Abstract: A strain gauge (12, 21A, 21B, 25A, 25B, 31, 35, 41, 45) and method of manufacturing a strain gauge (12, 21A, 21B, 25A, 25B, 31, 41, 35, 45) against moisture penetration comprises or includes the step of producing a coated base or cover layer (14, 34, 44) by forming a moisture barrier coating (17) on the surface the latter.

Abstract: A sensor apparatus includes at least one substrate layer of an elastically deformable material, the substrate layer extending longitudinally between spaced apart ends thereof. A conductive layer is attached to and extends longitudinally between the spaced apart ends of the at least one substrate layer. The conductive layer includes an electrically conductive material adapted to form a strain gauge having an electrical resistance that varies based on deformation of the conductive layer in at least one direction.

Abstract: A resonant pressure sensor has high linearity and includes: a housing; and a pressure sensing unit that detects a static pressure based on a change value of a resonance frequency and includes: a housing-fixed portion; a substrate that includes a substrate-fixed portion and a substrate-separated portion; the pressure-receiving fluid that is interposed in a gap between the housing-fixed portion and the substrate and envelops the substrate; and a first resonator that is disposed in the substrate-separated portion and detects the change value of the resonance frequency based on a strain in the substrate caused by the static pressure applied by the pressure-receiving fluid, wherein the first resonator is made of a semiconductor material including an impurity, a concentration of the impurity is 1×1020 (cm?3) or higher, and an atomic radius of the impurity is smaller than an atomic radius of the semiconductor material.

Abstract: A chemical mechanical polishing apparatus is provided. The chemical mechanical polishing apparatus includes a polishing pad, a pad conditioner, a measurement tool, and a controller. The polishing pad is provided in a processing chamber for polishing a wafer placed on the polishing surface of the polishing pad. The pad conditioner is configured to condition the polishing surface. The measurement tool is provided in the processing chamber and configured to measure the downward force of the pad conditioner. The controller is coupled to the pad conditioner and the measurement tool, and is configured to adjust the downward force of the pad conditioner in response to an input from the measurement tool.

Abstract: A pressure sensor system having at least one pressure sensor device. The pressure sensor device has a stack having a ceramic substrate, at least one signal processing element, and at least one sensor element. The pressure sensor device is placed in a sensor housing provided with a membrane, and a residual volume of the sensor housing provided with the membrane is filled with an incompressible fluid. A method for producing such a pressure sensor system, and to a measuring device, are also described.

Abstract: It is disclosed a stretchable touchpad (10) of the capacitive type including a stretchable textile fabric (20) having a plurality of conductive elements incorporated therein. The conductive elements are resistive strain gauges (30, 40) which form electrodes to detect a change of capacitance caused by a touch. It is also disclosed a method for operating a stretchable touchpad (10) comprising the steps of measuring continuously a capacitance analog signal provided by a resistive strain gauge (30, 40) of the stretchable touchpad (10); and comparing the measured capacitance signal with a threshold value in order to determine whether or not a touch has taken place, wherein the threshold value is continuously adjusted as a function of the actual measurement of capacitance and as a function of the resistance of said resistive strain gauges (30, 40) which form the capacitor electrodes of said touchpad (10).

Abstract: The invention relates to a galvanic cell (2) comprising a housing (4) which is equipped with at least one cell coil or a cell stack and comprising a sensor (16) for detecting the pressure of the galvanic cell (2). The housing (4) has a recess which is formed from a through-opening between an interior and an exterior of the cell (2), and the sensor (16) is arranged outside of the cell (2) so as to be secured directly or indirectly to the cell. The sensor (16), in particular a micro electromechanical system, is in contact with the interior of the galvanic cell (2) via the recess. The invention additionally relates to a method for producing such a galvanic cell (2).

