Abstract: The invention relates to the field of fuses, and particularly a multi-layer blade fuse and its manufacturing method. The said multi-layer blade fuse comprises a ceramic substrate, back electrodes, front electrodes, fuse wire, protective layers and metal ends, wherein the fuse wire is prepared in multiple layers and the adjacent layers of fuse wire are connected in a head-to-tail style; the two lead-outs of the fuse wire as a whole are respectively connected to the two front electrodes located at the two ends of the substrate, and each layer of the fuse wire is deposited with a protective layer. During manufacturing, all protective layers but the upmost one leave the tail of each layer of fuse wire uncovered so that the head-to-tail series connection is possible. Compared with the prior methods, the method disclosed herein is characteristic of simpler manufacturing processes, less investment on equipments and much shorter manufacturing duration, which consequently reduce the cost.

Abstract: A current limiter and related methods to protect a switched-mode power supply from inrush current. The current limiter may include a resistive element electrically interconnected in series to a thermal element. The resistive element and the thermal element may be disposed about a single, unitary core. The resistive element may be in the form of a wire wound resistor wound about the core. The thermal element may be in the form of plated portion of the core. The thermal element may act as a thermal fuse to prevent overheating and unsafe failure of the resistive element in cases where excessive current passes through the resistive element. The thermal element may be configured to trip in a safe manner without sparking or creating exposed energized conductors. Thus the current limiter may be operable to limit inrush current while providing for safe failure modes.

Abstract: The invention relates to the field of fuses, and particularly to a blade fuse used to protect electronic components and its manufacturing method.

Abstract: The invention provides a method for producing a connection grid with integrated fuse includes the steps of forming a concave portion that is suitable for forming a cradle for receiving one of the longitudinal ends of a fuse on each of the arms of a pair of arms of a connection grid in order to fix the fuse to the grid via these longitudinal ends, and molding a support formed by molding plastic onto the connection grid after the concave portions of the arms have been produced, wherein the support has a housing that is suitable for receiving a portion of the fuse in a space formed between the at least one pair of arms.

Abstract: An electronic fuse may receive a silicon/germanium material in the fuse body, which in turn may result in the formation of a metal silicide material of reduced thickness. Consequently, the current density and, thus, the electromigration and heat generation in the metal silicide material may be increased for a given amount of current. Consequently, transistor switches for applying the programming pulse to the electronic fuse may be reduced in size.

Abstract: A surge protector coated with an oxide layer having an excellent chemical stability at the high temperature range and excellent adherence with respect to main discharge electrodes. The surge protector includes a column-shaped ceramic member that has a conductive film divided by a discharge gap interposed therebetween; a pair of main discharge electrode members opposite to each other on both ends of the column-shaped ceramic member to come in contact with the conductive film; and a cylindrical ceramic tube which is fitted to the pair of main discharge electrode members opposite to each other to seal both the column-shaped ceramic member and sealing gas inside thereof. Oxide films are formed on main discharge surfaces of at least the protrusive supporting portions of the pair of main discharge electrode members opposite to each other, by performing an oxidation treatment, respectively.

Abstract: A multiple fuse device for a vehicle includes a circuit board with a battery-side bus bar portion and an alternator-side bus bar portion connected together by a temporary joint portion at a position apart from a fusing portion that provides charging current protection. An insulator housing is placed over the circuit board but the temporary joint portion is left uncovered by the insulator housing. A temporary joint portion is then at least partially removed. This partial removal may leave behind two temporary joint portion remnants, one on the battery-side bus bar portion, and one on the alternator-side bus bar portion. The temporary joint portion thus enhances the strength of the circuit board while the fuse device is being manufactured, which prevents the fusing portion from being accidentally deformed or broken during the device's assembly.

Abstract: An electrical fuse structure is disclosed. The electrical fuse structure includes: a fuse element disposed on surface of a semiconductor substrate; an anode electrically connected to one end of the fuse element; and a cathode electrically connected to another end of the fuse element, wherein no silicide is formed on at least part of the cathode of the electrical fuse structure.

