Fuse Making Patents (Class 29/623)
  • Patent number: 6917277
    Abstract: The invention is to offer a fuse and a fuse production method excellent in reducing manufacturing cost. A fuse having an electrically conductive fuse element. The fuse element has a pair of terminal connection portions and a fusible member for electrically connecting the terminal connection portions to each other and for being fused and broken when an overload electric current flows. At least a part of the fusible portion is formed by spouting or dropping the melting metal drops.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: July 12, 2005
    Assignee: Yazaki Corporation
    Inventors: Hitoshi Ohashi, Tatsuya Kato, Hitoshi Ushijima, Hiroyo Ayuzawa
  • Patent number: 6903649
    Abstract: A fuse that includes an arc energy reducing coating to reduce arc energy during a short-circuit and/or a full voltage overload current interrupt is described. The fuse includes end conductor elements, and at least one fuse element secured between and making electrical contact with the end conductor elements. An elongate fuse housing, having a passageway extending longitudinally through the housing, extends between the end conductor elements. The fuse element extends through the housing passageway. An arc energy reducing coating at least partially coats each end portion of the fuse element.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: June 7, 2005
    Assignee: Cooper Technologies Company
    Inventor: John Marvin Ackermann
  • Patent number: 6888440
    Abstract: A fuse that includes an arc energy reducing coating to reduce arc energy during a short-circuit and/or a full voltage overload current interrupt is described. The fuse includes end conductor elements, and at least one fuse element secured between and making electrical contact with the end conductor elements. An elongate fuse housing, having a passageway extending longitudinally through the housing, extends between the end conductor elements. The fuse element extends through the housing passageway. An arc energy reducing coating at least partially coats each end portion of the fuse element.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: May 3, 2005
    Assignee: Cooper Technologies Company
    Inventor: John Marvin Ackermann
  • Patent number: 6854176
    Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7,8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1) in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31,51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior. Additional electrical components may be attached directly to the surface of the device or assembly.
    Type: Grant
    Filed: December 12, 2001
    Date of Patent: February 15, 2005
    Assignee: Tyco Electronics Corporation
    Inventors: Scott Hetherton, Wayne Montoya, Thomas Bruguier, Randy Daering, James Toth, Daniel A. Chandler, Matthew P. Galla
  • Patent number: 6838971
    Abstract: Quantity of flux coated on fusible alloy of a thermal fuse disclosed can be inspected accurately by an image processing method. The thermal fuse comprises: (a) first insulation film 11 coupled with a pair of metal terminals 12; (b) fusible alloy 13 coupled between ends of the metal terminals 12, being placed above first insulation film 11; (c) flux 14 coated on fusible alloy 13; and (d) second insulation film 15 disposed on first insulation film 11 so that an internal space is formed, being placed above fusible alloy 13, wherein at least either of first insulation film 11 or second insulation film 15 is transparent or translucent, and flux 14 has the Gardner color scale from 4 to 16.
    Type: Grant
    Filed: May 21, 2002
    Date of Patent: January 4, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenji Senda, Takahiro Mukai
  • Patent number: 6830482
    Abstract: In a fusible link including a plurality of fuse circuit-forming members each having a plurality of terminal portions which are arranged in a chain-like manner, and are connected to an interconnecting plate portion through respective fusible portions, and the plurality of fuse circuit-forming members are mounted on housings to form large-current fuse circuits. A bending portion is formed integrally at a generally central portion of the interconnecting plate portion, and the fuse circuit-forming members are formed integrally respectively at opposite sides of the bending portion, and the bending portion and the fuse circuit-forming members are formed by an electrically-conductive flat plate. The insulating housings are formed integrally respectively on the fuse circuit-forming members by insert molding, and the bending portion is bent at its predetermined portions in such a manner that the housings are disposed in parallel opposed relation to each other.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: December 14, 2004
    Assignee: Yazaki Corporation
    Inventors: Norio Matsumura, Shinya Onoda, Yusuke Matsumoto
  • Patent number: 6791448
    Abstract: A fuse has a fuse element (6) with a fusible conductor (7) of a conductor material (8) such as Ag, Cu or Al and is provided with doping points (9) following one another at regular intervals. There, the conductor material (8) has a directly adjoining layer of a first compound (10) of the same with a doping material such as In or Ge. It forms mixed crystals which contain the conductor material (8) and the doping material in a fixed stoichiometric ratio, such as for example Ag2In, and is separated from said conductor material by a stable phase boundary. The doping points (9) weaken the fusible conductor by lowering the melting point to below 250° C., so that arc formation rapidly occurs there when there are short-circuit currents, although its electrical resistance per unit of length is under some circumstances only a few percent greater than in the remaining region. The fusible conductor (7) bears a continuous layer of a burn-up material (12).