Abstract: A sensor apparatus includes at least one substrate layer of an elastically deformable material, the substrate layer extending longitudinally between spaced apart ends thereof. A conductive layer is attached to and extends longitudinally between the spaced apart ends of the at least one substrate layer. The conductive layer includes an electrically conductive material adapted to form a strain gauge having an electrical resistance that varies based on deformation of the conductive layer in at least one direction.

Abstract: An apparatus includes a base assembly, a gasket and a housing assembly. The base assembly may have a locking feature and a bearing feature. The locking feature may have a first passage in communication with an exterior of the apparatus. The gasket may be mounted on the base assembly and may have (i) a compression region, (ii) a central region and (iii) a second passage in communication with the first passage. The housing assembly may have a sealing feature and may be configured to hold a sensor. The sealing feature (a) may mate with the bearing feature and (b) may compress the gasket in the compression region. The sensor (a) may seal to the central region of the gasket and (b) may be in communication with the exterior of the apparatus through the first passage and the second passage.

Abstract: A method of making a sensor apparatus including placing a mask over a polymeric sheet, wherein the mask is configured to block regions of the polymeric sheet, depositing a conductive structure on the polymeric sheet at regions exposed through the mask, shrinking the polymeric sheet with conductive structure patterned on its surface by heating, and transferring the conductive structure to a flexible substrate.

Abstract: A sensor has a sensor body with a first face and a second face opposite to one another, and a circuit arrangement supported by the sensor body that includes a first electrical circuit pattern on the first face, a second electrical circuit pattern on the second face, connection means, which electrically connect the first circuit pattern to the second circuit pattern and has at least one through hole that extends axially between the two faces of the sensor body. A plurality of terminals are electrically connected to the first circuit pattern and/or the second circuit pattern. The at least one through hole is preferably closed at the second face of the sensor body via a closing member (30) having pre-formed body with a closing portion having a diameter, greater than a diameter, of the opening of the through hole at the second face of the sensor body.

Abstract: A pressure sensing apparatus for a vehicle may include: a sensor element configured to measure a change in air pressure by a vehicle collision; a housing unit into which the sensor element is seated, and including a terminal unit electrically coupled to the sensor element, the housing unit being fixed to a vehicle body; a cover unit removably installed on the housing unit; and an elastic pressing unit including a first end coupled to the cover unit, and a second end protruding toward the sensor element and pressing the sensor element, the elastic pressing unit being made of elastically deformable material. An area of a pressing surface of the elastic pressing unit that faces the sensor element may be equal to or less than an area of a surface of the sensor element that faces the pressing surface.

Abstract: The method for producing the strain gauge device (10) comprises a first stop of producing the band (12). The band (12) has flexibility at least in the measuring zone (36). Then a sensor (22) comprising at least one measuring strand (30) and changing electrical resistivity in dependence of the strain is produced and arranged on or in the band (12) without pre-tension. Afterwards the shape of the band (12) is changed into a retaining working shape and thereby the measuring strand (30) is stretched to an amount of pre-tension.

Abstract: A pressure sensing apparatus for an airbag may include: a sensor element configured to measure a change of air pressure by a vehicle collision; a housing having the sensor element seated therein, including a terminal part electrically connected to the sensor element, and fixed to a vehicle body; a cover detachably installed on the housing; and an elastic pressing part having one side connected to the cover and the other side protruded toward the sensor element so as to press the sensor element, and formed of an elastically deformable material. The housing may include a support protrusion to support the bottom of the sensor element with the terminal part.

Abstract: A pressure sensor includes a sensor chip and a resin portion. The sensor chip extends in a lengthwise direction and includes a membrane whose length in a thickness direction perpendicular to the lengthwise direction is smaller than another part, and a piezoelectric element provided in the membrane. The sensor chip includes a fixed end that is covered with and fixed to the resin portion, and a free end opposite from the fixed end in the lengthwise direction. The free end is spaced away from the resin portion in the lengthwise direction, and the membrane is located in the free end. A shortest separation distance between the membrane and a part of the resin portion covering the sensor chip is equal to or larger than a length of the sensor chip along a crosswise direction of the sensor chip perpendicular to both the lengthwise direction and the thickness direction.

