June 30, 2020
    Assignee: Sanko Tekstil Isletmeleri San. Ve Tic. A.S.
    Inventors: Özgür Cobanoglu, Leyla Zengi, Günes Banazili, Merve Nagihan Akcay, Kenan Loyan, Özgür Akdemir, Fehim Caglar
  • Patent number: 10670484
    Abstract: An apparatus includes a base assembly, a gasket and a housing assembly. The base assembly may have a locking feature and a bearing feature. The locking feature may have a first passage in communication with an exterior of the apparatus. The gasket may be mounted on the base assembly and may have (i) a compression region, (ii) a central region and (iii) a second passage in communication with the first passage. The housing assembly may have a sealing feature and may be configured to hold a sensor. The sealing feature (a) may mate with the bearing feature and (b) may compress the gasket in the compression region. The sensor (a) may seal to the central region of the gasket and (b) may be in communication with the exterior of the apparatus through the first passage and the second passage.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: June 2, 2020
    Assignee: VEONEER US INC.
    Inventor: Jacob Pusheck
  • Patent number: 10634482
    Abstract: A method of making a sensor apparatus including placing a mask over a polymeric sheet, wherein the mask is configured to block regions of the polymeric sheet, depositing a conductive structure on the polymeric sheet at regions exposed through the mask, shrinking the polymeric sheet with conductive structure patterned on its surface by heating, and transferring the conductive structure to a flexible substrate.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: April 28, 2020
    Assignee: The Regents of the University of California
    Inventors: Jonathan Pegan, Michelle Khine, Mark Bachman, Joshua Kim, Sun-Jun Park
  • Patent number: 10627301
    Abstract: A sensor has a sensor body with a first face and a second face opposite to one another, and a circuit arrangement supported by the sensor body that includes a first electrical circuit pattern on the first face, a second electrical circuit pattern on the second face, connection means, which electrically connect the first circuit pattern to the second circuit pattern and has at least one through hole that extends axially between the two faces of the sensor body. A plurality of terminals are electrically connected to the first circuit pattern and/or the second circuit pattern. The at least one through hole is preferably closed at the second face of the sensor body via a closing member (30) having pre-formed body with a closing portion having a diameter, greater than a diameter, of the opening of the through hole at the second face of the sensor body.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: April 21, 2020
    Assignee: METALLUX SA
    Inventors: Massimo Monichino, Stefania Grandis
  • Patent number: 10571353
    Abstract: A pressure sensing apparatus for a vehicle may include: a sensor element configured to measure a change in air pressure by a vehicle collision; a housing unit into which the sensor element is seated, and including a terminal unit electrically coupled to the sensor element, the housing unit being fixed to a vehicle body; a cover unit removably installed on the housing unit; and an elastic pressing unit including a first end coupled to the cover unit, and a second end protruding toward the sensor element and pressing the sensor element, the elastic pressing unit being made of elastically deformable material. An area of a pressing surface of the elastic pressing unit that faces the sensor element may be equal to or less than an area of a surface of the sensor element that faces the pressing surface.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: February 25, 2020
    Assignees: HYUNDAI MOBIS CO., LTD., KOREA ELECTRIC TERMINAL CO., LTD.
    Inventors: Sangdo Kim, Hyunseok Yun
  • Patent number: 10548488
    Abstract: The method for producing the strain gauge device (10) comprises a first stop of producing the band (12). The band (12) has flexibility at least in the measuring zone (36). Then a sensor (22) comprising at least one measuring strand (30) and changing electrical resistivity in dependence of the strain is produced and arranged on or in the band (12) without pre-tension. Afterwards the shape of the band (12) is changed into a retaining working shape and thereby the measuring strand (30) is stretched to an amount of pre-tension.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: February 4, 2020
    Assignees: STBL Medical Research AG, EMPA Swiss Federal Laboratories for Materials Science and Technology
    Inventors: Mark Melnykowycz, Frank Clemens
  • Patent number: 10539436
    Abstract: A pressure sensing apparatus for an airbag may include: a sensor element configured to measure a change of air pressure by a vehicle collision; a housing having the sensor element seated therein, including a terminal part electrically connected to the sensor element, and fixed to a vehicle body; a cover detachably installed on the housing; and an elastic pressing part having one side connected to the cover and the other side protruded toward the sensor element so as to press the sensor element, and formed of an elastically deformable material. The housing may include a support protrusion to support the bottom of the sensor element with the terminal part.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: January 21, 2020
    Assignees: Hyundai Mobis Co., Ltd., KOREA ELECTRIC TERMINAL CO., LTD.