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: September 14, 2004
    Assignee: ABB Research LTD
    Inventors: Uwe Kaltenborn, Pal Kristian Skryten
  • Patent number: 6774760
    Abstract: In an exemplary embodiment, a fuse body includes a first end, a second end and a bore extending therethrough for receiving a fuse element assembly. The bore includes a clearing portion having a first cross sectional area and a positioning portion having a second cross sectional area. The first cross sectional area is larger than the second cross sectional area. The positioning portion provides a receptacle for receiving the fuse element assembly and ensuring that the fuse element is substantially centered within the clearance portion.
    Type: Grant
    Filed: June 5, 2001
    Date of Patent: August 10, 2004
    Assignee: Cooper Technologies Company
    Inventors: Varinder K. Kalra, Keith A. Spalding, Conrad M. Reeder
  • Patent number: 6724292
    Abstract: An object is to provide a thermal fuse that is free of a trouble of welding contact between a movable electrode (4) and a lead (2) even when temperature of an equipment to which the thermal fuse is connected rises gradually and that has small electric resistance at the time of conduction.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: April 20, 2004
    Assignees: NEC Schott Components Corporation, Tokuriki Honten Co., Ltd.
    Inventors: Ikuhiro Miyashita, Tokihiro Yoshikawa, Michihiko Nishijima, Hideo Kumita
  • Publication number: 20040056752
    Abstract: A plurality of fuse elements each having a pair of flat terminal pieces interconnected by a fusible part, and a coupling part for coupling the flat terminal pieces of each fuse element along the fuse belt are one-piece formed by pressing process. A fuse belt is formed by attaching an insulating housing covering the fusible part to each fuse element. The flat terminal pieces of each fuse element in the fuse belt are successively separated from the coupling part by cutting, and the fuses are mounted to fuse mounting parts of an electric junction box.
    Type: Application
    Filed: July 15, 2003
    Publication date: March 25, 2004
    Applicant: YAZAKI CORPORATION
    Inventors: Hironori Kondo, Takayoshi Endo
  • Patent number: 6698086
    Abstract: Linear configurations of metallic fuse sections have a bit combination which represents a characteristic of a circuit on a wafer. The metallic fuse sections need to be rid of a polyimide layer covering them in order to make it possible to burn the fuse sections. In the event of unsatisfactory adherence to process parameters and insufficient removal of polyimide on the metallic fuse sections, a resulting relative error in a characteristic of the circuit is minimized according to the method since the fuse section corresponding to the most significant bit is neighbored on both sides by other fuse sections.
    Type: Grant
    Filed: September 30, 1998
    Date of Patent: March 2, 2004
    Assignee: Infineon Technologies AG
    Inventor: RĂ¼diger Klette
  • Publication number: 20040034993
    Abstract: Methods of manufacturing a variety of circuit protection devices are provided as well as devices so manufactured. In an embodiment, a surface mount electrical device having a substrate and a pair of conductive electrodes connected to an electrical protection component for sensing current or voltage is provided. The method includes the steps of: (i) providing a substrate having a first surface and a second surface; creating a first and second aperture, plasma etching a through-hole, slot or bore through the substrate; (ii) depositing a conductive material on the substrate and through the apertures to form the electrodes, wherein the conductive material extends through the apertures and on the first and second surfaces of the substrate, respectively; and (iii) depositing the electrical protection component on the first surface of the substrate to electrically connect the electrodes.
    Type: Application
    Filed: August 26, 2002
    Publication date: February 26, 2004
    Inventors: Matthew Rybka, Thomas Restis
  • Patent number: 6694605
    Abstract: The present invention includes a new dome contact construction having an integral insulative layer that is precisely cut and aligned with the dome contact mechanism during fabrication. Prior to feeding the metal sheets or strips into the equipment for stamping and cutting the dome contact using the conventional method, a die cut layer of film is applied to one side of the sheet or strip. The film is cut into the shape of the desired insulative layer in the finished switch product and has periodic openings that correspond to the areas of the dome contact that are required to be uncovered both to provide electrical conductivity as a part of the proper function of the switch. The sheet of metal, including the laminate film, is cooled to a temperature near freezing to facilitate clean stamping of the laminated feedstock during the stamping process and is then fed into the forming and cutting press where the domes are formed and stamped.