Abstract: A differential pressure sensor includes a first sensor housing member having a first fluid inlet port for receiving a first fluid at a first pressure and a second sensor housing member having a second fluid inlet port for receiving a second fluid at a second pressure. A pressure-sensing subassembly includes a semiconductor pressure-sensing die having a sensitive diaphragm for sensing pressure. The pressure-sensing subassembly is configured for insertion into the differential pressure sensor such that once inserted the first fluid inlet port is in fluid communication with a first surface of the sensitive diaphragm and the second fluid inlet port is in fluid communication with a second surface of the sensitive diaphragm.

Abstract: An electronic pressure sensor includes a housing having a distal end configured to be exposed to a flow of a fluid media, the distal end opposite a proximal end, wherein the proximal end is configured not to be exposed to the fluid media. A chamber and connected passageway are disposed within the housing. The passageway is connected at one end to the chamber and connected at another end to an opening disposed at the distal end of the housing. The opening is configured to be in fluidic communication with the fluid media. A pressure sensor is disposed within the chamber. A first temperature sensor is disposed within the chamber. A viscous gel is disposed within the chamber, the viscous gel separating on a first side both the pressure sensor and the first temperature sensor apart from the passageway on a second side of the viscous gel.

Abstract: A magnetic laminating inductor structure and process for preventing substrate bowing and damping losses generally include a laminated film stack including a magnetic layer having a tensile stress, an insulating layer having a compressive stress disposed on the magnetic layer, and a dielectric planarizing layer on the insulating layer. The dielectric planarizing layer has a neutral stress and a roughness value less than the insulating layer. The reduction in surface roughness reduces damping losses and the compressive stress of the insulating layers reduces wafer bowing.

Abstract: A cardiovascular monitoring system includes a sensor assembly and a controller. The sensor assembly includes a membrane enclosing a viscous fluid, a substrate immersed in the viscous fluid, and at least one strain gauge mounted with the substrate. The strain gauge is configured to detect bending of the substrate due to changes in capillary blood pressure of a person in contact with the membrane at less than 50 mmHg contact pressure and to output a signal indicative of the changes. The controller may be configured to output a change in mean arterial pressure of the person based on a profile of the signal that is associated with a heartbeat of the person. Also, the controller may be configured to output the mean arterial pressure based on a weight signal indicative of a weight of the person and the profile of the signal associated with the heartbeat.

Abstract: A die compatibility adaptor including a housing and a die cable extending outward from the housing and terminating at a die cable end engageable with a manufacturing die that includes a first proximity sensor configured to output a first proximity signal and a second proximity sensor configured to output a second proximity signal. The die compatibility adaptor further includes a direct cable receptacle communicatively coupled to the die cable, a duplicate cable receptacle, and one or more isolation relays positioned between and communicatively coupled to the duplicate cable receptacle and the die cable, the one or more isolation relays having a closed position and an open position. In the closed position, the duplicate cable receptacle is communicatively coupled to the die cable.

Abstract: Flow sensors, systems, and methods for continuous in situ monitoring of a rheologically complex fluid flow within a vessel, such as particulate and multiphase media for ascertaining certain fluid flow parameters, such as flow rate, dynamic viscosity, fluid density, fluid temperature, particle density and particle mass, from flow sensor measurements, the sensors, systems, and methods involving a fluid flow sensor having a body member with internalized strain gauges configured to measure the deformation of certain segments of the body member and, based, at least in part, on these deformation measurements, the system is used to compute the fluid flow parameters.