    Inventors: Sang Do Kim, Hyun Seok Yun
  • Patent number: 10527513
    Abstract: A pressure sensor includes a sensor chip and a resin portion. The sensor chip extends in a lengthwise direction and includes a membrane whose length in a thickness direction perpendicular to the lengthwise direction is smaller than another part, and a piezoelectric element provided in the membrane. The sensor chip includes a fixed end that is covered with and fixed to the resin portion, and a free end opposite from the fixed end in the lengthwise direction. The free end is spaced away from the resin portion in the lengthwise direction, and the membrane is located in the free end. A shortest separation distance between the membrane and a part of the resin portion covering the sensor chip is equal to or larger than a length of the sensor chip along a crosswise direction of the sensor chip perpendicular to both the lengthwise direction and the thickness direction.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: January 7, 2020
    Assignee: DENSO CORPORATION
    Inventors: Kazuyuki Oono, Kouji Hashimoto
  • Patent number: 10466125
    Abstract: A differential pressure sensor includes a first sensor housing member having a first fluid inlet port for receiving a first fluid at a first pressure and a second sensor housing member having a second fluid inlet port for receiving a second fluid at a second pressure. A pressure-sensing subassembly includes a semiconductor pressure-sensing die having a sensitive diaphragm for sensing pressure. The pressure-sensing subassembly is configured for insertion into the differential pressure sensor such that once inserted the first fluid inlet port is in fluid communication with a first surface of the sensitive diaphragm and the second fluid inlet port is in fluid communication with a second surface of the sensitive diaphragm.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: November 5, 2019
    Assignee: Measurement Specialties Inc.
    Inventor: David E. Wagner
  • Patent number: 10458872
    Abstract: An electronic pressure sensor includes a housing having a distal end configured to be exposed to a flow of a fluid media, the distal end opposite a proximal end, wherein the proximal end is configured not to be exposed to the fluid media. A chamber and connected passageway are disposed within the housing. The passageway is connected at one end to the chamber and connected at another end to an opening disposed at the distal end of the housing. The opening is configured to be in fluidic communication with the fluid media. A pressure sensor is disposed within the chamber. A first temperature sensor is disposed within the chamber. A viscous gel is disposed within the chamber, the viscous gel separating on a first side both the pressure sensor and the first temperature sensor apart from the passageway on a second side of the viscous gel.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: October 29, 2019
    Assignee: FLO TECHNOLOGIES, INC.
    Inventor: Henry M. Halimi
  • Patent number: 10373747
    Abstract: A magnetic laminating inductor structure and process for preventing substrate bowing and damping losses generally include a laminated film stack including a magnetic layer having a tensile stress, an insulating layer having a compressive stress disposed on the magnetic layer, and a dielectric planarizing layer on the insulating layer. The dielectric planarizing layer has a neutral stress and a roughness value less than the insulating layer. The reduction in surface roughness reduces damping losses and the compressive stress of the insulating layers reduces wafer bowing.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: August 6, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hariklia Deligianni, Bruce B. Doris, Eugene J. O'Sullivan, Naigang Wang
  • Patent number: 10264984
    Abstract: A cardiovascular monitoring system includes a sensor assembly and a controller. The sensor assembly includes a membrane enclosing a viscous fluid, a substrate immersed in the viscous fluid, and at least one strain gauge mounted with the substrate. The strain gauge is configured to detect bending of the substrate due to changes in capillary blood pressure of a person in contact with the membrane at less than 50 mmHg contact pressure and to output a signal indicative of the changes. The controller may be configured to output a change in mean arterial pressure of the person based on a profile of the signal that is associated with a heartbeat of the person. Also, the controller may be configured to output the mean arterial pressure based on a weight signal indicative of a weight of the person and the profile of the signal associated with the heartbeat.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: April 23, 2019
    Inventors: Maged Choucair, Thierry Rolina
  • Patent number: 10245802
    Abstract: A die compatibility adaptor including a housing and a die cable extending outward from the housing and terminating at a die cable end engageable with a manufacturing die that includes a first proximity sensor configured to output a first proximity signal and a second proximity sensor configured to output a second proximity signal. The die compatibility adaptor further includes a direct cable receptacle communicatively coupled to the die cable, a duplicate cable receptacle, and one or more isolation relays positioned between and communicatively coupled to the duplicate cable receptacle and the die cable, the one or more isolation relays having a closed position and an open position. In the closed position, the duplicate cable receptacle is communicatively coupled to the die cable.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: April 2, 2019
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Dale A. Lewis
  • Patent number: 10215600
    Abstract: Flow sensors, systems, and methods for continuous in situ monitoring of a rheologically complex fluid flow within a vessel, such as particulate and multiphase media for ascertaining certain fluid flow parameters, such as flow rate, dynamic viscosity, fluid density, fluid temperature, particle density and particle mass, from flow sensor measurements, the sensors, systems, and methods involving a fluid flow sensor having a body member with internalized strain gauges configured to measure the deformation of certain segments of the body member and, based, at least in part, on these deformation measurements, the system is used to compute the fluid flow parameters.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: February 26, 2019
    Assignee: Lenterra, Inc.