    Type: Grant
    Filed: June 11, 2002
    Date of Patent: February 24, 2004
    Inventor: Robert Galli
  • Publication number: 20040017674
    Abstract: A low current blow trim fuse structure and method of forming the trim fuse structure. Oxide steps are placed beneath a trim fuse during prior processing steps. The oxide steps will cause the metal (or polycrystal silicon (poly)) to thin at the point where the metal (or poly) transitions the step, and thus will reduce its cross-sectional area and current carrying capability, making it easier to program the fuse. The oxide steps will serve a further purpose in that, to some extent, it will thermally isolate the trim fuse, thereby causing local heating, making the fuse easier to blow.
    Type: Application
    Filed: June 24, 2003
    Publication date: January 29, 2004
    Inventors: Gregory G. Romas, Rex W. Pirkle
  • Patent number: 6656826
    Abstract: A semiconductor device has a fuse to be blown with an energy beam. The semiconductor device has copper wiring levels formed on a semiconductor substrate on which semiconductor elements are formed, an uppermost wiring level formed on said copper wiring levels and including a refractory metal film connected to a top one of the copper wiring levels, the fuse formed from a part of the uppermost wiring level, and a surface protective film formed on the uppermost wiring level.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: December 2, 2003
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Kazunari Ishimaru
  • Patent number: 6655012
    Abstract: In the fabrication of a surge protector device which utilizes breakdown phenomena of a resistive film, a case which fixes metal bars in it, makes electrical contacts with the metal bars and contains oxidizing and refractory agents, a cap, metal bars and oxidizing and refractory agents are prepared in advance. In the fabrication process of the surge protector device using these elements, a step to control the force applied to the cap, the metal bars and the case so that the force applied to the interface between the resistive films and the mechanical contacts which form electrodes to the metal bars can be controlled. Automation process to fabricate the surge protector device will be realized and efficient fabrication of the precise surge protector device will be also realized. A surge protector device whose breakdown voltage is precisely controlled will be realized reproducibly.
    Type: Grant
    Filed: June 18, 2001
    Date of Patent: December 2, 2003
    Inventor: Takashi Katoda
  • Patent number: 6653925
    Abstract: There is provided a method for insulating leads of a thermal fuse with an insulating tube that can reduce the quantity of the adhesive and prevent the defect of appearance and the lowering of the value of the product, by applying an adhesive on the circumference of the leads, and putting the insulating tube on the lead from the outer end of the lead while rotating the insulating tube, so that the adhesive is present inside the insulating tube. There is also provided a low-cost, downsized thermal fuse with excellent heat resistance, by using the alloy that has a melting point of 190° C. or above as the fusible alloy, and a copper wire plated with an Sn—Cu alloy for the lead.
    Type: Grant
    Filed: October 13, 2000
    Date of Patent: November 25, 2003
    Assignee: Anzen Dengu Kabushiki Kaisha
    Inventors: Yoshio Asami, Shinichi Kato
  • Patent number: 6650223
    Abstract: The present invention relates to an electrical fuse element having an essentially ceramic housing which, in the unfired state, is closed around at least one fusible conductor. To improve the properties of such a fuse element with respect to the extremely high internal pressures occurring during switching off as well as when exposed to an arc, a fuse element (5) in which the fusible conductor (1) has an electrically conducting component, in particular a metallic wire (2), and an insulating, porous component is proposed.
    Type: Grant
    Filed: October 24, 2000
    Date of Patent: November 18, 2003
    Assignee: Wickmann-Werke GmbH
    Inventors: André Jöllenbeck, Barbara Marzinkowski, Peter Pössnicker
  • Patent number: 6642833
    Abstract: A high-voltage current-limiting fuse comprises an elongated housing, an auto-centering connector centrally located about the elongated axis of the housing, and an elongated fusible element attached to the connector and secured along the elongated axis of the housing by the connector. The auto-centering connector is located about the elongated axis of the housing by a surface near one end of the housing, and the elongated conductive fusible element is connected to the connector and contained within the housing. The auto-centering connector is connected to an end of the fusible element, and mechanically located but electrically insulated relative to the housing.