Abstract: A flip chip pressure sensor assembly. The flip chip pressure sensor assembly comprises a substrate; a pressure sensor die comprising a sensing diaphragm, the die having a top side and a bottom side that is reverse to the top side, where the top side of the die is electrically connected to the substrate by flip chip mounting technology; a cover defining an aperture disposed over the pressure sensor die, where the aperture defined by the cover aligns with the sensing diaphragm to provide a path for pressure to be transmitted through the aperture to the bottom side of the sensing diaphragm; and a gel disk disposed within the aperture in intimate contact with a bottom side of the sensing diaphragm, where the gel disk is domed above an outer shoulder of a rim defined by the cover.

Abstract: A deformation sensing apparatus comprises an elastic substrate, a first strain-gauge element formed on a first surface of the elastic substrate, and configured to output a first signal in response to a strain applied in a first direction, and a second strain-gauge element formed on a second surface of the elastic substrate opposite to the first surface, and configured to output a second signal in response to a strain applied in the same first direction.

Abstract: A force detector capable of preventing short-circuit fault between electrodes and allowing for downsizing. A prescribed region encompasses a projection region defined by projecting a deformation region of a force sensor element, which is deformed when a force transmission member applies a force to the force sensor element, onto a base substrate. A plurality of terminals are provided by four soldering land electrodes formed, respectively, at four corners of the base substrate. The soldering land electrodes are shaped such that a portion of each soldering land electrode is located within the projection region to form a soldering portion.

Abstract: A circuit board including an electronic circuit unit and electronic adjusting units is disposed in a case. A signal transmitting member connected to the circuit board is mounted in a mount hole of a cover member. Operation holes corresponding to a plurality of operable portions of the electronic adjusting units are provided to the cover member. A cap member including a plurality of cap bodies and a connection portion connecting the cap bodies is attached to the cover member to close the operation holes. The operation holes for adjusting the electronic adjusting units are thus covered/uncovered by the simple cap member. The operation holes are reliably waterproofed by the cap member.

Abstract: Provided are a flexible pressure sensor using an amorphous metal and a flexible bimodal sensor for simultaneously sensing a pressure and a temperature. The sensors according to an exemplary embodiment of the present invention include a conductive layer formed of the amorphous metal to have stretchable characteristics so that it may be used for an electronic skin. Therefore, these sensors may firmly maintain conductivity and sense a pressure or simultaneously sense a pressure and a temperature even in a state in which various kinds of physical external force are present. In addition, the flexible bimodal sensor according to an exemplary embodiment of the present invention is a novel element for an electronic skin that may simultaneously sense a pressure and a temperature using the amorphous metal.

Abstract: A micromechanical sensor system includes a micromechanical sensor chip surrounded at least laterally by a molded housing which has a front side and a rear side. The micromechanical sensor chip includes a chip area on the rear side, which is omitted from the molded housing, and a rewiring device formed on the rear side, which, starting from the chip area, extends to the surrounding molded housing on the rear side, and from there, past at least one via from the rear side to the front side of the molded housing.

Abstract: A Hall resistance measurement unit measures a Hall resistance value in two or more current directions between a plurality of terminals of the Hall element. A Hall electromotive force measurement unit measures the Hall electromotive force of the Hall element. A temperature measurement unit measures an operating temperature of the Hall element. A compensation signal generation unit compensates the Hall electromotive force on the basis of the Hall resistance value from the Hall resistance measurement unit and a temperature output value from the temperature measurement unit. A compensation coefficient calculation circuit calculates a compensation coefficient on the basis of the Hall resistance value measured by the Hall resistance measurement unit and the temperature output value measured by the temperature measurement unit. The compensation coefficient includes a mechanical stress compensation coefficient and a temperature compensation coefficient.

Abstract: A pressure sensor and methods of making a pressure sensor are described. In preferred embodiments, the pressure sensor is designed for low-pressure and high-sensitivity applications. In some embodiments, the pressure sensor comprises: a frame made from a single-crystal silicon starting material, the frame surrounding a cavity; a diaphragm that covers the cavity, the diaphragm constructed from a separate layer of material deposited on the single-crystal silicon starting material; a support structure that spans the diaphragm wherein the support structure is formed from the single-crystal starting material; and, a piezoresistor formed across an intersection of the frame and the support structure.