    Inventors: Valery Sheverev, Vadim Stepaniuk
  • Patent number: 10113927
    Abstract: A flip chip pressure sensor assembly. The flip chip pressure sensor assembly comprises a substrate; a pressure sensor die comprising a sensing diaphragm, the die having a top side and a bottom side that is reverse to the top side, where the top side of the die is electrically connected to the substrate by flip chip mounting technology; a cover defining an aperture disposed over the pressure sensor die, where the aperture defined by the cover aligns with the sensing diaphragm to provide a path for pressure to be transmitted through the aperture to the bottom side of the sensing diaphragm; and a gel disk disposed within the aperture in intimate contact with a bottom side of the sensing diaphragm, where the gel disk is domed above an outer shoulder of a rim defined by the cover.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: October 30, 2018
    Assignee: Honeywell International Inc.
    Inventor: Richard Wade
  • Patent number: 10067007
    Abstract: A deformation sensing apparatus comprises an elastic substrate, a first strain-gauge element formed on a first surface of the elastic substrate, and configured to output a first signal in response to a strain applied in a first direction, and a second strain-gauge element formed on a second surface of the elastic substrate opposite to the first surface, and configured to output a second signal in response to a strain applied in the same first direction.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: September 4, 2018
    Assignee: Oculus VR, LLC
    Inventors: Sean Jason Keller, Tristan Thomas Trutna, David R. Perek, Bruce A. Cleary, III
  • Patent number: 9983074
    Abstract: A force detector capable of preventing short-circuit fault between electrodes and allowing for downsizing. A prescribed region encompasses a projection region defined by projecting a deformation region of a force sensor element, which is deformed when a force transmission member applies a force to the force sensor element, onto a base substrate. A plurality of terminals are provided by four soldering land electrodes formed, respectively, at four corners of the base substrate. The soldering land electrodes are shaped such that a portion of each soldering land electrode is located within the projection region to form a soldering portion.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: May 29, 2018
    Assignee: HOKURIKU ELECTRIC INDUSTRY CO., LTD.
    Inventors: Masayoshi Minami, Tsutomu Sawai
  • Patent number: 9952114
    Abstract: A circuit board including an electronic circuit unit and electronic adjusting units is disposed in a case. A signal transmitting member connected to the circuit board is mounted in a mount hole of a cover member. Operation holes corresponding to a plurality of operable portions of the electronic adjusting units are provided to the cover member. A cap member including a plurality of cap bodies and a connection portion connecting the cap bodies is attached to the cover member to close the operation holes. The operation holes for adjusting the electronic adjusting units are thus covered/uncovered by the simple cap member. The operation holes are reliably waterproofed by the cap member.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: April 24, 2018
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Hiroyuki Toba, Hidebumi Seki, Tomohiro Rokugawa
  • Patent number: 9945739
    Abstract: Provided are a flexible pressure sensor using an amorphous metal and a flexible bimodal sensor for simultaneously sensing a pressure and a temperature. The sensors according to an exemplary embodiment of the present invention include a conductive layer formed of the amorphous metal to have stretchable characteristics so that it may be used for an electronic skin. Therefore, these sensors may firmly maintain conductivity and sense a pressure or simultaneously sense a pressure and a temperature even in a state in which various kinds of physical external force are present. In addition, the flexible bimodal sensor according to an exemplary embodiment of the present invention is a novel element for an electronic skin that may simultaneously sense a pressure and a temperature using the amorphous metal.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: April 17, 2018
    Assignee: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Sang Hun Jeon, Kung Won Rhie, Dong Seuk Kim, Bum Jin Kim, Tae Ho Kim, Min Hyun Jung
  • Patent number: 9885626
    Abstract: A micromechanical sensor system includes a micromechanical sensor chip surrounded at least laterally by a molded housing which has a front side and a rear side. The micromechanical sensor chip includes a chip area on the rear side, which is omitted from the molded housing, and a rewiring device formed on the rear side, which, starting from the chip area, extends to the surrounding molded housing on the rear side, and from there, past at least one via from the rear side to the front side of the molded housing.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: February 6, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Frieder Haag, Hubert Benzel