    Type: Grant
    Filed: January 26, 2001
    Date of Patent: November 4, 2003
    Assignee: General Electric Company
    Inventors: Radhakrishnan Ranjan, Eli Valle, Constance Moore Dotson, Arthur Thomas Ehmke, Cesar Eliut Lopez
  • Patent number: 6624356
    Abstract: An electrically conductive metal plate is stamped out to yield a fuse unit including an input terminal and several output terminals. The fuse unit further includes a predetermined locus where fuse element portions are to be formed later. A surface area of the fuse unit including the predetermined locus is then molded with an insulator material. Thereafter, the fuse element portions are formed at the predetermined locus by, for example, stamping. In this manner, the fuse unit can be manufactured easily at low costs, irrespective of the number and electrical capacity of the fuse element portions.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: September 23, 2003
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Tatsuya Sumida, Shunji Taga
  • Patent number: 6622375
    Abstract: A method for producing a fuse element having a fusible portion and any other portion which are made of different kinds of metal. The method comprises the steps of boring through-hole in a substrate made of first metal, forming an element plate by fusion-bonding a second metal to the through-hole and integrally stamping a pair of substrate portion made of the first metal and a low-melting-point portion made of the second metal. The second metal is made of a metal whose melting point is lower than that of the first metal. Further, the pair of substrate portion is connected together by the low-melting-point portion so that the fuse element is formed.
    Type: Grant
    Filed: September 25, 2000
    Date of Patent: September 23, 2003
    Assignee: Yazaki Corporation
    Inventors: Takayoshi Endo, Takashi Ishii
  • Patent number: 6614341
    Abstract: A thick film circuit on an insulating substrate includes a thermal fuse. The circuit includes a conductive strip, which may be sufficiently resistive to comprise the resistor of an automotive fan motor controller, which is made of a material dissolved by a solder which melts at a predetermined temperature. When an abnormal event occurs which raises the temperature of the circuit, the solder melts and dissolves the underlying conductive strip. The solder and melted material of the strip then coalesce into one or more droplets thereby breaking the circuit.
    Type: Grant
    Filed: January 22, 2001
    Date of Patent: September 2, 2003
    Assignee: International Resistive Company, Inc.
    Inventor: Shaun G. Martin
  • Patent number: 6594886
    Abstract: The method of fuse manufacture has a step to fabricate a metal plate with an overall long narrow shape, with a plurality of rows of connecting pieces having separated tips and connected aft ends, and with the tip of each connecting piece arranged in a straight line; a step to connect the tips of adjacent connecting pieces by welding wire to the connecting piece tip regions which are arranged in a straight line; a step to treat two adjacent connecting pieces as a unit, to cut the wire between each two-connecting piece unit for separation, and to detach each individual connecting piece; and a step to bend the wire, connecting each cut two-connecting piece unit, to form the pair of connecting pieces into a straight line.
    Type: Grant
    Filed: April 16, 2001
    Date of Patent: July 22, 2003
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Kazuo Osaki, Hisashi Hashimoto
  • Patent number: 6566599
    Abstract: An electrically conductive metal plate is stamped out to yield a fuse unit including an input terminal and several output terminals. The fuse unit further includes a predetermined locus where fuse element portions are to be formed later. A surface area of the fuse unit including the predetermined locus is then molded with an insulator material. Thereafter, the fuse element portions are formed at the predetermined locus by, for example, stamping. In this manner, the fuse unit can be manufactured easily at low costs, irrespective of the number and electrical capacity of the fuse element portions.
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: May 20, 2003
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Tatsuya Sumida, Shunji Taga
  • Publication number: 20030024105
    Abstract: A process for manufacturing fuse devices includes the steps of preparing an elongated metal sheet; forming a plurality of openings in the metal sheet so as to form a plurality of frame units, each of which includes a frame and a pair of opposing ribs that extend from the frame and that have spaced apart free ends; electrically connecting the free ends of the ribs of each of the frame units using a conductive wire; forming a dielectric body in each of the frame units; and cutting the ribs of the frame units at positions that are exposed from the respective one of the dielectric bodies so as to form a plurality of semi-finished fuse products.
    Type: Application
    Filed: September 25, 2001
    Publication date: February 6, 2003
    Applicant: CONQUER ELECTRONICS CO., LTD.