Abstract: A micromechanical pressure sensor device includes: an MEMS wafer having a front side and a rear side; a first micromechanical functional layer formed above the front side of the MEMS wafer; and a second micromechanical functional layer formed above the first micromechanical functional layer. A deflectable first pressure detection electrode is formed in one of the first and second micromechanical functional layers. A fixed second pressure detection electrode is formed spaced apart from and opposite the deflectable first pressure detection electrode. An elastically deflectable diaphragm area is formed above the front side of the MEMS wafer. An external pressure is applied to the diaphragm area via an access opening in the MEMS wafer, and the wafer is connected to the deflectable first pressure detection electrode via a plug-like joining area.

Abstract: A semiconductor pressure sensor for measuring an external pressure exerted on the sensor, comprises a membrane, and a bridge comprising a first and a second resistor pair, arranged on a first resp. second side portion of the membrane. The first resistor pair comprises a first and a second resistor (R1, R2) comprising elongated piezo-resistive strips connected in series, and located closely together, such that R1 and R2 have substantially the same temperature. The sensor has a reduced sensitivity to: a temperature gradient over the membrane, and optionally also a non-uniform stress gradient caused by packaging and a inhomogeneous disturbing electric field perpendicular to the sensor. The piezo-resistive strips of the first and second resistor may be oriented in orthogonal directions of maximum piezo-resistive coefficients. A second bridge may be added outside the membrane, for compensating for package pressure.

Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor unit subassembly for installation in or use with a pressure sensor housing may include at least one pressure sensor signal output terminal supported by a printed circuit board, a pressure input port, and a pressure sense element secured relative to one or more printed circuit boards. The printed circuit board(s) may include circuitry configured to format pressure output signals provided by the pressure sense element into a particularly chosen output format, and may provide the formatted pressure output signal(s) to an attached electrical connector of the pressure sensor housing. In some cases, the sensor unit subassemblies can be mixed with a multitude of different electrical connectors and/or with a multitude of different port connections to from a wide array of pressure sensor assemblies.

Abstract: The present invention relates to a method for measuring the liquid-metal surface level (13) and the slag surface level (14) in the crucible (1) of a metallurgical shaft furnace comprising the following steps: measuring, at one or more points on the external wall (2) of the crucible, the following variables: the circumferential strain in said external wall (2) by means of a number of strain-gauge sensors (6) fixed to the armor (4) of the external wall (2) of the crucible; and the temperature of said external wall (2) by means of one or more temperature sensors (7) fixed to the armor (4) of the external wall (2) of the crucible; introducing said variables measured at a number of points on the external wall of the crucible into the general equation governing circumferential strain, the solution of which is analytical, and which contains two unknowns, the liquid metal level and the overall liquid metal/slag level, considering set parameters; and solving said equation and obtaining an analytical solution giving th

Abstract: Embodiments of the present invention provide systems and methods for depositing materials on either side of a freestanding film using laser-assisted chemical vapor deposition (LA-CVD), and structures formed using same. A freestanding film, which is suspended over a cavity defined in a substrate, is exposed to a fluidic CVD precursor that reacts to form a solid material when exposed to light and/or heat. The freestanding film is then exposed to a laser beam in the presence of the precursor. The CVD precursor preferentially deposits on the surface(s) of the freestanding film.

Abstract: Technology capable of suppressing performance variation for each flow sensor and enhancing the performance is provided. According to a flow sensor of an embodiment, a local cavity CAV is provided on an upper surface SUR (MR) of a resin MR to generate an eddying current in a counterclockwise direction, so that an advancing direction of gas (air) that collided to an exposed side surface of a semiconductor chip CHP1 can be changed to an eddying direction instead of a direction toward an upper side of the semiconductor chip CHP1 differing by 90 degrees. Therefore, according to the flow sensor of the embodiment, the flow of the gas (air) at an upper side of the flow sensing unit FDU can be stably made smooth without being disturbed, whereby a flow sensing accuracy in the flow sensing unit FDU can be enhanced.