Abstract: An electronic component is provided in which: impact-absorbing layers are provided so as to cover at least the corner portions of both end portions of a base which is made of an insulating mixture of ceramic and glass; a conductive film is formed so as to cover the surface of these impact-absorbing layers and the surface of the base; the portions of this conductive film which cover the surfaces of the impact-absorbing layers are formed into electrodes; and a resistance-adjusting groove is provided in an other portion of the conductive film than the portions serving as the electrodes.

Abstract: A current protection device comprises a substrate having an upper portion and a lower portion; a fusing layer installed between the upper portion and the lower portion; ends of the fusing layer exposed from the substrate; a cavity formed near surfaces of the fusing layer for providing a space to receive the fusing layer as the fusing layer fuses; and an end electrode having three layers including a silver thin layer, a nickel thin layer and a tin thin layer; the end electrode being formed as a conductive electrode. The method for forming the same is provided.

Abstract: Disclosed is a method for manufacturing a base of a fuse, as well as a product of fuse base, which replaces a conventional human based process with a full-machine automatic process including the steps of loading metal wire rolls in racks; cutting the metal wire to a desired length to provide leads; forming a fixing portion on each lead; providing a formed body of the base; fitting and fixing the leads in the body; flattening ends of the leads; and completing a product of the fuse base. The fuse base so manufactured includes a body and two leads. The body forms through holes each having a lower end forming a diverging lead-in opening. Each lead forms a flattened fixing portion and is fit into a respective hole of the body through the lead-in opening with automatic machines and fixed in the fitting hole with the fixing portion.

Abstract: The present invention discloses a surface mount thin film fuse structure including a fusible fuse circuit structure disposed on a side of an insulating substrate, and the fusible fuse circuit structure has a fusible link portion electrically connected between two opposite electrode portions. If an overload current is passed through the fusible link portion, the fusible link portion will be melted down by a high temperature or a specific temperature to achieve the over current protection effect. At least one space is defined between the fusible link portion and the insulating substrate, such that a heat generated by the electrically energized the fusible link portion will not be dissipated through the heat conduction of the insulating substrate to achieve the circuit protection effect.

Abstract: A circuit protecting element includes insulating substrate (11), a pair of surface electrodes (12) provided to both ends of a top face of insulating substrate (11), element (13) bridging the pair of surface electrodes (12) and electrically connected to the pair of surface electrodes (12), base layer (14) formed between element (13) and insulating substrate (11), and insulating layer (15) covering element (13). Base layer (14) is formed of a mixture of diatom earth and silicone resin. The structure discussed above allows stabilizing the blowout characteristics of the circuit protecting element.

Abstract: A fuse box structure includes a first fuse, an insulating film formed on the first fuse, and a second fuse disposed on the insulating film to partially overlap the first fuse. Each of the first and second fuse includes a main portion and one or more cutting portions connected to the main portion. The configuration of the first and second fuse requires a reduced area of occupancy of the fuse box structure.

Abstract: The overcurrent protection structure according to the present invention mainly comprises a fusible fuse structure unit disposed in a coating, and the both ends of the fusible fuse structure unit extend outwardly beyond the coating and form a first electrode and a second electrode. In the manufacturing process, the gas-assisted injection molding process enables at least one space for accommodating gas disposed between the fusible fuse structure unit and the coating such that the heat generated by the electrically energized the fusible fuse structure unit will not dissipate through the heat conduction of the coating in order to ensure that it will blow at high temperature when reaching a specific current or a specific temperature and the circuit protection effect.

Abstract: The invention relates to a fusible alloy element (1), in particular for producing a thermal fuse, comprising a fusible element (2), which is made of a material that melts at a trigger temperature, and a support layer (4) on a surface in at least one contacting area of the fusible alloy element (1).

Abstract: The invention relates to a thermal fuse in a circuit structure, particularly a punched grid, having a plurality of circuit areas, having the circuit structure with connections sited (9) and having a fusible element (3), which is electrically and mechanically connected to the connection sites (9) of the circuit structure, the material of the fusible element (3) having a melting point, in order to melt at an ambient temperature greater than the melting point, such that material of the fusible element (3) collects at the connection sites (9) and the electrical connection formed by the fusible element (3) breaks.