    Inventor: Tony Chiu
  • Patent number: 6509824
    Abstract: An electrically conductive fuse element including fusible portions has a hinge portion provided at a middle portion thereof. A resin body is divided into resin body parts so that the resin body parts are provided around the fuse element in such a way as to be separated by the hinge portion. One of the resin body parts is bent from the hinge portion. The fuse element has abutting faces, against which the resin body parts are abutted in a bent state, and engaging means for the resin body parts. A connector housing is provided on the resin body part. Further, a terminal is provided at one of plate portions of the fuse element. Power supply connecting portions and terminal connecting portions are provided in the other plate portion connected to the plate portion through the hinge portion.
    Type: Grant
    Filed: February 9, 2001
    Date of Patent: January 21, 2003
    Assignee: Yazaki Corporation
    Inventors: Shigemitsu Inaba, Norio Matsumura, Yasuyuki Hama
  • Patent number: 6498559
    Abstract: A bimetallic switch comprising a bimetallic element having an outer edge and being adapted to snap between an open mode and a closed mode; a movable contact disposed on the bimetallic element; a first terminal in electrically conductively coupled to the movable contact; a fixed contact disposed adjacent the movable contact such that, when the switch is in a closed position, the fixed contact and the movable contact are in engagement with one another, and when the switch is in an open position, the fixed contact and the movable contact define an open contact gap therebetween; a second terminal electrically conductively coupled to the fixed contact; a step disposed adjacent the outer edge of the bimetallic element such that a clearance is defined therebetween when the bimetallic element is in its closed mode, the clearance being positioned and dimensioned such that, when the outer edge of the bimetallic element deforms prior to a snapping open thereof, the clearance isolates a deformation of the outer edge ther
    Type: Grant
    Filed: May 24, 2000
    Date of Patent: December 24, 2002
    Inventors: Christopher Cornell, Frank J. Sienkiewicz
  • Publication number: 20020162214
    Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7,8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1) in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31,51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior. Additional electrical components may be attached directly to the surface of the device or assembly.
    Type: Application
    Filed: December 12, 2001
    Publication date: November 7, 2002
    Inventors: Scott Hetherton, Wayne Montoya, Thomas Bruguier, Randy Daering, James Toth, Daniel A. Chandler, Matthew P. Galla
  • Patent number: 6452475
    Abstract: A protective device comprises a fuse element provided to electrodes on a substrate. The fuse element has a liquidus point higher than the mounting temperature of the protective device, and has a solidus point lower than the mounting temperature of the protective device. The difference between the liquidus and solidus points is 5° C. or higher.
    Type: Grant
    Filed: April 4, 2000
    Date of Patent: September 17, 2002
    Assignee: Sony Chemicals Corp.
    Inventors: Masami Kawazu, Norikazu Iwasaki
  • Patent number: 6412165
    Abstract: A method of increasing the cycle life of a thermostatic disc element for use in a disc assembly used in thermostatic switches in which a weld slug is used to weld the disc element to the disc assembly thereby causing a heat affected zone of the disc element comprising the step of engaging the surface of the disc element opposite the surface adjacent the weld slug with a fulcrum member at a location spaced from the heat affected zone so that upon reversal of the curvature of the disc element, the disc element will bend about the fulcrum member at a location removed from the heat affected zone.
    Type: Grant
    Filed: April 23, 1998
    Date of Patent: July 2, 2002
    Assignee: Texas Instruments Incorporated
    Inventor: Sheldon S. White
  • Publication number: 20020062549
    Abstract: A metal fuse process that uses a thinner (e.g., 6000 Å) oxide (108) over the top interconnect (102). The oxide (108) is removed over the probe pads (106) for testing but is not removed over the fuses (104). Because the oxide (108) is thin at the upper corners of the fuse (104), the oxide (108) cracks over the fuse (104) during a laser pulse (114). A wet etch is then used to dissolve the exposed fuses (104).
    Type: Application
    Filed: November 30, 2001
    Publication date: May 30, 2002
    Inventors: Melissa M. Hewson, Ricky A. Jackson, Abha Singh, Toan Tran, Howard L. Tigelaar
  • Patent number: 6373371
    Abstract: A preformed thermal fuse comprising two electrodes, at least one layer of solder, and a conductive bridge comprising a non-paste solder material is disclosed. The conductive bridge has a melting temperature which is substantially equivalent to the predetermined actuation temperature of the fuse.
    Type: Grant
    Filed: August 17, 1999
    Date of Patent: April 16, 2002
    Assignee: Microelectronic Modules Corp.