Abstract: A variable resistance flexure sensor, and a system and method of controlling an appliance using a variable resistance flexure sensor are provided. The sensor can include a substrate having a flexible portion and a non-flexible portion. A plurality of electrically resistive elements, such as a first resistive element and a second resistive element, can be disposed on the substrate where at least one resistive element is exclusively within the non-flexible portion of the substrate and at least one resistive element is within the flexible portion of the substrate. The resistive element within the non-flexible portion of the substrate can act as a reference resistance for the flexure sensor and can be used as, or as part of, a biasing network for the electrically resistive element within the flexible portion of the substrate. The flexure sensor can be used within an appliance to detect various conditions such as temperature, moisture, etc.

Abstract: An apparatus and method for measuring a tactile information, using a material having variable pressure dependent properties is disclosed. The apparatus for measuring the tactile information may include a plurality of pressure measurement units to measure a magnitude of an external pressure using a material having variable properties, and a tactile information measurement unit to measure a three-dimensional (3D) tactile information based on the external pressure using a location of the plurality of pressure measurement units and a pressure measured by the plurality of pressure measurement units.

Abstract: A method of manufacturing a load cell assembly and methods of folding a circuit device are disclosed. A flexible circuit body including a strip having at least one hinge is provided, with the strip being in a first position or an unfolded position. A plurality of strain gauges are attached to the strip, with the hinge disposed between the strain gauges. A jig is provided and the strip of the flexible circuit body is folded along the hinge utilizing the jig to define a second position or folded position of the strip.

Abstract: Implementations and techniques for manufacturing strain sensitive sensors and/or strain resistant conduits from a metal and carbon matrix are generally disclosed.

Abstract: A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.

Abstract: An apparatus and method for measuring a tactile sensation is provided. The tactile sensation measuring apparatus may include a plurality of pressure measuring units, each to measure a magnitude of an external pressure applied, using a variable resistance material of which a resistance changes when an external pressure is applied, and a tactile sensation measuring unit to measure a three-dimensional (3D) tactile sensation corresponding to the external pressure, based on a position of each of the plurality of pressure measuring units, and the magnitude of the external pressure measured by each of the plurality of pressure measuring units.

Abstract: A method of manufacturing a load cell assembly and methods of folding a circuit device are disclosed. A flexible circuit body including a strip having at least one hinge is provided, with the strip being in a first position or an unfolded position. A plurality of strain gauges are attached to the strip, with the hinge disposed between the strain gauges. A jig is provided and the strip of the flexible circuit body is folded along the hinge utilizing the jig to define a second position or folded position of the strip.

Abstract: Thermally stable four-terminal resistor (current sensor) is characterized by having the capacity to adjust both resistance and temperature coefficient of resistance (TCR), during manufacturing process. The four-terminal resistor includes 3 or 4 elementary resistors R1-R3 forming a closed loop. Resistor R1 is the principal low-ohmic value resistor. The terminals of resistor R1 serve as “Force” terminals of the four-terminal resistor. Resistors R2, R3 form a voltage divider intended to minimize the TCR of the four-terminal resistor and connected in parallel to resistor R1. The terminals of resistor R3 serve as “Sense” terminals of the four-terminal resistor. Resistor R2 may be split into two resistors: R2a, R2b to simplify the implementation of four-terminal resistor. Elementary resistors R1, R2 must have the same sign of TCR. Target resistance and TCR minimization in four-terminal resistor are reached by adjustment of resistance of the elementary resistors.

Abstract: A sensor system is adapted for use with an article of footwear and includes an insert member including a first layer and a second layer, a port connected to the insert and configured for communication with an electronic module, a plurality of force and/or compression sensors on the insert member, and a plurality of leads connecting the sensors to the port.