  • Patent number: 9864038
    Abstract: A Hall resistance measurement unit measures a Hall resistance value in two or more current directions between a plurality of terminals of the Hall element. A Hall electromotive force measurement unit measures the Hall electromotive force of the Hall element. A temperature measurement unit measures an operating temperature of the Hall element. A compensation signal generation unit compensates the Hall electromotive force on the basis of the Hall resistance value from the Hall resistance measurement unit and a temperature output value from the temperature measurement unit. A compensation coefficient calculation circuit calculates a compensation coefficient on the basis of the Hall resistance value measured by the Hall resistance measurement unit and the temperature output value measured by the temperature measurement unit. The compensation coefficient includes a mechanical stress compensation coefficient and a temperature compensation coefficient.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: January 9, 2018
    Assignee: Asahi Kasei Microdevices Corporation
    Inventors: Taisuke Fujita, Shigeki Okatake
  • Patent number: 9804046
    Abstract: A pressure sensor and methods of making a pressure sensor are described. In preferred embodiments, the pressure sensor is designed for low-pressure and high-sensitivity applications. In some embodiments, the pressure sensor comprises: a frame made from a single-crystal silicon starting material, the frame surrounding a cavity; a diaphragm that covers the cavity, the diaphragm constructed from a separate layer of material deposited on the single-crystal silicon starting material; a support structure that spans the diaphragm wherein the support structure is formed from the single-crystal starting material; and, a piezoresistor formed across an intersection of the frame and the support structure.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: October 31, 2017
    Assignee: DUNAN SENSING, LLC
    Inventor: Tom Kwa
  • Patent number: 9709451
    Abstract: A micromechanical pressure sensor device includes: an MEMS wafer having a front side and a rear side; a first micromechanical functional layer formed above the front side of the MEMS wafer; and a second micromechanical functional layer formed above the first micromechanical functional layer. A deflectable first pressure detection electrode is formed in one of the first and second micromechanical functional layers. A fixed second pressure detection electrode is formed spaced apart from and opposite the deflectable first pressure detection electrode. An elastically deflectable diaphragm area is formed above the front side of the MEMS wafer. An external pressure is applied to the diaphragm area via an access opening in the MEMS wafer, and the wafer is connected to the deflectable first pressure detection electrode via a plug-like joining area.
    Type: Grant
    Filed: January 8, 2015
    Date of Patent: July 18, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Arnd Kaelberer, Jochen Reinmuth, Johannes Classen
  • Patent number: 9689767
    Abstract: A semiconductor pressure sensor for measuring an external pressure exerted on the sensor, comprises a membrane, and a bridge comprising a first and a second resistor pair, arranged on a first resp. second side portion of the membrane. The first resistor pair comprises a first and a second resistor (R1, R2) comprising elongated piezo-resistive strips connected in series, and located closely together, such that R1 and R2 have substantially the same temperature. The sensor has a reduced sensitivity to: a temperature gradient over the membrane, and optionally also a non-uniform stress gradient caused by packaging and a inhomogeneous disturbing electric field perpendicular to the sensor. The piezo-resistive strips of the first and second resistor may be oriented in orthogonal directions of maximum piezo-resistive coefficients. A second bridge may be added outside the membrane, for compensating for package pressure.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: June 27, 2017
    Assignee: MELEXIS TECHNOLOGIES NV
    Inventor: Appolonius Jacobus Van Der Wiel
  • Patent number: 9658126
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor unit subassembly for installation in or use with a pressure sensor housing may include at least one pressure sensor signal output terminal supported by a printed circuit board, a pressure input port, and a pressure sense element secured relative to one or more printed circuit boards. The printed circuit board(s) may include circuitry configured to format pressure output signals provided by the pressure sense element into a particularly chosen output format, and may provide the formatted pressure output signal(s) to an attached electrical connector of the pressure sensor housing. In some cases, the sensor unit subassemblies can be mixed with a multitude of different electrical connectors and/or with a multitude of different port connections to from a wide array of pressure sensor assemblies.
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: May 23, 2017
    Assignee: Honeywell International Inc.