Abstract: In sophisticated integrated circuits, an electronic fuse may be formed such that an increased sensitivity to electromigration may be accomplished by including at least one region of increased current density. This may be accomplished by forming a corresponding fuse region as a non-linear configuration, wherein at corresponding connection portions of linear segments, the desired enhanced current crowding may occur during the application of the programming voltage. Hence, increased reliability and more space-efficient layout of the electronic fuses may be accomplished.

Abstract: A fuse (10) is proposed for interrupting a voltage and/or current-carrying conductor (12) in case of a thermal fault, having a conductor bar (14) ensuring an electrically conductive connection of the voltage and/or current-carrying conductor during correct operation, said fuse (10) being characterized in that the conductor bar (14) melts upon an increase in temperature above the melting point, and the electrically conductive connection of the voltage and/or current-carrying conductor is interrupted due to inherent surface tension. Also proposed is a method for producing the fuse (10) according to the invention.

Abstract: A small-sized surface-mounted fuse and a method of manufacturing the same. A fusing element, separated from a winding member, is connected to lead wires by arc welding instead of soldering. Consequently, the present invention has the effect of improving fusing characteristics and productivity while reducing the defective rate and manufacturing costs.

Abstract: The present invention provides a complex type fusible link which includes an insulative block base including a plurality of cavities; a conductive connecting plate which is integrally embedded in the insulative block base, a part of the conductive connecting plate being exposed to at least one of the cavities; a plurality of fusible elements each of which is accommodated in corresponding one of the cavities and includes a first end which is connected to the part of the conductive connecting plate and a second end; and a plurality of terminals each of which is integrally embedded in the insulative block base and includes a first end which is connected to the second end of corresponding one of the fusible elements and a second end which is exposed from the insulative block base.

Abstract: A semiconductor device includes an electric fuse formed on a semiconductor substrate and composed of an electric conductor. The electric fuse includes an upper layer interconnect, a via coupled to the upper interconnect and a lower layer interconnect coupled to the via, which are formed in different layers, respectively, in a condition before cutting the electric fuse, and wherein the electric fuse includes a flowing-out region formed of the electric conductor being flowed toward outside from the second interconnect and a void region formed between the first interconnect and the via or in the via, in a condition after cutting the electric fuse.

Abstract: A fuse module includes a wiring lug. The wiring lug includes a fuse clip member comprising a first pressure plate and a fuse clip, a lug box comprising a second pressure plate, and a securing member operably coupled to the lug box. The securing member operates between a first position and a second position to move the second pressure plate of the lug box with respect to the first pressure plate of the fuse clip member. The first pressure plate and the second pressure plate have a clamping relationship when the securing member is in the first position and have a non-clamping relationship when the securing member is in the second position.

Abstract: An electrical fuse and a first dielectric layer thereupon are formed on a semiconductor substrate. Self-assembling block copolymers containing two or more different polymeric block components are applied into a recessed region surrounded by a dielectric template layer. The self-assembling block copolymers are then annealed to form a pattern of multiple circles having a sublithographic diameter. The pattern of multiple circles is transferred into the first dielectric layer by a reactive ion etch, wherein the portion of the first dielectric layer above the fuselink has a honeycomb pattern comprising multiple circular cylindrical holes. A second dielectric layer is formed over the circular cylindrical holes by a non-conformal chemical vapor deposition and sublithographic cavities are formed on the fuselink. The sublithographic cavities provide enhanced thermal insulation relative to dielectric materials to the fuselink so that the electrical fuse may be programmed with less programming current.

Abstract: A temperature fuse protection device uses a hot melt metal to rivet for connecting two terminals in the circuit that are separated for making the two terminals electrically-connected and the circuit complete. There is a spacing in between the two free ends of the two terminals when no external force is being imposed. When an electric overloading or high circuit temperature event occurs, the hot melt metal would be heated to melt and break, which would then make the free ends of the two terminals to be disconnected, and therefore, the circuit will be at “OFF” status.