Abstract: Wireless strain and displacement sensors wirelessly monitor structural health and integrity, and are made by printing inductor-interdigital capacitor sensing circuits on a variety of substrates, including ceramic substrates, with thermally processable conductive inks. Sensors of the invention can be employed to detect strain and displacement of civil structures, such as bridges and buildings. The sensors include sensing elements that are mounted or printed on stiff, inflexible substrates, which prevent the sensing elements from bending, stretching, or otherwise warping when the sensor is strained. An interlayer between the sensing elements allows the sensing elements to move with respect to each other during application of strain. Thus, strain causes the sensing elements to move but not to deform, causing changes in sensor resonance that can be detected through wireless radio-frequency interrogation.

Abstract: A bend-detecting (bending) sensor is provided, including a flexible substrate, at least a pair of electrode patterns spaced apart from each other provided on the flexible substrate, and a paste layer containing conductive particles. The paste layer is coated onto the flexible substrate where the electrode patterns are formed, such that when the flexible substrate is bent, the density of the conductive particles between the electrode patterns changes and an electric resistance between the electrode patterns also changes, thereby sensing deformation of the flexible substrate, and eventually, a target to which the flexible display element or the flexible substrate is attached. When the bending sensor is applied to the flexible display device, the electrode patterns and the paste layer may be formed on the flexible substrate which is to form the flexible display element, thus forming a bending sensing structure with a thickness of the flexible display element or less.

Abstract: Pressure sensors having components with reduced variations due to stresses caused by various layers and components that are included in the manufacturing process. In one example, a first stress in a first direction causes a variation in a component. A second stress in a second direction is applied, thereby reducing the variation in the component. The first and second stresses may be caused by a polysilicon layer, while the component may be a resistor in a Wheatstone bridge.

Abstract: A force sensor 1 includes: a force sensor chip 2 including an action portion 21, a connecting portion 23 on which strain resistive elements are disposed, and a support portion 22 for supporting the action portion 21 and the connecting portion 23; an attenuator 3 including an input portion 30 to which an external force is input, a fixing portion 32 for fixing the force sensor chip 2, and a transmission portion 31 for attenuating the external force and transmitting the attenuated external force to the action portion 21; a first glass member 11 disposed between the action portion 21 and the transmission portion 31 and a second glass member 12 disposed between the support portion 22 and the fixing portion 32, through which glass members 11, 12 the force sensor chip 2 and the attenuator 3 are joined. A single or more glass beams 13 joins the first glass member 11 and the second glass member 12 together as a single member.

Abstract: A device for measuring deformation including: a) at least one strain gauge (3), producing a signal following a deformation, where the said strain gauge is positioned on a face of a flexible support (32) favouring elongation of the strain gauge (3), and where the face opposite the strain gauge of the flexible support, which is intended to be brought into contact with, or glued to, a test body the deformation of which it is desired to measure, b) at least one first substrate, including at least signal processing means and/or signal transmission means, c) securing means (4, 5, 6) to assemble the strain gauge and the first substrate mechanically, where these means include a layer of material having elastic properties, called the elastic layer, positioned between the gauge and the first substrate, and where this elastic layer prevents the deformation of the gauge from being transmitted, or allows it to be transmitted as little as possible, to the first substrate (2, 20).

Abstract: The present invention defines a bearing unit comprising a bearing provided with one or more strain sensors, where the bearing comprises an inner ring and an outer ring, and where the one or more strain sensors (10) comprises a sensing element (14) integrated on a support member (12). According to the invention, the support member is a thin flat plate made of a metal material and is attached to a surface (5) of the bearing only by means of a first weld seam (21) and a second weld seam (22) located at first and second lateral ends of the support member. The present invention also defines a method of attaching the strain sensor (10) to the bearing surface (5).