    Inventors: Bernhard E. Doerrwaechter, Keck C. Pathammavong, Kurt M. Krachenfels
  • Publication number: 20020010999
    Abstract: An electrical junction box for a vehicle has a connector circuit having bus bars fixed on an insulation substrate to connect to electrical connectors, a fuse circuit having bus bars fixed on an insulation substrate to connect to fuses, and a relay circuit having third bus bars fixed on an insulation substrate to connect to relays in use.
    Type: Application
    Filed: July 20, 2001
    Publication date: January 31, 2002
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Noriko Kobayashi, Yukitaka Saito, Tatsuya Sumida
  • Publication number: 20010054745
    Abstract: A fuse structure and process for forming it are described. The fuse is formed from a compound layer of aluminum and chromium. These two layers are shaped to form a stripe that bridges a gap between two copper dual damascene connectors. By controlling the degree of overlap between the stripe and the connectors the conductance of heat from the stripe into the connectors can be varied, thereby allowing control of the manner in which the fuse blows when irradiated. Since there is no copper in the fuse material, blowing a fuse does not introduce unprotected copper sources into the structure.
    Type: Application
    Filed: August 20, 2001
    Publication date: December 27, 2001
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
    Inventor: Chao-Chieh Tsai
  • Publication number: 20010046615
    Abstract: The method of fuse manufacture has a step to fabricate a metal plate with an overall long narrow shape, with a plurality of rows of connecting pieces having separated tips and connected aft ends, and with the tip of each connecting piece arranged in a straight line; a step to connect the tips of adjacent connecting pieces by welding wire to the connecting piece tip regions which are arranged in a straight line; a step to treat two adjacent connecting pieces as a unit, to cut the wire between each two-connecting piece unit for separation, and to detach each individual connecting piece; and a step to bend the wire, connecting each cut two-connecting piece unit, to form the pair of connecting pieces into a straight line.
    Type: Application
    Filed: April 16, 2001
    Publication date: November 29, 2001
    Inventors: Kazuo Osaki, Hisashi Hashimoto
  • Patent number: 6295721
    Abstract: A fuse structure and process for forming it are described. The fuse is formed from a compound layer of aluminum and chromium. These two layers are shaped to form a stripe that bridges a gap between two copper dual damascene connectors. By controlling the degree of overlap between the stripe and the connectors the conductance of heat from the stripe into the connectors can be varied, thereby allowing control of the manner in which the fuse blows when irradiated. Since there is no copper in the fuse material, blowing a fuse does not introduce unprotected copper sources into the structure.
    Type: Grant
    Filed: December 28, 1999
    Date of Patent: October 2, 2001
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventor: Chao-Chieh Tsai
  • Publication number: 20010002812
    Abstract: An electrically conductive metal plate is stamped out to yield a fuse unit including an input terminal and several output terminals. The fuse unit further includes a predetermined locus where fuse element portions are to be formed later. A surface area of the fuse unit including the predetermined locus is then molded with an insulator material. Thereafter, the fuse element portions are formed at the predetermined locus by, for example, stamping. In this manner, the fuse unit can be manufactured easily at low costs, irrespective of the number and electrical capacity of the fuse element portions.
    Type: Application
    Filed: December 1, 2000
    Publication date: June 7, 2001
    Applicant: ASAHI KOGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Tatsuya Sumida, Shunji Taga
  • Patent number: 6230391
    Abstract: A kit and method for minimizing the chance of a short circuit during servicing of a signal tap. The kit includes a pair of insertion tools. Each insertion tool includes a shaft dimensioned to be received within a plug port of the tap and a slot extending along its length. The kit further includes a pair of external insulator strips, each having an insertion portion configured to be positionable within the shaft slot. To prepare the tap for servicing, each insertion tool is positioned in a respective plug port. An external insulator strip is positioned in and moved along the respective slot to a position that isolates the contact terminals and reduces the risk of a short circuit. In taps including an internal bypass switch, the kit may further include a pair of internal insulator strips which are positioned between the bypass switch ends and the tap housing.