Abstract: A self-recovering current limiting fuse protecting a secondary battery having a high rated voltage thanks to its improved breakdown voltage, expanding the application range, shortening the charging time, and realizing maintenance-free. The self-recovering current limiting fuse is made by fluid-dispersing solid conductive particles into a liquid matrix between electrodes. A current limiting operation through evaporation/spreading of the solid conductive particles and a conducting state brought about through collection of the solid conductive particles between the electrodes by dielectrophoretic force of the solid conductive particles are realized repeatedly, and a current limiting operation through evaporation/spreading of the solid conductive particles by overcurrent is realized.

Abstract: A bimetallic thermostat with exchange contact is described comprising an external support covering (1) and an internal device (2) made up of a pierced base (3) provided with a packing (4) and with electric contacts (5, 15, 25, 35) with the outside, of a relay (8) electrically connected with said base (3) and of a sensitive thermostatic element (9) electrically connected with said relay (8). Said thermostat comprises in addition a printed circuit (7) interposed between the sensing element (9) and the relay (8).

Abstract: A master fuse module includes a base housing configured to be disposed on a battery, a fuse assembly connected to the base housing, and a cover disposed on the base housing. The fuse assembly includes a first generally planar portion including a first terminal, a second generally planar portion disposed generally perpendicular to the first generally planar portion, a plurality of second terminals, and a plurality of fuses. Each fuse includes a first portion in electrical communication with the first terminal and a second portion in electrical communication with one of the plurality of second terminals. A fuse element is in electrical communication between the first and second portions and provides overcurrent protection by melting when subjected to a predetermined current. A plurality of connectors connects the fuse assembly to the base housing.

Abstract: The invention relates to a method of manufacturing a circuit protector and to a circuit protector. The method comprises the steps of providing a substrate having opposing end portions, coupling an element layer to the top surface of the substrate, and laser machining the element layer to shape the element layer into a predetermined geometry. The circuit protector comprises a substrate having opposing end portions, termination pads coupled to the top surface at opposing end portions of the substrate, a fuse element disposed across a space between the termination pads and electrically connecting the termination pads, the fuse element having a predetermined geometry; the predetermined geometry having the narrowest width of about 0.025 to about 0.050 millimeters, a cover coupling the top surface and suffusing the substrate, the fuse element and the termination pads, and end terminations in electrical contact with the termination pads at the opposing end portions.

Abstract: A configuration for fuses and a method of manufacturing is disclosed. A fuse body is made with slots on the ends, allowing solder a greater surface area to grip the body and form an excellent bond. The slots communicate with a central cavity in the fuse body. The improvements relate primarily to surface mount fuses because of the great volume of such fuses in commerce, but may be applied to fuses of any size.

Abstract: The invention provides a connection grid, comprising at least a pair of arms for fixing a fuse to the grid via its longitudinal ends. Each of the arms comprises a concave portion forming a cradle for receiving one of the longitudinal ends of the fuse. A method for producing this grid and a device for implementing this method are also provided.

Abstract: In order to produce a cost-effective fuse (100) in chip design, which is applied to a carrier substrate (10) made of a Al2O3 ceramic having a high thermal conductivity, and which is provided with a fusible metallic conductor (13) and a cover layer (14), in which the melting point of the metallic conductor (13) may be defined reliably, it is suggested that an intermediate layer (11) having low thermal conductivity be positioned between the carrier substrate (10) and the metallic conductor (13), the intermediate layer (11) being formed by a low-melting-point inorganic glass paste applied in the screen-printing method or an organic intermediate layer (11) applied in island printing. Furthermore, a method for manufacturing the fuse (100) is specified.

Abstract: An electronic fuse for an integrated circuit and a method of fabrication thereof are presented. The electronic fuse has a first terminal portion and a second terminal portion interconnected by a fuse element. The fuse element has a convex upper surface and a lower surface with a radius of curvature at a smallest surface area of curvature less than or equal to 100 nanometers. Fabricating the electronic fuse includes forming an at least partially freestanding dielectric spacer above a supporting structure, and then conformably forming the fuse element of the fuse over at least a portion of the freestanding dielectric spacer, with the fuse element characterized as noted above. The dielectric spacer may remain in place as a thermally insulating layer underneath the fuse element, or may be removed to form a void underneath the fuse element.