    Inventors: Ryan Jones, Todd Eckhardt, Richard Wade
  • Patent number: 9598741
    Abstract: The present invention relates to a method for measuring the liquid-metal surface level (13) and the slag surface level (14) in the crucible (1) of a metallurgical shaft furnace comprising the following steps: measuring, at one or more points on the external wall (2) of the crucible, the following variables: the circumferential strain in said external wall (2) by means of a number of strain-gauge sensors (6) fixed to the armor (4) of the external wall (2) of the crucible; and the temperature of said external wall (2) by means of one or more temperature sensors (7) fixed to the armor (4) of the external wall (2) of the crucible; introducing said variables measured at a number of points on the external wall of the crucible into the general equation governing circumferential strain, the solution of which is analytical, and which contains two unknowns, the liquid metal level and the overall liquid metal/slag level, considering set parameters; and solving said equation and obtaining an analytical solution giving th
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: March 21, 2017
    Assignee: Centre de Recherches Métallurgiques asbl—Centrum voor Research in de Metallurgie vzw
    Inventors: Claudio Ojeda Arroyo, Frédéric Durieu, Eric Esser
  • Patent number: 9583354
    Abstract: Embodiments of the present invention provide systems and methods for depositing materials on either side of a freestanding film using laser-assisted chemical vapor deposition (LA-CVD), and structures formed using same. A freestanding film, which is suspended over a cavity defined in a substrate, is exposed to a fluidic CVD precursor that reacts to form a solid material when exposed to light and/or heat. The freestanding film is then exposed to a laser beam in the presence of the precursor. The CVD precursor preferentially deposits on the surface(s) of the freestanding film.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: February 28, 2017
    Assignee: The Aerospace Corporation
    Inventors: Margaret H. Abraham, David P. Taylor
  • Patent number: 9322686
    Abstract: Technology capable of suppressing performance variation for each flow sensor and enhancing the performance is provided. According to a flow sensor of an embodiment, a local cavity CAV is provided on an upper surface SUR (MR) of a resin MR to generate an eddying current in a counterclockwise direction, so that an advancing direction of gas (air) that collided to an exposed side surface of a semiconductor chip CHP1 can be changed to an eddying direction instead of a direction toward an upper side of the semiconductor chip CHP1 differing by 90 degrees. Therefore, according to the flow sensor of the embodiment, the flow of the gas (air) at an upper side of the flow sensing unit FDU can be stably made smooth without being disturbed, whereby a flow sensing accuracy in the flow sensing unit FDU can be enhanced.
    Type: Grant
    Filed: April 4, 2013
    Date of Patent: April 26, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Tsutomu Kono, Keiji Hanzawa, Noboru Tokuyasu, Shinobu Tashiro
  • Publication number: 20150000418
    Abstract: A variable resistance flexure sensor, and a system and method of controlling an appliance using a variable resistance flexure sensor are provided. The sensor can include a substrate having a flexible portion and a non-flexible portion. A plurality of electrically resistive elements, such as a first resistive element and a second resistive element, can be disposed on the substrate where at least one resistive element is exclusively within the non-flexible portion of the substrate and at least one resistive element is within the flexible portion of the substrate. The resistive element within the non-flexible portion of the substrate can act as a reference resistance for the flexure sensor and can be used as, or as part of, a biasing network for the electrically resistive element within the flexible portion of the substrate. The flexure sensor can be used within an appliance to detect various conditions such as temperature, moisture, etc.
    Type: Application
    Filed: September 16, 2014
    Publication date: January 1, 2015
    Inventor: James Carter Bach
  • Publication number: 20140260675
    Abstract: An apparatus and method for measuring a tactile information, using a material having variable pressure dependent properties is disclosed. The apparatus for measuring the tactile information may include a plurality of pressure measurement units to measure a magnitude of an external pressure using a material having variable properties, and a tactile information measurement unit to measure a three-dimensional (3D) tactile information based on the external pressure using a location of the plurality of pressure measurement units and a pressure measured by the plurality of pressure measurement units.
    Type: Application
    Filed: November 8, 2013
    Publication date: September 18, 2014
    Applicants: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY, SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Soo Chul LIM, Jong Baeg KIM, Joon Ah Park, Soon Jae Pyo, Min Ook KIM, Jae Ik Lee, Tae Young Chung
  • Patent number: 8813347
    Abstract: A method of manufacturing a load cell assembly and methods of folding a circuit device are disclosed. A flexible circuit body including a strip having at least one hinge is provided, with the strip being in a first position or an unfolded position. A plurality of strain gauges are attached to the strip, with the hinge disposed between the strain gauges. A jig is provided and the strip of the flexible circuit body is folded along the hinge utilizing the jig to define a second position or folded position of the strip.