    Type: Grant
    Filed: August 24, 1998
    Date of Patent: May 15, 2001
    Assignee: General Instrument Corporation
    Inventors: Robert Joseph Chilton, Livia N. McCleary, William Henry Segarra
  • Patent number: 6222438
    Abstract: A temperature fuse which is melted with high operating temperature accuracy at a desired predetermined temperature in the range of 140° C. to 160° C. A fuse element is made of an alloy consisting essentially of 52-100 wt. % indium and the balance tin, and with this construction there can be achieved the temperature fuse which is melted with high operating temperature accuracy at a desired predetermined temperature in the range of 140° C. to 160° C.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: April 24, 2001
    Assignee: Yazaki Corporation
    Inventors: Kinya Horibe, Takayoshi Endo, Takashi Ishii
  • Patent number: 6147586
    Abstract: An insulation plate (20) is provided with a window or a slot (21). A fusible element or circuit (31) is laid on a surface of the insulation plate (20) across the window (21). When the circuit (31) is heated by current-conduction, a fusible path (33) of the circuit (31) spanned in air across the window (21) melts at a predetermined current level, since heat generated in the fusible path (31) is not absorbed in the insulation plate (20). It is possible to transform the plate fuse depending on the conditions of use, and its configuration is substantially flexible.
    Type: Grant
    Filed: July 13, 1998
    Date of Patent: November 14, 2000
    Assignees: Sumitomo Wiring Systems, Ltd., Harness System Technologies Research, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Yasushi Saitoh, Jun Yasukuni
  • Patent number: 6147585
    Abstract: A method for manufacturing a subminiature fuse includes the steps of applying metallized coatings to surfaces at axially opposite ends of a hollow fuse body, placing a fuse element in an internal cavity in the fuse body, the fuse element extending from the first end to the second end of the cavity, placing a one of a solder and brazing preform and end termination at each of the first and second ends of the cavity, and heating the assembled fuse body, fuse element, solder preforms and end terminations to a temperature sufficient to cause the solder preforms to bond the fuse element to the end terminations and for the end terminations to bond with the metallized end portions of the fuse body, wherein the end terminations close the ends of the cavity. A subminiature fuse according to the invention includes a fuse body with a fuse element disposed in the body. The fuse body includes metallized end portions to which the end terminations are bonded.
    Type: Grant
    Filed: June 21, 1999
    Date of Patent: November 14, 2000
    Assignee: Cooper Technologies Company
    Inventors: Varinder K. Kalra, Keith A. Spalding
  • Patent number: 6144283
    Abstract: A temperature detectable current fuse comprises a temperature detecting fuse having a fusible portion, a current fuse having a fusible portion and a table portion provided at the fusible portion thereof, on which the fusible portion of the temperature detecting fuse is mounted, and a housing having a chamber into which the temperature detecting fuse and the current fuse are inserted through an opening of the chamber.
    Type: Grant
    Filed: May 14, 1999
    Date of Patent: November 7, 2000
    Assignee: Yazaki Corporation
    Inventor: Norio Matsumura
  • Patent number: 6073341
    Abstract: A machine method for providing a dome switch sub-assembly used for providing a keyboard-type user input to electronic devices. A spacer layer, attached to a retaining layer, having a plurality of spacer layer openings for receiving a plurality of dome switches is placed upon a moveable machine table. The dome switches, arranged in reel form, are machine removed and placed into the spacer layer openings. A removable release liner is then attached to the spacer layer. Also a complete dome switch assembly is provided. A spacer layer, attached to a circuit board, having a plurality of dome switch openings is placed on a moveable machine table. The dome switches, arranged in reel form, are machine removed and placed into the spacer layer openings. A retaining cover is attached to the spacer layer. An overlay layer, attached to the retaining cover layer, may also be provided.
    Type: Grant
    Filed: March 10, 1998
    Date of Patent: June 13, 2000
    Inventor: Richard A. Odorfer
  • Patent number: 6075434
    Abstract: A fusible element for an electrical fuse comprising a generally flat, strip-shaped body having a generally uniform cross-section; a constricted area formed in the body has a cross-section less than the cross-section of the body; an indentation formed in the body at least bordering on the constricted area; a solder coating disposed within the indentation; and a first solder stop coating on a first surface of the body that is disposed adjacent the solder coating to prevent migration of the coating along the surface.
    Type: Grant
    Filed: January 19, 1999
    Date of Patent: June 13, 2000
    Assignee: Ferraz S.A.