Abstract: A fuse includes an electrical assembly and a fuse tube assembly. The electrical assembly has two electrical contacts accessible from the exterior of the fuse and a fuse element in contact with the two electrical contacts. The fuse tube assembly includes a support structure surrounding at least a portion of the electrical assembly and a reinforcing structure formed over the support structure and in contact with at least a portion of the electrical assembly. The reinforcing structure is made of a fiber matrix pre-impregnated with a resin.

Abstract: A surge protector coated with an oxide layer having an excellent chemical stability at the high temperature range and excellent adherence with respect to main discharge electrodes. The surge protector includes a column-shaped ceramic member that has a conductive film divided by a discharge gap interposed therebetween; a pair of main discharge electrode members opposite to each other on both ends of the column-shaped ceramic member to come in contact with the conductive film; and a cylindrical ceramic tube which is fitted to the pair of main discharge electrode members opposite to each other to seal both the column-shaped ceramic member and sealing gas inside thereof. Oxide films are formed on main discharge surfaces of at least the protrusive supporting portions of the pair of main discharge electrode members opposite to each other, by performing an oxidation treatment, respectively.

Abstract: A low resistance fuse apparatus and methods of manufacture includes a first intermediate insulation layer, a second intermediate insulation layer, and a free standing fuse element layer independently formed and fabricated from each of the first and second intermediate insulation layers, The fuse element layer includes first and second contact pads and a fusible link extending therebetween. The first and second intermediate insulation layers extend on opposite sides of the free standing fuse element layer and are laminated together with the fuse element layer therebetween.

Abstract: A chip-type fuse is based on an electrically insulating substrate and fusible element is disposed thereon. A protective layer is formed over the fusible element and adheres to the substrate around the fusible element so as to define a cavity between the protective layer and the fusible element. The cavity isolates the protective layer from direct contact with the fusible element so that the protective layer will not be melted or breached by the excessive heat and arc generated by the fusible element under overload condition. Further, the cavity can be hermetically sealed to enclose a gas of pressure less than one atmosphere. A thermally insulating layer and an arc suppressive layer may be incorporated to reduce the response time and arc intensity of the chip-type fuse respectively under overload condition. The method of manufacturing chip-type fuse, particularly the method of forming fusible element and cavity, is described too.

Abstract: Methods of manufacturing a variety of circuit protection devices are provided as well as devices so manufactured. In an embodiment, a surface mount electrical device having a substrate and a pair of conductive electrodes connected to an electrical protection component for sensing current or voltage is provided. The method includes the steps of: (i) providing a substrate having a first surface and a second surface; creating a first and second aperture, plasma etching a through-hole, slot or bore through the substrate; (ii) depositing a conductive material on the substrate and through the apertures to form the electrodes, wherein the conductive material extends through the apertures and on the first and second surfaces of the substrate, respectively; and (iii) depositing the electrical protection component on the first surface of the substrate to electrically connect the electrodes.

Abstract: A method of fabricating a micro electromechanical switch on a substrate comprising piezoelectric layers, metal electrodes alternated with the layers and contact pads. Cross voltages are applied to the electrodes, in order to obtain an S-shaped deformation of the switch and allow contact between the contact pads. Additionally, a further electrode can be provided on a substrate where the switch is fabricated, to allow an additional electrostatic effect during movement of the piezoelectric layers to obtain contact between the contact pads. The overall dimensions of the switch are very small and the required actuation voltage is very low, when compared to existing switches.

Abstract: Tolerance to ESD is increased in an electronic fuse by providing at least one non-conductive region adjacent to a conductive region on the surface of an insulator. Such an arrangement reduces the thermal stresses imposed on the insulator in high current applications. Where multiple conductive and adjacent non-conductive regions are disposed on an insulator, the fuse can fail in discrete steps, thus providing a well defined and easily detected transisition to a blown state, as well as providing a stepwise increase in resistance between prescribed resistance values.