    Type: Grant
    Filed: August 20, 2012
    Date of Patent: August 26, 2014
    Assignee: GM Global Technology Operations LLC
    Inventors: Roland J. Menassa, Pamela R. Patterson, Geoffrey P. McKnight, Guillermo A. Herrera, Hung D. Nguyen, Douglas Martin Linn, Chris A. Ihrke
  • Publication number: 20140174190
    Abstract: Implementations and techniques for manufacturing strain sensitive sensors and/or strain resistant conduits from a metal and carbon matrix are generally disclosed.
    Type: Application
    Filed: June 7, 2012
    Publication date: June 26, 2014
    Applicant: Jawaharlal Nehru Centre for Advanced Scientific-Research
    Inventors: Giridhar Udapi Rao Kulkarni, Boya Radha, Abhay Abhimanyu Sagade
  • Patent number: 8705245
    Abstract: A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: April 22, 2014
    Assignee: EPCOS AG
    Inventors: Gerald Kloiber, Heinz Strallhofer, Norbert Freiberger
  • Publication number: 20140007700
    Abstract: An apparatus and method for measuring a tactile sensation is provided. The tactile sensation measuring apparatus may include a plurality of pressure measuring units, each to measure a magnitude of an external pressure applied, using a variable resistance material of which a resistance changes when an external pressure is applied, and a tactile sensation measuring unit to measure a three-dimensional (3D) tactile sensation corresponding to the external pressure, based on a position of each of the plurality of pressure measuring units, and the magnitude of the external pressure measured by each of the plurality of pressure measuring units.
    Type: Application
    Filed: January 15, 2013
    Publication date: January 9, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Soo Chul LIM, Joon Ah PARK, Jong Jin PARK, Bho Ram LEE, Hyun Jeong LEE, Seung Ju HAN
  • Publication number: 20130326863
    Abstract: A method of manufacturing a load cell assembly and methods of folding a circuit device are disclosed. A flexible circuit body including a strip having at least one hinge is provided, with the strip being in a first position or an unfolded position. A plurality of strain gauges are attached to the strip, with the hinge disposed between the strain gauges. A jig is provided and the strip of the flexible circuit body is folded along the hinge utilizing the jig to define a second position or folded position of the strip.
    Type: Application
    Filed: August 20, 2012
    Publication date: December 12, 2013
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: ROLAND J. MENASSA, PAMELA R. PATTERSON, GEOFFREY P. MCKNIGHT, GUILLERMO A. HERRERA, HUNG D. NGUYEN, DOUGLAS MARTIN LINN, CHRIS A. IHRKE
  • Patent number: 8581687
    Abstract: Thermally stable four-terminal resistor (current sensor) is characterized by having the capacity to adjust both resistance and temperature coefficient of resistance (TCR), during manufacturing process. The four-terminal resistor includes 3 or 4 elementary resistors R1-R3 forming a closed loop. Resistor R1 is the principal low-ohmic value resistor. The terminals of resistor R1 serve as “Force” terminals of the four-terminal resistor. Resistors R2, R3 form a voltage divider intended to minimize the TCR of the four-terminal resistor and connected in parallel to resistor R1. The terminals of resistor R3 serve as “Sense” terminals of the four-terminal resistor. Resistor R2 may be split into two resistors: R2a, R2b to simplify the implementation of four-terminal resistor. Elementary resistors R1, R2 must have the same sign of TCR. Target resistance and TCR minimization in four-terminal resistor are reached by adjustment of resistance of the elementary resistors.
    Type: Grant
    Filed: August 11, 2009
    Date of Patent: November 12, 2013
    Assignee: Vishay Dale Electronics, Inc.
    Inventor: Michael Belman
  • Publication number: 20130213144
    Abstract: A sensor system is adapted for use with an article of footwear and includes an insert member including a first layer and a second layer, a port connected to the insert and configured for communication with an electronic module, a plurality of force and/or compression sensors on the insert member, and a plurality of leads connecting the sensors to the port.
    Type: Application
    Filed: February 22, 2012
    Publication date: August 22, 2013
    Applicant: NIKE, INC.