    Inventor: Hans-Werner Rueckling
  • Patent number: 6040754
    Abstract: A thin type thermal fuse is structured by a resin base film, a pair of belt-shaped lead conductors, a low melting-point fusible alloy piece, flux and a resin cover film. Tip portions of the pair of belt-shaped lead conductors is fixed on the resin base film. The low melting-point fusible alloy piece is coupled between the tip end portions of the belt-shaped lead conductors. The flux applied on the low melting-point fusible alloy piece. The resin cover film which is disposed on a one surface of the resin base film so that a space between said films at peripheries of both the resin cover film and the resin base film is sealed and a space between the resin cover film and the belt-shaped lead conductors is sealed. In the thin type thermal fuse, a relation of (V/L).sup.1/2 /d.ltoreq.1.
    Type: Grant
    Filed: February 26, 1999
    Date of Patent: March 21, 2000
    Assignee: Uchihashi Estec Co., Ltd.
    Inventor: Toshiro Kawanishi
  • Patent number: 6034589
    Abstract: A surface mount fuse includes a plurality of substrate/arc suppressive layers, a plurality of fusible elements positioned between the substrate/arc suppressive layers and terminations connected to the ends of the fusible elements, such that the fusible elements are electrically connected in parallel. The surface mount fuse has greater amperage and voltage ratings than similarly sized conventional surface mount fuses. Additionally, the surface mount fuse has increased interrupt breaking capacity and superior mechanical properties.
    Type: Grant
    Filed: December 17, 1998
    Date of Patent: March 7, 2000
    Assignee: AEM, Inc.
    Inventors: Jeffrey D. Montgomery, Xiangming Li, Daniel H. Chang, Kenneth M. Wallace, Kenneth X. Kuang
  • Patent number: 6014803
    Abstract: A thermal triggering system includes bimetal strips a switching element for triggering a switching operation, and a differential lever which is fastened to the slide and which shortens its distance from the switching element as a result of the movement of said slide in the pushing direction, the mounting of the differential lever on the slide is improved in terms of adaption to the distance. For this purpose, the differential lever is fastened via a bearing point which is designed as a center of rotation and via which the distance can be set at a predetermined distance value.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: January 18, 2000
    Assignee: Siemens AG
    Inventor: Rainer Lewin
  • Patent number: 6002322
    Abstract: A thin film, surface-mounted fuse which comprises two material subassemblies. The first subassembly comprises a fusible link, its supporting substrate and terminal pads. The second subassembly comprises a protective, photoimageable layer which overlies the fusible link so as to provide protection from impacts and oxidation. The photoimageable layer is a low profile coating.
    Type: Grant
    Filed: May 5, 1998
    Date of Patent: December 14, 1999
    Assignee: Littelfuse, Inc.
    Inventors: David J. Krueger, Brian J. Bullock, Honorio S. Luciano
  • Patent number: 5982268
    Abstract: A thin type fuse of the present invention has a structure in which each tip portion of a pair of lead conductors is put out from one side of an insulating substrate film on to the other side thereof so as to keep watertightness, the tip portions of the lead conductors on the other side of the insulating substrate film are connected by a fuse element, and the other side of the insulating substrate film is covered with an insulating covering film which is in contact with the fuse element. The contact of the fuse element with the insulating covering film is surface contact and a flux is filled around said contact surface.
    Type: Grant
    Filed: March 31, 1998
    Date of Patent: November 9, 1999
    Assignee: Uchihashi Estec Co., Ltd
    Inventor: Toshiro Kawanishi
  • Patent number: 5977859
    Abstract: A multielectrode type fuse element manufactured by forming a shallow shaving portion 1 of a definite width in the long fuse material 9 in a longitudinal direction so as to form a thin area 2, punching from portions of the thin area 2 dependently on electrical conduction capacities of fuses so as to form a plurality of blowout portions 3, 3, forming a hook-like extending portion 6 on one side across the thin area 2 at an upper end of an input terminal 4 disposed in a direction perpendicular to the longitudinal direction of the long fuse material 9, forming a plurality of output terminals 5, 5 by punching from the long fuse material on a side of the hook-like extending portion 6 of the input terminal 4 in parallel with the input terminal 4 at an equal pitch, and forming the blowout portions 3, 3 to connect one side of an upper portion of a vertical section of the input terminal 4 and a lower tip of the hook-like extending portion 6 with top end of the plurality of output terminals 5, 5.
    Type: Grant
    Filed: June 25, 1998
    Date of Patent: November 2, 1999
    Assignee: Pacific Engineering Company
    Inventors: Isao Kawamura, Iwao Murakami, Isato Kataoka