Abstract: A fuse component (1) includes a hollow body (2) which is formed from a tubular wall that encloses an inner area (5) and which has two open faces that are situated opposite one another. The fuse component also includes a fuse-element (4) which extends inside the inner area (5) between both faces of the hollow body (2) and two contact caps (3) each provided with a bottom (7) and lateral walls (8) connected thereto. Two end section (10) of a conductor of the fuse-element (4) are led out of the inner area (5) through the faces and around the wall of the hollow body (2). The end sections (10) of the conductor of the fuse element (4) are fastened by an adhesive bond (11) so that the surfaces abutting the inner area (5) are essentially free from organic materials. The end sections (10) of the conductor are preferably fastened to a conductive plastic that, in turn, fastens the contact caps (3) to the outer wall (9) of the hollow body (2).

Abstract: The invention relates to a method for producing a protective component, for example a fuse component or a fusing resistor, including a fusible element and a heating element, which are attached as stacking components to the surface of a substrate. The fusible element is configured in such a way that a current flow between its connections is interrupted, if the fusible component is heated, at least in one fusible region, for a predetermined time period to above a predetermined temperature. The fusible element and the heating element are arranged on the substrate in such a way, that heat created by the heating element is transported to the fusible element and the current flow through the heating element exceeds a threshold value for a predetermined time period. During production, the heating element is positioned next to the fusible element, at a predetermined distance from it.

Abstract: A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration of the component. The component includes a semiconductor die, a substrate attached to the die, and terminal contacts on the substrate. The adjustment circuitry includes conductors and programmable links, such as fuses or anti-fuses, in electrical communication with the die and the terminal contacts. The adjustment circuit can also include capacitors and inductance conductors. The programmable links can be placed in a selected state (e.g., short or open) using a laser or programming signals. A method for fabricating the component includes the steps of forming the adjustment circuitry, and then placing the programmable links in the selected state to achieve the selected adjustment.

Abstract: In a method for marking a fuse in order to allow for the rapid visual identification of certain characteristics of that fuse, the fuse is provided with: a first color-coded visual indicia indicative of an amperage rating of the fuse; a second color-coded visual indicia indicative of an action value of the fuse; and/or a third color-coded visual indicia indicative of a voltage rating of the fuse.

Abstract: To produce bus bars, a conductive metal plate is stamped out into a plurality of strips simultaneously by press molding. Each strip has a tab having an L-shaped cross-section defined by a curved section and a distal end. The plurality of strips are bent in a thickness direction to obtain a plurality of rings, respectively. The rings are mutually different in diameter and have substantially the same center. The L-shaped tab of each of the rings is disposed such that the distal end of each tab is disposed substantially at a same distance from the center.

Abstract: Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.

Abstract: An electroluminescent (EL) lamp having at least two integral fusible links and a method of manufacturing such a lamp are disclosed. The present invention provides for a fusible link between the front electrode input power contact area and the transparent electrode. In addition, the present invention provides a second fusible link between the back electrode input power contact area and the transparent electrode. The fusible links are designed to become non-conductive (open) if a certain current level is exceeded. The EL lamp fails in a controlled way, without signs of combustion. The EL lamp is therefore protected from self-destruction when subject to an anomaly or manufacturing defect.

Abstract: A method for post-fabrication modification of the snap actuation properties of a thermally responsive bimetallic actuator by exposing a pre-formed bimetallic actuator to laser energy, thereby permanently altering the thermal response properties of the bimetallic actuator, and a thermally responsive bimetallic actuator having snap actuation properties developed according to the method.

Abstract: A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration of the component. The component includes a semiconductor die, a substrate attached to the die, and terminal contacts on the substrate. The adjustment circuitry includes conductors and programmable links, such as fuses or anti-fuses, in electrical communication with the die and the terminal contacts. The adjustment circuit can also include capacitors and inductance conductors. The programmable links can be placed in a selected state (e.g., short or open) using a laser or programming signals. A method for fabricating the component includes the steps of forming the adjustment circuitry, and then placing the programmable links in the selected state to achieve the selected adjustment.

Abstract: Devices capable of protecting electronic components during the occurrence of a disturbance event using printed circuit board manufacturing techniques. A three (3) layer structure is formed comprising a polymer-based formulation sandwiched between two electrode layers. The devices can be manufactured in panel form providing high quantities of devices which can be removed from the panel and applied directly to the component to be protected. Desired patterns can be formed on either one of the electrode layers by photo-etch techniques thereby providing a process that can be tailored to a large number of applications.