    Inventors: Jordan M. Rice, Allan M. Schrock, Steven H. Walker, Andreas Heinrich Steier
  • Publication number: 20120297888
    Abstract: Wireless strain and displacement sensors wirelessly monitor structural health and integrity, and are made by printing inductor-interdigital capacitor sensing circuits on a variety of substrates, including ceramic substrates, with thermally processable conductive inks. Sensors of the invention can be employed to detect strain and displacement of civil structures, such as bridges and buildings. The sensors include sensing elements that are mounted or printed on stiff, inflexible substrates, which prevent the sensing elements from bending, stretching, or otherwise warping when the sensor is strained. An interlayer between the sensing elements allows the sensing elements to move with respect to each other during application of strain. Thus, strain causes the sensing elements to move but not to deform, causing changes in sensor resonance that can be detected through wireless radio-frequency interrogation.
    Type: Application
    Filed: September 7, 2010
    Publication date: November 29, 2012
    Inventors: Ramaswamy Nagarajan, Jungrae Park, Sharavanan Balasubramaniam, Mario J. Cazeca, Shivshankar Sivasubramanian, Joey Mead, Julie Chen
  • Publication number: 20120256720
    Abstract: A bend-detecting (bending) sensor is provided, including a flexible substrate, at least a pair of electrode patterns spaced apart from each other provided on the flexible substrate, and a paste layer containing conductive particles. The paste layer is coated onto the flexible substrate where the electrode patterns are formed, such that when the flexible substrate is bent, the density of the conductive particles between the electrode patterns changes and an electric resistance between the electrode patterns also changes, thereby sensing deformation of the flexible substrate, and eventually, a target to which the flexible display element or the flexible substrate is attached. When the bending sensor is applied to the flexible display device, the electrode patterns and the paste layer may be formed on the flexible substrate which is to form the flexible display element, thus forming a bending sensing structure with a thickness of the flexible display element or less.
    Type: Application
    Filed: June 30, 2011
    Publication date: October 11, 2012
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kang-Ho BYUN, Byung-Jik KIM
  • Publication number: 20120204653
    Abstract: Pressure sensors having components with reduced variations due to stresses caused by various layers and components that are included in the manufacturing process. In one example, a first stress in a first direction causes a variation in a component. A second stress in a second direction is applied, thereby reducing the variation in the component. The first and second stresses may be caused by a polysilicon layer, while the component may be a resistor in a Wheatstone bridge.
    Type: Application
    Filed: February 16, 2011
    Publication date: August 16, 2012
    Applicant: Silicon Microstructures, Inc.
    Inventors: Richard J. August, Michael B. Doelle
  • Patent number: 8113065
    Abstract: A force sensor 1 includes: a force sensor chip 2 including an action portion 21, a connecting portion 23 on which strain resistive elements are disposed, and a support portion 22 for supporting the action portion 21 and the connecting portion 23; an attenuator 3 including an input portion 30 to which an external force is input, a fixing portion 32 for fixing the force sensor chip 2, and a transmission portion 31 for attenuating the external force and transmitting the attenuated external force to the action portion 21; a first glass member 11 disposed between the action portion 21 and the transmission portion 31 and a second glass member 12 disposed between the support portion 22 and the fixing portion 32, through which glass members 11, 12 the force sensor chip 2 and the attenuator 3 are joined. A single or more glass beams 13 joins the first glass member 11 and the second glass member 12 together as a single member.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: February 14, 2012
    Assignee: Honda Motor Co., Ltd.
    Inventors: Takeshi Ohsato, Shigenori Yasuie, Yusuke Hirabayashi, Hiroshi Yokobayashi
  • Publication number: 20120011938
    Abstract: A device for measuring deformation including: a) at least one strain gauge (3), producing a signal following a deformation, where the said strain gauge is positioned on a face of a flexible support (32) favouring elongation of the strain gauge (3), and where the face opposite the strain gauge of the flexible support, which is intended to be brought into contact with, or glued to, a test body the deformation of which it is desired to measure, b) at least one first substrate, including at least signal processing means and/or signal transmission means, c) securing means (4, 5, 6) to assemble the strain gauge and the first substrate mechanically, where these means include a layer of material having elastic properties, called the elastic layer, positioned between the gauge and the first substrate, and where this elastic layer prevents the deformation of the gauge from being transmitted, or allows it to be transmitted as little as possible, to the first substrate (2, 20).
    Type: Application
    Filed: April 22, 2010
    Publication date: January 19, 2012
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT
    Inventor: Hubert Grange
  • Publication number: 20110255813
    Abstract: The present invention defines a bearing unit comprising a bearing provided with one or more strain sensors, where the bearing comprises an inner ring and an outer ring, and where the one or more strain sensors (10) comprises a sensing element (14) integrated on a support member (12). According to the invention, the support member is a thin flat plate made of a metal material and is attached to a surface (5) of the bearing only by means of a first weld seam (21) and a second weld seam (22) located at first and second lateral ends of the support member. The present invention also defines a method of attaching the strain sensor (10) to the bearing surface (5).
    Type: Application
    Filed: December 22, 2008
    Publication date: October 20, 2011
    Applicant: AKTIEBOLAGET SKF
    Inventors: Hendrik Anne Mol, Johannes Franciscus van de Sanden
  • Patent number: 8033009
    Abstract: There is provided a method for producing a force sensor including: a force sensor chip; and an attenuator, in which the force sensor chip and the attenuator are joined at joint portions with a glass layer sandwiched therebetween. The method includes: a film forming step in which a glass film as the glass layer is formed on regions of the attenuator containing the joint portions or on regions of the force sensor chip containing the joint portions; and an anodic bonding step in which the force sensor chip and the attenuator are stacked as a stacked body in close contact with each other at the joint portions, and the glass film and the force sensor chip, or the glass film and the attenuator, are joined.
    Type: Grant
    Filed: August 23, 2007
    Date of Patent: October 11, 2011
    Assignee: Honda Motor Co., Ltd
    Inventors: Nariaki Kuriyama, Jun Sasahara, Tadahiro Kubota, Daisuke Okamura, Takeshi Ohsato
  • Publication number: 20110209555
    Abstract: A very robust sensor element for an absolute-pressure measurement is described, which is suitable for high temperatures and able to be miniaturized to a large extent. The micromechanical pressure-sensor element includes a sensor diaphragm having a rear-side pressure connection and at least one dielectrically insulated piezo resistor for signal acquisition. Furthermore, the pressure-sensor element has a front-side reference volume, which is sealed by a cap structure spanning the sensor diaphragm. The cap structure is realized as thin-film structure.
    Type: Application
    Filed: February 25, 2011
    Publication date: September 1, 2011
    Inventors: Marcus Ahles, Hubert Benzel
  • Publication number: 20110152725
    Abstract: Electronic devices, apparatus, systems, and methods of operating and constructing the devices, apparatus, and/or systems include a wireless sensor configured to measure strain of hardware implanted in a subject. In various embodiments, temporal measurement of the hardware strain includes monitoring changes of the resonant frequency of the sensor. The sensor can be realized as an inductively powered device that operates as an all-on-chip resonator, where the components of the sensor are biocompatible. Additional apparatus, systems, and methods are disclosed.
    Type: Application
    Filed: February 25, 2011
    Publication date: June 23, 2011
    Applicant: CHRISTIAN M. PUTTLITZ CONSULTING, LLC
    Inventors: Hilmi Volkan DEMIR, Christian Matthew PUTTLITZ, Rohat MELIK
  • Patent number: 7950139
    Abstract: The invention relates to a method of depositing a coating on a part having its surface made of silicon carbide. The method comprises the following steps: a) applying laser treatment to the SiC surface by superposing laser impacts for the purpose of increasing the roughness of said surface; and b) depositing a coating on the SiC surface by atmospheric thermal spraying. The invention also provides a device for measuring deformation, which device comprises a first alumina coating obtained by atmospheric thermal spraying onto the silicon carbide layer covering the substrate of the part after it has been treated by superposing laser impacts, a free filament strain gauge placed on the coating, and an additional alumina coating obtained by atmospheric thermal spraying onto the strain gauge.
    Type: Grant
    Filed: April 24, 2008
    Date of Patent: May 31, 2011
    Assignee: SNECMA
    Inventors: Frederic Leman, Sebastien Lukat, Sophie Costil, Christian Coddet
  • Publication number: 20100229655
    Abstract: A load detecting device includes a substrate, a load receiver arranged on a first face of the substrate, a load detecting element arranged between the substrate and the load receiver, and a supporting portion to support the substrate. The supporting portion is made of metal. The supporting portion is located to overlap with the load receiver in a direction approximately perpendicular to the substrate. The supporting portion has a plurality of projections contacting with a second face of the substrate opposite from the first face. The projections located adjacent to each other are distanced from each other through a trench.
    Type: Application
    Filed: March 9, 2010
    Publication date: September 16, 2010
    Applicant: DENSO CORPORATION
    Inventors: Hideyuki Hayakawa, Toshio Hosokawa, Kenji Morikawa